CN112701108A - Chip packaging structure and preparation method thereof - Google Patents
Chip packaging structure and preparation method thereof Download PDFInfo
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- CN112701108A CN112701108A CN202011639646.6A CN202011639646A CN112701108A CN 112701108 A CN112701108 A CN 112701108A CN 202011639646 A CN202011639646 A CN 202011639646A CN 112701108 A CN112701108 A CN 112701108A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
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Abstract
本发明涉及芯片封装技术领域，具体公开了一种芯片封装结构及其制备方法。芯片封装结构包括：底板，底板上设置有接地端点；至少一个电子元件，电子元件设置于底板；塑封体，塑封体覆盖至少部分设置于电子元件上；屏蔽结构，屏蔽结构设置于塑封体的外围；以及接地金属线，接地金属线至少部分穿过所述塑封体并连接于接地端点与屏蔽结构之间。本发明中的芯片封装结构采用接地金属线来连接底板上的接地端点和屏蔽结构，在实际加工的过程中，无需采用高精密的镭射机台来进行镭射打孔，不存在盲孔打孔深度不好控制的问题，接地金属线可以采用键合机来制备形成，该接地金属线的设置不会出现气泡，不易出现接地不良的问题，生产成本低，生产良率高。
The invention relates to the technical field of chip packaging, and specifically discloses a chip packaging structure and a preparation method thereof. The chip packaging structure includes: a bottom plate, on which a ground terminal is arranged; at least one electronic component, the electronic component is arranged on the bottom plate; a plastic sealing body, which covers at least part of the electronic component; and a shielding structure, which is arranged on the periphery of the plastic sealing body and a grounding metal wire, the grounding metal wire at least partially passes through the plastic package and is connected between the grounding terminal and the shielding structure. The chip packaging structure in the present invention uses grounding metal wires to connect the grounding terminal on the bottom plate and the shielding structure. In the actual processing process, there is no need to use a high-precision laser machine for laser drilling, and there is no blind hole drilling depth. For the problem of poor control, the grounding metal wire can be prepared by a bonding machine. The setting of the grounding metal wire will not cause air bubbles, and the problem of poor grounding is not easy to occur. The production cost is low and the production yield is high.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a chip packaging structure and a preparation method thereof.
Background
In the chip packaging process, in order to avoid generating electromagnetic signal interference with other electronic components, a shielding cover (or generated by adopting an electroplating process) needs to be assembled, the shielding cover is connected with a grounding end of a substrate, and the connection mode of the shielding cover and the grounding end is generally realized by laser punching and filling conductive adhesive, and the inventor finds that: this connection has the following drawbacks:
(1) the laser punching needs to adopt a high-precision laser machine table, and a transmitter is a loss part, so that the laser cost is high, the output per hour is low, the blind hole punching depth is not easy to control, and the risk of punching a polar plate is caused;
(2) the blind hole point conductive adhesive is easy to generate bubbles to cause poor grounding.
Disclosure of Invention
The invention discloses a chip packaging structure and a preparation method thereof.
In order to achieve the above object, an embodiment of the present invention discloses a chip packaging structure, including:
the grounding terminal point is arranged on the bottom plate;
at least one electronic component disposed on the base plate;
the plastic package body is at least partially arranged on the electronic element in a covering mode;
the shielding structure is arranged at the periphery of the plastic package body; and
the grounding metal wire at least partially penetrates through the plastic package body and is connected between the grounding end and the shielding structure.
Because the chip packaging structure adopts the grounding metal wire to connect the grounding end point and the shielding structure on the bottom plate, in the process of actually processing the chip packaging structure, a high-precision laser machine table is not needed for laser punching, the problem that the punching depth of a blind hole is not easy to control is avoided, the grounding metal wire can be prepared and formed by a bonding machine, the problem of poor grounding due to no bubbles can be caused in the arrangement of the grounding metal wire, the conductive performance and the stability of the grounding metal wire are superior to those of conductive adhesive, the production cost is low, and the production yield is high.
