CN113035766B - Huge amount of micro LED shifts mechanism - Google Patents
Huge amount of micro LED shifts mechanism Download PDFInfo
- Publication number
- CN113035766B CN113035766B CN202110574750.XA CN202110574750A CN113035766B CN 113035766 B CN113035766 B CN 113035766B CN 202110574750 A CN202110574750 A CN 202110574750A CN 113035766 B CN113035766 B CN 113035766B
- Authority
- CN
- China
- Prior art keywords
- guide rail
- assembly
- microled
- annular top
- disc assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010521 absorption reaction Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011148 porous material Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000001467 acupuncture Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- ONNCPBRWFSKDMQ-UHFFFAOYSA-N 2,3',5-trichlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=CC=C(Cl)C=2)Cl)=C1 ONNCPBRWFSKDMQ-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009950 felting Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- -1 porous die steel Chemical class 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a huge transfer mechanism of a MicroLED (light emitting diode), which comprises a source disc assembly, a target disc assembly, a top suction assembly and a puncture head assembly, wherein the source disc assembly is arranged on the target disc assembly; the source disc assembly is positioned above the target disc assembly, the top suction assembly is arranged on the target disc assembly, and the puncturing head assembly is positioned above the source disc assembly. The top suction assembly comprises a moving plate, a mounting plate arranged on the moving plate, a support arranged on the mounting plate and an annular top suction disc arranged on the support, a working area is arranged in the annular top suction disc, and the annular top suction disc is positioned above the transfer film. The huge transfer mechanism of the MicroLED effectively improves the transfer precision of the MicroLED, improves the product yield and realizes the high-precision huge transfer of the MicroLED.
Description
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to a huge transfer mechanism of a micro LED.
Background
MiniLED (small-pitch light emitting diode) refers to an LED product with a chip size of 100-200 μm, and MicroLED (micron light emitting diode) refers to an LED with a chip size of below 100 μm, which are important development directions of next generation display technology. The micro led/MiniLED has a higher dynamic range, better contrast ratio, and wider range than the OLED, and has a longer life span than the OLED, so that the micro led/MiniLED industry is gradually a hot spot of the entire display industry.
However, in the existing micro led/MiniLED transfer equipment, when the pricking head pricks the micro led/MiniLED downwards and transfers the micro led/MiniLED to the target disc, the film is easy to deform due to the large size of the transfer film, so that the position where the micro led/MiniLED is transferred to the target disc is deviated, the transfer precision of the micro led/MiniLED is low, the outgoing quality of a product is affected finally, and the yield of the product is low.
Disclosure of Invention
The invention provides a mass transfer mechanism of a micro LED, which can improve the transfer accuracy, improve the product yield and realize the high-precision mass transfer of the micro LED.
The technical scheme adopted by the invention is as follows: a bulk transfer mechanism for MicroLEDs, comprising: the device comprises a source disc assembly, a target disc assembly, a top suction assembly and a puncture head assembly; the source disc assembly is positioned above the target disc assembly and used for fixing a MicroLED transfer film to be transferred; the top suction assembly is arranged on the target disc assembly and used for tensioning the transfer film; the pricking head assembly is positioned above the source disc assembly and is used for transferring the micro LED pricks on the transfer film onto the target disc assembly; the target disc assembly is used for bearing the transferred MicroLED; the top suction assembly comprises a moving plate, a mounting plate arranged on the moving plate, a support arranged on the mounting plate and an annular top suction disc arranged on the support, wherein a working area is arranged in the annular top suction disc, and the annular top suction disc is positioned above the transfer film.
Furthermore, the source disc assembly comprises a sliding platform, and one end of the sliding platform is provided with a clamping piece for clamping the wafer ring.
Further, the target disk assembly includes a mounting table and a target disk; the mounting table is provided with a groove, the target disc is arranged in the groove in a sliding mode, and the target disc is located below the sliding platform; the top suction assembly is arranged on the mounting table and is positioned on one side of the groove.
Furthermore, a first guide rail is arranged on the mounting table and is positioned on one side of the groove, and the moving plate is slidably mounted on the first guide rail; a first motor is arranged in the mounting table, and the moving plate is driven by the first motor to move left and right along the first guide rail; the movable plate is provided with a second guide rail, the direction of the second guide rail is perpendicular to the direction of the first guide rail, the mounting plate is slidably mounted on the second guide rail, and the movable plate is provided with a second motor; and the mounting plate is driven by the second motor to move back and forth along the second guide rail.
