CN111312865A - Method and device for full-automatic intelligent positioning, transferring and arranging LED chips - Google Patents

Abstract

The invention discloses a method and a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein the device comprises: the device comprises a material fixing mechanism, a blue film platform module, a thimble mechanism, a detection and supervision mechanism and an intelligent control mechanism. The device realizes the accurate operation of the material fixing mechanism, the blue film platform module and the thimble mechanism through the supervision of the detection and supervision mechanism and the control of the intelligent control mechanism, so that the method for accurately fixing the LED chips on the substrate is simple and easy to implement, and the device has a simple structure and is easy to realize the full-automatic intelligent transfer and arrangement of the LED chips.

Description

A method and device for fully automatic intelligent positioning, transferring and arranging LED chips

technical field

The invention relates to a method and a device for fully automatic intelligent positioning, transferring and arranging LED chips. More specifically, the present invention relates to a method and apparatus for transferring and arranging LED chips from a blue film to a substrate.

Background technique

The production technology of LED is becoming more and more mature. Whether it is a common LED chip or a micro LED chip, its production technology is no longer a problem for any LED company. As a self-luminous display technology, the micro LED chip can be driven by a single point to emit light, and its size is 10-100 times smaller than that of the current mainstream LED. The existing millimeter level has been reduced to the micrometer level. At present, the industry has taken the latest LED, with relatively high technical difficulty, higher brightness, better luminous efficiency, and lower power consumption, as a research hotspot for mass industrialization. The advantages of micro LEDs in display technology must be studied on the batch transfer of micro LEDs. The batch transfer of micro LED chips has always been a major difficulty affecting its industrial production, and micro LED displays must undergo a large number of repeated transfer processes. Only then can the LED chips on the wafer be practically applied to the display. At present, many LED companies have conducted in-depth research on micro LED transfer technology. For example, LuxVue, which has been acquired by Apple, transfers micro LEDs in batches through electrostatic adsorption. Although it is ahead in batch transfer technology, this There are a lot of defects in the technology, such as how to screen out the unqualified chips in the batch transfer process, if another method is used to screen the unqualified chips individually, it is a huge project, and how to make the micro LED and the substrate more precise positioning, etc. A series of problems still need to be solved urgently in the field of micro-LED chip batch transfer technology. More enterprises and more energy are needed to conduct in-depth research on this technology, so that micro-LED can truly play its advantageous value in industrial production.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a fully automatic method for intelligently positioning, transferring and arranging LED chips. The method has simple steps and is easy to transfer and arrange large-scale industrialized LED chips.

Another object of the present invention is to provide a fully automatic intelligent positioning, transferring and arranging device for LED chips, which has a simple mechanism and can be used in the transferring and arranging of LED chips, making the operation of transferring and arranging large quantities of LED chips simpler and more accurate.

In order to achieve the purpose and other advantages according to the present invention, the present invention provides a method for fully automatic intelligent positioning, transferring and arranging LED chips, comprising the following steps:

A. Fixed blue film;

B. Fix the substrate so that the substrate is parallel to the blue film, and the LED chip on the blue film is close to the substrate but not attached;

C. Adjust the position of the blue film and the substrate horizontally, so that the position of an LED chip on the blue film and the LED chip to be fixed on the substrate and the top pin on the other side of the blue film correspond to the same vertical line;

D. The ejector pin pushes out the LED chip from the blue film along the vertical line and attaches it to the substrate;

E. The thimble is reset, the blue film and the substrate are moved horizontally, so that the position of the next LED chip to be fixed on the blue film and the next LED chip to be fixed on the substrate and the top pin on the other side of the blue film correspond to the same vertical on-line;

F. The ejector pin pushes out the LED chip from the blue film along the vertical line direction and attaches it to the substrate;

G. Repeat E and F until the LED chips are fixed at the positions on the substrate where the LED chips need to be fixed.

The method for fully automatic intelligent positioning, transferring and arranging LED chips according to the present invention, wherein the position of the LED chips to be fixed on the substrate on the blue film or the LED chips to be fixed on the substrate is not with the thimble on the other side of the blue film. On the same vertical line, fine-tune the position of the blue film or substrate in the horizontal direction, and adjust it to be on the same vertical line as the thimble.

