CN112703108B - 具有双侧传感器布置的复合玻璃板 - Google Patents
具有双侧传感器布置的复合玻璃板 Download PDFInfo
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- CN112703108B CN112703108B CN202080002108.8A CN202080002108A CN112703108B CN 112703108 B CN112703108 B CN 112703108B CN 202080002108 A CN202080002108 A CN 202080002108A CN 112703108 B CN112703108 B CN 112703108B
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- conductive layer
- layer
- structured conductive
- composite glass
- structured
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- H—ELECTRICITY
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Abstract
本发明涉及一种具有双侧传感器布置的复合玻璃板(1),其具有第一基板层(GS1)和第二基板层(GS2)、第一结构化的导电层(LS1)和第二结构化的导电层(LS2)以及绝缘层(ISO),其中在第一导电层(LS1)中形成具有第一引线结构(V1)的第一电容敏感元件(SW1)和在第二导电层(LS2)中形成具有第二引线结构(V2)的第一电容敏感元件(SW2),其中第一结构化的导电层(LS1)和第二结构化的导电层(LS2)至少通过绝缘层(ISO)彼此分隔,其中由第一结构化的导电层(LS1)、第二结构化的导电层(LS2)以及绝缘层(ISO)组成的组件被布置在第一基板层(GS1)和第二基板层(GS2)之间,其中第一电容敏感元件(SW1)相对于第二电容敏感元件(SW2)是错开地布置的,使得第一结构化的导电层(LS1)的至少一部分形成用于第二电容敏感元件(SW2)的屏蔽,和第二结构化的导电层(LS2)的至少一部分形成用于第一电容敏感元件(SW1)的屏蔽,其特征在于,第一电容敏感元件(SW1)和第一引线结构(V1)的元件重叠共计小于或等于第二电容敏感元件(SW2)的面积的10%。本发明此外涉及这种复合玻璃质玻璃板的用途。
Description
本发明涉及具有双侧传感器布置的复合玻璃板。
由欧洲专利申请EP 3 264 242 A1已知,将接触式传感器作为开关元件与电致发光显示屏集成在玻璃质玻璃板中。由欧洲专利申请EP 3 264 241 A1已知一种类似的布置。
由国际专利申请WO 2016/116 372 A1已知两个彼此相邻放置的接触式传感器的布置。
电容接触式传感器具有以下性质:在没有进一步措施的情况下,不能区别是从接触式传感器的哪一侧操作的。
由WO 2018/215 106 A1已知一种接触式传感器和一种雨水传感器,由于各自不同的相对定位,它们是不对称定位的,也就是说,每一个传感器各靠近一个不同的玻璃板表面。
这仅能通过相比于玻璃板的一个表面,将接触式传感器布置得更靠近玻璃板的另一个表面来实现。在此,将靠近理解为是指沿法线方向距离电容敏感区域的平面延伸的距离。
然而,为了避免错误操作,则必须对传感器进行深入评估,以使“不期望的”一侧的电容影响不会导致切换成功。但是,在各种情况下由此也会减小“期望的”一侧的电容影响导致切换成功的范围。
为了克服这种限制,因此在过去提出了采用一种屏蔽,使得“不期望的”一侧的电容影响被屏蔽,并因此不会导致切换成功。
但是,如果需要两个接触式传感器在不同侧上,则需要侧向错开地布置接触式传感器,或者由于结构构成形式的原因,产生相对厚的布置,该相对厚的布置如下构成:具有第一接触式传感器的导电层、绝缘层和随后的屏蔽层,然后在其上需要另一绝缘层,该另一绝缘层朝向具有第二接触式传感器的第二导电层。
