CN111526966A - Laser processing apparatus and method - Google Patents
Laser processing apparatus and method Download PDFInfo
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- CN111526966A CN111526966A CN201780098050.XA CN201780098050A CN111526966A CN 111526966 A CN111526966 A CN 111526966A CN 201780098050 A CN201780098050 A CN 201780098050A CN 111526966 A CN111526966 A CN 111526966A
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
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- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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Abstract
Description
技术领域technical field
本发明涉及激光处理装置和方法。特别地,本发明涉及通过激光处理的材料的焊接。The present invention relates to a laser processing apparatus and method. In particular, the present invention relates to the welding of materials processed by a laser.
背景技术Background technique
当利用激光射束焊接金属时,激光射束通常通过聚光透镜聚光成100-500µm的点,以增加能量密度并瞬时将工件加热到1500℃的温度或以上,使得工件熔化。同时,可以馈送辅助气体以防止熔化金属的氧化。与CO2激光器的十微米波段中的激光射束相比,来自固态激光器或光纤激光器的一微米波段的激光射束实现了金属机件上的非常高的光能强度和吸收率。然而,如果具有高斯射束的一微米波段激光射束与氧气辅助气体一起用于切割软钢板工件,则工件的顶面上的熔化宽度不必要地变宽并且削弱切口控制。另外,可能发生使激光切割的质量降低的自燃。When welding metals with a laser beam, the laser beam is usually condensed into a 100-500µm spot by a condenser lens to increase the energy density and instantaneously heat the workpiece to a temperature of 1500°C or above, causing the workpiece to melt. At the same time, auxiliary gas can be fed to prevent oxidation of the molten metal. Laser beams in the one-micrometer band from solid-state lasers or fiber lasers achieve very high light energy intensities and absorption rates on metal parts compared to laser beams in the ten-micrometer band of CO2 lasers. However, if a one-micron band laser beam with a Gaussian beam is used to cut a mild steel plate workpiece with an oxygen assist gas, the melting width on the top surface of the workpiece is unnecessarily widened and kerf control is impaired. In addition, spontaneous combustion that degrades the quality of the laser cut may occur.
在激光材料处理的领域中已知的是使用环形形状的激光射束,其提供可以被描述为具有环状或“油煎圈饼”状形状的强度分布。已经观察到,当使用油煎圈饼射束而不是较常规的射束分布时,可以以低得多的功率电平执行给定厚度的金属的切割,这可以改进切割速度和质量。It is known in the art of laser material processing to use a ring-shaped laser beam, which provides an intensity distribution that can be described as having a ring-shaped or "doughnut"-like shape. It has been observed that cutting of a given thickness of metal can be performed at a much lower power level when using a donut beam rather than a more conventional beam profile, which can improve cutting speed and quality.
US8781269公开了将激光射束引导到多包层光纤以生成输出激光射束的不同射束分布特性的各种布置,其中输入激光射束被选择性地耦合到内光纤芯中或外环形芯中。US8781269 discloses various arrangements for directing a laser beam into a multi-clad fiber to generate different beam distribution characteristics of an output laser beam, wherein the input laser beam is selectively coupled into an inner fiber core or an outer annular core .
这种材料处理应用力求使激光射束的亮度最大化。亮度被定义为每单位立体角和单位面积的功率。作为亮度的重要性的示例,通过增加激光射束的亮度,可以增加处理速度或材料厚度。高亮度激光射束可以从例如光纤激光器和薄盘激光器获得。直接二极管激光器在亮度方面也已经不断改进,但是用于材料处理的商业直接二极管激光器的确尚未达到光纤或薄盘激光器的亮度。This material processing application seeks to maximize the brightness of the laser beam. Brightness is defined as power per unit solid angle and unit area. As an example of the importance of brightness, by increasing the brightness of the laser beam, processing speed or material thickness can be increased. High brightness laser beams can be obtained from, for example, fiber lasers and thin disk lasers. Direct diode lasers have also continued to improve in brightness, but it is true that commercial direct diode lasers for materials processing have not yet achieved the brightness of fiber or thin disk lasers.
在根据现有技术的激光焊接中,激光射束的穿透可以沿着焊接焊缝变化,从而导致不规则或粗糙的焊接焊缝。因此,存在对于用于激光焊接的改进的方法和设备的需要。In laser welding according to the prior art, the penetration of the laser beam can vary along the welding seam, resulting in an irregular or rough welding seam. Accordingly, there is a need for improved methods and apparatus for laser welding.
发明内容SUMMARY OF THE INVENTION
本发明由独立权利要求的特征限定。在从属权利要求中限定了一些特定实施例。The invention is defined by the features of the independent claims. Some specific embodiments are defined in the dependent claims.
根据本发明的一个方面,一种激光处理装置包括:至少一个第一激光器设备,其各自为至少一个第一光学馈送光纤提供第一激光射束;至少一个第二激光器设备,其各自为至少一个第二光学馈送光纤提供第二激光射束;用于生成复合激光射束的工具,其包括用于焊接工件的第一输出激光射束和第二输出激光射束;其中第一输出激光射束具有圆形横截面,并且第二输出激光射束具有与第一输出激光射束同心的环形形状。第二激光器设备为光纤激光器设备或光纤耦合激光器设备。装置被配置成至少基于第二激光射束形成第二输出激光射束,并且第二输出激光射束包括具有至少10纳米的差的第一波长和第二波长,或者第二输出激光射束具有至少10纳米的光谱宽度。According to one aspect of the invention, a laser processing apparatus comprises: at least one first laser device each providing a first laser beam to at least one first optical feed fiber; at least one second laser device each being at least one A second optical feed fiber provides a second laser beam; a tool for generating a composite laser beam comprising a first output laser beam and a second output laser beam for welding workpieces; wherein the first output laser beam has a circular cross-section, and the second output laser beam has an annular shape concentric with the first output laser beam. The second laser device is a fiber laser device or a fiber coupled laser device. The apparatus is configured to form a second output laser beam based at least on the second laser beam, and the second output laser beam includes a first wavelength and a second wavelength having a difference of at least 10 nanometers, or the second output laser beam has Spectral width of at least 10 nanometers.