The method for fully automatic intelligent positioning, transferring and arranging LED chips of the present invention, wherein the LED chips to be fixed on the substrate on the blue film and the positions of the LED chips to be fixed on the substrate are aligned with the top of the other side of the blue film. The position of the blue film and the substrate should be fine-tuned in the horizontal direction not on the same vertical line, and adjusted to be on the same vertical line as the thimble.

The method for fully automatic intelligent positioning, transferring and arranging LED chips according to the present invention, wherein when the LED chip to be fixed on the top and bottom of the blue film is an unqualified LED chip, the next qualified LED chip needs to be fixed on the substrate. The position of the next LED chip and the top pin on the other side of the blue film should be on the same vertical line.

In order to achieve the purpose and other advantages according to the present invention, the present invention also provides a device for fully automatic intelligent positioning, transferring and arranging LED chips, including:

Material fixing mechanism: Fix the substrate during the transfer and arrangement of the LED chips, and adjust the position of the substrate in the x and y axis directions according to the position of the LED chips required by the substrate;

Blue film platform module: used to carry the LED chip fixed in front of the substrate, the LED chip on the blue film platform module and the substrate on the material fixing mechanism are parallel and close to each other without being attached;

Ejector mechanism: carries a fixed thimble, and by moving up and down on the z-axis, the LED chip at the corresponding position of the ejector is ejected from the blue film platform module and attached to the substrate;

Inspection and supervision mechanism: including bracket, camera inspection mechanism, camera inspection mechanism fixed on the bracket, detection material fixing mechanism, blue film platform module, thimble mechanism, the position between the three in the x and y axis directions;

Intelligent control mechanism: including the control material fixing mechanism, the blue film platform module, the thimble mechanism, and the operation of the inspection and supervision agency.

The device for automatic intelligent positioning, transferring and arranging LED chips of the present invention, wherein the material fixing mechanism transports the substrate into the device, and transports the substrate out of the device after fixing the required LED chips on the substrate.

The device of the present invention for automatic intelligent positioning, transferring and arranging LED chips, wherein the material fixing mechanism, before all LED chips required on the substrate are fixed, after each LED chip is fixed on the substrate on the material fixing mechanism, the material The fixing mechanism drives the substrate to move, so that the next position where the LED chip needs to be fixed corresponds to the top pin on the ejector pin mechanism on a vertical line.

The device for automatic intelligent positioning, transferring and arranging LED chips of the present invention, wherein the blue film platform module is a hollow platform module.

The device for automatic intelligent positioning, transferring and arranging LED chips of the present invention, wherein the hollow blue film platform module is hollow at the corresponding position of the LED chips.

The fully automatic intelligent positioning, transferring and arranging device for LED chips of the present invention, wherein the blue film platform module is fixed on the material fixing mechanism before all LED chips required on the substrate on the material fixing mechanism are fixed, and each LED chip is fixed on the material fixing mechanism After the substrate is placed on, the blue film platform module drives the LED chip on the blue film platform module to move, so that the next LED chip that needs to be fixed on the substrate and the top pin on the ejector mechanism correspond to a vertical line.

The device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention, wherein the intelligent control mechanism marks the position of the unqualified LED chips on the blue film platform module. When the first LED chip is an unqualified LED chip, it will automatically jump to the next qualified LED chip and the top needle on the thimble mechanism corresponds to a vertical line.

The device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention, wherein the ejector mechanism has no displacement on the x and y axes, and can only move up and down on the z axis; the movement path of the ejector mechanism includes:

The thimble mechanism moves upward along the z-axis;

The LED chip corresponding to the position of the ejector pin is ejected from the blue film platform module through the ejector pin;

Attach the ejected LED chip to the substrate on the material fixing mechanism;

The thimble mechanism moves down along the z-axis and returns to its original position.

