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CN111490033A - Electromagnetic shielding package and method of making the same - Google Patents

Electromagnetic shielding package and method of making the same Download PDF

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Publication number
CN111490033A
CN111490033A CN202010461371.5A CN202010461371A CN111490033A CN 111490033 A CN111490033 A CN 111490033A CN 202010461371 A CN202010461371 A CN 202010461371A CN 111490033 A CN111490033 A CN 111490033A
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chip
pins
base island
shielding
electromagnetic shielding
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吴涛
岳茜峰
吴奇斌
吕磊
汪阳
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Changjiang Electronics Technology Chuzhou Co Ltd
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Changjiang Electronics Technology Chuzhou Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention discloses an electromagnetic shielding packaging piece and a manufacturing method thereof, and belongs to the technical field of semiconductor packaging. The packaging part comprises a base island, a shielding cover, a chip, a first plastic packaging material and a second plastic packaging material, wherein pins are arranged on two sides or the periphery of the base island, enclosing walls are arranged on the outer sides of the pins, the chip is electrically connected with the pins through an electrical connection part, and the shielding cover covers the first plastic packaging material and is electrically connected with the enclosing walls; the first plastic packaging material is used for coating the base island, the pins, the upper part of the enclosing wall, the electric connection part and the chip; the second molding compound is used for coating the upper part of the remaining part of the enclosing wall and the shielding case. The method comprises the steps of firstly carrying out plastic packaging by using a first plastic packaging material, then mounting the shielding cover once, and then carrying out plastic packaging by using a second plastic packaging material. The invention aims to overcome the defect of complex electromagnetic shielding packaging process in the prior art, the electromagnetic shielding packaging process is simple, the difficulty of the packaging process is greatly reduced, and the efficiency of the electromagnetic shielding packaging is further improved.

Description

一种电磁屏蔽封装件及其制作方法Electromagnetic shielding package and method of making the same

技术领域technical field

本发明涉及半导体封装技术领域，更具体地说，涉及一种电磁屏蔽封装件及其制作方法。The present invention relates to the technical field of semiconductor packaging, and more particularly, to an electromagnetic shielding package and a manufacturing method thereof.

背景技术Background technique

封装技术是一种将集成电路用绝缘的塑料或陶瓷材料打包的技术，以CPU为例，实际看到的体积和外观并不是真正的CPU内核的大小和面貌，而是CPU内核等元件经过封装后的产品。封装技术对于芯片来说是必须的，也是至关重要的。因为芯片必须与外界隔离，以防止空气中的杂质对芯片电路的腐蚀而造成电气性能下降。随着对电子产品的便携性、低重量、小尺寸的要求不断提高，系统级封装技术得到蓬勃发展。系统级封装的一个重要的发展趋势是将如高速数字电路、模拟电路和射频电路之类的不同芯片封装在一个封装体内以实现所要求的集成度。但是，这产生了封装体内各芯片之间的电磁干扰问题、以及封装体向外的电磁辐射问题。Packaging technology is a technology for packaging integrated circuits with insulating plastic or ceramic materials. Taking CPU as an example, the actual volume and appearance seen are not the size and appearance of the real CPU core, but the components such as the CPU core are packaged. product after. Packaging technology is necessary and crucial for chips. Because the chip must be isolated from the outside world, in order to prevent the corrosion of the chip circuit caused by the impurities in the air, the electrical performance is degraded. With the ever-increasing requirements for portability, low weight, and small size of electronic products, system-in-package technology has flourished. An important development trend in system-in-package is to package different chips such as high-speed digital circuits, analog circuits and radio frequency circuits in one package to achieve the required level of integration. However, this results in the problem of electromagnetic interference between the chips in the package and the problem of electromagnetic radiation outside the package.

