CN111546521B - High-efficiency cutting control method of dicing saw - Google Patents

Abstract

The invention discloses a high-efficiency cutting control method of a dicing saw, which comprises the following steps ofA plurality of processed objects are loaded and installed on the scribing worktable at the same time, and cutting parameters are specifically designed, specifically, the characteristic coordinates P of the starting point based on each processed object₁And end point feature coordinates P_1’Calculating and determining cutting parameters corresponding to each processed object, and calculating characteristic coordinates P of the starting point of each processed object₁First edge near to it, and end point feature coordinates P_1’Edge distances D are respectively arranged between the second edges close to the first edges₁Simultaneously, the first edge and the second edge are respectively provided with a cutting residual starting length L in parallel along the cutting channel direction₁And length L of cutting residual position₂Determining cutting parameters corresponding to each processed object through the specific structure design; the invention realizes the simultaneous cutting of a plurality of processed objects through a single cutting process, and obviously improves the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.

Description

High-efficiency cutting control method of dicing saw

Technical Field

The invention relates to the technical field of semiconductor cutting processing, in particular to a high-efficiency cutting control method of a dicing saw.

Background

A dicing saw is an indispensable device for a subsequent processing step in the production of integrated circuits of semiconductor devices, and its main function is to cut semiconductor chips into individual chip elements, and in order to avoid the dicing saw from finding deviations during the cutting process, a manual straightening machine is usually used in the prior art for alignment adjustment. However, with the popularization of current intelligent manufacturing in domestic industry, the traditional manual straightening machine has the defects of low efficiency, low output ratio and the like, and compared with the popularization of intelligent manufacturing, the manual straightening technology has no market competitiveness.

Further, the cutting market is demanding more and more automatic alignment, and at the same time, it puts higher demands on the automatic alignment control technology, and for this reason, the applicant hopes to seek a technical solution for increasing the cutting number to achieve effective improvement of the cutting efficiency of the dicing saw.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a high-efficiency cutting control method for a dicing saw, which simultaneously loads and installs a plurality of processed objects on a dicing table, and simultaneously performs a specific design on cutting parameters, so as to simultaneously cut the plurality of processed objects through a single cutting process, and significantly improve the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.

The technical scheme adopted by the invention is as follows:

a high-efficiency cutting control method of a dicing saw comprises a dicing worktable, an image acquisition module, a driving assembly and a cutting tool, wherein a theoretical characteristic position cutting model of a machined object is pre-stored in the image acquisition module, the dicing worktable is arranged on the driving assembly, and the cutting demand of the machined object on the dicing worktable is realized through the cutting tool positioned above the dicing worktable; the scribing worktable is provided with at least 2 identical first machined objects and second machined objects which are loaded and installed at intervals, an X-Y coordinate system is established by the central point of the scribing worktable, the first machined objects and the second machined objects are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing worktable, and the first machined objects and the second machined objects are provided with at least 1 identical cutting channels;

the same cutting channel is cut by adopting a high-efficiency cutting control method, and the method comprises the following operation steps:

A10) rotating the scribing worktable to the same cutting channel direction of each machined object, and automatically aligning and identifying the machined objects corresponding to the scribing worktable according to the theoretical characteristic position cutting model corresponding to each machined object through the image acquisition module, wherein the automatic alignment and identification are carried out on the machined objectsThe alignment recognition result comprises the characteristic coordinate P of the starting point of the corresponding processed object₁And end point feature coordinates P_1’；

A20) Based on the characteristic coordinate P of the starting point of each processed object₁And end point feature coordinates P_1’Calculating and determining cutting parameters corresponding to each processed object, wherein the cutting parameters of each processed object comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the starting point of each workpiece₁First edge near to it, and end point feature coordinates P_1’Edge distances D are respectively arranged between the second edges close to the first edges₁The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L₁And length L of cutting residual position₂The cutting residual starting length L₁And length L of cutting residual position₂Are all parallel to the cutting channel direction;

A30) and the cutting tool executes the cutting parameters of the cutting tool corresponding to each machined object and simultaneously realizes the rapid cutting of each machined object in the same cutting channel based on the automatic alignment recognition result.

