CN111159970B - Multi-physical-field analysis method and device for flexible interconnection reliability - Google Patents
Multi-physical-field analysis method and device for flexible interconnection reliability Download PDFInfo
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Abstract
本发明提供了一种针对柔性互连可靠性的多物理场分析方法及装置。所述方法包括：将柔性互连电路设计文件导入电磁仿真软件；基于柔性互连电路设计文件，在电磁仿真软件中建立柔性互连电路板对应的三维电磁模型；基于三维电磁模型，提取柔性互连电路板对应的互连传输参数；根据互连传输参数，计算柔性互连电路板的第一误码率；在第一误码率小于等于10‑12时，对柔性互连电路板进行结构仿真，计算得到柔性互连电路板所能承受的最大形变；基于最大形变确定柔性电路板的最大形变模型；根据最大形变模型，计算柔性互连电路板的第二误码率；基于第二误码率，分析柔性互连电路板的信号传输质量。本发明可以实现对柔性电路的可靠性进行充分评估。
The invention provides a multi-physical field analysis method and device for the reliability of flexible interconnection. The method includes: importing the flexible interconnection circuit design file into electromagnetic simulation software; establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file; and extracting the flexible interconnection circuit board based on the three-dimensional electromagnetic model Connect the interconnection transmission parameters corresponding to the circuit board; calculate the first bit error rate of the flexible interconnection circuit board according to the interconnection transmission parameters; when the first bit error rate is less than or equal to 10-12 , perform structural Simulation, calculate the maximum deformation that the flexible interconnection circuit board can withstand; determine the maximum deformation model of the flexible circuit board based on the maximum deformation; calculate the second bit error rate of the flexible interconnection circuit board based on the maximum deformation model; Bit rate, to analyze the signal transmission quality of the flexible interconnect circuit board. The invention can fully evaluate the reliability of the flexible circuit.
Description
技术领域technical field
本发明涉及电路设计技术领域，特别是一种针对柔性互连可靠性的多物理场分析方法及装置。The invention relates to the technical field of circuit design, in particular to a multi-physical field analysis method and device for the reliability of flexible interconnection.
背景技术Background technique
柔性电子克服了传统无机电子产品脆硬的缺点，在保持优异电学性能的基础上以优异的可延展性极大拓展了微电子器件的应用范围。柔性互连是柔性电子学研究中的关键科学问题。柔性互连线不仅是柔性电路形变的主要承载对象，同时发生形变的互连线对于电子系统信号完整性具有显著影响。因此，深入分析柔性互连的电学性能以及形变规律并建立适用于电子系统的可靠性分析十分重要，这也是柔性电子系统性能仿真和互连布局布线优化的必要前提。Flexible electronics overcome the shortcomings of brittle and hard traditional inorganic electronic products, and greatly expand the application range of microelectronic devices with excellent ductility on the basis of maintaining excellent electrical properties. Flexible interconnection is a key scientific issue in the study of flexible electronics. Flexible interconnects are not only the main objects of deformation of flexible circuits, but also deformed interconnects have a significant impact on the signal integrity of electronic systems. Therefore, it is very important to deeply analyze the electrical properties and deformation laws of flexible interconnects and establish a reliability analysis applicable to electronic systems, which is also a necessary prerequisite for performance simulation of flexible electronic systems and optimization of interconnect layout and routing.