传感器的并排布置是占用空间的,并且导致光学可用区域减小。在此既要遵循实际的限制又要遵循规范性限制,因此并排布置并非总是可行的。此外,经常希望不要散布连接,而是将它们集中地提供给其他电气系统。
但是,如果以已知方式来存放接触式传感器,则经常出现复合玻璃板变得太厚的问题。随着厚度的增加,复合玻璃质玻璃板也变得更重。这两者都是不希望的现象,因为例如插入宽度经常不允许超过一定大小,或者是要求保持小的重量,例如在交通工具的情况中,以便能将有效载荷保持在高水平,或者需要较少的用于行驶的驱动能量。
由此出发,本发明的目的是提供一种改进的复合玻璃质玻璃板,其中避免了现有技术中的一个或多个问题。
所述目的通过一种具有双侧传感器布置的复合玻璃板得以实现,该复合玻璃板具有第一基板层和第二基板层、第一结构化的导电层和第二结构化的导电层以及绝缘层,其中在第一导电层中形成具有第一引线结构的第一电容敏感元件和在第二导电层中形成具有第二引线结构的第二电容敏感元件,其中第一结构化的导电层和第二结构化的导电层至少通过绝缘层彼此分隔,其中该由第一结构化的导电层、第二结构化的导电层以及绝缘层组成的组件是布置在第一基板层和第二基板层之间的,其中第一电容敏感元件相对于第二电容敏感元件是错开布置的,使得第一结构化的导电层的至少一部分形成用于第二电容敏感元件的屏蔽,并且第二结构化的导电层的至少一部分形成用于第一电容敏感元件的屏蔽。
在此,第一电容敏感元件和第一引线结构的元件重叠共计小于或等于第二电容敏感元件的面积的10%。
这具有以下优点:在狭窄的空间中,在复合玻璃质玻璃板的不同侧上提供两个具有有效区域的接触式传感器,其中仅需要少量层,但仍然提供了接触式传感器的去耦,使得能够敏感设计接触式传感器。
也就是说,传感器的一部分可以重叠。在重叠小的情况下,来自“不期望的”一侧的电容影响是如此之小,以至于在“期望的”一侧上不会持久性地损害灵敏度。
在本发明的另一实施方式中,第一结构化的导电层和/或第二结构化的导电层具有 10 µm – 75 µm的高度,特别是35 µm或特别优选50 µm。
这能够实现薄的布置,该薄的布置也可以集成到复合玻璃板中或者也可以适应于弯曲表面。
在本发明的又一实施方式中,第一结构化的导电层和/或第二结构化的导电层具有铜、锡、银、氧化铟锡、金、石墨烯和/或它们的混合物。
也就是说,本发明可以良好且廉价地嵌入到现有工艺中。
根据本发明的另一实施方式,所述绝缘层是膜。
也就是说,本发明可以良好且廉价地嵌入到现有工艺中。
根据本发明的又一实施方式,所述绝缘层是膜,并且第一结构化的导电层和/或第二结构化的导电层是施加在所述膜上的。
由此,可以提供预制用于引入到复合玻璃质玻璃板中的具有一个或两个结构化的导电层的膜F。
在本发明的一个实施方式中,第一基板层和/或第二基板层是玻璃或塑料基板。
在本发明的又一实施方式中,第一基板层和/或第二基板层选自平板玻璃、浮法玻璃、石英玻璃、硼硅酸盐玻璃、钠钙玻璃、聚乙烯、聚丙烯、聚碳酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、聚酰胺、聚酯、聚氯乙烯和/或它们的混合物。
也就是说,本发明可以良好且廉价地嵌入到现有工艺中。
根据本发明的另一实施方式,绝缘层具有至少一种选自下述的材料:聚酰亚胺、聚氨酯、聚亚甲基甲基丙烯酸、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯醇缩丁醛、FR6、丙烯腈-丁二烯-苯乙烯共聚物、聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚对苯二甲酸丁二醇酯、聚酰胺。
根据本发明的复合玻璃质玻璃板可以在本发明的实施方式中用作交通工具玻璃板或用作建筑物装配玻璃的一部分或用于显示器中。
下面借助于附图和实施例更详细地解释本发明。附图是示意图,并非按比例绘制。附图不以任何方式限制本发明。
其中
图1 示出了关于膜、基板层的布置的示意性概图,以说明根据本发明的各个方面,
图2 示出了导电层的示意性俯视图,其中第一导电层布置在上侧上,
图3 示出了导电层的示意性俯视图,其中第二导电层布置在上侧上,
图4 示出了作为接触式传感器起作用的部件的示意性视图,省略了屏蔽部件,其中第二导电层布置在上侧上,和
