CN112225458B - A kind of high temperature resistant and low expansion coefficient bonding slurry for ceramic matrix composite materials and preparation method thereof - Google Patents

Abstract

The invention relates to a high-temperature-resistant and low-expansion-coefficient bonding slurry for ceramic matrix composite materials and a preparation method thereof. The adhesive paste comprises 55%-85% by weight of glass-ceramic powder and 15-45% of organic adhesive phase; the glass-ceramic powder is SiO ₂ -Al ₂ O ₃ -B ₂ O ₃ ‑MgO‑BaO‑ZnO‑ZrO ₂ -series glass-ceramic powder and β‑eucryptite glass-ceramic powder mixed powder; the organic binder phase includes an organic solvent, a dispersant and a thickener. The invention realizes the adjustment of the thermal expansion coefficient, dielectric constant, dielectric loss, glass transition temperature, softening temperature, crystallization temperature, etc. of the glass-ceramic powder by adjusting the type and content of each oxide in the glass-ceramic powder Finally, the thermal expansion coefficient of the adhesive paste can be equal to the thermal expansion coefficient of the ceramic substrate, which can meet the requirements of wave transmission in a specific frequency band; the ceramic material samples connected by the adhesive paste have good bonding performance.

Description

A kind of high temperature resistant and low expansion coefficient bonding paste for ceramic matrix composites and its preparation method

technical field

The invention relates to the technical field of adhesives, in particular to a high-temperature bonding slurry of a wave-transmitting ceramic matrix composite material and a preparation method thereof.

Background technique

In recent years, ceramic-based frequency selective surface (FSS) radomes have become more and more widely used in stealth. The FSS structure needs to withstand the high-temperature airflow during flight and can work for a long time in harsh aerodynamic environments. To ensure the reliability of the FSS structure, it is a feasible solution to place the FSS structure inside the ceramic substrate. At this time, the combined connection of the outer wave-transmitting protective layer and the FSS-containing structural layer has become the focus of research.

The composition of the ceramic radome is a fiber-reinforced ceramic matrix composite material, which has poor processability and a loose structure, making it difficult to manufacture large or complex-shaped components. Currently, the commonly used connection methods are welding, mechanical connection and bonding. Brazing connection is a widely used connection method between ceramic matrix composite materials, but they have high process temperature, high equipment cost, and heavy damage to the substrate. Mechanical connections are connections where materials are joined with mechanical fasteners such as pins, screws, rivets, and bolts. At present, there are many metal fasteners, but the matching with ceramics is poor, and the engineering application of high-temperature and high-strength ceramics and their composite joints is immature. Seriously affect the mechanical properties of the connector and the reliability of the product. The adhesives used for bonding and connection are mainly divided into organic adhesives, inorganic adhesives and organic-inorganic hybrid adhesives. Therefore, it is necessary to develop an inorganic adhesive with high temperature resistance, good wave permeability and good matching with the substrate. CN 110511682 A invented a kind of aluminum phosphate adhesive with high versatility and high temperature resistance and its preparation method. performance requirements.

Since glass has adhesive properties, and its properties can be changed by adjusting the chemical composition, glass powder can be used as the functional phase for inorganic adhesives, and glass paste is made by adding organic solvents, thickeners and dispersants for bonding. However, the commonly used glass powder has a high thermal expansion coefficient, which is much higher than that of quartz ceramics (0.47-0.58×10 ^-6 /℃). The mismatch of thermal expansion coefficient causes great thermal stress between the FSS layer and the wave-transmitting protective layer. Therefore, on the basis of ensuring the matching between the FSS layer and the substrate, the FSS layer and the wave-transmitting protective layer also need to be well matched. Only in this way can the reliability of the whole component be improved.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and to provide a high temperature resistant and low expansion coefficient bonding slurry for ceramic matrix composite materials and a preparation method thereof, so as to lay a good foundation for the combined connection of ceramic matrix wave transparent composite materials. research work.