柔性电路板是以导体和耐热高分子薄膜构成的组合为基本结构，只在耐热高分子薄膜的单面设置导体的柔性电路板称为单面柔性电路板；在耐热高分子薄膜的两面设置导体的柔性电路板称为双面柔性电路板。单面柔性电路板的制造方法中，一般采用铜箔层叠板，即通过粘合剂在耐热高分子薄膜上贴合铜箔层叠板，通过对铜箔层叠板实施金属面腐蚀法，能够形成布线图案，制造单面柔性电路板。多层柔性电路板是通过在单面柔性电路板或双面柔性电路板上涂覆薄膜及绝缘树脂而得到的电路板，多层柔性电路板通过用镀膜法在通孔的内壁上设置金属，形成过孔导体，连接多层柔性电路板的各层的布线图案。The flexible circuit board is based on the combination of a conductor and a heat-resistant polymer film. The flexible circuit board with a conductor on only one side of the heat-resistant polymer film is called a single-sided flexible circuit board; A flexible circuit board with conductors on both sides is called a double-sided flexible circuit board. In the manufacturing method of single-sided flexible circuit boards, copper foil laminates are generally used, that is, copper foil laminates are bonded on heat-resistant polymer films with adhesives, and copper foil laminates are etched on the metal surface to form Wiring patterns, manufacturing single-sided flexible circuit boards. The multilayer flexible circuit board is a circuit board obtained by coating a film and insulating resin on a single-sided flexible circuit board or a double-sided flexible circuit board. The multilayer flexible circuit board is provided with metal on the inner wall of the through hole by coating method. Via conductors are formed to connect the wiring patterns of each layer of the multilayer flexible circuit board.
随着信号传输频率的飞速提升，柔性互连所担负的信号质量至关重要，但是目前对柔性互连可靠性的分析还存在以下问题：With the rapid increase of signal transmission frequency, the signal quality of flexible interconnection is very important, but the current analysis of the reliability of flexible interconnection still has the following problems:
其一，柔性互连电性能的分析主要以测试为主，测试的主要参数为互连线的传输阻抗、插损以及回损参数。分析对象大部分集中在封装级别，分析频段集中在直流或低频阶段，对于高频阶段以及长距离传输的柔性互连的建模和分析方法鲜少研究；First, the analysis of the electrical performance of the flexible interconnection is mainly based on testing, and the main parameters of the test are the transmission impedance, insertion loss and return loss parameters of the interconnection line. Most of the analysis objects are concentrated at the packaging level, and the analysis frequency band is concentrated in the DC or low-frequency stage. There are few researches on the modeling and analysis methods of flexible interconnections in the high-frequency stage and long-distance transmission;
其二，结构可靠性问题:柔性电路板具有体积小、厚度薄、重量轻、柔性大、结构简洁灵活等诸多的优点，用于动态弯曲的、卷曲及其折叠的场合等。但柔性互连面临着大幅度弯折，且柔性板局部刚度低，振动频率高、抗压和抗折弯能力差，存在强非线性、高度耦合的问题，在受力情况下的变形具有非线性的特点，如何模拟非线性变形后的结构特性是难点。Second, the problem of structural reliability: flexible circuit boards have many advantages such as small size, thin thickness, light weight, large flexibility, simple and flexible structure, etc., and are used for dynamic bending, curling and folding occasions. However, the flexible interconnection is faced with large bending, and the local stiffness of the flexible board is low, the vibration frequency is high, the compression and bending resistance are poor, and there are problems of strong nonlinearity and high coupling. Due to the linear characteristics, how to simulate the structural characteristics after nonlinear deformation is difficult.
其三，形变对电学特性的影响：分析不同形变对柔性互连信号传输质量的影响。由于柔性板结构不能抵抗外压力以及抗弯刚度很小，所以当柔性板受到面外压力或者弯扭的作用后往往会产生弯折，弯折后有可能会造成内部电信号传输失真。Third, the influence of deformation on electrical characteristics: analyze the influence of different deformations on the signal transmission quality of flexible interconnection. Since the flexible board structure cannot resist external pressure and the bending stiffness is very small, when the flexible board is subjected to external pressure or bending torsion, it will often bend, which may cause internal electrical signal transmission distortion after bending.
发明内容Contents of the invention
本发明解决的技术问题是：克服现有技术的不足，提供了一种针对柔性互连可靠性的多物理场分析方法及装置。The technical problem solved by the invention is to overcome the deficiencies of the prior art and provide a multi-physical field analysis method and device for the reliability of flexible interconnection.