图5示出了具有屏蔽部件的作为接触式传感器起作用的部件的示意性视图,其中第二导电层布置在上侧上。
下面将参考附图更详细地说明本发明。在此应当注意,描述了可以各自单独使用或组合使用的不同方面。也就是说,除非明确示出为纯替代,否则任何方面都可以用本发明的不同实施方式来使用。
此外,为了简单起见,下面在各种情况下始终仅参考一个实体。然而,除非明确指出,否则本发明也可以在每种情况中具有多个相关实体。在这方面,词语“一”,“一个”和“一种”的使用仅应被理解为表示,在一个简单的实施方式中使用至少一个实体。
在以下描述的方法中,方法的各个步骤可以以任意顺序排列和/或组合,除非上下文另有明确说明。此外,这些方法可以相互组合-除非另有明确说明。
具有数值的数据通常不应被理解为精确值,而是也包括+/- 1%至+/- 10%的公差。
只要在本申请中提及标准、规范等,则至少始终涉及在申请日可使用的标准、规范等。也就是说,标准/规范等被更新或被后继者替换,则本发明也适用于此。
在附图中示出了各种实施方式。在下文中,将依据电容式接近传感器来理解接触式传感器。也就是说,在各种情况下,为影响电容,不需要接触,而是接近。在此情况下,接触式传感器的感压板形成平面电极。通过电容传感器电子设备测量该平面电极的电容。当接地体靠近它们或者例如接触平面电极上方的绝缘层时,平面电极的电容相对于大地变化。绝缘层例如可以通过基板Gs1、Gs2来形成。电容变化通过传感器电子设备来测量,并且在超过阈值时触发开关信号。开关区域由平面电极的形状和尺寸共同决定。
在此,图1示出了关于膜、基板层的布置的示意性概图,以说明根据本发明的各个方面。
在此,在示意性截面中示出了具有双侧传感器布置的复合玻璃板1。
复合玻璃板1具有第一基板层GS1和第二基板层GS2。
此外,复合玻璃板1具有第一结构化的导电层LS1和第二结构化的导电层LS2以及绝缘层ISO。
在第一导电层LS1中形成具有第一引线结构V1的第一电容敏感元件SW1。第一电容敏感元件SW1例如可以如此来设计,使得其在其大小方面相应于平均指尖大小。第一电容敏感元件SW1优选具有1 cm2至200 cm2,特别优选1 cm2至10 cm2的面积。第一电容敏感元件SW1例如可以具有卵形,椭圆形或圆形,三角形,矩形,正方形或其它类型的四边形或更多多边形的形状。特别地,圆形,椭圆形或液滴状的形状或具有倒圆角的形状以及条形形状是特别有利的。
任选地,此外可以形成(相对于引线结构V1)扩大的连接区域AB1,以使与其它电子设备的接触变得容易。
在第二导电层LS2中,形成具有第二引线结构V2的第二电容敏感元件SW2。第二电容敏感元件SW2例如可以如此来设计,使得其同样在其大小方面相应于平均指尖大小。第二电容敏感元件SW2优选具有1 cm2至200 cm2,特别优选1 cm2至10 cm2的面积。第二电容敏感元件SW2例如可以具有卵形,椭圆形或圆形,三角形,矩形,正方形或其它类型的四边形或更多多边形的形状。特别地,圆形,椭圆形或液滴状的形状或具有倒圆角的形状和条形形状是特别有利的。
第一结构化的导电层LS1和第二结构化的导电层LS2至少通过绝缘层ISO彼此分隔。
该由第一结构化的导电层LS1、第二结构化的导电层LS2以及绝缘层ISO构成的布置被布置在第一基板层GS1和第二基板层GS2之间。
第一电容敏感元件SW1相对于第二电容敏感元件SW2在其空间平面延伸上与其错开地布置,使得第一结构化的导电层LS1的至少一部分形成用于第二电容敏感元件SW2的屏蔽,并且第二结构化的导电层LS2的至少一部分形成用于第一电容敏感元件SW1的屏蔽。
也就是说,不是第一电容敏感元件SW1的一部分的第一结构化的导电层LS1的至少一部分形成用于第二电容敏感元件SW2的屏蔽。不是第二电容敏感元件SW2的一部分的第二结构化的导电层LS2的至少一部分形成用于第一电容敏感元件SW1的屏蔽。
这具有以下优点:在狭窄的空间中,在复合玻璃质玻璃板的不同侧上提供两个具有有效区域的接触式传感器,其中仅需要少量层,但仍然提供了接触式传感器的去耦,使得能够敏感设计接触式传感器。
因此可以在小空间上提供接触式传感器。也就是说,在提供用于这种接触式传感器的有限区域中,现在可以在复合玻璃板1的两侧上提供接触式传感器,从而在有利的情况下,可以在有限的面积上将接触式传感器的数量加倍。
