CN111718678A - A kind of glue for copper clad laminate, copper clad laminate and preparation method thereof - Google Patents

Abstract

The invention provides a glue solution for a copper-clad plate, the copper-clad plate and a preparation method thereof. The glue solution for the copper-clad plate comprises the following components in parts by weight: 80-100 parts of epoxy resin, 15-35 parts of curing agent, 0.05-0.15 part of accelerator, 10-30 parts of flame retardant, 60-80 parts of inorganic filler, 0.1-0.2 part of interface bonding agent and 90-110 parts of solvent. The flame retardance of the copper-clad plate prepared by the glue solution for the copper-clad plate can meet the requirement of UL94V-0, and the copper-clad plate has good thermal reliability, low water absorption, lower dielectric constant and dielectric loss and excellent comprehensive performance.

Description

A kind of glue for copper clad laminate, copper clad laminate and preparation method thereof

technical field

The invention relates to the technical field of copper clad laminates, in particular to a glue for copper clad laminates, a copper clad laminate and a preparation method thereof.

Background technique

In order to comply with the world's environmental protection trends and green regulations, halogen-free (Halogen-free) is the current trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated the production schedule of halogen-free electronic products for their electronic products. After the implementation of the EU's Restriction of Hazardous Substances (RoHS), substances such as lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or products. Its components make the printed circuit board not only require no halogenation, but also meet the requirements of the lead-free process.

Conventional halogen-free boards often use DOPO-modified epoxy resins or add phosphorus-containing flame retardants such as phosphazene to meet UL94V-0 requirements. At the same time, the curing agent is generally cured by Dicy, which has low heat resistance, high water absorption, and large Z-CTE value, resulting in the dielectric loss of the substrate above 0.018 (1MHz); in addition, the poor solubility of conventional flame retardants exists with the main body. The resin produces phase separation, which limits its application in lead-free processes and high-end products.

In view of this, the present invention is proposed.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a glue for a copper clad laminate, a copper clad laminate and a preparation method thereof, the flame retardancy of the copper clad laminate prepared by using the glue for the copper clad laminate can meet the requirements of UL94V-0, and the copper clad laminate has excellent thermal reliability. properties, low water absorption, and low dielectric constant and dielectric loss.

The glue for a copper clad laminate provided by the invention comprises the following components in parts by weight: 80-100 parts of epoxy resin, 15-35 parts of curing agent, 0.05-0.15 parts of accelerator, 10-30 parts of flame retardant, 60-80 parts of inorganic filler, 0.1-0.2 part of interface binder and 90-110 parts of solvent.

In the present invention, the curing agent includes phenolic curing agent and amine curing agent. Further, the mass ratio of phenolic curing agent and amine curing agent in the curing agent can be (10-30): 5; wherein, the phenolic curing agent can be selected from phenolic resin and bisphenol A type novolac At least one of the resins, more preferably bisphenol A phenolic resin; the amine curing agent can be selected from at least one of diaminodiphenylsulfone and dicyandiamide, more preferably dicyandiamide. That is, the preferred curing agent of the present invention includes bisphenol A phenolic resin and dicyandiamide, and the mass ratio of bisphenol A phenolic resin and dicyandiamide is (10-30):5.

In the present invention, the flame retardant may include at least one of a phosphorus-based flame retardant and a nitrogen-based flame retardant; wherein, the phosphorus-based flame retardant may be selected from toluene diphenyl phosphate, trichlorophosphate At least one of propyl ester, DOPO, hexaphenoxy cyclotriphosphazene and modified diphenyl phosphate, preferably, the modified diphenyl phosphate is biphenol bis(2,6 -dimethylphenyl) phosphate; further, the preparation method of the biphenol bis(2,6-dimethylphenyl) phosphate comprises: under a protective atmosphere, mixing phosphorus oxychloride and 4,4-dihydroxybiphenyl is reacted in the presence of a catalyst, and then 2,6-dimethylphenol is added to continue the reaction; the nitrogen-based flame retardant can be selected from at least one of melamine and melamine phosphate.