As an alternative embodiment, in an embodiment of the invention, the diameter of the earth wire is not less than 0.018 mm. The diameter of the grounding metal wire is set to be not less than 0.018mm, so that a good straightening effect of the grounding metal wire can be guaranteed, the grounding metal wire can be prevented from being bent and deformed by impact force of plastic package fluid in the plastic package process, and the grounding stability of the grounding metal wire can be guaranteed.
As an optional implementation manner, in an embodiment of the present invention, the number of the ground metal wires is at least one, the ground metal wire has a first connection end and a second connection end, the first connection end of the ground metal wire is connected to the ground end of the bottom board, the second connection end of the ground metal wire is connected to the shielding structure, and the bottom board has at least one ground end whose number matches the number of the ground metal wires. The grounding metal wires are arranged to be one, two or more than two, and at least one grounding end point which is matched with the grounding metal wires in number is correspondingly arranged on the bottom plate, so that the connection stability of the grounding metal wires can be improved.
As an optional implementation manner, in an embodiment of the present invention, a plastic package cavity is formed between the shielding structure and the bottom plate, the electronic component is disposed in the plastic package cavity, and the plastic package body fills the plastic package cavity and covers all the electronic component, so that the plastic package body can well package all the structural components on the bottom plate, and the structure on the bottom plate is protected and fixed conveniently.
As an optional implementation manner, in an embodiment of the present invention, the electronic component has a highest surface protruding out of the bottom plate, a plastic cover is disposed on a side of the plastic cover away from the bottom plate, a distance between the plastic cover and the highest surface of the electronic component protruding out of the bottom plate is a plastic package height, and the plastic package height is 0.05mm to 0.5 mm. The plastic package height is 0.05mm to 0.5mm, so that the structural part on the bottom plate can be well plastically packaged, the phenomenon that the size of the chip packaging structure is too large due to the fact that the plastic package body is too high can be avoided, and the chip packaging structure is convenient to achieve miniaturized design.
As an alternative implementation manner, in the embodiment of the present invention, the grounding metal wire includes a gold wire or a copper wire, and the conductive performance is good. The copper wire is preferably adopted in the application, so that the production and manufacturing cost of the chip packaging structure is reduced conveniently.
As an optional implementation manner, in an embodiment of the present invention, the plastic package body includes an epoxy plastic package material, and the epoxy plastic package material is a powdered molding compound formed by mixing an epoxy resin as a matrix resin, a high performance phenolic resin as a curing agent, silica powder and the like as fillers, and a plurality of auxiliaries, so as to facilitate the plastic package of the structural member on the base plate.
As an alternative, in an embodiment of the invention, both the starting and ending ends of the earth wire are located on the base plate. The method comprises the steps of arranging a starting end and an end point of a grounding metal wire on a bottom plate, forming the grounding metal wire between the starting end and the end point, forming a bending structure on the grounding metal wire in a direction perpendicular to the bottom plate, forming a bending part at the topmost end of the bending structure in the direction perpendicular to the bottom plate, and then shearing one side of the grounding metal wire which is bent back and forth and deviates from the bottom plate (namely the bending part), so that a plurality of independent grounding metal wires can be formed. Therefore, after one side of the grounding metal wire, which is deviated from the bottom plate, is cut off, the grounding metal wire can form a plurality of grounding positions on the bottom plate, the grounding stability of the chip packaging structure can be improved, the bending deformation of the grounding metal wire under the action of the impact force of plastic packaging fluid in the plastic packaging process can be reduced, namely, the grounding metal wire is formed in a closed-loop stretching mode, and the strength and the service life of the grounding metal wire can be ensured.
As an alternative implementation, in an embodiment of the present invention, the shielding structure includes a metal shielding cover or a metal shielding layer. Set up shielding structure into metal shielding lid, simple structure, the processing of being convenient for sets up shielding structure into the metal shielding layer, and when chip package structure size required was higher, the volume of chip package structure can be reduced in the setting of metal shielding layer, the miniaturized design of the chip package structure of being convenient for more.
