CN112468617A

CN112468617A - Image sensing module, camera module and electronic equipment

Info

Publication number: CN112468617A
Application number: CN202011247092.5A
Authority: CN
Inventors: 谭耀成; 韦怡
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-03-09
Anticipated expiration: 2040-11-10
Also published as: CN112468617B

Abstract

The present application relates to an image sensing module, a camera module and an electronic device. The image sensing module includes an image sensor and an infrared filter film, the image sensor has a light incident surface and a back surface arranged opposite to each other, and the infrared filter film is arranged on the light incident surface and covers all the light incident surfaces. The above-mentioned image sensing module, since all the light-incident surfaces of the image sensor are covered with infrared filter films, the infrared filter films can be formed on the light-incident surfaces by coating or coating process. Compared with the traditional infrared filter films, the infrared filter films The film has a smaller thickness, and because there is no need to set a bracket for installing the infrared filter, when the above image sensing module is applied to the camera module, the overall thickness of the camera module can be reduced, which is beneficial to the camera module. thin design.

Description

Image sensing module, camera module and electronic equipment

Technical Field

The application relates to the technical field of camera shooting, in particular to an image sensing module, a camera module and electronic equipment.

Background

The camera module of mobile terminals such as cell-phone, panel computer generally includes infrared filter, and infrared filter can filter the infrared light of incidenting to camera module inside to promote camera module's image quality. The infrared filter is generally fixed in the camera module through the bracket, and the infrared filter and the bracket occupy space in the thickness direction of the camera module, which is not beneficial to the thin design of the camera module.

Disclosure of Invention

The embodiment of the application discloses an image sensing module in the first aspect, and the image sensing module can be applied to the camera module to do benefit to the attenuate of the whole thickness of camera module.

An image sensing module comprising:

the image sensor is provided with a light incident surface and a back surface which are arranged in a reverse manner; and

and the infrared filter film is arranged on the light incident surface and covers the whole light incident surface.

Above-mentioned image sensing module, because image sensor's whole income plain noodles covers has infrared filter coating, infrared filter coating can adopt coating or coating process to form in going into the plain noodles, and infrared filter coating compares traditional infrared filter and has a smaller thickness, and owing to need not to set up the support that is used for installing infrared filter, when above-mentioned image sensing module is applied to the camera module, the whole thickness of camera module can the attenuate to be favorable to the slim design of camera module.

In one embodiment, the infrared filter film includes at least one of an infrared cut layer and a near-infrared absorbing pigment layer.

In one embodiment, the infrared cut-off layer or the near-infrared absorbing pigment layer is spin-coated on the light incident surface.

In one embodiment, the infrared filter film includes an infrared cut layer and a near-infrared absorbing pigment layer, which are stacked, and one of the infrared cut layer and the near-infrared absorbing pigment layer is located between the other and the light incident surface.

The second aspect of the embodiment of the application discloses a camera module, is favorable to realizing the slim design of camera module.

The camera module comprises a lens and the image sensing module, wherein the lens is arranged on the side of the light incident surface, and ambient light penetrating through the lens can be directly incident to the image sensing module.

The third aspect of the embodiments of the present application discloses an electronic device, which is favorable for realizing a light and thin design.

An electronic device, comprising:

a body; and

the camera module, connect in the body, camera module includes camera lens and image sensing module, the image sensing module includes image sensor and infrared filter coating, image sensor has the income plain noodles and the back that set up mutually, infrared filter coating is located go into plain noodles and cover wholly go into the plain noodles, the camera lens is located go into plain noodles place side and be used for going into the light.

In one embodiment, the electronic device comprises a protective cover plate covering the lens, and at least one of the side of the lens facing the protective cover plate and the protective cover plate is provided with a reflection reducing layer.

In one embodiment, the electronic device includes a protective cover plate covering the lens, the infrared filter film includes one of an infrared cut-off layer and a near-infrared absorbing pigment layer and is spin-coated on the light incident surface, and the other of the infrared cut-off layer and the near-infrared absorbing pigment layer is spin-coated on the protective cover plate or the lens.

In one embodiment, at least one of a side of the lens facing the protective cover and the protective cover is provided with a antireflection layer.

