CN111722325A

CN111722325A - Optical module

Info

Publication number: CN111722325A
Application number: CN201910214540.2A
Authority: CN
Inventors: 吴涛; 慕建伟; 杜光超; 唐永正; 刘维伟; 邵乾
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-03-20
Filing date: 2019-03-20
Publication date: 2020-09-29
Also published as: WO2020187149A1

Abstract

The invention provides an optical module which comprises an optical assembly shell, a circuit board, a first optical filter, a second optical filter, an optical fiber adapter, a transmitter, a first receiver and a second receiver, wherein the circuit board partially extends into the optical assembly shell, the transmitter is positioned on the bottom surface of the optical assembly shell, the first receiver and the second receiver are positioned on the side wall of the optical assembly shell, the optical fiber adapter is connected with the optical assembly shell, the optical fiber adapter and the transmitter are respectively positioned at the opposite ends of the optical assembly shell, light emitted by the transmitter is emitted into the optical fiber adapter through the first optical filter and the second optical filter, the light of the optical fiber adapter is reflected into the first receiver through the first optical filter, and the light of the optical fiber adapter is reflected into the second receiver through the second optical filter. The optical module provided by the invention reduces the manufacturing cost of the data sending port, and the whole occupied space of the optical module is small.

Description

Optical module

Technical Field

The invention relates to the technical field of optical communication, in particular to an optical module.

Background

A Passive Optical Network (PON) refers to an Optical Distribution Network (ODN) between an Optical Line Terminal (OLT) and an Optical Network Unit (ONU), and there is no active access Network for electronic devices. And the OLT customer premise equipment in the central machine room is the ONU. The ODN is linked with the ONU or the OLT by one or more optical splitters, and is responsible for centralizing uplink data and distributing downlink data, and completing functions of wavelength multiplexing, optical signal power distribution and the like. The OLT is a multi-service providing platform and a router or switch, and the provided optical fiber interface faces the PON. The OLT can also allocate bandwidth and manage configuration and network security for different requirements of the user service level protocol. The passive optical network avoids the electromagnetic interference and lightning influence of external equipment, reduces the fault rate of circuits and the external equipment, improves the reliability of the system and saves the maintenance cost. The passive optical network includes passive optical network APON, EPON, GPON and CPON.

The CPON integrates the original two optical modules with different rates, and two paths of transmission and two paths of reception are realized by using the same optical fiber; in particular, the optical module can integrate 1 pair of GPON data receiving port and transmitting port and 1 pair of XG-PON1 data receiving port and transmitting port. This integration places higher demands on the design and packaging of the optical module.

Disclosure of Invention

The invention provides an optical module, which realizes multipath optical transceiving by using the same optical fiber in one optical module.

The invention provides an optical module, which comprises an optical component shell, a circuit board, a first optical filter, a second optical filter, an optical fiber adapter, a transmitter, a first receiver and a second receiver, the circuit board extends into the optical assembly shell, the emitter is positioned on the bottom surface of the optical assembly shell, the first receiver and the second receiver are located on a sidewall of the optical assembly housing, the fiber optic adapter is connected to the optical assembly housing, the optical fiber adapter and the transmitter are respectively positioned at the opposite ends of the optical component shell, light emitted by the transmitter is transmitted into the optical fiber adapter through the first optical filter and the second optical filter, light transmitted through the optical fiber adapter is reflected into the first receiver through the first optical filter, and light transmitted through the optical fiber adapter is reflected into the second receiver through the second optical filter.

