CN111584123A - Less glue mica tape and its preparation method - Google Patents
Less glue mica tape and its preparation method Download PDFInfo
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- CN111584123A CN111584123A CN202010423368.4A CN202010423368A CN111584123A CN 111584123 A CN111584123 A CN 111584123A CN 202010423368 A CN202010423368 A CN 202010423368A CN 111584123 A CN111584123 A CN 111584123A
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- Prior art keywords
- glass cloth
- mica tape
- resin
- adhesive
- mica
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Links
- 239000010445 mica Substances 0.000 title claims abstract description 86
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 86
- 239000003292 glue Substances 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title description 7
- 239000004744 fabric Substances 0.000 claims abstract description 71
- 239000011521 glass Substances 0.000 claims abstract description 71
- 230000001070 adhesive effect Effects 0.000 claims abstract description 50
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 239000007787 solid Substances 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 28
- 239000000835 fiber Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 13
- 239000005011 phenolic resin Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 150000003505 terpenes Chemical class 0.000 claims description 9
- 235000007586 terpenes Nutrition 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- 239000003208 petroleum Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 230000035699 permeability Effects 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000005470 impregnation Methods 0.000 abstract description 2
- 229920000297 Rayon Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- -1 after being dried Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/66—Joining insulating bodies together, e.g. by bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Insulating Bodies (AREA)
- Laminated Bodies (AREA)
Abstract
A mica tape with less glue comprises glass cloth and mica paper, wherein a powder solid adhesive is applied on the glass cloth, and the powder solid adhesive is attached to glass cloth fibers and then compounded with the mica paper. According to the mica tape with less glue, the adhesive is only present in the local contact area of the glass cloth fibers and the mica paper, so that the mica tape has extremely high porosity, the porosity of the mica tape and the cohesiveness between the glass cloth and the mica paper are obviously improved, the requirements of the main insulation of the mica tape of large-scale high-voltage generators and motors on resin permeability and wrapping manufacturability are met, and the impregnation of the resin in a VPI process is facilitated.
Description
Technical Field
The invention relates to a preparation method of a high-temperature resistant strip-shaped insulating material, in particular to a mica tape with less glue and a preparation method thereof, which are used for meeting the use requirements of large-scale high-voltage generators and motors.
Background
Mica is a rock-making mineral, is of a layered structure, has excellent electrical insulation and high-temperature resistance, and is widely applied to the industries of electrical insulation, coatings, paints and the like.
The dry mica tape and the dry mica tape are two major insulating materials applied to electrical products. The mica tape with less glue is prepared by taking glass cloth as a base material and covering mica paper on the glass cloth, the content of glue in the mica tape is small (between 6 and 10 percent), volatile matters are not contained, after the mica tape is subjected to paint dipping and curing by adopting a vacuum pressure impregnation process (VPI process), the insulation performance is good, the production efficiency is high, and no air gap exists in a finally formed insulation layer, so that an electrical product is endowed with excellent electrical insulation performance.
The common preparation method of the mica tape with less glue needs to adopt a liquid adhesive containing a solvent, the liquid adhesive is coated on glass cloth and then contacted and compounded with mica paper, so that the liquid adhesive can completely permeate into gaps of the mica paper, the void ratio is greatly reduced, the VPI paint dipping process is difficult to soak, the adhesive content is high, the adhesive property is poor, and the use requirements of large-scale high-voltage generators and motors can not be met.
Disclosure of Invention
The invention aims to provide a mica tape with less glue, which improves the porosity of the mica tape and is beneficial to being applied to a VPI process.
The invention also aims to provide the mica tape with less glue, which improves the caking property of the mica tape, is convenient for wrapping electric products and improves the insulating property.
Still another object of the present invention is to provide a method for preparing mica tapes with less glue, wherein the prepared mica tapes have significantly improved porosity.
The invention also aims to provide a method for preparing the mica tape with less glue, and the prepared mica tape has obviously improved adhesive property.