In one embodiment, the infrared filter film includes an infrared cut-off layer and a near-infrared absorbing pigment layer, which are stacked, and one of the infrared cut-off layer and the near-infrared absorbing pigment layer is spin-coated on the light incident surface and is located between the other one and the light incident surface.

In one embodiment, the electronic device includes a protective cover covering the lens, the protective cover being provided with at least one of an antireflection layer, an infrared cut layer, and a near-infrared absorbing pigment layer.

In one embodiment, a side of the lens facing the protective cover is provided with at least one of the antireflection layer, the infrared cut layer, and the near-infrared absorbing pigment layer.

In one embodiment, the protective cover is provided with at least one of the infrared cut layer and the near-infrared absorbing pigment layer, and the lens is provided with at least one of the infrared cut layer and the near-infrared absorbing pigment layer.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of an electronic device according to an embodiment;

FIG. 2 is a schematic view of another perspective of an electronic device according to an embodiment;

fig. 3 is a schematic position diagram of a camera module and a protective cover plate according to an embodiment;

FIG. 4 is a graph of transmittance versus wavelength of the infrared filter of the camera module shown in FIG. 3;

FIG. 5 is a graph of reflectivity-wavelength curve of the infrared filter of the camera module shown in FIG. 3;

fig. 6 is a schematic position diagram of a camera module and a protective cover plate according to another embodiment;

fig. 7 is a schematic position diagram of a camera module and a protective cover plate according to yet another embodiment;

fig. 8 is a schematic position diagram of a camera module and a protective cover plate according to yet another embodiment;

fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Reference numerals:

10. electronic device 11, main body 111, and middle frame

113. Display screen module 115, protective cover plate 116 and antireflection layer

117. Back cover 12, camera module 121 and lens

123. Image sensing module 1231, image sensor a1, light incident surface

a2, a back surface 1233, an infrared filter 123a, and an infrared cut-off layer

123b near infrared absorbing dye layer

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "electronic device" means a device capable of receiving and/or transmitting communication signals including, but not limited to, a device connected via any one or more of the following connections:

(1) via wireline connections, such as via Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital cable, direct cable connections;

(2) via a Wireless interface means such as a cellular Network, a Wireless Local Area Network (WLAN), a digital television Network such as a DVB-H Network, a satellite Network, an AM-FM broadcast transmitter.

Electronic devices arranged to communicate over a wireless interface may be referred to as "mobile terminals". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) satellite or cellular telephones;

(2) personal Communications Systems (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data Communications capabilities;

(3) radiotelephones, pagers, internet/intranet access, Web browsers, notebooks, calendars, Personal Digital Assistants (PDAs) equipped with Global Positioning System (GPS) receivers;

(4) conventional laptop and/or palmtop receivers;

(5) conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1 and 2, in one embodiment, the electronic device 10 is a smartphone. The electronic device 10 includes a body 11 and a camera module 12, and the camera module 12 is mounted on the body 11. The body 11 may include a middle frame 111, a display module 113, a circuit board (not shown), and the like, wherein the middle frame 111 may be used to mount the display module 113 and the circuit board, and the camera module 12 is communicatively connected to the circuit board. In some embodiments, the camera module 12 may be used to perform functions of a rear camera, for example, a user may perform operations such as close-up shooting, long-range shooting, or video recording through the camera module 12. In other embodiments, the camera module 12 may be used to perform the function of a front camera, that is, a user may perform operations such as self-shooting, video call, etc. through the camera module 12. In other embodiments, the electronic device 10 may be of the tablet, notebook, or the like type.

Referring to fig. 3, the camera module 12 includes a lens 121 and an image sensing module 123, the lens 121 and the image sensing module 123 are disposed at an interval, ambient light can pass through the lens 121 and directly enter the image sensing module 123, the image sensing module 123 can convert an optical signal into an electrical signal, and an image of a photographed object can be formed after further processing. The camera module 12 may further include a housing (not shown) to which the lens 121 and the image sensing module 123 are mounted and positioned by the housing, which may be mounted to the bezel 111 or the circuit board of the electronic device 10 and which enables the camera module 12 to be communicatively coupled to the processor of the electronic device 10 for further processing of images captured by the camera module 12 by the processor.

