CN111970616A - Loudspeaker module and electronic equipment - Google Patents
Loudspeaker module and electronic equipment Download PDFInfo
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- CN111970616A CN111970616A CN202011008109.1A CN202011008109A CN111970616A CN 111970616 A CN111970616 A CN 111970616A CN 202011008109 A CN202011008109 A CN 202011008109A CN 111970616 A CN111970616 A CN 111970616A
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- 238000003466 welding Methods 0.000 description 2
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- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
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Abstract
Description
技术领域technical field
本发明涉及电子技术领域,尤其涉及一种扬声器模组及电子设备。The present invention relates to the field of electronic technology, and in particular, to a speaker module and an electronic device.
背景技术Background technique
近年来,用户对于音效的主观体验要求不断提升,已经经历了从简单的有声音-声音大-音效体验好的转变过程。由于扬声器模组的后音腔越大音效越好,因此增大后音腔的体积是一种有效的音效提升办法。In recent years, users' subjective experience requirements for sound effects have been continuously improved, and they have gone through a transition process from simple sound - loud sound - good sound effect experience. Since the larger the rear sound cavity of the speaker module, the better the sound effect, so increasing the volume of the rear sound cavity is an effective way to improve the sound effect.
然而,随着小型化发展趋势,智能手机和平板等电子设备的整机厚度越来越薄,导致扬声器模组在手机和平板等电子设备内的可利用空间越来越小。因此,在有限的可利用空间内增大扬声器模组中后音腔的体积存在较大难度。However, with the trend of miniaturization, the overall thickness of electronic devices such as smartphones and tablets is getting thinner and thinner, resulting in less and less available space for speaker modules in electronic devices such as mobile phones and tablets. Therefore, it is difficult to increase the volume of the rear sound cavity in the speaker module within the limited available space.
目前,有两种常规的后音腔增大方式:At present, there are two conventional ways to enlarge the rear cavity:
一种为在扬声器模组的腔体内增设原子吸附材料,利用该原子吸附材料吸收空气中的氧原子和氮原子以形成负压,从而达到扩展后音腔体积的效果。但是,原子吸附材料成本高,还需要特殊的罐装设备,并且装入工艺流程复杂。One is to add atomic adsorption material in the cavity of the speaker module, and the atomic adsorption material is used to absorb oxygen atoms and nitrogen atoms in the air to form negative pressure, so as to achieve the effect of expanding the volume of the sound cavity. However, the atomic adsorption material is expensive, requires special canning equipment, and has a complicated loading process.
另一种为在后音腔内贴吸音棉,但是该方式可增加的后音腔体积有限,而且会牺牲部分声音的响度,使得音效变差。The other is to stick sound-absorbing cotton in the rear sound cavity, but this method can increase the volume of the rear sound cavity is limited, and the loudness of part of the sound will be sacrificed, making the sound effect worse.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种扬声器模组及电子设备,克服现有技术存在的成本高、工艺复杂和音效提升程度较小的缺陷。The purpose of the present invention is to provide a loudspeaker module and an electronic device to overcome the defects of the prior art, such as high cost, complicated process and small sound effect enhancement.
为达此目的,本发明采用以下技术方案:For this purpose, the present invention adopts the following technical solutions:
一种扬声器模组,包括:壳体和扬声器单元;A speaker module, comprising: a shell and a speaker unit;
所述扬声器单元设于所述壳体的内腔中,并将所述内腔分为相互隔绝的前音腔和后音腔;所述壳体上,于所述前音腔的对应区域,开设有出音孔,所述出音孔连通所述前音腔;所述壳体上,于所述后音腔的对应区域,开设有预设数量和按照预设方式排布的连通孔,所述连通孔与所述后音腔连通。The speaker unit is arranged in the inner cavity of the casing, and the inner cavity is divided into a front sound cavity and a rear sound cavity which are isolated from each other; on the casing, in the corresponding area of the front sound cavity, A sound outlet is provided, and the sound outlet communicates with the front sound cavity; on the casing, in the corresponding area of the rear sound cavity, a preset number of communication holes arranged in a preset manner are opened, The communication hole communicates with the rear sound cavity.
可选的,所述壳体上,于所述连通孔的开孔区域设有多孔阻尼网,所述多孔阻尼网的通孔的孔径小于所述连通孔的孔径。Optionally, on the casing, a porous damping net is provided in the opening area of the communication hole, and the diameter of the through holes of the porous damping net is smaller than the diameter of the communication hole.