The device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention, wherein the detection and supervision mechanism detects the positions of the material fixing mechanism, the blue film platform module and the thimble mechanism through the camera detection mechanism:

The material fixing mechanism needs to fix the position of the LED chip, the blue film platform module needs to fix the LED chip, and the thimble on the thimble mechanism is on the same vertical line. After the detection and supervision organization sends a signal to the intelligent control mechanism, the thimble mechanism starts. Drive the thimble to move up along the z-axis, push out the LED chip at the corresponding position on the blue film platform module, and fit it to the position of the LED chip that needs to be fixed on the substrate on the material fixing mechanism;

The position of the LED chip to be fixed on the material fixing mechanism or the LED chip to be fixed on the blue film platform module is not on the same vertical line as the thimble on the thimble mechanism. After the detection and supervision institution sends a signal to the intelligent control mechanism, the intelligent control The mechanism controls the material fixing mechanism or the blue film platform module to fine-tune the position in the horizontal direction, so that the material fixing mechanism that is not on the same vertical line as the thimble on the thimble mechanism needs to fix the position of the LED chip or the next blue film platform module. After the LED chip to be fixed is on the same vertical line as the thimble on the thimble mechanism, the detection and supervision mechanism sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the thimble mechanism to start to drive the thimble mechanism to move upward along the z-axis to eject the blue film The LED chip at the corresponding position on the platform module is attached to the position of the LED chip that needs to be fixed on the substrate on the material fixing mechanism;

The material fixing mechanism needs to fix the position of the LED chip and the LED chip that needs to be fixed next to the blue film platform module is not on the same vertical line as the thimble on the thimble mechanism. After the detection and supervision institution sends a signal to the intelligent control mechanism, the intelligent The control mechanism controls the material fixing mechanism and the blue film platform module to fine-tune the positions in the horizontal direction, so that the material fixing mechanism that is not on the same vertical line as the thimble on the thimble mechanism needs to fix the position of the LED chip and the blue film platform module. After the next LED chip to be fixed is on the same vertical line as the thimble on the thimble mechanism, the detection and supervision mechanism sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the thimble mechanism to start to drive the thimble to move up along the z-axis, and eject the The LED chip at the corresponding position on the blue film platform module is attached to the position of the LED chip that needs to be fixed on the substrate on the material fixing mechanism.

The present invention includes at least the following beneficial effects:

At present, the batch transfer technology of LED micro chips, such as Mini LED and Micro LED chips, is almost controlled by foreign companies. They restrict the development of other companies in the field of micro LED chip transfer technology by applying for patents. The LED chip batch transfer has made a difference. There is no way to use the existing technology. The only thing we can do is to develop our unique technology through independent research and development. During the batch transfer experiment, a method for batch transfer of chips was found. By positioning the chip on the blue film and the substrate on which the chip needs to be fixed, the chip was ejected from the blue film by the ejector pin and attached to the chip. On the substrate, the steps of the method for batch transferring and arranging chips of the present invention are simple and easy to operate, and in the process, unqualified LED chips can be screened, and the LED chips and the required fixed positions on the substrate can be accurately positioned, which can effectively The work efficiency of batch transfer and arrangement of LED chips is improved, and the qualification rate of LED chips on the substrate is guaranteed.

In the research process, the inventor of the present invention has developed a fully automatic intelligent positioning, transferring and arranging device for LED chips in order to enable the transfer and arrangement of LED chips to enter mass industrialization. Batch transfer and arrangement can realize fully automatic and intelligent operation. No human participation is required in the whole process. The whole process of LED chip transfer and arrangement is supervised and controlled by the device itself, including the LED chips on the blue film and the LED chips to be fixed on the substrate. The position is positioned and monitored. If there is a position deviation, the position deviation can be fine-tuned, and the unqualified LED chips can be screened out to ensure that each LED chip fixed on the substrate is accurately positioned and qualified. . .

Other advantages, objects, and features of the present invention will appear in part from the description that follows, and in part will be appreciated by those skilled in the art from the study and practice of the invention.