Preferably, the lower tool position P of each machined object and the characteristic coordinate P of the starting point of the corresponding machined object₁The distance difference between them is D₁+L₁(ii) a The cut length S of each processed product was 2 × D₁+L₁+L+L₂(ii) a Wherein L is the characteristic coordinate P of the end point of the corresponding processed object_1’With its characteristic coordinates P of the starting point₁The effective cutting length in between.

Preferably, the edge distance D₁In the range of 1-3mm, the cutting residual starting length L₁Is in the range of 1-3mm, the length L of the cutting residual end position₂Is in the range of 1-3mm and the effective cutting length is in the range of 80-100 mm.

Preferably, a workpiece distance D is provided between the first workpiece and the second workpiece₂The distance D between the workpieces₂In the range of 1-3 mm.

Preferably, at least 4 identical first machined objects, second machined objects, third machined objects and fourth machined objects which are loaded and installed at intervals are arranged on the scribing worktable, an X-Y coordinate system is established by the central point of the scribing worktable, and the first machined objects, the second machined objects, the third machined objects and the fourth machined objects are positioned in different quadrants of the X-Y coordinate system and are distributed pairwise symmetrically relative to the X-Y coordinate system; each of the workpieces has a first identical cutting channel and a second identical cutting channel.

Preferably, the first identical cutting channel is perpendicular to the second identical cutting channel.

Preferably, the first processed object and the second processed object are firstly cut by a first same cutting channel, then the third processed object and the fourth processed object are cut by a first same cutting channel, then the first processed object and the third processed object are cut by a second same cutting channel, and finally the second processed object and the fourth processed object are cut by a first same cutting channel.

Preferably, the first processed object and the second processed object are firstly subjected to first identical cutting channel cutting, then the third processed object and the fourth processed object are subjected to first identical cutting channel cutting, and then the first processed object, the second processed object, the third processed object and the fourth processed object are sequentially subjected to second identical cutting channel cutting.

Preferably, the starting point feature coordinates P₁The identification control process comprises the following steps:

when the image acquisition module identifies again, the image acquisition module firstly identifies the set upper left corner coordinate to identify the feature point, and when the image acquisition interface does not find the feature coordinate P of the starting point₁The spiral motion of the image acquisition module from inside to outside is used for searching the characteristic coordinate P of the initial point₁Wherein the motion process comprises: firstly moving one step unit to the negative direction of Y axis, then moving one step unit to the negative direction of X axis, then moving two step units to the positive direction of Y axis, then moving three step units to the positive direction of X axis, then moving three step units to the negative direction of Y axis, and adding a single step unit according to the sequenceCirculating as a motion track until the image acquisition interface identifies the characteristic coordinate P of the starting point₁。

Preferably, the processed object is a semiconductor wafer, and the scribing worktable adopts a vacuum adsorption worktable disc; the driving assembly comprises a T-direction motor capable of rotating in the forward and reverse directions and an X-Y axis movement module, the scribing worktable is installed on the T-direction motor, and the T-direction motor is installed on the X-Y axis movement module in a relatively rotating mode.

The invention loads and installs a plurality of processed objects on the scribing worktable at the same time, performs specific design on cutting parameters, and particularly performs characteristic coordinate P based on the starting point of each processed object₁And end point feature coordinates P_1’Calculating and determining cutting parameters (specifically including a lower cutter position P and a cutting length S) corresponding to each machined object, and in order to ensure the cutting quality and avoid damaging the machined objects, the invention creatively provides a characteristic coordinate P of a starting point of each machined object₁First edge near to it, and end point feature coordinates P_1’Edge distances D are respectively arranged between the second edges close to the first edges₁Simultaneously, the first edge and the second edge are respectively provided with a cutting residual starting length L in parallel along the cutting channel direction₁And length L of cutting residual position₂Determining cutting parameters corresponding to each processed object through the specific structure design; therefore, the invention realizes the simultaneous cutting of a plurality of processed objects through a single cutting process, and obviously improves the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.

