CN111816366A - Printed electronics, manufacturing method thereof, manufacturing equipment thereof and production line thereof - Google Patents
Printed electronics, manufacturing method thereof, manufacturing equipment thereof and production line thereof Download PDFInfo
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- CN111816366A CN111816366A CN201910293215.XA CN201910293215A CN111816366A CN 111816366 A CN111816366 A CN 111816366A CN 201910293215 A CN201910293215 A CN 201910293215A CN 111816366 A CN111816366 A CN 111816366A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The embodiment of the invention discloses a printed electronic, a manufacturing method thereof, manufacturing equipment thereof and a production line thereof, and relates to the technical field of printed electronic additive manufacturing. The printed electronic manufacturing method comprises the following steps: making a coating layer adhered with the low-melting-point metal on the base material not adhered with the low-melting-point metal; the coating is in accordance with the pattern of the target printed electrons; forming a first metal layer with a first thickness on the coating by using low-melting-point metal, and enabling the first metal layer to be a second metal layer with a second thickness through a metal infiltration effect; wherein the second thickness is greater than the first thickness. The invention realizes thickening of low-melting-point metal printing electrons by utilizing the metal infiltration effect between low-melting-point metal and low-melting-point metal, thereby effectively solving the defect of poor resistance and high conductivity caused by over-thinness of the low-melting-point metal printing electrons.
Description
Technical Field
The invention belongs to the technical field of additive manufacturing, and particularly relates to a printed electronic product, a manufacturing method thereof, manufacturing equipment thereof and a production line thereof.
Background
Printing electronics is an emerging technology that applies traditional printing (or coating) processes to the manufacture of electronic components and products. The electronic paste is one of basic materials in the printed electronics industry, wherein the conductor paste mainly comprises silver paste, aluminum paste, gold paste, copper paste and the like, and is widely applied to the fields of front and back electrodes of solar panels, RFID electronic tags, mobile phone antennas, non-contact IC card antenna circuits and the like. However, the melting points of the metal components of the conductor paste are high, and after sintering, the conductive phase is still in particle contact, so that the contact resistance is high. In contrast, the low-melting-point metal has the characteristics of low melting point, high conductivity, liquid state at normal temperature and good fluidity, and the conductive ink made of the low-melting-point metal can replace electronic paste and is widely applied to the printing electronic industry.
Although the low-melting-point metal has a very wide application prospect as a printing electronic material, for the prior art, the corresponding production process and production equipment are not mature, the fluidity of the low-melting-point metal in a liquid state is extremely high, good adhesion on a printing roller set is difficult to realize, and the thickness of the ink is only a thin layer, so that the printed low-melting-point metal has extremely thin thickness, and the problem of large printing electronic resistance and poor conductivity is caused.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for manufacturing printed electronics, so as to solve the problem that the low-melting-point metal printed electronics produced by the equipment in the prior art has too thin thickness, resulting in large resistance and poor missile performance.
In some illustrative embodiments, the printed electronics fabrication method comprises: making a coating layer adhered with the low-melting-point metal on the base material not adhered with the low-melting-point metal; the coating is in accordance with the pattern of the target printed electrons; forming a first metal layer with a first thickness on the coating by using low-melting-point metal, and enabling the first metal layer to be a second metal layer with a second thickness through a metal infiltration effect; wherein the second thickness is greater than the first thickness.
In some optional embodiments, the making, by the metal wetting effect, the first metal layer into a second metal layer with a second thickness specifically includes: and immersing the base material attached with the first metal layer in a low-melting-point metal pool, and taking out to obtain the second metal layer attached to the base material.
In some optional embodiments, the dipping the substrate attached with the first metal layer in the low-melting metal pool, and taking out to obtain the second metal layer attached to the substrate specifically includes: passing or contacting the substrate attached with the first metal layer with a set speed through or in contact with the low-melting-point metal in the low-melting-point metal pool to obtain a second metal layer attached to the substrate; wherein the set speed is selected according to a target thickness of the second metal layer.