As an optional implementation manner, in an embodiment of the present invention, the grounding metal wire protrudes out of the plastic package body and abuts against, is welded to, or is connected to the shielding structure through a conductive adhesive, so that the grounding metal wire protrudes out of the plastic package body.
As an optional implementation manner, in the embodiment of the present invention, the bottom plate is a PCB, which has a simple structure and is convenient for carrying and supporting the plastic package body, the electronic component, the shielding structure, and the like.
On the other hand, the embodiment of the invention also provides a preparation method of the chip packaging structure, the preparation method of the chip packaging structure is used for preparing the chip packaging structure, and the preparation method of the chip packaging structure comprises the following steps:
mounting the electronic component on the base plate;
forming or mounting the grounding wire;
the plastic package body is formed on the bottom plate in an injection molding mode, and the second connecting end of the grounding metal wire is exposed out of the plastic package surface of the plastic package body;
forming or installing the shielding structure to electrically connect the grounding metal wire.
The grounding metal wire is adopted to realize the connection between the grounding end point on the bottom plate and the shielding structure, and the conductivity and the stability of the grounding metal wire are superior to those of the conductive adhesive, so that the shielding effect of a packaged finished product can be improved.
As an alternative implementation manner, in the embodiment of the present invention, in the step of forming or installing the grounding metal wire, a metal ball is deposited at the grounding end of the bottom plate by using a bonding machine, and a porcelain mouth of the bonding machine is made to stretch from the metal ball in a manner perpendicular to the bottom plate to form the grounding metal wire, and the grounding metal wire is fused after the grounding metal wire is higher than the bottom plate by a first preset value. Compared with a laser punching mode, the preparation method of the chip packaging structure is not easy to generate bubbles to cause defects, and can improve the production yield of the chip packaging structure.
As an optional implementation manner, in an embodiment of the present invention, after the step of injection molding the plastic package body on the bottom plate and exposing the second connection end of the grounding metal wire to the plastic package surface of the plastic package body, and before the step of forming or mounting the shielding structure and electrically connecting the grounding metal wire, the method for manufacturing the chip package structure further includes:
adopt automatic wafer attenuate machine right the plastic-sealed body is polished so that the plastic-sealed body is kept away from the front cover of moulding of bottom plate with electronic component protrusion in the distance between the highest face of bottom plate is 0.05mm to 0.5 mm. Namely, the plastic package height of the plastic package body is 0.05mm to 0.5mm, so that on one hand, the structural member on the bottom plate can be well plastically packaged, on the other hand, the phenomenon that the size of the chip packaging structure is too large due to the fact that the plastic package body is too high can be avoided, and the miniaturization design of the chip packaging structure is convenient to achieve.
As an optional implementation manner, in the embodiment of the present invention, in the step of forming or installing the shielding structure and electrically connecting the grounding metal wire, a conductive adhesive is dispensed on the grounding metal wire exposed out of the plastic package body, and the grounding metal wire is connected to the shielding structure through the conductive adhesive, so that the connection strength between the grounding metal wire and the shielding structure can be ensured.
As an alternative, in the embodiment of the present invention, in the step of forming or installing the shielding structure and electrically connecting the grounding metal wire, the shielding structure is generated on the surface of the plastic package body by means of magnetron sputtering coating. The shielding structure formed at this time is a shielding metal layer, and the miniaturization design of the chip packaging structure can be realized. That is, when the minimum limit of the package size is required, the metal layer is generated on the surface of the plastic package body by adopting a magnetron sputtering coating mode, so that the miniaturization of the chip package structure and the shielding effect can be achieved.
As an alternative, in the embodiment of the present invention, in the step of forming or mounting the grounding wire, the bonder is stretched back and forth in a height direction of the base plate to form the grounding wire having a start end and an end on the base plate. That is to say, the grounding metal wire is formed by adopting a closed-loop stretching mode, so that the bending deformation of the grounding metal wire under the action of the impact force of plastic package fluid in the plastic package process can be reduced, and the strength and the service life of the grounding metal wire can be ensured.
