CN111564557A - Flexible substrate, preparation method thereof, display panel and display device - Google Patents
Flexible substrate, preparation method thereof, display panel and display device Download PDFInfo
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- CN111564557A CN111564557A CN201910113149.3A CN201910113149A CN111564557A CN 111564557 A CN111564557 A CN 111564557A CN 201910113149 A CN201910113149 A CN 201910113149A CN 111564557 A CN111564557 A CN 111564557A
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- 239000000758 substrate Substances 0.000 title claims abstract description 115
- 238000002360 preparation method Methods 0.000 title abstract description 14
- 239000012044 organic layer Substances 0.000 claims description 201
- 239000011368 organic material Substances 0.000 claims description 133
- 230000007547 defect Effects 0.000 claims description 104
- 238000000034 method Methods 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 230000008439 repair process Effects 0.000 claims description 19
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 230000002950 deficient Effects 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 20
- 230000000694 effects Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 238000001723 curing Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000003672 processing method Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- Y02E10/00—Energy generation through renewable energy sources
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- Y02E10/549—Organic PV cells
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Abstract
The embodiment of the invention discloses a flexible substrate, a preparation method thereof, a display panel and a display device.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a flexible display panel, a preparation method of the flexible display panel and a display device.
Background
The flexible display panel has wide application due to the characteristics of being deformable, bendable, light and thin and low in power consumption. At present, the flexible display panel can be applied to electronic products such as intelligent wearable equipment, computers, mobile phones and the like.
The flexible display panel includes a flexible substrate, a wiring layer formed on the flexible substrate, and the like. The flexible board is made of a flexible material, for example, a polyimide material is coated on a glass substrate, and the coated polyimide material is cured to form the flexible substrate. However, during the coating and curing process, the surface of the upper flexible substrate may form an uneven structure under the influence of ambient temperature, contaminant particles in the process, and the like. Due to the fact that the surface of the flexible substrate is not flat, when a circuit layer is prepared subsequently, the circuit layer is poor in contact and even broken, the yield of the display panel is reduced, and the display effect of the display panel is affected.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a flexible display panel, a manufacturing method thereof, and a display device, so as to solve the technical problems of low yield and poor display effect of the flexible display panel in the prior art.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a flexible substrate, including:
providing a substrate base plate;
forming an organic layer on the base substrate; the organic layer has a defect structure therein;
repairing the defect structure of the organic layer for the first time, and removing the organic layer at the defect structure to form a concave structure;
and filling a first organic material at the concave structure.
Optionally, after the filling of the organic material at the recessed structure, the method further includes:
and repairing the position filled with the first organic material for the second time, so that the difference between the thickness of the first organic material and the preset thickness of the organic layer is within a preset range in the direction of the substrate base plate pointing to the organic layer.
Optionally, the material of the organic layer comprises a second organic material; the first organic material and the second organic material are the same material.
Optionally, the first organic material comprises: a polyimide material.
Optionally, before performing first repair on the defect structure of the organic layer and removing the organic layer at the defect structure to form the recessed structure, the method further includes:
scanning the organic layer and collecting an image of the organic layer;
comparing the parameters of the image of the organic layer with the parameters of a standard image, determining the position of the defect structure on the organic layer, and determining the area S of the vertical projection of the defect structure on the substrate.
Optionally, the first repairing the defect structure of the organic layer, and removing the organic layer at the defect structure to form a recessed structure includes:
carrying out first laser irradiation on the organic layer at the position of the defect structure, and removing the organic layer at the position of the defect structure to form a concave structure; wherein the area S of the vertical projection of the concave structure on the substrate base plate1The value range is as follows: s1≥S。
Optionally, the filling of the first organic material at the recessed structures includes:
determining the filling amount of the first organic material according to the size of the defect structure;
injecting the first organic material at the position of the defect structure according to the filling amount;
curing the injected first organic material.
Optionally, the performing the second repair on the position filled with the first organic material includes:
detecting the thickness of the first organic material to obtain the thickness of the first organic material;
comparing the thickness of the first organic material with the preset thickness to obtain a thickness difference between the thickness of the first organic material and the preset thickness;
and setting the time and the intensity of the second laser irradiation according to the thickness difference, and performing the second laser irradiation on the position of the first organic material.