More specifically, the preparation method of the biquinol bis(2,6-dimethylphenyl) phosphate comprises: under a protective atmosphere, mixing 30-35g of phosphorus oxychloride and 15-20g of 4 , 4-dihydroxybiphenyl was mixed and heated to 70-80 °C, then 0.08-0.012g of catalyst was added, and the temperature was continued to rise to 110-120 °C, after 3-4h reaction, 48-52g of 2,6-diphenylene was added. methyl phenol, after reacting at 120-150 ° C for 3.5-4.5 h, remove 2,6-dimethylphenol to obtain a crude product; further, the crude product is subjected to alkali washing and recrystallization to obtain biphenyl diphenyl Phenol bis(2,6-dimethylphenyl) phosphate; wherein the catalyst is anhydrous aluminum trichloride.

The research found that the introduction of biphenol bis(2,6-dimethylphenyl) phosphate as a flame retardant is particularly beneficial to overcome the problem of phase separation, thereby achieving the purpose of improving the dielectric properties of the product.

In the present invention, the epoxy resin can be selected from novolac epoxy resin, bisphenol A novolac epoxy resin, o-cresol novolac epoxy resin, phosphorus-containing epoxy resin, isocyanate modified epoxy resin, At least one of benzene epoxy resin, trifunctional epoxy resin and tetrafunctional epoxy resin.

Preferably, the epoxy resin includes bisphenol A type novolac epoxy resin, DOPO type phosphorus-containing novolac epoxy resin and diphenylmethane-4,4'-diisocyanate (MDI) epoxy resin; further, the The mass ratio between bisphenol A type novolac epoxy resin, DOPO type phosphorus-containing novolac epoxy resin and diphenylmethane-4,4'-diisocyanate epoxy resin in the epoxy resin is (20-40) :(30-50):(10-40).

In the present invention, the accelerator may be selected from imidazole, 1-benzylbenzene-2-ethylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1 -At least one of aminoethyl-2-methylimidazole and 1-cyanoethylimidazole, preferably 2-ethyl-4-methylimidazole.

In the present invention, the inorganic filler may be selected from at least one of magnesium hydroxide, aluminum hydroxide, aluminum hydroxide monohydrate, soft composite silicon micropowder, fused silicon micropowder, talc, and barium sulfate. Preferably, the inorganic filler includes soft composite silica powder, talc powder and aluminum hydroxide; further, the mass ratio among the soft composite silica powder, talc powder and aluminum hydroxide in the inorganic filler is (35- 45):(10-20):(10-20).

In the present invention, the solvent may be selected from at least one of propylene glycol methyl ether, propylene glycol methyl ether acetate, cyclohexanone, methyl ethyl ketone, acetone, methanol and xylene. Preferably, the solvent includes butanone and propylene glycol methyl ether acetate; further, the mass ratio of butanone and propylene glycol methyl ether acetate in the solvent is (50-60): (40-50);

In the present invention, the interface binding agent is selected from at least one of a silane coupling agent, a titanate coupling agent and an aluminate coupling agent, preferably a silane coupling agent.

The present invention also provides a method for preparing the above-mentioned glue for copper clad laminates, including:

Add solvent and interface bonding agent to the glue tank according to weight parts, then add curing agent and epoxy resin, stir and mix, then add accelerator, flame retardant and inorganic filler, stir and mature to prepare glue for copper clad laminate .

Specifically, the stirring speed during the stirring and aging can be controlled to be 800-1200 rpm, and the stirring and aging time can be controlled to be 5-7 h.

The present invention also provides a preparation method of the copper clad laminate, comprising:

The prepreg is prepared by using the glue for the above-mentioned copper clad laminate;

The prepreg and the copper foil are stacked and then laminated to obtain a copper clad laminate.

Specifically, when preparing the prepreg, the glue content is controlled to be 40-50%, and the fluidity is 15-50%.

The present invention also provides a copper clad laminate, which is prepared according to the above preparation method.

In the present invention, epoxy resin is reasonably selected for matching, a new type of halogen-free flame retardant is introduced at the same time, and PN and amine curing agent are used for co-curing, so that the flame retardant ability of the copper clad laminate can meet the requirements of UL94V-0, and the copper clad laminate has excellent Excellent thermal reliability, low water absorption, low dielectric constant and dielectric loss, and excellent overall performance.