As an alternative, in the embodiment of the present invention, after the step of reciprocally drawing the bonder in the height direction of the base plate to form the grounding wire having the start end and the end on the base plate, the side of the reciprocally bent grounding wire facing away from the base plate is cut to form a plurality of independent grounding wires. After the bonding machine is used for stretching and reciprocating in the height direction of the bottom plate, the grounding metal wire can be formed between the starting end and the terminal end, the grounding metal wire forms a bending structure in the direction vertical to the bottom plate, the bending structure forms a bending part at the topmost end in the direction vertical to the bottom plate, and then the side, away from the bottom plate, of the grounding metal wire bent in a reciprocating mode is cut off (namely the bending part), so that a plurality of independent grounding metal wires can be formed. Therefore, after one side of the grounding metal wire, which is deviated from the bottom plate, is cut off, the grounding metal wire can form a plurality of grounding positions on the bottom plate, the grounding stability of the chip packaging structure can be improved, the bending deformation of the grounding metal wire under the action of the impact force of plastic packaging fluid in the plastic packaging process can be reduced, namely, the grounding metal wire is formed in a closed-loop stretching mode, and the strength and the service life of the grounding metal wire can be ensured.
Compared with the prior art, the chip packaging structure and the preparation method thereof have the following beneficial effects:
the chip packaging structure adopts the grounding metal wire to connect the grounding end point and the shielding structure on the bottom plate, in the process of actually processing the chip packaging structure, a high-precision laser machine table is not needed for laser punching, the problem that the punching depth of a blind hole is not easy to control is avoided, the grounding metal wire can be prepared and formed by a bonding machine, bubbles cannot be generated in the grounding metal wire, the problem of poor grounding is not easy to generate, the conductivity and the stability of the grounding metal wire are superior to those of conductive adhesive, the production cost is low, and the production yield is high.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a chip package structure according to an embodiment of the disclosure;
fig. 2 is a cross-sectional view of another chip package structure disclosed in the embodiments of the present invention;
fig. 3 is a flowchart of a method for manufacturing a chip package structure according to an embodiment of the present invention.
Icon: 10. a base plate; 20. an electronic component; 30. molding the body; 40. a shielding structure; 50. and a grounding wire.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the particular nature and configuration of which may be the same or different, and not intended to indicate or imply the relative importance or importance of the indicated device, element, or component.
The following detailed description is made with reference to the accompanying drawings.
Example one
Referring to fig. 1 and 2, according to an embodiment of the present invention, a chip package structure is provided, which includes a bottom plate 10, an electronic component 20, a plastic package body 30, a shielding structure 40, and a grounding metal line 50.
Wherein, a grounding end point is arranged on the bottom plate 10; at least one electronic component 20 is disposed on the base plate 10; the plastic package body 30 is at least partially covered and arranged on the electronic element 20; the shielding structure 40 is disposed at the periphery of the plastic package body 30; the grounding wire 50 at least partially penetrates the plastic package body 30 and is connected between the grounding terminal and the shielding structure 40. It is understood that the electronic component 20 in the present embodiment includes a chip assembly, an LED, and other components.
Because the chip packaging structure in this embodiment adopts grounding metal wire 50 to connect grounding end point and shielding structure 40 on bottom plate 10, at the in-process of actual processing chip packaging structure, need not to adopt high-precision laser board to carry out laser punching, there is not the not well problem of control of blind hole punching depth, grounding metal wire 50 can adopt the bonding machine to prepare and form, this grounding metal wire 50's setting can not appear the bubble, the difficult bad problem of ground connection appears, and grounding metal wire 50's electric conductive property and stability are superior to the conducting resin, low in production cost, the production yield is high.