According to the optical module provided by the invention, the emitter is arranged on the bottom surface of the optical component shell, the first receiver and the second receiver are positioned on the side wall of the optical component shell, the optical fiber adapter is connected with the optical component shell, the optical fiber adapter and the emitter are respectively positioned at the opposite ends of the optical component shell, light emitted by the emitter is emitted into the optical fiber adapter through the first optical filter and the second optical filter, light transmitted through the optical fiber adapter is reflected into the first receiver through the first optical filter, and light transmitted through the optical fiber adapter is reflected into the second receiver through the second optical filter. The transmitter, the first receiver and the second receiver share one optical fiber adapter, so that multiple paths of optical transceiving are realized by using the same optical fiber.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present invention;

fig. 2 is an exploded view of an optical module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an interior of a housing of an optical module optical assembly according to an embodiment of the present invention;

fig. 4 is an exploded view of the interior of a housing of an optical module optical assembly according to an embodiment of the present invention;

fig. 5 is a schematic structural view of an optical module optical assembly housing according to an embodiment of the present invention, in which an upper housing cover is removed;

FIG. 6 is a schematic diagram of the transmitter of FIG. 4;

fig. 7 is a schematic diagram illustrating an internal structure of a lower cover in an optical module according to an embodiment of the present invention;

fig. 8 is a cross-sectional view of the inside of a housing of an optical module optical assembly according to an embodiment of the present invention, taken along the light emitting direction of an emitter;

fig. 9 is a cross-sectional view of a first receiver in an optical module according to an embodiment of the present invention;

fig. 10 is an exploded view of a first receiver in an optical module according to an embodiment of the present invention;

fig. 11 is a schematic view illustrating an installation of a first receiver and a housing in an optical module according to an embodiment of the present invention;

fig. 12 is an optical path diagram of an optical module according to an embodiment of the present invention;

fig. 13 is another optical path diagram of an optical module according to an embodiment of the present invention.

Description of reference numerals:

101-an upper shell; 102-a lower housing; 103-optical assembly housing; 104-an accommodating cavity; 105 — a first via; 106 — an upper cover plate; 107-lower cover body; 108 — an unlocking handle; 109-handle; 1010-connecting legs; 1011-a limit part; 1012 — third via; 1013-opening; 1014-a bracket; 1015 — a second via; 110-a third filter; 20-a circuit board; 30-a first optical filter; 40-a second optical filter; 50-a fiber optic adapter; 60-an emitter; 601 — a first laser chip; 602-a second laser chip; 70 — a first receiver; 701-a pipe cap; 702-a lens; 703-a receiving chip; 704-a base; 80 — a second receiver; 90-backlight detector; 100-a first lens; 200-a second lens; 300-a third lens; 400-a first reflector; 500-displacement prism; 600-a second reflector; 700-an isolator; 1000-semiconductor refrigerator; 800-backing plate; 900-conductive substrate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are only some, but not all embodiments of the invention. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and the like are to be construed broadly, e.g., as meaning fixedly attached, detachably attached, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present invention, and fig. 2 is an exploded view of an optical module according to an embodiment of the present invention; as shown in fig. 1 and 2, an optical module provided in an embodiment of the present invention includes an upper housing 101, a lower housing 102, an optical module housing 103, an unlocking handle 108, an optical fiber adapter 50, and a circuit board 20. Wherein, the upper casing 101 and the lower casing 102 can be spliced and connected to each other to form a receiving cavity for receiving the optical module casing 103. The upper casing 101 and the lower casing 102 may be connected by a snap after being assembled with each other, or may be connected by a screw after being assembled with each other, and the embodiment of the manner in which the upper casing 101 and the lower casing 102 are assembled with each other is not limited herein.

The upper housing 101 and the lower housing 102 together enclose a containing cavity, and the optical assembly housing 103 is located in the containing cavity. The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper casing, lower casing to combine is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

A handle 109 is arranged at one end of the unlocking handle 108, two connecting legs 1010 are arranged at the other end of the unlocking handle 108, the two connecting legs 1010 respectively coat two side surfaces of the lower shell 102, are connected with the two side surfaces of the lower shell 102 and can move along the side surfaces of the lower shell 102, and the unlocking handle 108 can be pulled by the handle 109 to enable the unlocking handle 108 to move relatively on the outer wall surface of the lower shell 102; when the optical module is inserted into the host computer, the optical module is fixed in the cage of the host computer by the unlocking handle 108, and the optical module can be pulled out from the cage of the host computer by pulling the unlocking handle 108 to release the engagement relation between the optical module and the host computer.

