CN1115772A - Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material - Google Patents
Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material Download PDFInfo
- Publication number
- CN1115772A CN1115772A CN 94111852 CN94111852A CN1115772A CN 1115772 A CN1115772 A CN 1115772A CN 94111852 CN94111852 CN 94111852 CN 94111852 A CN94111852 A CN 94111852A CN 1115772 A CN1115772 A CN 1115772A
- Authority
- CN
- China
- Prior art keywords
- composite material
- resin
- benzoxazine
- ring
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 17
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 16
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 16
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 title claims abstract description 14
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004744 fabric Substances 0.000 claims abstract description 21
- 239000000835 fiber Substances 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 239000003054 catalyst Substances 0.000 claims abstract description 4
- 239000003733 fiber-reinforced composite Substances 0.000 claims abstract 7
- 238000007142 ring opening reaction Methods 0.000 claims abstract 3
- 239000005007 epoxy-phenolic resin Substances 0.000 claims abstract 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 26
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 23
- 238000007151 ring opening polymerisation reaction Methods 0.000 claims description 21
- -1 Amine compounds Chemical class 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 12
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 150000002989 phenols Chemical class 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 7
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 6
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 229920002866 paraformaldehyde Polymers 0.000 claims description 5
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 239000008098 formaldehyde solution Substances 0.000 claims description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Inorganic materials [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 3
- 150000003141 primary amines Chemical class 0.000 claims description 3
- 150000003335 secondary amines Chemical class 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 claims description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 claims description 2
- CVNOWLNNPYYEOH-UHFFFAOYSA-N 4-cyanophenol Chemical compound OC1=CC=C(C#N)C=C1 CVNOWLNNPYYEOH-UHFFFAOYSA-N 0.000 claims description 2
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000748 compression moulding Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims 2
- 150000007522 mineralic acids Chemical class 0.000 claims 2
- 229920003986 novolac Polymers 0.000 claims 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 claims 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 229910019440 Mg(OH) Inorganic materials 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 229940018564 m-phenylenediamine Drugs 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000012772 electrical insulation material Substances 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 15
- 229920003987 resole Polymers 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000001879 gelation Methods 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 241000428199 Mustelinae Species 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 238000004455 differential thermal analysis Methods 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XGCCXKOSCKUFIF-UHFFFAOYSA-N O1NC=CC2=C1C=CC=C2.O2NC=CC1=C2C=CC=C1 Chemical group O1NC=CC2=C1C=CC=C2.O2NC=CC1=C2C=CC=C1 XGCCXKOSCKUFIF-UHFFFAOYSA-N 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229940090668 parachlorophenol Drugs 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006324 polyoxymethylene Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
一种开环聚合酚醛树脂与纤维增强复合材料,它是由自制Benzoxazine与环氧树脂和/或酚醛树脂共混,经过调节溶剂、催化剂或固化剂种类及用量、浸渍或涂敷纤维、织物来实现复合材料的增强作用。该产品具有较高的热稳定性、电气、物理和机械性能优良,尤其是高温机械强度突出,适用作150-180℃长期使用的耐高温的结构材料和电绝缘材料。成本低,易于推广应用,有显著的经济效益和社会效益。A ring-opening polymerized phenolic resin and fiber reinforced composite material, which is blended with self-made Benzoxazine and epoxy resin and/or phenolic resin, through adjusting the type and amount of solvent, catalyst or curing agent, impregnating or coating fibers and fabrics. Realize the reinforcement of composite materials. The product has high thermal stability, excellent electrical, physical and mechanical properties, especially high-temperature mechanical strength, and is suitable for high-temperature-resistant structural materials and electrical insulation materials for long-term use at 150-180 °C. The cost is low, easy to popularize and apply, and has significant economic and social benefits.
