CN111799389A - Flexible organic electroluminescent display panel and display device - Google Patents
Flexible organic electroluminescent display panel and display device Download PDFInfo
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- CN111799389A CN111799389A CN201910274868.3A CN201910274868A CN111799389A CN 111799389 A CN111799389 A CN 111799389A CN 201910274868 A CN201910274868 A CN 201910274868A CN 111799389 A CN111799389 A CN 111799389A
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-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a flexible organic electroluminescent display panel and a display device, wherein the display panel comprises a flexible substrate; the thin film transistor array layer is positioned on one side of the flexible substrate; the light-emitting device comprises a pixel defining layer and a light-emitting device layer, wherein the light-emitting device layer comprises an anode layer, a light-emitting functional layer and a cathode layer which are sequentially stacked on the thin film transistor array layer, and the cathode layer covers the pixel defining layer and the light-emitting functional layer; the Tape angle of the pixel definition layer is alpha; a thin film encapsulation structure directly covering the cathode layer; the Tape angle of the thin film packaging layer is beta, wherein beta is not more than alpha. The organic electroluminescent display panel does not need a protective cover plate or a supporting column for supporting the cover plate, so that the Tape angle of the film packaging layer can be effectively reduced, the probability of packaging failure caused by microcracks generated by bending of the film packaging structure is reduced, and the service life of the organic electroluminescent display panel is prolonged.
Description
Technical Field
The invention relates to the field of display, in particular to a flexible organic electroluminescent display panel and a display device.
Background
With the continuous development of society, mobile phones, computers and televisions all need to use visual screens, and the demand of people on the display screens is higher and higher. Organic electroluminescent Display panels (Organic electroluminescence) are widely used in the Display field as a self-luminous Display technology, in which a very thin Organic material coating and a substrate are used, and when a current flows, the Organic material emits light, and the Organic electroluminescent Display panels have a large viewing angle and can significantly save electric energy.
The organic electroluminescent display panel may be further classified into a rigid panel and a flexible panel. Compared with the traditional display panel, the organic electroluminescent flexible panel has obvious advantages, is lighter and thinner in size, is lower than the original device in power consumption, and is beneficial to improving the cruising ability of equipment.
The process for manufacturing an organic electroluminescent display panel generally includes:
providing a substrate;
preparing a thin film transistor array layer on the substrate;
preparing an anode layer on one side of the thin film transistor array layer far away from the substrate; the anode layer is composed of a plurality of anodes formed by the patterned conductive film layer;
preparing a Pixel Definition Layer (PDL) on a side of the anode layer away from the substrate;
preparing a support pillar on a side of the pixel defining layer away from the anode layer;
preparing an organic light-emitting functional layer on one side of the anode layer far away from the substrate;
preparing a cathode layer on one side of the pixel defining layer and the organic light-emitting functional layer far away from the substrate;
the packaging thin film layer is prepared on one side of the cathode layer, which is far away from the substrate, and the thin film packaging layer can isolate a pixel (light-emitting) element from water vapor and oxygen in the surrounding environment because the organic material is quite sensitive to oxygen and water vapor, so that the pixel (light-emitting) element is prevented from being corroded by water and oxygen.
In the preparation process, the support columns are periodically arranged on the pixel defining layer, one function of the support columns is to support a subsequent evaporation mask plate of the organic light-emitting functional material, and the other function of the support columns is to support the cover plate glass. Generally, since the support pillar is above the pixel definition layer, the tape angle of the cathode layer or the thin film encapsulation layer prepared after the support pillar is increased, and the tape angle of the cathode layer is increased to make the cathode layer electrode too thin, thereby causing open circuit or uneven conduction; meanwhile, when the tape angle of the film packaging layer is increased, the probability that the film packaging layer is broken or cracked is increased, and the packaging life of the film packaging layer and the service life of the display panel are shortened.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present invention and therefore may include information that does not constitute prior art known to a person of ordinary skill in the art.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a flexible organic electroluminescent display panel and a display device, which can reduce the micro-crack of a thin film packaging layer caused by the folding of a display panel bending area and reduce the probability of packaging failure by reducing the Tape angle of the thin film packaging layer.