The technical scheme of the present invention is:

In the first aspect, the present invention provides a high-temperature-resistant and low-expansion-coefficient bonding slurry for ceramic matrix composite materials, comprising 55% to 85% by weight of glass-ceramic powder and 15% to 45% of an organic bonding phase; The glass-ceramic powder is a mixed powder of SiO ₂ -Al ₂ O ₃ -B ₂ O ₃ -MgO-BaO-ZnO-ZrO ₂ series glass-ceramic powder and β-eucryptite glass-ceramic powder; the The organic binder phase includes organic solvents, dispersants and thickeners.

Further, the glass-ceramic powder is a mixed powder of SiO ₂ -Al ₂ O ₃ -B ₂ O ₃ -MgO-BaO-ZnO-ZrO ₂ series glass-ceramic powder and β-eucryptite glass-ceramic powder , which includes 55-72% of SiO ₂ , 6-20% of Al ₂ O ₃ , 2-13% of B ₂ O ₃ , 1-8% of MgO, 0-3% BaO, 0-3% ZnO, 0-2% CaO, 0-2% ZrO ₂ , 0-3% rare earth oxide and 3-15% β-eucryptite glass-ceramic powder;

Further, the organic adhesive phase includes 70-85% of organic solvent, 2-15% of dispersant, and 2-15% of thickener by weight percentage (the proportion of the total weight of the organic adhesive phase).

Further, the thermal expansion coefficient of the glass-ceramic powder is 0.5×10 ^-6 /°C to 1.6×10 ^-6 /°C.

Further, the organic solvent is at least one of terpineol, butyl carbitol, butyl carbitol acetate and diethylene glycol ethyl ether.

Further, the dispersant is at least one of triamine citric acid, polyamine methacrylate, and 1,4-dihydroxysulfonic acid amine.

Further, the thickener is a polymer thickener, and the polymer thickener is ethyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, nitrocellulose, tributyl citrate at least one of them.

Further, the rare earth oxide is one or more of La ₂ O ₃ , Gd ₂ O ₃ , Y ₂ O ₃ , Er ₂ O ₃ , CeO ₂ , and Nd ₂ O ₃ .

Further, the viscosity range of the high temperature resistant adhesive paste for ceramic matrix composites is 50 Pa·S to 120 Pa·S, and the fineness is less than 12 μm.

In a second aspect, the present invention also provides a method for preparing the above-mentioned high-temperature-resistant and low-expansion-coefficient bonding slurry for the ceramic matrix composite material, comprising the following steps:

Step 1, prepare the basic glass powder: prepare the ingredients according to the weight percentage stated in the above formula, mix the ingredients in a mixer for 2-24 hours, after the ingredients are mixed evenly, put them into a corundum crucible, and put them in a resistance furnace at 1500 ℃～ 1 to 4 hours at a constant temperature of 1700 °C to obtain a clear glass liquid, then the glass liquid is quenched in deionized water and taken out, put into a blast drying oven, and dried at 80-120 °C for 2-6 hours to obtain glass slag. Ball milling in a planetary ball mill for 4-8 hours, passing through a 400-500 mesh sieve to obtain basic glass powder, and controlling the average particle size of the powder to be less than 3 μm;

Step 2, prepare glass-ceramic powder: add β-eucryptite to the glass powder obtained in step 1, ball mill for 2-5 hours, sieve with a 300-400 mesh sieve after drying, and then carry out melting, water quenching and baking. Dry to obtain the glass-ceramic powder, and control the average particle size of the powder to be 1.0um～2.5um;

Step 3, preparing the organic bonding phase: after accurately weighing the organic solvent, thickening agent and dispersing agent, put it into a round-bottomed flask, and stir and dissolve at a constant temperature of 80-85 ° C for 1-3 hours to obtain a clear and transparent fluid;

Step 4, prepare the adhesive slurry: stir and disperse the glass-ceramic powder and the organic adhesive phase in a container, and then place it in a three-roll mill for repeated grinding, control the fineness below 12um, and the viscosity range from 50Pa·S～ 120Pa·S to obtain the adhesive paste.

Further, in step 1, the average particle size of the powder is controlled at 1.0 μm to 2.5 μm; in step 2, the melting temperature is 1250-1400° C., and the temperature is kept for 0.5-2 h.