Description
| Index name | Desired value | |||
| Last 3255 phenyl ether glass cloth laminated sheets | 9334 bismaleimides glass cloth laminated sheets | 3250 organosilicon laminated epoxy glass-cloth boards | MDAPF1-EGF glass cloth laminated sheet of the present invention | |
| Density, g/cm 3The temperature classification Martens temperature, ℃ flexural strength, MPa, 180 ℃ of tensile strengths of normality, MPa, impact of collision intensity, KJ/m 2Vertical bond strength, the N surface resistivity, M Ω, immersion back volume specific resistance during normality, M Ω .m, the back 180 ℃ of dielectric dissipation factors of soaking during normality | ??????H ????≥250 ????≥343 ????≥294 ????≥147 ????≥5688 ????≥10 5????≥10 3????≥10 5????≥10 3????≥10 2 | ???≥1.70 ??????H ???≥280 ???≥343 ???≥176 ???≥147 ???≥4900 ???≥10 6???≥10 4???≥10 5???≥10 3???≥10 2???≤0.05 | ????H ??≥250 ??≥196 ??≥167 ??≥78.4 ??≥1960 ??≥10 7??≥10 5??≥10 5??≥10 8??≥10 2??≤0.04 | ????1.73 ?????H ????222 ????443 ????262 ????327 ????176 ????7068 ??4.3×10 7??4.6×10 5??1.7×10 7??1.2?×10 5??1.4×10 4????0.012 |
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN94111852A CN1058738C (en) | 1994-07-29 | 1994-07-29 | Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN94111852A CN1058738C (en) | 1994-07-29 | 1994-07-29 | Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1115772A true CN1115772A (en) | 1996-01-31 |
| CN1058738C CN1058738C (en) | 2000-11-22 |
Family
ID=5035681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94111852A Expired - Fee Related CN1058738C (en) | 1994-07-29 | 1994-07-29 | Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1058738C (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000027921A1 (en) * | 1998-11-10 | 2000-05-18 | Edison Polymer Innovation Corporation | Ternary systems of benzoxazine, epoxy, and phenolic resins |
| CN1088727C (en) * | 1996-02-09 | 2002-08-07 | 日立化成工业株式会社 | Thermosetting resin composition, solidifying material, preformed material metal armoured laminated plate and circuit board |
| US7087467B2 (en) | 2000-12-27 | 2006-08-08 | Matsushita Electric Industrial Co., Ltd. | Lead frame and production process thereof and production process of thermally conductive substrate |
| WO2008051373A3 (en) * | 2006-10-19 | 2008-06-19 | Dow Global Technologies Inc | Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article |
| CN100457821C (en) * | 2005-08-08 | 2009-02-04 | 陈金奎 | Modified textile insertion pnenolic aldehyde supporting ring, guiding ring and its production method |
| CN101220152B (en) * | 2007-12-11 | 2010-06-09 | 山东大学 | Preparation method of diamine-type phosphorus-containing high flame-retardant benzoxazine resin |
| CN1832985B (en) * | 2003-07-31 | 2010-10-20 | 国立大学法人京都大学 | Fiber reinforced composite material and preparation method and application thereof |
| CN102092136A (en) * | 2010-12-21 | 2011-06-15 | 东华大学 | Method for producing reinforced thermoplastic plastic composite material for spun yarn fabric |
| CN102399365A (en) * | 2010-09-08 | 2012-04-04 | 台燿科技股份有限公司 | Stable solution of polymer prepared from nitrogen-oxygen heterocyclic compound, and preparation method and application of stable solution |
| CN102408388A (en) * | 2010-09-23 | 2012-04-11 | 汉高公司 | Method for preparing benzoxazine using aqueous solvent |
| CN102417729A (en) * | 2011-07-28 | 2012-04-18 | 应城市力发化工有限责任公司 | Preparation method of environment-friendly high-temperature initiation resin for blast furnace |
| CN101381506B (en) * | 2008-09-26 | 2012-05-30 | 广东生益科技股份有限公司 | Halogen-free phosphorus-free flame-retardant epoxy resin composition, bonding sheet and copper-clad laminate prepared from same |
| CN102757644A (en) * | 2012-07-26 | 2012-10-31 | 合肥工业大学 | Fluorenyl siloxane type polybenzoxazine resin composite material and preparation method thereof |
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| US8580916B2 (en) | 2010-09-02 | 2013-11-12 | Taiwan Union Technology Corporation | Stable solution of the polymer prepared from N,O-heterocycles and its preparation method and use |
| CN103724997A (en) * | 2013-12-31 | 2014-04-16 | 福建新世纪电子材料有限公司 | Halogen-free low water-absorbent thermosetting flame retardant resin composition and application thereof |
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| CN106995582A (en) * | 2017-05-16 | 2017-08-01 | 江苏恒神股份有限公司 | A kind of curable resin composition and its application containing benzoxazine and epoxy resin blend |
| CN107074789A (en) * | 2014-10-27 | 2017-08-18 | 塞特工业公司 | Method for preparing benzoxazine |
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| CN109486104A (en) * | 2018-10-31 | 2019-03-19 | 西安长峰机电研究所 | A kind of benzoxazine resin base reinforcing fiber composite material and its forming method |
| CN114350111A (en) * | 2021-12-24 | 2022-04-15 | 常州市贝美家居科技有限公司 | Floor and preparation method thereof |
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| CN1296433C (en) * | 2003-05-09 | 2007-01-24 | 广州宏仁电子工业有限公司 | Glue liquid no-halide fire-retardant copper-clad plate with the glue liquid and its making process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4557979A (en) * | 1984-02-17 | 1985-12-10 | Monsanto Company | Process for deposition of resin dispersions on metal substrates |
| DE4016296C1 (en) * | 1990-05-21 | 1991-09-05 | Gurit-Essex Ag, Freienbach, Ch | Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives |
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