Description of drawings

The accompanying drawings in the description are for the purpose of further explaining the present invention, and are not intended to limit the protection scope of the present invention.

FIG. 1 is a schematic front view of the structure of the device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention.

FIG. 2 is a schematic top view of the structure of the device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention.

3 is a schematic side view A of the structure of the device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention.

FIG. 4 is a schematic side view B of the structure of the device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention.

FIG. 5 is a schematic side view of the schematic structure of another device for automatic intelligent positioning, transferring and arranging LED chips according to the present invention.

Description: 1. is the ejector mechanism, 2. is the ejector, 3. is the blue film platform module, 4. is the blue film, 5. is the LED chip, 6. is the material fixing mechanism, 7. is the substrate, and 8. is the bracket , 9, for the inspection and supervision agencies.

Detailed ways

Embodiments of the present disclosure are described in the specification. The disclosed embodiments are merely examples and other embodiments may take various and alternative forms, and the numbers are not necessarily to scale; some functions may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to various application embodiments.

The present invention will be described in further detail below in conjunction with the specific embodiments, so that those skilled in the art can implement it with reference to the description, rather than limiting the scope of the present invention.

The LED chips described in the present invention include ordinary LED chips, micro LED chips, and micro chips include Mini LED chips, Micro LED chips, etc., that is, the technology of the present invention is applicable to the arrangement and transfer of LED chips of any size, especially Suitable for Mini LED chips. The blue film of the present invention is the blue film used for crystal expansion in the prior art, or a film with a similar effect to the blue film. If elastic, the chip on the wafer can be fixed and then the distance can be expanded. When it is used in the device of the present invention, the detection mechanism can clearly capture the position information of the object on the other side through it.

Example 1 A device for fully automatic intelligent positioning, transferring and arranging LED chips (suitable for transparent substrates).

As shown in Figure 1, the device for automatic intelligent positioning and transferring and arranging LED chips is composed of material fixing mechanism, blue film platform module, thimble mechanism, inspection and supervision mechanism, intelligent control mechanism and other parts, and a transparent substrate for arranging Mini LED chips is required. Through the material fixing mechanism, it is transported to the device and fixed on the material fixing mechanism, and moves in the X and Y axis directions through the displacement of the material fixing mechanism; The film is fixed on the blue film platform module, parallel to the horizontal direction of the substrate on the material fixing mechanism, and close to each other without sticking. The blue film platform module drives the LED chip on the blue film to move in the X and Y axis directions. Move, the position of the blue film platform module with the LED chip on it is empty, the thimble fixed on the thimble mechanism can pass through, the thimble moves up and down on the Z axis through the up and down displacement of the thimble platform, and the LED above the thimble can be moved up and down. The chip is ejected from the blue film platform module and attached to the substrate where the LED chip needs to be fixed. The ejector pin, the LED chip that needs to be fixed currently, and the substrate need to fix the LED chip, on the same vertical line. On the same vertical line, the inspection and supervision mechanism set on the other side of the substrate will detect and transmit the offset information to the intelligent control mechanism. The intelligent control mechanism controls the position deviation through the acquired position deviation information: blue film platform mold Group or material fixing mechanism, fine-tune the deviation position, so that the thimble, the LED chip that needs to be fixed at present and the substrate need to fix the LED chip on the same vertical line. When the inspection and supervision agency detects that they are on the same vertical line, the inspection and supervision agency sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the thimble mechanism to move in the Z-axis direction, and uses the thimble to place the thimble on the blue film platform module. The LED chip is pushed out to the place where the LED chip needs to be fixed on the substrate. After completion, the thimble is reset with the thimble platform, and the blue film platform module and the material fixing mechanism move horizontally respectively, so that the next LED chip to be fixed on the blue film platform module and the next one that needs to be fixed on the substrate of the material fixing mechanism. The position of the LED chip and the top pin on the other side of the blue film should be on the same vertical line. The ejector pin platform drives the ejector pin to push out the LED chip from the blue film again along the Z-axis direction and attach it to the substrate. Repeat the above to reach the position on the substrate. The position of the LED chip to be fixed must be fixed after the LED chip is fixed. During the period, when there are unqualified LED chips on the blue film platform module, the inspection and supervision agency sends a signal to the intelligent control mechanism, or marks the position information of the unqualified LED chips in the intelligent control mechanism in advance. When moving to the unqualified LED chip At the same time, the intelligent control mechanism controls the blue film platform module to move on the X and Y axes until the qualified LED chip is on the same vertical line as the thimble and the fixed LED chip required by the substrate, and then use the thimble to correspond to the thimble according to the normal steps. The LED chip on the blue film platform module is pushed out to the place where the LED chip needs to be fixed on the substrate.