In a second aspect, an embodiment of the present invention further provides a flexible substrate, where the flexible substrate is prepared by the above method for preparing a flexible substrate, and the flexible substrate includes:
a substrate base plate;
an organic layer on the substrate base plate; the organic layer has a recessed structure; the sunken structure is formed by removing the organic layer at the position of the defect structure through first repair;
and the first organic material is filled in the concave structure.
Optionally, in a direction in which the substrate base plate points to the organic layer, a difference between a thickness of the first organic material and a preset thickness of the organic layer is within a preset range.
In a third aspect, an embodiment of the present invention further provides a display panel, including the flexible substrate.
In a fourth aspect, an embodiment of the present invention further provides a display device, including: the display panel is provided.
The embodiment of the invention provides a flexible substrate, a preparation method of the flexible substrate, a display panel and a display device. When the flexible substrate is prepared, an organic layer is formed on the substrate base plate, the organic layer has a defect structure due to the influence of the preparation environment, and the organic layer at the defect structure is removed by carrying out first repair on the organic layer formed on the substrate base plate; after the organic layer at the position of the defect structure is removed, a corresponding concave structure is formed, and the concave structure is filled with the first organic material, so that the flatness of the surface of the organic layer is ensured. The embodiment of the invention can solve the technical problems that in the prior art, the organic layer of the flexible substrate is affected by the preparation environment to generate defects, so that the subsequent preparation of the circuit layer on the flexible substrate affects the connectivity of the circuit layer, further affects the display effect of the display panel and reduces the production yield. According to the embodiment of the invention, the organic layer formed on the substrate is subjected to first repair, the first organic material is refilled after the organic layer at the position of the defect structure is removed, and the flatness of the surface of the organic layer is ensured on the premise of eliminating the defect structure in the organic layer, so that the organic layer has a relatively flat surface, the circuit layer prepared on the organic layer has good connectivity, the display effect of the display panel is improved, and the production yield is improved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a flexible substrate according to an embodiment of the present invention;
fig. 2 to fig. 4 are schematic flow structure diagrams of a method for manufacturing a flexible substrate according to an embodiment of the present invention;
FIG. 5 is a flow chart of another method for manufacturing a flexible substrate according to an embodiment of the present invention;
fig. 6 to 7 are schematic flow structure diagrams of another method for manufacturing a flexible substrate according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a second repair method according to an embodiment of the present invention;
fig. 9 is a flowchart of a method for manufacturing a flexible substrate according to another embodiment of the present invention;
FIG. 10 is a flow chart of a method of filling a first organic material according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The embodiment of the invention provides a preparation method of a flexible substrate, which can be suitable for preparing the flexible substrate in a flexible display panel. The method for manufacturing a flexible substrate according to this embodiment repairs the organic layer formed on the substrate to remove the corresponding defect structure, and fills the first organic material at the position where the recess structure is formed by removing the defect structure. Fig. 1 is a flowchart of a method for manufacturing a flexible substrate according to an embodiment of the present invention. As shown in fig. 1, the preparation method of this example includes:
s101, providing a substrate base plate;
s102, forming an organic layer on the substrate base plate; the organic layer has a defect structure therein.
In particular, since the flexible substrate is generally flexible and deformable, the material for manufacturing the flexible substrate should have stronger plasticity, lower hardness, and smaller elastic modulus. As shown in fig. 2, in the manufacturing process of the flexible substrate, the organic layer 20 of the flexible substrate is formed on the base substrate 10, and the formed organic layer 20 can meet the basic requirement of the flexible substrate. Among them, the method for preparing the organic layer 20 may include: the material of the organic layer 20 is coated on the base substrate 10, and the material of the organic layer 20 is cured to form the organic layer 20. The material of the organic layer 20 may be a polyimide material.