The circuit board is arranged in a packaging cavity formed by the upper shell and the shell, the end surface of the electric plate is provided with a golden finger, the golden finger consists of a root pin which is mutually independent, and the circuit board is inserted into an electric connector in the cage and is connected with a clamping elastic sheet in the electric connector in a conduction mode through the golden finger.

The optical fiber adapter 50 is connected to the optical module case 103, and an optical fiber outside the optical module is inserted into the optical fiber adapter to realize optical connection between the optical module and an external optical fiber.

Fig. 3 is a schematic structural diagram of an interior of a housing of an optical module optical assembly according to an embodiment of the present invention; fig. 4 is an exploded view of the interior of a housing of an optical module optical assembly according to an embodiment of the present invention; fig. 5 is a schematic structural view of an optical module optical assembly housing according to an embodiment of the present invention, in which an upper housing cover is removed; as shown in fig. 3, 4, and 5, an optical module according to an embodiment of the present invention includes an optical module housing 103, a circuit board 20, an optical fiber adapter 50, a transmitter 60, a first receiver 70, and a second receiver 80, where the circuit board 20 partially extends into the housing 10, the transmitter 60 is located on a bottom surface of the optical module housing 103, the first receiver 70 and the second receiver 80 are located on a sidewall of the optical module housing 103, the optical fiber adapter 50 is connected to the optical module housing 103, and the optical fiber adapter 50 and the transmitter 60 are located at opposite ends of the optical module housing 103, respectively.

The upper shell and the lower shell form a shell of the optical module, the optical module is located between the upper shell and the lower shell, the optical module shell 103 comprises a lower cover body 107 and an upper cover plate 106, the lower cover body 107 is an accommodating cavity 104 with an opening, and the upper cover plate 106 covers the opening. Therefore, when the optical module is packaged, the emitter 60 and other devices can be conveniently placed in the accommodating cavity 104 through the opening. Through holes are formed at different positions on the lower cover body 107, for example, a first through hole 105 and a third through hole 1012 are formed on the side surface of the lower cover body 107, the first receiver 70 is connected with the lower cover body 107 through the first through hole 105, and the second receiver 80 is connected with the lower cover body 107 through the third through hole 1012; a second through hole 1015 is disposed on an end surface of the lower cover 107, and the fiber adapter 50 is connected to the lower cover 107 through the second through hole 1015, where the position of the through hole is set according to the positions of the first receiver 70, the second receiver 80, and the fiber adapter 50, and the embodiment is not limited herein.

Optionally, an opening 1013 is formed at one end of the lower cover 107, and the circuit board 20 is inserted into the lower cover 107 through the opening 1013 to realize a close-range electrical connection with the transmitter. Specifically, the width of the main body of the circuit board 20 may be greater than or equal to the width of the opening 1013 into which the circuit board 20 is inserted in the length direction of the opening 1013.

The upper cover plate 106 and the lower cover body 107 are assembled in a split manner, so that the emitter 60, the circuit board 20, the optical fiber adapter 50 and other devices can be conveniently installed in the accommodating cavity 104 of the optical assembly housing 103.

Optionally, the circuit board 20 is bonded to the opening 1013 to connect the circuit board 20 to the opening 1013 so that a non-airtight, waterproof, and moisture-tight seal is achieved within the housing 10.

Optionally, the first receiver 70 and the second receiver 80 are bonded to the optical module housing 103 and the fiber optic adapter 50 is bonded to the housing 10 to provide a non-hermetic, water and vapor tight seal within the optical module housing 103.

The bonding can be performed by a COB (chip on board) sealing machine, which is an automatic machine for automatically coating black epoxy resin on an IC (integrated circuit) according to a certain height rule or shape rule and other standards, and is used for protecting gold wires or aluminum wires, welding spots and chips from mechanical damage, oxidation and corrosion.

Alternatively, the optical assembly housing 103 may be fabricated using a tungsten copper alloy substrate or Kovar (Fe-Ni-Co hard glass sealing alloy) to provide overall structural support.

