CN112643165A - Device for melting welding material and method for establishing electronic connection - Google Patents
Device for melting welding material and method for establishing electronic connection Download PDFInfo
- Publication number
- CN112643165A CN112643165A CN202011587631.XA CN202011587631A CN112643165A CN 112643165 A CN112643165 A CN 112643165A CN 202011587631 A CN202011587631 A CN 202011587631A CN 112643165 A CN112643165 A CN 112643165A
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- China
- Prior art keywords
- needle head
- tin
- welding
- welding material
- needle
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/053—Heating appliances electric using resistance wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The device for melting the welding materials comprises a needle cylinder, a piston, a needle head, a controller and a transducer; the needle cylinder is connected with the needle head, and welding materials are contained in the needle cylinder; the piston can move in the syringe, and under the drive of external pressure, the piston can drive the welding material to move in the syringe and extrude and output from the needle head; the transducer is close to or positioned at the outlet of the needle head and is in electric signal connection with the controller; the controller outputs a control signal to drive the piston to move, the controller outputs a pulse type control signal to drive the transducer to output transient energy to heat welding materials in the needle head, and metal particles in the welding materials are melted into metal liquid and output from the outlet of the needle head. The precise heat supply to the needle or the spray printing part is carried out to fully melt the solder, and a precise air source or other mechanical energy propelling modes are provided to melt the solder part to form a solder drop according to the size of the pad and the requirement of connection strength.
Description
Technical Field
The invention relates to a device for melting welding materials and a method for establishing electronic connection, which belong to the technical field of welding flux processing devices and welding and are used for the production process of welding or circuit boards and circuit printed boards.
Background
With the increasing miniaturization of microelectronics and semiconductor devices, the connection between electronic devices and circuit boards has been developed from millimeter-scale pins to micron-scale leads, the density of external leads of integrated Package (SIP: System In a Package) of semiconductor systems has already reached micron level, and the traditional microelectronic connection process is divided into 2 process steps, namely, solder spreading process and heating, welding and curing process. In the material distribution process, a connecting material such as solder paste, organic resin and inorganic resin adhesive is distributed on the bonding pads and leads to be connected in a dispensing, printing, spray printing or glue dipping mode, and then a heating melting welding or curing stage is carried out.
In modern electronic circuit board manufacturing, it is usually necessary to coat the surface of the circuit board with solder paste into fine lines of micron order, and then to melt and cool the solder paste by reflow soldering, so as to form conductive paths between nodes. The pads and component connection portions of the first step material are typically heated to a temperature above the melting point of the alloy solder or the glass transition temperature of the resin using energy supply equipment such as a reflow oven, a flat oven, an oven, a laser pulse heater, etc., and then cooled to metallurgically or solidly connect the components.
Due to the miniaturization of the microelectronic and semiconductor centralized packaging, the connection size is smaller and smaller, for example, in a typical mobile phone camera module, the diameter of an external lead gold wire after the centralized packaging is only 35 micrometers, the width of a corresponding bonding pad is only 80 micrometers, and the distance is only 50 micrometers, so that great difficulty is brought to subsequent reflow or other curing processes, a steel mesh cannot be opened, and a solder paste bridge is formed in the reflow process to form a short circuit. Particularly, other elements on the camera module, such as a lens-side CMOS, have a chip which is very sensitive to temperature, and the whole module cannot adapt to typical heating and welding processes, such as reflow soldering, baking and the like.
The key point of the present invention is to solve this pain point of microelectronic and semiconductor integrated packages. And (3) heating the connecting material while distributing the material to enable the connecting material to quickly reach the melting point or the glass transition temperature point, dripping the connecting material on a connecting part in an alloy liquid drop or low-viscosity resin mode under the action of pressure injection or gravity, and directly cooling to realize metallurgical connection or solidification. The defects that the traditional heating mode causes the components and the linear smelting plate to generate wing bending deformation or influences the performance of the thermosensitive element are avoided. The technical scheme of the invention provides a simple and rapid process device and a method for forming the fine conductive path in one step.
Disclosure of Invention
The technical scheme of the invention aims to overcome the defect that in the existing micro-connection of microelectronics and semiconductors, a multi-step process of firstly applying solder, then melting and cooling is adopted for improvement, the solder is heated and melted or softened in the distribution and application process, the solder is directly applied to pins or/and pads of components and parts in the form of liquid drops, and the solder is cooled to form welding spots or the solder directly forms a micro circuit on a circuit board in the form of liquid drops. The reflux heating or other heating procedures of the original process are reduced, and the process efficiency is improved.
