CN111665913A - M.2 Connector, M.2 Module Assembly, and System Tray - Google Patents
M.2 Connector, M.2 Module Assembly, and System Tray Download PDFInfo
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Abstract
本申请提供一种M.2连接器、M.2模块组件和系统盘,该系统盘包括:PCIe底板,PCIe底板上设置有两个M.2模块组件的容置区域,所述M.2模块组件的容置区域用于容置M.2模块组件,由于M.2模块组件的尺寸比较小,通过在PCIe底板上设置有两个M.2模块组件的容置区域,将两个M.2模块组件设置在PCIe底板上实现系统盘支持硬RAID1,PCIe底板只需占用一个槽位,占用空间小,因此,提高了服务器的存储密度,进而,提高服务器的系统性能。
The present application provides an M.2 connector, an M.2 module assembly, and a system disk. The system disk includes: a PCIe backplane. The PCIe backplane is provided with two accommodating areas for M.2 module components. The M.2 The accommodating area of the module assembly is used to accommodate the M.2 module assembly. Since the size of the M.2 module assembly is relatively small, two M.2 .2 The module components are arranged on the PCIe backplane to realize that the system disk supports hard RAID1. The PCIe backplane only needs to occupy one slot and occupies a small space. Therefore, the storage density of the server is improved, and the system performance of the server is improved.
Description
技术领域technical field
本申请涉及芯片技术,尤其涉及一种M.2连接器、M.2模块组件和系统盘。The present application relates to chip technology, and in particular, to an M.2 connector, an M.2 module assembly and a system disk.
背景技术Background technique
随着分布式存储、大数据或软件定义存储(Software Defined Storage,SDS)的流行,在很多应用如虚拟化存储区域网络(virtual Storage Area Network,vSAN),分布式文件系统(Ceph)或存储空间直通(Storage Spaces Direct,S2D)等,为了提升存储的可靠性和安全性,将系统盘和数据盘分离,并且使系统盘支持独立磁盘冗余阵列(redundantarray of independent disks,RAID)的要求,以实现优化应用,提升应用的系统健壮性。With the popularity of distributed storage, big data or software-defined storage (SDS), in many applications such as virtual storage area network (virtual storage area network, vSAN), distributed file system (Ceph) or storage space Storage Spaces Direct (S2D), etc., in order to improve the reliability and security of storage, the system disk and data disk are separated, and the system disk supports the requirements of redundant array of independent disks (RAID), so as to Optimize the application and improve the system robustness of the application.
现有技术中,通常系统盘通过两个2.5寸硬盘实现RAID阵列,因此,系统盘需要占用服务器两个2.5寸硬盘槽位。In the prior art, a system disk usually implements a RAID array by using two 2.5-inch hard disks. Therefore, the system disk needs to occupy two 2.5-inch hard disk slots in the server.
然而,采用现有技术的方式,影响服务器的存储密度。However, in the manner of the prior art, the storage density of the server is affected.
发明内容SUMMARY OF THE INVENTION
本申请提供一种M.2连接器、M.2模块组件和系统盘,以提高服务器的存储密度。The present application provides an M.2 connector, an M.2 module assembly and a system disk to improve the storage density of a server.
第一方面,本申请提供一种系统盘,包括:高速串行计算机扩展总线标准PCIe底板,PCIe底板上设置有两个M.2模块组件的容置区域,所述M.2模块组件的容置区域用于容置M.2模块组件。In a first aspect, the present application provides a system disk, comprising: a high-speed serial computer expansion bus standard PCIe backplane, the PCIe backplane is provided with two accommodating areas for M.2 module components, and the M.2 module components contain The storage area is used to accommodate M.2 module components.
由于M.2模块组件的的尺寸比较小,通过在PCIe底板上设置有两个M.2模块组件的容置区域,将两个M.2模块组件设置在PCIe底板上实现系统盘支持硬RAID1,PCIe底板只需占用一个槽位,占用空间小,因此,提高了服务器的存储密度,进而,提高服务器的系统性能。Due to the relatively small size of the M.2 module assembly, two M.2 module assemblies are arranged on the PCIe base plate by arranging accommodating areas for two M.2 module assemblies on the PCIe base plate to realize that the system disk supports hard RAID1 , the PCIe backplane only needs to occupy one slot and occupies a small space. Therefore, the storage density of the server is improved, and the system performance of the server is further improved.