此外,可以使复合玻璃板1的厚度保持较小,因为与在单侧传感器布置的情况中相比不需要更多的层。由此可以节省重量,并且遵循迄今的插入宽度。
图2示出了第一导电层LS1的示意性俯视图,第二导电层LS2的一部分位于其下方。在此可以看出,第二导电层LS2的位于第一电容敏感元件SW1下方的那部分用作屏蔽。此外也可以看出,(变形和放大示出的)第一引线结构V1和/或任选的所属的(变形和放大示出的)连接区域AB1同样也被第二导电层LS2的一部分屏蔽。
图3示出了同样的第二导电层LS2的示意性俯视图,第一导电层LS1的一部分位于其下方。在此可以看出,第一导电层LS1的位于第二电容敏感元件SW2下方的那部分用作屏蔽。此外也可以看出,(变形和放大示出的)第二引线结构V2和/或任选的所属的(变形和放大示出的)连接区域AB2同样被第一导电层LS1的一部分屏蔽。
在此适用的是,存在的屏蔽越多,就越少地能够从“不期望的”一侧影响接触式传感器。由于引线结构可以保持得很窄-为清楚起见,在图中该结构被夸大了-施加的影响远不如对电容敏感元件施加的影响重要。此外,在各种情况下,在引线结构的位置处或在任选的连接区域的位置处,都不应考虑故意的影响。
换句话说,通过合适的尺寸设计,可以良好地利用安装空间用于大量传感器,其中提供高程度的(相互)屏蔽。
由于感压板的导电结构仅必须传输小的电流,因此可以将该层的薄层电阻选择为较高。根据本发明的有利的导电层LS1和LS2具有0.4欧姆/口至200欧姆/口的薄层电阻。
该感压板可以与传感器电子设备以电的方式,尤其是以电流的方式、电容的方式和/或电感的方式连接。传感器电子设备可以布置在复合玻璃板1之外或之内或在复合玻璃板1上。
在本发明的实施方式中,第一电容敏感元件SW1和第一引线结构V1的元件重叠优选地小于或等于第二电容敏感元件SW2的面积的10%。也就是说,第一电容元件SW1包括其引线结构V1在内的电容可影响区域覆盖小于第二电容敏感元件SW2的面积的1/10。由此,相对于第二电容敏感元件SW2,保持小的第一电容敏感元件SW1的可能的电容影响。也就是说,尽管有重叠,但可以提供灵敏度而不会出现错误操作。由此可以更自由地放置接触式传感器。
根据本发明的另一实施方式,第一结构化的导电层LS1-如图1中所示-具有10μm-75μm的高度(也称为层的厚度) hLS1。同样可以提供第二结构化的导电层LS2。该第二导电层LS2同样可以具有10μm-75μm的高度(也称为层的厚度)hLS2。优选地,第一导电层和第二导电层具有大约35μm或50μm的高度。在第一导电层上和/或在第二导电层上可以任选地施加促粘层。该促粘层可以具有例如在每种情况下约15 µm的高度。
这能够实现薄的布置,该薄的布置也可以集成到复合玻璃板1中或者也可以适应于弯曲表面。
根据本发明的又一实施方式,第一结构化的导电层LS1和/或第二结构化的导电层LS2具有铜、锡、银、氧化铟锡、金、石墨烯和/或它们的混合物。
也就是说,本发明可以良好且廉价地嵌入到现有工艺中。
在此应当注意的是,导体层LS1、LS2可以具有不同的材料。但是,它们优选具有相同的材料。也就是说,导体结构可以适应于电和/或热和/或机械边界条件。
应当注意的是,在第一结构化电层LS1中和/或在第二电结构化层LS2中也可以实现其它电功能。例如,可以实现显示元件和/或天线和/或加热元件和/或其它功能元件。
在本发明的另一实施方式中,绝缘层ISO是膜。
也就是说,本发明可以良好且廉价地嵌入到现有工艺中。
特别地,例如,可以将第一导电层LS1和/或第二导电层LS2提供在膜上提供用于生产。
由此,可以提供预制用于引入到复合玻璃质玻璃板中的具有一个或两个结构化的导电层的膜F。
也就是说,可以通过合适的措施在导电层上提供用于形成接触式传感器的结构化。除了例如借助于印刷方法(丝网印刷等)有针对性地施加的结构化的导电层之外,替代地或附加地,可以通过烧蚀方法,例如激光结构化,剥离,铣削,切割等提供结构。
在图1中作为白色的分格示出的分隔线的宽度优选为30μm至200μm,特别优选为70μm至140μm。这种细的分隔线使可靠且足够高的电绝缘成为可能,并且同时不会或仅略微干扰穿过复合玻璃板1的透视。该分隔线优选通过激光结构化或者化学或机械剥蚀来制造。感压板的这种布置可以特别简单并且便宜地制造。