However, in the process of the organic layer 20, the organic layer 20 after being solidified is wrapped with particles and/or bubbles due to the influence of particles, dust, temperature, etc. in the environment, so that the defect structure 21 is formed at the position where the particles and/or bubbles are wrapped. The surface of the defect structure 21 far from the substrate 10 is protruded, so that the surface of the organic layer 20 is not flat, and when a circuit layer is prepared on the side of the organic layer 20 far from the substrate 10, the organic layer 20 with the protrusion can cause the circuit of the circuit layer to break, thereby affecting the display effect of the display panel adopting the flexible substrate. In addition, the defect structure with the encapsulated bubbles may be broken in a subsequent high temperature process, so that the material of the organic layer 20 sputtered after the breaking contaminates the equipment.
S103, repairing the defect structure of the organic layer for the first time, and removing the organic layer at the defect structure to form a concave structure.
Specifically, as shown in fig. 3, in order to eliminate the defect structure of the organic layer 20, a first repair is performed on the defect structure of the organic layer 20, and the first repair may be performed by, for example, irradiating the position of the defect structure with laser light to remove the organic layer 20 at the defect structure, so as to form the recess structure 22 at the position of the defect structure. The recessed structure 22 formed after removing the defect structure may be a through hole penetrating through the organic layer.
And S104, filling a first organic material in the concave structure.
Specifically, as shown in fig. 4, after the organic layer 20 at the defect structure is removed, a concave structure is formed, so that a pit appears on the surface of the organic layer 20, which also affects the connectivity of a circuit in a circuit layer to be subsequently prepared, thereby affecting the display effect of the display panel using the flexible substrate. By filling the first organic material 30 in the formed recess structure, the organic layer 20 has a relatively flat surface while satisfying the characteristic of bending deformation of the organic layer. In order to make the remaining organic layers 20 of the first organic material 30 filled in the recess structure have the same performance, the material of the organic layers 20 and the first organic material 30 may be the same material, that is, when the material of the organic layers includes the second organic material, the first organic material and the second organic material are the same material. The first organic material includes, for example, a polyimide material.
The embodiment carries out first restoration on the organic layer formed on the substrate, refills the first organic material after removing the organic layer at the defect structure, and ensures the flatness of the surface of the organic layer on the premise of eliminating the defect structure in the organic layer, so that the organic layer has a relatively flat surface, the circuit prepared on the organic layer has good connectivity, the display effect of the display panel is improved, and the production yield is improved.
Optionally, on the basis of the foregoing embodiment, the method for manufacturing a flexible substrate provided in this embodiment further includes a method for repairing the position where the first organic material is filled. Fig. 5 is a flowchart of another method for manufacturing a flexible substrate according to an embodiment of the present invention. As shown in fig. 5, the preparation method of this embodiment includes:
s501, providing a substrate base plate;
s502, forming an organic layer on the substrate base plate; the organic layer has a defect structure therein;
s503, repairing the defect structure of the organic layer for the first time, and removing the organic layer at the defect structure to form a concave structure;
and S504, filling a first organic material in the concave structure.
And S505, repairing the position filled with the first organic material for the second time, so that the difference between the thickness of the first organic material and the preset thickness of the organic layer is within a preset range in the direction of the substrate base plate pointing to the organic layer.
Specifically, as shown in fig. 6, since the first organic material 30 has a surface tension, a protrusion may be generated at a position where the first organic material 30 is filled, and the protrusion may also break a line formed in a line layer on a side of the organic layer 20 away from the substrate 10, thereby affecting a display effect of a display panel using the flexible substrate. The second repair is performed on the positions where the first organic material 30 is filled, and the second repair may be performed on all the positions where the first organic material 30 is filled, or only on the positions where the large protrusions are formed after the first organic material 30 is filled. After the second repair, the thickness T of the first organic material 30 is filled in the direction of the base substrate 10 towards the organic layer 20, as shown in fig. 71The difference Δ T from the preset thickness T of the organic layer 20 is within a preset range. The predetermined thickness T of the organic layer 20 may be a predetermined thickness of the material of the organic layer 20 when the organic layer 20 is prepared.
This embodiment is through filling first organic material after, carries out the second time to organic material's position department and restores for in the orientation of substrate base plate directional organic layer, the difference between the thickness of first organic material and the thickness of predetermineeing of organic layer is in predetermineeing the within range, thereby can make the surface that organic layer kept away from substrate base plate one side have a smooth surface, further guarantee that the circuit layer of preparation on organic layer has good connectivity, improve display panel's display effect, improve the production yield.