In some optional embodiments, the first metal layer faces upward relative to the substrate during penetration of the substrate with the first metal layer affixed thereto through the low-melting metal in the low-melting metal pool.
In some optional embodiments, the first thickness of the first metal layer is 0.1-10 μm.
In some optional embodiments, the second thickness of the second metal layer is 0.1-1 mm.
Another object of the present invention is to provide a printed electronic obtained by any of the above printed electronic manufacturing methods.
It is a further object of the present invention to provide a printed electronic production apparatus, comprising: a low melting point metal bath, and a guide structure for dipping or contacting the substrate with the low melting point metal in the low melting point metal bath.
In some optional embodiments, the low-melting-point metal material pool contains a low-melting-point metal and a spacer fluid which are layered up and down; the quality of the isolating liquid is lower than that of the low-melting-point metal and is positioned above the low-melting-point metal.
A further object of the invention is to propose a printed electronic assembly line with production links provided with printed electronic production devices as described in any one of the above.
Compared with the prior art, the invention has the following advantages:
the invention realizes thickening of low-melting-point metal printing electrons by utilizing the metal infiltration effect between low-melting-point metal and low-melting-point metal, thereby effectively solving the defect of poor resistance and high conductivity caused by over-thinness of the low-melting-point metal printing electrons.
Drawings
FIG. 1 is a flow chart of a method of printed electronics fabrication in an embodiment of the present invention;
FIG. 2 is a process flow diagram of a method of printed electronics fabrication in an embodiment of the present invention;
FIG. 3 is a schematic diagram of the structure of a printed electronic fabrication apparatus in an embodiment of the present invention;
FIG. 4 is a schematic diagram of the structure of a printed electronic fabrication apparatus in an embodiment of the present invention;
FIG. 5 is a schematic diagram of a printed electronics pipeline in an embodiment of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention discloses a printed electronic manufacturing method, and as shown in fig. 1-2, fig. 1 is a flow chart of the printed electronic manufacturing method in the embodiment of the invention; FIG. 2 is a process flow diagram of a method of fabricating printed electronics in an embodiment of the present invention; the printed electronic manufacturing method comprises the following steps: step S1, manufacturing a coating 2 adhered with the low-melting-point metal on the base material 1 not adhered with the low-melting-point metal; wherein the coating 2 conforms to the pattern of the target printed electrons; step S2, forming a first metal layer 3 of a first thickness on the coating layer 2 using a low melting point metal; step S3, making the first metal layer 3 become a second metal layer 4 with a second thickness by a metal wetting effect; wherein the second thickness is greater than the first thickness.
In step S3, the first metal layer is made into a second metal layer with a second thickness by a metal infiltration effect, specifically, the first metal layer attached on the surface of the substrate is fully contacted with sufficient low melting point metal (the sufficient contact is required to satisfy the complete contact of the first metal layer; the sufficient low melting point metal means that the amount of the low melting point metal in contact with the first metal layer should not be less than the amount of the first metal layer), so that the low melting point metal in contact with the first metal layer is adsorbed on the first metal layer by the metal infiltration effect generated between the low melting point metal and the first metal layer, thereby realizing the thickening of the metal layer.
The invention realizes thickening of low-melting-point metal printing electrons by utilizing the metal infiltration effect between low-melting-point metal and low-melting-point metal, thereby effectively solving the defect of poor resistance and high conductivity caused by over-thinness of the low-melting-point metal printing electrons. Compared with the method for directly adhering the low-melting-point metal through the colloid, the low-melting-point metal is not ideal in adhesion effect directly adhered to the coating and is easy to generate the problem of discontinuous metal slices due to the fact that the low-melting-point metal is not compatible with the material, the high surface tension of the low-melting-point metal and the like, and the low-melting-point metal can be ideally adhered to the coating only by providing a certain contact pressure between the low-melting-point metal and the coating in the middle. The invention utilizes the infiltration effect among metals, has no problem of material incompatibility, and can obtain good adsorption effect without any contact pressure, thereby achieving the purpose of thickening.