Continuing to refer to fig. 3, the image sensor module 123 includes an image sensor 1231 and an infrared filter 1233, the image sensor 1231 has a light incident surface a1 and a back surface a2 opposite to each other, the infrared filter 1233 is disposed on the light incident surface a1 and covers all of the light incident surface a1, and the lens 121 is disposed on the light incident surface a1 side and used for entering light. Further, the infrared filter film 1233 includes at least one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123 b. The infrared cut-off layer 123a is used to cut off light in the infrared band (750 nm to 1 mm), and the near-infrared absorbing pigment layer 123b is used to absorb light in the near-infrared band (750 nm to 1100 nm) to achieve the effect of suppressing near-infrared light.

In some embodiments, the thickness of the infrared cut layer 123a may be 3 micrometers to 6 micrometers, for example, the thickness of the infrared cut layer 123a may be 4 micrometers, or 4.5 micrometers, or 5 micrometers, or 5.5 micrometers, and the like. The thickness of the near infrared absorbing pigment layer 123b may be 2 micrometers to 10 micrometers. For example, the near infrared absorbing pigment layer 123b may have a thickness of 3 microns, or 5 microns, or 8 microns, etc. Further, the infrared cut-off layer 123a or the near-infrared absorption pigment layer 123b may be coated on the light incident surface a1 by a spin coating process, so that the thickness of the infrared cut-off layer 123a or the thickness of the near-infrared absorption pigment layer 123b is uniformly distributed, the consistency of the optical performance of the edge region and the central region of the infrared filter film 1233 is ensured, a good angle consistency is obtained while a normal imaging effect is ensured, the edge color difference of the imaging region is extremely small, and further, color cast between the central region and the edge region is prevented, so that the imaging quality of the image sensor 1231 is improved.

In the embodiment shown in fig. 3, the infrared filter 1233 includes an infrared cut layer 123a and a near-infrared absorbing pigment layer 123b that are stacked, and one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b is located between the other and the light incident surface a 1. For example, the infrared cut-off layer 123a may be spin-coated on the entire light incident surface a1 of the image sensor 1231, and the near-infrared absorbing pigment layer 123b may be coated on the side of the infrared cut-off layer 123a opposite to the light incident surface a 1. For example, the near-infrared absorbing pigment layer 123b may be spin-coated on the entire light incident surface a1 of the image sensor 1231, and the infrared cut-off layer 123a may be coated on the side of the near-infrared absorbing pigment layer 123b opposite to the light incident surface a 1. Of course, in other embodiments, one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b may be provided on the light incident surface a1 of the image sensor 1231, and the other of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b may be absent.

Referring to fig. 4 and 5 in conjunction with fig. 3, taking an example that the infrared filter 1233 includes the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b stacked, the transmittance spectrum of the infrared filter 1233 is shown in fig. 4, and the reflectance spectrum of the infrared filter 1233 is shown in fig. 5. Where the position of the angle of incidence gamma is shown in figure 3.

As can be seen from fig. 4, the comprehensive transmittance of the infrared filter 1233 achieves the infrared cut-off filtering effect, and for the light rays with the wavelength range of 430 nm to 640 nm in the human eye sensitive band, the average transmittance of the disclosed infrared filter 1233 for the visible light with the wavelength range of 435 nm to 565 nm reaches 90%, and the maximum transmittance thereof reaches more than 93.6%, so that the high transmittance of the visible light is achieved; the average transmittance of the infrared ray in the wavelength range of 700-1100 nm is less than 0.2%, and the maximum transmittance is less than 5%, so that the infrared ray is efficiently cut off; the average transmittance variation amount of the light source is less than 2% for the incident angle of 0-40 degrees, and the angle consistency is good, so that the normal imaging effect can be ensured, and the effect of no chromatic aberration at the edge can be realized.

As can be seen from fig. 5, the average reflectance of visible light in the wavelength range of 400 nm to 700 nm is less than 2% and the highest reflectance is less than 6% within the incident angle range of 0 to 40 °; this shows that even in the case where light is incident at a large angle, a lower reflectance can be achieved, and thus an effect of reducing glare or ghost can be achieved.