Drawings

FIG. 1 shows the characteristic coordinates P of the starting point of the first wafer in example 1 of the present invention₁Identifying a motion trail interface diagram;

FIG. 2 is a loading and mounting interface diagram of each wafer on a dicing table in example 1 of the present invention;

FIG. 3 is a loading interface diagram of a scribing table on which 4 wafers are loaded in embodiment 2 of the present invention;

FIG. 4 is a schematic view of the whole process for rapidly cutting each wafer in example 2 of the present invention;

fig. 5 is a schematic flow chart of a process for cutting each wafer in the first same cutting channel in embodiment 2 of the present invention;

fig. 6 is a schematic flow chart of a process for cutting each wafer in a second identical cutting channel in embodiment 2 of the present invention.

Detailed Description

The embodiment of the invention discloses a high-efficiency cutting control method of a dicing saw, wherein the dicing saw comprises a dicing worktable, an image acquisition module pre-storing a theoretical characteristic position cutting model of a machined object, and the dicing worktable is arranged on a driving assembly, and the cutting requirement on the machined object on the dicing worktable is realized through a cutting tool positioned above the dicing worktable; the scribing workbench is provided with at least 2 identical first machined objects and second machined objects which are loaded at intervals, an X-Y coordinate system is established by the central point of the scribing workbench, the first machined objects and the second machined objects are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing workbench, and the first machined objects and the second machined objects are provided with at least 1 identical cutting channel; the same cutting channel is cut by adopting a high-efficiency cutting control method, and the method comprises the following operation steps: A10) rotating the scribing worktable to the same cutting channel direction of each processed object, and automatically aligning and identifying the corresponding processed object through the image acquisition module according to the theoretical characteristic position cutting model corresponding to each processed object, wherein the automatic alignment and identification result comprises the initial point characteristic coordinate P of the corresponding processed object₁And end point feature coordinates P_1’；

A20) Based on the characteristic coordinates P of the starting point of each processed object₁And end point feature coordinates P_1’Calculating and determining cutting parameters corresponding to each processed object, wherein the cutting parameters of each processed object comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the starting point of each workpiece₁First edge near to it, and end point feature coordinates P_1’Edge distances D are respectively arranged between the second edges close to the first edges₁The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L₁And length L of cutting residual position₂Cutting residual start length L₁And length L of cutting residual position₂Are all parallel to the direction of the cutting channel; A30) and the cutting tool executes the cutting parameters of the cutting tool corresponding to each machined object, and simultaneously realizes the rapid cutting of each machined object in the same cutting channel based on the automatic alignment recognition result.

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1: a high-efficiency cutting control method of a dicing saw comprises a dicing worktable, an image acquisition module pre-stored with a theoretical characteristic position cutting model of a processed object, and the dicing worktable installed on a driving assembly, wherein the cutting demand of the processed object on the dicing worktable is realized through a cutting tool above the dicing worktable, and particularly preferably, in the embodiment, as shown in figure 1, the processed object is a semiconductor wafer 1, and the dicing worktable adopts a vacuum adsorption worktable disc; the driving assembly comprises a T-direction motor capable of rotating in the forward and reverse directions and an X-Y axis movement module, the scribing worktable is installed on the T-direction motor, and the T-direction motor can be installed on the X-Y axis movement module in a relatively rotating mode;

in the embodiment, 2 identical first wafer 1 and second wafer 1 which are loaded and installed at intervals are arranged on a scribing worktable, an X-Y coordinate system is established by using the central point of the scribing worktable, the first wafer 1 and the second wafer 1 are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing worktable, and the first wafer 1 and the second wafer 1 have 1 identical cutting channel; the same cutting channel is cut by adopting a high-efficiency cutting control method, and comprises the following operation steps:

A10) the scriberThe worktable rotates to the same cutting channel direction of each wafer 1, the image acquisition module performs automatic alignment identification on the corresponding wafer 1 according to the theoretical characteristic position cutting model corresponding to each wafer 1, and the automatic alignment identification result comprises the initial point characteristic coordinate P of the corresponding wafer 1₁And end point feature coordinates P_1’(ii) a Preferably, in this step a10), please further refer to fig. 1, the starting point feature coordinate P₁The identification control process comprises the following steps:

when the image acquisition module identifies again, the feature point identification is carried out on the set upper left corner coordinate first, and when the image acquisition interface is found not to find the feature coordinate P of the starting point₁The spiral motion of the image acquisition module from inside to outside is used for searching the characteristic coordinate P of the initial point₁Wherein, the motion process includes: firstly moving one stepping unit to the negative direction of the Y axis, then moving one stepping unit to the negative direction of the X axis, then moving two stepping units to the positive direction of the Y axis, then moving three stepping units to the positive direction of the X axis, then moving three stepping units to the negative direction of the Y axis, and adding a single stepping unit according to the sequence as a motion track cycle until the characteristic coordinate P of the identification starting point of the image acquisition interface is taken as a motion track cycle until the characteristic coordinate P of the identification starting point₁(ii) a Specifically, in the present embodiment, each step unit is 1 mm;

A20) referring to FIG. 2, the feature coordinates P of the starting point of each wafer 1 are based₁And end point feature coordinates P_1’Calculating and determining cutting parameters corresponding to each wafer 1, wherein the cutting parameters of each wafer 1 comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the start point of each wafer 1₁First edge near to it, and end point feature coordinates P_1’Edge distances D are respectively arranged between the second edges close to the first edges₁The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L₁And length L of cutting residual position₂Cutting residual start length L₁And length L of cutting residual position₂Are all parallel to the direction of the cutting channel;

preferably, in the present embodiment, each wafer1 and the characteristic coordinate P of the starting point of the corresponding wafer 1₁The distance difference between them is D₁+L₁(ii) a The cutting length S of each wafer 1 is 2 × D₁+L₁+L+L₂(ii) a Wherein L is the characteristic coordinate P of the end point of the corresponding wafer 1_1’With its characteristic coordinates P of the starting point₁Effective cutting length in between; particularly preferably, the edge distance D₁In the range of 1-3mm, the cutting residual starting length L₁Is in the range of 1-3mm, and the length L of the cutting residual position₂The range of (1-3 mm) and the range of effective cutting length of 80-100 mm; a wafer 1 space D is arranged between the first wafer 1 and the second wafer 1₂1 pitch D of wafer₂Is in the range of 1-3 mm; wafer 1 pitch D₂Length L of the cutting residual position of the first wafer 1 and the second wafer 1₂；

A30) And the cutting tool executes the cutting parameters of the cutting tool corresponding to each wafer 1, and simultaneously realizes the rapid cutting of each wafer 1 in the same cutting channel based on the automatic alignment recognition result.

Example 2: the other technical solutions of this embodiment 2 are the same as those of embodiment 1, except that, in this embodiment 2, please refer to fig. 3, and refer to fig. 1 in combination, 4 identical first, second, third and fourth wafers 1a, 1b, 1c and 1D, which are loaded and installed at intervals, are arranged on the dicing table 2, an X-Y coordinate system is established with a central point of the dicing table 2, the first, second, third and fourth wafers 1a, 1b, 1c and 1D are located in different quadrants of the X-Y coordinate system, and are symmetrically distributed in pairs with respect to the X-Y coordinate system, and a wafer spacing D is provided between every two adjacent wafers₂Wafer spacing D₂Is 1.6mm, each wafer edge distance D₁2.2mm, the cutting residual starting length L₁2.5mm, length L of the cutting residual position₂Is 1.6mm (wafer pitch D)₂Can be used as the length L of the cutting residual ending position₂) The effective cutting length L is 90 mm;