针对上述问题，现有技术也提出了一些解决方案，例如发明创造名称为：电磁屏蔽封装组件及其制造方法(申请日：2015年12月24日；申请号：2015110080740)，该方案公开了一种电磁屏蔽封装组件的制造方法，具体步骤为：步骤1：利用基板和第一掩膜板电镀形成芯片载体和电磁屏蔽罩侧壁的底部；步骤2：再利用第二掩膜板电镀形成电磁屏蔽罩侧壁的上部分；步骤3：利用粘胶粘结芯片并通过电性连接部连接芯片和引脚；步骤4：塑封，利用塑封料将上述芯片电性连接部，芯片载体与电磁屏蔽罩侧壁全部包裹，形成第一塑封体；步骤5：研磨，将电磁屏蔽罩侧壁顶部露出，然后设置第三掩膜板继续电镀形成电磁屏蔽罩的顶部；步骤6：再次塑封，形成第二塑封体，然后通过腐蚀或者机械剥离的方式将基板与第一塑封体和第二塑封体分离。通过上述方法制造的封装组件具有较好的电磁屏蔽特性，但是封装组件的制作工艺时多次电镀，制作工艺复杂且工艺难度较大，且形成产品时需要剥离封装基板，使得制作成本较高。In response to the above problems, the prior art has also proposed some solutions. For example, the name of the invention is: electromagnetic shielding package assembly and its manufacturing method (application date: December 24, 2015; application number: 2015110080740), the solution discloses a A method for manufacturing an electromagnetic shielding package assembly, the specific steps are as follows: step 1: electroplating the chip carrier and the bottom of the side wall of the electromagnetic shielding cover by using a substrate and a first mask plate; step 2: using the second mask plate to electroplate to form electromagnetic The upper part of the side wall of the shielding case; Step 3: Use adhesive to bond the chip and connect the chip and the pins through the electrical connection part; Step 4: Plastic sealing, use the plastic sealing compound to connect the electrical connection part of the chip, the chip carrier and the electromagnetic shielding The side walls of the cover are all wrapped to form a first plastic body; step 5: grinding to expose the top of the side walls of the electromagnetic shielding cover, and then setting a third mask plate to continue electroplating to form the top of the electromagnetic shielding cover; step 6: plastic sealing again to form the first The second plastic packaging body, and then the substrate is separated from the first plastic packaging body and the second plastic packaging body by means of corrosion or mechanical peeling. The packaged component manufactured by the above method has good electromagnetic shielding properties, but the manufacturing process of the packaged component requires multiple electroplating, the manufacturing process is complicated and the process is difficult, and the package substrate needs to be peeled off when forming the product, which makes the manufacturing cost high.

综上所述，如何降低电磁屏蔽封装工艺的难度，提高电磁屏蔽封装的效率，是现有技术亟需解决的问题。In summary, how to reduce the difficulty of the electromagnetic shielding packaging process and improve the efficiency of the electromagnetic shielding packaging is an urgent problem to be solved in the prior art.

发明内容SUMMARY OF THE INVENTION

1.要解决的问题1. The problem to be solved

本发明的目的在于克服现有技术中，电磁屏蔽封装工艺复杂且工艺难度较高的不足，提供了一种电磁屏蔽封装件及其制作方法，电磁屏蔽封装工艺简单，大大降低了电磁屏蔽封装工艺的难度，进一步提高了电磁屏蔽封装的效率。The purpose of the present invention is to overcome the deficiencies in the prior art that the electromagnetic shielding packaging process is complex and the process difficulty is high, and provides an electromagnetic shielding package and a manufacturing method thereof, the electromagnetic shielding packaging process is simple, and the electromagnetic shielding packaging process is greatly reduced. It is difficult to further improve the efficiency of electromagnetic shielding packaging.

2.技术方案2. Technical solutions

为了解决上述问题，本发明所采用的技术方案如下：In order to solve the above problems, the technical scheme adopted in the present invention is as follows:

本发明的一种电磁屏蔽封装件，包括基岛，该基岛的两侧或者四周设有引脚，引脚的外侧设有围墙；芯片，该芯片通过电性连接部与引脚电性连接；第一塑封料，该第一塑封料用于包覆基岛的上部、引脚的上部、部分围墙的上部、电性连接部和芯片；屏蔽罩，该屏蔽罩覆盖于第一塑封料上，且屏蔽罩的底部与围墙电性连接；第二塑封料，该第二塑封料用于包覆剩余部分围墙的上部和屏蔽罩，且第二塑封料不包覆基岛的下部、引脚的下部和围墙的下部。An electromagnetic shielding package of the present invention includes a base island, pins are provided on both sides or around the base island, and walls are provided on the outer sides of the pins; and a chip is electrically connected to the pins through an electrical connection portion. ; a first plastic sealing compound, the first plastic sealing compound is used to cover the upper part of the base island, the upper part of the pin, the upper part of the partial wall, the electrical connection part and the chip; the shielding cover, the shielding cover is covered on the first plastic sealing compound , and the bottom of the shielding cover is electrically connected to the wall; the second plastic sealing compound is used to cover the upper part of the remaining part of the surrounding wall and the shielding cover, and the second plastic sealing compound does not cover the lower part of the base island, the pins the lower part of the wall and the lower part of the wall.

更进一步地，电性连接部为焊丝或者焊球，若芯片为正装方式封装，则芯片通过焊丝与引脚电性连接。若芯片为倒装方式封装，芯片通过焊球与基岛和引脚电性连接。Further, the electrical connection portion is a solder wire or a solder ball, and if the chip is packaged in a positive-mounting manner, the chip is electrically connected to the pins through the solder wire. If the chip is flip-chip packaged, the chip is electrically connected to the base island and the pins through solder balls.

更进一步地，屏蔽罩的底部通过导电胶与围墙电性连接，且围墙的上部为若干个设置于引脚外侧的金属柱或者金属环。Furthermore, the bottom of the shielding case is electrically connected to the enclosure wall through conductive glue, and the upper part of the enclosure wall is a plurality of metal pillars or metal rings arranged outside the pins.