Example 2 A device for fully automatic intelligent positioning, transferring and arranging LED chips (can be used for opaque substrates).

As shown in Figure 5, the device for automatic intelligent positioning, transferring and arranging LED chips consists of a material fixing mechanism, a blue film platform module, a thimble mechanism, a detection and supervision mechanism, and an intelligent control mechanism. The material fixing mechanism is transported to the device and fixed on the material fixing mechanism, and moves in the X and Y axis directions through the displacement of the material fixing mechanism; Fixed on the blue film platform module, parallel to the horizontal direction of the substrate on the material fixing mechanism, and close to each other without sticking, the blue film platform module drives the LED chip on the blue film to move in the X and Y axis directions , the position of the blue film platform module with the LED chip on it is empty, the thimble fixed on the thimble mechanism can pass through, the thimble moves up and down on the Z axis through the up and down displacement of the thimble platform, and the LED chip above the thimble can be moved up and down. It is ejected from the blue film platform module and attached to the substrate where the LED chip needs to be fixed. The ejector pin platform or the fixed ejector pin area is made of transparent material. The ejector pin, the LED chip that needs to be fixed currently and the substrate need to fix the LED chip. , On the same vertical line, if not on the same vertical line, the detection and supervision agency set on the other side of the thimble platform will detect it and transmit the offset information to the intelligent control mechanism. The intelligent control mechanism obtains the position deviation information, Mechanism for controlling position deviation: Blue film platform module or material fixing mechanism, fine-tune the deviation position, so that the thimble, the LED chip that needs to be fixed at present and the substrate need to fix the LED chip on the same vertical line. When the inspection and supervision agency detects that they are on the same vertical line, the inspection and supervision agency sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the thimble mechanism to move in the Z-axis direction, and uses the thimble to place the thimble on the blue film platform module. The LED chip is pushed out to the place where the LED chip needs to be fixed on the substrate. After completion, the thimble is reset with the thimble platform, and the blue film platform module and the material fixing mechanism move horizontally respectively, so that the next LED chip to be fixed on the blue film platform module and the next one that needs to be fixed on the substrate of the material fixing mechanism. The position of the LED chip and the top pin on the other side of the blue film should be on the same vertical line. The ejector pin platform drives the ejector pin to push out the LED chip from the blue film again along the Z-axis direction and attach it to the substrate. Repeat the above to reach the position on the substrate. The position of the LED chip to be fixed must be fixed after the LED chip is fixed. During the period, when there are unqualified LED chips on the blue film platform module, the inspection and supervision agency sends a signal to the intelligent control mechanism, or marks the position information of the unqualified LED chips in the intelligent control mechanism in advance. When moving to the unqualified LED chip At the same time, the intelligent control mechanism controls the blue film platform module to move on the X and Y axes until the qualified LED chip is on the same vertical line as the thimble and the fixed LED chip required by the substrate, and then use the thimble to correspond to the thimble according to the normal steps. The LED chip on the blue film platform module is pushed out to the place where the LED chip needs to be fixed on the substrate.

It is obvious that those skilled in the art can obtain various effects that have not been directly mentioned according to the respective embodiments from the various structures of the embodiments of the present invention.