The technical scheme for solving the technical problems is that the device for melting welding materials comprises a needle cylinder, a piston, a needle head, a controller and a transducer; the needle cylinder is connected with the needle head, and welding materials are contained in the needle cylinder; the piston can move in the syringe, and under the drive of external pressure, the piston can drive the welding material to move in the syringe and extrude and output from the needle head; the transducer is close to or positioned at the outlet of the needle head and is in electric signal connection with the controller; the controller outputs a control signal to drive the piston to move, the controller outputs a pulse type control signal to drive the transducer to output transient energy to heat welding materials in the needle head, and metal particles in the welding materials are melted into metal liquid and output from the outlet of the needle head.
In the device for melting welding materials, the strength and/or the width and/or the frequency of the pulse type control signal output by the controller are related to the moving speed of the piston in the needle cylinder, and the faster the piston moves, the stronger the pulse type control signal output by the controller, or the wider the pulse signal width, or the higher the pulse signal frequency.
The welding material can be tin paste consisting of tin-based alloy powder and soldering flux; or tin glue consisting of tin-based alloy powder and organic resin; or silver paste composed of silver powder and organic resin; or may be a thermosetting organic resin.
The device for melting the welding material further comprises a spraying cavity, wherein the spraying cavity comprises a cavity inlet, a pneumatic or electromagnetic control channel and a spray head, and the cavity inlet is connected with the needle head; the welding material enters the jet cavity from the cavity inlet, the transducer is driven by the pulsating control signal output by the controller to output instantaneous high energy, the welding material entering the cavity is heated to melt metal particles in the welding flux, and the molten metal is driven to be jetted out from the nozzle under the control of a pneumatic or electromagnetic mode.
The molten metal is used for being sprayed to pins of electronic components and connecting the electronic components; or molten metal for spraying onto an electronic printed circuit board where it cools to form solder bumps.
The soldering material is tin paste consisting of tin-based alloy powder and soldering flux, and the particle size of the tin-based alloy powder in the tin paste is less than one fifth of the inner diameter of the needle head.
The device for melting the welding material further comprises a smoking device, and a suction head of the smoking device is close to the needle head.
The device for melting the welding material further comprises a shielding gas release device, wherein the shielding gas release device is close to the needle head, releases nitrogen and inert gas to the welding spot, protects the welding spot and prevents the needle head from outputting oxidation of metal liquid drops.
The soldering material is tin paste consisting of tin-based alloy powder and soldering flux, the soldering flux contains 0.5-5% of high-volatile-point organic acid active agent by mass percent, and the active substance is attached to the surface of molten tin after the solder is melted.
The transducer is a laser generator; or the transducer may be an electromagnetic induction heating device; or the transducer may be a resistive wire contact heat source.
The technical scheme for solving the technical problems can also be a method for establishing electronic connection, the device for melting the welding material is used for outputting the fluid-shaped welding material to a welding surface, so that an object to be welded can be directly contacted with the fluid-shaped welding material to generate metallurgical connection, and the electronic connection is established after cooling.
Compared with the prior art, the invention has the beneficial effects that: the invention uses a heat energy controllable heat source of precise and controllable electromagnetic induction, laser direct injection and resistance wire heating to supply precise heat to the needle head or the spray printing part according to the alloy melting point, the scaling powder type and the alloy grain size of the welding flux in the feeding needle cylinder or the thermal characteristic of thermosetting organic resin, so that the welding flux is fully melted, and a precise air source or other mechanical energy propulsion modes are provided, so that the welding flux melts the part to form welding drops according to the size of the welding pad and the requirement of the connection strength. The transducer does not heat the PCB bonding pad, and molten tin formed by the solder provides heat required by welding, so that the warping problem of the thin substrate heat sensitive device can be effectively protected. The liquid metal with chemical activity or the solder in a molten state is directly applied to the welding pad, and the welding pad is rapidly metallurgically connected with the welding pad to form a welding point.
Drawings
FIG. 1 is a schematic view of a preferred embodiment of an apparatus for melting a weld material using a laser;
FIG. 2 is a schematic view of a preferred embodiment of an apparatus for melting solder material using resistive heating;
FIG. 3 is a schematic view of a preferred embodiment of an apparatus for melting a solder material using electromagnetic induction heating;
FIG. 4 is a schematic view of a preferred embodiment of an ejection chamber;
fig. 5 is a schematic diagram of a preferred embodiment of the controller outputting pulsating control signals.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings.