根据本发明的第二方面,一种用于利用激光射束焊接工件的方法包括以下步骤:According to a second aspect of the present invention, a method for welding a workpiece with a laser beam comprises the steps of:
-从连接到至少一个第一激光器设备的至少一个第一光学馈送光纤提供至少一个第一激光射束;- providing at least one first laser beam from at least one first optical feed fiber connected to at least one first laser device;
-从连接到至少一个第一激光器设备的至少一个第二光学馈送光纤提供至少一个第二激光射束;- providing at least one second laser beam from at least one second optical feed fiber connected to at least one first laser device;
-生成复合激光射束,其包括用于焊接工件的第一输出激光射束和第二输出激光射束;其中第一输出激光射束具有圆形横截面,并且第二输出激光射束具有与第一输出激光射束同心的环形形状,第二输出激光射束(2)至少基于第二激光射束通过光纤激光器设备或光纤耦合激光器设备形成,第二输出激光射束(2)包括具有至少10纳米的差的第一波长和第二波长,或者第二输出激光射束(2)具有至少10纳米的光谱宽度。- generating a composite laser beam comprising a first output laser beam and a second output laser beam for welding workpieces; wherein the first output laser beam has a circular cross-section and the second output laser beam has the same The concentric annular shape of the first output laser beam, the second output laser beam (2) is formed by a fiber laser device or a fiber-coupled laser device based at least on the second laser beam, the second output laser beam (2) comprises a The difference of 10 nanometers between the first wavelength and the second wavelength, or the second output laser beam (2), has a spectral width of at least 10 nanometers.
根据实施例,第二光纤激光输出射束的波长是800-815nm。According to an embodiment, the wavelength of the second fiber laser output beam is 800-815 nm.
根据实施例,第一激光器设备包括光纤激光器设备,并且第二激光器设备包括光纤耦合二极管激光器设备。According to an embodiment, the first laser device comprises a fiber laser device and the second laser device comprises a fiber coupled diode laser device.
根据实施例,激光处理装置和复合激光射束适于焊接具有1-20mm之间的厚度的铝板。According to an embodiment, the laser processing device and the composite laser beam are suitable for welding aluminium sheets having a thickness between 1-20 mm.
根据实施例,提供了在功能上连接到第一和第二激光器设备的控制单元,以单独地控制第一和/或第二输出激光射束中的功率密度。According to an embodiment, a control unit functionally connected to the first and second laser devices is provided to individually control the power density in the first and/or second output laser beams.
接下来,参考所附的图较详细地描述本发明的实施例。Next, embodiments of the present invention are described in more detail with reference to the accompanying drawings.
附图说明Description of drawings
在以下,参考所附的附图详细描述本发明,其中In the following, the present invention is described in detail with reference to the accompanying drawings, in which
图1a和1c图示了根据本发明的一些实施例的激光焊接操作的示例;Figures 1a and 1c illustrate an example of a laser welding operation according to some embodiments of the present invention;
图1b图示了根据本发明的一些实施例的复合激光射束的横截面;Figure lb illustrates a cross-section of a composite laser beam according to some embodiments of the invention;
图2a和2b图示了根据本发明的一些实施例的第二输出激光射束的性质;Figures 2a and 2b illustrate properties of a second output laser beam according to some embodiments of the present invention;
图3图示了用于聚焦复合激光射束的光学布置;Figure 3 illustrates an optical arrangement for focusing a composite laser beam;
图4图示了与瑞利长度相关的射束参数;Figure 4 illustrates beam parameters related to Rayleigh length;
图5图示了针对焦移的模拟结果;Figure 5 illustrates simulation results for focus shift;
图6图示了根据本发明的一些实施例的用于激光射束分布功率控制的控制单元;Figure 6 illustrates a control unit for laser beam distribution power control in accordance with some embodiments of the present invention;
图7示出了根据本发明的一些实施例的装置的示例;Figure 7 shows an example of an apparatus according to some embodiments of the invention;
图8a示出了根据一些实施例的耦合工具的接收端的横截面;Figure 8a shows a cross-section of a receiving end of a coupling tool according to some embodiments;
图8b图示了根据一些实施例的耦合工具的输出处的折射率分布;以及Figure 8b illustrates the refractive index profile at the output of a coupling tool according to some embodiments; and
图9示意性地示出了根据实施例的光学部件。Figure 9 schematically illustrates an optical component according to an embodiment.
具体实施方式Detailed ways
现在提供了一种使能够改进焊接质量的方法和装置。这通过应用下面进一步说明的特定复合激光射束配置来实现。There is now provided a method and apparatus enabling improved weld quality. This is achieved by applying the specific compound laser beam configuration described further below.