The low-melting-point metal in the embodiment of the invention mainly refers to a low-melting-point metal simple substance or a low-melting-point metal alloy with a melting point below 300 ℃. Alternatively, the low-melting metal may be a low-melting metal having a melting point of 250 ℃ or lower, a low-melting metal having a melting point of 220 ℃ or lower, a low-melting metal having a melting point of 200 ℃ or lower, a low-melting metal having a melting point of 180 ℃ or lower, a low-melting metal having a melting point of 125 ℃ or lower, a low-melting metal having a melting point of 120 ℃ or lower, a low-melting metal having a melting point of 75 ℃ or lower, a low-melting metal having a melting point of 55 ℃ or lower, a low-melting metal that is in a liquid state in a normal temperature environment (18 ℃ to 35 ℃), or a low-melting metal having a melting point of 0 ℃ to.
The low-melting-point metal in the embodiment of the invention is in a molten liquid state during manufacturing, and the condition for reaching the molten liquid state is provided by the manufacturing environment; for normal-temperature liquid metal, the low-melting-point metal can be in a surface melting liquid state in a normal-temperature environment, and an additional heating environment is not needed; for normal temperature solid metal, the low melting point metal needs to be brought into a molten liquid state by additionally arranging a heating component.
Specifically, the low-melting-point metal in the embodiment of the present invention may be a gallium simple substance or a gallium-based alloy (such as a gallium-based eutectic alloy), and such low-melting-point metal may be in a liquid state in a normal temperature environment, and is suitable for most printing substrates on the market, such as various fabric materials, wood, paper materials, metal materials, polymer materials, glass, stone materials, and composite materials formed by any combination of the above materials; specifically, the substrate may be glass, ceramic, marble, nylon, fiber fabric, cotton fabric, silica gel, stainless steel, etc., or PET, PI, PVC, PBT, rubber, ABS, coated paper, printing paper, etc. In other embodiments, the low-melting point metal may be a bismuth-based alloy (such as a bismuth-based eutectic alloy), the melting point of the low-melting point metal is between 50 ℃ and 130 ℃, the low-melting point metal is in a molten liquid state during manufacturing by a heating assembly, and the low-melting point metal is suitable for the printing substrate meeting the temperature range; in other embodiments, the low melting point metal may be a tin-based alloy (tin-based eutectic alloy), and the melting point of the low melting point metal is between 150 ℃ and 260 ℃, and the low melting point metal is in a molten liquid state during manufacturing by the heating element, so that the printing substrate satisfying the temperature range can be used.
It should be noted that the effect of adhering or not adhering the low melting point metal in the embodiment of the present invention can be determined through experiments, and can also be determined through the following simpler manner: the base material or the base material attached with the coating is obliquely placed on a test bench, the inclination angle of the base material is 20 degrees, so that low-melting-point metal slurry drops (the volume is 80-120 mu L, for example 80 mu L) drop from a certain height (2-5 cm, for example 2 cm) onto the surface of the base material, if no low-melting-point metal is left on the surface of the base material/coating, the low-melting-point metal is not adhered on the surface of the base material/coating, and if the low-melting-point metal slurry is adhered on the surface of the base material/coating, the low-melting-point metal is adhered on the surface of the base material/coating.
On the basis, the base material which is not adhered with the low-melting-point metal can be selected at will in the market, and the coating material which is adhered with the low-melting-point metal can be selected at will; specifically, the coating material adhered with the low-melting-point metal can be water-based ink, oil-based self-volatile ink, heating curing ink, ultraviolet curing ink, electron beam curing ink, laser curing ink, or colloid substances such as water-based glue and oil-based glue on the market.
For the substrate with poor selectivity of the low-melting-point metal, the surface modification treatment can be firstly carried out on the whole substrate, so that the substrate meets the requirement of not adhering the low-melting-point metal, and then the subsequent steps in the embodiment of the invention are carried out. That is, before step S1, the present invention may further include: step S0, carrying out full-page modification treatment on the base material through the coating which does not adhere to the low-melting-point metal; specifically, the coating material for forming the non-stick low melting point metal can be any one of carbon powder, wax and polytetrafluoroethylene.