Furthermore, a third guide rail is arranged on the mounting plate, the third guide rail is spatially perpendicular to the first guide rail and the second guide rail, a sliding block is arranged on the third guide rail, one end of the support is mounted on the sliding block, the other end of the support is provided with the annular top suction cup, and the annular top suction cup is positioned above the transfer film; and the mounting plate is also provided with a third motor, and the third motor drives the sliding block to move up and down along the third guide rail so as to drive the annular top sucker to move up and down.
Furthermore, the annular top sucker is provided with a vacuum cavity, the annular top sucker is connected with a vacuum connector, and the vacuum connector is communicated with the vacuum cavity.
Further, the annular top sucker is made of a porous material, and the porous material is porous ceramic, zeolite, porous stainless steel, porous nickel, porous titanium, porous die steel, porous aluminum alloy, porous magnesium alloy, foamed aluminum or foamed nickel.
Furthermore, the bottom surface of the annular top sucker is a top pressing adsorption surface, the top pressing adsorption surface is provided with a plurality of vacuum holes, and the vacuum holes are communicated with the vacuum cavity.
Further, the bottom surface of the annular top sucker is provided with a PCB, an FPC or a chip, and the PCB, the FPC or the chip are used for carrying out electrostatic adsorption on the MicroLED.
Furthermore, the puncture head assembly comprises a fixed seat, a voice coil motor, a puncture head arm and a puncture needle; the voice coil motor is arranged in the fixed seat, the puncture needle arm is mechanically connected with the voice coil motor through a leaf spring bearing or an elastic sheet, the puncture needle is arranged on the puncture needle arm, and the puncture needle is positioned above the working area; the voice coil motor drives the puncture needle arm to drive the puncture needle to rotate at high speed in the vertical direction by taking the leaf spring bearing or the elastic sheet as a rotation center.
Compared with the prior art, the huge transfer mechanism of the MicroLED is provided with the jacking component, when the jacking component moves downwards, the annular jacking sucker tensions a small range of MicroLEDs (or MiniLED) on the transfer film, the stabbing head component can perform accurate alignment and needling actions after tensioning, a large wafer is divided into small areas, independent tensioning, identification and transfer attachment are performed, the precision can be guaranteed under the condition of high-speed attachment, the transfer precision of the MicroLED is effectively improved, the product yield is improved, and high-precision huge transfer of the MicroLED is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings, there is shown in the drawings,
FIG. 1: the invention discloses a perspective view of a huge transfer mechanism of a MicroLED;
FIG. 2: the invention discloses a top view of a huge transfer mechanism of a MicroLED;
FIG. 3: the invention discloses a side view of a huge transfer mechanism of a MicroLED;
FIG. 4: the invention discloses a structural schematic diagram of a huge transfer mechanism of a MicroLED;
FIG. 5: a perspective view of a first embodiment of the annular top suction cup of the present invention;
FIG. 6: a perspective view of a second embodiment of the annular top suction cup of the present invention;
FIG. 7: a third embodiment of the annular top suction cup of the present invention is a perspective view.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1 to 3, the mass transfer mechanism for micro led of the present invention comprises a source disk assembly, a target disk assembly, a top suction assembly and a piercing head assembly; the source disc assembly is positioned above the target disc assembly and used for fixing the MicroLED transfer film 100 to be transferred; the top suction assembly is mounted on the target disc assembly for tensioning the transfer film 100; the pricking head assembly is positioned above the source disc assembly and is used for transferring the micro LED pricks on the transfer film 100 to the target disc assembly; the target disc assembly is used for carrying the transferred MicroLED.
The source disc assembly comprises a sliding platform 1, a clamping piece 2 is arranged at one end of the sliding platform 1 and used for clamping a crystal ring 3 (a transfer film 100 is arranged on the crystal ring 3, a micro LED (or a MiniLED) is pasted on the transfer film 100, and the transfer film 100 is a transparent film).
The target disk assembly comprises a mounting table 4 and a target disk 5; wherein, the mounting table 4 is provided with a groove 6, the target disc 5 is slidably arranged in the groove 6, and the target disc 5 is positioned below the sliding platform 1, so as to adjust the position of the target disc 5 to align with the position of the wafer ring 3 on the clamping piece 2. The top suction assembly is arranged on the mounting table 4 and located on one side of the groove 6 and used for adsorbing the transfer film 100 on the tensioning crystal ring 3, so that the micro LED on the transfer film 100 is accurately positioned, and the transfer accuracy of the micro LED is further improved.