Optionally, after the first organic material is filled, when the position of the first organic material is repaired for the first time, the repair is performed according to the specific thickness of the first organic material. A specific method for performing the second repair on the position filled with the first organic material may include: detecting the thickness of the first organic material to obtain the thickness of the first organic material; comparing the thickness of the first organic material with the preset thickness to obtain a thickness difference between the thickness of the first organic material and the preset thickness; and setting the time and the intensity of the second laser irradiation according to the thickness difference, and performing the second laser irradiation on the position of the first organic material. Fig. 8 is a schematic structural diagram of a second repairing method according to an embodiment of the present invention. As shown in fig. 8, the specific method of the second repair includes:
s801, detecting the thickness of the first organic material to obtain the thickness of the first organic material.
Specifically, since the first organic material has surface tension, a protrusion is generated at a position where the first organic material is filled, and the thickness at the position of the protrusion is different from the thickness at other positions of the organic layer. If the recessed structure formed after the defect structure of the organic layer is removed is a through hole penetrating through the organic layer, the thickness of the first organic layer is the thickness of the raised position, and the thickness of the first organic material can be measured by a film thickness detector.
S802, comparing the thickness of the first organic material with the preset thickness to obtain the thickness difference between the thickness of the first organic material and the preset thickness.
Specifically, when the organic layer is prepared, a predetermined thickness of the organic layer is preset, for example, 100 μm, and the predetermined thickness is ideally the thickness of the organic layer. A protrusion is formed at the filling position of the first organic material so that the thickness of the organic layer is different at the filling position of the first organic material from that at other positions. If the thickness of the organic layer at the other position is regarded as the predetermined thickness and the recess structure formed after the defect structure is removed from the organic layer is a through hole penetrating through the organic layer, the thickness difference between the thickness of the first organic material and the predetermined thickness can be obtained by comparing the thickness of the filling position of the first organic material with the predetermined thickness.
And S803, setting the time and the intensity of the second laser irradiation according to the thickness difference, and performing the second laser irradiation on the position of the first organic material.
Specifically, when the thickness difference between the thickness of the first organic material and the predetermined thickness is large, a portion of the first organic material needs to be removed, so that the thickness difference between the thickness of the first organic material and the predetermined thickness is within the predetermined range. Since the time and intensity of laser irradiation are related to the removal amount and removal speed of the first organic material. Generally, the greater the intensity of laser irradiation, the faster the removal rate of the first organic material; the longer the laser irradiation time, the more the amount of the first organic material removed. The time and intensity of the second laser irradiation of the first organic material may be set according to the magnitude of the thickness difference between the thickness of the first organic material and the preset thickness to remove a portion of the first organic material, so that the organic layer has a relatively flat surface.
The embodiment compares the detected thickness of the first organic material with the preset thickness to obtain a corresponding thickness difference, and determines the time and the intensity of the second laser irradiation according to the thickness difference, so that the organic layer has a relatively flat surface, the circuit layer prepared on the organic layer is ensured to have good connectivity, the display effect of the display panel is improved, and the production yield is improved.
Optionally, on the basis of the foregoing embodiment, the method for manufacturing a flexible substrate provided in this embodiment further includes a method for identifying a position of the defect structure before performing first repair on the defect structure of the organic layer and removing the organic layer at the defect structure to form the recess structure. Fig. 9 is a flowchart of a method for manufacturing a flexible substrate according to another embodiment of the present invention. As shown in fig. 9, the preparation method of this embodiment includes:
s901, providing a substrate base plate;
s902, forming an organic layer on the substrate base plate; the organic layer has a defect structure therein;
s903, scanning the organic layer, and collecting an image of the organic layer;
s904, comparing the parameters of the image of the organic layer with the parameters of the standard image, determining the position of the defect structure on the organic layer, and determining the area S of the vertical projection of the defect structure on the substrate.