为了解决上述技术问题，本发明实施例提供了一种针对柔性互连可靠性的多物理场分析方法，包括：In order to solve the above technical problems, an embodiment of the present invention provides a multi-physics analysis method for the reliability of flexible interconnection, including:
将柔性互连电路设计文件导入电磁仿真软件；Import the flexible interconnection circuit design file into the electromagnetic simulation software;
基于所述柔性互连电路设计文件，在所述电磁仿真软件中建立柔性互连电路板对应的三维电磁模型；Based on the flexible interconnection circuit design file, a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board is established in the electromagnetic simulation software;
基于所述三维电磁模型，提取所述柔性互连电路板对应的互连传输参数；Based on the three-dimensional electromagnetic model, extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board;
根据所述互连传输参数，计算所述柔性互连电路板在实际工作频率下的第一误码率；calculating a first bit error rate of the flexible interconnection circuit board at an actual operating frequency according to the interconnection transmission parameters;
在所述第一误码率小于等于10-12时，对所述柔性互连电路板进行结构仿真，计算得到所述柔性互连电路板所能承受的最大形变；When the first bit error rate is less than or equal to 10 −12 , performing structural simulation on the flexible interconnection circuit board, and calculating the maximum deformation that the flexible interconnection circuit board can withstand;
基于所述最大形变，确定所述柔性电路板的最大形变模型；determining a maximum deformation model of the flexible circuit board based on the maximum deformation;
根据所述最大形变模型，计算所述柔性互连电路板在实际工作频率下的第二误码率；calculating a second bit error rate of the flexible interconnection circuit board at an actual operating frequency according to the maximum deformation model;
基于所述第二误码率，分析所述柔性互连电路板的信号传输质量。Based on the second bit error rate, analyzing the signal transmission quality of the flexible interconnection circuit board.
优选地，所述基于所述柔性互连电路设计文件，在所述电磁仿真软件中建立柔性互连电路板对应的三维电磁模型的步骤，包括：Preferably, the step of establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file includes:
根据所述柔性互连电路设计文件，设置所述柔性互连电路板的材料参数和叠层参数，材料参数包含传输导线材料参数和介质参数；According to the flexible interconnection circuit design document, setting material parameters and stacking parameters of the flexible interconnection circuit board, the material parameters include transmission wire material parameters and medium parameters;
计算所述柔性互连电路板在高频下的趋肤深度；calculating the skin depth of the flexible interconnect circuit board at high frequencies;
计算并设置电磁场有限元网格划分时网格的最大长度；Calculate and set the maximum length of the grid when the electromagnetic field finite element grid is divided;
计算提取所述柔性互连电路板的电磁散射参数；calculating and extracting the electromagnetic scattering parameters of the flexible interconnection circuit board;
确定所述柔性互连电路板是否存在形变和扭曲状态；Determining whether the flexible interconnect circuit board is deformed and twisted;
在所述柔性互连电路板不存在形变和扭曲状态时，根据所述传输导线材料参数、所述介质参数、所述叠层参数、所述趋肤深度、所述最大长度和所述电磁散射参数，搭建所述三维电磁模型。When the flexible interconnection circuit board is free of deformation and distortion, according to the transmission wire material parameters, the dielectric parameters, the stack parameters, the skin depth, the maximum length and the electromagnetic scattering parameters to build the three-dimensional electromagnetic model.
优选地，所述根据所述互连传输参数，计算所述柔性互连电路板在实际工作频率下的第一误码率的步骤，包括：Preferably, the step of calculating the first bit error rate of the flexible interconnection circuit board at the actual operating frequency according to the interconnection transmission parameters includes:
根据所述三维电磁模型和所述互连传输参数，计算高速信号在所述实际工作频率下的传输眼图、抖动参数和浴盆曲线；According to the three-dimensional electromagnetic model and the interconnection transmission parameters, calculate the transmission eye diagram, jitter parameters and bathtub curve of the high-speed signal at the actual operating frequency;
根据所述传输眼图、所述抖动参数和所述浴盆曲线，计算得到所述第一误码率。The first bit error rate is calculated according to the transmission eye diagram, the jitter parameter, and the bathtub curve.