As shown in fig. 1, 4 and 5, the top suction assembly includes a moving plate 7, a mounting plate 8 mounted on the moving plate 7, a bracket 9 mounted on the mounting plate 8, and a circular top suction cup 10 mounted on the bracket 9, and the circular top suction cup 10 has a square or circular working area 25 therein. In other embodiments, the working area of the annular top suction cup 10 may be a polygonal area such as an oval, a pentagon, a hexagon, etc., but not limited thereto. The ring-shaped top suction cup 10 may also be an arc-shaped semi-closed ring or be composed of a plurality of suction legs, which is not limited to this.
Specifically, a first guide rail 11 is arranged on the mounting table 4, the first guide rail 11 is positioned on one side of the groove 6, and the moving plate 7 is slidably mounted on the first guide rail 11; and a first motor is arranged in the mounting table 4, and the moving plate 7 is driven by the first motor to move left and right along the first guide rail 11. The moving plate 7 is provided with a second guide rail 12, the direction of the second guide rail 12 is vertical to the direction of the first guide rail 11, the mounting plate 8 is slidably mounted on the second guide rail 12, and the moving plate 7 is provided with a second motor; the mounting plate 8 is driven by a second motor to move back and forth along the second guide rail 12.
Further, be equipped with third guide rail 13 on the mounting panel 8, third guide rail 13 is all perpendicular with first guide rail 11 and second guide rail 12 in the space, be equipped with slider 14 on the third guide rail 13, the one end of support 9 is installed in slider 14, the other end extends and is located the top of transfer membrane 100, annular top sucking disc 10 is installed in the other end of support 9, be used for tensioning micro LED (or MiniLED) of miniLED on transfer membrane 100, be convenient for the first subassembly of thorn after the tensioning to carry out accurate counterpoint and acupuncture action, thereby it is the position production deviation to make micro LED shift to target dish 5 on the transfer membrane 100 because of the deformation effect when effectively avoiding the acupuncture, improve micro LED's transfer accuracy, and then improve the yield of final product. In addition, the mounting plate 8 is also provided with a third motor, and the third motor drives the sliding block 14 to move up and down along the third guide rail 13 so as to drive the annular top suction cup 10 to move up and down.
The movable plate 7 is driven by a first motor to move left and right along a first guide rail 11, so that the annular top sucker 10 is driven to move left and right, and the left and right positions of the annular top sucker 10 are adjusted; the mounting plate 8 is driven by a second motor to move back and forth along a second guide rail 12 so as to adjust the back and forth position of the annular top suction cup 10; finally, the third motor drives the sliding block 14 to move up and down along the third guide rail 13 so as to adjust the up-down position of the annular top suction cup 10; when the ring-shaped top chuck 10 moves downward, the transfer film 100 on the wafer ring 3 located below is tensioned to position the micro leds on the upper portion of the transfer film 100.
The annular top suction cup 10 is provided with a vacuum cavity 15, and the annular top suction cup 10 is connected with a vacuum connector 16, the vacuum connector 16 is communicated with the vacuum cavity 15 for connecting an external vacuum device, so that the vacuum cavity 15 generates negative pressure. Further, the bottom surface of the annular top suction cup 10 is a top pressing adsorption surface 17, the top pressing adsorption surface 17 is provided with a plurality of vacuum holes 18, and the plurality of vacuum holes 18 are communicated with the vacuum cavity 15. When the vacuum chamber 15 generates the negative pressure, the top suction surface 17 is caused to tightly suck the transfer film 100 through the plurality of vacuum holes 18.
As shown in fig. 6, in the second embodiment, since the micro led is too small in size, it is required to absorb the micro led flat without collapsing, and the vacuum hole is required to be very thin, the ring-shaped top suction cup 10 can be made of porous material (porous), and the small hole made of the material itself is used as the vacuum hole. Wherein, the porous material is porous ceramic, zeolite or is made of carbide, nitride, boride and porous material silicide of various metals and alloys and refractory metals, such as: porous die steel, porous aluminum alloy, or porous magnesium alloy; the porous material may also be foamed aluminum, foamed nickel or porous stainless steel, porous nickel, porous titanium, etc. made by a powder metallurgy process.
