CN113126725A - Extended computer processor heat dissipation device with display function - Google Patents
Extended computer processor heat dissipation device with display function Download PDFInfo
- Publication number
- CN113126725A CN113126725A CN202010028804.8A CN202010028804A CN113126725A CN 113126725 A CN113126725 A CN 113126725A CN 202010028804 A CN202010028804 A CN 202010028804A CN 113126725 A CN113126725 A CN 113126725A
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- water
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of electronic chip heat dissipation, and provides an extended computer processor heat dissipation device with a display function, aiming at the technical problems of larger volume, liquid leakage and the like in the water-cooling heat dissipation technology of the existing air-cooled radiator, comprising: the invention relates to a water-cooled heat radiator, which comprises a fan control circuit interface, a fan control circuit, an embedded fan, a heat input interface, a heat pipe array, a water-cooled heat radiation interface, a water-cooled heat radiator group, a display control circuit interface, a display screen and a waterproof isolation container.
Description
Technical Field
The invention relates to an extended computer processor heat dissipation device with a display function, in particular to a device for dissipating heat of a computer processor through a heat pipe array, a water-cooling radiator group and an embedded fan.
Background
Water-cooled heat sinks for computer processor heat dissipation provide a greater heat dissipation effect than air-cooled heat sinks through the circulating flow of a liquid medium and high heat capacity. At present, the mainstream computer case is a vertical case, a water-cooled radiator is usually located at the top or front part of the case, and a water-cooled head is fixed on a processor and located above an expensive display card. After the water-cooled radiator group is used for years, aging, cracking and leakage are often caused at the positions of a water pipe, a joint and the like due to high temperature and high pressure. Once liquid leakage occurs, circuits such as a computer mainboard and a display card can be burnt out in a short circuit, and thousands of yuan is lost for users. At present, the problem of liquid leakage of the water-cooled radiator due to aging is researched and developed by manufacturers for many years, and is still not thoroughly solved.
In order to avoid damage to a computer circuit caused by aging and leakage of a water-cooling radiator, the invention provides an extended computer processor heat dissipation device with a display function. Compared with the air-cooled heat dissipation device in the current market, the air-cooled heat dissipation device has the advantages of strong compatibility, compact size, no blocking of a memory slot or a mainboard mounting hole, convenience in installation, no need of forming an air duct and the like, and in addition, the device is provided with a display screen and a waterproof isolation container to prevent liquid leakage of a water-cooled heat dissipation device group from damaging a circuit of a computer.
Disclosure of Invention
The invention aims to provide an extended computer processor heat dissipation device with a display function, in particular to a device for dissipating heat of a computer processor through a heat pipe array, a water-cooling radiator group and an embedded fan.
In order to achieve the purpose, the invention adopts the technical scheme that: the device comprises a fan control circuit interface, a fan control circuit, an embedded fan, a heat input interface, a heat pipe array, a water-cooling heat dissipation interface, a water-cooling heat radiator group, a display control circuit interface, a display screen and a waterproof isolation container, wherein the output end of the fan control circuit interface is connected with the input end of the fan control circuit, the output end of the fan control circuit is connected with the input end of the embedded fan, the output end of the heat input interface is connected with the input end of the heat pipe array, the output end of the heat pipe array is connected with the input end of the water-cooling heat dissipation interface, the output end of the water-cooling heat dissipation interface is connected with the input end of the water-cooling heat radiator group, the other output end of the water-cooling heat dissipation interface is connected with the input end of the waterproof isolation container, the heat pipe array is connected with a computer, the water pipe of the water-cooling radiator set absorbs and circularly transmits heat to the cold row of the water-cooling radiator set, the fan of the water-cooling radiator set blows air to the cold row of the water-cooling radiator set to cool the liquid in the water-cooling radiator set, the other function of the heat pipe array is to move the water cooling head, the water pipe and other components of the water-cooling radiator set which are usually positioned on the computer processor to the water-cooling radiating interface positioned outside the mainboard, the water-cooling radiating interface is surrounded by the waterproof isolating container, even if the water-cooling radiator set leaks, the leaked liquid can be collected by the waterproof isolating container to avoid damaging the mainboard, the display card and the like, the fan control circuit receives the processor temperature information provided by the temperature sensor in the computer processor through the fan control circuit interface to control the rotating speed of the embedded fan, the embedded fan is fixed above the heat pipe array and works in a downward pressure, the display screen is used for providing airflow for a power supply element and a memory of a computer mainboard, the input end of the display control circuit interface is connected with the computer mainboard, the output end of the display control circuit interface is connected with the input end of the display screen, and the display screen is fixed above the embedded fan.