分隔线可以保持为空,但也可以填充绝缘材料。
在不限制本发明的一般性的情况下,第一导电层LS1和/或第二导电层LS2也可以提供在各自相邻的基板GS1/GS2上。
也就是说,可以通过合适的措施在导电层上提供用于形成接触式传感器的结构化。除了例如借助于印刷方法(丝网印刷等)有针对性地施加的结构化的导电层之外,替代地或附加地,可以通过烧蚀方法,例如激光结构化,剥离,铣削,切割等提供结构。
第一基板层GS1和/或第二基板层GS2例如可以是玻璃质基板或塑料基板。作为基板,基本上所有在制造和使用根据本发明的交通工具玻璃板的条件下是热和化学稳定的电绝缘基板都是合适的。
参考图2和3,当一起查看它们时,可以看出紧邻的接触式传感器的并排布置。
在图4中示出了重叠,其中首先仅示出了作为接触式传感器起作用的部分,省略了屏蔽部分,其中第二导电层布置在上侧上。为了比较,由相同的观察方向在图5中示出了具有屏蔽部件的作为接触式传感器起作用的部分的示意性视图,其中第二导电层布置在上侧上。如在此可以清楚地看出的是,第二电容敏感元件SW2在此布置在第一引线结构V1的上方。为了避免电容耦合,第一引线结构V1和第二引线结构V2没有重叠。如果引线结构的面积相对于电容敏感元件SW1/SW2的面积是微小的,则也可能部分地或完全地重叠也是能够实现的。同样适用于任选的连接区域AB1、AB2。但是,期望的是,电容敏感元件的外部区域基本上被屏蔽。
第一基板层GS1和/或第二基板层GS2特别优选包含平板玻璃、浮法玻璃、石英玻璃、硼硅酸盐玻璃、钠钙玻璃或透明塑料,优选刚性透明塑料,特别是聚乙烯、聚丙烯、聚碳酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、聚酰胺、聚酯 、聚氯乙烯和/或它们的混合物。
也就是说,本发明还可以特别容易地集成到现有的材料体系中。
在本发明的另一实施方式中,绝缘层ISO具有至少一种选自下述的材料:聚酰亚胺、聚氨酯、聚亚甲基甲基丙烯酸、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯醇缩丁醛、FR6、丙烯腈-丁二烯-苯乙烯共聚物、聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚对苯二甲酸丁二醇酯、聚酰胺。
也就是说,本发明还可以特别容易地集成到现有的材料体系中。
在本发明的实施方式中,根据本发明的复合玻璃板可用作交通工具玻璃板或用作建筑物装配玻璃的一部分或用于显示器中。
在不限制一般性的情况下,所述复合玻璃板可以是挡风玻璃、后窗玻璃、侧窗玻璃或天窗玻璃。
根据本发明的另一个实施方案,提供了具有根据本发明的复合玻璃板的交通工具,特别是陆-、海-、空交通工具或太空飞行器。
特别是在短途公共交通的交通工具,例如公共汽车和火车中,可以找到在玻璃区域中的双侧开关元件。这样的开关元件例如用于控制门,以便可以从内部以及从外部将其打开。
附图标记列表
1 复合玻璃板
GS1 第一基材层
GS2 第二基材层
LS1 第一结构化的导电层
LS2 第二结构化的导电层
ISO 绝缘层
SW1 第一电容敏感层
V1 第一引线结构
SW2 第二电容敏感层
V2 第二引线结构
AB1 连接区域
AB2 连接区域
hLS1 第一结构化的导电层的高度
hLS2 第二结构化的导电层的高度
Claims (11)
1.具有双侧传感器组件的复合玻璃板(1),其具有第一基板层(GS1)、第二基板层(GS2)、第一结构化的导电层(LS1)、第二结构化的导电层(LS2)和绝缘层(ISO),其中在第一导电层(LS1)中形成具有第一引线结构(V1)的第一电容敏感元件(SW1)和在第二导电层(LS2)中形成具有第二引线结构(V2)的第二电容敏感元件(SW2),
• 其中第一结构化的导电层(LS1)和第二结构化的导电层(LS2)至少通过绝缘层(ISO)彼此分隔,
• 其中由第一结构化的导电层(LS1)、第二结构化的导电层(LS2)以及绝缘层(ISO)组成的组件被布置在第一基板层(GS1)和第二基板层(GS2)之间,