Fig. 6 is a schematic structural diagram of the transmitter in fig. 4, and as shown in fig. 4 and fig. 6, in the optical module provided in this embodiment, the transmitter 60 includes a first laser chip 601 and a second laser chip 602, and forward light emitted by the first laser chip 601 and the second laser chip 602 are parallel to each other. The first laser chip 601 and the second laser chip 602 can generate laser, and the single-wavelength characteristic of the laser is better, and the wavelength tuning characteristic is better. Optionally, the optical module provided in this embodiment further includes a displacement prism 500, where the displacement prism 500 is used to adjust the height of the light emitted by the emitter 60. Namely, the heights of the light emitted from the first laser chip 601 and the second laser chip 602 are adjusted by the displacement prism 500.

The optical module provided by the present embodiment further includes a semiconductor cooler 1000 and a conductive substrate 900, the semiconductor cooler 1000 is located in the optical module housing 103, and the first lens 100, the second lens 200 and the conductive substrate 900 are located on the semiconductor cooler 1000; the first laser chip 601 and the second laser chip 602 are located on the surface of the conductive substrate 900,

a pad 800 may be disposed between the semiconductor cooler 1000 and the conductive substrate for adjusting the height of the conductive substrate, wherein the conductive substrate 900 may be made of a metalized ceramic, and the pad may also be made of a ceramic material for increasing the heat conduction capability and the dimensional accuracy, which is not limited herein.

The first laser chip 601 and the second laser chip 602 generate heat during operation, and the semiconductor refrigerator 1000 cools down the heat generated during the operation of the first laser chip 601 and the second laser chip 602.

In some embodiments, a substrate is further included, the substrate being located on the inner bottom wall of the lower cover 107, and the semiconductor cooler 1000 being located on the substrate.

In some embodiments, as shown in fig. 4, the light module further includes two backlight detectors 90, and the two backlight detectors 90 are respectively configured to receive the backlight emitted by the first laser chip 601 and the second laser chip 602.

The first laser chip 601 and the second laser chip 602 respectively emit two beams of light forward and backward, which are forward light and backward light, the two backlight detection parts 90 are used for respectively receiving the backward light emitted by the first laser chip 601 and the second laser chip 602, and the backlight detection parts 90 monitor the light emitting power of the first laser chip 601 and the second laser chip 60. The forward light emitted by the first laser chip 601 and the second laser chip 602, respectively, is finally emitted through the fiber adapter 50 for data transmission.

In specific implementation, the backlight detection part 90 is mounted on the circuit board 20 and is located on the circuit board 20 inserted into the housing 10, and the backlight detection part 90 is adhered to the circuit board 20 by glue, so that the assembly difficulty is reduced.

Further, in the optical module provided in this embodiment, the backlight detection element 90 is located behind the light emitted from the laser chip 3011. In this way, it is convenient to receive backward light emitted from the first and

second laser chips

601 and 602 without affecting the forward light of the first and

second laser chips

601 and 602. When the backlight detecting element 90 is installed, the backlight detecting element 90 may have a fixed included angle with the first laser chip 601 and the second laser chip 602, and the specific angle is set according to a specific installation position, which is not limited herein. The backlight detecting element 90 may also be arranged in parallel with the back of the first laser chip 601 and the second laser chip 602 (i.e. the position opposite to the light emitting direction of the first laser chip 601 and the second laser chip 602), as long as the backlight detecting element 90 can monitor the light emitting state of the first laser chip 601 and the second laser chip 602.

Further, fig. 7 is a schematic diagram of an internal structure of a lower cover in an optical module according to an embodiment of the present invention; as shown in fig. 6 and 7, the optical module provided by the present invention further includes a first lens 100, a second lens 200, a third lens 300, a first optical filter 30, a second optical filter 40, a first reflective sheet 400 and a third optical filter 110, wherein the first lens 100 is located between the first laser chip 601 and the third optical filter 110, and is configured to converge light emitted from the first laser chip 601 to the third optical filter 110, the second lens 200 is located between the second laser chip 602 and the first reflective sheet 400, and is configured to converge light emitted from the second laser chip 602 to the first reflective sheet 400, and is reflected to the third optical filter 110 by the first reflective sheet 400, and the third optical filter 110 is located between the first optical filter 30 and the first lens 100; therefore, light emitted by the first laser chip enters the light inlet surface of the third optical filter 110 through the first lens and is transmitted out of the third optical filter 110; the light emitted by the second laser chip is collimated and converged by the second lens, and then is reflected to the reflective surface of the third optical filter 110 by the first reflective sheet, and at the third optical filter 110, the light emitted by the first laser chip and the light emitted by the second laser chip are combined into a beam of light, which is the light emitted by the emitter.

