CN111799207A - A micro device transfer device, system and transfer method - Google Patents

Abstract

The invention discloses a micro device transfer device, a system and a transfer method, which belong to the field of electronic manufacturing. Aiming at the problems of low transfer efficiency and high error rate of micro-devices in the prior art, the present invention provides a micro-device transfer device, a system and a transfer method. The micro-device transfer device includes: On the receiving device; the conversion mechanism includes a projection device and a transfer wheel arranged opposite to the receiving device, and uses the electrostatic induction transfer technology to transfer the micro devices, and transfers the micro devices on the receiving device to the transfer substrate. Using the electrostatic induction transfer technology to transfer the micro-devices in large quantities, it can realize the large-scale transfer of micro-devices with high efficiency and good accuracy.

Description

A micro device transfer device, system and transfer method

technical field

The present invention relates to the technical field of electronic manufacturing, and more particularly, to a micro device transfer device, system and transfer method.

Background technique

Micro devices are small in size and high in precision. The transfer and assembly of existing micro devices are mainly carried out by adsorption, such as vacuum system adsorption for transfer, but the transfer efficiency is low and the cost is high. For micro devices such as micro-luminescence diodes, or other electronic micro-devices.

With the advancement of optoelectronic technology, the volume of many optoelectronic components has gradually been miniaturized, and various micro-display technologies have been introduced in recent years. Among them, due to the breakthrough in the production size of light-emitting diodes (LEDs), micro-light-emitting diodes, which are fabricated by arranging light-emitting diodes in an array, namely Micro-LED displays, are gradually gaining attention in the market. Micro-light-emitting diode displays are different from active light-emitting component displays. In addition to being not inferior to organic light-emitting diode (Organic Light-Emitting Diode, OLED) displays in terms of contrast ratio and energy consumption, they also have absolute advantages in reliability and lifespan. Diode displays have great potential to become the mainstream display technology for wearable electronics in future mobile communication electronics and IoT applications.

Micro-LED displays are arranged in arrays of LEDs on a circuit substrate to form a projection image or pixels of a display image. During the manufacturing process of the micro-LED display, a plurality of LED components must be arranged on the substrate and the LED components must be aligned to predetermined contact positions on the substrate. How to achieve fast packaging and precise alignment is a very important issue when it is desired to achieve color display, or even full-color display, with light-emitting diodes of different colors. The light-emitting colors of the light-emitting components include red, green and blue. In addition, the light-emitting colors of these light-emitting components may also include other different colors. In some embodiments, a light-emitting component may emit light of a single color, or a light-emitting component may Emits light of different colors. Micro-LED display technology is a self-luminous display technology. Through the structure of thin-film, miniaturized and arrayed light-emitting diodes, the volume of light-emitting diodes is reduced to at least 1% of the original volume, with low power consumption, high brightness and high resolution. With the characteristics of high rate, high color saturation, fast response speed and long service life, the development potential has attracted much attention. In the process of commercializing micro-LEDs, the key lies in how to realize "mass transfer", that is, how to transfer a large number of micro-LEDs to the substrate. In the prior art, micro-electromechanical systems (MEMS) are usually used to pick up micro-LEDs. However, the MEMS pick-up process has high requirements on the flatness and cleanliness of the substrate before and after the transfer of the micro-LEDs. Complex and costly.

For example, Chinese patent application, application number 201711354228.0, published on May 8, 2018, the invention provides a micro-light emitting diode transfer method, and provides an LED chip initial substrate, and the LED chip initial substrate is provided with a plurality of LED chips. At the same time, a transfer base plate provided with a plurality of grooves is provided, and the plurality of LED chips are transferred into the plurality of grooves to obtain a transfer base plate carrying the plurality of LED chips. In addition, a circuit board is provided, the transfer base plate is bonded to the circuit board, and the electrodes of the plurality of LED chips are welded to the circuit board. The transfer base plate is separated from the circuit substrate. The plurality of LED chips are arranged on the initial base of the LED chips, and the plurality of LED chips are transferred to the circuit substrate through the transfer base plate, so that a large number of LED chips can be transferred each time, which improves the production efficiency. Chip offset is avoided.