A mica tape with less glue comprises glass cloth and mica paper, wherein the glass cloth is coated with a powder solid adhesive and then is compounded with the mica paper, and the powder solid adhesive is attached to the fibers of the glass cloth.
The mica tape with less glue comprises glass cloth and mica paper, wherein the glass cloth is coated with a powder solid adhesive and then is compounded with the mica paper, and the powder solid adhesive is attached to the glass cloth fibers by a fluidized bed.
The other mica tape with less glue comprises glass cloth and mica paper, wherein a liquid adhesive without a solvent is coated on the glass cloth, and then a powder solid adhesive is attached to the glass cloth fibers by a fluidized bed.
The weight per unit area of the mica tape and the glass cloth of the less-glue mica tape is 18g/m2~42g/m2In particular 20g/m2~35g/m2. An embodiment of a glass cloth is provided with 20-28 wefts and 10-20 warps per square centimeter.
The amount of the powder solid adhesive combined on the glass cloth fiber of the mica tape with less glue is 5-40% of the glass cloth by mass, particularly 10-25% of the glass cloth by mass, and the powder solid adhesive comprises but is not limited to epoxy resin, polyester resin, phenolic resin, terpene phenol resin, rosin resin, petroleum resin, organic silicon resin and the like, and the polymers are singly or in combination applied to the mica tape with less glue.
The mica tape with less glue of the invention, the glass cloth also comprises a liquid adhesive without solvent, such as: but are not limited to, epoxy resins, polyester resins, phenolic resins, polyester elastomers, terpene resins, terpene phenol resins, rosin resins, petroleum resins, polybutadiene epoxy resins, silicone resins, polyacrylic resins, and the like, alone or in combination.
The mica tape with less glue has high porosity, obviously improved air permeability, porosity of less than or equal to 500s/100mL (GB/T5402-2003) and interlayer bonding strength of more than or equal to 0.5N/cm2Adhesive content of 3g/m2~12g/m2. More preferably 4 to 10g/m2。
In order to prepare the mica tape with less glue, the invention provides a preparation method, which comprises the steps of conveying a powder solid adhesive to the surface of glass cloth by a fluidized bed, attaching the powder solid adhesive to glass cloth fibers, and finally compounding the glass cloth fibers with mica paper.
The other method for preparing the mica tape with less glue comprises the steps of coating liquid adhesive without solvent on glass cloth, conveying the powder solid adhesive to the surface of the glass cloth by a fluidized bed to enable the powder solid adhesive to be attached to glass cloth fibers, and finally compounding the glass cloth fibers and mica paper.
Dip-coating a small amount of a solvent-free liquid adhesive on a glass cloth, preferably in the following amounts: 0.2-2% of the glass cloth.
The other method for preparing the mica tape with less glue comprises the steps of coating a liquid adhesive without a solvent on glass cloth, drying, conveying a powder solid adhesive to the surface of the glass cloth by a fluidized bed to enable the powder solid adhesive to be attached to glass cloth fibers, and finally compounding the glass cloth fibers with mica paper.
According to the mica tape with less glue, the adhesive is only present in the local area where the glass cloth fiber is in contact with the mica paper, so that the prepared mica tape with less glue has extremely high porosity, the air permeability of the mica tape is remarkably improved, the requirement of the main insulation of the mica tape of a large-scale high-voltage generator and a motor on the permeability of the resin is met, and the rapid permeation of the resin in a VPI process is facilitated.
In the preparation of the mica tape, the liquid adhesive and the powder solid adhesive are simultaneously used and are only concentrated in the local contact area of the glass cloth fibers and the mica paper, so that the adhesive content can be further reduced (compared with the existing product, the adhesive content can be reduced by 3-8 g/m2) Meanwhile, the bonding property between the glass cloth reinforcing material and the mica paper is improved, the occurrence of mica powder flying is obviously reduced, the wrapping of an electrical product is facilitated, the insulating property is improved, and the requirements of the mica tape wrapping manufacturability and the insulating electrical property are met.