本发明的一种上述的电磁屏蔽封装件的制作方法，包括以下步骤：S1、对第一基材的上部进行半蚀刻形成基岛的上部、引脚的上部以及围墙的上部；S2、对芯片进行电性设置，使得芯片与引脚的上部电性连接；S3、利用第一塑封料对芯片进行塑封，使得第一塑封料包覆基岛的上部、引脚的上部、部分围墙的上部、电性连接部以及芯片；S4、利用第二基材制作屏蔽罩，再将屏蔽罩覆盖于第一塑封料上，并将屏蔽罩的底部与围墙的上部电性连接；S5、利用第二塑封料对剩余部分围墙的上部和屏蔽罩进行塑封，使得第二塑封料包覆第一基材的上部和屏蔽罩；S6、对基材的下部进行半蚀刻形成基岛的下部、引脚的下部和围墙的下部，使得基岛、引脚和围墙互相分离；S7、对基岛的下部、引脚的下部和围墙的下部进行电镀形成防氧化金属层，再将基岛、引脚和围墙作为整体进行切割分离得到单个电磁屏蔽封装件。A method of manufacturing the above-mentioned electromagnetic shielding package of the present invention includes the following steps: S1, half-etching the upper part of the first base material to form the upper part of the base island, the upper part of the pin and the upper part of the surrounding wall; S2, to the chip Make electrical settings so that the chip is electrically connected to the upper part of the pin; S3, plastic-encapsulate the chip with the first plastic encapsulating material, so that the first plastic encapsulating compound covers the upper part of the base island, the upper part of the pin, the upper part of the partial wall, Electrical connection part and chip; S4, use the second base material to make a shielding cover, then cover the shielding cover on the first plastic sealing compound, and electrically connect the bottom of the shielding cover to the upper part of the fence; S5, use the second plastic sealing The upper part of the remaining part of the surrounding wall and the shielding case are plastic-sealed, so that the second plastic sealing material covers the upper part of the first base material and the shielding case; S6, half-etch the lower part of the base material to form the lower part of the base island and the lower part of the pin and the lower part of the fence, so that the base island, the pin and the fence are separated from each other; S7, electroplating the lower part of the base island, the lower part of the pin and the lower part of the fence to form an anti-oxidation metal layer, and then use the base island, the pin and the fence as The whole is cut and separated to obtain a single electromagnetic shielding package.

更进一步地，若芯片为正装方式封装，步骤S2的具体过程为：将芯片置于基岛上方，再利用焊线将基岛与引脚的上部电性连接。Furthermore, if the chip is packaged in a positive way, the specific process of step S2 is as follows: placing the chip on the base island, and then electrically connecting the base island and the upper part of the pins with bonding wires.

更进一步地，若芯片为倒装方式封装，步骤S3的具体过程为：预先在芯片底部设置焊球，将设置有焊球的芯片置于基岛和引脚的上方，并将焊球对应的电性连接于基岛和引脚的上部。Further, if the chip is flip-chip packaged, the specific process of step S3 is as follows: pre-arrange solder balls on the bottom of the chip, place the chip with solder balls above the base island and the pins, and place the solder balls corresponding to the solder balls. It is electrically connected to the base island and the upper part of the pin.

更进一步地，利用导电胶将屏蔽罩覆盖粘结于第一塑封料上，且屏蔽罩的底部与围墙相粘结。Furthermore, the shielding cover is covered and bonded on the first plastic sealing compound with conductive glue, and the bottom of the shielding cover is bonded with the surrounding wall.

更进一步地，当电磁屏蔽封装件不需要接地或者无电性连接要求时，对围墙的下部进行半蚀刻，使得围墙的下部被消除。Furthermore, when the electromagnetic shielding package does not need to be grounded or has no electrical connection requirements, the lower part of the enclosure wall is half-etched so that the lower part of the enclosure wall is eliminated.

3.有益效果3. Beneficial effects

相比于现有技术，本发明的有益效果为：Compared with the prior art, the beneficial effects of the present invention are:

(1)本发明的一种电磁屏蔽封装件，通过设置围墙和与其电性连接的屏蔽罩，从而可以形成一个整体的、封闭的金属屏蔽罩，进一步实现了封装件的电磁屏蔽特性；此外，本发明的电磁屏蔽封装件结构简单，制作工艺简单且其制作成本低。(1) An electromagnetic shielding package of the present invention can form an integral and closed metal shield by setting a wall and a shielding cover electrically connected to it, further realizing the electromagnetic shielding characteristics of the package; in addition, The electromagnetic shielding package of the present invention has simple structure, simple manufacturing process and low manufacturing cost.