However, in the method shown above, when manufacturing the micro-LED display panel, the individual micro-LEDs must be drawn and transferred to the display panel. Usually electrostatic, magnetic or vacuum suction is used to pick up the micro-LEDs. In addition, the above-mentioned method cannot achieve the desired effect for the device size of the light-emitting component in the range of 1 to 100 micrometers for smaller devices. Traditional electrostatic force absorption and transfer equipment mainly uses MEMS technology, which has disadvantages such as complex structure, high cost and low yield. The traditional magnetic suction and transfer equipment also uses MEMS technology, so it also has the disadvantages of complex structure, high cost and low yield. In addition, an additional magnetic material needs to be coated on the micro-LED, thus requiring additional manufacturing process and cost. The traditional vacuum suction transfer equipment uses a micro-vacuum nozzle, and the ratio of its height to the inner diameter must be less than a critical value to ensure the suction capacity. When the size of the micro-LED is very small, the height and thickness of the vacuum nozzle also need to be reduced accordingly. Therefore, it is easy to cause deformation of the suction and transfer device during operation, thereby reducing the suction efficiency, and even causing the suction and transfer device to break. Therefore, the traditional vacuum suction and transfer device is not suitable for suction of small micro-components.

SUMMARY OF THE INVENTION

1. Technical problems to be solved

Aiming at the problems of low transfer efficiency and high error rate of micro-devices in the prior art, the present invention provides a micro-device transfer device, system and transfer method, which can realize massive transfer of micro-devices with high efficiency and accuracy. it is good.

2. Technical solutions

The object of the present invention is achieved through the following technical solutions.

A micro device transfer device includes a projection device and a receiving device; the receiving device and the projection device rotate or move relatively; the surfaces of the projection device and the receiving device are each provided with a photosensitive material layer; and the distribution of electrical appliances; the projection device and the receiving device are each provided with a light-emitting source; the light-emitting source controls the level of potential generated on the surface of the photosensitive material layer of the projection device and the receiving device. The surface of the device and the receiving device are powered.

Further, the light-emitting source is arranged on the outside or inside of the projection device and the receiving device.

Further, the light-emitting source is a laser emitter or an LPH light-emitting source.

Further, the projecting device and the receiving device are of a single-roller structure, a belt-type structure or a plane structure.

Furthermore, the belt-type structure projection device includes no less than two rotating wheels, and a photosensitive belt surrounding the periphery of the rotating wheels, and a photosensitive material layer is arranged on the photosensitive belt.

A micro device transfer system includes the micro device transfer device, a transfer substrate passes between a transfer roller and a receiving device, and the transfer roller transfers the micro devices on the receiving device to the transfer substrate.

A micro device transfer method, the steps are as follows:

A. Using the transfer device or the transfer system, the projection device rotates or moves, and the electrical distribution device generates a high-potential negative electrostatic charge on the surface of the projection device. position, convert the high-potential negative electrostatic charge into low-potential negative electrostatic charge, and use the low-potential negative electrostatic charge on the surface of the projection device and the high-potential negative electrostatic charge on the micro-device to generate an electrostatic effect to adsorb the micro-device on the photosensitive material;

B. The surface provided with the photosensitive material on the projection device and the receiving device, and the surface provided with the photosensitive material layer moves relatively. During the relative movement, the distributors of the corresponding device respectively generate high-potential negative electrostatic charges on the surface of the corresponding structure. The projection device is then irradiated on the surface of the projection device by controlling the light-emitting source, and there is no need to transfer the surface position to generate low-potential negative electrostatic charge; the surface position of the micro-device that needs to be transferred, the light-emitting source does not emit light, and retains high-potential negative static electricity When the projection device and the receiving device rotate each other for the next turn or move the next time, they will be re-distributed by the electric device to generate a high-potential negative electrostatic charge on the surface of the device, and then control the luminous source to illuminate the next transfer position;

C. When the receiving device rotates or moves, the electrical distribution on the receiving device generates a high-potential negative electrostatic charge on the surface of the receiving device, which is illuminated by the light-emitting source on the surface of the receiving device to receive the corresponding position of the micro-device on the projection device. The light source illuminates the surface of the receiving device to generate a low potential negative electrostatic charge, the corresponding micro device to be projected by the projection device is at a high potential negative electrostatic charge, and the receiving device is at a low potential negative electrostatic charge, there is a potential difference between the two, resulting in static electricity. The effect transfers the micro-devices on the projection device to the receiving device; the micro-devices on the projection device are transferred to the receiving device;