Detailed ways

It should be noted that the following detailed description is exemplary and intended to provide further explanation of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It should be noted that the terminology used herein is for the purpose of describing specific embodiments only, and is not intended to limit the exemplary embodiments according to the present application. As used herein, the singular also includes the plural unless the context clearly dictates otherwise, and it should also be understood that when the terms "comprising" and/or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components and/or combinations thereof.

The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1

1. Preparation of biphenol bis(2,6-dimethylphenyl) phosphate

In a four-necked flask equipped with a thermometer and nitrogen protection device, add 33.3g of phosphorus oxychloride and 18.6g of 4,4-dihydroxybiphenyl, pass nitrogen, heat up to about 75°C, stir evenly, add catalyst anhydrous Aluminum trichloride 0.010g, then slowly raised to 115°C, reacted for 3.5h, then added 50.1g of 2,6-dimethylphenol, reacted at 135°C for 4h, and removed 2,6-dimethylphenol under reduced pressure , and then after alkali washing and recrystallization, a white solid was obtained, which was biphenol bis(2,6-dimethylphenyl) phosphate, and the yield was 85.1%.

2. Preparation of glue for copper clad laminates

The glue solution for copper clad laminates of the present embodiment is composed of the following components by weight:

Epoxy resin: 20 parts of bisphenol A phenolic epoxy resin, 30 parts of DOPO type phosphorus-containing phenolic epoxy resin and 40 parts of diphenylmethane-4,4'-diisocyanate epoxy resin;

Curing agent: 10 parts of bisphenol A phenolic resin and 5 parts of dicyandiamide;

Curing accelerator: 0.1 part of 2-ethyl-4-methylimidazole;

Flame retardant: 10 parts of biphenol bis(2,6-dimethylphenyl) phosphate;

Inorganic fillers: 40 parts of soft composite silica micropowder, 15 parts of talc and 15 parts of aluminum hydroxide;

Interface bonding agent: 0.16 part of silane coupling agent;

Solvent: 55 parts of butanone and 45 parts of propylene glycol methyl ether acetate.

After cleaning the glue tank, add the above-mentioned solvent and interface binder into the glue tank by weight, then add the above-mentioned curing agent and epoxy resin, stir for 3 hours and mix well, then add the remaining components in turn, and stir at 1000 rpm for 6 hours. After curing, the glue for copper clad laminate is prepared.

3. Preparation of CCL

Using a vertical gluing machine, the above-prepared glue for copper clad laminates is made into a prepreg, and the glue content is controlled to be about 45% and the fluidity is about 30%.

8 sheets of prepreg are covered with a 1OZ copper foil on the top and bottom as a stack structure, put into a laminator and pressed to obtain a composite laminate, that is, a copper clad laminate.

According to the IPC-650 method, the quality of the above-mentioned copper clad laminates is tested, and the test results are shown in Table 1.

Example 2

1. Preparation of biphenol bis(2,6-dimethylphenyl) phosphate

In a four-necked flask equipped with a thermometer and a nitrogen protection device, add 33.3g of phosphorus oxychloride and 18.6g of 4,4-dihydroxybiphenyl, pass nitrogen, heat up to about 70°C, stir evenly, add catalyst anhydrous Aluminum trichloride 0.010g, then slowly raised to 115°C, reacted for 3.5h, then added 50.1g of 2,6-dimethylphenol, reacted at 120°C for 4h, and removed 2,6-dimethylphenol under reduced pressure , and then through alkaline washing and recrystallization to obtain biquinol bis(2,6-dimethylphenyl) phosphate.