In addition, since at least a portion of the grounding metal wire 50 in the embodiment passes through the plastic package body 30, the grounding metal wire 50 can be protected by the plastic package effect of the plastic package body 30, so that the connection stability and reliability of the grounding metal wire 50 are improved, and the grounding stability of the grounding metal wire 50 is prevented from being damaged by the chip package structure in the moving or using process due to the damage of the grounding metal wire 50.
Specifically, the bottom plate 10 in this embodiment has a rectangular plate-shaped structure, and has a simple structure, so as to support and support the electronic component 20, the plastic package body 30, the shielding structure 40, and the like. Alternatively, the bottom plate 10 may also have a square plate structure, a circular plate structure, an oval plate structure, a triangular plate structure, other polygonal or irregular plate structures, as long as the bottom plate has other modified structures capable of carrying the electronic component 20, the plastic package 30 and the shielding structure 40, and the scope of the present invention is also covered by the present invention.
The electronic component 20 in this embodiment includes at least one chip, and is specifically configured according to actual usage requirements. The concept of the present application will be described in the present embodiment by taking an example in which the electronic component 20 includes a chip and a functional device. Specifically, the electronic component 20 in this embodiment includes two chips, the two chips are respectively laid and fixed on the bottom plate 10, the ground end point on the bottom plate 10 is located between the two chips, and the ground metal wire 50 extends from the ground end point to the direction away from the bottom plate 10 to contact with the shielding structure 40, so as to implement ground connection of the shielding structure 40 and avoid electromagnetic signal interference between components inside the shielding structure 40 and other electronic components.
In the process of actually processing the grounding metal wire 50, the grounding metal wire 50 is prepared by a bonding machine, specifically, gold balls are firstly deposited on the bottom plate 10, then a ceramic nozzle of the bonding machine is straightened in a mode of being perpendicular to the bottom plate 10 to obtain the grounding metal wire 50, and the grounding metal wire 50 is fused after being stretched to a certain height. Optionally, the diameter of the grounding metal wire 50 in this embodiment is not less than 0.018mm, for example, 0.018mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, or 0.1mm, and the diameter of the grounding metal wire 50 is set to be not less than 0.018mm, which can ensure a good straightening effect of the grounding metal wire 50, avoid the bending and deformation of the grounding metal wire 50 caused by the impact force of the plastic package fluid during the plastic package process, and ensure the grounding stability of the grounding metal wire 50.
Optionally, in this embodiment, at least one grounding metal wire 50 is provided, for example, one, two or more grounding metal wires 50 may be provided, and the grounding metal wire 50 has a first connection end and a second connection end, the first connection end of the grounding metal wire 50 is connected with the grounding end point of the bottom board 10, the second connection end of the grounding metal wire 50 is connected with the shielding structure 40, and the bottom board 10 has at least one grounding end point matching with the number of the grounding metal wires 50, the grounding metal wires 50 are provided as two or more grounding metal wires 50, and at least one grounding end point matching with the number of the grounding metal wires 50 is correspondingly provided on the bottom board 10, so that the connection stability of the grounding metal wires 50 can be improved.
For example, the grounding metal wire 50 in the present embodiment may be a gold wire, or may be a copper wire, and the gold wire and the copper wire have good conductivity. The copper wire is preferably adopted in the application, so that the production and manufacturing cost of the chip packaging structure in the embodiment is reduced. Of course, in other embodiments of the present invention, the grounding wire 50 may also be made of conductive metal such as nickel, chromium, etc.