In step S3 of the embodiment of the present invention, there are various ways to make the first metal layer become the second metal layer with the second thickness by the metal wetting effect, such as spraying, splashing, dipping, and the like, for example, the substrate attached with the first metal layer is placed obliquely so that the first metal layer faces upward, and then the low melting point metal is poured from top to bottom so that part of the low melting point metal is adsorbed on the first metal layer by the first metal layer under the effect of the metal wetting effect, thereby forming the second metal layer. For example, the base material with the first metal layer attached thereto is directly immersed in a low melting point metal bath, and after being taken out, a second metal layer covering the first metal layer is formed on the surface of the base material. The thickness of the second metal layer is related to the dipping time, and an operator can control the thickness of the second metal layer by controlling the dipping time. Specifically, the base material attached with the first metal layer is immersed in the low-melting metal in a low-melting metal pool, and the second metal layer attached to the base material is obtained after being taken out, and specifically, the following steps are selected: passing or contacting the substrate attached with the first metal layer with a set speed through or in contact with the low-melting-point metal in the low-melting-point metal pool to obtain a second metal layer attached to the substrate; wherein the set speed is selected according to a target thickness of the second metal layer.
Wherein, in the process that the substrate attached with the first metal layer penetrates through the low-melting-point metal in the low-melting-point metal pool, the first metal layer is placed upwards relative to the substrate, so that the first metal layer is completely immersed in the low-melting-point metal and penetrates through the low-melting-point metal, and the thickness of the second metal layer in the embodiment is related to the length of the low-melting-point metal pool, the immersion depth of the substrate in the low-melting-point metal, and the passing speed of the substrate through the low-melting-point metal pool; if the length of the low-melting-point metal material pool is a constant value, the thickness of the second metal layer is only related to the immersion depth and the passing speed, and an operator can set the matched immersion depth and passing speed according to the target thickness, which is not limited by the embodiment of the invention.
Illustratively, the length of the selected low-melting-point metal material pool is 50mm, the immersion depth in the embodiment is set to be 0-5mm, the passing speed is set to be 20mm/s, the thickness of the formed second metal layer can be 0.2-0.5mm, the detection sheet resistance of the second metal layer is 10m omega/Sq, and the printed electrons have good conductive performance.
In other embodiments, the first metal layer is placed downward relative to the substrate during the process of the substrate attached with the first metal layer penetrating through the low melting point metal in the low melting point metal pool, the embodiment can control the moving first metal layer to just contact with the low melting point metal in the low melting point metal pool, and the thickness of the second metal layer is controlled by the passing speed of the substrate under the condition that the length of the low melting point metal pool is a constant value. In other embodiments, in which the first metal layer is disposed downward, the substrate may be immersed in the low-melting-point metal to a certain depth.
The formation of the first metal layer on the coating layer by using the low melting point metal in step S2 according to the embodiment of the present invention can also be achieved in various ways, such as offset printing, flexo printing, gravure printing, transfer printing, silk screen printing, steel screen printing, pad printing, etc., so that the first metal layer is stably adhered to the coating layer under a certain printing pressure, thereby ensuring the stability of the first metal layer adhered to the substrate and the stability of the second metal layer adhered to the substrate.
The thickness of the first metal layer printed in the above manner may be 0.1-50 μm, and then may be thickened to 1mm after passing through step S3; specifically, for pure low melting point metal, the first metal layer is formed to have a thickness of substantially 0.1 to 10 μm due to its extremely high surface tension; for the low melting point metal mixed with the conductive particles, the surface tension is reduced due to the mixing of the conductive particles, the low melting point metal is more easily adhered to a plate roll or a rubber head, and the thickness of the formed first metal layer can be 5-50 μm.
Preferably, the thickness of the first metal layer in the embodiment of the present invention is 0.5 to 10 μm, and the thickness of the second metal layer is 0.1 to 0.5 mm. The thickness ranges of the first metal layer and the second metal layer in this embodiment may provide a stable structure for printed electronics, as well as good conductivity.