2. Preparation of glue for copper clad laminates

The glue solution for copper clad laminates of the present embodiment is composed of the following components by weight:

Epoxy resin: 30 parts of bisphenol A phenolic epoxy resin, 40 parts of DOPO type phosphorus-containing phenolic epoxy resin and 20 parts of diphenylmethane-4,4'-diisocyanate epoxy resin;

Curing agent: 20 parts of bisphenol A phenolic resin and 5 parts of dicyandiamide;

Curing accelerator: 0.05 part of 2-ethyl-4-methylimidazole;

Flame retardant: 20 parts of biquinol bis(2,6-dimethylphenyl) phosphate;

Inorganic fillers: 35 parts of soft composite silica micropowder, 10 parts of talc and 20 parts of aluminum hydroxide;

Interface bonding agent: 0.1 part of silane coupling agent;

Solvent: 50 parts of butanone and 50 parts of propylene glycol methyl ether acetate.

After cleaning the glue tank, add the above-mentioned solvent and interface binder into the glue tank by weight, then add the above-mentioned curing agent and epoxy resin, stir for 3 hours and mix well, then add the remaining components in turn, and stir at 800 rpm for 7 hours. After curing, the glue for copper clad laminate is prepared.

3. Preparation of CCL

A vertical gluing machine is used to make the above-prepared glue for copper clad laminates into a prepreg, and the glue content is controlled to be about 40% and the fluidity is about 40%.

8 sheets of prepreg are covered with a 1OZ copper foil on the top and bottom as a stack structure, put into a laminator and pressed to obtain a composite laminate, that is, a copper clad laminate.

According to the IPC-650 method, the quality of the above-mentioned copper clad laminates is tested, and the test results are shown in Table 1.

Example 3

1. Preparation of biphenol bis(2,6-dimethylphenyl) phosphate

In a four-necked flask equipped with a thermometer and a nitrogen protection device, add 33.3g of phosphorus oxychloride and 18.6g of 4,4-dihydroxybiphenyl, pass nitrogen, heat up to about 80°C, stir evenly, add catalyst anhydrous Aluminum trichloride 0.010g, then slowly raised to 115°C, reacted for 3.5h, then added 50.1g of 2,6-dimethylphenol, reacted at 150°C for 4h, and removed 2,6-dimethylphenol under reduced pressure , and then through alkaline washing and recrystallization to obtain biquinol bis(2,6-dimethylphenyl) phosphate.

2. Preparation of glue for copper clad laminates

The glue solution for copper clad laminates of the present embodiment is composed of the following components by weight:

Epoxy resin: 40 parts of bisphenol A phenolic epoxy resin, 50 parts of DOPO type phosphorus-containing phenolic epoxy resin and 10 parts of diphenylmethane-4,4'-diisocyanate epoxy resin;

Curing agent: 30 parts of bisphenol A phenolic resin and 5 parts of dicyandiamide;

Curing accelerator: 0.15 part of 2-ethyl-4-methylimidazole;

Flame retardant: 30 parts of biquinol bis(2,6-dimethylphenyl) phosphate;

Inorganic fillers: 45 parts of soft composite silica micropowder, 20 parts of talc and 10 parts of aluminum hydroxide;

Interface bonding agent: 0.2 part of silane coupling agent;

Solvent: 50 parts of butanone and 50 parts of propylene glycol methyl ether acetate.

After cleaning the glue tank, add the above-mentioned solvent and interface binder into the glue tank by weight, then add the above-mentioned curing agent and epoxy resin, stir for 3 hours and mix well, then add the remaining components in turn, and stir at 800 rpm for 7 hours. After curing, the glue for copper clad laminate is prepared.

3. Preparation of CCL

A vertical gluing machine is used to make the above-prepared glue for copper clad laminates into a prepreg, and the glue content is controlled to be about 40% and the fluidity is about 40%.

8 sheets of prepreg are covered with a 1OZ copper foil on the top and bottom as a stack structure, put into a laminator and pressed to obtain a composite laminate, that is, a copper clad laminate.

According to the IPC-650 method, the quality of the above-mentioned copper clad laminates is tested, and the test results are shown in Table 1.

Comparative Example 1

The glue for a copper clad laminate of this comparative example is basically the same as that of Example 1 except that the epoxy resin composition used is different from that of Example 1.

The epoxy resin composition of this control example is as follows:

20 parts of dicyclopentadiene epoxy resin, 30 parts of phosphorus-containing phenolic epoxy resin, 35 parts of isocyanate type epoxy resin and 5 parts of tetrafunctional epoxy resin.