Specifically, the organic layer formed on the base substrate has a defective structure, so that the surface of the organic layer is generally uneven with the surface of the organic layer having the defective structure. The position and size of the defect structure in the organic layer are determined by scanning the organic layer, acquiring an image of the organic layer, and comparing parameters of the acquired image with parameters of a standard image in a database. The area of the defect structure is equal to the area S of the vertical projection of the defect structure on the substrate base plate. The image acquisition of the organic layer and the determination of the position and the size of the defect structure may be performed by an Automated Optical Inspection (AOI) system, which obtains the surface state of the organic layer by an optical method, and detects the defect structure in the organic layer by an image processing method. The specific detection method of the AOI system is, for example: the method comprises the steps of automatically scanning an organic layer through a camera, collecting images of the organic layer, comparing collected image parameters with qualified standard parameters in a database, detecting the position and the size of a defect structure in the organic layer through image processing, and displaying/marking the position and the size of the defect structure through a display/an automatic mark.
S905, repairing the defect structure of the organic layer for the first time, and removing the organic layer at the defect structure to form a concave structure;
and S906, filling a first organic material in the concave structure.
The embodiment is through the image of gathering the organic layer to image parameter and the standard image parameter that will gather compare, determine defect structure's position and size in the organic layer, restore defect structure for follow-up, reduce the influence of defect to organic layer surface smoothness, thereby can guarantee that the circuit layer of preparing on the organic layer has good connectivity, improve display panel's display effect, improve the production yield.
Optionally, after determining the position and size of the defect structure, the defect structure of the organic layer is repaired for the first time, and the organic layer at the defect structure is removed to form the concrete of the recessed structureThe method comprises the following steps: carrying out first laser irradiation on the organic layer at the position of the defect structure, and removing the organic layer at the position of the defect structure to form a concave structure; wherein the area S of the vertical projection of the concave structure on the substrate base plate1The value range is as follows: s1≥S。
Specifically, the position and size S of the defect structure in the organic layer can be known by comparing the parameters of the acquired image of the organic layer with the parameters of the standard image. The position of the first laser irradiation on the organic layer and the irradiation range at that position may be set according to the position and size of the defect structure. After the first laser irradiation, the organic layer at the defect structure is removed to form a concave structure. In order to enable the defective structure to be completely removed, the range of the first laser irradiation may be set to be slightly larger than the size of the defective structure. When the area of the vertical projection of the defect structure on the substrate base plate is S, the value of the area of the vertical projection of the concave structure on the substrate base plate is S1Is more than or equal to S. When the recessed structure is a via hole penetrating the organic layer, the volume V of the recessed structure1Has a value range of V1≥S×T1Wherein T1 is a predetermined thickness of the organic layer.
Optionally, after the position and the size of the defect structure are determined, the position and the size range of the recess structure can be obtained, and the filling amount and the position of the first organic material filled in the recess structure can be determined according to the size and the position of the defect structure. A specific method of filling the first organic material at the recess structure may include: determining the filling amount of the first organic material according to the size of the defect structure; injecting the first organic material at the position of the defect structure according to the filling amount; curing the injected first organic material. Fig. 10 is a flowchart of a method for filling a first organic material according to an embodiment of the present invention. As shown in fig. 10, the method for filling the first organic material in the recess structure of the present embodiment includes:
and S1001, determining the filling amount of the first organic material according to the size of the defect structure.
In particular, by comparisonThe position and size of the defect structure can be obtained by the acquired parameters of the image of the organic layer and the parameters of the standard image. And after removing the organic layer at the position of the defect structure, the position of the formed concave structure is the position of the defect structure, and the size of the concave structure is at least equal to that of the defect structure. In order to fill the recessed structure with the first organic material, the filling amount of the first organic material may be determined according to the size of the defect structure. When the area of the vertical projection of the defect structure on the substrate base plate is S, the filling amount V of the first organic material filled in the concave structure corresponding to the defect structure2Is a V2≥S×T1Wherein T1 is a predetermined thickness of the organic layer.
S1002, injecting the first organic material at the position of the defect structure according to the filling amount;
s1003, curing the injected first organic material.