In some embodiments, the low melting metal bath further comprises a spacer fluid floating above the low melting metal; the isolating liquid is used for isolating low-melting-point metal in the low-melting-point metal material pool from contacting with the outside; in the process of dipping the base material or passing through the low-melting-point metal, the base material attached with the first metal layer penetrates through the isolating liquid to enable the first metal layer to be in contact with the low-melting-point metal in the low-melting-point metal material pool.
The spacer fluid may be a solution that does not chemically react with the low melting point metal, such as a neutral solution of a salt solution, water, alcohol, or the like.
The arrangement of the isolating liquid in the embodiment can reduce the oxidation degree of the low-melting-point metal in the low-melting-point metal material pool as far as possible, so that the purity of the low-melting-point metal in the material pool is ensured, and the possibility that the surface oxide of the low-melting-point metal is attached to the first metal layer on the entered base material and the precision of the circuit is influenced by adhesion is reduced.
Further, the isolating solution may be a solution that does not chemically react with the low melting point metal but chemically reacts with the oxide of the low melting point metal, such as a sodium hydroxide solution, a hydrochloric acid solution, a citric acid solution, an oxalic acid solution, an acetic acid solution, and the like, so as to eliminate the oxide in the low melting point metal.
Alternatively, the separating liquid may be an electrolyte that does not chemically react with the low-melting-point metal, such as a salt solution (e.g., sodium chloride), and when energized, the oxide forms a corresponding salt that dissolves in the electrolyte and reduces a portion of the low-melting-point metal. Wherein the electrolyte contacts the positive electrode, the low-melting metal contacts the negative electrode, and oxides on the surface of the low-melting metal can be eliminated.
The printed electron manufacturing method in the embodiment of the invention can not only solve the problem that the printed electron of the low-melting-point metal manufactured by the existing printing equipment is too thin, and achieve the effect of good conductive performance, but also can effectively ensure the printed electron precision, firstly, in consideration of flatness, the very thin thickness of the first metal layer causes the first metal layer to have good flatness, in the process of forming the second metal layer by infiltration, each position of the first metal layer contacts the low-melting-point metal under the same condition, so that the second metal layer has good flatness, and then the formed second metal layer can be leveled slowly by means of flatly placing the base material, so that the flatness of the second metal layer is further ensured; in addition, in the aspect of line distance, the line distance precision of the printed electronic manufacturing method in the embodiment of the invention can reach 0.2 mm; therefore, the printed electronics can be provided with good print quality. Meanwhile, the thickness of the second metal layer formed by adsorption through the wetting effect is controlled to be less than 1mm, and the low-melting-point metal in the formed second metal layer can be stably attached to the first metal layer due to the wetting force provided by the first metal layer, so that the problem of overflow is avoided even under the influence of a large shaking degree, and the stability of printed electrons is guaranteed.
In some embodiments, the method for manufacturing printed electronics of the present invention may further include: step S4, performing a packaging process on the second metal layer attached to the substrate by using a packaging material, so as to further stabilize the second metal layer and isolate air. Specifically, the encapsulating material may be a polymer such as epoxy resin, polyurethane, or silicone, and in view of the curing method, the encapsulating material may be a thermosetting type, an electron irradiation curing type, an ultraviolet curing type, or a self-volatilization curing type. In other embodiments, the encapsulating material may also be an encapsulating material such as a film, sheet, or the like.
In some embodiments, between step 3 and step 4 of the method for manufacturing printed electronics in the embodiments of the present invention, the method may further include: and S3.5, mounting and/or inserting electronic components on the second metal layer to form printed electrons with different functions. Specifically, the electronic component may be various components such as a resistor, an inductor, a capacitor, a diode, a transistor, an LED, a control chip, a sound generator, and the like. The operator can assemble the corresponding electronic components according to the actual requirements of the printed electronics so as to achieve the target functions of the printed electronics.
In some embodiments, the method for manufacturing printed electronics in the embodiments of the present invention may not need to perform step S4 to meet the needs of the application scenario or the user.