(2)本发明的一种电磁屏蔽封装件的制作方法，通过将屏蔽罩覆盖粘结于第一塑封料上，且屏蔽罩的底部与围墙电性连接，从而实现对屏蔽罩的一次性安装，大大地降低了工艺难度；进一步可以形成一个整体的、封闭的金属屏蔽罩，进而实现了封装件的电磁屏蔽特性。此外，本发明先进行一次塑封，再一次性安装屏蔽罩，而后进行二次塑封得到电磁屏蔽封装件，工艺简单易操作，大大降低了电磁屏蔽封装工艺的难度，进一步提高了电磁屏蔽封装的效率。(2) In a method of manufacturing an electromagnetic shielding package of the present invention, the shielding cover is covered and bonded on the first plastic sealing compound, and the bottom of the shielding cover is electrically connected to the surrounding wall, so as to realize the one-time installation of the shielding cover , greatly reducing the difficulty of the process; further, an integral, closed metal shield can be formed, thereby realizing the electromagnetic shielding characteristics of the package. In addition, the present invention performs one-time plastic sealing, then installs the shielding cover once, and then performs secondary plastic-sealing to obtain the electromagnetic shielding package, the process is simple and easy to operate, the difficulty of the electromagnetic shielding packaging process is greatly reduced, and the efficiency of the electromagnetic shielding packaging is further improved. .

附图说明Description of drawings

图1为实施例1电磁屏蔽封装件正装方式封装流程示意图；FIG. 1 is a schematic diagram of the packaging process of the electromagnetic shielding package in the positive installation method of Embodiment 1;

图2为实施例1正装方式封装的电磁屏蔽封装件的结构示意图；2 is a schematic structural diagram of an electromagnetic shielding package packaged in a positive-installation manner in Embodiment 1;

图3为实施例2电磁屏蔽封装件倒装方式封装流程示意图；FIG. 3 is a schematic diagram of the flip-chip packaging process of the electromagnetic shielding package in Embodiment 2;

图4为实施例2倒装方式封装的电磁屏蔽封装件的结构示意图。FIG. 4 is a schematic structural diagram of an electromagnetic shielding package packaged in a flip-chip manner according to Embodiment 2. FIG.

示意图中的标号说明：Description of the labels in the diagram:

110、基岛；120、引脚；130、围墙；140、屏蔽罩；200、芯片；210、电性连接部；310、第一塑封料；320、第二塑封料；400、防氧化金属层。110, base island; 120, pin; 130, fence; 140, shield; 200, chip; 210, electrical connection part; 310, first molding compound; 320, second molding compound; 400, anti-oxidation metal layer .

具体实施方式Detailed ways

为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例；而且，各个实施例之间不是相对独立的，根据需要可以相互组合，从而达到更优的效果。因此，以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围，而是仅仅表示本发明的选定实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all of the embodiments; moreover, each embodiment is not relatively independent, and can be combined with each other according to needs, so as to achieve better effects. Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

为进一步了解本发明的内容，结合附图和实施例对本发明作详细描述。In order to further understand the content of the present invention, the present invention will be described in detail with reference to the accompanying drawings and embodiments.

实施例1Example 1

结合图1所示，本发明的一种电磁屏蔽封装件的制作方法，具体步骤如下：With reference to Figure 1, a method for manufacturing an electromagnetic shielding package of the present invention, the specific steps are as follows:

S1、对第一基材的上部进行半蚀刻形成基岛110的上部、引脚120的上部以及围墙130的上部；值得说明的是，围墙130的上部由若干个设置于引脚120外侧的金属柱或者金属环组成。S1, the upper part of the first substrate is half-etched to form the upper part of the base island 110, the upper part of the pin 120 and the upper part of the surrounding wall 130; Columns or metal rings.

S2、对芯片200进行电性设置，使得芯片200与引脚120的上部电性连接；具体地，芯片200通过电性连接部210与引脚120的上部电性连接；本实施例中电性连接部210为焊线，采用正装方式对芯片200进行贴装，先将芯片200置于基岛110上方，而后利用焊线将芯片200与引脚120的上部电性连接。S2. The chip 200 is electrically set so that the chip 200 is electrically connected to the upper part of the pin 120; specifically, the chip 200 is electrically connected to the upper part of the pin 120 through the electrical connection part 210; The connecting portion 210 is a bonding wire, and the chip 200 is mounted by a positive mounting method. The chip 200 is first placed on the base island 110 , and then the chip 200 is electrically connected to the upper portion of the pin 120 by the bonding wire.