Compared with the prior art, the beneficial technical effects of the present invention are:

(1) The present invention provides a high temperature-resistant adhesive for ceramic matrix composite materials and a preparation method thereof. As an adhesive between wave-transmitting ceramic materials, by adjusting the types and contents of each oxide in the glass-ceramic powder Adjust to realize the adjustment of the thermal expansion coefficient, dielectric constant, dielectric loss, glass transition temperature, softening temperature, crystallization temperature, etc. of the glass-ceramic powder, and finally make the thermal expansion coefficient of the bonding paste and the thermal expansion of the ceramic substrate. The coefficients are equivalent, the dielectric constant at 9GHz is 4.5-6.0, and the dielectric loss tangent is 3×10 ^-3 -5×10 ^-3 , which can meet the requirements of wave transmission in specific frequency bands;

(2) The content of SiO ₂ and Al ₂ O ₃ in the composition of glass powder is high, and the melting temperature and high temperature viscosity are high. After adding rare earth element oxides, the radius of rare earth ions is large and the coordination number is high High, when the introduction amount is small, it can destroy the network structure, reduce the degree of network connectivity, reduce the viscosity, and improve the adhesion of the slurry after sintering.

(3) The ceramic material samples connected by the bonding slurry have a tensile shear strength at room temperature of not less than 7.0 MPa and a compressive shear strength of not less than 10.0 MPa, with good bonding properties, and there is no interface layer due to Defects such as spalling, warpage and cracks that exist due to the mismatch between them.

Detailed ways

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described in detail below through specific embodiments.

Example 1

The above-mentioned high-temperature-resistant and low-expansion-coefficient bonding slurry for ceramic matrix composite materials and a preparation method thereof include the following steps:

1. Preparation of basic glass powder: weighing 65% SiO ₂ , 14% Al ₂ O ₃ , 7% B ₂ O ₃ , 6% MgO, 2% BaO, 2% CaO, 2% % ZnO and 2% ZrO ₂ were mixed uniformly in a mixer for 12 hours; then kept in a high temperature resistance furnace at 1600 °C for 1.5 hours to obtain a clear glass liquid; then the glass liquid was quenched in deionized water, taken out, and placed in a Put the glass slag into a blast drying oven, and dry it at 100°C for 4 hours to obtain glass slag; place the glass slag in a planetary ball mill for 8 hours, pass through a 500-mesh sieve, and obtain a basic glass powder with a particle size of 1.0 μm to 2.5 μm;

2. Preparation of glass-ceramic powder: add 5% β-eucryptite to the basic glass powder, ball mill for 2 hours, sieve with a 400-mesh sieve after drying, and keep the sieved raw materials in a 1300 ℃ resistance furnace for 1 hour , after being clarified, water quenching, ball milling and drying are carried out to obtain the glass-ceramic powder;

Specifically, after testing, the softening point of the glass-ceramic powder is 720°C, and the thermal expansion coefficient is 1.2×10 ^-6 /°C.

3. Preparation of organic bonding phase: After accurately weighing the organic solvent, polymer thickener and dispersant, put it into a round-bottomed flask, stir and dissolve at a constant temperature of 80-85 °C for 1-3 hours, and obtain a clear and transparent fluid ;

Specifically, the organic solvent includes 55% by weight terpineol and 35% butyl carbitol; the polymer thickener includes 8% by weight ethyl cellulose; the dispersant includes 2% by weight polyamine methacrylate;

4. Preparation of bonding paste: Stir and disperse 67% by weight glass-ceramic powder and 33% organic bonding phase in a container, and then place it in a three-roll mill for repeated grinding to obtain bonding paste material.

The quartz fiber reinforced silica-based composite materials were bonded according to the size specified by the standard using the above bonding slurry. The bonded samples were dried at 120°C for 0.5h, and then heat-treated at 950°C for 0.5h. Then, the tensile shear strength and bending shear strength were tested, and the test results were as follows: the tensile shear strength was 7.5 MPa, and the compressive shear strength was 11.2 MPa.