Another object of the present invention is to provide a printed electronic obtained by any of the above printed electronic manufacturing methods. Specifically, the low-melting-point metal in the printed electronics can be kept in a liquid state in a suitable environment, has extremely strong flexibility, is suitable for being matched with a flexible base material to manufacture flexible printed electronics, and can continuously keep a good conductive conduction effect under the condition that the printed electronics are stretched by 200% even when the flexible base material with certain elastic deformation capacity is selected.
Specifically, the printed electronics may be FPC or RFID; for the FPC board, the second metal layer forms a circuit or a local circuit on the FPC board, and realizes the function of circuit interconnection under the condition that electronic elements are not assembled, and simultaneously realizes the corresponding function of the electronic elements under the condition that the electronic elements are assembled. For the RFID tag, the second metal layer constitutes a tag antenna of the RFID tag, and may be used as a chipless tag when a tag chip is not mounted, or may be used as a chip tag when a tag chip is mounted.
The printed electronics in the embodiments of the present invention may have the following layer structure in order: a substrate, a coating, a second metal layer; or else: the packaging structure comprises a substrate, a coating, a second metal layer and a packaging layer; or the following steps: a substrate, a coating, a second metal layer provided with an electronic element, and an encapsulation layer. Some structures of the printed electronics in the embodiments of the present invention are shown only by way of example, and it should be understood by those skilled in the art that the printed electronics in the embodiments of the present invention may include other structures besides the above examples, and thus are not described herein again.
It is a further object of the present invention, as shown in fig. 3, to propose a printed electronic production device comprising: a low melting point metal bath 20, and a guide structure 40 for dipping or contacting the substrate 10 into or with the low melting point metal 30 in the low melting point metal bath 20.
Preferably, the guide structure 40 in the embodiment of the present invention is a guide roller set structure, which is used to support the substrate and provide the substrate to move along a set path. More specifically, the guide roller set is supported at both ends (i.e., each pair of rollers, consisting of two rollers on the left and right), and is disposed to contact only the non-printed area of the substrate, thereby avoiding the problem of scratching the printed area. The guide roller sets may be fixed on the inner wall of the material bath and/or on the outer support structure.
In some embodiments, the low melting point metal pool 20 contains the low melting point metal 30 and the isolating liquid 50 layered up and down; the spacer liquid 50 has a lower mass than the low melting point metal 30 and is located above the low melting point metal 30. In this embodiment, the low melting point metal material pool plays a role of oxygen-barrier protection for the low melting point metal through the isolating liquid floating on the low melting point metal, and the isolating liquid is selected from a liquid which does not produce a chemical reaction with the low melting point metal and has a lower mass than the low melting point metal, such as water, alcohol, sodium chloride solution, and the like. Preferably, the isolating solution is an acidic or alkaline solution that does not react with the low-melting metal and reacts with the low-melting metal oxide, such as sodium hydroxide solution, hydrochloric acid solution, citric acid solution, oxalic acid solution, and acetic acid solution. This embodiment can avoid the formation oxide impurity of the low melting point metal in the feed pool through the setting of spacer fluid, through still can eliminate the oxide that forms on first metal layer to a certain extent to further ensure the electric conductive property of second metal layer.
In addition, the isolating liquid may be electrolyte without chemical reaction with the low melting point metal, such as salt solution (e.g. sodium chloride), and the oxide may be dissolved in the electrolyte to form corresponding salt under the condition of power supply, and part of the low melting point metal may be reduced. Wherein the electrolyte contacts the positive electrode, the low-melting metal contacts the negative electrode, and oxides on the surface of the low-melting metal can be eliminated.
Referring to fig. 4, in some embodiments, the low-melting-point metal bath has a feeding portion 21 and a discharging portion 22, the feeding portion 21 is used for introducing the substrate into the bath to be impregnated or contacted with the low-melting-point metal 30 therein, and the discharging portion 22 is used for guiding the substrate impregnated or contacted with the low-melting-point metal 30 out of the bath. In some embodiments, the feeding part is of a top-down inclined structure, and the discharging part is of a bottom-up inclined structure; preferably, the feeding part and the discharging part are in mirror symmetry structures. The low melting point metal bath shown in this example can reduce the guiding amplitude of the substrate in the low melting point metal bath, thereby reducing the possibility of mechanical drawing. In some embodiments, the surfaces of the infeed section and/or outfeed section may be cambered surfaces.