The position of the micro-device that is not transferred on the receiving device is not irradiated by the light-emitting source, so that the surface potential of the micro-device is at a high potential and negative electrostatic charge will not adsorb the micro-device on the projection device that is irradiated by the light-emitting source light and is at a low potential negative electrostatic charge;

When the projection device and the receiving device rotate each other for the next turn or move the next time, they will be re-distributed by their respective distributors, and a high-potential negative electrostatic charge will be generated on the corresponding surface. The corresponding positions of the device and the receiving device, repeat steps B and C;

D. The transfer substrate passes between the transfer roller and the receiving device. The photosensitive material of the receiving device is in a negative electrostatic charge and the transfer roller conducts a high-potential positive electrostatic charge. There is a potential difference between the two to generate an electrostatic effect, and the receiving device is exposed to light. The micro devices on the material are transferred to the transfer substrate by electrostatic effect;

E. The next transfer substrate changes the position with position difference or axial movement, corresponding to the next projected micro device;

F. Repeat steps B, C, D, and E until the micro-devices on the projection device are projected.

Furthermore, the surface distance between the projection device and the receiving device is less than 3mm.

Further, the micro-devices transferred by the projection device and the receiving device in the micro-device transfer method are of any pattern and size.

3. Beneficial effects

Compared with the prior art, the advantages of the present invention are:

Through the electric field transfer technology, this scheme can realize the massive transfer of small-sized micro-devices, and through the printing method, the transfer efficiency is high, and the transfer accuracy rate is good. Smooth and automated transfer with low cost and high efficiency.

Description of drawings

1 is a schematic structural diagram of a transfer device;

2 is a schematic side view of the structure of the transfer device;

3 is a schematic side view of another structure of the transfer device structure;

4 is a schematic diagram showing the transfer of the micro device from the projection device to the surface of the receiving device;

5 is a schematic view of the surface of the A1 group of micro-devices being transferred from the projection device to the receiving device;

6 is a schematic view of the surface of the A2 group of micro-devices being transferred from the projection device to the receiving device;

FIG. 7 is a schematic structural diagram of a transfer device including a flat projection device.

Description of the labels in the figure:

1. Micro device; 202, Receiving device; 203, Transfer roller; 204, Projection device; 241, Photosensitive belt; 242, Wheel; 5, Transfer substrate; 6, Electric appliance; 7, Light source.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Example 1

In order to solve the above problems, this solution provides a transfer device, a transfer system and a corresponding transfer method for micro-devices designed by using electrostatic force transfer technology.

The micro device 1 in this solution is a micro light emitting diode or other micro electronic components, which can be optoelectronic components, such as light emitting diodes, light sensing components, solar cells, etc., or other electronic components unrelated to light, such as sensors , transistors, etc., within the scope of this scheme, such as this scheme can use micro light-emitting diodes. The goal of this solution is to transfer the particles of the micro device 1 to the transfer substrate 5 through the transfer device, and the transfer substrate 5 can be cut or set in the early stage of production according to requirements.

As shown in Figures 1, 2, and 3, a micro device transfer device of this solution includes a projection device 204, a receiving device 202 and a transfer roller 203, wherein the projection device 204 is placed on the micro device 1, and the transfer substrate 5 is along the axis moveable. There are many kinds of specific moving devices. For example, a guide rail device can be provided above, and the transfer substrate can be axially moved by a motor, which can be realized in various ways, which will not be described here. As long as the transfer substrate can be moved axially. The projection device 204 and the receiving device 202 each have a photosensitive material layer, and the photosensitive material includes selenium, zinc oxide, cadmium sulfide, organic photoconductor, etc., like the photosensitive material OPC of a printer, the full English name of the photosensitive material structure is called Organic Photo-Conductor Drum , Chinese for organic photoconductive drum, referred to as OPC. The OPC drum is a photoelectric conversion device formed by coating the surface of the conductive aluminum cylinder with OPC material. It is characterized by being an insulator in the dark and can maintain a certain electrostatic charge. when a certain wavelength of light is irradiated. become a conductor. The electrostatic latent image is formed by discharging the charge through the aluminum base. When the laser is irradiated to the photosensitive material from the inside, the photosensitive material is a light-transmitting material.