Although embodiments of the present invention have been disclosed above, they are not limited to the applications set forth in the specification and embodiments. It can be fully adapted to various fields suitable for the present invention. Additional modifications can readily be implemented by those skilled in the art. Therefore, the invention is not to be limited to the specific details and illustrations herein shown and described, without departing from the general concept defined by the appended claims and the scope of equivalents.

Claims (13)

1. a fully automatic intelligent positioning transfer, a method for arranging LED chips, characterized in that the method comprises: A. Fixed blue film; B. Fix the substrate so that the substrate is parallel to the blue film, and the LED chip on the blue film is close to the substrate but not attached; C. Adjust the position of the blue film and the substrate horizontally, so that the position of an LED chip on the blue film and the LED chip to be fixed on the substrate and the top pin on the other side of the blue film correspond to the same vertical line; D. The ejector pin pushes out the LED chip from the blue film along the vertical line and attaches it to the substrate; E. The thimble is reset, the blue film and the substrate are moved horizontally, so that the position of the next LED chip to be fixed on the blue film and the next LED chip to be fixed on the substrate and the top pin on the other side of the blue film correspond to the same vertical on-line; F. The ejector pin pushes out the LED chip from the blue film along the vertical line direction and attaches it to the substrate; G. Repeat E and F until the LED chips are fixed at the positions on the substrate where the LED chips need to be fixed. 2. The method for fully automatic intelligent positioning, transferring and arranging LED chips according to claim 1, characterized in that, the position of the LED chips to be fixed on the substrate or the LED chips to be fixed on the substrate on the blue film is the same as that of the blue film. The thimble on the other side of the membrane is not on the same vertical line, and the position of the blue membrane or substrate is fine-tuned in the horizontal direction to adjust to the same vertical line as the thimble. 3. The method for fully automatic intelligent positioning and transferring and arranging LED chips according to claim 1, characterized in that, the position of the LED chips to be fixed on the substrate and the LED chips to be fixed on the substrate on the blue film are the same as the blue film. The top pin on the other side of the membrane should not be on the same vertical line. Adjust the position of the blue film and the substrate in the horizontal direction to be on the same vertical line as the top pin. 4. The method for fully automatic intelligent positioning, transferring and arranging LED chips according to claim 1, wherein the LED chip to be fixed on the top and bottom of the blue film is an unqualified LED chip, and the next qualified LED chip is connected with the LED chip. The position of the next LED chip to be fixed on the substrate and the top pin on the other side of the blue film correspond to the same vertical line. 5. A device for fully automatic intelligent positioning, transferring and arranging LED chips, characterized in that the device comprises: Material fixing mechanism: Fix the substrate during the transfer and arrangement of the LED chips, and adjust the position of the substrate in the x and y axis directions according to the position of the LED chips required by the substrate; Blue film platform module: used to carry the LED chip fixed in front of the substrate, the LED chip on the blue film platform module and the substrate on the material fixing mechanism are parallel and close to each other without being attached; Ejector mechanism: carries a fixed thimble, and by moving up and down on the z-axis, the LED chip at the corresponding position of the ejector is ejected from the blue film platform module and attached to the substrate; Inspection and supervision mechanism: including bracket, camera inspection mechanism, camera inspection mechanism fixed on the bracket, detection material fixing mechanism, blue film platform module, thimble mechanism, the position between the three in the x and y axis directions; Intelligent control mechanism: including the control material fixing mechanism, the blue film platform module, the thimble mechanism, and the operation of the inspection and supervision organization. 6. The device for fully automatic intelligent positioning, transferring and arranging LED chips according to claim 5, wherein the material fixing mechanism transports the substrate into the device, and transports the substrate out of the device after fixing the required LED chips on the substrate . 7. The device for fully automatic intelligent positioning, transferring and arranging LED chips according to claim 5, characterized in that, in the material fixing mechanism, each LED chip is fixed on the material fixing mechanism before all LED chips required on the substrate are fixed. After the substrate on the mechanism, the material fixing mechanism drives the substrate to move, so that the next position where the LED chip needs to be fixed corresponds to the top pin on the ejector pin mechanism on a vertical line. 8 . The device for automatic intelligent positioning, transferring and arranging LED chips according to claim 5 , wherein the blue film platform module is a hollow platform module. 