A further object of the invention is to propose a printed electronic assembly line with production links provided with printed electronic production devices as described in any one of the above. Specifically, a printing mechanism for printing a low melting point metal on a substrate to form a first metal layer and the printed electronic manufacturing device in any of the above embodiments may be installed on the printed electronic pipeline, and the printed electronic manufacturing device is located downstream of the printing mechanism. The printing mechanism can adopt the printing modes of offset printing, flexible plate printing, gravure printing, transfer printing, silk screen printing, steel screen printing, pad printing and the like.
In one embodiment, the printing mechanism includes: an ink form roller 51, and a printing roller 52, an ink outlet roller 53, an ink distributing roller 54, and an ink oscillating roller 55 directly engaged with the ink form roller 51; an ink tank 55 and a roller blade 56 are arranged below the ink outlet roller 53. The substrate 10 passes between the form roller 51 and the impression roller 52 and then through the guide structure 40 into and through the low melting metal bath 20.
In some embodiments, a printing mechanism for forming a coating of adherent low melting point metal on a substrate may be provided upstream of the printing mechanism in the printing electronics line, and may be any printer or printer commercially available that can produce such a coating.
In some embodiments, a packaging mechanism for packaging the substrate may also be provided downstream of the low melting point metal reservoir in the printing electronics pipeline.
In some embodiments, a mounting mechanism for mounting or inserting an electronic component on the second metal layer may be further disposed between the low melting point metal pool and the packaging mechanism in the printing electronic pipeline.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (10)
1. A method of printed electronics fabrication, comprising:
making a coating layer adhered with the low-melting-point metal on the base material not adhered with the low-melting-point metal; the coating is in accordance with the pattern of the target printed electrons;
forming a first metal layer with a first thickness on the coating by using molten low-melting-point metal, and enabling the first metal layer to be a second metal layer with a second thickness through a metal infiltration effect;
wherein the second thickness is greater than the first thickness.
2. The method according to claim 1, wherein the step of forming the first metal layer into a second metal layer of a second thickness by a metal wetting effect comprises:
and immersing the base material attached with the first metal layer in a low-melting-point metal pool in which molten low-melting-point metal is stored, and taking out the base material to obtain the second metal layer attached to the base material.
3. The printed electronic manufacturing method according to claim 2, further comprising a spacer fluid floating above the low melting point metal in the low melting point metal pool; the isolating liquid is used for isolating low-melting-point metal in the low-melting-point metal material pool from contacting with the outside;
the dipping of the base material attached with the first metal layer in a low-melting-point metal pool storing a molten low-melting-point metal specifically includes:
and enabling the base material attached with the first metal layer to pass through the isolating liquid so that the first metal layer is contacted with the low-melting-point metal in the low-melting-point metal material pool.
4. The method of claim 3, wherein the spacer is a solution that is non-reactive with the low-melting metal and reactive with an oxide of the low-melting metal; or the isolating solution is electrolyte which does not react with the low-melting-point metal.
5. The method according to claim 2, wherein the step of immersing the substrate attached with the first metal layer in a low melting point metal pool storing a molten low melting point metal and taking out the substrate to obtain the second metal layer attached to the substrate comprises:
passing or contacting the substrate attached with the first metal layer with a set speed through or in contact with the low-melting-point metal in the low-melting-point metal pool to obtain a second metal layer attached to the substrate;
wherein the set speed is selected according to a target thickness of the second metal layer.
6. The printed electronics fabrication method of claim 1, wherein the first thickness of the first metal layer is 0.1-10 μ ι η; and/or the second thickness of the second metal layer is 0.1-1 mm.
7. Printed electronics, characterized in that it is obtained by a method for manufacturing printed electronics according to any one of claims 1 to 6.