The copper clad laminate was prepared according to the preparation method of Example 1, and the quality of the copper clad laminate was tested according to the IPC-650 method. The test results are shown in Table 1.

Comparative Example 2

The glue for the copper clad laminate of this comparative example is basically the same as that of the embodiment 1 except that the composition of the curing agent used is different from that of the embodiment 1.

The composition of the curing agent of this comparative example is as follows:

10 parts of bisphenol A phenolic resin and 5 parts of phenolic phenolic resin.

The copper clad laminate was prepared according to the preparation method of Example 1, and the quality of the copper clad laminate was tested according to the IPC-650 method. The test results are shown in Table 1.

Comparative Example 3

The glue solution for copper clad laminates of this comparative example is basically the same as that of Example 1 except that the composition of the flame retardant used is different from that of Example 1.

The flame retardant composition of this comparative example is: 10 parts of toluene diphenyl phosphate.

The copper clad laminate was prepared according to the preparation method of Example 1, and the quality of the copper clad laminate was tested according to the IPC-650 method. The test results are shown in Table 1.

Comparative Example 4

The glue solution for copper clad laminates of this comparative example is basically the same as that of Example 1 except that the composition of the flame retardant used is different from that of Example 1.

The flame retardant composition of this comparative example is: 5 parts of tetrabromobisphenol A and 5 parts of aluminum hydroxide.

The copper clad laminate was prepared according to the preparation method of Example 1, and the quality of the copper clad laminate was tested according to the IPC-650 method. The test results are shown in Table 1.

Comparative Example 5

The glue for a copper clad laminate of this comparative example is basically the same as that of Example 1 except that the composition is different from that of Example 1.

The composition of the glue for the copper clad laminate in this comparative example is as follows:

Epoxy resin: 10 parts of bisphenol A type phenolic epoxy resin, 30 parts of DOPO type phosphorus-containing phenolic epoxy resin and 50 parts of diphenylmethane-4,4'-diisocyanate epoxy resin;

Curing agent: 13 parts of bisphenol A phenolic resin and 2 parts of dicyandiamide;

Curing accelerator: 0.1 part of 2-ethyl-4-methylimidazole;

Flame retardant: 10 parts of biphenol bis(2,6-dimethylphenyl) phosphate;

Inorganic fillers: 40 parts of soft composite silica micropowder, 15 parts of talc and 15 parts of aluminum hydroxide;

Interface bonding agent: 0.16 part of silane coupling agent;

Solvent: 55 parts of butanone and 45 parts of propylene glycol methyl ether acetate.

The copper clad laminate was prepared according to the preparation method of Example 1, and the quality of the copper clad laminate was tested according to the IPC-650 method. The test results are shown in Table 1.

Table 1 Quality inspection results of each CCL

In the present invention, a variety of different types of epoxy resins are reasonably selected for matching, a novel halogen-free flame retardant modified diphenyl phosphate is introduced at the same time, and a dual curing agent system of PN and an amine curing agent is used for co-curing, Therefore, the flame retardant ability of the copper clad laminate meets the requirements of UL94V-0, and the copper clad laminate has excellent thermal reliability, low water absorption, low dielectric constant and dielectric loss, and excellent comprehensive performance.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (10)

1. The glue solution for the copper-clad plate is characterized by comprising the following components in parts by weight: 80-100 parts of epoxy resin, 15-35 parts of curing agent, 0.05-0.15 part of accelerator, 10-30 parts of flame retardant, 60-80 parts of inorganic filler, 0.1-0.2 part of interface bonding agent and 90-110 parts of solvent.

2. The glue solution for copper-clad plates according to claim 1, wherein the curing agent comprises phenolic curing agent and amine curing agent;

preferably, the mass ratio of the phenolic aldehyde curing agent to the amine curing agent in the curing agent is (10-30): 5;

preferably, the phenolic aldehyde curing agent is selected from at least one of phenolic resin and bisphenol a type phenolic resin, more preferably bisphenol a type phenolic resin;

preferably, the amine curing agent is selected from at least one of diaminodiphenyl sulfone and dicyandiamide, more preferably dicyandiamide.