The receiving device 202 and the projection device 204 move relative to each other. In this embodiment, the micro-device 1 adsorbed on the projection device 204 is transferred to the receiving device 202 by relative rolling. The surface of the receiving device 202 is provided with a photosensitive material layer, and the receiving device 202 The side of the device is provided with a cloth device 6 and a light-emitting source 7. The light-emitting source 7 is a laser emitter or LPH light-emitting source, LPH is an LED print head, and LPH is an LED (Light Emitting Diode) Print Head, which can specify the position potential of the surface of the photosensitive material. reduce.

Distributing electricity on the surface of the receiving device 202 through the distributor 6 will generally generate a corresponding potential, and then project it at the corresponding required position through the light-emitting source 7. The potential difference between the two is used to adsorb the corresponding micro device 1. In specific work, often one rotation can directly transfer the high-potential negative electrostatic charge on the surface of the projection device 204. The micro device 1, the receiving device 202 and the projection device The 204 spacing can be set according to the requirements, as long as the smooth transfer can be ensured, the spacing of less than 3mm can be designed in this embodiment. The corresponding projection device 204 can have various forms, such as the single-roller type shown in FIG. 1 , the belt type shown in FIG. 2 , and the flat type shown in FIG. 7 , as long as the relative projection with the receiving device 202 can be ensured. It will be all right.

After passing through the transfer between the receiving device 202 and the projecting device 204 , the transfer roller 203 is disposed opposite to the receiving device 202 for transferring the micro-devices 1 on the receiving device 202 to the passage between the transfer roller 203 and the receiving device 202 . onto the transfer substrate 5.

The specific projection device 204 can be a roller design as shown in FIG. 1 , or a belt type design as shown in FIG. 241. The corresponding distribution device 6 and light source 7 can be designed on the inner or outer side of the roller or belt, and can be designed according to the needs. The corresponding potential can be controlled, and the photosensitive belt 241 can be a light-transmitting film belt. The axial length of the light source 7, the surface of the photosensitive layer and the distributor 6 on the receiving device 202 and the projection device 204 is greater than the axial length of the combination of all the transfer devices. The receiving device 202 can also be of a roller design or a belt-type design, and can be of the same design as the projection device 204 .

A micro device transfer system includes a plurality of the micro device transfer devices, the transfer substrate 5 passes through the transfer device, and the transfer device transfers the micro device 1 on the receiving device 202 to the transfer substrate 5 . For example, it is necessary to transfer RGB devices of three colors, and there may be three transfer devices on one production line, which transfer the devices of three colors respectively. The specific work is designed according to the needs, and the rotation speed of the corresponding transfer part, the time of the distribution of electricity 6 and the light-emitting source 7 and the light-emitting area are reasonably controlled by the control system.

As shown in Figures 4, 5 and 6, a micro device transfer method, the steps are as follows:

A. Using the above-mentioned micro device transfer system, the specific installation structure and support method can be selected according to the needs. The specific method and installation will not be described in detail. It can be the overall adsorption, or it can be supported at both ends like the roller installed on the printer. The corresponding housing is set for support, the projection device 204 is rotated, and the electrical distribution device 6 is distributed on the surface of the OPC layer of the projection device 204 to generate a high-potential negative electrostatic charge. The electrostatic charge is converted into a low-potential negative electrostatic charge, and the micro-device is placed on a tray that conducts high-potential negative electrostatic charge, using the low-potential negative electrostatic charge of the photosensitive material and the high-potential negative electrostatic charge of the micro-device 1 to generate an electrostatic effect The micro-device 1 is adsorbed on the projection device 204; the projection device 204 is adsorbed with the micro-device 1; this solution only attracts a single piece, not one piece at a time, which was easy to attract one piece before. The settings of the light source 7 and the electrical distribution device 6 can ensure accurate adsorption.