Specifically, the filling amount V in the first organic material2After the determination, the first organic material may be quantitatively and site-specifically injected using an injection apparatus for the first organic material according to the filling amount of the first organic material and the position of the recess structure. The injected first organic material may be a liquid and/or a colloid, and then the injected first organic material is cured by photo-curing and/or thermal curing to form an organic layer with a relatively flat surface.
The filling amount and the filling position of the first organic material are determined according to the size and the position of the defect structure, so that the organic layer has a relatively flat surface after the first organic material is filled, the circuit layer prepared on the organic layer can be ensured to have good connectivity, the display effect of the display panel is improved, and the production yield is improved.
The embodiment of the invention also provides a flexible substrate, and the flexible substrate can be prepared by adopting the preparation method of the flexible substrate provided by the embodiment of the invention. As shown in fig. 4, the flexible substrate 100 includes: a base substrate 10; an organic layer 20 on the base substrate 10; the organic layer has a recessed structure; the recessed structure is formed by removing the organic layer 20 at the defective structure by first repair; and a first organic material 30 filled in the recess structure.
In particular, since the flexible substrate 100 is generally bendable and deformable, the material of the flexible substrate 100 should have stronger plasticity, lower hardness, and smaller elastic modulus. The flexible substrate 100 has an organic layer 20 having strong plasticity, low hardness, and small elastic modulus, and the organic layer 20 is disposed on the base substrate 10. The material of the organic layer 20 may be a polyimide material.
However, in the process of the organic layer 20, particles, dust, temperature, etc. in the environment affect the organic layer 20 of the flexible substrate 100 to wrap the particles and/or bubbles, so that a defect structure is formed at the position where the particles and/or bubbles are wrapped. The surface of the defect structure on the side far from the substrate 10 may be raised, so that the surface of the organic layer 20 is uneven, and the circuit of the circuit layer on the side far from the substrate 10 of the organic layer 20 is broken, thereby affecting the display effect of the display panel using the flexible substrate 100. In addition, the defect structure with the encapsulated bubbles may be broken in a subsequent high temperature process, so that the material of the organic layer 20 sputtered after the breaking contaminates the equipment.
In order to eliminate the defect structure of the organic layer 20, the defect structure of the organic layer 20 is repaired to remove the organic layer 20 at the defect structure, so as to form a recess structure at the position of the defect structure. The recessed structure may be, for example, a via hole through the organic layer. Due to the concave structure of the organic layer 20, the connectivity of the circuit in the subsequent circuit layer is also affected, and thus the display effect of the display panel using the flexible substrate is affected. The first organic material 30 is filled into the recessed structure, so that the organic layer 20 has a relatively flat surface, and the characteristics of bending deformation of the organic layer are satisfied. In order to make the remaining organic layers 20 of the first organic material 30 filled in the recess structure have the same performance, the material of the organic layers 20 and the first organic material 30 may be the same material, that is, when the material of the organic layers includes the second organic material, the first organic material and the second organic material are the same material. The first organic material includes, for example, a polyimide material.
This embodiment carries out first restoration through the organic layer to lieing in on the substrate base board, forms sunk structure in the defect structure department on organic layer, packs first organic material to sunk structure department again to make under the prerequisite of defect structure elimination in the organic layer, guarantee the roughness on organic layer surface, thereby can make organic layer have relatively level and smooth surface, guarantee that the circuit has good connectivity in the circuit layer on the organic layer, and then improve display panel's display effect, improve the production yield.
Optionally, in a direction in which the substrate base plate points to the organic layer, a difference between a thickness of the first organic material and a preset thickness of the organic layer is within a preset range.
Specifically, as shown in fig. 6, the first organic material 30 filled into the recessed structure has a surface tension, so that a protrusion is formed at the position where the first organic material 30 is filled. To further improve the flatness of the surface of the organic layer, the position filled with the first organic material 30 may be repaired such that the difference between the thickness of the first organic material 30 and the predetermined thickness of the organic layer 20 is within a predetermined range [ Δ T ] in the direction of the substrate toward the organic layer1，ΔT2]And (4) the following steps.