参考图1a,本特征可以应用在一种方法和装置中,其中具有基本上圆形横截面的第一激光输出射束1和具有与第一激光输出射束同心的基本上环状形状的第二激光输出射束2从激光处理头3施加到要焊接的工件4部分。因此,第一输出激光射束1可以被称为圆形或中心射束,并且第二输出激光射束2可以被称为环状或环形射束。Referring to Figure 1a, the present feature may be employed in a method and apparatus in which a first
在图1b中图示了从激光处理头3出射到工件4的复合激光射束7的结构。环状外环形射束2传送由第二激光器设备提供的激光功率。对应地,内中心射束1传送由第一激光器设备提供的激光功率。The structure of the
在一些实施例中,中心射束1基于来自光纤激光器(设备)的激光射束形成,以及环形射束2由光纤激光器(设备)或光纤耦合激光器(设备)形成。中心射束1和环形射束2可以选择性地被引导至要焊接的元件。In some embodiments, the
如图1c中所图示,中心射束1可以配置成在工件中引起锁眼图案。在射束1和2之间是环状成形区8,其仅提供杂散或完全不提供激光辐射。As illustrated in Figure 1c, the
在复合激光射束7中应用特定的环状射束配置以改进焊接质量。在一些实施例中,环形射束2包括两个不同波长的射束2a、2b。如图2a中进一步图示的,环形射束2可以包括具有至少10纳米的差的第一波长和第二波长,其可以指代平均波长的差。在一些替代实施例中,参考图2b,环形射束2具有至少10纳米的光谱宽度,其可以指代环形射束2的总光谱宽度,所述环形射束2可以由在一些实施例中可以具有不同波长的一个或多个射束形成。要注意,图2b仅图示了用于确定光谱宽度的一个选项,并且可以在强度峰的较高强度水平处定义环形射束的光谱宽度。在另外的实施例中,光谱宽度不超过100nm,并且其可以在10nm至100nm之间的区域(诸如10-50nm)中选择。A specific annular beam configuration is applied in the
应用平均波长的至少10nm差或至少10nm宽光谱的本布置实现沿着射束路径的穿透深度的较小变化。这由图1c中的线6图示,与在没有特定环状射束构造的情况下提供的线5相比,所述线6具有相对小的变化。另外,可以减少飞溅的量并且实现较低的孔隙率。此外,具有平均波长的至少10nm差或至少10nm宽光谱的环形射束2可以用于在焊接铝和铝合金的同时从表面去除氧化铝而不变形。该方法减少了氧化铝封闭的量并提供了较好和较强的焊接焊缝质量。另外,可以避免或减少在焊接之前用于去除氧化物的附加准备。The present arrangement applying at least 10 nm difference in mean wavelength or at least 10 nm wide spectrum achieves a small variation in penetration depth along the beam path. This is illustrated by
已经在环形射束2中利用不同的光谱宽度测试了特定的复合激光射束配置。观察到10nm的光谱宽度提供比5nm的光谱宽度显著更好的焊缝质量和更低的孔隙率。在示例配置中,环形射束2的约100nm的光谱宽度可以通过以20nm间隔(在第二激光器设备输出中)设置四个激光射束源来实现,所述激光射束源各自具有10nm光谱宽度。例如,可以应用在1030-1090nm的区中的波长。Specific composite laser beam configurations have been tested in
参考图3,图示了用于激光射束变换的光学系统。在至少一些实施例中,这种光学系统可以应用在用于复合激光射束7的激光处理头3中。Referring to Figure 3, an optical system for laser beam transformation is illustrated. In at least some embodiments, such an optical system may be used in a
准直透镜和聚焦透镜的焦距分别为fcol和ffoc,θ0是会聚角,d0是射束直径,以及ZR是工件上焦点处的瑞利距离。The focal lengths of the collimating and focusing lenses are f col and f foc , respectively, θ 0 is the convergence angle, d 0 is the beam diameter, and Z R is the Rayleigh distance at the focal point on the workpiece.
聚焦直径取决于发散角以及取决于聚焦射束的射束参数乘积(bpp)。其中M2为射束理想因子并且λ为射束的自由空间波长。The focus diameter depends on the divergence angle and on the beam parameter product (bpp) of the focused beam. where M2 is the beam ideality factor and λ is the free space wavelength of the beam.
图4进一步图示了与瑞利距离相关的射束参数。瑞利距离是用于评估由于在处理头的光学器件中使用的材料的折射率的色散而引起的具有宽光谱激光器的波长的焦点偏移Df的合适标度。瑞利距离ZR提供聚焦长度,在所述聚焦长度中激光射束处于聚焦。参数b=2ZR可以描述为聚焦深度。理想高斯激光射束的瑞利距离由聚焦处的最小射束半径w0和波长λ定义:Figure 4 further illustrates beam parameters related to Rayleigh distance. The Rayleigh distance is a suitable scale for evaluating the focus shift Df for wavelengths with broad spectrum lasers due to dispersion of the refractive index of the material used in the optics of the processing head. The Rayleigh distance Z R provides the focal length in which the laser beam is in focus. The parameter b=2Z R can be described as the depth of focus. The Rayleigh distance of an ideal Gaussian laser beam is defined by the minimum beam radius w at the focus and the wavelength λ:
对于非理想或多模激光射束,瑞利距离是理想高斯射束的瑞利距离的M2分之一。当Df<<ZR时,由射束的不同波长引起的聚焦距离改变可能对激光处理质量没有显著影响。在另一方面,当Df~ZR或Df>ZR时,波长光谱的宽度可能对激光焊接质量具有显著影响。注意的是,处理材料的厚度也影响质量。For non-ideal or multimode laser beams, the Rayleigh distance is one-half M2 of the Rayleigh distance of an ideal Gaussian beam. When Df<< ZR , changes in focus distance caused by different wavelengths of the beam may not have a significant effect on the quality of laser processing. On the other hand, when Df ~ Z R or Df > Z R , the width of the wavelength spectrum may have a significant effect on the laser welding quality. Note that the thickness of the processed material also affects the quality.
