CN111978684A - 一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用 - Google Patents
一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用 Download PDFInfo
- Publication number
- CN111978684A CN111978684A CN202010983654.6A CN202010983654A CN111978684A CN 111978684 A CN111978684 A CN 111978684A CN 202010983654 A CN202010983654 A CN 202010983654A CN 111978684 A CN111978684 A CN 111978684A
- Authority
- CN
- China
- Prior art keywords
- parts
- epoxy resin
- glue solution
- loss
- dimer acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 239000000539 dimer Substances 0.000 claims abstract description 38
- 239000002253 acid Substances 0.000 claims abstract description 35
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 22
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 11
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- 239000005011 phenolic resin Substances 0.000 claims abstract description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000004843 novolac epoxy resin Substances 0.000 claims description 38
- 238000003756 stirring Methods 0.000 claims description 30
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 16
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical compound C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 235000019359 magnesium stearate Nutrition 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 claims description 2
- HZZUMXSLPJFMCB-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;acetate Chemical compound CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 HZZUMXSLPJFMCB-UHFFFAOYSA-M 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 238000004026 adhesive bonding Methods 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- JNJGROHZMWDCCM-UHFFFAOYSA-N C(C)C1=C(C=CC=C1)P(C1=CC=CC=C1)C1=CC=CC=C1.C(C)(=O)O Chemical compound C(C)C1=C(C=CC=C1)P(C1=CC=CC=C1)C1=CC=CC=C1.C(C)(=O)O JNJGROHZMWDCCM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
Abstract