The third lens 300 is located between the second filter 40 and the optical fiber adapter 50, and the third lens 300 is used for converging the light entering the optical fiber adapter 50 through the second filter 40.

The first lens 100, the second lens 200, and the third lens 300 function to condense light, and the condensing is generally performed to condense divergent light into parallel light, and condense the divergent light and the parallel light into condensed light. The light emitted from the first laser chip 601 and the second laser chip 602 is in a divergent state, and in order to facilitate subsequent optical path design and optical coupling into an optical fiber, collimation and convergence processing are required, the first lens 100 and the first lens 200 may be collimating lenses, the second optical filter 30 and the second optical filter 40 may be semi-reflective and semi-transparent, a specific wavelength may pass through the optical filters, and the specific wavelength may be reflected by the optical filters.

Light emitted from the emitter 60 is incident on the optical fiber adapter 50 through the first filter 30 and the second filter 40, light incident through the optical fiber adapter 50 is reflected to the first receiver 70 through the first filter 30, and light incident through the optical fiber adapter 50 is reflected to the second receiver 80 through the second filter 40.

The emitter 60 is configured to emit light, the first receiver 70 and the second receiver 80 are configured to receive light, the first optical filter 30 and the second optical filter 40 are configured to transmit the light emitted from the emitter 60 to the optical fiber adapter 50, the light entering through the optical fiber adapter 50 is reflected into the first receiver 70 through the first optical filter 30, and the light entering through the optical fiber adapter 50 is reflected into the second receiver 80 through the second optical filter 40. The fiber optic adapter 50 serves to maximize the coupling of light from the transmitter 60 into the optical fiber connected to the fiber optic adapter 50 and to minimize the impact on the system due to its intervening optical link. In the optical module provided by this embodiment, the transmitter 60 is disposed on the bottom surface of the optical module housing 103, the first receiver 70 and the second receiver 80 are located on the side wall of the optical module housing 103, the optical fiber adapter 50 is connected to the housing 10, the optical fiber adapter 50 and the transmitter 60 are respectively located at the opposite ends of the optical module housing 103, light emitted by the transmitter 60 is incident on the optical fiber adapter 50 through the first optical filter 30 and the second optical filter 40, light incident through the optical fiber adapter 50 is reflected into the first receiver 70 through the first optical filter 30, and light incident through the optical fiber adapter 50 is reflected into the second receiver 80 through the second optical filter 40. Namely, the transmitter 60 is disposed in the optical module housing 103, the first receiver 70 and the second receiver 80 are disposed on the sidewall of the optical module housing 103, and the optical transmitter, the first receiver 70 and the second receiver 80 share one optical fiber adapter 50, so that the manufacturing cost of the data transmission port is reduced, and the overall occupied space of the optical module is reduced.

Optionally, as shown in fig. 7, in the optical module provided in this embodiment, the optical module further includes a second reflector 600, and light entering through the optical fiber adapter 50 is reflected into the second reflector 600 through the second optical filter 40, and is reflected to the second receiver 80 through the second reflector 600. When the second receiver 80 and the second optical filter 40 are arranged in a staggered manner, and the light transmitted through the optical fiber adapter 50 cannot be directly reflected into the second receiver 80 through the second optical filter 40, the light passing through the second optical filter 40 is reflected to the second receiver 80 through the second reflector 600 by the arrangement of the second reflector 600. Similarly, when the first receiver 70 and the first optical filter 30 are disposed in a staggered manner, the light reflected by the first optical filter 30 via the reflective sheet may be reflected to the first receiver 70. In particular implementations, the first receiver 70 and the second receiver 80 may be located on the same side of the optical module housing 103 or may be located on opposite sides of the optical module housing 103.