图5图示了针对由于由熔融硅石制成的单个透镜元件的折射率的色散引起的焦移的模拟结果。在该示例中,当利用250mm聚焦透镜进行激光焊接时,可以在第二输出激光射束的第一波长2a和第二波长2b的波长差为15nm的情况下实现0.1mm焦移。当如在典型的处理头中使用多个透镜元件时,与单个元件的情况相比,由于色散引起的焦移也将增加。Figure 5 illustrates simulation results for focal shift due to dispersion of the refractive index of a single lens element made of fused silica. In this example, when laser welding is performed with a 250 mm focusing lens, a focal shift of 0.1 mm can be achieved with a wavelength difference of 15 nm between the
针对光纤或光纤耦合激光器(设备)的功率电平可以从0到10kW或更加大、根据所讨论的应用的需要来控制。在许多应用中,可以应用用于环形射束2的大约1至4kW的光纤激光器输出功率电平。Power levels for fiber or fiber coupled lasers (devices) can be controlled from 0 to 10 kW or more, depending on the needs of the application in question. In many applications, fiber laser output power levels of about 1 to 4 kW for the
与当使用常规激光射束时相比,本特定复合射束配置使得能够应用较低的由于焊接的功率电平。在示例实施例中,激光功率对于中心射束1可以是600W,并且对于环形射束2可以是1kW,其中100mm/s焊接速度用于焊接铝(针对3000系列铝给出的示例)。在这些参数的情况下,可以实现1mm的穿透深度和非常好的激光焊接质量。This particular composite beam configuration enables the application of lower power levels due to welding compared to when conventional laser beams are used. In an example embodiment, the laser power may be 600 W for
通过适当地控制中心射束1和环形射束2的焊接参数,可以利用本特定复合射束配置优化激光焊接焊缝的熔体池的长度。可以通过优化熔体池的长度并使熔体池内的湍流最小化来显著减少飞溅。另外,通过优化熔体池的长度,可以在熔体固化之前为气体和气泡逸出熔体给出足够的时间。这促进焊接焊缝中的较低孔隙率和减少的空隙数量。By appropriately controlling the welding parameters of the
在一些实施例中,环形射束2中的光纤或光纤耦合激光器的波长在1030-1090nm的区中。中心射束1中的光纤激光器的波长可以取决于所讨论的应用来选择,在一些实施例中是在700-1200nm的区域中,诸如例如1070nm。In some embodiments, the wavelength of the fiber or fiber coupled laser in the
在一些实施例中,激光处理装置和复合激光射束适合于焊接铝板。铝板可以具有1-20mm(优选地,1-10nm)之间的厚度。例如,可以选择环形射束2的在800-1100nm的区中的(一个或多个)波长。环形射束2中的808nm的波长由于在808nm的波长处的吸收峰使得能够至少在焊接6000系列铝合金件时获得特别好质量的焊接结果。In some embodiments, the laser processing device and composite laser beam are suitable for welding aluminum sheets. The aluminium plate may have a thickness between 1-20mm (preferably, 1-10nm). For example, the wavelength(s) of the
在一些其它实施例中,第二输出激光射束2可以包括光纤耦合二极管激光射束。在环形射束2中的适当光纤耦合二极管激光射束的添加促进复合激光射束7的光功率的吸收的增加。In some other embodiments, the second
在实施例中,应用光纤和二极管激光器的组合来形成环形射束2。例如,用于环形射束2的(第二激光器设备或另外的第三激光器设备的)光源中的一个可以发出二极管光。这使得能够进一步改进穿透深度的稳定性,如也由图1c中的线6所图示,与在没有用于环状射束的二极管激光器设备的情况下提供的线5相比,所述线6具有相对小的变化。在这样的实施例中,射束2a可以指代光纤激光射束,并且射束2b可以指代二极管激光射束。在一些实施例中,二极管激光射束的波长在环形射束中的0.5至1.5µm的区域中。在一些实施例中,在10至50W的范围中的二极管激光器输出功率电平被应用于环形射束2。在一些实施例中,环形射束中的光纤射束和二极管射束及其功率电平可以被独立地适配。In an embodiment, a combination of fiber and diode lasers is applied to form the
因此,存在通过应用目前公开的特征和应用添加的二极管光以用于复合激光射束焊接而可实现的各种优点。一个优点是可以改进焊接焊缝质量和均匀性。二极管光与以环状环形式的光纤激光器的组合的特定配置实现焊接质量的改进。此外,由于可以实现被处理的材料的较稳定的熔体池,因此这使能够减少飞溅。Accordingly, there are various advantages achievable by applying the presently disclosed features and applying added diode light for compound laser beam welding. One advantage is that weld seam quality and uniformity can be improved. The specific configuration of the diode light in combination with the fiber laser in the form of an annular ring achieves an improvement in weld quality. Furthermore, this enables spatter to be reduced since a more stable melt pool of the material being processed can be achieved.