Example 2

1. Preparation of basic glass powder: weighing 70% SiO ₂ , 13% Al ₂ O ₃ , 5% B ₂ O ₃ , 3% MgO, 2% BaO, 0% CaO, 2% % ZnO, 2% ZrO ₂ and 3% La ₂ O ₃ were mixed uniformly in a mixer for 20 hours; then kept in a high temperature resistance furnace at 1600°C for 2 hours to obtain a clear glass liquid; then the glass liquid was deionized After quenching in water, take it out, put it in a blast drying oven, and dry it at 100 °C for 4 hours to obtain glass slag; put the glass slag in a planetary ball mill for 8 hours, pass through a 500-mesh sieve, and obtain a particle size of 1.0 μm ~ 2.5 μm the base glass powder;

2. Preparation of glass-ceramic powder: add 5% β-eucryptite to the basic glass powder, ball mill for 2 hours, sieve with a 400-mesh sieve after drying, and keep the sieved raw materials in a 1300 ℃ resistance furnace for 1 hour , after being clarified, water quenching, ball milling and drying are carried out to obtain the glass-ceramic powder;

Specifically, after testing, the softening point of the glass-ceramic powder is 705°C, and the thermal expansion coefficient is 1.55×10 ^-6 /°C.

3. Preparation of organic bonding phase: After accurately weighing the organic solvent, polymer thickener and dispersant, put it into a round-bottomed flask, stir and dissolve at a constant temperature of 80-85 °C for 1-3 hours, and obtain a clear and transparent fluid ;

Specifically, the organic solvent includes 55% by weight terpineol and 35% butyl carbitol; the polymer thickener includes 8% by weight ethyl cellulose; the dispersant includes 2% by weight polyamine methacrylate;

4. Preparation of bonding paste: 67% by weight of glass-ceramic powder and 33% of organic bonding phase are stirred and dispersed in a container, and then placed in a three-roll mill for repeated grinding to obtain inorganic bonding slurry.

The quartz fiber reinforced silica-based composite materials were bonded according to the size specified by the standard using the above bonding slurry. The bonded samples were dried at 120°C for 0.5h, and then heat-treated at 950°C for 0.5h. Then, the tensile shear strength and bending shear strength were tested, and the test results were as follows: the tensile shear strength was 7.2 MPa, and the compressive shear strength was 10.8 MPa.

Example 3

1. Preparation of basic glass powder: weighing 70% SiO ₂ , 13% Al ₂ O ₃ , 5% B ₂ O ₃ , 3% MgO, 2% BaO, 0% CaO, 2% % ZnO, 2% ZrO ₂ and 3% CeO ₂ were mixed uniformly in a mixer for 20 hours; then kept in a high temperature resistance furnace at 1600 °C for 2 hours to obtain a clear glass liquid; then the glass liquid was mixed in deionized water After quenching, take it out, put it in a blast drying box, and dry it at 100 °C for 4 hours to obtain glass slag; put the glass slag in a planetary ball mill for 8 hours, pass through a 500-mesh sieve, and obtain a foundation with a particle size of 1.0 μm to 2.5 μm. glass powder;

2. Preparation of glass-ceramic powder: add 10% β-eucryptite to the basic glass powder, ball mill for 2 hours, sieve with a 400-mesh sieve after drying, and keep the sieved raw materials in a 1300 ℃ resistance furnace for 1 hour , after being clarified, water quenching, ball milling and drying are carried out to obtain the glass-ceramic powder;

Specifically, after testing, the softening point of the glass-ceramic powder is 740°C, and the thermal expansion coefficient is 0.96×10 ^-6 /°C.

3. Preparation of organic bonding phase: After accurately weighing the organic solvent, polymer thickener and dispersant, put it into a round-bottomed flask, stir and dissolve at a constant temperature of 80-85 °C for 1-3 hours, and obtain a clear and transparent fluid ;

Specifically, the organic solvent includes 55% by weight terpineol and 35% butyl carbitol; the polymer thickener includes 8% by weight ethyl cellulose; the dispersant includes 2% by weight polyamine methacrylate;

4. Preparation of bonding paste: 67% by weight of glass-ceramic powder and 33% of organic bonding phase are stirred and dispersed in a container, and then placed in a three-roll mill for repeated grinding to obtain inorganic bonding slurry.