B. The surfaces provided with the photosensitive material layer on the projection device 204 and the receiving device 202 move relative to each other. During the relative movement, the distributors 6 of the corresponding devices respectively generate high-potential negative electrostatic charges on the surfaces of the corresponding structures. Then, the light-emitting source 7, that is, the LPH, is controlled to emit light and irradiates the surface of the projection device 204. There is no need to transfer the surface position to generate a low-potential negative electrostatic charge position. The surface position of the micro-device 1 that needs to be transferred, the light-emitting source 7 does not emit light. , retains the high potential negative electrostatic charge. When the projection device 204 and the receiving device 202 rotate each other for the next turn, they will be re-distributed by the electric device to generate a high-potential negative electrostatic charge on the surface of the device; the light-emitting source 7 is controlled to illuminate and transfer to different positions;

C. When the receiving device 202 rotates, the electrical distribution device on the receiving device 202 generates a high-potential negative electrostatic charge on the surface. By controlling the light-emitting source 7, the light is irradiated on the surface to receive the corresponding position of the micro-device 1, and the light-emitting source 7 emits light. After irradiation, the surface of the device generates a low potential negative electrostatic charge, corresponding to the micro device 1 to be projected by the projection device 204 is at a high potential negative electrostatic charge, and the receiving device 202 is at a low potential negative electrostatic charge, there is a potential difference between the two, resulting in The electrostatic effect adsorbs and transfers the micro device 1 on the projection device 204 to the receiving device 202, and the transfer of the micro device 1 on the projection device 204 to the receiving device 202 is completed. Irradiate the light, so that the electrostatic charge whose surface potential is at a high potential and negative will not be adsorbed on the projection device 204, and the micro-device 1 with a negative electrostatic charge at a low potential that has been irradiated by the light-emitting source 7;

When the projection device 204 and the receiving device 202 move to each other again for the next transfer, they will be re-distributed by their respective distributors 6, and a high-potential negative electrostatic charge will be generated on the surface. 204 corresponds to the position of the receiving device 202, repeat steps B and C; the micro-device 1 to be transferred for the next movement can be replaced with a new projection device 204 that is covered with the micro-device 1, similar to the way of replacing the toner cartridge, also The projection device 204 may be filled with the micro device 1 by projection or other methods, for example, the projection device 204 may be filled with particles in the groove of the micro device similar to a printer by adsorption. There are many specific ways of reinstalling the micro device 1 in the prior art, and details are not described here.

D. The transfer substrate 5 passes between the transfer roller 203 and the receiving device 202. The surface of the receiving device 202 is in negative electrostatic charge and the transfer roller 203 conducts high-potential positive electrostatic charge, and there is a potential difference between the two to generate an electrostatic effect. Transfer the micro device 1 on the receiving device 202 to the transfer substrate 5 by electrostatic effect, and complete the transfer of the micro device to the transfer substrate 5;

E. The next transfer substrate 5 changes the position with position difference or axial movement, corresponding to the micro device 1 projected next time;

F. Repeat the steps B.C.D and E continuously until the micro device 1 on the projection device 204 is projected. Complete the corresponding projection.

In actual work, the surface charge of the micro device 1 has the same polarity as that of the photosensitive material layer on the surface of the projection device 204 and the photosensitive material layer on the surface of the receiving device 202 , and is opposite to that of the transfer roller 203 . For example, the surface charge of the micro device 1 and the projection device 204=surface, the surface polarity of the receiving device 202 is a negative electrostatic potential, and the transfer roller 203 is a positive electrostatic potential;

For example, the polarity of the surface of the projection device 204 and the surface of the receiving device 202 is a positive electrostatic potential, and the transfer roller 203 is a negative electrostatic potential. The size of the electrostatic potential is proportional to the size of the micro device 1. The size of the micro device 1 increases and the electrostatic potential also increases. The size of the micro device 1 in this solution is less than 200 μm, which can ensure that the very small micro device 1 is suitable for the transfer of the device of this solution.

The above-mentioned positive and negative potential settings can also be reversed, as long as a potential difference that can be adsorbed can be ensured. There is no restriction that the potential must be positive or negative.