As shown in fig. 7, since the micro led is too small in size, the flat micro led needs to be attached and does not collapse, in the third embodiment, a PCB 26 (Printed Circuit Board), an FPC (Flexible Printed Circuit) or a chip may be disposed on the bottom surface of the ring-shaped top suction cup 10, and the micro led is attached through the PCB 26, the FPC or the chip in an electrostatic attachment manner.
In the embodiment, two jacking components are arranged on the mounting table 4 and are oppositely arranged on the left side and the right side of the groove 6; it is understood that, in other embodiments, only one or more than three top suction assemblies may be provided, and the invention is not limited thereto.
As shown in FIG. 4, the lancet assembly comprises a fixed base 19, a voice coil motor 20, a lancet arm 21 and a lancet 22; the voice coil motor 20 is mounted in the holder 19, the lancet arm 21 is mechanically connected to the voice coil motor 20 by a leaf spring bearing 23, the lancet 22 is mounted to the lancet arm 21, and the lancet 22 is located above the working area 25. The voice coil motor 20 drives the puncture needle arm 21 to drive the puncture needle 22 to rotate at high speed in the vertical direction by taking the leaf spring bearing 23 as a rotation center; each time the lancet 22 is down, the MicroLED on the transfer film 100 is pierced and transferred to the target disk 5, thereby effectively improving the transfer efficiency of the MicroLED.
Wherein, the voice coil motor 20 is a halbach voice coil motor; the periodic speed of the lancet 22 is 20ms-50 ms. The leaf spring bearing 23 is arranged at the rotation center, so that the acceleration of the puncture needle assembly can reach 200 g and 300g, and the transfer efficiency of the puncture needle 22 is effectively improved. In other embodiments, the leaf spring bearing 23 may be replaced by a spring plate, but not limited thereto. In addition, the leaf spring bearing 23 is provided with an encoder 24 for detecting the rotational speed of the lancet arm 21 to monitor the rotational speed of the lancet 22 in real time.
The huge transfer mechanism of the MicroLED of the invention has the following working process:
fixing a wafer ring 3 of a transfer film 100 to be loaded with a micro LED (or MiniLED, the same below) in a clamping piece 2, and when the transfer operation is carried out, operating the pricking head assembly aiming at two independent annular top suckers 10;
firstly, the top suction assembly moves downwards, so that the annular top suction disc 10 sucks and presses the transfer film 100 in the wafer ring 3 below;
then, the lancet head assembly moves back and forth, left and right, so that the lancet needles 22 are aligned with the micro LEDs on the lower working area 25;
finally, the voice coil motor 20 drives the lancet arm 21 to rotate at a high speed, so as to drive the lancet 22 to rotate at a high speed, and each time the lancet 22 moves downwards, the micro leds in the working area 25 are punched on the target disk 5 below the transfer film 100, so that the transfer of the micro leds is completed.
In the working process, the whole process is controlled by the master control system, and when the stabhead assembly performs a transfer action in the right annular top suction cup 10, the tensioned left annular top suction cup 10 performs a positioning action; when the pricking head assembly performs transferring action in the annular top sucker 10 on the left side, the annular top sucker 10 on the right side performs region changing, tensioning and positioning actions, and the reciprocating circulation is performed until the micro LED on the transferring film 100 is transferred, and then a new wafer ring 3 is replaced.
In conclusion, the huge transfer mechanism of the micro LED has the following beneficial effects:
1. the voice coil motor 20 is arranged to drive the bayonet arm 21 to rotate by taking the leaf spring bearing 23 or the elastic sheet as a rotating center, so that the acceleration of the bayonet component can reach 200-300g, and the transfer efficiency of the MicroLED is effectively improved.
2. Through setting up the top and inhaling the subassembly, when the top is inhaled the subassembly and is moved downwards, annular top sucking disc 10 with the tensioning of the micro LED (or MiniLED) of minizone on transfer membrane 100, the felting needle 22 of being convenient for after the tensioning carries out accurate counterpoint and acupuncture action, effectively improves the precision that the micro LED shifted to improve the product yield, realize the high accuracy huge volume of micro LED and shift.
3. The target disk 5 is slidably mounted on the mounting table 4 so that the position of the target disk 5 can be adjusted to be aligned with the wafer ring 3 on the holder 2.