优选地，在所述根据所述互连传输参数，计算所述柔性互连电路板在实际工作频率下的第一误码率的步骤之后，还包括：Preferably, after the step of calculating the first bit error rate of the flexible interconnection circuit board at the actual operating frequency according to the interconnection transmission parameters, it further includes:
在所述第一误码率大于10-12时，重新设计所述柔性互连电路板对应的柔性互连电路设计文件。When the first bit error rate is greater than 10 −12 , redesign the FPC design file corresponding to the FPC.
优选地，所述对所述柔性互连电路板进行结构仿真，计算得到所述柔性互连电路板所能承受的最大形变的步骤，包括：Preferably, the step of performing structural simulation on the flexible interconnection circuit board and calculating the maximum deformation that the flexible interconnection circuit board can withstand includes:
设置所述柔性互连电路板的材料属性；setting material properties of the flexible interconnection circuit board;
划分有限元网格；Divide the finite element mesh;
根据所述柔性互连电路板的实际工况施加边界条件和载荷；applying boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
根据所述材料属性、所述有限元网格、所述边界条件和所述载荷，计算得到所述最大形变。The maximum deformation is calculated based on the material properties, the finite element mesh, the boundary conditions and the load.
优选地，所述基于所述第二误码率，分析所述柔性互连电路板的信号传输质量的步骤，包括：Preferably, the step of analyzing the signal transmission quality of the flexible interconnect circuit board based on the second bit error rate includes:
在所述第二误码率小于等于10-12时，确定所述柔性互连电路板在最大形变的条件下信号传输无误码；When the second bit error rate is less than or equal to 10-12 , it is determined that the flexible interconnection circuit board has no bit error in signal transmission under the condition of maximum deformation;
在所述第二误码率大于10-12时，确定所述柔性互连电路板在最大形变的状态下无法保证所传输的电信号质量。When the second bit error rate is greater than 10 −12 , it is determined that the flexible interconnection circuit board cannot guarantee the quality of the transmitted electrical signal in a state of maximum deformation.
为了解决上述技术问题，本发明实施例提供了一种针对柔性互连可靠性的多物理场分析装置，包括：In order to solve the above technical problems, an embodiment of the present invention provides a multi-physics analysis device for the reliability of flexible interconnection, including:
电路设计文件导入模块，用于将柔性互连电路设计文件导入电磁仿真软件；The circuit design file import module is used to import the flexible interconnection circuit design file into the electromagnetic simulation software;
三维电磁模型建立模块，用于基于所述柔性互连电路设计文件，在所述电磁仿真软件中建立柔性互连电路板对应的三维电磁模型；A three-dimensional electromagnetic model building module, configured to establish a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file;
互连传输参数提取模块，用于基于所述三维电磁模型，提取所述柔性互连电路板对应的互连传输参数；An interconnection transmission parameter extraction module, configured to extract interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
第一误码率计算模块，用于根据所述互连传输参数，计算所述柔性互连电路板在实际工作频率下的第一误码率；The first bit error rate calculation module is used to calculate the first bit error rate of the flexible interconnection circuit board at the actual working frequency according to the interconnection transmission parameters;
最大形变计算模块，用于在所述第一误码率小于等于10-12时，对所述柔性互连电路板进行结构仿真，计算得到所述柔性互连电路板所能承受的最大形变；A maximum deformation calculation module, configured to perform structural simulation on the flexible interconnection circuit board when the first bit error rate is less than or equal to 10 −12 , and calculate the maximum deformation that the flexible interconnection circuit board can withstand;
最大形变模型确定模块，用于基于所述最大形变，确定所述柔性电路板的最大形变模型；a maximum deformation model determination module, configured to determine a maximum deformation model of the flexible circuit board based on the maximum deformation;
第二误码率计算模块，用于根据所述最大形变模型，计算所述柔性互连电路板在实际工作频率下的第二误码率；A second bit error rate calculation module, configured to calculate a second bit error rate of the flexible interconnection circuit board at an actual operating frequency according to the maximum deformation model;
信号传输质量分析模块，用于基于所述第二误码率，分析所述柔性互连电路板的信号传输质量。A signal transmission quality analysis module, configured to analyze the signal transmission quality of the flexible interconnection circuit board based on the second bit error rate.