本发明提供了一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用。本发明的胶液,包括如下重量份的组分:DOPO酚醛环氧树脂90‑120份,二聚酸改性酚醛环氧树脂5‑10份,双酚A型酚醛树脂30‑50份,双酚F型苯并恶嗪树脂20‑40份,2‑甲基‑4乙基咪唑0.01‑0.3份,硅微粉60‑80份,硅烷偶联剂0.02‑0.05份和溶剂70‑100份。利用本发明胶液制作的覆铜板可防止裂纹现象的出现,除具备优异的耐热性和可靠性,还降低了基板的介电常数与介电损耗,能够良好地满足信息高传输、中损耗的市场需求。
Description
技术领域
本发明涉及覆铜板技术领域,尤其是涉及一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用。
背景技术
近年来,全球信息技术向数字化、网络化迅速发展,超大容量的信息传输,超快速度和超高密度的信息处理,已成为信息及通信设备(ICT)技术发展所追求的目标。目前,4G通信功能已经逐步趋于不能满足社会的通信需求,5G技术已然成熟;5G基站的前期铺设工作已经开始,这时必将开发出性能更高的雷达、天线、服务器、交换机等通讯产品,这些给高速覆铜板带来了前所未有的机遇和挑战。
从整个通讯技术的发展历程不难看出,高传输、大容量、大数据、云计算等先进理念不断的提出与发展,势必要求硬件产品性能不断提升,尤其是对PCB的设计也随之不断升级,如高层数、大尺寸、高纵横比、高密度、无铅焊接、高速材料的应用等等,都对高速覆铜板整体加工性能、可靠性能以及传输损耗性能提出了更高的要求。
当今社会已进入到高度信息化的社会,IT产业成为社会信息化的强大推动力。5G时代的来临、自动驾驶、汽车防撞系统、高速大容量存贮器、定位系统、物联网等广泛应用,均要求所用电子材料和电子元器件等具有高频、高速和大容量存储及传输信号的功能。
高频高速材料PCB产品一般为高多层叠构,为了保证材料的低介电性能,材料配方中通常加入多种树脂、填料、助剂等,而板料的加工性比普通的FR4要差,可靠性也相应地受到挑战。然而,传统的高频高速板材经过PCB密集孔加工后,在受到288℃的热冲击后容易出现裂纹(Crack)等情况,从而影响了终端产品的性能。
鉴于此,特提出本发明。
发明内容
本发明的目的在于提供一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用,利用该胶液制作的覆铜板可防止裂纹现象的出现,除具备优异的耐热性和可靠性,还降低了基板的介电常数与介电损耗。
本发明提供的一种用于提高中损耗无卤覆铜板韧性的胶液,包括如下重量份的组分:DOPO酚醛环氧树脂90-120份,二聚酸改性酚醛环氧树脂5-10份,双酚A型酚醛树脂30-50份,双酚F型苯并恶嗪树脂20-40份,2-甲基-4乙基咪唑0.01-0.3份,硅微粉60-80份,硅烷偶联剂0.02-0.05份和溶剂70-100份。
优选地,本发明的胶液包括如下重量份的组分:DOPO酚醛环氧树脂100-110份,二聚酸改性酚醛环氧树脂5-10份,双酚A型酚醛树脂30-35份,双酚F型苯并恶嗪树脂25-40份,2-甲基-4乙基咪唑0.01-0.1份,硅微粉60-70份,硅烷偶联剂0.02-0.05份和溶剂70-90份。
在本发明中,所述溶剂可以选自环己酮和丁酮中的至少一种;优选地,所述溶剂包括环己酮10-20份和丁酮60-80份。
在本发明中,所述二聚酸改性酚醛环氧树脂是二聚酸的羧基与环氧基发生反应形成的嵌段结构,二聚酸的长碳链不仅能够改善环氧树脂的脆性,提高环氧树脂的冲击强度和剪切力,同时提高了断裂韧性,适量的使用不会降低耐热性和力学性能。更具体地,二聚酸改性环氧树脂的酸值小于2mgKOH/g,环氧当量为280-300;使用时,可以加入丁酮配成50%的溶剂型环氧树脂。
对上述二聚酸改性酚醛环氧树脂的制备方法不作严格限制,例如可以是通过将酚醛环氧树脂与二聚酸进行反应得到的。
本发明还提供上述胶液的制备方法,包括:
A)按照重量份,将溶剂与硅烷偶联剂混合后搅拌,得到第一混合物;
B)按照重量份,向第一混合物中加入硅微粉,搅拌,得到第二混合物;
C)按照重量份,向第二混合物中加入DOPO酚醛环氧树脂、二聚酸改性酚醛环氧树脂、双酚A型酚醛树脂、双酚F型苯并恶嗪树脂和2-甲基-4乙基咪唑,搅拌,制得胶液。
具体地,步骤A)中,可以控制搅拌速度为800-1200r/min,搅拌时间为0.5-1.5h;步骤B)中,可以控制搅拌速度为1500-2000r/min,搅拌时间为1-2h;步骤C)中,搅拌可以包括:先以1800-2200r/min搅拌2-4h,然后再以500-800r/min搅拌1.5-2.5h。
在一实施方式中,二聚酸改性酚醛环氧树脂的制备方法可以包括:
在保护气氛下,将酚醛环氧树脂与二聚酸在催化剂存在下进行反应,得到二聚酸改性酚醛环氧树脂。
在上述制备方法中,所述催化剂可以选自四丁基溴化铵、四乙基溴化铵、乙基三苯基醋酸膦、三苯基膦和硬脂酸镁中的至少一种,优选为硬脂酸镁。此外,酚醛环氧树脂、二聚酸和催化剂之间的质量比可以为100:(20-40):(0.01-0.05);进一步地,所述反应的温度可以为160-170℃,反应时间可以为2-4h。