The fan control circuit interface is used for establishing electrical connection between the temperature sensor in the computer processor and the fan control circuit of the extended computer processor heat dissipation device with the display function, and providing the processor temperature information provided by the temperature sensor in the computer processor for the fan control circuit of the extended computer processor heat dissipation device with the display function;
the fan control circuit is a digital pulse width modulation control chip and is used for controlling the rotating speed of an embedded fan of the extended computer processor heat dissipation device with the display function according to processor temperature information provided by a temperature sensor in a computer processor;
the embedded fan is a radial fan, an axial fan or a radial-axial mixed fan;
the heat input interface is used for connecting a computer processor and a heat pipe array of an extended computer processor heat dissipation device with a display function, is a massive metal or a soaking plate, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the computer processor, and is in close contact with the heat pipe array by adopting a welding technology so as to establish high-efficiency thermal connection;
the heat pipe array is used for efficiently conducting heat led in from the heat input interface to the water-cooling heat dissipation interface;
the water-cooling heat dissipation interface is used for connecting the heat pipe array and the water-cooling heat dissipation set, is a block metal or a vapor chamber, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the water-cooling heat dissipation set, and is tightly connected with the heat pipe array by adopting a welding process;
the water-cooled radiator group is a single integrated water-cooled radiator, a plurality of integrated water-cooled radiators or a split water-cooled radiator, the device comprises a water-cooled head, a water pipe, a cold air exhauster, a fan, a water pump and other parts, and the common device is not described herein;
the display control circuit interface is used for establishing electrical connection between the computer and the display screen and providing information to be displayed in the computer to the display screen;
the display screen is a liquid crystal display screen, an organic light emitting diode display screen or a plasma technology display screen, can be in any shape, and is usually a rectangle with the diagonal length of 1-10 inches;
the waterproof isolation container is used for preventing liquid from splashing on circuits such as a mainboard or a display card and the like due to high pressure in the pipe when the water-cooled radiator group leaks, and collecting the leaked liquid.
The working principle of the invention is as follows: when the computer processor cooling device is used, the temperature sensor in the computer processor is connected with the fan control circuit of the extended computer processor cooling device with the display function through the fan control circuit interface of the extended computer processor cooling device with the display function, and the fan control circuit controls the rotating speed of the embedded fan of the extended computer processor cooling device with the display function according to the processor temperature information provided by the temperature sensor in the computer processor; the computer processor is connected with a heat pipe array of the extended computer processor heat dissipation device with the display function through a heat input interface of the extended computer processor heat dissipation device with the display function, the heat pipe array receives heat and conducts the heat to one or more water cooling heads of the water cooling heat dissipation device group through the water cooling heat dissipation interface, a water pipe of the water cooling heat dissipation device group absorbs the heat and circularly transmits the heat to a cold drain of the water cooling heat dissipation device group, a fan of the water cooling heat dissipation device group blows air to the cold drain of the water cooling heat dissipation device group to cool liquid in the water cooling heat dissipation device group, the heat pipe array moves the water cooling heads, the water pipes and other parts of the water cooling heat dissipation device group which are usually positioned on the computer processor to the water cooling heat dissipation interface positioned outside a mainboard, the periphery of the water cooling heat dissipation interface is surrounded by a waterproof isolation container, and leaked liquid can be, avoid causing damage to mainboard and display card etc, fan control circuit passes through the treater temperature information that temperature sensor provided in the fan control circuit interface receiving computer processor, the rotational speed of control embedded fan, embedded fan is fixed in the top of heat pipe array, work in the push-down state of blowing for supply element and the memory to the computer mainboard provides the air current, the input that shows the control circuit interface links to each other with the computer mainboard, the output that shows the control circuit interface links to each other with the input of display screen, the display screen is fixed in the top of embedded fan.