The incident surface of the second optical filter 40 forms an included angle smaller than 45 degrees with respect to the propagation direction of the light from the optical fiber adapter; in order to transmit the light from the second optical filter to the second receiver 80 at such an angle, a second light-reflecting sheet is added, the light reflected by the light incident surface of the second optical filter is reflected to the second light-reflecting sheet, and the second light-reflecting sheet reflects the light to the second receiver, so that the second optical filter reflects the light from the optical fiber adapter to the second receiver. The second optical filter 40 and the second reflective sheet 600 are assembled at a small angle, and compared with the prior art in which an included angle of 45 degrees is used, the light loss generated when light is reflected at the optical filter can be reduced.

Further, the optical module provided in this embodiment further includes an isolator 700, where the isolator 700 is located between the first optical filter 30 and the third optical filter 110. The isolator 700 serves to prevent incoming light passing through the fiber adapter 50 from being reflected toward the first laser chip 601 and the second laser chip 602.

When the optical module is assembled, in order to facilitate installation of the first optical filter 30, the second optical filter 40, the second lens 200, the first reflective sheet 400, the third optical filter 110, the second reflective sheet 600 and the isolator 700, supports 1014 may be disposed at different positions in the lower cover 107, a limiting portion 1011 is disposed on the support 1014, and the first optical filter 30, the second optical filter 40, the second lens 200, the first reflective sheet 400, the third optical filter 110, the second reflective sheet 600 and the isolator 700 are respectively supported and positioned by the limiting portions 1011 on the different supports 1014.

Fig. 8 is a cross-sectional view of the inside of a housing of an optical module optical assembly taken along the light emitting direction of an emitter according to an embodiment of the present invention. As shown in fig. 7 and 8, the heights of the light emitted by the first laser chip 601 and the second laser chip 602 are adjusted by the displacement prism 500, so that the light emitted from the third optical filter 110 can enter the first optical filter 30 and the second optical filter 40, pass through the first optical filter 30 and the second optical filter 40, and then exit the optical fiber adapter 50 after being converged by the third lens 300.

Fig. 9 is a cross-sectional view of a first receiver in an optical module according to an embodiment of the present invention; fig. 10 is an exploded view of a first receiver in an optical module according to an embodiment of the present invention; fig. 11 is a schematic view illustrating an installation of a first receiver and a housing in an optical module according to an embodiment of the present invention. As shown in fig. 9 to 11, taking the first receiver 70 as an example for description, the receiver includes a cap 701, a base 704, a lens 702 and a receiving chip 703, the cap 701 covers the base 704, the lens 702 is located outside the cap 701, a recess is formed in the middle of the inner side of the base 704, the receiving chip 703 is located in the recess, and the lens 702 is opposite to the receiving chip 703. In another specific implementation, the cap 701 is inserted into the first through hole 105, the lens 702 extends into the lower cover 107, the light transmitted through the fiber adapter 50 is reflected into the lens 702 through the first optical filter 30, and is converged by the lens 702 and transmitted to the receiving chip 703.

It should be noted that the structure and principle of the first receiver 70 and the first receiver 80 are the same, and the description of the embodiment is not repeated herein.

Fig. 12 is an optical path diagram of an optical module according to an embodiment of the present invention. Fig. 12 shows an optical path diagram of light emitted by the emitter 60 in the optical module provided in the present embodiment. As shown in figure 12 of the drawings,

light emitted by the first laser chip 601 is converged by the first lens 100 and then emitted to the third optical filter 110, and then passes through the first optical filter 30 and the second optical filter 40 and is emitted to the optical fiber adapter 50 after being converged by the third lens 300;

light emitted by the second laser chip 602 is converged by the second lens 200 to the first reflector 400, reflected by the first reflector 400 to the third filter 110, passes through the first filter 30 and the second filter 40, and is converged by the third lens 300 and then exits the optical fiber adapter 50.