图6图示了根据一些实施例的用于控制激光器装置的中心射束1和环形射束2的生成的控制单元10。控制单元10直接或间接连接到至少一个适于生成中心射束1和/或环形射束2的激光器单元12。控制单元10可以包括提供有用于功率控制的适当软件的通用计算机,或者控制单元可以包括微控制器。控制单元包括至少一个处理器11,其可以是单核或多核处理器,其中单核处理器包括一个处理核,而多核处理器包括多于一个处理核。处理器可以包括至少一个专用集成电路ASIC。处理器可以是用于在设备中执行方法步骤的工具。处理器可以至少部分地由计算机指令配置成控制目前图示的特定复合射束配置和(一个或多个)分布。Figure 6 illustrates a
控制单元设备可以包括存储器13。存储器可以包括随机存取存储器和/或永久存储器。存储器可以包括至少一个RAM芯片。存储器可以包括例如固态、磁性、光学和/或全息存储器。存储器可以对处理器是至少部分地可访问的。存储器可以包括计算机指令14,处理器11被配置成执行所述计算机指令14。当被配置成使得处理器执行某些动作的计算机指令被存储在存储器中、并且设备总体上被配置成使用来自存储器的计算机指令在处理器的引导下运行时,处理器和/或其至少一个处理核可以被认为是配置成执行所述某些动作。存储器11可以至少部分地包括在处理器中。存储器可以11至少部分地在设备外部,但是对于控制单元设备是可访问的。The control unit device may include a
目前图示的特征可以由存储在存储器13中并且包括指令的至少一个计算机程序引起,当在处理器11中执行时,所述指令使得处理器通过到(一个或多个)激光器单元12的相应输出控制信号来控制激光射束1、2a、2b的配置。存储器13还可以存储影响由处理器控制的环形射束2和/或中心射束1的性质的各种参数15,诸如限定由操作者可调整的不同焊接分布和程序以及不同的中心和/或环形射束参数的参数集合。The presently illustrated features may be caused by at least one computer program stored in the
控制单元设备可以包括用户界面UI 16。UI可以包括例如显示器、键盘、触摸屏中的至少一个。控制单元可以被布置成至少部分地基于用户输入来控制激光射束配置和/或参数。控制单元10还可以连接到一个或多个传感器17,诸如监测激光焊接操作的进展的传感器和/或检测被处理的工件的性质的传感器。控制单元10还可以包括其它单元,诸如被配置成根据至少一个蜂窝或非蜂窝标准来发射和接收信息的发射器和接收器。The control unit device may include a
根据一些实施例,控制单元10可以被配置成单独地控制中心射束1和/或环形射束2中的功率密度,而不管另一射束的状态如何。中心射束1的功率密度和环形射束2的功率密度之间的关系可以根据被焊接的工件的厚度来控制。例如,控制单元10可以被配置成响应于工件的厚度下降到用于遮断环形激光射束的预定厚度极限值以下而切断环形射束。在一些实施例中,极限值选自4至8毫米的范围,在一个实施例中为6mm。中心射束1和环形射束2之间的不同功率密度和关系可以取决于被焊接的材料来控制。According to some embodiments, the
还存在可由控制单元10控制的其它焊接参数。这样的参数的一些示例包括但不限于:焊接进展速度、中心射束和/或环形射束的直径、调制开/关、调制参数和其它射束性质。There are also other welding parameters that can be controlled by the
实施例可应用于点焊接和连续焊接应用。在连续焊接的情况下,在激光处理头的移动的方向上的环形射束2的前边缘引起第一强度峰,并且环形射束2的后边缘引起第二强度峰。因此,元件分阶段地加热,并且与单点射束相比,后边缘和前边缘的强度水平可能更低,以引起充分熔化。除了预先加热之外,前边缘还提供污染物消融。这使得能够避免急剧温度改变,并且避免或至少减少随后的回火,并且因此避免或至少减少由急剧温度改变引起的较弱区域。在连续焊接中对环形射束的使用在避免飞溅方面也是有利的。在实施例中,中心射束1的功率密度可以被设置为低,或者中心射束甚至可以完全闭合。因此可以避免过分加热。Embodiments are applicable to spot welding and continuous welding applications. In the case of continuous welding, the leading edge of the
复合激光射束7(即中心射束1和环形射束2的混合)可以通过组合来自起源激光器设备和多芯光学光纤中的馈送光纤的激光射束来生成,利用中心射束1和环形射束2的所得到的复合激光射束可以从其被引导到工件。第一光学馈送光纤可以与多芯光学光纤的第一芯对准,并且第二光学馈送光纤可以与多芯光学光纤的第二芯对准。多芯光学光纤的第一芯具有圆形横截面,并且第二芯具有与第一芯同心的环状形状。下面说明了一些另外的示例实施例。Composite laser beam 7 (i.e. a mixture of
在一些实施例中,还参考图1c的图示,将锁眼激光焊接与热传导焊接组合应用以提供动态可适应的中心和环形激光射束分布。热传导焊接适用于焊接通常高达约2mm的材料厚度的金属板。由能够传导焊接的激光器处理的金属板撞击金属的相对浅但宽的点。典型的锁眼图案是由高亮度激光器(诸如光纤激光器)引起的。锁眼的直径可以在小于一毫米的区中,例如0.1毫米,并且点的直径可以在若干毫米的区中,诸如例如3毫米。当比较纯锁眼焊接和通过圆形和环状激光射束的混合焊接的应用时,已经注意到,混合焊接穿透比使用相同处理速度的纯锁眼焊接的穿透深至少20%。In some embodiments, referring also to the illustration of Figure lc, keyhole laser welding is applied in combination with thermal conduction welding to provide dynamically adaptable center and ring laser beam distributions. Thermal conduction welding is suitable for welding metal sheets with material thicknesses typically up to about 2 mm. A metal sheet processed by a laser capable of conduction welding strikes a relatively shallow but wide spot of the metal. Typical keyhole patterns are caused by high brightness lasers such as fiber lasers. The diameter of the keyholes may be in the region of less than one millimeter, such as 0.1 millimeters, and the diameter of the dots may be in the region of several millimeters, such as, for example, 3 millimeters. When comparing the application of pure keyhole welding and hybrid welding by circular and annular laser beams, it has been noted that hybrid welding penetrates at least 20% deeper than pure keyhole welding using the same processing speed.