Drawings
FIG. 1 is a schematic flow chart of a method for preparing the mica tape with less glue according to the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the mica tape with less glue of the invention.
Detailed Description
The technical solution of the present invention is described in detail below. Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
FIG. 1 is a schematic flow chart of a method for preparing the mica tape with less glue of the invention. As shown in fig. 1, unreeling glass cloth, applying a liquid adhesive without a solvent to the glass cloth, drying, conveying solid viscose powder accounting for 5% -40% of the glass cloth mass to the surface of the glass cloth by a fluidized bed, so that the solid viscose powder is bonded on glass cloth fibers, and finally compounding with mica paper.
The powder solid adhesive is selected from one or more of epoxy resin, polyester resin, phenolic resin, terpene phenol resin, rosin resin, petroleum resin and organic silicon resin.
The solvent-free liquid adhesive is selected from one or more of epoxy resin, polyester resin, phenolic resin, polyester elastomer, terpene resin, terpene phenol resin, rosin resin, petroleum resin, polybutadiene epoxy resin, organic silicon resin and polyacrylic resin.
The fluidized bed process conditions are as follows: the air flow speed is 3 cm/s-20 cm/s, especially 5 cm/s-10 cm/s; the pressure drop is 1500 Pa-4000 Pa, especially 2500 Pa-3500 Pa; the air inlet temperature is 80-140 ℃, especially 100-120 ℃.
Example 1
Conveying solid viscose powder with the weight of 18g/m per unit area to the mass of 5-40% of the glass cloth by a fluidized bed2~42g/m2The glass cloth surface is prepared by adhering the solid viscose powder on the glass cloth fiber and finally compounding the glass cloth fiber with mica paper.
Example 2
Unit area weight of 18g/m2~42g/m2The glass cloth is applied with liquid adhesive which is 0.2-2% of the glass cloth by mass and does not contain solvent, after being dried, powder solid adhesive which is 5-40% of the glass cloth by mass is conveyed to the surface of the glass cloth by a fluidized bed, so that the solid viscose powder is bonded on the glass cloth fiber, and finally the glass cloth is compounded with mica paper.
Fig. 2 is a schematic structural diagram of an embodiment of the mica tape with less glue of the invention. As shown in fig. 2, the mica paper 1 and the glass cloth fiber 2 are compounded to form a mica tape with less glue, the glass cloth fiber is woven by warp and weft, and the viscose powder 3 is combined on the fiber by observing with a microscope, namely, the adhesive is only present in the local area where the glass cloth fiber is contacted with the mica paper.
Example 3
The dry mica tapes prepared in the examples 1 and 2 are compared with the commercial products for detection, and the contents are shown in the following table 1. The prepared mica tape with less glue has obviously improved bonding strength and obviously improved air permeability (namely porosity).
TABLE 1
Claims (12)
1. A mica tape with less glue is characterized by comprising glass cloth and mica paper, wherein the glass cloth is coated with a powder solid adhesive and then is compounded with the mica paper, and the powder solid adhesive is attached to the fiber of the glass cloth;
the weight per unit area of the glass cloth is 18g/m2~42g/m2。
2. The dry mica tape according to claim 1, wherein the weight per unit area of the glass cloth is 20g/m2~35g/m2。
3. The dry mica tape as claimed in claim 1, wherein the amount of the powdered solid adhesive bonded to the glass cloth fibers is 5-40% by mass of the glass cloth.
4. The dry mica tape as claimed in claim 1, wherein the amount of the powdered solid adhesive bonded to the glass cloth fibers is 10-25% by mass of the glass cloth.
5. The dry mica tape as claimed in claim 1, wherein the powdered solid adhesive is attached to the glass cloth fibers by a fluidized bed.