• 其中第一电容敏感元件(SW1)相对于第二电容敏感元件(SW2)是错开地布置的,使得第一结构化的导电层(LS1)的至少一部分形成用于第二电容敏感元件(SW2)的屏蔽,和第二结构化的导电层(LS2)的至少一部分形成用于第一电容敏感元件(SW1)的屏蔽,
其特征在于,第一电容敏感元件(SW1)和第一引线结构(V1)的元件重叠共计小于或等于第二电容敏感元件(SW2)的面积的10%。
2.根据权利要求1所述的复合玻璃板,其特征在于,所述第一结构化的导电层(LS1)的高度hLS1和/或所述第二结构化的导电层(LS2)的高度hLS2为10 µm – 75 µm。
3.根据权利要求1所述的复合玻璃板,其特征在于,所述第一结构化的导电层(LS1)的高度hLS1和/或所述第二结构化的导电层(LS2)的高度hLS2为50 µm。
4.根据权利要求1-3中任一项所述的复合玻璃板,其特征在于,所述第一结构化的导电层(LS1)和/或所述第二结构化的导电层(LS2)具有铜、锡、银、氧化铟锡、金、石墨烯和/或它们的混合物。
5.根据权利要求1-3中任一项所述的复合玻璃板,其特征在于,所述绝缘层(ISO)是膜。
6.根据权利要求1-3中任一项所述的复合玻璃板,其特征在于,所述绝缘层(ISO)是膜,并且所述第一结构化的导电层(LS1)和/或所述第二结构化的导电层(LS2)是施加在所述膜上的。
7.根据权利要求1-3中任一项所述的复合玻璃板,其特征在于,所述第一基板层(GS1)和/或所述第二基板层(GS2)是玻璃或塑料基板。
8.根据前述权利要求1-3中任一项所述的复合玻璃板,其特征在于,所述第一基板层(GS1)和/或所述第二基板层(GS2)选自平板玻璃、浮法玻璃、石英玻璃、硼硅酸盐玻璃、钠钙玻璃、聚乙烯、聚丙烯、聚碳酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、聚酰胺、聚酯、聚氯乙烯和/或它们的混合物。
9.根据权利要求1-3中任一项所述的复合玻璃板,其特征在于,所述绝缘层(ISO)具有至少一种选自下述的材料:聚酰亚胺、聚氨酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯醇缩丁醛、丙烯腈-丁二烯-苯乙烯共聚物、聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚对苯二甲酸丁二醇酯和聚酰胺。
10.根据前述权利要求1-9中任一项所述的复合玻璃板作为交通工具玻璃板的用途。
11.根据前述权利要求1-9中任一项所述的复合玻璃板作为建筑物装配玻璃的一部分的用途。
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| CN106457779B (zh) | 2015-01-20 | 2019-04-09 | 法国圣戈班玻璃厂 | 具有电容性开关区域的复合玻璃板 |
| EP3264241A1 (en) | 2016-06-29 | 2018-01-03 | Saint-Gobain Glass France | Lighting laminated glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturing |
| EP3264242A1 (en) | 2016-06-29 | 2018-01-03 | Saint-Gobain Glass France | Touch control glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturing |
| US11733801B2 (en) * | 2017-09-29 | 2023-08-22 | Apple Inc. | Touch sensor panel architecture with multiple sensing mode capabilities |
| US10485094B1 (en) * | 2018-08-27 | 2019-11-19 | Tactotek Oy | Multilayer structure with embedded sensing functionalities and related method of manufacture |