本发明还提供上述胶液在制备中损耗无卤覆铜板中的应用。
本发明还提供一种中损耗无卤覆铜板的制备方法,包括:
将电子玻璃布浸润于上述胶液中,烘烤,制得半固化片;
将半固化片与铜箔叠置后进行热压,制得中损耗无卤覆铜板。
具体地,制取半固化片时,控制胶含量为40-50%,流动度为15-50%,胶化时间为120-180s。
本发明还提供一种中损耗无卤覆铜板,按照上述制备方法制得;所述中损耗无卤覆铜板是环保型,具有良好的抗冲击性能,同时介电损耗较低,有利于提高信号传输的准确性。
本发明的实施,至少具有以下优势:
1、本发明采用二聚酸改性酚醛环氧树脂作为补强材料,通过DOPO酚醛环氧树脂与二聚酸改性酚醛环氧树脂的复合树脂体系,增加了材料的韧性,提升了材料的热冲击性能;
2、本发明采用双酚A型酚醛树脂与双酚F型苯并恶嗪树脂的复合固化剂体系,保证了材料在压合后具有优异的电性能;
3、利用本发明胶液制作的覆铜板可防止裂纹现象的出现,除具备优异的耐热性和可靠性,还降低了基板的介电常数与介电损耗,能够良好地满足信息高传输、中损耗的市场需求。
具体实施方式
应该指出,以下详细说明都是例示性的,旨在对本申请提供进一步的说明。除非另有指明,本文使用的所有技术和科学术语具有与本申请所属技术领域的普通技术人员通常理解的相同含义。
需要注意的是,这里所使用的术语仅是为了描述具体实施方式,而非意图限制根据本申请的示例性实施方式。如在这里所使用的,除非上下文另外明确指出,否则单数形式也包括复数形式,此外,还应当理解的是,当在本说明中使用术语“包含”和/或“包括”时,其指明存在特征、步骤、操作、器件、组件和/或它们的组合。
下面将结合实施例对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
一、制备二聚酸改性酚醛环氧树脂
将100份酚醛环氧树脂和30份二聚酸加入到带有搅拌器和温度计的四口烧瓶里,充入氮气,在125℃下加入0.03份催化剂硬脂酸镁,随后缓慢升温至160℃,保温反应4h,得到淡黄色的二聚酸改性酚醛环氧树脂。
二、制备胶液
本实施例的胶液,由如下重量份的组分组成:
胶液的制备步骤如下:
用丙酮清洗调胶槽后,按重量份投入丁酮、环己酮和硅烷偶联剂,开启搅拌,以转速为800r/min搅拌1.5h;然后,再按重量份加入硅微粉,以1500r/min的转速高速搅拌2h,同时通入冷却水保持槽内温度在20℃左右。
再按重量份加入DOPO酚醛环氧树脂、二聚酸改性酚醛环氧树脂、双酚A型酚醛树脂、双酚F型苯并恶嗪树脂和2-甲基-4乙基咪唑,先以1800r/min的转速高速搅拌4h,再以500r/min的转速搅拌2.5h,测试胶水胶化时间合格,即制得胶液。
三、制备半固化片
将上述制备的胶液打入不锈钢上胶盆里,设定上胶机机速为10m/min,将电子玻璃布通过胶液,进入立式上胶机烘烤1-2min,即制得半固化片;其中,控制胶含量为40%,流动度为20%,胶化时间为120s,挥发份<0.5%。
四、制备中损耗无卤覆铜板
取8张半固化片裁成一定的尺寸,上下各覆一张铜箔为组合叠构,放入热压机中,在温度为210℃、压力400psi的条件下压合2.5小时,即得到中损耗无卤覆铜板。
采用IPC-650方法对上述中损耗无卤覆铜板进行检测,结果见表1。
实施例2
一、制备二聚酸改性酚醛环氧树脂
将100份酚醛环氧树脂和30份二聚酸加入到带有搅拌器和温度计的四口烧瓶里,充入氮气,在125℃下加入0.03份催化剂四丁基溴化铵,随后缓慢升温至170℃,保温反应2h,得到淡黄色的二聚酸改性酚醛环氧树脂。
二、制备胶液
本实施例的胶液,由如下重量份的组分组成:
胶液的制备步骤如下:
用丙酮清洗调胶槽后,按重量份投入丁酮、环己酮和硅烷偶联剂,开启搅拌,以转速为1200r/min搅拌0.5h;然后,再按重量份加入硅微粉,以2000r/min的转速高速搅拌1h,同时通入冷却水保持槽内温度在40℃左右。
再按重量份加入DOPO酚醛环氧树脂、二聚酸改性酚醛环氧树脂、双酚A型酚醛树脂、双酚F型苯并恶嗪树脂和2-甲基-4乙基咪唑,先以2200r/min的转速高速搅拌2h,再以800r/min的转速搅拌1.5h,测试胶水胶化时间合格,即制得胶液。
三、制备半固化片
将上述制备的胶液打入不锈钢上胶盆里,设定上胶机机速为15m/min,将电子玻璃布通过胶液,进入立式上胶机烘烤1-2min,即制得半固化片;其中,控制胶含量为50%,流动度为40%,胶化时间为180s,挥发份<0.5%。
四、制备中损耗无卤覆铜板
取8张半固化片裁成一定的尺寸,上下各覆一张铜箔为组合叠构,放入热压机中,在温度为210℃、压力400psi的条件下压合2小时,即得到中损耗无卤覆铜板。
采用IPC-650方法对上述中损耗无卤覆铜板进行检测,结果见表1。
实施例3
一、制备二聚酸改性酚醛环氧树脂