The apparatus for melting a welding material as shown in fig. 1 comprises a cylinder 18, a piston 11, a needle 13, a controller, a transducer 15; the needle cylinder 18 is connected with the needle head 13, and the welding material 12 is contained inside the needle cylinder 18; the piston 11 can move in the syringe 18, and under the driving of external pressure, the piston 11 can drive the welding material 12 to move in the syringe 18 and extrude and output from the needle 13; the transducer 15 is close to the outlet of the needle 13, and the transducer 15 is in electric signal connection with an external controller; an external controller outputs a control signal to drive the piston 11 to move, the controller outputs a pulse type control signal to drive the transducer to output transient energy to heat the welding material 12 in the needle 11, and metal particles in the welding material are melted into metal liquid 16 and output from an outlet of the needle 11. Said transducer is a laser generator; or the transducer may be an electromagnetic induction heating device; or the transducer may be a resistive wire contact heat source.
As shown in fig. 1 for the apparatus for melting the weld material, the transducer 15 may be a laser generating device, which momentarily heats the needle. As shown in fig. 2 for the means for melting the solder material, the transducer 25 may be a resistive heating device. The apparatus for melting the solder material shown in fig. 3 comprises a transducer electromagnetic heater 37 and a temperature sensor 36 for directly heating the needle by electromagnetic induction. The heating means can be a temperature sensor, such as a thermocouple, which is arranged outside the needle or the injection cavity and used for monitoring the temperature, and the temperature sensor is introduced into the controller for processing. The temperature sensor 36 may be a thermocouple.
Use controller drive transducer in the scheme of this application, the transducer can be accurate controllable electromagnetic induction, laser and penetrate directly, the resistance wire heating, and the heat energy of transducer is controllable, according to the alloy melting point of solder in the feed cylinder, scaling powder kind and alloy particle size or the thermal property of thermosetting organic resin, to the syringe needle or carry out accurate heat supply, can export the metal liquid of accurate size.
As shown in fig. 5, the strength 71 and/or width 72 and/or frequency of the pulsating control signal output by the controller is related to the moving speed of the piston inside the syringe, and the faster the piston moves, the stronger the pulsating control signal output by the controller, or the wider the pulsating signal width, or the higher the frequency of the pulsating signal, the smaller the period 73 of the pulsating signal.
The welding material can be tin paste consisting of tin-based alloy powder and soldering flux; or tin glue consisting of tin-based alloy powder and organic resin; or silver paste composed of silver powder and organic resin; or may be a thermosetting organic resin. The solder is directly applied to the pins and/or pads of the components in the form of liquid drops, and is cooled to form solder joints or the solder directly forms fine circuits on the circuit board in the form of liquid drops. The organic resin or the hot melt adhesive can be controlled to be used for precise gluing.
The apparatus for melting a welding material, as shown in fig. 4, further includes an ejection chamber 40; the injection cavity comprises a cavity inlet 41, a pneumatic or electromagnetic control channel 44 and a spray head 43, wherein the cavity inlet 41 is connected with a needle; the welding material enters the jet cavity from the cavity inlet 41, the transducer is driven by the pulsating control signal output by the controller to output instantaneous high energy, the welding material entering the cavity is heated, metal particles in the welding flux are melted, and the molten metal is driven to be jetted out from the jet head under the control of a pneumatic or electromagnetic mode.
The molten metal is used for being sprayed to pins of electronic components and connecting the electronic components; or molten metal for spraying onto an electronic printed circuit board where it cools to form solder bumps.
The welding material is tin paste consisting of tin-based alloy powder and soldering flux, and the particle size of the tin-based alloy powder in the tin paste is less than one fifth of the inner diameter of the needle head.
In some embodiments not shown in the drawings, the means for melting the welding material further comprises a smoking device having a tip proximate to the needle. In some embodiments not shown in the drawings, the apparatus for melting a solder material further comprises a shielding gas release device proximate the needle, the shielding gas release device releasing nitrogen, an inert gas, to the solder joint, shielding the solder joint and preventing oxidation of the metal droplet output by the needle.
The soldering material is tin paste composed of tin-based alloy powder and soldering flux, wherein the soldering flux contains 0.5-5% by mass of high-volatile organic acid active agent, and the active substance is attached to the surface of molten tin after the solder is melted.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the contents of the specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An apparatus for melting a welding material, characterized in that,
comprises a needle cylinder, a piston, a needle head, a controller and an energy converter;
the needle cylinder is connected with the needle head, and welding materials are contained in the needle cylinder;
the piston can move in the syringe, and under the drive of external pressure, the piston can drive the welding material to move in the syringe and extrude and output from the needle head;
the transducer is close to or positioned at the outlet of the needle head and is in electric signal connection with the controller;
the controller outputs a control signal to drive the piston to move, the controller outputs a pulse type control signal to drive the transducer to output transient energy to heat welding materials in the needle head, and metal particles in the welding materials are melted into metal liquid and output from the outlet of the needle head.
2. The apparatus for melting welding material according to claim 1,
the controller outputs the strength of the pulse type control signal and/or the width of the pulse signal and/or the frequency of the pulse signal, and the controller is used for controlling the piston to move in the syringe.