Referring to fig. 1, in some embodiments of the present invention, the starting end of the grounding wire 50 is located on the base plate 10 and the ending end is located on the shielding structure 40. Referring to fig. 2, in other embodiments of the present invention, the starting end and the ending end of the grounding wire 50 are both located on the base plate 10, and the starting end and the ending end of the grounding wire 50 are both located on the base plate 10, at this time, the grounding wire 50 is formed between the starting end and the ending end, the grounding wire 50 is formed into a bent structure in a direction perpendicular to the base plate 10, the bent structure is formed into a bent portion at the topmost end in the direction perpendicular to the base plate 10, and thereafter, one side of the grounding wire 50 bent back and forth away from the base plate is cut off (i.e., the bent portion), so that a plurality of independent grounding wires 50 can be formed. Therefore, after the grounding metal wire 50 is cut off from one side of the bottom plate, the grounding metal wire 50 can form a plurality of grounding positions on the bottom plate 10, so that the grounding stability of the chip packaging structure can be improved, the bending deformation of the grounding metal wire 50 under the action of the impact force of plastic packaging fluid in the plastic packaging process can be reduced, namely, the grounding metal wire 50 is formed in a closed-loop stretching mode, and the strength and the service life of the grounding metal wire 50 can be ensured.
After the grounding metal wire 50 is arranged on the bottom plate 10, the plastic package body 30 can be arranged on the bottom plate 10, in the process of arranging the plastic package body 30, a plastic package cavity is formed between the shielding structure 40 and the bottom plate 10, correspondingly, the electronic element 20 is arranged in the plastic package cavity, the plastic package body 30 is filled in the plastic package cavity and covers all the electronic elements 20, the plastic package body 30 is ensured to be capable of well plastically packaging all structural components on the bottom plate 10, and the structure on the bottom plate 10 is protected and fixed conveniently.
Illustratively, the electronic component 20 has a highest surface protruding out of the base plate 10 (i.e., a surface of the electronic component 20 facing away from the base plate 10), and a side of the plastic package body 30 away from the base plate 10 has a plastic package height, where a distance between the plastic package surface and the highest surface of the electronic component 20 protruding out of the base plate 10 is 0.05mm to 0.5mm, such as 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, and 0.5 mm. The plastic package height is 0.05mm to 0.5mm, so that the structural member on the bottom plate 10 can be well plastically packaged, the phenomenon that the size of the chip packaging structure is too large due to the fact that the plastic package body 30 is too high can be avoided, and the chip packaging structure is convenient to achieve miniaturized design.
Optionally, the plastic package body 30 in this embodiment includes an Epoxy plastic package material, which is an EMC-Epoxy Molding Compound having an english name, and the Epoxy plastic package material is a powdery Molding Compound formed by mixing Epoxy resin as a matrix resin, a high-performance phenolic resin as a curing agent, silicon micropowder and the like as a filler, and a plurality of additives, so as to be convenient for plastic-packaging the structural members on the base plate 10.
Further, shielding structure 40 in this embodiment includes metal shielding lid or metal shielding layer, sets up shielding structure 40 to the metal shielding lid, simple structure, and the processing of being convenient for sets up shielding structure 40 to the metal shielding layer, and when chip package structure size required is higher, the volume of chip package structure can be reduced in the setting of metal shielding layer, the miniaturized design of chip package structure of being convenient for more.
In the specific design, the plastic package body 30 and the shielding structure 40 in this embodiment are both cubic, so that they can be conveniently mounted on the rectangular bottom plate 10. In other embodiments of the present invention, the plastic package body 30 and the shielding structure 40 may be configured as a cylinder, an elliptical cylinder, a prism, or other irregular columnar structure.
As an optional implementation manner, in the embodiment of the present invention, the grounding metal wire 50 protrudes out of the plastic package body 30 and abuts against, is welded to, or is connected to the shielding structure 40 through a conductive adhesive, so that the grounding metal wire 50 protrudes out of the plastic package body 30, when the shielding structure 40 is disposed on the outer periphery of the plastic package body 30, the grounding metal wire 50 is more easily contacted with the plastic package body 30, and can also be connected to the shielding structure 40 through abutting against, welding, or is connected through a conductive adhesive, and the like, so as to further improve the grounding stability of the chip packaging structure.
As an alternative embodiment, the bottom plate 10 may be configured as a PCB, and may also be configured as a circuit board such as an FPC, which has a simple structure and is convenient for carrying and supporting the plastic package body, the electronic component, the shielding structure, and the like.