An embodiment of the present invention provides an organic electroluminescent display panel including:
a flexible substrate;
the thin film transistor array layer is positioned on one side of the flexible substrate;
the light-emitting device layer comprises an anode layer, a light-emitting functional layer and a cathode layer, wherein the anode layer, the light-emitting functional layer and the cathode layer are sequentially stacked on the thin film transistor array layer and are composed of a plurality of anodes, and the cathode layer covers the pixel defining layer and the light-emitting functional layer;
the Tape angle of the pixel definition layer is alpha;
a thin film encapsulation layer directly covering the cathode layer;
the Tape angle of the thin film packaging layer is beta, wherein beta is not more than alpha.
According to an example of the present invention, the Tape angle α of the pixel defining layer is between 0 and 40 °.
According to an example of the present invention, the thin film encapsulation structure includes a plurality of thin film layers.
According to an example of the present invention, the thickness of the thin film encapsulation structure is 1um to 20 um.
According to an example of the present invention, the thin film encapsulation structure includes at least an inorganic thin film layer and an organic thin film layer, and the inorganic thin film layer and the organic thin film layer are alternately stacked.
According to an example of the present invention, the thin film encapsulation structure is an inorganic thin film layer/an organic thin film layer/an inorganic thin film layer.
According to an example of the present invention, the thin film encapsulation layer is prepared by one or more of coating, chemical vapor deposition, physical vapor deposition or atomic layer deposition.
Embodiments of the present invention also provide an organic electroluminescent display device including the above organic electroluminescent display panel.
The organic electroluminescence display panel provided by the invention adopts a support-pillar-free structure, and can effectively reduce the Tape angle of the thin film packaging layer, thereby reducing the probability of packaging failure caused by microcracks appearing in the thin film packaging structure due to bending and prolonging the service life of the organic electroluminescence display panel.
Drawings
Other features, objects, and advantages of the invention will be apparent from the following detailed description of non-limiting embodiments, which proceeds with reference to the accompanying drawings and which is incorporated in and constitutes a part of this specification, illustrating embodiments consistent with the present application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of a flexible organic electroluminescent display panel according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a flexible organic electroluminescent display panel according to yet another embodiment of the present invention;
reference numerals
100 flexible substrate
200 thin film transistor array layer
300 pixel definition layer
310 light emitting device layer
311 anode layer
312 light emitting functional layer
313 cathode layer
400 thin film packaging structure
401 first inorganic thin film layer
402 organic thin film layer
403 second inorganic thin film layer
501 first planarization layer
502 second planarization layer
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention can be practiced without one or more of the specific details, or with other methods, components, and so forth. In some instances, well-known structures or operations are not shown or described in detail to avoid obscuring the invention.
Fig. 1 is a schematic structural diagram of a flexible organic electroluminescent display panel according to an embodiment of the present invention. Specifically, the flexible organic electroluminescent display panel includes:
the flexible substrate 100 may have a structure with a single-layer or multi-layer flexible substrate film, and the flexible substrate film may be made of a flexible substrate material such as Polyimide (PI), polyethylene terephthalate (PET), polybutylene naphthalate (PBN), or polycarbonate, or may be made of a material such as a metal foil. In the present embodiment, the flexible substrate 100 employs a single PI film. In other embodiments of the present invention, the flexible substrate 100 may be a multilayer PI film, or a multilayer PET film, or have a multilayer film structure in which PI films and PET are alternately laminated.
And a thin film transistor array layer 200 on one side of the flexible substrate 100, i.e., on the upper surface of the flexible substrate 100 in fig. 1.
The pixel defining layer 300 and the light emitting device layer 310 are located on one side of the thin film transistor array 200 away from the flexible substrate 100, the light emitting device layer 310 includes an anode layer 311, a light emitting functional layer 312 and a cathode layer 313, which are sequentially stacked and arranged on the thin film transistor array layer and are composed of a plurality of anodes, and the cathode layer 313 covers the pixel defining layer 300 and the light emitting functional layer 312.