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2020
- 2020-07-21 US US17/634,831 patent/US12327700B2/en active Active
- 2020-07-21 JP JP2022508562A patent/JP7261351B2/ja active Active
- 2020-07-21 WO PCT/EP2020/070505 patent/WO2021028163A1/de not_active Ceased
- 2020-07-21 KR KR1020227004026A patent/KR102700739B1/ko active Active
- 2020-07-21 CN CN202080002108.8A patent/CN112703108B/zh active Active
- 2020-07-21 EP EP20740345.2A patent/EP4013609B1/de active Active
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| GB1042331A (en) * | 1961-09-29 | 1966-09-14 | Emi Ltd | Improvements relating to printed electric circuits and to the manufacture of such circuits |
| DE4031560A1 (de) * | 1990-10-05 | 1992-04-09 | Dieter Prof Dr Ing Seitzer | Stromsensor, multiplizierer, kopplungselement |
| WO2000021659A1 (en) * | 1998-10-09 | 2000-04-20 | Motorola Inc. | Integrated multilayered microfluidic devices and methods for making the same |
| WO2018215106A1 (de) * | 2017-05-24 | 2018-11-29 | Saint-Gobain Glass France | Verbundglasscheibe und verfahren zu deren herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021028163A1 (de) | 2021-02-18 |
| EP4013609B1 (de) | 2023-09-27 |
| KR102700739B1 (ko) | 2024-08-30 |
| US12327700B2 (en) | 2025-06-10 |
| JP7261351B2 (ja) | 2023-04-19 |
| EP4013609A1 (de) | 2022-06-22 |
| JP2022544245A (ja) | 2022-10-17 |
| US20220301793A1 (en) | 2022-09-22 |
| KR20220034158A (ko) | 2022-03-17 |
| CN112703108A (zh) | 2021-04-23 |
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Effective date of registration: 20250723 Address after: Turot, France Patentee after: Saint Gobain Safety Glass Company in France Country or region after: France Address before: Kolb Watt, France Patentee before: SAINT-GOBAIN GLASS FRANCE Country or region before: France |