优选地，所述三维电磁模型建立模块包括：Preferably, the three-dimensional electromagnetic model building module includes:
材料叠层参数设置子模块，用于根据所述柔性互连电路设计文件，设置所述柔性互连电路板的材料参数和叠层参数，材料参数包含传输导线材料参数和介质参数；The material stacking parameter setting submodule is used to set the material parameters and stacking parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, and the material parameters include transmission wire material parameters and medium parameters;
趋肤深度计算子模块，用于计算所述柔性互连电路板在高频下的趋肤深度；The skin depth calculation submodule is used to calculate the skin depth of the flexible interconnection circuit board under high frequency;
最大长度计算子模块，用于计算并设置电磁场有限元网格划分时网格的最大长度；The maximum length calculation sub-module is used to calculate and set the maximum length of the grid when the electromagnetic field finite element grid is divided;
电磁散射参数计算子模块，用于计算提取所述柔性互连电路板的电磁散射参数；The electromagnetic scattering parameter calculation submodule is used to calculate and extract the electromagnetic scattering parameters of the flexible interconnection circuit board;
形变扭曲状态确定子模块，用于确定所述柔性互连电路板是否存在形变和扭曲状态；Deformation and twisting state determination submodule, used to determine whether there is deformation and twisting state of the flexible interconnection circuit board;
三维电磁模型搭建子模块，用于在所述柔性互连电路板不存在形变和扭曲状态时，根据所述传输导线材料参数、所述介质参数、所述叠层参数、所述趋肤深度、所述最大长度和所述电磁散射参数，搭建所述三维电磁模型。The three-dimensional electromagnetic model builds a sub-module, which is used to build a sub-module according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, The maximum length and the electromagnetic scattering parameters are used to construct the three-dimensional electromagnetic model.
优选地，所述第一误码率计算模块包括：Preferably, the first bit error rate calculation module includes:
眼图抖动浴盆计算子模块，用于根据所述三维电磁模型和所述互连传输参数，计算高速信号在所述实际工作频率下的传输眼图、抖动参数和浴盆曲线；The eye diagram jitter bathtub calculation submodule is used to calculate the transmission eye diagram, jitter parameters and bathtub curve of the high-speed signal at the actual operating frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameters;
第一误码率计算子模块，用于根据所述传输眼图、所述抖动参数和所述浴盆曲线，计算得到所述第一误码率。The first bit error rate calculation sub-module is configured to calculate the first bit error rate according to the transmission eye diagram, the jitter parameter and the bathtub curve.
优选地，还包括：Preferably, it also includes:
电路设计文件重新设计模块，用于在所述第一误码率大于10-12时，重新设计所述柔性互连电路板对应的柔性互连电路设计文件。The circuit design file redesign module is used to redesign the flexible interconnection circuit design file corresponding to the flexible interconnection circuit board when the first bit error rate is greater than 10 −12 .
优选地，所述最大形变计算模块包括：Preferably, the maximum deformation calculation module includes:
材料属性设置子模块，用于设置所述柔性互连电路板的材料属性；The material property setting submodule is used to set the material property of the flexible interconnection circuit board;
有限元网格划分子模块，用于划分有限元网格；The finite element meshing sub-module is used to divide the finite element mesh;
边界条件载荷施加子模块，用于根据所述柔性互连电路板的实际工况施加边界条件和载荷；The boundary condition load applying submodule is used to apply boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
最大形变计算子模块，用于根据所述材料属性、所述有限元网格、所述边界条件和所述载荷，计算得到所述最大形变。The maximum deformation calculation sub-module is used to calculate and obtain the maximum deformation according to the material properties, the finite element grid, the boundary conditions and the load.