The anode layer 311 in the light emitting device layer 310 is made of a conductive thin film. The anode layer 311 is composed of an anode that is an anode of each pixel in the display panel, and may be obtained by a conductive film patterned on the upper surface of the thin film transistor array layer 200 by evaporation or sputtering, and the material of the conductive film includes a film of a simple substance of metal elements of aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na), gold (Au), silver (Ag), copper (Cu), chromium (Cr), platinum (Pt), and nickel (Ni), or an alloy thereof; or an oxide such as Indium Tin Oxide (ITO), indium zinc oxide (InZnO), zinc oxide (ZnO), or the like. The thickness of anode layer 311 may be between 10nm and 500nm, preferably between 20nm and 150 nm.
The light emitting function Layer 312 may include an Electron Injection Layer (EIL), an Electron Transport Layer (ETL), an organic light emitting Layer, a Hole Transport Layer (HTL), a Hole Injection Layer (HIL), and an insulating Layer (not shown) between each of the Transport layers and the anode Layer 311 or the cathode Layer 313, which are stacked between the anode Layer 311 and the cathode Layer 313. The light-emitting functional layer of the present invention can be selectively designed according to the actual requirements of each product on the light-emitting brightness and the light-emitting efficiency.
Similarly, the cathode layer 313 in the light emitting device layer 310 may be made of a conductive thin film prepared by various methods, and the material of the conductive thin film includes a thin film of a simple substance of metal elements of aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na), gold (Au), silver (Ag), copper (Cu), chromium (Cr), platinum (Pt), nickel (Ni), or an alloy thereof; or an oxide such as Indium Tin Oxide (ITO), indium zinc oxide (InZnO), zinc oxide (ZnO), or the like. The thickness may be between 10nm and 500 nm.
As shown in fig. 1, the pixel defining layer 300 covers the edge of each anode in the anode layer 311, and an anode, a light emitting function layer and a cathode layer constitute one pixel of the organic electroluminescent display panel, and the pixels are separated by the pixel defining layer 300. Each anode may be divided into an edge-ineffective light emitting region covered by the pixel defining layer 300 and a light emitting region not covered by the pixel defining layer 300. In the embodiment of the present invention, the cross section of the pixel defining layer 300 is trapezoid, and the bottom angle of the trapezoid is defined as a tape angle α of the pixel defining layer, as shown in fig. 1, α may be between 0 to 40 °, and since the cathode layer 313 directly covers the pixel defining layer 300, when the tape angle of the pixel defining layer 300 is large, the tape angle of the cathode layer 313 prepared thereon and the encapsulation film structure is also large. The increased tape angle of the cathode layer makes the cathode layer electrode too thin, resulting in open circuits or non-uniform conduction; meanwhile, when the tape angle of the film packaging layer is increased, the probability that the film packaging layer is broken or cracked is increased, and the packaging life of the film packaging layer and the service life of the display panel are shortened.
In the embodiment of the present invention, the tape angle of the pixel defining layer 300 is 0 to 40 °, and the thickness of the pixel defining layer 300 is 0 to 3 um. Preferably, the Tape angle α of the pixel definition layer of the present invention is between 0-10 ° angle.
In the embodiment of the present invention, the thin film encapsulation structure 400 directly covers the cathode layer 313, i.e. the thin film encapsulation structure 400 directly covers the pixel defining layer 300 and the light emitting device layer 310. At the pixel defining layer 300, since the flexible organic electroluminescent display panel of the present invention does not need to provide a support pillar between the pixel defining layer 300 and the cathode layer 313, the Tape angle β of the thin film encapsulation layer 400 is not greater than α. Compared with the display panel provided with the supporting columns, the Tape angle beta of the film packaging layer is not more than alpha, so that the probability that the packaging effect is lost due to microcracks of the film packaging structure is reduced, and the service life of the organic electroluminescent display panel is prolonged.
To better serve as a water and oxygen barrier, the film package 400 may include multiple film layers, each of which may have complementary properties. The inorganic thin film layer has higher compactness and is mainly used for blocking the invasion of water and oxygen, but the inorganic thin film layer has lower elasticity and larger internal stress and is easier to crack or peel under the action of internal force or external force; the organic film layer has strong flexibility and can be used for reducing the stress of the film packaging structure.
In an embodiment of the present invention, the thin film package structure 400 includes at least an inorganic thin film layer and an organic thin film layer, and the inorganic thin film layer and the organic thin film layer are alternately stacked.