S3、利用第一塑封料310对芯片200进行塑封，使得第一塑封料310包覆基岛110的上部、引脚120的上部、部分围墙130的上部、电性连接部210以及芯片200；需要说明的是，被包覆的部分围墙130的上部靠近引脚120的上部，通过包覆部分围墙130的上部使得后续安装屏蔽罩140时，可以减少导电胶的使用量，且屏蔽罩140的底部可以设置在围墙130上部的中间区域，从而可以避免屏蔽罩140从围墙130上掉落。S3. The chip 200 is plastic-encapsulated with the first plastic sealing compound 310, so that the first plastic sealing compound 310 covers the upper part of the base island 110, the upper part of the lead 120, the upper part of part of the surrounding wall 130, the electrical connection part 210 and the chip 200; It is noted that the upper part of the covered part of the surrounding wall 130 is close to the upper part of the pin 120 . By covering the upper part of the part of the surrounding wall 130 , when the shielding case 140 is subsequently installed, the amount of conductive glue used can be reduced, and the bottom of the shielding case 140 can be reduced. It can be arranged in the middle area of the upper part of the enclosure wall 130 , so that the shielding cover 140 can be prevented from falling from the enclosure wall 130 .

利用第一塑封料310进行塑封的具体过程为：将连接有芯片200的第一基材放入注塑模具内，然后向注塑模具内注入熔融状态的第一塑封料310，使得第一塑封料310包覆基岛110的上部、引脚120的上部、部分围墙130的上部、电性连接部210以及芯片200。The specific process of using the first plastic sealing compound 310 for plastic sealing is as follows: put the first substrate connected with the chip 200 into the injection mold, and then inject the molten first plastic sealing compound 310 into the injection mold, so that the first plastic sealing compound 310 The upper part of the base island 110 , the upper part of the lead 120 , the upper part of part of the surrounding wall 130 , the electrical connection part 210 and the chip 200 are covered.

S4、利用第二基材制作屏蔽罩140，具体地，通过对第二基材进行半蚀刻或者冲压形成屏蔽罩140；值得说明的是，形成的屏蔽罩140为阵列排布，由于第一基材上具有多个阵列排布的塑封的芯片200，阵列排布的屏蔽罩140可以对应设置于阵列排布的塑封的芯片200上，从而简化了工艺，降低了生产成本，进一步提高了产品的生产效率。进一步地，将屏蔽罩140覆盖于第一塑封料310上，且将屏蔽罩140的底部与围墙130的上部电性连接；从而形成一个整体的、封闭的金属屏蔽罩，进而可以实现封装件的电磁屏蔽特性。具体地，利用导电胶将屏蔽罩140整体粘结于第一塑封料310上，再利用导电胶将屏蔽罩140的底部与围墙130的上部相粘结，从而实现屏蔽罩140与围墙130的电性导通，进而实现了对屏蔽罩140的一次性安装，大大地降低了工艺难度。S4, using the second base material to make the shielding cover 140, specifically, forming the shielding cover 140 by half-etching or punching the second base material; it is worth noting that the formed shielding cover 140 is arranged in an array, because the first base material There are a plurality of plastic-encapsulated chips 200 arranged in an array on the material, and the shielding covers 140 arranged in an array can be correspondingly arranged on the plastic-encapsulated chips 200 arranged in an array, thereby simplifying the process, reducing the production cost, and further improving the product quality. Productivity. Further, the shielding cover 140 is covered on the first plastic sealing compound 310 , and the bottom of the shielding cover 140 is electrically connected with the upper part of the surrounding wall 130 ; thus an integral and closed metal shielding cover is formed, thereby realizing the sealing of the package. Electromagnetic shielding properties. Specifically, the shielding cover 140 is integrally bonded to the first plastic sealing compound 310 by conductive glue, and the bottom of the shielding cover 140 is bonded to the upper part of the surrounding wall 130 by conductive glue, so as to realize the electrical connection between the shielding cover 140 and the surrounding wall 130 . It is electrically conductive, thereby realizing the one-time installation of the shielding cover 140, which greatly reduces the difficulty of the process.

S5、利用第二塑封料320对剩余部分围墙130的上部和屏蔽罩140进行塑封，具体地，将连接有屏蔽罩140的第一基材放入注塑模具内，然后向注塑模具内注入熔融状态的第二塑封料320，使得第二塑封料320包覆屏蔽罩140和剩余部分围墙130的上部，且第二塑封料320不包覆基岛110的下部、引脚120的下部和围墙130的下部。值得说明的是，二次注塑使用的注塑模具结构简单，可以提高封装产品的脱模效率和生产效率。S5. Use the second molding compound 320 to mold the upper part of the remaining part of the enclosure wall 130 and the shielding cover 140. Specifically, put the first base material connected with the shielding cover 140 into the injection mold, and then inject the molten state into the injection mold. the second molding compound 320, so that the second molding compound 320 covers the shielding cover 140 and the upper part of the remaining part of the surrounding wall 130, and the second molding compound 320 does not cover the lower part of the base island 110, the lower part of the lead 120 and the surrounding wall 130 lower part. It is worth noting that the injection mold used in the secondary injection molding has a simple structure, which can improve the demolding efficiency and production efficiency of the packaged product.