可选的,所述多孔阻尼网贴设于所述壳体的外壁。Optionally, the porous damping net is attached to the outer wall of the housing.
可选的,所述壳体上的所述连通孔呈矩形阵列方式排布。Optionally, the communication holes on the housing are arranged in a rectangular array.
可选的,所述连通孔的数量为20-150个。Optionally, the number of the communication holes is 20-150.
可选的,所述连通孔的数量为56个,所述连通孔的直径为0.5mm,所述多孔阻尼网的通孔的目数为2000个。Optionally, the number of the communication holes is 56, the diameter of the communication holes is 0.5 mm, and the mesh number of the through holes of the porous damping net is 2000.
可选的,所述壳体包括装配连接形成所述内腔的上壳和下壳;所述下壳内设有台阶槽,所述扬声器单元装设于所述台阶槽的台阶面上,所述扬声器单元的出音面面向所述台阶槽,使得所述扬声器的出音面与所述台阶槽形成密封的所述前音腔。Optionally, the casing includes an upper casing and a lower casing assembled and connected to form the inner cavity; a stepped groove is provided in the lower casing, and the speaker unit is installed on the stepped surface of the stepped groove, so The sound exit surface of the speaker unit faces the stepped groove, so that the sound exit surface of the speaker and the stepped groove form the sealed front sound cavity.
可选的,所述出音孔开设于所述台阶槽的侧壁或者底壁。Optionally, the sound outlet hole is opened on the side wall or the bottom wall of the stepped groove.
可选的,所述扬声器模组还包括设于所述内腔的柔性电路板;所述柔性电路板的一端与所述扬声器单元电连接,另一端伸出所述内腔与电源电连接。Optionally, the speaker module further includes a flexible circuit board disposed in the inner cavity; one end of the flexible circuit board is electrically connected to the speaker unit, and the other end extends out of the inner cavity and is electrically connected to a power source.
一种电子设备,包括如上任一所述的扬声器模组。An electronic device includes any one of the speaker modules described above.
与现有技术相比,本发明实施例具有以下有益效果:Compared with the prior art, the embodiments of the present invention have the following beneficial effects:
本发明实施例针对后音腔进行了特殊设计:在壳体上的与后音腔的对应区域开设多个连通孔,使得后音腔与扬声器模组的外界环境连通。在扬声器单元发出声音时,扬声器单元的振动膜的振动会推动后音腔内的空气运动,这样后音腔中的空气会发生膨胀并由后音腔的连通孔流出至扬声器模组的外界环境中,或者发生收缩而让外界环境中的空气由连通孔进入后音腔,因此该特殊设计达到了利用外界空间对后音腔进行扩展的效果,相当于增大了后音腔的体积,进而可降低Fo值和提升SPL值,有效提升了音效。The embodiment of the present invention has a special design for the rear sound cavity: a plurality of communication holes are opened on the shell in the area corresponding to the rear sound cavity, so that the rear sound cavity is communicated with the external environment of the speaker module. When the speaker unit emits sound, the vibration of the diaphragm of the speaker unit will push the air in the rear sound cavity to move, so that the air in the rear sound cavity will expand and flow out from the communication hole of the rear sound cavity to the external environment of the speaker module. , or it shrinks so that the air in the external environment enters the rear sound cavity through the communication hole, so this special design achieves the effect of using the external space to expand the rear sound cavity, which is equivalent to increasing the volume of the rear sound cavity, and then It can reduce the Fo value and increase the SPL value, which effectively improves the sound effect.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其它的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1为本发明实施例提供的扬声器模组的装配立体图;1 is an assembly perspective view of a speaker module provided by an embodiment of the present invention;
图2为本发明实施例提供的扬声器模组的爆炸图;2 is an exploded view of a speaker module provided by an embodiment of the present invention;
图3为本发明实施例提供的扬声器模组的剖视图;3 is a cross-sectional view of a speaker module provided by an embodiment of the present invention;
图4为本发明实施例提供的SPL响度曲线对比图;4 is a comparison diagram of SPL loudness curves provided by an embodiment of the present invention;
图5为本发明实施例提供的Fo曲线对比图。FIG. 5 is a comparison diagram of Fo curves provided by an embodiment of the present invention.