The quartz fiber reinforced silica-based composite materials were bonded according to the size specified by the standard using the above bonding slurry. The bonded samples were dried at 120°C for 0.5h, and then heat-treated at 950°C for 0.5h. Then, the tensile shear strength and bending shear strength were tested, and the test results were as follows: the tensile shear strength was 8.3 MPa, and the compressive shear strength was 12.4 MPa.

Example 4

1. Preparation of basic glass powder: weighing 72% SiO ₂ , 12% Al ₂ O ₃ , 6% B ₂ O ₃ , 4% MgO, 2% BaO, 2% CaO, 2% % ZnO was mixed uniformly in a mixer for 12 hours; then kept in a high temperature resistance furnace at a constant temperature of 1600 ° C for 1.5 hours to obtain a clear glass liquid; then the glass liquid was quenched in deionized water, taken out, and placed in a blast drying oven , and dried at 100°C for 4 hours to obtain glass slag; the glass slag was ball-milled in a planetary ball mill for 8 hours and passed through a 500-mesh sieve to obtain a basic glass powder with a particle size of 1.0 μm to 2.5 μm;

2. Preparation of glass-ceramic powder: Add 15% β-eucryptite to the base glass powder, ball mill for 2 hours, sieve with a 400-mesh sieve after drying, and keep the sieved raw materials in a 1300 ℃ resistance furnace for 1 hour , after being clarified, water quenching, ball milling and drying are carried out to obtain the glass-ceramic powder;

Specifically, after testing, the softening point of the glass-ceramic powder is 790°C, and the thermal expansion coefficient is 0.5×10 ^-6 /°C.

3. Preparation of organic bonding phase: After accurately weighing the organic solvent, polymer thickener and dispersant, put it into a round-bottomed flask, stir and dissolve at a constant temperature of 80-85 °C for 1-3 hours, and obtain a clear and transparent fluid ;

Specifically, the organic solvent includes 55% by weight terpineol and 35% butyl carbitol; the polymer thickener includes 8% by weight ethyl cellulose; the dispersant includes 2% by weight polyamine methacrylate;

4. Preparation of bonding paste: 72% by weight of glass-ceramic powder and 28% of organic bonding phase are stirred and dispersed in a container, and then placed in a three-roll mill for repeated grinding to obtain inorganic bonding slurry.

The quartz fiber reinforced silica-based composite materials were bonded according to the size specified by the standard using the above bonding slurry. The bonded samples were dried at 120°C for 0.5h, and then heat-treated at 950°C for 0.5h. Then, the tensile shear strength and bending shear strength were tested, and the test results were as follows: the tensile shear strength was 10.8 MPa, and the compressive shear strength was 16 MPa.

Example 5

1. Preparation of basic glass powder: weighing 72% SiO ₂ , 12% Al ₂ O ₃ , 6% B ₂ O ₃ , 3% MgO, 2% BaO, 2% ZnO and 3% by mass. % La ₂ O ₃ was mixed uniformly in a mixer for 24 hours; then kept in a high temperature resistance furnace at a constant temperature of 1600 ° C for 2 hours to obtain a clear glass liquid; then the glass liquid was quenched in deionized water, taken out, and put into blast drying In a box, drying at 100°C for 4 hours to obtain glass slag; placing the glass slag in a planetary ball mill for 8 hours and passing through a 500-mesh sieve to obtain a basic glass powder with a particle size of 1.0 μm to 2.5 μm;

2. Preparation of glass-ceramic powder: Add 15% β-eucryptite to the base glass powder, ball mill for 2 hours, sieve with a 400-mesh sieve after drying, and keep the sieved raw materials in a 1300 ℃ resistance furnace for 1 hour , after being clarified, water quenching, ball milling and drying are carried out to obtain the glass-ceramic powder;

Specifically, after testing, the softening point of the glass-ceramic powder is 775°C, and the thermal expansion coefficient is 0.75×10 ^-6 /°C.