the image acquisition module recognizes that: starting point of the first wafer 1aCharacteristic coordinate P₁(-75mm, 60mm), characteristic coordinates P of the starting point of the second wafer 1b₂(0.8mm, 60mm), the characteristic coordinates P of the starting point of the third wafer 1c₃(-75mm, -0.8mm), characteristic coordinates P of the starting point of the fourth wafer 1d₄(0.8mm, -0.8 mm); each wafer is provided with a first same cutting channel and a second same cutting channel; wherein the first identical cutting channels are 90 ° perpendicular to the second identical cutting channels; preferably, as shown in fig. 4, in the present embodiment, first, the first identical cutting channel cutting is performed on the first wafer 1a and the second wafer 1b, then, the first identical cutting channel cutting is performed on the third wafer 1c and the fourth wafer 1d, and then, the second identical cutting channel cutting is performed on the first wafer 1a, the second wafer 1b, the third wafer 1c, and the fourth wafer 1d in sequence, which is favorable for a better cutting effect; specifically, in the present embodiment, please further refer to fig. 5, in an initial state, after the whole dicing table 2 rotates clockwise by 270 °, the first same cutting channel cutting is performed on the first wafer 1a and the second wafer 1b, and after the whole dicing table 2 rotates counterclockwise by 180 °, the first same cutting channel cutting is performed on the third wafer 1c and the fourth wafer 1 d; after the first identical cutting channel is finished; as further shown in fig. 6, when the scribing worktable 2 rotates counterclockwise by 90 ° in its entirety, the first wafer 1a is first cut through the second same cutting channel, when the scribing worktable 2 rotates clockwise by 180 ° in its entirety, the second wafer 1b is cut through the second same cutting channel, when the scribing worktable 2 rotates counterclockwise by 180 ° in its entirety, the third wafer 1c is cut through the second same cutting channel, and finally, when the scribing worktable 2 rotates clockwise by 180 ° in its entirety, the fourth wafer 1d is cut through the second same cutting channel, thereby completing the cutting process efficiently;

in other embodiments, the following cutting sequence may be used as an alternative: firstly, the first wafer 1a and the second wafer 1b are subjected to cutting in the same cutting channel, then the third wafer 1c and the fourth wafer 1d are subjected to cutting in the same cutting channel, then the first wafer 1a and the third wafer 1c are subjected to cutting in the same cutting channel, and finally the second wafer 1b and the fourth wafer 1d are subjected to cutting in the same cutting channel, so that higher cutting efficiency can be obtained.

In this embodiment, 4 wafers are loaded and mounted on the scribing table 2 at the same time, and the cutting parameters are specifically designed, specifically, the characteristic coordinates P of the starting point based on each wafer₁And end point feature coordinates P_1’Calculating and determining cutting parameters (specifically including a cutting position P and a cutting length S) corresponding to each wafer 1a, 1b, 1c, 1d, and in order to ensure the cutting quality and avoid damage to the wafers 1a, 1b, 1c, 1d, the present embodiment creatively proposes that a characteristic coordinate P is set at a starting point of each wafer 1a, 1b, 1c, 1d₁、P₂、P₃、P₄First edge near to it, and end point feature coordinates P_1’、P_2’、P_3’、P_4’Edge distances D are respectively arranged between the second edges close to the first edges₁Simultaneously, the first edge and the second edge are respectively provided with a cutting residual starting length L in parallel along the cutting channel direction₁And length L of cutting residual position₂Determining cutting parameters corresponding to the wafers 1a, 1b, 1c and 1d through the specific structure designs; therefore, the present embodiment realizes simultaneous cutting of four wafers 1a, 1b, 1c, and 1d by a single cutting process, and significantly improves the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (9)

1. A high-efficiency cutting control method of a dicing saw comprises a dicing worktable, an image acquisition module, a driving assembly and a cutting tool, wherein a theoretical characteristic position cutting model of a machined object is pre-stored in the image acquisition module, the dicing worktable is arranged on the driving assembly, and the cutting demand of the machined object on the dicing worktable is realized through the cutting tool positioned above the dicing worktable; the scribing worktable is provided with at least 2 identical first machined objects and second machined objects which are loaded and installed at intervals, an X-Y coordinate system is established by using the central point of the scribing worktable, the first machined objects and the second machined objects are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing worktable, and the first machined objects and the second machined objects are provided with at least 1 identical cutting channels;

the same cutting channel is cut by adopting a high-efficiency cutting control method, and the method comprises the following operation steps:

A10) rotating the scribing worktable to the same cutting channel direction of each processed object, and automatically aligning and identifying the corresponding processed object through an image acquisition module according to a theoretical characteristic position cutting model corresponding to each processed object, wherein the automatic alignment and identification result comprises a starting point characteristic coordinate P of the corresponding processed object₁And end point feature coordinates P_1’；