In conclusion, in the chip package structure in this embodiment, the grounding metal wire 50 is used to connect the grounding end point on the bottom plate 10 and the shielding structure 40, in the actual process of processing the chip package structure, it is not necessary to use a high-precision laser machine to perform laser drilling, there is no problem of poor control of the drilling depth of the blind hole, the grounding metal wire 50 can be prepared and formed by using a bonding machine, the grounding metal wire 50 is not provided with bubbles, and is not prone to poor grounding, and the production cost is low and the production yield is high.
Example two
Referring to fig. 3, the present embodiment provides a method for manufacturing a chip package structure, and the method for manufacturing a chip package structure is used to manufacture the chip package structure in the first embodiment.
Specifically, the method for manufacturing the chip package structure in the embodiment includes the following steps:
101: the electronic component 20 is mounted on the base plate 10.
In this step, the base plate 10 is first placed on a work table, and then the electronic components 20 are laid on the base plate 10, so that the processing and production of the grounding wires 50 and the plastic-sealed body 30 are facilitated.
102: the grounding wire 50 is formed or mounted.
In this step, a metal ball is deposited at the ground terminal of the base plate 10 by using a bonder, and a porcelain nozzle of the bonder is stretched from the metal ball in a manner perpendicular to the base plate 10 to form a ground wire 50, and the ground wire 50 is fused after being higher than the base plate 10 by a first preset value. To ensure good straightening of the grounding wire 50 and to avoid bending deformation of the grounding wire 50 due to the impact of the plastic package fluid during plastic package, gold wires with a larger diameter, such as 0.018mm or larger diameter, are preferably used. The diameter of the grounding metal wire 50 formed by stretching in the step is not less than 0.018mm, such as 0.018mm, 0.0356, 0.04, 0.05, 0.06 or 0.1mm, and the diameter of the grounding metal wire 50 is set to be not less than 0.018mm, so that the good straightening effect of the grounding metal wire 50 can be ensured, the grounding metal wire 50 can be prevented from being bent and deformed by the impact force of plastic package fluid in the plastic package process, and the grounding stability of the grounding metal wire 50 can be ensured.
Optionally, the first preset value in this embodiment is higher than the height of the highest structural member on the bottom plate 10, specifically, the height of the plastic package body 30 to be formed later is higher.
In the process of machining the grounding wire 50, the bonder is subjected to a reciprocating drawing motion in the height direction of the base plate 10 to form the grounding wire 50 having a start point and an end point on the base plate 10. It is understood that the above-mentioned grounding wire 50 may be formed between the starting end and the ending end by subjecting the bonder to a reciprocating stretching motion in the height direction of the base plate 10, the grounding wire 50 may be formed into a bent structure in a direction perpendicular to the base plate 10, the bent structure may be formed into a bent portion at the topmost end in the direction perpendicular to the base plate 10, and thereafter, the side of the reciprocating bent grounding wire 50 facing away from the base plate may be cut off (i.e., the bent portion), so that a plurality of independent grounding wires 50 may be formed. Therefore, after the grounding metal wire 50 is cut off from one side of the base plate, the grounding metal wire 50 can form a plurality of grounding positions on the base plate 10, not only can the grounding stability of the chip packaging structure be improved, but also the bending deformation of the grounding metal wire under the action of the impact force of plastic package fluid in the plastic package process can be reduced, namely, the grounding metal wire 50 is formed in a closed-loop stretching mode, the bending deformation of the grounding metal wire 50 under the action of the impact force of the plastic package fluid in the plastic package process can be reduced, and the strength and the service life of the grounding metal wire 50 can be ensured.
When the wire bonding is carried out by using the wire bonder, one wire, two wires or more than two wires can be bonded, and the grounding metal wires 50 are arranged into two wires or more than two wires, so that the connection stability of the grounding metal wires 50 can be improved.