As shown in FIG. 4 , the projection device 204 shown in FIG. 1 is used as a single roller structure for description;

The starting point of the projection device 204 corresponds to the starting point 0,0 of the receiving device 202;

During the first transfer, when the projection device 204 is rotated, the distributor 6 generates a high-potential negative electrostatic charge on the surface. In the group position of the A1 micro-device, the light-emitting source 7 does not emit light and retains the high-potential negative electrostatic charge, and the rest The position is irradiated by the light-emitting source 7 to generate low-potential negative electrostatic charge, corresponding to the receiving device 202, the position irradiated by the light-emitting source 7 generates a low-potential negative electrostatic charge, and the light-emitting source 7 does not emit light and irradiates the rest of the position. The electrostatic charge with negative potential corresponds to the position where the group light-emitting source 7 of the A1 micro-devices on the projection device 204 does not emit light. Due to the potential difference between the two, an electrostatic force is generated, and the group of A1 micro-devices on the projection device 204 is adsorbed to the receiving device. 202, and then transfer onto the transfer substrate 5; wherein, the group of A1 micro-devices includes rows A1-1 A1-2 A1-3 . . .

During the second round of transfer, the transfer substrate 5 rotates forward from the starting point X-axis direction to move a distance of the micro device 1,

When the projection device 204 is rotated, the electric distributor generates a high-potential negative electrostatic charge on the surface. The light-emitting source 7 in the group position of the A2 micro-device does not emit light and retains the high-potential negative electrostatic charge, and the remaining positions are illuminated by the light-emitting source 7. A low-potential negative electrostatic charge is generated, corresponding to the position on the receiving device 202 that is irradiated by the light-emitting source 7 to generate a low-potential negative electrostatic charge, and the light-emitting source 7 at other positions does not emit light and retains a high-potential negative electrostatic charge, corresponding to the projection device 204. The group light source 7 of the A2 micro-device does not emit light and irradiates the position, and the two generate electrostatic force due to the potential difference, and the group of A2 micro-devices on the projection device 204 is adsorbed on the receiving device 202, and then transferred to the transfer substrate 5. ; where the group of A2 microdevices contains rows A2-1A2-2 A2-3....

During the third round of transfer, the transfer substrate 5 moves forward by a distance of the two micro-devices 1 from the starting point in the X-axis direction, so that the projection device 204 and the receiving device 202 will be re-distributed on the photosensitive material by the distributor when they rotate each other for the next round. A high potential negative electrostatic charge is generated on the surface. The light source 7 on the projection device 204 does not emit light to illuminate the A3 micro device group, while the light source 7 on the receiving device 202 emits light to illuminate the corresponding position of the A3 micro device group. The difference generates electrostatic force, and the group of A3 micro-devices on the projection device 204 is adsorbed on the receiving device 202 and then transferred to the transfer substrate 5;

By analogy, the X-axis direction of the group A micro-device array is transferred in sequence from front to back. When the transfer of the A-group array micro-device 1 is completed, the transfer substrate 5 moves a distance of the micro-device 1 in the Y-axis direction of the starting point. And return to the zero point in the X-axis direction of the starting point to transfer the B micro device group array, just like the A group micro device array method to complete the transfer. After the transfer of the micro-device array of group B is completed, the transfer substrate 5 moves the distance of two micro-devices in the Y-axis direction of the starting point and returns to the zero point of the X-axis direction to perform the transfer of the C-group array. The transfer of the C-group array is completed. And so on to complete the transfer of all the micro device group arrays to the transfer substrate 5 .

The linear speed ratio between the receiving device 202 and the transfer roller 203 is 1:1, and the linear speed ratio between the receiving device 202 and the transfer substrate 5 is 1:1.

Through the electric field transfer technology, this scheme can realize the large-scale transfer of small-sized micro-devices 1, and through the printing method, the transfer efficiency is high, and the transfer accuracy is good. Combined with the corresponding detection and later supplementary equipment, the entire industry can be completed. The smooth and automated transfer, low cost and high efficiency.