图示说明:壳体10、扬声器单元20、多孔阻尼网30、柔性电路板40、前音腔11、后音腔12、出音孔13、连通孔14、上壳15、下壳16、台阶槽17。Illustration description:
具体实施方式Detailed ways
为使得本发明的发明目的、特征、优点能够更加的明显和易懂,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,下面所描述的实施例仅仅是本发明一部分实施例,而非全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
图1所示为本发明实施例的扬声器模组的装配立体图,图2所示为本发明实施例的扬声器模组的爆炸图,图3所示为本发明实施例的扬声器模组的剖视图。请参阅图1至图3,本发明实施例提供的扬声器模组主要包括:壳体10和扬声器单元20。FIG. 1 is an assembled perspective view of a speaker module according to an embodiment of the present invention, FIG. 2 is an exploded view of the speaker module according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of the speaker module according to an embodiment of the present invention. Referring to FIG. 1 to FIG. 3 , the speaker module provided by the embodiment of the present invention mainly includes: a
其中,扬声器单元20设于壳体10的内腔中,并将内腔分为相互隔绝的前音腔11和后音腔12。壳体10上,于前音腔11的对应区域,开设有出音孔13,该出音孔13连通前音腔11。壳体10上,于后音腔12的对应区域,开设有预设数量和按照预设方式排布的连通孔14,该连通孔14与后音腔12连通。The
需要说明的是,扬声器单元20有许多种类,但其基本的工作原理是相似的,均是一种将电信号转换为声音信号进行重放的元件。目前使用最为广泛的是电动式扬声器,它由振动膜、音圈、永久磁铁、支架等组成,其工作原理为:当扬声器单元20的音圈通入音频电流后音圈在电流的作用下便产生交变的磁场,永久磁铁同时也产生一个大小和方向不变的恒定的磁场。由于音圈所产生磁场的大小和方向随音频电流的变化不断地在改变,这样两个磁场的相互作用使音圈作垂直于音圈中电流方向的运动,由于音圈和振动膜相连,从而带动振动膜产生振动,由振动膜振动引起空气的振动而发出声音。It should be noted that there are many types of
扬声器频率响应曲线关键参数包括SPL(灵敏度)值和Fo(低音共振频率)值。其中,SPL:指输入扬声器单元201W的电功率,在扬声器轴线方向离开1米远的地方测得的声压级大小,它实质上是一种转换效率的体现。Fo反映了扬声器的低频特性,是频响曲线次重要的指标。The key parameters of the speaker frequency response curve include the SPL (sensitivity) value and the Fo (bass resonance frequency) value. Among them, SPL: refers to the electric power input to the speaker unit of 201W, the sound pressure level measured at a distance of 1 meter away from the axis of the speaker, which is essentially a manifestation of conversion efficiency. Fo reflects the low-frequency characteristics of the speaker and is the second most important indicator of the frequency response curve.
音腔,主要包括相互隔绝的前音腔11和后音腔12。前音腔11主要影响声音的高频部分,对声音的低频影响不大;随着前音腔11的容积的增大高频谐振点会越来越低,在设计前音腔11时需考虑出音孔13的面积,一般情况下,前音腔11越大则出声孔的面积也应该越大。后音腔12主要影响声音的低频部分,对高频部分影响较小;例如,针对铃声,铃声的低频部分对音质影响很大,低音越突出,主观上会觉得铃声比较悦耳。The sound cavity mainly includes a
本发明实施例中,针对后音腔12进行了特殊设计:在壳体10上的与后音腔12对应区域开设多个连通孔14,使得后音腔12与扬声器模组的外界环境连通。在扬声器单元20发出声音时,扬声器单元20的振动膜的振动会推动后音腔12内的空气运动,这样后音腔12中的空气会发生膨胀并由后音腔12的连通孔14流出至扬声器模组的外界环境中,或者发生收缩而让外界环境中的空气由连通孔14进入后音腔12,因此该特殊设计达到了利用外界空间对后音腔12进行扩展的效果,相当于增大了后音腔12的体积,进而可降低Fo值和提升SPL值,有效提升了音效。In the embodiment of the present invention, a special design is made for the rear sound cavity 12: a plurality of
不同于开设口径较大的一个开口的方式,本实施例采用开设多个较小直径的连通孔14的方式,可有效避免杂音混入。Different from the method of opening an opening with a larger diameter, the present embodiment adopts a method of opening a plurality of communication holes 14 with a smaller diameter, which can effectively avoid the mixing of noise.