The material of the inorganic thin film layer includes, but is not limited to, oxide, nitride, oxynitride, carbonitride, fluoride, sulfide, or a mixture of the above materials. Wherein, the oxide includes but is not limited to aluminum oxide, zirconium oxide, zinc oxide, titanium oxide, magnesium oxide, silicon oxide, tantalum oxide, hafnium oxide, cerium oxide, tin oxide, boron oxide, gallium oxide, thallium oxide, calcium oxide; nitrides include, but are not limited to, silicon nitride, zirconium nitride, aluminum nitride, titanium nitride, tantalum nitride, hafnium nitride, cerium nitride, tin nitride, preferably silicon nitride; oxynitrides include, but are not limited to, silicon oxynitride, aluminum oxynitride, titanium oxynitride; carbonitrides include, but are not limited to, silicon carbonitride; fluorides include, but are not limited to, magnesium fluoride, sodium fluoride, lithium fluoride; sulfides include, but are not limited to, titanium disulfide, iron sulfide, dichromium trisulfide, copper sulfide, zinc sulfide, tin disulfide, nickel sulfide, cobaltosic sulfide, antimonous trisulfide, lead sulfide, dillenium trisulfide, cerium sulfide, zirconium disulfide, and the like.
The material of the organic thin film layer includes, but is not limited to, any one or a combination of acrylic-based polymer, silicon-based polymer or epoxy-based polymer. For example, epoxy, acrylate, polyimide resin, silicone, PET, PI (polyimide), PC (polycarbonate), polyethylene terephthalate, polymethacrylate, polystyrene, or polyester.
The thin film encapsulation layer 400 can be prepared by one or more of coating, chemical vapor deposition, physical vapor deposition, or atomic layer deposition.
Fig. 2 is a schematic structural diagram of a flexible organic electroluminescent display panel according to another embodiment of the present invention, in which a film encapsulation structure 400 includes a first inorganic thin film layer 401, an organic thin film layer 402, and a second inorganic thin film layer 403, and the two inorganic thin film layers wrap one organic thin film layer structure, where the organic thin film layer has high elasticity and can be used as a buffer layer to effectively inhibit cracking of the inorganic thin film layer to a certain extent.
Generally, the greater the thickness of the film encapsulation structure 400 is, the better the anti-moisture performance thereof is, the thickness of the film encapsulation structure 400 may be between 1um to 20um, but an excessively thick film encapsulation structure will cause the flexible display panel not to obtain a good flexible bending effect, and preferably, the thickness of the film encapsulation structure 400 is between 2um, 5um, 6um, 7um or 8 um.
The flexible organic electroluminescent display panel of the present invention may further include a planarization layer, as in the embodiment of fig. 2, the planarization layer includes a first planarization layer 501 with a thickness of 2-15um and a second planarization layer 502 with a thickness of 0.5-3 um.
The embodiment of the invention also provides an organic electroluminescent display device which comprises the organic electroluminescent display panel. In specific implementation, the organic electroluminescent display panel provided in the embodiments of the present disclosure may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a media player, a watch device, a pendant device, an earphone or a headphone device, a navigation device, a wearable or miniature device, an embedded device of a system in which an electronic device having a display is installed in a self-service terminal or an automobile, and the like.
In summary, the present invention provides an organic electroluminescent display panel and a display device, wherein the organic electroluminescent display panel includes a flexible substrate; the thin film transistor array layer is positioned on one side of the flexible substrate; the light-emitting device comprises a pixel defining layer and a light-emitting device layer, wherein the pixel defining layer and the light-emitting device layer are positioned on one side, away from the flexible substrate, of the thin film transistor array layer; the Tape angle of the pixel definition layer is alpha; a thin film encapsulation layer directly covering the cathode layer; the Tape angle of the thin film packaging layer is beta, wherein beta is not more than alpha. The organic electroluminescent display panel does not need a protective cover plate or a supporting column for supporting the cover plate, so that the Tape angle of the film packaging layer can be effectively reduced, the probability that the film packaging structure loses packaging effect due to microcracks is reduced, and the service life of the organic electroluminescent display panel is prolonged.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. A plurality of units or means recited in the apparatus claims may also be implemented by one unit or means in software or hardware. It is to be understood that the terms "lower" or "upper", "downward" or "upward" and the like are used to describe features of the exemplary embodiments with reference to the positions of such features as displayed in the figures; the terms first, second, etc. are used to denote names, but not any particular order.