在一种可能的实现方式中,所述PCIe底板上还设置有板载RAID1芯片。In a possible implementation manner, the PCIe backplane is further provided with an onboard RAID1 chip.
通过将RAID1芯片设置PCIe底板上,节省了外接RAID1芯片所占用的PCIe槽位,进一步地,提高了存储密度。By arranging the RAID1 chip on the PCIe backplane, the PCIe slot occupied by the external RAID1 chip is saved, and the storage density is further improved.
在一种可能的实现方式中,每个所述M.2模块组件的容置区域的一端还设置有底板连接器,所述底板连接器与M.2连接器的连接底座的热拔插的接口匹配。In a possible implementation manner, one end of the accommodating area of each M.2 module assembly is further provided with a backplane connector, and the backplane connector is hot-pluggable with the connection base of the M.2 connector. interface matches.
通过设置与M.2连接器的连接底座的热拔插的接口匹配的底板连接器,实现M.2连接器的热拨插,进而实现M.2模块组件的热拨插,方便更换M.2模块组件,易于维护系统盘。By setting the backplane connector that matches the hot-plugging interface of the connection base of the M.2 connector, the hot-plugging of the M.2 connector is realized, and the hot-plugging of the M.2 module assembly is further realized, which is convenient to replace the M. 2 module components, easy to maintain the system tray.
在一种可能的实现方式中,所述底板连接器为串行连接小型计算机系统接口SAS连接器或者小型可拔插SFP+连接器。In a possible implementation manner, the backplane connector is a serial connection small computer system interface SAS connector or a small form factor pluggable SFP+ connector.
通过将底板连接器设置为SAS连接器或者SFP+连接器,进一步地提高连接器的通用性。By setting the backplane connector as a SAS connector or an SFP+ connector, the versatility of the connector is further improved.
在一种可能的实现方式中,所述PCIe底板为PCIe半高半长卡底板。In a possible implementation manner, the PCIe backplane is a PCIe half-height half-length card backplane.
通过在标准的PCIe半高半长卡底板上进行设计,提高了系统盘的通用性。By designing on the standard PCIe half-height half-length card backplane, the versatility of the system disk is improved.
在一种可能的实现方式中,还包括:两个M.2模块组件,所述两个M.2模块组件分别放置于所述两个M.2模块组件的容置区域内。In a possible implementation manner, the method further includes: two M.2 module assemblies, the two M.2 module assemblies are respectively placed in the accommodating areas of the two M.2 module assemblies.
第二方面,本申请提供一种M.2连接器,包括:In a second aspect, the present application provides an M.2 connector, including:
连接底座,所述连接底座上设置有M.2模块的容置槽,所述连接底座的一端设置有用于热拔插的接口,所述连接底座的另一端设置有限位件,所述限位件用于将所述M.2模块限制于所述容置槽内。A connection base, which is provided with an M.2 module accommodating slot, one end of the connection base is provided with an interface for hot swapping, and the other end of the connection base is provided with a limiter, the limit The piece is used to confine the M.2 module in the accommodating slot.
由于该连接底座具有热拨插的接口,因此,该连接底座可实现热拨插,由于连接底座上设置有M.2模块的容置槽,将M.2模块放置于M.2模块的容置槽内,通过连接底座间接的实现M.2模块热拨插,从而便于维护M.2模块。Since the connection base has a hot-plugging interface, the connection base can realize hot-plugging. Since the connection base is provided with an M.2 module accommodating slot, the M.2 module is placed in the M.2 module's container. In the slot, the M.2 module is hot-swapped and inserted indirectly through the connection base, which is convenient for maintenance of the M.2 module.
在一种可能的实现方式中,所述用于热拔插的接口为金手指。In a possible implementation manner, the interface for hot swapping is a gold finger.
通过金手指作为热拨插的接口,提高其通用性。By using the gold finger as the hot-plug interface, its versatility is improved.
在一种可能的实现方式中,所述限位件为挡片,所述挡片的悬空端指向所述连接底座的用于热拔插的接口的一端,所述挡片的平面平行所述容置槽的底面。In a possible implementation manner, the limiting member is a baffle, the suspended end of the baffle points to one end of the interface used for hot-plugging of the connection base, and the plane of the baffle is parallel to the The bottom surface of the receiving slot.
第三方面,本申请提供一种M.2模块组件,包括:M.2模块和如第二方面任一项所述的M.2连接器,所述M.2模块放置于所述M.2模块的容置槽内。In a third aspect, the present application provides an M.2 module assembly, comprising: an M.2 module and the M.2 connector according to any one of the second aspects, wherein the M.2 module is placed on the M.2 module. 2 in the accommodating slot of the module.