6. The dry mica tape according to claim 1, wherein the powder solid adhesive is selected from one or more of epoxy resin, polyester resin, phenolic resin, terpene phenol resin, rosin resin, petroleum resin and silicone resin.
7. The mica tape with less glue of claim 1, further comprising a solvent-free adhesive selected from one or more of epoxy resin, polyester resin, phenolic resin, polyester elastomer, terpene resin, terpene phenol resin, rosin resin, petroleum resin, polybutadiene epoxy resin, silicone resin and polyacrylic resin.
8. The dry mica tape according to claim 1, wherein the porosity is less than or equal to 500s/100 mL.
9. The dry mica tape as claimed in claim 1, wherein the interlayer bonding strength is not less than 0.5N/cm2。
10. The dry mica tape as claimed in claim 1, wherein the adhesive content is 3g/m2~12g/m2。
11. The method for preparing the mica tape with less glue according to any one of claims 1 to 10, characterized in that the powdered solid adhesive is conveyed to the surface of the glass cloth by a fluidized bed, so that the powdered solid adhesive is attached to the glass cloth fibers and finally compounded with the mica paper.
12. The method of claim 11, wherein a liquid adhesive without solvent is coated on the glass cloth, and then the powdered solid adhesive is transported to the surface of the glass cloth by the fluidized bed.
Priority Applications (1)
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| CN202010423368.4A CN111584123B (en) | 2020-05-18 | 2020-05-18 | Less glue mica tape and its preparation method |
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| CN202010423368.4A CN111584123B (en) | 2020-05-18 | 2020-05-18 | Less glue mica tape and its preparation method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908600A (en) * | 2021-02-20 | 2021-06-04 | 浙江博菲电气股份有限公司 | High-strength drawing magnetic slot wedge and manufacturing method thereof |
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| GB1082191A (en) * | 1964-12-09 | 1967-09-06 | Alsthom Cgee | Insulating tape for the windings of electrical machines |
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| US6524710B1 (en) * | 1998-10-16 | 2003-02-25 | Isovolta- Osterreichische Isolierstoffwerke Aktiengesellschaft | Method for producing insulating tapes containing mica, and the utilization thereof |
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| CN103440902A (en) * | 2013-08-29 | 2013-12-11 | 苏州巨峰电气绝缘系统股份有限公司 | Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof |
| CN106960705A (en) * | 2017-04-19 | 2017-07-18 | 苏州巨峰电气绝缘系统股份有限公司 | It is a kind of suitable for low resin mica tape of high-voltage motor and preparation method thereof |
| CN108068415A (en) * | 2016-11-17 | 2018-05-25 | 通用电气公司 | Electrical insulation system and the insulating element for motor |
-
2020
- 2020-05-18 CN CN202010423368.4A patent/CN111584123B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1082191A (en) * | 1964-12-09 | 1967-09-06 | Alsthom Cgee | Insulating tape for the windings of electrical machines |
| CN85104788A (en) * | 1984-06-14 | 1986-12-17 | 西屋电气公司 | Solvent-free insulating compound |
| US6524710B1 (en) * | 1998-10-16 | 2003-02-25 | Isovolta- Osterreichische Isolierstoffwerke Aktiengesellschaft | Method for producing insulating tapes containing mica, and the utilization thereof |
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| CN108068415A (en) * | 2016-11-17 | 2018-05-25 | 通用电气公司 | Electrical insulation system and the insulating element for motor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908600A (en) * | 2021-02-20 | 2021-06-04 | 浙江博菲电气股份有限公司 | High-strength drawing magnetic slot wedge and manufacturing method thereof |
| CN112908600B (en) * | 2021-02-20 | 2024-04-05 | 浙江博菲电气股份有限公司 | High-strength drawing magnetic slot wedge and manufacturing method thereof |
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| CN111584123B (en) | 2022-02-08 |
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