3. Preparation of organic bonding phase: After accurately weighing the organic solvent, polymer thickener and dispersant, put it into a round-bottomed flask, stir and dissolve at a constant temperature of 80-85 °C for 1-3 hours, and obtain a clear and transparent fluid ;

Specifically, the organic solvent includes 55% by weight terpineol and 35% butyl carbitol; the polymer thickener includes 8% by weight ethyl cellulose; the dispersant includes 2% by weight polyamine methacrylate;

4. Preparation of bonding paste: 72% by weight of glass-ceramic powder and 28% of organic bonding phase are stirred and dispersed in a container, and then placed in a three-roll mill for repeated grinding to obtain inorganic bonding slurry.

The quartz fiber reinforced silica-based composite materials were bonded according to the size specified by the standard using the above bonding slurry. The bonded samples were dried at 120°C for 0.5h, and then heat-treated at 950°C for 0.5h. Then, the tensile shear strength and bending shear strength were tested, and the test results were as follows: the tensile shear strength was 12 MPa, and the compressive shear strength was 17.4 MPa.

Example 6

1. Preparation of basic glass powder: weighing 58% SiO ₂ , 18% Al ₂ O ₃ , 12% B ₂ O ₃ , 4% MgO, 2% BaO, 2% CaO, 2% % ZnO and 2% ZrO ₂ were mixed uniformly in a mixer for 12 hours; then kept in a high temperature resistance furnace at 1600 °C for 1.5 hours to obtain a clear glass liquid; then the glass liquid was quenched in deionized water, taken out, and placed in a Put the glass slag into a blast drying oven, and dry it at 100°C for 4 hours to obtain glass slag; place the glass slag in a planetary ball mill for 6 hours, pass through a 400-mesh sieve, and obtain a basic glass powder with a particle size of 1.0 μm to 2.5 μm;

2. Preparation of glass-ceramic powder: add 5% β-eucryptite to the base glass powder, ball mill for 2 hours, sieve with a 300-mesh sieve after drying, and keep the sieved raw materials in a 1300 ℃ resistance furnace for 1 hour , after being clarified, water quenching, ball milling and drying are carried out to obtain the glass-ceramic powder;

Specifically, after testing, the softening point of the glass-ceramic powder is 735°C, and the thermal expansion coefficient is 1.5×10 ^-6 /°C.

3. Preparation of organic bonding phase: After accurately weighing the organic solvent, polymer thickener and dispersant, put it into a round-bottomed flask, stir and dissolve at a constant temperature of 80-85 °C for 1-3 hours, and obtain a clear and transparent fluid ;

Specifically, the organic solvent includes 55% by weight terpineol and 35% butyl carbitol; the polymer thickener includes 8% by weight ethyl cellulose; the dispersant includes 2% by weight polyamine methacrylate;

4. Preparation of bonding paste: Stir and disperse 67% by weight glass-ceramic powder and 33% organic bonding phase in a container, and then place it in a three-roll mill for repeated grinding to obtain bonding paste material.

The quartz fiber reinforced silica-based composite materials were bonded according to the size specified by the standard using the above bonding slurry. The bonded samples were dried at 120°C for 0.5h, and then heat-treated at 950°C for 0.5h. Then, the tensile shear strength and bending shear strength were tested, and the test results were as follows: the tensile shear strength was 6.1 MPa, and the compressive shear strength was 8.6 MPa.

The specific embodiments of the present invention disclosed above are intended to help understand the content of the present invention and implement them accordingly. Those skilled in the art can understand that various substitutions, changes and modifications can be made without departing from the spirit and scope of the present invention. Modifications are possible. The present invention should not be limited to the contents disclosed in the embodiments of this specification, and the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims (9)

1. The high-temperature-resistant low-expansion-coefficient bonding slurry for the wave-transparent ceramic matrix composite is characterized by comprising 55-85 wt% of microcrystalline glass powder and 15-45 wt% of organic bonding phase; the microcrystalline glass powder is SiO ₂ -Al ₂ O ₃ -B ₂ O ₃ -MgO-BaO-ZnO-ZrO ₂ Is a mixed powder of basic glass powder and beta-eucryptite; the organic binding phase comprises an organic solvent, a dispersant and a thickening agent;

the microcrystalline glass powder comprises 55-72 wt% of SiO ₂ 6 to 20% of Al ₂ O ₃ 2-13% of B ₂ O ₃ 1-8% of MgO, 0-3% of BaO, 0-3% of ZnO, 0-2% of CaO and 0-2% of ZrO ₂ 0-3% of rare earth oxide and 3-15% of beta-eucryptite;

the average grain size of the microcrystalline glass powder is controlled to be 1.0-2.5 mu m.