Due to the adoption of the technical scheme, the invention has the following advantages:
1. the key problem that the aging leakage of the water-cooling radiator damages a circuit is solved;
2. the heat dissipation of the computer processor is realized by simultaneously using a plurality of water-cooled radiators for the first time, the heat dissipation capacity of the computer processor is enhanced, and the calculation performance of the computer processor is indirectly improved;
3. the display screen is used for displaying text or graphic information.
Drawings
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a schematic diagram of the operation of the present invention;
fig. 3 is a schematic structural diagram of the present invention.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings: as shown in fig. 1-3, it includes a fan control circuit interface 1, a fan control circuit 2, an embedded fan 3, a heat input interface 4, a heat pipe array 5, a water-cooling heat dissipation interface 6, a water-cooling heat sink group 7, a display control circuit interface 8, a display screen 9 and a waterproof isolation container 10, the output end of the fan control circuit interface 1 is connected with the input end of the fan control circuit 2, the output end of the fan control circuit 2 is connected with the input end of the embedded fan 3, the output end of the heat input interface 4 is connected with the input end of the heat pipe array 5, the output end of the heat pipe array 5 is connected with the input end of the water-cooling heat dissipation interface 6, the output end of the water-cooling heat dissipation interface 6 is connected with the input end of the water-cooling heat sink group 7, the other output end of the water-cooling heat dissipation interface 6 is connected with, the heat of the computer is received and is transmitted to one or more water-cooled heads of a water-cooled radiator group 7 through a water-cooled radiator interface 6, a water pipe of the water-cooled radiator group 7 absorbs and circularly transmits the heat to a cold row of the water-cooled radiator group 7, a fan of the water-cooled radiator group 7 blows air to the cold row of the water-cooled radiator group 7 to cool liquid in the water-cooled radiator group 7, the other function of the heat pipe array 5 is to move the water-cooled heads, the water pipe and other components of the water-cooled radiator group 7 which are usually positioned on a computer processor to the water-cooled radiator interface 6 positioned on the outer side of a mainboard, the periphery of the water-cooled radiator interface 6 is surrounded by a waterproof isolation container 10, even if the water-cooled radiator group 7 leaks, the leaked liquid can be collected by the waterproof isolation container 10 to avoid damaging the mainboard, a display card and the like, a fan control circuit 2 receives processor temperature information provided, the rotating speed of the embedded fan 3 is controlled, the embedded fan 3 is fixed above the heat pipe array 5 and works in a downward-pressing type blowing state and is used for providing airflow for a power supply element and a memory of a computer mainboard, the input end of the display control circuit interface 8 is connected with the computer mainboard, the output end of the display control circuit interface 8 is connected with the input end of the display screen 9, and the display screen 9 is fixed above the embedded fan 3.