图7示出了实现独立的中心射束和环形射束功率控制的装置的一个实施例,并且在所述装置中以及通过所述装置可以应用特定复合激光射束配置上的以上说明的特征中的至少一些。第一激光器(设备)30与光学馈送光纤32连接到激光射束组合器34。同样地,一个或若干第二激光器31与馈送光纤33连接到射束组合器34。组合器的任务是布置所有引入的激光射束,使得它们可以耦合到双芯光学光纤35。因此,激光器装置的混合属性是具有在单个双芯光学光纤35内部传播的两个激光射束的结果。光纤35内部的两个激光射束通常具有不同的亮度和强度分布,并且可以具有不同的波长。此外,可以通过调整来自第一激光器30和第二激光器设备31的功率电平来独立且连续地控制两个激光射束中的功率电平。Figure 7 shows one embodiment of an apparatus to achieve independent center beam and ring beam power control, and in which and by which the above-described features on specific composite laser beam configurations may be applied of at least some. A first laser (device) 30 is connected to a
为了实现足够的射束亮度,第一激光器设备30可以是包括二极管泵浦的单个或多个光纤激光振荡器或主振荡器-功率放大器(MOPA)模块的高亮度光纤激光器,所述模块各自由例如耦合到光纤谐振器的光纤耦合二极管激光器组成。高亮度激光器的另外的示例是光纤耦合薄盘激光器或Nd-YAG激光器,其利用来自二极管激光器的光泵浦。现代激光器技术常常依赖于光作为能量传递介质,因为许多有源固态光放大材料是绝缘体。二极管激光器由于其较高的效率和较窄的光谱而已经替代先前使用的闪光灯作为能量泵浦。To achieve sufficient beam brightness, the
第二激光器设备31可以被配置成提供用于形成如上所图示的环形射束2配置的(一个或多个)特定第二激光射束。第二激光器设备31可以是光纤激光器或光纤耦合激光器,其还可以包括由二极管激光器(例如薄盘激光谐振器(未示出))泵浦的固态激光谐振器。如图8a中所图示,双芯光学光纤35可以布置成在其中心芯中传送来自第一激光器设备30的激光射束,并且在距中心芯一距离处的、围绕中心芯环状地布置的外芯中传送由一个或多个第二激光器设备31生成的射束。The
在一些实施例中,第一和第二激光器设备30、31二者都是光纤激光器,其各自具有独立可控的功率电平。一些激光器按构造是光纤激光器,并且固有地将光馈送到光学光纤中;其它激光器需要与光纤光学对接,以便将激光射束对准到输出光纤的芯。激光器装置的目的以及单独的激光器模块的额定功率和其它性质确定了哪些类型的激光器连接到射束组合器34是可行的。In some embodiments, both the first and
在一些实施例中,装置包括另外的二极管激光器设备(未示出),其向射束组合器34提供二极管激光射束。射束组合器34适于将二极管激光射束与多芯光学光纤的至少一个第二芯对准。In some embodiments, the apparatus includes additional diode laser equipment (not shown) that provides a diode laser beam to
双芯光学光纤在其相对端处连接到激光处理头20,激光处理头20将组合或复合激光射束7向前引导到工件21。激光处理头20通常包括准直和聚焦透镜,以产生具有如由透镜的焦距确定的期望尺寸的从光纤35的端出射到工件21上的强度分布的图像。激光头20的任务还可以是向焊接线提供加压气体射流。还可以施加加压气体以进一步保护激光头20内的光学器件免于喷溅熔化金属,并且还将喷溅熔化金属从焊接线去除以帮助保持焊接线清洁。在一个实施例中,至少将焊接进展转向点与氧气辅助气体结合地应用,从而提供附加的能量并且使得能够进一步改进这些点中的焊接边缘质量。The dual-core optical fiber is connected at its opposite ends to a
在本发明的一个实施例中,该装置被提供有控制单元,诸如以上图示的控制单元10。控制单元还可以集成在激光器设备30或31中的一个中。可替代地,为了方便和可靠性,所有单元30、31和10可以放置在单个外壳中并且在它们的构造中彼此集成。如所指示的,控制单元10可以用于执行环形射束2和中心射束1的分布的独立功率控制,并且用于实现动态可调整的环形中心射束,其可以通过应用以上说明的特征中的至少一些来即时(on-the-fly)调整。控制单元可以被配置成控制激光器设备30、31中的至少一个的调制和/或其它参数。优选地,可以分离地动态控制两个激光射束的调制。因此,通过相同的装置,各种各样的不同的焊接应用和目的变得可能。可以动态地调整射束分布以适应具有挑战性的焊接类型/应用的多种需求,诸如不同的材料、涂层和/或厚度。In one embodiment of the invention, the device is provided with a control unit, such as the
控制单元10可以被布置成接收来自激光头20的用户的反馈36,或者例如来自光强度传感器的自动反馈。反馈或输入然后被用于控制激光器30和31的功率以遵循预定目标,或者用于根据在工件21处观察到的所得到的焊接结果来调整激光功率。控制单元10或另一控制单元还可以控制装置的其它功能,诸如激光处理头20相对于工件的移动。The
根据本发明,射束组合器34由熔融硅石部件制成,其中光学功率通过整个组合器结构在熔融硅石内部传播,并且组合器在输入和输出处具有光学光纤。因此,在本发明中,射束组合器34可以被称为全玻璃光纤组合器。In accordance with the present invention, the
在图8a中示出了示例双/多芯光学光纤50的横截面,该双/多芯光学光纤50具有带有主包层54的中心芯51。外芯53在空间上由内包层54和外包层55形成。如熟悉本领域的技术人员清楚的,包层被定义为具有比芯的折射率更低的折射率的材料。例如,中心芯51的直径可以是70µm,以及外芯53的内直径和外直径可以分别是100µm和180µm。中心芯51和外围芯53还可以采取除上述形式之外的其它形式。中心芯51可以是例如正方形或矩形形状。外围芯53还可以具有矩形边界或由多个线性或圆形形状的段组成。A cross-section of an example dual/multi-core