3. The glue solution for copper-clad plates according to claim 1, wherein the flame retardant comprises at least one of a phosphorus flame retardant and a nitrogen flame retardant;

preferably, the phosphorus-based flame retardant is selected from at least one selected from the group consisting of cresyldiphenyl phosphate, trichloropropyl phosphate, DOPO, hexaphenoxycyclotriphosphazene and modified diphenyl phosphate;

preferably, the modified diphenyl phosphate is biphenol bis (2, 6-dimethylphenyl) phosphate;

preferably, the preparation method of the biphenol bis (2, 6-dimethylphenyl) phosphate comprises the following steps:

under the protective atmosphere, reacting phosphorus oxychloride with 4, 4-dihydroxybiphenyl in the presence of a catalyst, and then adding 2, 6-dimethylphenol for continuous reaction;

preferably, the nitrogen-based flame retardant is selected from at least one of melamine and melamine phosphate.

4. The glue solution for copper-clad plates according to claim 1, wherein the epoxy resin is at least one of phenolic epoxy resin, bisphenol A phenolic epoxy resin, o-cresol novolac epoxy resin, phosphorus-containing epoxy resin, isocyanate modified epoxy resin, biphenyl epoxy resin, trifunctional epoxy resin and tetrafunctional epoxy resin;

preferably, the epoxy resin includes bisphenol a type novolac epoxy resin, DOPO type phosphorous novolac epoxy resin, and diphenylmethane-4, 4' -diisocyanate epoxy resin;

preferably, the epoxy resin comprises bisphenol A type novolac epoxy resin, DOPO type phosphorus-containing novolac epoxy resin and diphenylmethane-4, 4' -diisocyanate epoxy resin in a mass ratio of (20-40): (30-50): (10-40).

5. The glue solution for copper-clad plates according to claim 1, wherein the accelerator is at least one selected from imidazole, 1-benzylbenzene-2-ethylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-aminoethyl-2-methylimidazole and 1-cyanoethylimidazole, and is preferably 2-ethyl-4-methylimidazole.

6. The glue solution for copper-clad plates according to claim 1, wherein the inorganic filler is at least one selected from magnesium hydroxide, aluminum hydroxide monohydrate, soft composite silica micropowder, fused silica micropowder, talcum powder and barium sulfate;

preferably, the inorganic filler comprises soft composite silicon powder, talcum powder and aluminum hydroxide;

preferably, the mass ratio of the soft composite silicon powder, the talcum powder and the aluminum hydroxide in the inorganic filler is (35-45): (10-20): (10-20).

7. The glue solution for copper-clad plates according to claim 1, wherein the solvent is at least one selected from propylene glycol methyl ether, propylene glycol methyl ether acetate, cyclohexanone, butanone, acetone, methanol and xylene;

preferably, the solvent comprises butanone and propylene glycol methyl ether acetate;

preferably, the mass ratio of the butanone to the propylene glycol monomethyl ether acetate in the solvent is (50-60): (40-50);

preferably, the interface bonding agent is selected from at least one of a silane coupling agent, a titanate coupling agent, and an aluminate coupling agent, more preferably a silane coupling agent.

8. The preparation method of the glue solution for the copper-clad plate according to any one of claims 1 to 7, which is characterized by comprising the following steps:

adding a solvent and an interface bonding agent into a glue tank according to the parts by weight, then adding a curing agent and epoxy resin, uniformly stirring, adding an accelerator, a flame retardant and an inorganic filler, stirring and curing to obtain a glue solution for the copper-clad plate;

preferably, the stirring speed during stirring and curing is controlled to be 800-1200rpm, and the stirring and curing time is controlled to be 5-7 h.

9. The preparation method of the copper-clad plate is characterized by comprising the following steps:

preparing a prepreg from the glue solution for the copper-clad plate according to any one of claims 1 to 7;

laminating the prepreg and the copper foil after overlapping to obtain a copper-clad plate;

preferably, when the prepreg is prepared, the glue content is controlled to be 40-50%, and the fluidity is controlled to be 15-50%.

10. A copper-clad plate, characterized in that it is prepared according to the preparation method of claim 9.