由于M.2连接器可以实现热拨插,M.2模块放置于M.2模块的容置槽内,因此,通过连接底座间接的实现M.2模块热拨插,使得M.2模块易于维护。Since the M.2 connector can be hot-swapped, the M.2 module is placed in the M.2 module's accommodating slot. Therefore, the M.2 module is indirectly hot-swappable by connecting the base, making the M.2 module easy to use. maintain.
附图说明Description of drawings
图1为本申请提供的M.2连接器的一种结构示意图;1 is a schematic structural diagram of an M.2 connector provided by the application;
图2为本申请提供的M.2连接器的另一种结构示意图;FIG. 2 is another schematic structural diagram of the M.2 connector provided by the application;
图3为本申请提供的M.2模块组件的一种结构示意图;3 is a schematic structural diagram of an M.2 module assembly provided by this application;
图4为本申请提供的系统盘的一种结构示意图;4 is a schematic structural diagram of a system disk provided by the present application;
图5为本申请提供的系统盘的另一种结构示意图;FIG. 5 is another schematic structural diagram of the system disk provided by the application;
图6为本申请提供的系统盘的再一种结构示意图;FIG. 6 is another schematic structural diagram of a system disk provided by the present application;
图7为本申请提供的系统盘的又一种结构示意图;7 is another schematic structural diagram of a system disk provided by the present application;
图8为图7所示的系统盘的俯视图;FIG. 8 is a top view of the system disk shown in FIG. 7;
图9为本申请提供的系统盘的逻辑示意图。FIG. 9 is a schematic diagram of the logic of the system disk provided by the present application.
具体实施方式Detailed ways
RAID 1通过磁盘数据镜像实现数据冗余,在成对的独立磁盘上产生互为备份的数据。当原始数据繁忙时,可直接从镜像拷贝中读取数据,因此RAID 1可以提高读取性能。RAID 1提供了很高的数据安全性和可用性。当一个磁盘失效时,系统可以自动切换到镜像磁盘上读写,而不需要重组失效的数据。
其工作原理为:RAID1将一个两块硬盘所构成RAID磁盘阵列,其容量仅等于一块硬盘的容量,因为另一块只是当作数据“镜像”。RAID 1磁盘阵列是比较可靠的一种阵列,因为它总是保持一份完整的数据备份。其数据读取较单一硬盘来的快,因为数据会从两块硬盘中较快的一块中读出。RAID 1磁盘阵列一般支持“热交换”,就是说阵列中硬盘的移除或替换可以在系统运行时进行,无须中断退出系统。RAID 1磁盘阵列是十分安全的。RAID 1磁盘阵列主要用在数据安全性很高,而且要求能够快速恢复被破坏的数据的场合。Its working principle is: RAID1 forms a RAID disk array with two hard disks, and its capacity is only equal to the capacity of one hard disk, because the other one is only used as a data "mirror". A
本申请为了进一步地提高系统的性能,将系统盘和数据盘分离,并且使系统盘支持硬RAID1的要求,系统盘支持硬RAID1无需占用中央处理器(Central Processing Unit,CPU)的处理能力,因此,可以进一步提高系统的性能。In order to further improve the performance of the system, the present application separates the system disk from the data disk, and enables the system disk to support the requirements of hard RAID1. The system disk supports hard RAID1 without occupying the processing power of a central processing unit (Central Processing Unit, CPU). Therefore, , which can further improve the performance of the system.
本申请在实现系统盘支持硬RAID1时,通过M.2模块替代传统的2.5寸硬盘,由于M.2模块体积小,因此,两个M.2模块可以设置在一个PCIe底板上,一个PCIe底板占用一个PCIe槽位,因此,提高了服务器的存储密度,进而,提高服务器的系统性能。In this application, when the system disk supports hard RAID1, the traditional 2.5-inch hard disk is replaced by an M.2 module. Since the M.2 module is small in size, two M.2 modules can be installed on one PCIe backplane and one PCIe backplane Occupying one PCIe slot, therefore, the storage density of the server is improved, and further, the system performance of the server is improved.
其中,M.2模块可以选择不同尺寸的,例如:2280。Among them, M.2 modules can choose different sizes, for example: 2280.