In the image sensor module 123, since all the light incident surfaces a1 of the image sensor 1231 are covered with the infrared filter film 1233, the infrared filter film 1233 may include at least one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b, and the infrared filter film 1233 may be formed on the light incident surface a1 by a coating or filming process, which is simple in processing process, and can obtain high processing efficiency, so as to obtain the infrared filter film 1233 with relatively small thickness. On one hand, compared with the scheme of coating the surface of the blue glass or resin substrate with the thickness of 0.21 mm or 0.11 mm in the traditional infrared filter, the infrared filter 1233 has smaller thickness; on the other hand, since the infrared filter film 1233 is formed on the light incident surface a1 of the image sensor 1231, the camera module 12 does not need to be provided with a bracket for installing a conventional infrared filter, and does not need to reserve a gap between the lens 121 and the bracket, and between the bracket and the image sensor 1231, so that the overall thickness of the camera module 12 can be effectively reduced, thereby being beneficial to the thin design of the camera module 12. When camera module 12 is applied to electronic equipment 10 such as smart phone, the scheme of this disclosure can reduce the height that camera module 12 protrudes in electronic equipment 10 casing to be favorable to electronic equipment 10's frivolous design, with the outward appearance characteristic that promotes electronic equipment 10.

In addition, in the related art, when the infrared filter is disposed on the bracket or the infrared filter is bonded to the image sensor 1231 through the optical adhesive, a gap exists between the infrared filter and the image sensor 1231, and the gap distance is short. The surface of the infrared filter may generate a strong reflection effect on light, and particularly for light incident at a large angle, for example, light incident at 45 °, strong reflected light may appear in a visible light band, and the strong reflected light is overlapped with the reflected light on the surface of the image sensor 1231, which may cause a problem of significant glare or ghost, and affect the imaging quality of the camera module 12. Especially, when a user takes a picture in the backlight, because the incident light is stronger, the phenomena of glare or ghost are more obvious. According to the scheme of the disclosure, the infrared filter film 1233 is arranged on the surface of the image sensor 1231, the infrared filter film 1233 can comprise at least one of the infrared cut-off layer 123a and the near-infrared absorption pigment layer 123b, and the glare or ghost problem caused by the conventional infrared filter can be effectively reduced while the height of the camera module 12 is reduced, so that the shooting quality of the camera module 12 is improved.

With continued reference to fig. 2 and 3, the electronic device 10 may include a protective cover 115 covering the lens 121, at least one of a side of the lens 121 facing the protective cover 115 and the protective cover 115 being provided with a antireflection layer 116. The material of the protective cover plate 115 may be white glass, sapphire, or plastic, and the protective cover plate 115 is used for protecting the lens 121 of the camera module 12. The electronic device 10 may include a rear cover 117 mounted on the middle frame 111, wherein the rear cover 117 and the display module 113 are disposed on opposite sides of the middle frame 111 to form a mounting space, and the mounting space may be used to mount a battery, a circuit board, the camera module 12, and the like of the electronic device 10. In some embodiments, the rear cover 117 is formed with a through hole for transmitting light, and the camera module 12 and the protective cover 115 are disposed corresponding to the through hole. In other embodiments, the protective cover 115 is part of the rear cover 117. For example, in the embodiment where the rear cover 117 is made of glass, a partial area of the inner surface of the rear cover 117 may not be covered with the decoration layer, and the portion of the rear cover 117 not covered with the decoration layer may be disposed corresponding to the camera module 12, so that the ambient light can penetrate through the rear cover 117 and enter the camera module 12.

The thickness of the antireflection layer 116 may be 0.1 to 0.2 microns, for example, the thickness of the antireflection layer 116 may be 0.13 mm, or 0.15 mm, or 0.18 mm, etc. In some embodiments, the antireflection layer 116 may be formed on at least one of the inner surface and the outer surface of the protective cover sheet 115 using a spin coating process. For example, the anti-reflection layer 116 may be spin-coated on the inner surface of the protective cover 115, may be spin-coated on the outer surface of the protective cover 115, or may be spin-coated on both the inner and outer surfaces of the protective cover 115. The anti-reflection layer 116 can weaken the reflection of incident light by using the coherent principle of light, thereby improving the imaging quality of the camera module 12. In some embodiments, the anti-reflection layer 116 may also be used to cut off ultraviolet light, for example, the anti-reflection layer 116 may include a material having ultraviolet light absorption to absorb ultraviolet light in a wavelength band of 350 nm to 380 nm, which has relatively high transmittance in the ultraviolet light wavelength band. Of course, in some embodiments, a material for cutting off ultraviolet light may be added to the near-infrared absorbing dye layer 123b to absorb ultraviolet light in a wavelength band of 350 nm to 380 nm, in which transmittance is relatively high in the ultraviolet light wavelength band. In other embodiments, the anti-reflective layer 116 may be coated on the surface of the lens 121. For example, in an embodiment where the lens 121 includes a plurality of lenses, the antireflection layer 116 may be applied to the surface of the lens 121 closest to the protective cover 115 to reduce the reflection of incident light and improve the imaging quality of the camera module 12.