S6、对第一基材的下部进行半蚀刻形成基岛110的下部、引脚120的下部和围墙130的下部，使得基岛110、引脚120与围墙130互相分离；值得说明的是，当电磁屏蔽封装件需要接地时，则不对围墙130的下部进行半蚀刻；若电磁屏蔽封装件不需要接地或者无电性连接要求时，则对围墙130的下部进行半蚀刻，使得围墙130的下部被消除，从而可以避免封装件SMT加工后，围墙130下部的金属与其他引脚120连接短路的风险。S6, half-etching the lower part of the first substrate to form the lower part of the base island 110, the lower part of the pin 120 and the lower part of the fence 130, so that the base island 110, the pin 120 and the fence 130 are separated from each other; it is worth noting that when When the electromagnetic shielding package needs to be grounded, the lower part of the enclosure wall 130 is not half-etched; if the electromagnetic shielding package does not need to be grounded or has no electrical connection requirements, the lower part of the enclosure wall 130 is half-etched, so that the lower part of the enclosure wall 130 is partially etched. Therefore, the risk of short circuit between the metal at the lower part of the fence 130 and other pins 120 after the SMT process of the package can be avoided.

S7、对基岛110的下部、引脚120的下部和围墙130的下部进行电镀形成防氧化金属层400，再将基岛110、引脚120和围墙130作为整体进行切割分离得到单个电磁屏蔽封装件。本发明采用机械或者激光的方式进行切割。S7, electroplating the lower part of the base island 110, the lower part of the pin 120 and the lower part of the fence 130 to form the anti-oxidation metal layer 400, and then cut and separate the base island 110, the pin 120 and the fence 130 as a whole to obtain a single electromagnetic shielding package pieces. In the present invention, the cutting is carried out by means of a machine or a laser.

本发明的一种电磁屏蔽封装件的制作方法，通过将屏蔽罩140覆盖粘结于第一塑封料310上，且屏蔽罩140的底部与围墙130电性连接，从而实现对屏蔽罩140的一次性安装，大大地降低了工艺难度；进一步可以形成一个整体的、封闭的金属屏蔽罩，进而实现了封装件的电磁屏蔽特性。此外，本发明先进行一次塑封，再一次性安装屏蔽罩140，而后进行二次塑封得到电磁屏蔽封装件，工艺简单易操作，大大降低了电磁屏蔽封装工艺的难度，进一步提高了电磁屏蔽封装的效率。In a method for manufacturing an electromagnetic shielding package of the present invention, the shielding cover 140 is covered and bonded on the first plastic sealing compound 310, and the bottom of the shielding cover 140 is electrically connected to the surrounding wall 130, so as to realize the one-time operation of the shielding cover 140. The flexible installation greatly reduces the difficulty of the process; further, an integral, closed metal shield can be formed, thereby realizing the electromagnetic shielding characteristics of the package. In addition, the present invention performs one-time plastic sealing, then installs the shielding cover 140 once, and then performs secondary plastic-sealing to obtain the electromagnetic shielding package. The process is simple and easy to operate, which greatly reduces the difficulty of the electromagnetic shielding packaging process and further improves the electromagnetic shielding package. efficiency.

本发明的一种电磁屏蔽封装件，包括基岛110、引脚120、围墙130、屏蔽罩140、芯片200、第一塑封料310和第二塑封料320，基岛110的两侧或者四周设有引脚120，引脚120的外侧设有围墙130，值得说明的是，围墙130的上部为若干个设置于引脚120外侧的金属柱或者金属环。本发明的芯片200通过电性连接部210与引脚120电性连接。结合图2所示，本实施例的电性连接部210为焊丝，芯片200采用正装方式安装，焊丝设置于芯片200的顶部，芯片200通过焊丝与引脚120电性连接。An electromagnetic shielding package of the present invention includes a base island 110 , pins 120 , a wall 130 , a shielding cover 140 , a chip 200 , a first plastic sealing compound 310 and a second plastic sealing compound 320 . There are pins 120 , and the outer sides of the pins 120 are provided with walls 130 . It is worth noting that the upper part of the walls 130 is a plurality of metal columns or metal rings disposed outside the pins 120 . The chip 200 of the present invention is electrically connected to the pins 120 through the electrical connection portion 210 . Referring to FIG. 2 , the electrical connection portion 210 in this embodiment is a welding wire, the chip 200 is installed in a positive manner, the welding wire is disposed on the top of the chip 200 , and the chip 200 is electrically connected to the pins 120 through the welding wire.