Any combination of the various embodiments of the present invention should be considered as disclosed in the present invention, unless the inventive concept is contrary to the present invention; within the scope of the technical idea of the invention, any combination of various simple modifications and different embodiments of the technical solution without departing from the inventive idea of the present invention shall fall within the protection scope of the present invention.
Claims (6)
1. A bulk transfer mechanism for MicroLEDs, comprising: the device comprises a source disc assembly, a target disc assembly, a top suction assembly and a puncture head assembly; the source disc assembly is positioned above the target disc assembly and used for fixing a MicroLED transfer film to be transferred; the top suction assembly is arranged on the target disc assembly and used for tensioning the transfer film; the pricking head assembly is positioned above the source disc assembly and is used for transferring the micro LED pricks on the transfer film onto the target disc assembly; the target disc assembly is used for bearing the transferred MicroLED; the top suction assembly comprises a moving plate, a mounting plate, a bracket and an annular top suction disc; the movable plate is arranged on the target disc assembly in a left-right sliding mode, the mounting plate is arranged on the movable plate in a front-back sliding mode, the support is arranged on the mounting plate in a vertical sliding mode, the annular top sucker is arranged on the support, a working area is arranged in the annular top sucker, and the annular top sucker is located above the transfer film;
the bottom surface of annular top sucking disc is equipped with a PCB, FPC or chip, through PCB FPC or the chip carries out the electrostatic absorption MicroLED.
2. The mass transfer mechanism for a MicroLED of claim 1, wherein: the source disc assembly comprises a sliding platform, and one end of the sliding platform is provided with a clamping piece for clamping a wafer ring.
3. The mass transfer mechanism for a MicroLED of claim 2, wherein: the target disk assembly comprises a mounting table and a target disk; the mounting table is provided with a groove, the target disc is arranged in the groove in a sliding mode, and the target disc is located below the sliding platform; the top suction assembly is arranged on the mounting table and is positioned on one side of the groove.
4. A mass transfer mechanism for a MicroLED as in claim 3, wherein: the mounting table is provided with a first guide rail, the first guide rail is positioned on one side of the groove, and the moving plate is slidably mounted on the first guide rail; a first motor is arranged in the mounting table, and the moving plate is driven by the first motor to move left and right along the first guide rail; the movable plate is provided with a second guide rail, the direction of the second guide rail is perpendicular to the direction of the first guide rail, the mounting plate is slidably mounted on the second guide rail, and the movable plate is provided with a second motor; and the mounting plate is driven by the second motor to move back and forth along the second guide rail.
5. The mass transfer mechanism for MicroLEDs as recited in claim 4, wherein: a third guide rail is arranged on the mounting plate, the third guide rail is perpendicular to the first guide rail and the second guide rail in space, a sliding block is arranged on the third guide rail, one end of the support is mounted on the sliding block, the other end of the support is provided with the annular top sucker, and the annular top sucker is positioned above the transfer film; and the mounting plate is also provided with a third motor, and the third motor drives the sliding block to move up and down along the third guide rail so as to drive the annular top sucker to move up and down.