优选地，所述信号传输质量分析模块包括：Preferably, the signal transmission quality analysis module includes:
传输无误码确定子模块，用于在所述第二误码率小于等于10-12时，确定所述柔性互连电路板在最大形变的条件下信号传输无误码；The transmission error-free determination submodule is used to determine that the flexible interconnection circuit board has no error in signal transmission under the condition of maximum deformation when the second bit error rate is less than or equal to 10 −12 ;
电信号质量确定子模块，用于在所述第二误码率大于10-12时，确定所述柔性互连电路板在最大形变的状态下无法保证所传输的电信号质量。The electrical signal quality determination submodule is configured to determine that the quality of the transmitted electrical signal cannot be guaranteed when the flexible interconnection circuit board is in a state of maximum deformation when the second bit error rate is greater than 10 −12 .
本发明与现有技术相比的优点在于：The advantage of the present invention compared with prior art is:
(1)本发明在柔性互连电路板电性能分析方法中采用了基于趋肤效应对超薄电路板表面网格的划分方法，充分考虑了高速传输带来的趋肤效应；(1) In the method for analyzing the electrical properties of the flexible interconnection circuit board, the present invention adopts a method for dividing the surface grid of the ultra-thin circuit board based on the skin effect, fully considering the skin effect caused by high-speed transmission;
(2)本发明通过结构仿真分析计算柔性互连电路板的最大形变，并提取最大形变模型；(2) The present invention calculates the maximum deformation of the flexible interconnection circuit board through structural simulation analysis, and extracts the maximum deformation model;
(3)采用多物理场分析的方法将结构分析和电磁场分析相结合，对柔性电路的可靠性进行充分评估。(3) The reliability of the flexible circuit is fully evaluated by combining the structural analysis and the electromagnetic field analysis with the method of multi-physics analysis.
附图说明Description of drawings
图1为本发明实施例提供的一种针对柔性互连可靠性的多物理场分析方法的步骤流程图；FIG. 1 is a flow chart of the steps of a multi-physics field analysis method for flexible interconnection reliability provided by an embodiment of the present invention;
图2为本发明实施例提供的一种针对柔性互连可靠性的多物理场分析装置的结构示意图。Fig. 2 is a schematic structural diagram of a multi-physics analysis device for flexible interconnection reliability provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明的实施例中的附图，对本发明的实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的实施例一部分实施例，而不是全部的实施例。基于本发明的实施例中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明的实施例保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Example. Based on the embodiments in the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the embodiments of the present invention.
实施例一Embodiment one
参照图1，示出了本发明实施例提供的一种针对柔性互连可靠性的多物理场分析方法的步骤流程图，如图1所示，该针对柔性互连可靠性的多物理场分析方法具体可以包括如下步骤：Referring to FIG. 1 , it shows a flow chart of the steps of a multi-physics analysis method for the reliability of flexible interconnections provided by an embodiment of the present invention. As shown in FIG. 1 , the multi-physics analysis method for the reliability of flexible interconnections The method may specifically include the following steps:
步骤101：将柔性互连电路设计文件导入电磁仿真软件。Step 101: Import the FIC design file into electromagnetic simulation software.
在本发明实施例中，柔性互连电路设计文件的格式可以为*.brd格式或*.ANF格式。In the embodiment of the present invention, the format of the flexible interconnection circuit design file may be *.brd format or *.ANF format.
首先，可以将柔性互连电路设计文件导入电磁仿真软件，进而，执行步骤102。First, the design file of the flexible interconnection circuit may be imported into electromagnetic simulation software, and then step 102 is performed.
步骤102：基于所述柔性互连电路设计文件，在所述电磁仿真软件中建立柔性互连电路板对应的三维电磁模型。Step 102: Based on the flexible interconnection circuit design file, establish a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software.