The fan control circuit interface 1 is used for establishing electrical connection between a temperature sensor in the computer processor and the fan control circuit 1 of the extended computer processor heat dissipation device with the display function, and providing processor temperature information provided by the temperature sensor in the computer processor to the fan control circuit 2 of the extended computer processor heat dissipation device with the display function;
the fan control circuit 2 is a digital pulse width modulation control chip and is used for controlling the rotating speed of the embedded fan 3 of the extended computer processor heat dissipation device with the display function according to the processor temperature information provided by the temperature sensor in the computer processor, and the working principle is not repeated because various digital pulse width modulation control chips are available in the market;
the embedded fan 3 is a radial fan, an axial fan or a radial-axial mixed fan;
the heat input interface 4 is used for connecting a computer processor and a heat pipe array 5 of an extended computer processor heat dissipation device with a display function, is a massive metal or a soaking plate, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the computer processor, and is in close contact with the heat pipe array 5 by adopting a welding technology so as to establish high-efficiency thermal connection;
the heat pipe array 5 is used for efficiently conducting heat led in from the heat input interface 4 to the water-cooling heat dissipation interface 6;
the water-cooling heat dissipation interface 6 is used for connecting the heat pipe array 5 and the water-cooling heat dissipation set 7, is a block metal or a vapor chamber, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the water-cooling heat dissipation set 7, and is tightly connected with the heat pipe array 5 by adopting a welding process;
the water-cooled radiator group 7 is a single integrated water-cooled radiator, a plurality of integrated water-cooled radiators or a split water-cooled radiator, the device comprises a water-cooled head, a water pipe, a cold air exhaust, a fan, a water pump and other parts, and the common device is not described herein;
the display control circuit interface 8 is used for establishing electrical connection between the computer and the display screen 9 and providing information to be displayed in the computer to the display screen 9;
the display screen 9 is a liquid crystal display screen, an organic light emitting diode display screen or a plasma technology display screen, and can be in any shape, usually a rectangle with a diagonal length of 1-10 inches;
the waterproof isolation container 10 is used for preventing liquid from splashing on a circuit such as a mainboard or a display card and the like due to high pressure in the pipe when the water-cooled radiator group 7 leaks, and collecting the leaked liquid.
The working principle of the invention is as follows: when the temperature sensor is used, the temperature sensor in the computer processor is connected with the fan control circuit 2 of the extended computer processor heat dissipation device with the display function through the fan control circuit interface 1 of the extended computer processor heat dissipation device with the display function, and the fan control circuit 2 controls the rotating speed of the embedded fan 3 of the extended computer processor heat dissipation device with the display function according to the processor temperature information provided by the temperature sensor in the computer processor; the computer processor is connected with a heat pipe array 5 of the expansion type computer processor heat dissipation device with the display function through a heat input interface 4 of the expansion type computer processor heat dissipation device with the display function, the heat pipe array 5 receives heat and conducts the heat to one or more water cooling heads of a water cooling radiator set 7 through a water cooling radiator set 6, a water pipe of the water cooling radiator set 7 absorbs the heat and circularly transmits the heat to a cold row of the water cooling radiator set 7, a fan of the water cooling radiator set 7 blows air to the cold row of the water cooling radiator set 7 to cool liquid in the water cooling radiator set 7, the heat pipe array 5 moves the water cooling heads, the water pipes and other parts of the water cooling radiator set 7 which are usually positioned on the computer processor to the water cooling radiator set 6 positioned on the outer side of a mainboard, the periphery of the water cooling radiator set 6 is surrounded by a waterproof isolation container 10, even if the water cooling radiator set, leaked liquid can be collected by waterproof isolation container 10, avoid causing the damage to mainboard and display card etc, fan control circuit 2 receives the treater temperature information that temperature sensor provided in the computer processor through fan control circuit interface 1, control embedded fan 3's rotational speed, embedded fan 3 is fixed in the top of heat pipe array 5, work in the push-down state of blowing, a power supply unit and the memory for to the computer mainboard provide the air current, the input of display control circuit interface 8 links to each other with the computer mainboard, the output of display control circuit interface 8 links to each other with the input of display screen 9, display screen 9 is fixed in the top of embedded fan 3.
The heat pipe array 5 is a normal temperature heat pipe, and the working temperature is 0-250 ℃.
The heat pipe array 5 is made of copper, copper alloy, aluminum or aluminum alloy.
The heat input interface 4 is made of copper, copper alloy, aluminum or aluminum alloy.
The surface of the heat input interface 4 contacting with the computer processor is coated with heat-conducting silicone grease or liquid metal with high heat conductivity.