下面以具体地实施例对本申请的技术方案进行详细说明。下面这几个具体的实施例可以相互结合,对于相同或相似的概念或过程可能在某些实施例不再赘述。The technical solutions of the present application will be described in detail below with specific examples. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.
图1为本申请提供的M.2连接器的一种结构示意图,如图1所示,该M.2连接器200包括:连接底座1,连接底座1上设置有M.2模块的容置槽11,连接底座1的一端设置有用于热拔插的接口12,连接底座1的另一端设置有限位件13,限位件13用于将M.2模块限制于容置槽11内。FIG. 1 is a schematic structural diagram of the M.2 connector provided by the application. As shown in FIG. 1 , the M.2
使用时,通过将M.2模块放置于容置槽11中,通过限位件13将M.2模块限制于容置槽11内,避免其晃动。When in use, by placing the M.2 module in the
当需要安装M.2模块时,可以将M.2模块和M.2连接器作为一个整体插入系统盘内,使连接底座1的热拨插的接口12插入系统盘的底板连接器内;当需要更换M.2模块时,将M.2模块和M.2连接器作为一个整体从系统盘内拨出。When the M.2 module needs to be installed, the M.2 module and the M.2 connector can be inserted into the system disk as a whole, so that the hot-
在图1所示的M.2连接器实施例中,由于在其连接底座的一端设置有用于热拨插的接口,因此,该连接底座可实现热拨插,由于连接底座上设置有M.2模块的容置槽,将M.2模块放置于M.2模块的容置槽内,通过连接底座间接的实现M.2模块的热拨插,从而便于维护M.2模块。In the embodiment of the M.2 connector shown in FIG. 1, since an interface for hot-plugging is provided at one end of the connection base, the connection base can realize hot-plugging, because the M.2 connector is provided on the connection base. 2 module accommodating slot, place the M.2 module in the accommodating slot of the M.2 module, and indirectly realize the hot swap of the M.2 module through the connection base, so as to facilitate the maintenance of the M.2 module.
图2为本申请提供的M.2连接器的另一种结构示意图,图2是在图1所示实施例的基础上,通过金手指实现热拨插的接口12,从而,提高接口的通用性,使得应用更加广泛。FIG. 2 is another schematic structural diagram of the M.2 connector provided by the application, and FIG. 2 is based on the embodiment shown in FIG. 1 , the
在图1或图2所示实施例中,可选地,限位件12可以通过挡片实现,挡片的悬空端指向连接底座的用于热拨插的接口的一端,挡片的平面平行容置槽的底面,从而,将M.2模块限制于所述容置槽内11。In the embodiment shown in FIG. 1 or FIG. 2 , optionally, the limiting
图3为本申请提供的M.2模块组件的一种结构示意图,如图3所示,包括:M.2模块100和M.2连接器200,M.2模块100放置于M.2模块的容置槽内。M.2连接器200的结构如图1或图2所示,此处不再赘述。FIG. 3 is a schematic structural diagram of an M.2 module assembly provided by this application, as shown in FIG. 3 , including: an M.2
在图3所示的M.2模块组件的实施例中,由于M.2连接器可以实现热拨插,M.2模块放置于M.2模块的容置槽内,可以通过M.2连接器的连接底座间接的实现M.2模块热拨插,使得M.2模块易于维护。In the embodiment of the M.2 module assembly shown in FIG. 3 , since the M.2 connector can realize hot swapping, the M.2 module is placed in the accommodating slot of the M.2 module and can be connected through M.2 The connection base of the device indirectly realizes the hot swap of the M.2 module, which makes the M.2 module easy to maintain.
图4为本申请提供的系统盘的一种结构示意图,如图4所示,该系统盘包括:高速串行计算机扩展总线标准(Peripheral Component Interconnect express,PCIe)底板41,PCIe底板41上设置有两个M.2模块组件的容置区域411,所述M.2模块组件的容置区域411用于容置M.2模块组件。FIG. 4 is a schematic structural diagram of a system disk provided by the application. As shown in FIG. 4 , the system disk includes: a high-speed serial computer expansion bus standard (Peripheral Component Interconnect express, PCIe)
在图4所示的系统盘实施例中,由于M.2模块组件的的尺寸比较小,通过在PCIe底板上设置有两个M.2模块组件的容置区域,将两个M.2模块组件设置在PCIe底板上实现系统盘支持硬RAID1,PCIe底板只需占用一个槽位,占用空间小,因此,提高了服务器的存储密度,进而,提高服务器的系统性能。In the system disk embodiment shown in FIG. 4 , due to the relatively small size of the M.2 module assembly, two M.2 The components are arranged on the PCIe backplane to realize that the system disk supports hard RAID1. The PCIe backplane only needs to occupy one slot and occupies a small space. Therefore, the storage density of the server is improved, and the system performance of the server is further improved.