Fig. 13 is another optical path diagram of an optical module according to an embodiment of the present invention. Fig. 13 is a diagram showing optical paths of light received by the first receiver 70 and the second receiver 80 in the optical module provided in the present embodiment. As shown in fig. 13, the optical path of the light received by the first receiver 70 is: the light introduced through the fiber adapter 50 is reflected to the first receiver 70 through the second filter 40 and the first filter 30. The optical path for receiving light by the second receiver 80 is: the light transmitted through the optical fiber adapter 50 is reflected into the second light reflecting plate 600 through the second optical filter 40, and is reflected to the second receiver 80 through the second light reflecting plate 600.

As can be seen from the transmission path and the reception path, the optical paths of the transmitter 60, the first receiver 70 and the second receiver 80 are partially the same, which reduces the coupling time during packaging, requires only one coupling station, and is simple in packaging and convenient to repair.

In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Furthermore, elements, structures, or features illustrated in one drawing or one embodiment of the invention may be combined in any suitable manner with elements, structures, or features illustrated in one or more other drawings or embodiments.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module is characterized by comprising an optical module shell, a circuit board, a first optical filter, a second optical filter, an optical fiber adapter, a transmitter, a first receiver and a second receiver, the circuit board extends into the optical assembly shell, the emitter is positioned on the bottom surface of the optical assembly shell, the first receiver and the second receiver are located on a sidewall of the optical assembly housing, the fiber optic adapter is connected to the optical assembly housing, the optical fiber adapter and the emitter are respectively positioned at the opposite ends of the optical component shell, light emitted by the emitter is emitted into the optical fiber adapter through the first optical filter and the second optical filter, light transmitted through the optical fiber adapter is reflected into the first receiver through the first optical filter, and light transmitted through the optical fiber adapter is reflected to the second receiver through the second optical filter.

2. The optical module of claim 1, wherein the transmitter comprises a first laser chip and a second laser chip, and forward lights emitted by the first laser chip and the second laser chip are parallel to each other;

the backlight detection device comprises a first laser chip, a second laser chip and a circuit board, and is characterized by further comprising at least two backlight detection pieces, wherein the backlight detection pieces are respectively used for receiving backward light emitted by the first laser chip and the second laser chip, and are arranged on the circuit board in the optical component shell.

3. The optical module of claim 2, further comprising a first lens, a second lens, a third lens, a first reflector, and a third filter; the first lens is positioned between the first laser chip and the third optical filter and is used for converging the light emitted by the first laser chip to the third optical filter; the second lens is positioned between the second laser chip and the first reflector and is used for converging the light emitted by the second laser chip to the first reflector and reflecting the light to the third optical filter through the first reflector; the third optical filter is positioned between the first optical filter and the first lens;

the third lens is positioned between the second optical filter and the optical fiber adapter, and is used for converging light which is emitted into the optical fiber adapter through the second optical filter.

4. The light module of claim 1,

the optical fiber adapter is characterized by further comprising a second light reflecting sheet, and light transmitted by the optical fiber adapter is reflected into the second light reflecting sheet through the second optical filter and is reflected to the second receiver through the second light reflecting sheet.

5. The light module of claim 4,

and the propagation direction of the light from the optical fiber adapter and the light incident surface of the second optical filter form an included angle of less than 45 degrees.

6. The optical module of claim 3, further comprising an isolator between the first filter and the third filter.

7. The optical module of claim 3, further comprising a semiconductor cooler and a conductive substrate, the semiconductor cooler being located within the optical module housing, the first lens, the second lens, and the conductive substrate being located on the semiconductor cooler;

the first laser chip and the second laser chip are located on the surface of the conductive substrate.

8. The light module of any of claims 1 to 7, wherein the first and second receivers are located on the same side or on opposite sides of the light assembly housing.

9. The light module of any of claims 1-7, wherein the first and second receivers are located within the light assembly housing.

10. The light module according to any one of claims 1 to 7, further comprising a displacement prism for adjusting a height of the light emitted from the emitter.