Example 2

As shown in FIG. 7 , the projection device 204 has a planar design and moves in one direction. The receiving device 202 rotates relatively on the projection device 204 . One side or both sides, fixed, as long as the distributor 6 is upstream in the moving direction, and the light source 7 is downstream, so that the distributor 6 first distributes electricity, and then the light source 7 illuminates to generate a potential difference, as shown in Figure 7 As shown, the distributor 6 is arranged on the upper side of the projection device 204, and the light-emitting source 7 is arranged on the lower side of the projection device 204. A certain position of the projection device 204 first passes through the distributor 6 and then reaches the light-emitting source 7, and the distributor 6 distributes electricity on the projection device 204. The surface of the photosensitive material generates a high-potential negative electrostatic charge, which is irradiated by the light-emitting source 7 to convert the high-potential negative electrostatic charge into a low-potential negative electrostatic charge at the position where the micro-device is to be adsorbed;

Specifically, the surfaces on the projection device 204 and the receiving device 202 provided with the photosensitive material, and the surfaces provided with the photosensitive material layer move relatively. During the relative movement, the distributors 6 of the corresponding devices distribute electricity on the surfaces of the corresponding structures to generate a high potential negative The electrostatic charge of the projection device 204 is then irradiated on the surface of the projection device 204 by controlling the light-emitting source 7, and there is no need to transfer the surface position to generate a low-potential negative electrostatic charge; the surface position of the micro-device 1 to be transferred, the light-emitting source 7 does not When the projection device 204 and the receiving device 202 re-rotate or move with each other, they will be re-distributed by the electric device to generate a high-potential negative electrostatic charge on the surface of the device;

When the receiving device 202 rotates, the electrical distribution on the receiving device 202 generates a high-potential negative electrostatic charge on the surface. By controlling the light-emitting source 7, the light is irradiated on the surface to receive the corresponding position of the micro-device 1. After being irradiated by the light-emitting source 7 The surface of the device generates a low potential negative electrostatic charge, corresponding to the micro device 1 to be projected by the projection device 204 is at a high potential negative electrostatic charge, and the receiving device 202 is at a low potential negative electrostatic charge, there is a potential difference between the two, resulting in an electrostatic effect. The micro device 1 on the projection device 204 is adsorbed and transferred to the receiving device 202, and the transfer of the micro device 1 on the projection device 204 to the receiving device 202 is completed. , so that the electrostatic charge whose surface potential is at a high potential and negative will not be adsorbed on the projection device 204, and the micro-device 1 with a negative electrostatic charge at a low potential that has been irradiated by the light source 7;

When the projection device 204 and the receiving device 202 move to each other again for the next transfer, they will be re-distributed by their respective distributors 6, and a high-potential negative electrostatic charge will be generated on the surface. 204 corresponds to the position of the receiving device 202; the micro device 1 to be transferred in the next movement can be replaced with a new projection device 204 covered with the micro device 1, or the projection device 204 can be moved in the opposite direction, and after returning to the installation position , the micro-devices 1 can be spread all over the projection device 204 by means of projection or other means. There are many specific ways of reinstalling the micro device 1 in the prior art, and details are not described here.

The receiving device 202 can also be of a planar design, and the design can be the same as that of the projection device 204 . The relative movement with the projection device 204 is carried out during the movement.

The transfer device based on the flat projection device 204 is the same as the first embodiment, and a corresponding micro device transfer system can be formed, including a plurality of the micro device transfer devices.

The invention and its embodiments have been described above schematically, and the description is not restrictive. The invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. What is shown in the accompanying drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto, and any reference signs in the claims shall not limit the related claims. Therefore, if those of ordinary skill in the art are inspired by it, and without departing from the purpose of the present invention, any structure and embodiment similar to this technical solution are designed without creativity, which shall belong to the protection scope of this patent. Furthermore, the word "comprising" does not exclude other components or steps, and the word "a" preceding a component does not exclude the inclusion of "a plurality" of that component. Several components recited in the product claims can also be realized by one component by means of software or hardware. The terms first, second, etc. are used to denote names and do not denote any particular order.

Claims (10)

1. A micro device transfer apparatus, comprising a projection apparatus (204) and a receiving apparatus (202); the receiving device (202) and the projecting device (204) rotate or move relatively; photosensitive material layers are respectively arranged on the surfaces of the projection device (204) and the receiving device (202), and light emitting sources (7) are respectively arranged on the projection device (204) and the receiving device (202); the projecting device (204) and the receiving device (202) are respectively provided with a distributor (6).