本发明的第一塑封料310用于包覆基岛110的上部、引脚120的上部、电性连接部210以及芯片200；需要说明的是，第一塑封料310还包覆部分围墙130的上部，被包覆的部分围墙130的上部靠近引脚120。进一步地，本发明的屏蔽罩140覆盖于第一塑封料310上，且屏蔽罩140的底部与围墙130的上部电性连接，具体地，屏蔽罩140通过导电胶覆盖粘结于第一塑封料310上，且屏蔽罩140的底部通过导电胶与围墙130电性导通，从而实现对屏蔽罩140的一次性安装，大大地降低了工艺难度；进一步可以形成一个整体的、封闭的金属屏蔽罩，进而实现了电磁屏蔽封装件的电磁屏蔽特性。此外，本发明的第二塑封料320用于包覆剩余部分围墙130的上部和屏蔽罩140，本实施例中第一塑封料310和第二塑封料320均为环氧树脂模塑料。进一步地，基岛110的下部、引脚120的下部和围墙130的下部设有防氧化金属层400，从而可以避免电磁屏蔽封装件被氧化。The first plastic sealing compound 310 of the present invention is used to cover the upper part of the base island 110 , the upper part of the lead 120 , the electrical connection part 210 and the chip 200 ; it should be noted that the first plastic sealing compound 310 also covers part of the surrounding wall 130 The upper, upper part of the clad partial wall 130 is adjacent to the pin 120 . Further, the shielding cover 140 of the present invention is covered on the first plastic sealing compound 310, and the bottom of the shielding cover 140 is electrically connected with the upper part of the surrounding wall 130. Specifically, the shielding cover 140 is covered and bonded to the first plastic sealing compound by conductive adhesive. 310, and the bottom of the shielding cover 140 is electrically connected to the wall 130 through the conductive glue, so as to realize the one-time installation of the shielding cover 140, which greatly reduces the difficulty of the process; further, an integral, closed metal shielding cover can be formed , thereby realizing the electromagnetic shielding properties of the electromagnetic shielding package. In addition, the second molding compound 320 of the present invention is used to cover the upper part of the remaining part of the surrounding wall 130 and the shielding cover 140 . In this embodiment, the first molding compound 310 and the second molding compound 320 are both epoxy resin molding compounds. Further, the lower part of the base island 110 , the lower part of the lead 120 and the lower part of the enclosure wall 130 are provided with an anti-oxidation metal layer 400 , so that the electromagnetic shielding package can be prevented from being oxidized.

实施例2Example 2

结合图3所示，本实施例的内容基本同实施例1，不同之处在于：本实施例的芯片200为倒装封装，如图4所示，电性连接部210为焊球，该焊球设置于芯片200的底部，芯片200通过焊球与引脚120电性连接。本实施例的一种电磁屏蔽封装件的制作方法，在步骤S2中，预先在芯片200底部设置焊球，具体地，在芯片200底部的两侧或四周以及中间位置设置焊球，将设置有焊球的芯片200置于基岛110和引脚120的上方，并将焊球对应的电性连接于基岛110和引脚120的上部。本实施例的电磁屏蔽封装件的制作方法的其余步骤与实施例1相一致。值得说明的是，在倒装封装方式中，基岛110和引脚120均起到承载芯片200的作用，特别地，若基岛110不设置电性输出，则可以不设置基岛110，只需通过引脚120来承载芯片200。Referring to FIG. 3 , the content of this embodiment is basically the same as that of Embodiment 1, except that the chip 200 of this embodiment is a flip-chip package. As shown in FIG. 4 , the electrical connection portion 210 is a solder ball, and the solder The balls are disposed at the bottom of the chip 200 , and the chip 200 is electrically connected to the pins 120 through solder balls. In the method for manufacturing an electromagnetic shielding package in this embodiment, in step S2, solder balls are pre-arranged at the bottom of the chip 200. The chip 200 with solder balls is placed above the base island 110 and the pins 120 , and the corresponding solder balls are electrically connected to the upper parts of the base island 110 and the pins 120 . The remaining steps of the manufacturing method of the electromagnetic shielding package of this embodiment are the same as those of the first embodiment. It is worth noting that, in the flip-chip packaging method, the base island 110 and the pins 120 both play the role of carrying the chip 200. In particular, if the base island 110 is not provided with an electrical output, the base island 110 may not be provided, and only the base island 110 may be provided. The chip 200 needs to be carried by the pins 120 .

在上文中结合具体的示例性实施例详细描述了本发明。但是，应当理解，可在不脱离由所附权利要求限定的本发明的范围的情况下进行各种修改和变型。详细的描述和附图应仅被认为是说明性的，而不是限制性的，如果存在任何这样的修改和变型，那么它们都将落入在此描述的本发明的范围内。此外，背景技术旨在为了说明本技术的研发现状和意义，并不旨在限制本发明或本申请和本发明的应用领域。The present invention has been described in detail above with reference to specific exemplary embodiments. However, it should be understood that various modifications and variations can be made without departing from the scope of the present invention as defined by the appended claims. The detailed description and drawings are to be regarded in an illustrative rather than a restrictive sense, and if any such modifications and variations exist, they will fall within the scope of the invention described herein. In addition, the background art is intended to illustrate the research and development status and significance of the present technology, and is not intended to limit the present invention or the application and application fields of the present invention.