3. The apparatus for melting welding material according to claim 1,
the welding material can be tin paste consisting of tin-based alloy powder and soldering flux; or tin glue consisting of tin-based alloy powder and organic resin; or silver paste composed of silver powder and organic resin; or may be a thermosetting organic resin.
4. The apparatus for melting welding material according to claim 1,
the injection cavity comprises a cavity inlet, a pneumatic or electromagnetic control channel and a spray head, wherein the cavity inlet is connected with the needle head; the welding material enters the jet cavity from the cavity inlet, the transducer is driven by the pulsating control signal output by the controller to output instantaneous high energy, the welding material entering the cavity is heated to melt metal particles in the welding flux, and the molten metal is driven to be jetted out from the nozzle under the control of a pneumatic or electromagnetic mode.
5. An apparatus for melting welding material according to claim 4,
the molten metal is used for being sprayed to pins of electronic components and connecting the electronic components;
or molten metal for spraying onto an electronic printed circuit board where it is cooled to form solder joints.
6. An apparatus for melting welding material according to claim 4,
the soldering material is tin paste consisting of tin-based alloy powder and soldering flux, and the particle size of the tin-based alloy powder in the tin paste is less than one fifth of the inner diameter of the needle head.
7. An apparatus for melting welding material according to claim 5,
the suction head of the smoking device is close to the needle head;
the protective gas releasing device is close to the needle head and releases nitrogen and inert gas to the welding spot.
8. A molten welding material apparatus as defined in claim 3,
the soldering material is tin paste consisting of tin-based alloy powder and soldering flux, the soldering flux contains 0.5-5% of high-volatile-point organic acid active agent by mass percent, and the active substance is attached to the surface of molten tin after the solder is melted.
9. The apparatus for melting welding material according to claim 1,
the transducer is a laser generator; or the transducer may be an electromagnetic induction heating device; or the transducer may be a resistive wire contact heat source.
10. A method of establishing an electronic connection,
an apparatus for melting a solder material according to any one of claims 1 to 9, wherein a fluid solder material is delivered to a soldering surface so that the solder material directly contacts the fluid solder material to form a metallurgical bond, and an electrical bond is established after cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011587631.XA CN112643165A (en) | 2020-12-29 | 2020-12-29 | Device for melting welding material and method for establishing electronic connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011587631.XA CN112643165A (en) | 2020-12-29 | 2020-12-29 | Device for melting welding material and method for establishing electronic connection |
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| Publication Number | Publication Date |
|---|---|
| CN112643165A true CN112643165A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011587631.XA Pending CN112643165A (en) | 2020-12-29 | 2020-12-29 | Device for melting welding material and method for establishing electronic connection |
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| CN (1) | CN112643165A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038986A (en) * | 2006-03-16 | 2007-09-19 | Tdk株式会社 | Adjoining apparatus and nozzle unit therefor |
| CN101574023A (en) * | 2006-12-04 | 2009-11-04 | 昭和电工株式会社 | Method of producing conductive circuit board |
| CN105097611A (en) * | 2014-05-22 | 2015-11-25 | 三菱电机株式会社 | Molten metal discharging device and method for discharging molten metal |
| CN105873710A (en) * | 2013-11-08 | 2016-08-17 | 株式会社达文希斯 | Induction heating head for melting and supplying metal material |
| CN107322118A (en) * | 2017-06-15 | 2017-11-07 | 北京康普锡威科技有限公司 | A kind of soldering corollary apparatus and method for welding |
| CN110814458A (en) * | 2019-11-14 | 2020-02-21 | 深圳大学 | Tin ball melting injection laser welding device and welding method |
-
2020
- 2020-12-29 CN CN202011587631.XA patent/CN112643165A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038986A (en) * | 2006-03-16 | 2007-09-19 | Tdk株式会社 | Adjoining apparatus and nozzle unit therefor |
| CN101574023A (en) * | 2006-12-04 | 2009-11-04 | 昭和电工株式会社 | Method of producing conductive circuit board |
| CN105873710A (en) * | 2013-11-08 | 2016-08-17 | 株式会社达文希斯 | Induction heating head for melting and supplying metal material |
| CN105097611A (en) * | 2014-05-22 | 2015-11-25 | 三菱电机株式会社 | Molten metal discharging device and method for discharging molten metal |
| CN107322118A (en) * | 2017-06-15 | 2017-11-07 | 北京康普锡威科技有限公司 | A kind of soldering corollary apparatus and method for welding |
| CN110814458A (en) * | 2019-11-14 | 2020-02-21 | 深圳大学 | Tin ball melting injection laser welding device and welding method |
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Application publication date: 20210413 |