同时,由于壳体10上的连通孔14的加工精度有限,按照目前的加工水平加工精度一般仅能达到直径0.5mm,而理论上连通孔14的直径越小音效越好,因此为了进一步提升音效,本发明实施例于连通孔14的开孔区域还设有多孔阻尼网30,该多孔阻尼网30的通孔的孔径小于连通孔14的孔径。At the same time, due to the limited machining accuracy of the
具体的,多孔阻尼网30由大声阻的网布与双面胶模切而成,多孔阻尼网30上的通孔目数可根据实际音效需求来选择。Specifically, the porous damping net 30 is die-cut from a mesh cloth with high acoustic resistance and double-sided adhesive tape, and the number of through holes on the porous damping net 30 can be selected according to actual sound effects requirements.
示例性的,连通孔14的数量为20-150个,呈矩形阵列方式排布于壳体10上的指定区域。采用不同的连通孔14数量设计,可实现不同体积的后音腔12,从而获得不同音效。在实际应用中,可根据实际需求来灵活调整。Exemplarily, the number of the communication holes 14 is 20-150, which are arranged in a designated area on the
优选的,连通孔14的数量为56个,各个连通孔14的直径为0.5mm,多孔阻尼网30的通孔的目数为2000个。为体现本实施例的技术效果,下面将采用此设计的扬声器模组,与常规扬声器模组进行对比测试,对比结果如下:Preferably, the number of the communication holes 14 is 56, the diameter of each
请参阅图4所示的SPL响度曲线对比图,其中SPL响度曲线A是常规的扬声器模组客观测试值,SPL响度曲线B是本实施例的增大后音腔12后的扬声器模组客观测试值;从测试结果看,本实施例的扬声器模组的SPL值有明显的提升;Please refer to the SPL loudness curve comparison diagram shown in FIG. 4 , wherein the SPL loudness curve A is the objective test value of the conventional loudspeaker module, and the SPL loudness curve B is the objective test of the loudspeaker module after the
请参阅图5所示的Fo曲线对比图,其中阻抗曲线C是常规的扬声器模组客观测试值,阻抗曲线D是本实施例的增大后音腔12后的扬声器模组客观测试值;从测试结果看,本实施例的扬声器模组的Fo值明显降低。Please refer to the Fo curve comparison diagram shown in FIG. 5, wherein the impedance curve C is the objective test value of the conventional speaker module, and the impedance curve D is the objective test value of the speaker module after the
为方便加工,壳体10可具体包括装配连接形成内腔的上壳15和下壳16。其中,下壳16内设有台阶槽17,扬声器单元20装设于台阶槽17的台阶面上,扬声器单元20的出音面面向台阶槽17,使得扬声器的出音面与台阶槽17形成密封的前音腔11。出音孔13开设于台阶槽17的侧壁,以形成侧出音方式;在其他实施例中,出音孔13也可开设于台阶槽17的底壁,以形成正出音方式。For the convenience of processing, the
此外,音腔模组还包括设于内腔的柔性电路板40;柔性电路板40的一端与扬声器单元20电连接,另一端伸出内腔与电源电连接。In addition, the sound cavity module further includes a
可以理解的,本发明实施例中,连通孔14具体可以开设于上壳15和/或下壳16上。相应的,多孔阻尼网30贴设于相应上壳15/下壳16的外壁,以降低操作难度。It can be understood that, in the embodiment of the present invention, the
结合图1和图2所示,本实施例的扬声器模组的装配方法为:先将扬声器单元20装入到下壳16的对应位置后,进行点胶密封;再贴入柔性电路板40并进行热压焊接,使得柔性电路板40与扬声器单元20的焊盘焊接在一起;之后盖入上壳15,进行超声波焊接;最后将多孔阻尼网30贴至壳体10外表面的连通孔14对应位置,完成组装过程。As shown in FIG. 1 and FIG. 2 , the assembly method of the speaker module in this embodiment is as follows: first, the
与常规的装配方式相比,本实施例的装配方式仅在最后增加了一个贴多孔阻尼网30的步骤。因此,本实施例还具有组装方便和低成本的优点。Compared with the conventional assembly method, the assembly method of this embodiment only adds a step of attaching the porous damping
基于此,本实施例还提供了一种电子设备,包括如上所述的扬声器模组。具体的,本实施例中的电子设备,可以包括但不限于手机、平板电脑、个人数字助理(PersonalDigital Assistant,PDA)、销售终端(Point of Sales,POS)、车载电脑等。Based on this, this embodiment also provides an electronic device, including the speaker module as described above. Specifically, the electronic device in this embodiment may include, but is not limited to, a mobile phone, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA), a point of sale (Point of Sales, POS), a vehicle-mounted computer, and the like.