For example, the grounding metal wire 50 in this embodiment may be made of gold or copper, and the gold wire and the copper wire have good conductivity, so as to improve the stability of the chip package structure.
103: the plastic package body 30 is injection molded on the bottom plate 10, and the second connection end of the grounding metal wire 50 is exposed to the plastic package surface of the plastic package body 30.
In this step, the plastic package raw material of the plastic package body 30 is an epoxy plastic package material, and the epoxy plastic package material is a powdery molding compound formed by mixing epoxy resin as a matrix resin, high-performance phenolic resin as a curing agent, silicon micropowder and the like as fillers, and a plurality of auxiliaries, so that the plastic package of the structural member on the bottom plate 10 is facilitated. In the process of molding the plastic package body 30, smaller injection molding pressure is adopted, so that the bending deformation of the grounding metal wire 50 caused by stress in the injection molding process is reduced as much as possible.
104: the plastic package body 30 is polished by an automatic wafer thinning machine so that the distance between the plastic cover on the side of the plastic package body 30 far away from the bottom plate 10 and the highest surface of the electronic element 20 protruding out of the bottom plate 10 is 0.05mm to 0.5 mm.
In this step, the distance between the plastic cover surface on the side of the plastic package body 30 away from the bottom plate 10 and the highest surface of the electronic component 20 protruding from the bottom plate 10 is 0.05mm to 0.5mm, so that on one hand, the structural component on the bottom plate 10 can be well plastic-packaged, on the other hand, the phenomenon that the size of the chip package structure is too large due to the too high plastic package body 30 can be avoided, and the miniaturization design of the chip package structure is facilitated.
When the plastic package body 30 at the top is ground, the grinding wheel of the automatic wafer thinning machine rotates at a high speed to grind redundant plastic package materials, and the thickness dimension of the ground plastic package body 30 can be accurately monitored in real time in the grinding process.
105: the shielding structure 40 is formed or mounted to electrically connect the grounding wires 50.
In this step, in order to ensure the connection strength between the grounding metal wire 50 and the shielding structure 40, a conductive adhesive is dispensed on the grounding metal wire 50 exposed on the plastic cover of the plastic package body 30, and the grounding metal wire 50 is connected to the shielding structure 40 through the conductive adhesive.
Further, when the shielding structure 40 is disposed, the shielding structure 40 is formed on the surface of the plastic package 30 by magnetron sputtering coating. The shielding structure 40 formed at this time is a shielding metal layer, and the miniaturization design of the chip packaging structure can be realized. That is, when the minimum requirement of package size is met, the magnetron sputtering coating method is used to form a metal layer on the surface of the plastic package body 30, so as to achieve the miniaturization of the chip package structure and the shielding effect.
Alternatively, in other embodiments of the present invention, a metal shielding cover may be formed by injection molding or stamping, and then directly disposed on the plastic package body 30 to conduct the shielding structure 40 and the grounding metal wire 50.
In addition, the grounding metal wire 50 is adopted to realize the connection between the grounding end point on the bottom plate 10 and the shielding structure 40, and the conductive performance and the stability of the grounding metal wire 50 are superior to those of conductive adhesive, so that the shielding effect of a packaged finished product can be improved. Compared with a laser punching mode, the preparation method of the chip packaging structure is not easy to generate bubbles to cause defects, and the production yield of the chip packaging structure can be improved.
The chip package structure and the device of the manufacturing method thereof disclosed by the embodiments of the present invention are described in detail above, and the principle and the embodiment of the present invention are explained in detail herein by applying specific examples, and the description of the embodiments above is only used to help understanding the chip package structure, the manufacturing method thereof, and the core concept thereof of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (18)
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| CN113395841A (en) * | 2021-05-25 | 2021-09-14 | 佛山市国星光电股份有限公司 | Module processing method, module and device |
| US12148867B2 (en) | 2021-01-15 | 2024-11-19 | Foshan Nationstar Optoelectronics Co., Ltd | Light-emitting device and displayer |
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Application publication date: 20210423 |