Claims (8)
1. A flexible organic electroluminescent display panel, comprising:
a flexible substrate;
the thin film transistor array layer is positioned on one side of the flexible substrate;
the light-emitting device layer comprises an anode layer, a light-emitting functional layer and a cathode layer, wherein the anode layer, the light-emitting functional layer and the cathode layer are sequentially stacked on the thin film transistor array layer and are composed of a plurality of anodes, and the cathode layer covers the pixel defining layer and the light-emitting functional layer;
the Tape angle of the pixel definition layer is alpha;
a thin film encapsulation structure directly covering the cathode layer;
the Tape angle of the thin film packaging layer is beta, wherein beta is not more than alpha.
2. The flexible organic electroluminescent display panel according to claim 1, wherein: the pixel defining layer has a Tape angle α between 0 and 40 °.
3. The flexible organic electroluminescent display panel according to claim 1, wherein: the thin film encapsulation structure comprises a plurality of thin film layers.
4. The flexible organic electroluminescent display panel according to claim 1, wherein: the thickness of the film packaging structure is 1um-20 um.
5. The flexible organic electroluminescent display panel according to claim 1, wherein: the film packaging structure comprises at least one inorganic film layer and one organic film layer, and the inorganic film layer and the organic film layer are alternately stacked.
6. The flexible organic electroluminescent display panel according to claim 5, wherein: the thin film encapsulation structure is an inorganic thin film layer/an organic thin film layer/an inorganic thin film layer.
7. The flexible organic electroluminescent display panel according to claim 1, wherein: the thin film packaging layer adopts one or more preparation modes of coating, chemical vapor deposition, physical vapor deposition or atomic layer deposition.
8. An organic electroluminescent display device comprising the flexible organic electroluminescent display panel according to any one of claims 1 to 7.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420948A (en) * | 2020-11-16 | 2021-02-26 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN113113426A (en) * | 2021-03-19 | 2021-07-13 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020074936A1 (en) * | 2000-09-18 | 2002-06-20 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating the display device |
| CN101582442A (en) * | 2008-05-16 | 2009-11-18 | 索尼株式会社 | Display unit |
| US20140021856A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Display Co., Ltd. | Flexible organic light-emitting display apparatus and method of manufacturing the same |
| US20150060822A1 (en) * | 2013-08-30 | 2015-03-05 | Japan Display Inc. | Organic el display device |
| CN106384744A (en) * | 2016-11-16 | 2017-02-08 | 信利(惠州)智能显示有限公司 | Organic light emitting display device and manufacturing method thereof |
| CN108550617A (en) * | 2018-06-22 | 2018-09-18 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109216406A (en) * | 2017-06-30 | 2019-01-15 | 昆山国显光电有限公司 | OLED display panel and preparation method thereof |
-
2019
- 2019-04-08 CN CN201910274868.3A patent/CN111799389A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020074936A1 (en) * | 2000-09-18 | 2002-06-20 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating the display device |
| CN101582442A (en) * | 2008-05-16 | 2009-11-18 | 索尼株式会社 | Display unit |
| US20140021856A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Display Co., Ltd. | Flexible organic light-emitting display apparatus and method of manufacturing the same |
| US20150060822A1 (en) * | 2013-08-30 | 2015-03-05 | Japan Display Inc. | Organic el display device |
| CN106384744A (en) * | 2016-11-16 | 2017-02-08 | 信利(惠州)智能显示有限公司 | Organic light emitting display device and manufacturing method thereof |
| CN109216406A (en) * | 2017-06-30 | 2019-01-15 | 昆山国显光电有限公司 | OLED display panel and preparation method thereof |
| CN108550617A (en) * | 2018-06-22 | 2018-09-18 | 武汉天马微电子有限公司 | Display panel and display device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420948A (en) * | 2020-11-16 | 2021-02-26 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN113113426A (en) * | 2021-03-19 | 2021-07-13 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| US12016238B2 (en) | 2021-03-19 | 2024-06-18 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and method for manufacturing same |
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