利用虚线示出的是来自射束组合器的熔融馈送光纤56和57(图9中的光纤72和71)的端的芯如何可以与双芯光学光纤50的横截面对准。例如,与(用于形成环形射束2的)外围芯53对准的四个馈送光纤57中的每个可以具有按20nm间隔的10nm光谱宽度,从而导致对于环形射束2的约100nm的总光谱宽度。Shown with dashed lines is how the cores of the ends of the
双芯光学光纤50的中心芯51中的激光辐射具有中心和窄空间强度分布,而外芯53中的强度分布状态采取油煎圈饼的形状。利用激光头20中的处理光学器件将该空间强度图案进一步成像到工件上。利用此配置,激光射束的射束质量在中心芯和外芯两者中都相对高。The laser radiation in the
现在参考图8b,示出了光学双芯光纤50的示例折射率分布。芯51和53具有分别高于环绕材料54和55的折射率n54和n55的折射率n51和n53。以这种方式,激光射束被引导到工件,其中最不可能有环状强度分布中的降级以及芯中的每个中的光学功率和强度的衰减。Referring now to FIG. 8b, an example refractive index profile of the optical
熔融硅石的折射率可以通过利用杂质掺杂来调整。利用锗掺杂熔融硅石导致折射率的增加,而利用氟掺杂熔融硅石导致折射率的降低。因此,例如,芯51和53可以由Ge-掺杂或未掺杂熔融硅石制成,并且它们的主包层54和55可以由F-掺杂熔融硅石制成。The refractive index of fused silica can be adjusted by doping with impurities. Doping the fused silica with germanium results in an increase in the refractive index, while doping the fused silica with fluorine results in a decrease in the refractive index. Thus, for example,
在图9中示出的是光纤组合器34的关键光学部件70。它是具有主体部分的多孔毛细管,该主体部分由以下各项构成:熔融硅石玻璃管77、用于从至少两个激光器设备接收由光学馈送光纤71和72传送的激光射束(未示出)的输入端76(例如,来自设备30和31的光纤32和33)。它还具有相对的输出端74,以用于传递由在相同方向上彼此对准的至少两个激光射束组成的复合输出激光射束。Shown in FIG. 9 are key
在输入端76处进入的光学馈送光纤71、72通过毛细孔中的主体部分延伸到输出端74,并且与玻璃管77熔融以形成由光导芯71a、72a和环绕玻璃材料组成的部件。芯具有高于围绕芯的环绕玻璃材料的折射率的折射率,以通过全内反射提供光学功率通过整个部件在芯中的传播。The
为了示出光纤组合器的原理,芯的尺度和部件70的尺度不是按比例的,并且为了清楚起见,利用虚线示出了仅一对芯。To illustrate the principles of the fiber combiner, the dimensions of the cores and the dimensions of the
光学部件70可以通过例如拉制来制造。在该示例中,对于在中心中的直径方面为约300µm的光纤72而言可以存在较大的孔,并且对于被放置成与中心孔72对称并且在中心孔72外围的光纤71而言可以存在四个较小的孔。较小的孔可以具有例如约150µm的直径。毛细管的外直径可以是例如1mm。管的材料可以是例如熔融硅石。其块状玻璃(未示出)的外包层优选地已经被至少部分地蚀刻掉的光纤被插入到中间孔中并使其穿过到毛细尖椎体的腰部部分73。当光纤处于适当位置时,毛细管70在腰部区段73处被加热,以将光纤熔融到管并且以形成第一中心光导芯72a和第二光导芯71a,其全部延伸通过光学部件70。The
作为替代,光纤71、72可以具有纯熔融硅石材料的内芯和F-掺杂熔融硅石的外包层。以这种方式,光学部件70的熔融硅石玻璃管77可以由纯熔融硅石制成,因为光纤的光导芯固有地被具有较低折射率的材料包围。这意味着即使毛细管的折射率与光纤芯中的折射率相同,光也保留在芯71a、72a中。在这种情况下,块状玻璃的外光纤包层可以被蚀刻掉直到F-掺杂包层,或者甚至进一步地,只要一些F-掺杂包层保留在纯或Ge-掺杂内光纤芯周围。Alternatively, the
熔融芯71a、72a(利用虚线示出)和管70然后被切断或劈开以产生端表面74。然后,类似于图8中所示出的双芯光纤的双芯光纤35可以在端74处焊接到毛细管,从而形成焊缝75。The
在优选实施例中,第一光学馈送光纤72的中心与部件70的中心对准,并且例如四个第二光学馈送光纤71的中心被定位成在距第一中心光导芯72a预定距离R处在输出端74处提供输出射束。要认识到,第二馈送光纤的数量不像这样被限制,而是代之以例如8个、16个或32个而不是4个。第二光导芯71a优选地相对于中心芯72a对称地布置,以提供彼此之间具有90°角距离的输出射束。In a preferred embodiment, the center of the first
目前公开的激光焊接方法和装置可应用于各种各样的应用中。在需要实现具有不同性质(诸如厚度和/或改变和多形式焊接操作)的激光焊接材料的优异焊接表面质量的应用中实现了特别的优点。单个焊接装置现在可以用于这些变化的性质/要求,从而使得能够相应地立即适应最佳焊接射束分布。作为一些示例,本系统对于汽车工业的焊接需要可以是特别有利的。The presently disclosed laser welding methods and apparatus can be used in a wide variety of applications. Particular advantages are realized in applications where it is required to achieve excellent weld surface quality of laser welding materials with different properties such as thickness and/or variation and multi-modal welding operations. A single welding device can now be used for these changing properties/requirements, thereby enabling the optimum welding beam distribution to be adapted immediately accordingly. As some examples, the present system may be particularly advantageous for the welding needs of the automotive industry.