图5为本申请提供的系统盘的另一种结构示意图,图5是在图4所示实施例的基础上,进一步地,在所述PCIe底板41上还设置有板载的RAID1芯片412。FIG. 5 is another schematic structural diagram of the system disk provided by the present application. FIG. 5 is based on the embodiment shown in FIG. 4 , and further, the
在图5所示系统盘实施例中,通过将RAID1芯片412设置在PCIe底板41上,节省了外接RAID1芯片所占用的PCIe槽位,进一步地,提高了存储密度。In the system disk embodiment shown in FIG. 5 , by arranging the
图6为本申请提供的系统盘的再一种结构示意图,图6是在图5所示实施例的基础上,进一步地,每个M.2模块组件的容置区域411的一端还设置有底板连接器413,所述底板连接器413与M.2连接器的连接底座的热拔插的接口匹配。FIG. 6 is another schematic structural diagram of the system disk provided by the application, and FIG. 6 is based on the embodiment shown in FIG. 5 , and further, one end of the
在图6所示系统盘实施例中,通过设置与M.2连接器的连接底座的热拔插的接口匹配的底板连接器,实现M.2连接器的热拨插,进而实现M.2模块组件的热拨插,方便更换M.2模块组件,易于维护系统盘。In the embodiment of the system disk shown in FIG. 6 , by setting the backplane connector that matches the hot-plugging interface of the connection base of the M.2 connector, the hot-plugging of the M.2 connector is realized, and the M.2 connector is further realized. Hot swap of module components, easy to replace M.2 module components, easy to maintain the system disk.
在图6所示系统盘实施例中,底板连接器可以为串行连接小型计算机系统接口(Serial Attached Small Computer System Interface,SAS)连接器或者SFP+连接器,通过将底板连接器设置为SAS连接器或者小型可拔插(Small Form-Factor Pluggable,SFP+)连接器,进一步地提高连接器的通用性。In the system disk embodiment shown in FIG. 6 , the backplane connector may be a Serial Attached Small Computer System Interface (SAS) connector or an SFP+ connector. By setting the backplane connector as a SAS connector Or a Small Form-Factor Pluggable (SFP+) connector to further improve the versatility of the connector.
可选地,底板连接器也可以采用定制连接器的方式,对此,本申请不作限制。Optionally, the backplane connector may also be a customized connector, which is not limited in this application.
在上述实施例中,为PCIe半高半长卡底板。通过在标准的PCIe半高半长卡底板上进行设计,提高了系统盘的通用性。In the above embodiment, it is a PCIe half-height half-length card backplane. By designing on the standard PCIe half-height half-length card backplane, the versatility of the system disk is improved.
图7为本申请提供的系统盘的又一种结构示意图,图8为图7所示的系统盘的俯视图。图7是在上述各实施例的基础上,进一步地,还包括:M.2模块组件300,两个M.2模块组件300分别放置于所述两个M.2模块组件的容置区域内。FIG. 7 is another schematic structural diagram of the system disk provided by the present application, and FIG. 8 is a top view of the system disk shown in FIG. 7 . FIG. 7 further includes M.2
图9为本申请提供的系统盘的逻辑示意图,如图9所示,RAID1芯片可以选用业界通用的芯片,如:Broadcom、PMC的RAID芯片,其支持SAS/,串行高级技术附件(SerialAdvanced Technology Attachment,SATA)接口的M.2模块。或者,RAID1芯片也可以选用Broadcom公司支持Tri mode特性的RAID芯片(如:Broadcom公司的SAS3508等)或者使用PCIe Switch芯片,以支持PCIe接口的M.2模块。FIG. 9 is a schematic diagram of the logic of the system disk provided by the application. As shown in FIG. 9 , the RAID1 chip can be a chip commonly used in the industry, such as: Broadcom, PMC RAID chip, which supports SAS/, Serial Advanced Technology Attachment (Serial Advanced Technology Attachment, SATA) interface M.2 module. Alternatively, the RAID1 chip can also choose a RAID chip (such as SAS3508 from Broadcom, etc.) that supports the Tri mode feature or use a PCIe Switch chip to support the M.2 module of the PCIe interface.
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