将100份酚醛环氧树脂和30份二聚酸加入到带有搅拌器和温度计的四口烧瓶里,充入氮气,在125℃下加入0.03份催化剂三苯基膦,随后缓慢升温至165℃,保温反应3h,得到淡黄色的二聚酸改性酚醛环氧树脂。
二、制备胶液
本实施例的胶液,由如下重量份的组分组成:
胶液的制备步骤如下:
用丙酮清洗调胶槽后,按重量份投入丁酮、环己酮和硅烷偶联剂,开启搅拌,以转速为1000r/min搅拌1h;然后,再按重量份加入硅微粉,以1800r/min的转速高速搅拌1.5h,同时通入冷却水保持槽内温度在30℃左右。
再按重量份加入DOPO酚醛环氧树脂、二聚酸改性酚醛环氧树脂、双酚A型酚醛树脂、双酚F型苯并恶嗪树脂和2-甲基-4乙基咪唑,先以2000r/min的转速高速搅拌3h,再以600r/min的转速搅拌2h,测试胶水胶化时间合格,即制得胶液。
三、制备半固化片
将上述制备的胶液打入不锈钢上胶盆里,设定上胶机机速为12m/min,将电子玻璃布通过胶液,进入立式上胶机烘烤1-2min,即制得半固化片;其中,控制胶含量为45%,流动度为35%,胶化时间为150s,挥发份<0.5%。
四、制备中损耗无卤覆铜板
取8张半固化片裁成一定的尺寸,上下各覆一张铜箔为组合叠构,放入热压机中,在温度为210℃、压力400psi的条件下压合3小时,即得到中损耗无卤覆铜板。
采用IPC-650方法对上述中损耗无卤覆铜板进行检测,结果见表1。
对照例1
本对照例的胶液,由如下重量份的组分组成:
本对照例覆铜板的制备方法与实施例3基本相同;采用IPC-650方法对制备的覆铜板进行检测,结果见表1。
对照例2
本对照例的胶液,由如下重量份的组分组成:
本对照例覆铜板的制备方法与实施例3基本相同;采用IPC-650方法对制备的覆铜板进行检测,结果见表1。
对照例3
本对照例的胶液,由如下重量份的组分组成:
本对照例覆铜板的制备方法与实施例3基本相同;采用IPC-650方法对制备的覆铜板进行检测,结果见表1。
表1各覆铜板的性能检测结果
表1结果表明:
相对于对比例的环氧树脂体系和固定化体系,本发明实施例1-3采用二聚酸改性酚醛环氧树脂作为补强材料,通过DOPO酚醛环氧树脂与二聚酸改性酚醛环氧树脂的复合树脂体系,增加了材料的韧性,提升了材料的热冲击性能;同时,通过双酚A型酚醛树脂与双酚F型苯并恶嗪树脂的复合固化剂体系,保证了材料在压合后具有优异的电性能。
本发明实施例1-3胶液制作的覆铜板可防止裂纹现象的出现,除具备优异的耐热性和可靠性,还降低了基板的介电常数与介电损耗,能够良好地满足信息高传输、中损耗的市场需求。
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。
Claims (10)
1.一种用于提高中损耗无卤覆铜板韧性的胶液,其特征在于,包括如下重量份的组分:DOPO酚醛环氧树脂90-120份,二聚酸改性酚醛环氧树脂5-10份,双酚A型酚醛树脂30-50份,双酚F型苯并恶嗪树脂20-40份,2-甲基-4乙基咪唑0.01-0.3份,硅微粉60-80份,硅烷偶联剂0.02-0.05份和溶剂70-100份。
2.根据权利要求1所述的胶液,其特征在于,所述溶剂选自环己酮和丁酮中的至少一种;
优选地,所述溶剂包括环己酮10-20份和丁酮60-80份。
3.根据权利要求1所述的胶液,其特征在于,所述二聚酸改性酚醛环氧树脂是通过将酚醛环氧树脂与二聚酸进行反应得到的。
4.权利要求1-3任一所述的胶液的制备方法,其特征在于,包括:
A)按照重量份,将溶剂与硅烷偶联剂混合后搅拌,得到第一混合物;
B)按照重量份,向第一混合物中加入硅微粉,搅拌,得到第二混合物;
C)按照重量份,向第二混合物中加入DOPO酚醛环氧树脂、二聚酸改性酚醛环氧树脂、双酚A型酚醛树脂、双酚F型苯并恶嗪树脂和2-甲基-4乙基咪唑,搅拌,制得胶液。
5.根据权利要求4所述的制备方法,其特征在于,步骤A)中,控制搅拌速度为800-1200r/min,搅拌时间为0.5-1.5h;步骤B)中,控制搅拌速度为1500-2000r/min,搅拌时间为1-2h;步骤C)中,搅拌包括:先以1800-2200r/min搅拌2-4h,然后再以500-800r/min搅拌1.5-2.5h。
6.根据权利要求4所述的制备方法,其特征在于,二聚酸改性酚醛环氧树脂的制备方法包括:
在保护气氛下,将酚醛环氧树脂与二聚酸在催化剂存在下进行反应,得到二聚酸改性酚醛环氧树脂。
7.根据权利要求6所述的制备方法,其特征在于,所述催化剂选自四丁基溴化铵、四乙基溴化铵、乙基三苯基醋酸膦、三苯基膦和硬脂酸镁中的至少一种,优选为硬脂酸镁;
优选地,酚醛环氧树脂、二聚酸和催化剂之间的质量比为100:(20-40):(0.01-0.05);
优选地,所述反应的温度为160-170℃,反应时间为2-4h。
8.权利要求1-3任一所述的胶液在制备中损耗无卤覆铜板中的应用。
9.一种中损耗无卤覆铜板的制备方法,其特征在于,包括:
将电子玻璃布浸润于权利要求1-3任一所述的胶液中,烘烤,制得半固化片;
将半固化片与铜箔叠置后进行热压,制得中损耗无卤覆铜板;
优选地,制取半固化片时,控制胶含量为40-50%,流动度为15-50%,胶化时间为120-180s。
10.一种中损耗无卤覆铜板,其特征在于,按照权利要求9所述的制备方法制得。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010983654.6A CN111978684A (zh) | 2020-09-18 | 2020-09-18 | 一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010983654.6A CN111978684A (zh) | 2020-09-18 | 2020-09-18 | 一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111978684A true CN111978684A (zh) | 2020-11-24 |
Family
ID=73450930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010983654.6A Pending CN111978684A (zh) | 2020-09-18 | 2020-09-18 | 一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111978684A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113771408A (zh) * | 2021-09-07 | 2021-12-10 | 林州致远电子科技有限公司 | 一种改善热压机快速升降温系统 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09296020A (ja) * | 1996-05-08 | 1997-11-18 | Yuka Shell Epoxy Kk | フェノール樹脂の製造方法、エポキシ樹脂硬化剤、及びエポキシ樹脂組成物 |
| WO2013019092A2 (ko) * | 2011-08-04 | 2013-02-07 | 주식회사 두산 | 성형성이 우수한 에폭시 수지 조성물 및 이를 포함한 금속 베이스 인쇄회로기판용 적층체 |
| CN103571157A (zh) * | 2013-10-31 | 2014-02-12 | 广东生益科技股份有限公司 | 一种树脂组合物及其制作的半挠性覆铜板 |
| CN103724936A (zh) * | 2012-10-10 | 2014-04-16 | 慧智科技(中国)有限公司 | 改善抗冲击性能的无卤低介电环氧树脂组合物 |
| CN105542394A (zh) * | 2015-12-23 | 2016-05-04 | 陕西生益科技有限公司 | 一种无卤树脂组合物及其应用 |
| CN107791649A (zh) * | 2016-08-29 | 2018-03-13 | 上海国纪电子材料有限公司 | 一种高韧性无卤cem‑3覆铜板用胶液 |
| CN109054046A (zh) * | 2018-08-06 | 2018-12-21 | 浩力森涂料(上海)有限公司 | 一种新型特种水性环氧树脂乳液的制备方法 |
| CN110951216A (zh) * | 2019-11-29 | 2020-04-03 | 陕西生益科技有限公司 | 一种热固性树脂组合物以及使用其的预浸料和层压板 |
-
2020
- 2020-09-18 CN CN202010983654.6A patent/CN111978684A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09296020A (ja) * | 1996-05-08 | 1997-11-18 | Yuka Shell Epoxy Kk | フェノール樹脂の製造方法、エポキシ樹脂硬化剤、及びエポキシ樹脂組成物 |
| WO2013019092A2 (ko) * | 2011-08-04 | 2013-02-07 | 주식회사 두산 | 성형성이 우수한 에폭시 수지 조성물 및 이를 포함한 금속 베이스 인쇄회로기판용 적층체 |
| CN103724936A (zh) * | 2012-10-10 | 2014-04-16 | 慧智科技(中国)有限公司 | 改善抗冲击性能的无卤低介电环氧树脂组合物 |
| CN103571157A (zh) * | 2013-10-31 | 2014-02-12 | 广东生益科技股份有限公司 | 一种树脂组合物及其制作的半挠性覆铜板 |