Further, referring to fig. 6, 7 and 8, in other embodiments, the infrared filter 1233 includes one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b and is spin-coated on the light incident surface a1, and the other of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b is spin-coated on the protective cover 115 or the lens 121. In other words, in this embodiment, one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b may be spin-coated on the image sensor 1231, so that the image sensor 1231 has a smaller thickness, and the other of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b may be spin-coated on the lens 121 or the protective cover 115. For example, the light incident surface a1 of the image sensor 1231 may be spin-coated with the infrared cut-off layer 123a, and the near-infrared absorbing pigment layer 123b may be spin-coated on the surface of the lens 121 or the surface of the protective cover 115. Specifically, when the near-infrared absorbing pigment layer 123b is spin-coated on the lens 121, it may be spin-coated on the lens closest to the protective cover 115, on the surface of the lens closest to the image sensor 1231, or on the surface of one or more lenses inside the lens 121. When the near-infrared absorbing pigment layer 123b is spin-coated on the protective cover 115, the near-infrared absorbing pigment layer 123b may be spin-coated on a surface (i.e., an inner surface) of the protective cover 115 facing the lens 121, or may be spin-coated on a surface (i.e., an outer surface) of the protective cover 115 facing away from the lens 121, or both inner and outer surfaces of the protective cover 115 may be spin-coated with the near-infrared absorbing pigment layer 123 b.

For example, the light incident surface a1 of the image sensor 1231 may be spin-coated with the near-infrared absorbing pigment layer 123b, and the infrared cut-off layer 123a may be spin-coated on the surface of the lens 121 or the surface of the protective cover 115. Specifically, when the infrared cut-off layer 123a is spin-coated on the lens 121, it may be spin-coated on the lens closest to the protective cover 115, on the surface of the lens closest to the image sensor 1231, or on the surface of one or more lenses inside the lens 121. When the ir-cut layer 123a is spin-coated on the protective cover 115, it may be spin-coated on the surface (i.e. inner surface) of the protective cover 115 facing the lens 121, or spin-coated on the surface (i.e. outer surface) of the protective cover 115 facing away from the lens 121, or spin-coated on both inner and outer surfaces of the protective cover 115.

In other embodiments, the protective cover 115 may be provided with at least one of the antireflection layer 116, the infrared cut layer 123a, and the near-infrared absorbing pigment layer 123 b. In other words, in this embodiment, the protective cover 115 is not limited to providing one of the antireflection layer 116, the infrared cut layer 123a, and the near-infrared absorbing pigment layer 123 b. For example, any one of the antireflection layer 116, the infrared cut layer 123a, and the near-infrared absorbing dye layer 123b may be provided on the surface of the protective cover 115, any two of the antireflection layer 116, the infrared cut layer 123a, and the near-infrared absorbing dye layer 123b may be provided, or the antireflection layer 116, the infrared cut layer 123a, and the near-infrared absorbing dye layer 123b may be provided on the protective cover 115. In this embodiment, any one of the reflection reducing layer 116, the infrared cut layer 123a, and the near-infrared absorbing pigment layer 123b may be provided on the outer surface side or the inner surface side, and when any two of the reflection reducing layer 116, the infrared cut layer 123a, and the near-infrared absorbing pigment layer 123b are stacked, the stacking order thereof is not limited.