6. The mass transfer mechanism for a MicroLED of claim 1, wherein: the puncturing head assembly comprises a fixed seat, a voice coil motor, a puncturing head arm and a puncturing needle; the voice coil motor is arranged in the fixed seat, the puncture needle arm is mechanically connected with the voice coil motor through a leaf spring bearing or an elastic sheet, the puncture needle is arranged on the puncture needle arm, and the puncture needle is positioned above the working area; the voice coil motor drives the puncture needle arm to drive the puncture needle to rotate at high speed in the vertical direction by taking the leaf spring bearing or the elastic sheet as a rotation center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110574750.XA CN113035766B (en) | 2021-05-26 | 2021-05-26 | Huge amount of micro LED shifts mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110574750.XA CN113035766B (en) | 2021-05-26 | 2021-05-26 | Huge amount of micro LED shifts mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113035766A CN113035766A (en) | 2021-06-25 |
| CN113035766B true CN113035766B (en) | 2021-09-28 |
Family
ID=76455838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110574750.XA Active CN113035766B (en) | 2021-05-26 | 2021-05-26 | Huge amount of micro LED shifts mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113035766B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451179B (en) * | 2021-06-29 | 2022-03-01 | 广东阿达智能装备有限公司 | A massive transfer device for tiny electronic components |
| CN114512579B (en) * | 2022-02-18 | 2022-10-11 | 广东工业大学 | A Mini/micro chip flexible flying thorn crystal device |
| CN115440642B (en) * | 2022-09-19 | 2024-09-24 | 深圳市优界科技有限公司 | Carrier plate bearing device suitable for grain transfer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164640A (en) * | 1998-11-25 | 2000-06-16 | Shinkawa Ltd | Flip chip bonding device |
| US6109861A (en) * | 1998-08-17 | 2000-08-29 | Lucent Technologies, Inc. | Apparatus and method for rotating semiconductor objects |
| CN109065482A (en) * | 2018-08-09 | 2018-12-21 | 深圳市华腾半导体设备有限公司 | A kind of die grading mechanism and its die grading method |
| CN111128799A (en) * | 2019-11-18 | 2020-05-08 | 广东工业大学 | Alignment device and method for mass transfer of equidistant chip array |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011054648A (en) * | 2009-08-31 | 2011-03-17 | Elpida Memory Inc | Method of manufacturing semiconductor device |
| US20180108554A1 (en) * | 2016-10-14 | 2018-04-19 | Research Foundation Of The City University Of New York | Method for self-aligning a thin-film device on a host substrate |
-
2021
- 2021-05-26 CN CN202110574750.XA patent/CN113035766B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6109861A (en) * | 1998-08-17 | 2000-08-29 | Lucent Technologies, Inc. | Apparatus and method for rotating semiconductor objects |
| JP2000164640A (en) * | 1998-11-25 | 2000-06-16 | Shinkawa Ltd | Flip chip bonding device |
| CN109065482A (en) * | 2018-08-09 | 2018-12-21 | 深圳市华腾半导体设备有限公司 | A kind of die grading mechanism and its die grading method |
| CN111128799A (en) * | 2019-11-18 | 2020-05-08 | 广东工业大学 | Alignment device and method for mass transfer of equidistant chip array |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113035766A (en) | 2021-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113035766B (en) | Huge amount of micro LED shifts mechanism | |
| CN201174380Y (en) | Wafer taking and placing structure | |
| CN113451179B (en) | A massive transfer device for tiny electronic components | |
| CN109719479B (en) | Semi-automatic assembly device and method for front frame and screen of vehicle-mounted screen of automobile | |
| CN115172538A (en) | Display chip's huge transfer device and system | |
| CN111352334B (en) | A fully automatic needle loading machine | |
| CN102163541A (en) | Chip welding device | |
| CN114211248A (en) | Automatic chip mounting device | |
| CN218585944U (en) | Chip feeding mechanism and ejector pin module | |
| CN212625534U (en) | Impact-free ejector pin device of die bonder | |
| CN102169768B (en) | Spot-welding positioning mechanism for process gasket of protector | |
| CN215848584U (en) | Punching device and punching platform | |
| CN101794718B (en) | Automatic pallet exchange device | |
| CN109873068B (en) | Eutectic machine | |
| CN211479985U (en) | Material taking device and die bonder | |
| CN113547582A (en) | Punching device, punching platform and punching method | |
| CN221354637U (en) | Automatic heat sink mounting equipment | |
| CN206885539U (en) | Labeller | |
| JP4954652B2 (en) | Precision parts assembly equipment | |
| CN101272678A (en) | Mounting head, mounting device and method for mounting electronic components on a substrate | |
| CN222592768U (en) | A soft needle material belt transfer mechanism | |
| CN219981174U (en) | LED gathers battle array paster head | |
| JP2003258495A (en) | Component mounting head for component mounting device | |
| CN218069811U (en) | Material taking and placing device for springtails | |
| CN222495107U (en) | A quick pick-and-place structure for multi-cavity molded lenses |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 101, 201, 301, 401, 501, Building 10, Standard Industrial Park, No. 49 Wantai Road, Nansha District, Guangzhou City, Guangdong Province 511400 Patentee after: Guangdong Ada Semiconductor Equipment Co.,Ltd. Country or region after: China Address before: Room 507, Building B, Phase I, Nanhai Industrial Think Tank City, Taoyuan Road, Software Park, Shishan Town, Nanhai District, Foshan City, Guangdong Province Patentee before: GUANGDONG ADA INTELLIGENT EQUIPMENT Co.,Ltd. Country or region before: China |