| CN105542394A (zh) * | 2015-12-23 | 2016-05-04 | 陕西生益科技有限公司 | 一种无卤树脂组合物及其应用 |
| CN107791649A (zh) * | 2016-08-29 | 2018-03-13 | 上海国纪电子材料有限公司 | 一种高韧性无卤cem‑3覆铜板用胶液 |
| CN109054046A (zh) * | 2018-08-06 | 2018-12-21 | 浩力森涂料(上海)有限公司 | 一种新型特种水性环氧树脂乳液的制备方法 |
| CN110951216A (zh) * | 2019-11-29 | 2020-04-03 | 陕西生益科技有限公司 | 一种热固性树脂组合物以及使用其的预浸料和层压板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113771408A (zh) * | 2021-09-07 | 2021-12-10 | 林州致远电子科技有限公司 | 一种改善热压机快速升降温系统 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2752449B1 (en) | Halogen-free resin composition and method for preparation of copper clad laminate with same | |
| CN105566621B (zh) | 低介电含磷聚酯化合物组成及其制法 | |
| CN104987667B (zh) | 一种树脂组合物及使用其制作的半固化片及层压板 | |
| CN105415778A (zh) | 一种无卤高频高速覆铜板及其制备方法 | |
| CN105778848A (zh) | 一种柔性印刷电路板用低介电常数黏合剂及其应用方法 | |
| CN104559888A (zh) | 一种适用于制作高多层印制线路板的覆铜板及其制备方法 | |
| CN113004856A (zh) | 一种高Tg热固性树脂组合物及其制备方法和应用 | |
| TWI674288B (zh) | 一種耐燃改質型苯乙烯馬來酸酐樹脂硬化劑製法與環氧樹脂之組合物及在銅箔基板與膠片應用 | |
| CN107953629A (zh) | 一种高速高可靠性无卤覆铜板及其制备方法 | |
| CN111704785A (zh) | 一种无卤高cti覆铜板用胶液及其制备方法和应用 | |
| CN111732817A (zh) | 一种无卤低损耗覆铜板及其胶液和制备方法 | |
| CN111978684A (zh) | 一种用于提高中损耗无卤覆铜板韧性的胶液及其制备方法和应用 | |
| CN112048155A (zh) | 一种无卤中Tg中损耗覆铜板用胶液及其制备方法和应用 | |
| CN111777541A (zh) | 一种高Tg低介电活性酯固化剂、制备方法及应用 | |
| CN108219134B (zh) | 一种改性复合双马来酰亚胺树脂的预聚物、树脂组合物及使用其制作的半固化片及层压板 | |
| CN114851650A (zh) | 一种耐高温高频bt树脂覆铜基板及其加工工艺 | |
| CN118684994B (zh) | 一种表面光滑Tg140无铅PP粘结片及其制备工艺 | |
| US20110315435A1 (en) | Acid anhydride curable thermosetting resin composition | |
| CN114644824A (zh) | 阻燃型聚苯醚树脂组合物、覆铜板及其制备方法 | |
| CN108727775B (zh) | 耐燃改质型苯乙烯马来酸酐树脂硬化剂制法与环氧树脂的组合物及其在铜箔基板与胶片应用 | |
| TWI388622B (zh) | And a thermosetting resin composition having an acid anhydride hardening | |
| CN112063113A (zh) | 一种应用于hdi多层板的覆铜板用胶液及其制备方法和应用 | |
| CN114889265A (zh) | 一种适用于高速领域的高可靠性覆铜板及其制备方法 | |
| CN113085301A (zh) | 一种无卤阻燃型覆铜板的制作方法 | |
| CN111704786A (zh) | 一种无卤高Tg中损耗覆铜板用胶液及其制备方法和应用 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201124 |
|
| RJ01 | Rejection of invention patent application after publication |