In the above embodiment, the lens 121 or the image sensor 1231 may not need to be repeatedly disposed on the film layer already provided on the protective cover 115, so that the overall thickness of the image sensor 1231 may be reduced, and the thin design of the camera module 12 is facilitated, so that the thickness of the electronic device 10 may be thinner. For example, when the protective cover 115 is provided with the infrared cut-off layer 123a, the image sensor 1231 or the lens 121 may not need to be provided with the infrared cut-off layer 123a, and the infrared filter 1233 of the image sensing module 123 may include the near-infrared absorbing pigment layer 123 b. For another example, when the protective cover 115 is provided with the near-infrared absorbing pigment layer 123b, the image sensor 1231 or the lens 121 does not need to be provided with the near-infrared absorbing pigment layer 123b, and the infrared filter 1233 of the image sensing module 123 may include the infrared cut-off layer 123 a. For another example, when the protective cover 115 is provided with the antireflection layer 116, the lens 121 does not need to be provided with the antireflection layer 116.

Of course, it is understood that, in the case of the infrared cut-off layer 123a (or the near-infrared absorbing pigment layer 123b) already provided on the protective cover 115, the light incident surface a1 of the image sensor 1231 or the lens 121 may still be provided with the infrared cut-off layer 123a (or the near-infrared absorbing pigment layer 123b) repeatedly, so as to further improve the imaging quality of the camera module 12. For example, the protective cover 115 may be provided with at least one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b, the lens 121 may be provided with at least one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123b, and the infrared filter 1233 may include at least one of the infrared cut layer 123a and the near-infrared absorbing pigment layer 123 b. In this embodiment, the antireflection layer 117 may be provided on the side of the lens 121 facing the protective cover 115 or on the protective cover 115.

Referring to fig. 9, fig. 9 is a schematic structural diagram of an electronic device 10 according to an embodiment of the present disclosure. The electronic device 10 may include Radio Frequency (RF) circuitry 501, memory 502 including one or more computer-readable storage media, input unit 503, display unit 504, sensor 505, audio circuitry 506, Wireless Fidelity (WiFi) module 507, processor 508 including one or more processing cores, and power supply 509 (or a battery). Those skilled in the art will appreciate that the configuration of the electronic device 10 shown in FIG. 9 does not constitute a limitation of the electronic device 10, and may include more or fewer components than shown, or some components in combination, or a different arrangement of components.

The rf circuit 501 may be used for receiving and transmitting information, or receiving and transmitting signals during a call, and in particular, receives downlink information of a base station and then sends the received downlink information to one or more processors 508 for processing; in addition, data relating to uplink is transmitted to the base station. In general, radio frequency circuit 501 includes, but is not limited to, an antenna, at least one Amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a Low Noise Amplifier (LNA), a duplexer, and the like. In addition, the radio frequency circuit 501 may also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to Global System for Mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.

The memory 502 may be used to store applications and data. Memory 502 stores applications containing executable code. The application programs may constitute various functional modules. The processor 508 executes various functional applications and data processing by executing application programs stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the stored data area may store data (such as audio data, a phonebook, etc.) created according to the use of the electronic device 10, and the like. Further, the memory 502 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 502 may also include a memory controller to provide the processor 508 and the input unit 503 access to the memory 502.

The input unit 503 may be used to receive input numbers, character information, or user characteristic information (such as a fingerprint), and generate a keyboard, mouse, joystick, optical, or trackball signal input related to user setting and function control. In particular, in one particular embodiment, the input unit 503 may include a touch-sensitive surface as well as other input devices. The touch-sensitive surface, also referred to as a touch display screen or a touch pad, may collect touch operations by a user (e.g., operations by a user on or near the touch-sensitive surface using a finger, a stylus, or any other suitable object or attachment) thereon or nearby, and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface may comprise two parts, a touch detection means and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 508, and can receive and execute commands sent by the processor 508.

The display unit 504 may be used to display information input by or provided to the user as well as various graphical user interfaces of the electronic device 10, which may be made up of graphics, text, icons, video, and any combination thereof. The display unit 504 may include a display panel. Alternatively, the Display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch-sensitive surface may overlay the display panel, and when a touch operation is detected on or near the touch-sensitive surface, the touch operation is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in FIG. 9 the touch sensitive surface and the display panel are two separate components to implement input and output functions, in some embodiments the touch sensitive surface may be integrated with the display panel to implement input and output functions.

The electronic device 10 may also include at least one sensor 505, such as light sensors, motion sensors, and other sensors. Specifically, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel based on the intensity of ambient light, and a proximity sensor that turns off the display panel and/or backlight when the electronic device 10 is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which may be further configured to the electronic device 10, detailed descriptions thereof are omitted.