The heat input interface 4 and the computer processor are fixed by a pressure clamp.
The water-cooling heat dissipation interface 6 and the water-cooling head of the water-cooling heat dissipation device group 7 are fixed by a pressure clamp.
The heat input interface 4 is a block metal or a soaking plate.
The heat input interface 4 and the heat pipe array 5 are connected by adopting a welding process.
The water-cooling heat dissipation interface 6 is connected with the heat pipe array 5 by adopting a welding process.
The waterproof isolation container 10 is positioned outside the water-cooling heat dissipation interface 6, the water-cooling heads and water pipes of the connected water-cooling heat dissipation interface 6 and the water-cooling heat dissipation set 7 are all positioned in the waterproof isolation container 10, and one side of the waterproof isolation container 10 facing a computer mainboard is sealed.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010028804.8A CN113126725A (en) | 2020-01-11 | 2020-01-11 | Extended computer processor heat dissipation device with display function |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010028804.8A CN113126725A (en) | 2020-01-11 | 2020-01-11 | Extended computer processor heat dissipation device with display function |
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| CN113126725A true CN113126725A (en) | 2021-07-16 |
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| CN202010028804.8A Pending CN113126725A (en) | 2020-01-11 | 2020-01-11 | Extended computer processor heat dissipation device with display function |
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Citations (8)
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| TWI273378B (en) * | 2001-08-22 | 2007-02-11 | Hitachi Ltd | Method of cooling system for a personal computer |
| CN203040101U (en) * | 2013-01-23 | 2013-07-03 | 周哲明 | Water cooling device used for cooling electronic device |
| CN103945677A (en) * | 2014-05-05 | 2014-07-23 | 万建岗 | Double-faced heat source forced liquid cooling design of integrated TR (transmitter and receiver) module |
| CN204360310U (en) * | 2014-12-22 | 2015-05-27 | 河南机电高等专科学校 | A kind of mainboard that there is protection circuit and be not blown |
| CN206627899U (en) * | 2017-04-17 | 2017-11-10 | 四川城市职业学院 | Heat abstractor and notebook computer |
| CN107396599A (en) * | 2017-07-14 | 2017-11-24 | 华南理工大学 | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system |
| CN107640104A (en) * | 2017-08-21 | 2018-01-30 | 安徽特斯艾尔机电设备有限公司 | A kind of automobile high-voltage electricity device shipping bill is to air interchanger |
| CN210835979U (en) * | 2020-01-11 | 2020-06-23 | 苏州溢博伦光电仪器有限公司 | Extended computer processor heat dissipation device with display function |
-
2020
- 2020-01-11 CN CN202010028804.8A patent/CN113126725A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI273378B (en) * | 2001-08-22 | 2007-02-11 | Hitachi Ltd | Method of cooling system for a personal computer |
| CN203040101U (en) * | 2013-01-23 | 2013-07-03 | 周哲明 | Water cooling device used for cooling electronic device |
| CN103945677A (en) * | 2014-05-05 | 2014-07-23 | 万建岗 | Double-faced heat source forced liquid cooling design of integrated TR (transmitter and receiver) module |
| CN204360310U (en) * | 2014-12-22 | 2015-05-27 | 河南机电高等专科学校 | A kind of mainboard that there is protection circuit and be not blown |
| CN206627899U (en) * | 2017-04-17 | 2017-11-10 | 四川城市职业学院 | Heat abstractor and notebook computer |
| CN107396599A (en) * | 2017-07-14 | 2017-11-24 | 华南理工大学 | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system |
| CN107640104A (en) * | 2017-08-21 | 2018-01-30 | 安徽特斯艾尔机电设备有限公司 | A kind of automobile high-voltage electricity device shipping bill is to air interchanger |
| CN210835979U (en) * | 2020-01-11 | 2020-06-23 | 苏州溢博伦光电仪器有限公司 | Extended computer processor heat dissipation device with display function |
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Application publication date: 20210716 |