A20) Based on the characteristic coordinate P of the starting point of each processed object₁And end point feature coordinates P_1’Calculating and determining cutting parameters corresponding to each processed object, wherein the cutting parameters of each processed object comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the starting point of each workpiece₁First edge near to it, and end point feature coordinates P_1’Edge distances D are respectively arranged between the second edges close to the first edges₁The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L₁And length L of cutting residual position₂The cutting residual starting length L₁And length L of cutting residual position₂Are all parallel to the cutting channel direction;

A30) the cutting tool executes the cutting parameters of the cutting tool corresponding to each machined object, and simultaneously realizes the rapid cutting of each machined object in the same cutting channel based on the automatic alignment recognition result;

the scribing worktable is provided with at least 4 first machined objects, second machined objects, third machined objects and fourth machined objects which are identical and are loaded at intervals, an X-Y coordinate system is established by the central point of the scribing worktable, and the first machined objects, the second machined objects, the third machined objects and the fourth machined objects are positioned in different quadrants of the X-Y coordinate system and are symmetrically distributed in pairs relative to the X-Y coordinate system; each of the workpieces has a first identical cutting channel and a second identical cutting channel.

2. The high-efficiency cutting control method according to claim 1, wherein the lower tool position P of each machined object and the starting point feature coordinate P of the corresponding machined object₁The distance difference between them is D₁+ L₁(ii) a Cutting length S =2 × D of each processed product₁+L₁+L+ L₂(ii) a Wherein L is the characteristic coordinate P of the end point of the corresponding processed object_1’With its characteristic coordinates P of the starting point₁The effective cutting length in between.

3. The high efficiency cutting control method of claim 2, wherein the edge distance D₁In the range of 1-3mm, the cutting residual starting length L₁Is in the range of 1-3mm, the length L of the cutting residual end position₂Is in the range of 1-3mm and the effective cutting length is in the range of 80-100 mm.

4. The high-efficiency cutting control method according to claim 1, 2 or 3, wherein a workpiece distance D is provided between the first workpiece and the second workpiece₂The distance D between the workpieces₂In the range of 1-3 mm.

5. The method of claim 1, wherein the first identical cutting channel is perpendicular to the second identical cutting channel.

6. The high-efficiency cutting control method according to claim 5, characterized in that first identical cutting pass cutting is performed on the first processed product and the second processed product, then first identical cutting pass cutting is performed on the third processed product and the fourth processed product, then second identical cutting pass cutting is performed on the first processed product and the third processed product, and finally first identical cutting pass cutting is performed on the second processed product and the fourth processed product.

7. The high-efficiency cutting control method according to claim 5, characterized in that first identical cutting pass cutting is performed on the first processed product and the second processed product, then first identical cutting pass cutting is performed on the third processed product and the fourth processed product, and then second identical cutting pass cutting is performed on the first processed product, the second processed product, the third processed product, and the fourth processed product in sequence.

8. The high-efficiency cutting control method according to claim 1, wherein the starting point feature coordinate P is set to the starting point feature coordinate P₁The identification control process comprises the following steps:

when the image acquisition module identifies again, the image acquisition module firstly identifies the set upper left corner coordinate to identify the feature point, and when the image acquisition interface does not find the feature coordinate P of the starting point₁The spiral motion of the image acquisition module from inside to outside is used for searching the characteristic coordinate P of the initial point₁Wherein, the motion process includes: firstly moving one stepping unit to the negative direction of the Y axis, then moving one stepping unit to the negative direction of the X axis, then moving two stepping units to the positive direction of the Y axis, then moving three stepping units to the positive direction of the X axis, then moving three stepping units to the negative direction of the Y axis, and adding a single stepping unit according to the sequence as a motion track cycle until the characteristic coordinate P of the identification starting point of the image acquisition interface is taken as a motion track cycle until the characteristic coordinate P of the identification starting point₁。

9. The high-efficiency cutting control method according to claim 1, wherein the workpiece is a semiconductor wafer, and the scribing worktable adopts a vacuum adsorption worktable disc; the driving assembly comprises a T-direction motor capable of rotating in the forward and reverse directions and an X-Y axis movement module, the scribing worktable is installed on the T-direction motor, and the T-direction motor is installed on the X-Y axis movement module in a relatively rotating mode.

Images