The embodiment of the invention also provides a display panel which comprises the flexible substrate provided by the embodiment of the invention. The display panel may be, for example, a flexible organic light emitting diode display panel. Fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the present invention. As shown in fig. 11, the display panel 200 includes the flexible substrate 100 according to the embodiment of the present invention. The organic layer of the flexible substrate 100 provided by the embodiment of the invention has a relatively flat surface after being repaired, so that the circuit in the circuit layer of the display panel 200 on the organic layer of the flexible substrate 100 has good connectivity, the display effect of the display panel 200 is further improved, and the production yield of the display panel 200 is improved. The circuit layer of the display panel 200 on the organic layer of the flexible substrate 100 may include, for example, a thin film transistor, an anode and a cathode of an organic light emitting diode, and the like.
The embodiment of the invention also provides a display device which comprises the display panel. The display device may be, for example, a terminal device such as a personal digital assistant, a mobile phone, a computer, or a television. Fig. 12 is a schematic structural diagram of a display device according to an embodiment of the present invention. As shown in fig. 12, the display device 300 includes the display panel 200 according to the embodiment of the present invention. The display panel 200 includes the flexible substrate provided by the embodiment of the invention, and the organic layer of the flexible substrate has a relatively flat surface after being repaired, so that the circuit in the circuit layer of the display panel 200 on the organic layer of the flexible substrate has good connectivity, the display effect of the display device 300 is further improved, and the production yield of the display device 300 is improved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (12)
1. A method for manufacturing a flexible substrate, comprising:
providing a substrate base plate;
forming an organic layer on the base substrate; the organic layer has a defect structure therein;
repairing the defect structure of the organic layer for the first time, and removing the organic layer at the defect structure to form a concave structure;
and filling a first organic material at the concave structure.
2. The method of claim 1, further comprising, after filling the organic material at the recessed features:
and repairing the position filled with the first organic material for the second time, so that the difference between the thickness of the first organic material and the preset thickness of the organic layer is within a preset range in the direction of the substrate base plate pointing to the organic layer.
3. The method of claim 1, wherein the material of the organic layer comprises a second organic material; the first organic material and the second organic material are the same material.
4. The method of claim 3, wherein the first organic material comprises: a polyimide material.
5. The method of claim 1, further comprising, before performing a first repair on the defective structure of the organic layer to remove the organic layer at the defective structure to form a recessed structure:
scanning the organic layer and collecting an image of the organic layer;
comparing the parameters of the image of the organic layer with the parameters of a standard image, determining the position of the defect structure on the organic layer, and determining the area S of the vertical projection of the defect structure on the substrate.
6. The method of claim 5, wherein the first repairing the defect structure of the organic layer and removing the organic layer at the defect structure to form a recess structure comprises:
carrying out first laser irradiation on the organic layer at the position of the defect structure, and removing the organic layer at the position of the defect structure to form a concave structure; wherein the area S of the vertical projection of the concave structure on the substrate base plate1The value range is as follows: s1≥S。
7. The method of claim 6, wherein the filling the first organic material at the recessed features comprises:
determining the filling amount of the first organic material according to the size of the defect structure;
injecting the first organic material at the position of the defect structure according to the filling amount;
curing the injected first organic material.
8. The method of claim 2, wherein the second repairing the location filled with the first organic material comprises:
detecting the thickness of the first organic material to obtain the thickness of the first organic material;
comparing the thickness of the first organic material with the preset thickness to obtain a thickness difference between the thickness of the first organic material and the preset thickness;
and setting the time and the intensity of the second laser irradiation according to the thickness difference, and performing the second laser irradiation on the position of the first organic material.
9. A flexible substrate produced by the method for producing a flexible substrate according to any one of claims 1 to 8, comprising:
a substrate base plate;
an organic layer on the substrate base plate; the organic layer has a recessed structure; the sunken structure is formed by removing the organic layer at the position of the defect structure through first repair;
and the first organic material is filled in the concave structure.
10. The flexible substrate of claim 9, wherein a difference between a thickness of the first organic material and a predetermined thickness of the organic layer in a direction of the base substrate toward the organic layer is within a predetermined range.
11. A display panel comprising the flexible substrate according to any one of claims 9 to 10.
12. A display device, comprising: the display panel of claim 11.
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