Claims (10)

1. An electromagnetic shielding package, comprising
The device comprises a base island (110), wherein pins (120) are arranged on two sides or four sides of the base island (110), and enclosing walls (130) are arranged on the outer sides of the pins (120);
a chip (200), wherein the chip (200) is electrically connected with the pins (120) through the electrical connection parts (210);
the first molding compound (310), the first molding compound (310) is used for coating the upper part of the base island (110), the upper parts of the pins (120), the upper parts of the partial enclosing walls (130), the electric connection parts (210) and the chip (200);
the shielding cover (140), the shielding cover (140) covers on the first plastic packaging material (310), and the bottom of the shielding cover (140) is electrically connected with the enclosing wall (130);
and a second molding compound (320), wherein the second molding compound (320) is used for coating the upper part of the remaining part of the fence (130) and the shielding cover (140), and the second molding compound (320) does not coat the lower part of the base island (110), the lower part of the pin (120) and the lower part of the fence (130).
2. The electromagnetic shielding package of claim 1, wherein the electrical connection (210) is a solder wire, and the chip (200) is electrically connected to the pin (120) through the solder wire.
3. The EMI shielding package as claimed in claim 1, wherein the electrical connection portion (210) is a solder ball, and the chip (200) is electrically connected to the pad (110) and the leads (120) through the solder ball.
4. The EMI package of claim 1, wherein the bottom of said shielding enclosure (140) is electrically connected to said perimeter wall (130) by a conductive adhesive.
5. The EMI package as claimed in any one of claims 1-4, wherein the upper portion of the enclosure (130) is a plurality of metal posts or rings disposed outside the pins (120).
6. A method for manufacturing an electromagnetic shielding package according to any one of claims 1 to 5, wherein: the method comprises the following steps:
s1, half-etching the upper part of the first substrate to form the upper part of the base island (110), the upper part of the pin (120) and the upper part of the fence (130);
s2, electrically setting the chip (200) to ensure that the chip (200) is electrically connected with the upper parts of the pins (120);
s3, plastically packaging the chip (200) by using a first plastic packaging material (310), so that the first plastic packaging material (310) covers the upper part of the base island (110), the upper parts of the pins (120), the upper parts of the partial enclosing walls (130), the electric connection part (210) and the chip (200);
s4, manufacturing a shielding case (140) by using the second substrate, covering the shielding case (140) on the first molding compound (310), and electrically connecting the bottom of the shielding case (140) with the upper part of the enclosing wall (130);
s5, plastic packaging the upper part of the remaining part of the enclosing wall (130) and the shielding case (140) by using a second plastic packaging material (320), so that the second plastic packaging material (320) covers the upper part of the first base material and the shielding case (140);
s6, half-etching the lower part of the substrate to form the lower part of the base island (110), the lower part of the pin (120) and the lower part of the fence (130), so that the base island (110), the pin (120) and the fence (130) are separated from each other;
s7, electroplating the lower part of the base island (110), the lower parts of the pins (120) and the lower part of the enclosing wall (130) to form an anti-oxidation metal layer (400), and cutting and separating the base island (110), the pins (120) and the enclosing wall (130) as a whole to obtain a single electromagnetic shielding packaging piece.
7. The method of claim 6, wherein: if the chip (200) is packaged in a normal mounting manner, the specific process of step S2 is: the chip (200) is placed above the base island (110), and then the base island (110) is electrically connected with the upper part of the pin (120) by using the bonding wire.
8. The method of claim 6, wherein: if the chip (200) is packaged in a flip-chip manner, the specific process of step S2 is: solder balls are arranged at the bottom of the chip (200) in advance, the chip (200) provided with the solder balls is arranged above the base island (110) and the pins (120), and the solder balls are correspondingly and electrically connected to the upper parts of the base island (110) and the pins (120).
9. A method for making an electromagnetic shielding package according to any one of claims 6 to 8, wherein: the shielding cover (140) is covered and adhered on the first molding compound (310) by using conductive adhesive, and the bottom of the shielding cover (140) is adhered with the enclosing wall (130).
10. A method of making an electromagnetically shielded package as claimed in claim 9, wherein: when the electromagnetic shielding package does not require grounding or electrical connection requirements, the lower portion of the perimeter wall (130) is half etched such that the lower portion of the perimeter wall (130) is eliminated.
CN202010461371.5A 2020-05-27 2020-05-27 Electromagnetic shielding package and method of making the same Pending CN111490033A (en)

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CN115706071A (en) * 2021-08-13 2023-02-17 江苏长电科技股份有限公司 QFN package structure and manufacturing method thereof

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