9 . 9 . The fully automatic intelligent positioning, transferring and arranging device for LED chips according to claim 8 , wherein the hollow blue film platform module is hollow at the corresponding position of the LED chips. 10 . 10. The device for fully automatic intelligent positioning, transferring and arranging LED chips according to claim 5, characterized in that, before the blue film platform module completes the fixing of all LED chips required on the substrate on the material fixing mechanism, each After the LED chip is fixed on the substrate on the material fixing mechanism, the blue film platform module drives the LED chip on the blue film platform module to move, so that the next LED chip that needs to be fixed on the substrate and the top needle on the ejector mechanism correspond to a vertical on-line. 11. The device for automatic intelligent positioning and transferring and arranging LED chips according to claim 10, wherein the intelligent control mechanism marks the unqualified LED chips on the blue film platform module. When the next LED chip that needs to be fixed on the substrate is an unqualified LED chip, it will automatically jump to the next qualified LED chip and the top pin on the ejector pin mechanism corresponds to a vertical line. 12. The device for fully automatic intelligent positioning, transferring and arranging LED chips according to claim 5, wherein the ejector mechanism has no displacement on the x and y axes, but can only move up and down on the z axis; the movement path of the ejector mechanism include: The thimble mechanism moves upward along the z-axis; The LED chip corresponding to the position of the ejector pin is ejected from the blue film platform module through the ejector pin; Attach the ejected LED chip to the substrate on the material fixing mechanism; The thimble mechanism moves down along the z-axis and returns to its original position. 13. The device according to claim 5, wherein the detection and supervision mechanism detects the positions of the material fixing mechanism, the blue film platform module and the thimble mechanism through the camera detection mechanism: The material fixing mechanism needs to fix the position of the LED chip, the blue film platform module needs to fix the LED chip, and the thimble on the thimble mechanism is on the same vertical line. After the detection and supervision organization sends a signal to the intelligent control mechanism, the thimble mechanism starts. Drive the thimble to move up along the z-axis, push out the LED chip at the corresponding position on the blue film platform module, and fit it to the position of the LED chip that needs to be fixed on the substrate on the material fixing mechanism; The position of the LED chip to be fixed on the material fixing mechanism or the LED chip to be fixed on the blue film platform module is not on the same vertical line as the thimble on the thimble mechanism. After the detection and supervision institution sends a signal to the intelligent control mechanism, the intelligent control The mechanism controls the material fixing mechanism or the blue film platform module to fine-tune the position in the horizontal direction, so that the material fixing mechanism that is not on the same vertical line as the thimble on the thimble mechanism needs to fix the position of the LED chip or the next blue film platform module. After the LED chip to be fixed is on the same vertical line as the thimble on the thimble mechanism, the detection and supervision mechanism sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the thimble mechanism to start to drive the thimble mechanism to move upward along the z-axis to eject the blue film The LED chip at the corresponding position on the platform module is attached to the position of the LED chip that needs to be fixed on the substrate on the material fixing mechanism; The material fixing mechanism needs to fix the position of the LED chip and the LED chip that needs to be fixed next to the blue film platform module is not on the same vertical line as the thimble on the thimble mechanism. After the detection and supervision institution sends a signal to the intelligent control mechanism, the intelligent The control mechanism controls the material fixing mechanism and the blue film platform module to fine-tune the positions in the horizontal direction, so that the material fixing mechanism that is not on the same vertical line as the thimble on the thimble mechanism needs to fix the position of the LED chip and the blue film platform module. After the next LED chip to be fixed is on the same vertical line as the thimble on the thimble mechanism, the detection and supervision mechanism sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the thimble mechanism to start to drive the thimble to move up along the z-axis, and eject the The LED chip at the corresponding position on the blue film platform module is attached to the position of the LED chip that needs to be fixed on the substrate on the material fixing mechanism.

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