8. A printed electronic fabrication apparatus, comprising: a low melting point metal pool storing the low melting point metal in a molten state, and a guide structure for dipping or contacting the base material with the low melting point metal in the low melting point metal pool.
9. The printed electronics fabrication apparatus of claim 8, further comprising a spacer fluid floating in the low-melting metal reservoir; the isolating liquid is used for isolating low-melting-point metal in the low-melting-point metal material pool from contacting with the outside.
10. A printed electronics assembly line having printed electronics fabrication equipment according to claim 8 or 9 in a production run.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112497915A (en) * | 2020-12-01 | 2021-03-16 | 浙江聚众柔印科技有限公司 | Impression roller ink scraping device for flexographic printing machine |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB734079A (en) * | 1951-12-27 | 1955-07-27 | Victor Emmanuel Yarsley | Improvements in or relating to methods and apparatus for the production of resin-bonded materials |
| JPH0799384A (en) * | 1993-09-29 | 1995-04-11 | Toppan Printing Co Ltd | Printed wiring board and manufacturing method thereof |
| JPH09170083A (en) * | 1995-12-20 | 1997-06-30 | Mitsubishi Electric Corp | Electroless plating method for tin or tin alloy |
| JPH1154926A (en) * | 1997-06-06 | 1999-02-26 | Ibiden Co Ltd | One-sided circuit board and its manufacture |
| JP2001135916A (en) * | 1999-11-04 | 2001-05-18 | Ibiden Co Ltd | Manufacturing method for printed wiring board |
| JP2011058051A (en) * | 2009-09-10 | 2011-03-24 | Hitachi Cable Ltd | Method for hot-dipping wire |
| CN102352446A (en) * | 2011-08-19 | 2012-02-15 | 帅鹏 | Antioxidation reducing agent for tin or tin alloy |
| CN108511349A (en) * | 2018-03-27 | 2018-09-07 | 北京大学东莞光电研究院 | Metallization method of a ceramic substrate |
| CN108770222A (en) * | 2018-06-22 | 2018-11-06 | 北京梦之墨科技有限公司 | A kind of printing process of low-melting-point metal |
| CN209766120U (en) * | 2019-04-12 | 2019-12-10 | 北京梦之墨科技有限公司 | Printed electronic manufacturing equipment and assembly line thereof |
-
2019
- 2019-04-12 CN CN201910293215.XA patent/CN111816366A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB734079A (en) * | 1951-12-27 | 1955-07-27 | Victor Emmanuel Yarsley | Improvements in or relating to methods and apparatus for the production of resin-bonded materials |
| JPH0799384A (en) * | 1993-09-29 | 1995-04-11 | Toppan Printing Co Ltd | Printed wiring board and manufacturing method thereof |
| JPH09170083A (en) * | 1995-12-20 | 1997-06-30 | Mitsubishi Electric Corp | Electroless plating method for tin or tin alloy |
| JPH1154926A (en) * | 1997-06-06 | 1999-02-26 | Ibiden Co Ltd | One-sided circuit board and its manufacture |
| JP2001135916A (en) * | 1999-11-04 | 2001-05-18 | Ibiden Co Ltd | Manufacturing method for printed wiring board |
| JP2011058051A (en) * | 2009-09-10 | 2011-03-24 | Hitachi Cable Ltd | Method for hot-dipping wire |
| CN102352446A (en) * | 2011-08-19 | 2012-02-15 | 帅鹏 | Antioxidation reducing agent for tin or tin alloy |
| CN108511349A (en) * | 2018-03-27 | 2018-09-07 | 北京大学东莞光电研究院 | Metallization method of a ceramic substrate |
| CN108770222A (en) * | 2018-06-22 | 2018-11-06 | 北京梦之墨科技有限公司 | A kind of printing process of low-melting-point metal |
| CN209766120U (en) * | 2019-04-12 | 2019-12-10 | 北京梦之墨科技有限公司 | Printed electronic manufacturing equipment and assembly line thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112497915A (en) * | 2020-12-01 | 2021-03-16 | 浙江聚众柔印科技有限公司 | Impression roller ink scraping device for flexographic printing machine |
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