要理解的是,所公开的发明的实施例不限于本文中所公开的特别结构、处理步骤或材料,而是延伸到会由相关领域的普通技术人员认识到的其等同物。还应当理解的是,本文中采用的术语仅用于描述特别实施例的目的,而不旨在是限制性的。It is to be understood that the disclosed embodiments of the invention are not limited to the particular structures, process steps or materials disclosed herein, but extend to equivalents thereof that one of ordinary skill in the relevant art would recognize. It is also to be understood that the terminology employed herein is for the purpose of describing particular embodiments only and is not intended to be limiting.
贯穿本说明书对“一个实施例”或“实施例”的引用意味着将与实施例结合描述的特别特征、结构或特性包括在本发明的至少一个实施例中。因此,在贯穿本说明书的各种地方中的短语“在一个实施例中”或“在实施例中”的出现不一定全部指代相同的实施例。Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment.
本发明的各种实施例和示例在本文中可以连同其各种部件的替代方案一起被涉及。理解的是,这样的实施例、示例和替代方案不应被解释为彼此的事实上的等同物,而是要被认为是本发明的分离且自主的表示。Various embodiments and examples of the invention may be referred to herein along with alternatives for the various components thereof. It is to be understood that such embodiments, examples and alternatives are not to be construed as de facto equivalents of each other, but are to be considered separate and autonomous representations of the invention.
此外,所描述的特征、结构或特性可以以任何合适的方式组合在一个或多个实施例中。在说明书中提供了许多特定细节(诸如长度、宽度、形状等的示例),以提供对本发明的实施例的透彻理解。然而,相关领域的技术人员将认识到,可以在没有特定细节中的一个或多个的情况下,或者利用其它方法、部件、材料等来实践本发明。在其它实例中,没有详细描述或示出公知的结构、材料或操作,以免使本发明的各方面模糊。Furthermore, the described features, structures or characteristics may be combined in any suitable manner in one or more embodiments. Numerous specific details (such as examples of lengths, widths, shapes, etc.) are provided in the description to provide a thorough understanding of embodiments of the present invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations have not been described or shown in detail so as not to obscure aspects of the invention.
虽然前述示例在一个或多个特别应用中说明了本发明的原理,但是对于本领域普通技术人员将显而易见的是,在不运用发明能力情况下,并且在不脱离本发明的原理和构思的情况下,可以对实施方式的形式、使用和细节进行许多修改。因此,本发明不旨在被限制,除了如由下面阐述的权利要求限制的那样。While the foregoing examples illustrate the principles of the invention in one or more particular applications, it will be apparent to those of ordinary skill in the art that, without exercising the ability of the invention, and without departing from the principles and concepts of the invention Below, many modifications may be made in the form, use and details of the embodiments. Accordingly, the invention is not intended to be limited except as by the claims set forth below.
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| CN114101907A (en) * | 2021-12-24 | 2022-03-01 | 沈阳大学 | 2000 MPa-level thermoformed steel sheet double-spot laser welding process |
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|---|---|
| US20240082948A1 (en) | 2024-03-14 |
| JP2021514841A (en) | 2021-06-17 |
| JP7119094B2 (en) | 2022-08-16 |
| TW201929989A (en) | 2019-08-01 |
| CN111526966B (en) | 2022-08-05 |
| US12447553B2 (en) | 2025-10-21 |
| KR102418512B1 (en) | 2022-07-07 |
| US11850679B2 (en) | 2023-12-26 |
| EP3731991A1 (en) | 2020-11-04 |
| EP3731991A4 (en) | 2021-08-18 |
| FI3731991T3 (en) | 2023-05-11 |
| US20200306878A1 (en) | 2020-10-01 |
| WO2019129917A1 (en) | 2019-07-04 |
| EP3731991B1 (en) | 2023-04-26 |
| KR20200103027A (en) | 2020-09-01 |
| TWI789466B (en) | 2023-01-11 |
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