2. A micro device transfer apparatus according to claim 1, wherein the light source (7) is disposed outside or inside the projection means (204) and the receiving means (202).

3. A micro device transfer apparatus according to claim 2, wherein the light source (7) is a laser emitter or a LPH light source.

4. The micro device transfer apparatus of claim 1, wherein the projection device (204) and the receiving device (202) are of a single roller, belt, or planar configuration.

5. The micro device transfer apparatus according to claim 4, wherein the belt type structure projecting means (204) comprises not less than 2 rotating wheels (242), and a photosensitive belt (241) surrounding the periphery of the rotating wheels (242), the photosensitive belt (241) having a photosensitive material layer disposed thereon.

6. A micro device transfer system comprising a plurality of micro device transfer apparatuses according to claims 1 to 5, wherein a transfer substrate (5) passes between a transfer roller (203) and a receiving apparatus (202), and the transfer roller (203) transfers micro devices (1) on the receiving apparatus (202) onto the transfer substrate (5).

7. A micro device transfer method comprises the following steps:

A. the transfer device projection device (204) of any one of claims 1 to 5 is adopted to generate high potential electrostatic charge on the surface of the projection device (204) through rotation or movement by the electricity distribution of the electricity distributor (6), the high potential electrostatic charge is converted into low potential electrostatic charge at the position where the micro device (1) is to be adsorbed by irradiating through the light emitting source (7), the micro device (1) is placed in the device for conducting the high potential electrostatic charge, and the micro device (1) is adsorbed on the photosensitive material layer through electrostatic effect by utilizing the low potential electrostatic charge on the surface of the projection device (204) and the high potential electrostatic charge of the micro device (1);

B. the surfaces of the projection device (204) and the receiving device (202) provided with the photosensitive material layers move relatively to control the light emitting source (7), the electricity distributor (6) of the corresponding device distributes electricity on the surfaces of the corresponding structures to generate high-potential static charges during the relative movement, and the projection device (204) irradiates the surface of the projection device (204) through the control light emitting source (7) without transferring the surface position of the position to generate low-potential static charges; when the projection device (204) and the receiving device (202) rotate for the next circle or move for the next time, the electric distributor distributes electricity to generate high-potential static charges on the surface of the device again, and then the light source (7) is controlled to irradiate the next transfer position;

C. when the receiving device (202) rotates or moves, the electricity distributor (6) on the receiving device (202) distributes electricity to generate high-potential electrostatic charges on the surface of the receiving device (202), the light source (7) is controlled, light irradiates the position of the micro device (1) needing to be transferred on the surface of the photosensitive material layer of the receiving device (204), the light emitted by the light source (7) irradiates the surface of the receiving device (202) to generate low-potential electrostatic charges, the micro device (1) to be projected by the corresponding projecting device (204) is in the high-potential electrostatic charges, the receiving device (202) is in the low-potential electrostatic charges, the two electrostatic charges have a potential difference, and the micro device (1) on the projecting device (204) is absorbed and transferred to the receiving device (202) through an electrostatic effect;

when the projecting device (204) and the receiving device (202) rotate for the next circle or move for the next time, the electricity is distributed again by the respective electricity distributors (6), the two groups of light-emitting sources (7) respectively emit light and irradiate the corresponding positions of the projecting device (204) and the receiving device (202), and the step B, C is repeated.

8. The micro device transfer method of claim 7, further comprising the step of,

D. the transfer substrate (5) passes between the transfer roller (203) and the receiving device (202), the receiving device (202) and the transfer roller (203) have potential difference to generate electrostatic effect, and the micro device (1) on the photosensitive material of the receiving device (202) is transferred onto the transfer substrate (5) through the electrostatic effect;

E. the next transfer substrate (5) changes position by position difference or axial movement, corresponding to the micro device (1) projected next time;

F. the step B, C, D, E is repeated until the projection of the micro device (1) on the projection device (204) is completed.

9. A micro device transfer method according to claim 7 or 8, characterized in that the surface distance between the projection means (204) and the receiving means (202) is less than 3 mm.

10. A micro device transfer method according to claim 9, wherein the micro device (1) transferred by the projecting means (204) and the receiving means (202) is of any pattern and size.

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