可以理解的,本实施例的电子设备除了扬声器模组外,还可以包括其它部件和结构,具体不作限制。It can be understood that, in addition to the speaker module, the electronic device in this embodiment may also include other components and structures, which are not specifically limited.
由于采用了上述扬声器模组,本实施例的电子设备可通过壳体10上的连通孔14使得后音腔12与电子设备的整机内部空间连通,从而将整机内部空间作为后音腔12的扩展部分,极大程度的增加了后音腔12的体积,最终使得模组的Fo较低、SPL响度更高,大大提升了音效。Due to the use of the above-mentioned speaker module, the electronic device of this embodiment can make the
以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The technical solutions described in the embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the present invention.
Claims (10)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112600963A (en) * | 2020-12-11 | 2021-04-02 | 维沃移动通信有限公司 | Electronic equipment |
| CN115914957A (en) * | 2022-11-30 | 2023-04-04 | 杭州灵伴科技有限公司 | Sound cavity structure and intelligent glasses |
| CN116489565A (en) * | 2022-01-14 | 2023-07-25 | 北京字跳网络技术有限公司 | Speaker device for head-mounted device and head-mounted device having the same |
| CN116684787A (en) * | 2022-10-31 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170041693A1 (en) * | 2014-04-29 | 2017-02-09 | Goertek Inc. | Loudspeaker module applied inside terminal |
| CN107277711A (en) * | 2017-06-29 | 2017-10-20 | 维沃移动通信有限公司 | A kind of sound cavity apparatus and mobile terminal |
| CN208675508U (en) * | 2018-10-22 | 2019-03-29 | 歌尔科技有限公司 | Loudspeaker mould group |
| CN110113697A (en) * | 2019-04-08 | 2019-08-09 | Oppo广东移动通信有限公司 | Electroacoustic component and mobile terminal |
| CN209299516U (en) * | 2019-01-17 | 2019-08-23 | 歌尔科技有限公司 | A kind of loudspeaker mould group and electronic equipment |
| CN212628399U (en) * | 2020-09-23 | 2021-02-26 | 华勤技术股份有限公司 | Loudspeaker module and electronic equipment |
-
2020
- 2020-09-23 CN CN202011008109.1A patent/CN111970616A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170041693A1 (en) * | 2014-04-29 | 2017-02-09 | Goertek Inc. | Loudspeaker module applied inside terminal |
| CN107277711A (en) * | 2017-06-29 | 2017-10-20 | 维沃移动通信有限公司 | A kind of sound cavity apparatus and mobile terminal |
| CN208675508U (en) * | 2018-10-22 | 2019-03-29 | 歌尔科技有限公司 | Loudspeaker mould group |
| CN209299516U (en) * | 2019-01-17 | 2019-08-23 | 歌尔科技有限公司 | A kind of loudspeaker mould group and electronic equipment |
| CN110113697A (en) * | 2019-04-08 | 2019-08-09 | Oppo广东移动通信有限公司 | Electroacoustic component and mobile terminal |
| CN212628399U (en) * | 2020-09-23 | 2021-02-26 | 华勤技术股份有限公司 | Loudspeaker module and electronic equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112600963A (en) * | 2020-12-11 | 2021-04-02 | 维沃移动通信有限公司 | Electronic equipment |
| CN112600963B (en) * | 2020-12-11 | 2023-03-21 | 维沃移动通信有限公司 | Electronic equipment |
| CN116489565A (en) * | 2022-01-14 | 2023-07-25 | 北京字跳网络技术有限公司 | Speaker device for head-mounted device and head-mounted device having the same |
| CN116684787A (en) * | 2022-10-31 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
| CN115914957A (en) * | 2022-11-30 | 2023-04-04 | 杭州灵伴科技有限公司 | Sound cavity structure and intelligent glasses |
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Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Applicant after: Huaqin Technology Co.,Ltd. Address before: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203 Applicant before: Huaqin Technology Co., Ltd |