2. The high temperature resistant low expansion coefficient bonding slurry for the wave-transparent ceramic matrix composite material according to claim 1, wherein the organic bonding phase comprises 70-85% of an organic solvent, 2-15% of a dispersant, and 2-15% of a thickener by weight percentage.

3. The high temperature resistant, low expansion coefficient bonding paste for a wave-transparent ceramic matrix composite according to claim 1, wherein the high temperature resistant, low expansion coefficient bonding paste isCharacterized in that the coefficient of thermal expansion of the microcrystalline glass powder is 0.5 multiplied by 10 ^-6 /℃～1.6×10 ^-6 /℃。

4. The high temperature resistant low expansion coefficient bonding paste for the wave-transparent ceramic matrix composite material according to claim 1, wherein the organic solvent is at least one of terpineol, butyl carbitol acetate, and diethylene glycol ethyl ether.

5. The high temperature resistant low expansion coefficient bonding paste for the wave-transparent ceramic matrix composite according to claim 1, wherein the dispersant is at least one of triammonium citrate, polymethacrylic acid amine, and 1, 4-dihydroxysulfonic acid amine.

6. The high temperature resistant low expansion coefficient bonding paste for the wave-transparent ceramic matrix composite according to claim 1, wherein the thickener is a polymeric thickener, and the polymeric thickener is at least one of ethyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, nitrocellulose, and tributyl citrate.

7. The high temperature resistant low expansion coefficient bonding slurry for the wave-transparent ceramic matrix composite of claim 1, wherein the rare earth oxide is La ₂ O ₃ 、Gd ₂ O ₃ 、Y ₂ O ₃ 、Er ₂ O ₃ 、CeO ₂ 、Nd ₂ O ₃ At least one of (1).

8. A method for preparing the high temperature resistant low expansion coefficient bonding slurry for the wave-transparent ceramic matrix composite material according to claim 1, comprising the following steps:

step 1, preparing base glass powder: preparing ingredients according to the weight percentage in the formula, mixing the ingredients in a mixer for 2-24h, uniformly mixing the ingredients, then placing the mixture into a corundum crucible, keeping the temperature of 1500-1700 ℃ in a resistance furnace for 1-4 h to obtain clear glass liquid, then quenching the glass liquid in deionized water, then taking out the glass liquid, placing the glass liquid into a blast drying box, drying the glass liquid for 2-6h at the temperature of 80-120 ℃ to obtain glass slag, then placing the glass slag into a planetary ball mill for ball milling for 4-8h, and sieving the glass slag with a 400-plus-500-mesh sieve to obtain basic glass powder, wherein the average particle size of the powder is controlled to be less than 3 mu m;

step 2, preparing microcrystalline glass powder: adding beta-eucryptite into the glass powder obtained in the step (1), ball-milling for 2-5h, sieving with a 300-plus 400-mesh sieve after drying, and then performing melting, water quenching and drying to obtain microcrystalline glass powder, wherein the average particle size of the powder is controlled to be 1.0-2.5 mu m;

step 3, preparing an organic bonding phase: accurately weighing an organic solvent, a thickening agent and a dispersing agent, then putting the organic solvent, the thickening agent and the dispersing agent into a round-bottom flask, stirring and dissolving the organic solvent, the thickening agent and the dispersing agent for 1-3 hours at a constant temperature of 80-85 ℃ to obtain a clear and transparent fluid;

step 4, preparing bonding slurry: stirring and dispersing the microcrystalline glass powder and the organic bonding phase in a container, then repeatedly grinding the mixture in a three-roll grinder, and controlling the fineness to be below 12 mu m and the viscosity range to be 50-120 Pa.s to obtain bonding slurry.

9. The method according to claim 8, wherein the average particle size of the powder in step 1 is controlled to be 1.0-2.5 μm; the melting temperature in the step 2 is 1250-.