The audio circuitry 506 may provide an audio interface between the user and the electronic device 10 through a speaker, microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit the electrical signal to a speaker, and convert the electrical signal into a sound signal to output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, which is then processed by the audio data output processor 508 and then sent to, for example, another electronic device 10 via the rf circuit 501, or output to the memory 502 for further processing. The audio circuitry 506 may also include an earphone jack to provide communication of a peripheral earphone with the electronic device 10.

Wireless fidelity (WiFi) belongs to short-range wireless transmission technology, and the electronic device 10 can help the user send and receive e-mail, browse web pages, access streaming media and the like through the wireless fidelity module 507, and provides wireless broadband internet access for the user. Although fig. 9 shows the wireless fidelity module 507, it is understood that it does not belong to the essential constitution of the electronic device 10, and may be omitted entirely as needed within the scope not changing the essence of the invention.

The processor 508 is a control center of the electronic device 10, connects various parts of the whole electronic device 10 by various interfaces and lines, performs various functions of the electronic device 10 and processes data by running or executing an application program stored in the memory 502 and calling up the data stored in the memory 502, thereby performing overall monitoring of the electronic device 10. Optionally, processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor, which primarily handles operating systems, user interfaces, application programs, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 508.

The electronic device 10 also includes a power supply 509 to power the various components. Preferably, the power supply 509 may be logically connected to the processor 508 through a power management system, so that the power management system may manage charging, discharging, and power consumption. The power supply 509 may also include any component such as one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.

Although not shown in fig. 9, the electronic device 10 may further include a bluetooth module or the like, which is not described in detail herein. In specific implementation, the above modules may be implemented as independent entities, or may be combined arbitrarily to be implemented as the same or several entities, and specific implementation of the above modules may refer to the foregoing method embodiments, which are not described herein again.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An image sensing module, comprising:

2. The image sensing module of claim 1, wherein the infrared filter film comprises at least one of an infrared cut layer and a near-infrared absorbing pigment layer.

3. The image sensing module of claim 2, wherein the infrared cut-off layer or the near-infrared absorbing pigment layer is spin-coated on the light incident surface.

4. The image sensing module of claim 1, wherein the infrared filter film comprises an infrared cut-off layer and a near-infrared absorbing pigment layer, which are stacked, and one of the infrared cut-off layer and the near-infrared absorbing pigment layer is located between the other one and the light incident surface.

5. A camera module, characterized by comprising a lens and the image sensing module of any one of claims 1-4, wherein the lens is arranged at the side of the light incident surface, and ambient light passing through the lens can be directly incident to the image sensing module.

6. An electronic device, comprising:

a body; and

7. The electronic device according to claim 6, wherein the infrared filter film includes at least one of an infrared cut layer and a near-infrared absorbing pigment layer.

8. The electronic device according to claim 7, wherein the electronic device comprises a protective cover plate covering the lens, and at least one of a side of the lens facing the protective cover plate and the protective cover plate is provided with a antireflection layer.

9. The electronic device of claim 6, wherein the electronic device comprises a protective cover covering the lens, the infrared filter comprises one of an infrared cut-off layer and a near-infrared absorbing pigment layer and is spin-coated on the light incident surface, and the other of the infrared cut-off layer and the near-infrared absorbing pigment layer is spin-coated on the protective cover or the lens.

10. The electronic device according to claim 9, wherein at least one of a side of the lens facing the protective cover and the protective cover is provided with a antireflection layer.

11. The electronic device of claim 6, wherein the infrared filter film comprises an infrared cut-off layer and a near-infrared absorbing pigment layer stacked, and one of the infrared cut-off layer and the near-infrared absorbing pigment layer is spin-coated on the light incident surface and located between the other and the light incident surface.

12. The electronic device according to claim 6, comprising a protective cover plate covering the lens, the protective cover plate being provided with at least one of an antireflection layer, an infrared cut layer, and a near-infrared absorbing pigment layer.

13. The electronic device according to claim 12, wherein a side of the lens facing the protective cover is provided with at least one of the antireflection layer, the infrared cut layer, and the near-infrared absorbing pigment layer.

14. The electronic device according to claim 12, wherein the protective cover is provided with at least one of the infrared cut layer and the near-infrared absorbing pigment layer, and the lens is provided with at least one of the infrared cut layer and the near-infrared absorbing pigment layer.