步骤103：基于所述三维电磁模型，提取所述柔性互连电路板对应的互连传输参数。Step 103: Based on the three-dimensional electromagnetic model, extract interconnection transmission parameters corresponding to the flexible interconnection circuit board.
步骤104：根据所述互连传输参数，计算所述柔性互连电路板在实际工作频率下的第一误码率。Step 104: Calculate a first bit error rate of the flexible interconnection circuit board at an actual operating frequency according to the interconnection transmission parameters.
在柔性电路板无形变和扭曲的状态下进行三维电磁建模，提取传输参数，并进行频域和时域的分析，分析高速信号的传输眼图和抖动参数，具体步骤如下：Carry out three-dimensional electromagnetic modeling without deformation and distortion of the flexible circuit board, extract transmission parameters, and perform frequency domain and time domain analysis to analyze the transmission eye diagram and jitter parameters of high-speed signals. The specific steps are as follows:
a)设置柔性PCB(Printed Circuit Board，印制电路板)的材料参数和叠层参数，材料参数包含传输导线材料参数和介质参数；a) Set the material parameters and stacking parameters of the flexible PCB (Printed Circuit Board, printed circuit board), the material parameters include transmission wire material parameters and medium parameters;
b)计算高频下的柔性电路的趋肤深度，计算并设置有限元网格划分时网格的最大长度；b) Calculate the skin depth of the flexible circuit at high frequency, and calculate and set the maximum length of the grid when dividing the finite element grid;
趋肤深度δ计算公式为：The calculation formula of skin depth δ is:
上述公式(1)中，δ为金属趋肤深度，f为传输频率，u为金属磁导率，σ为金属电导率。In the above formula (1), δ is the skin depth of the metal, f is the transmission frequency, u is the magnetic permeability of the metal, and σ is the electrical conductivity of the metal.
得到金属的趋肤深度之后，进一步对柔性电路板中传输线表面进行基于趋肤深度的有限元网格设置，为精确计算高速超薄导体的电磁参数，导体表面网格划分需足够精细，网格长度不得大于趋肤深度。After the skin depth of the metal is obtained, the surface of the transmission line in the flexible circuit board is further set up based on the finite element mesh of the skin depth. In order to accurately calculate the electromagnetic parameters of the high-speed ultra-thin conductor, the mesh division of the conductor surface must be fine enough, and The length must not be greater than the skin depth.
c)频域仿真：计算提取柔性互连的电磁散射参数(仿真频率范围为直流到截止频率)；c) Frequency domain simulation: calculate and extract the electromagnetic scattering parameters of the flexible interconnection (the simulation frequency range is from DC to cut-off frequency);
截止频率的计算公式为：The formula for calculating the cutoff frequency is:
F＝0.35/TR (2)F=0.35/TR (2)
上述公式(2)中，F为截止频率，TR为实际工作信号的上升时间。In the above formula (2), F is the cut-off frequency, and TR is the rise time of the actual working signal.
d)时域仿真：搭建分析电路模型，激励源为方波信号，其频率为实际工作信号的频率，计算在该频率下高速信号的眼图、抖动和浴盆曲线，并计算该频率下的误码率。d) Time domain simulation: build an analysis circuit model, the excitation source is a square wave signal, and its frequency is the frequency of the actual working signal, calculate the eye diagram, jitter and bathtub curve of the high-speed signal at this frequency, and calculate the error at this frequency code rate.
步骤105：在所述第一误码率小于等于10-12时，对所述柔性互连电路板进行结构仿真，计算得到所述柔性互连电路板所能承受的最大形变。Step 105: When the first bit error rate is less than or equal to 10 −12 , perform structural simulation on the flexible interconnection circuit board, and calculate the maximum deformation that the flexible interconnection circuit board can withstand.
对计算所得的误码率进行判断，如果小于等于10-12，则进行下一步分析，如果大于10-12则证明该互连线在无形变的状态下就无法保证所传输的电信号质量，则需返回第一步修改设计。Judge the calculated bit error rate, if it is less than or equal to 10 -12 , proceed to the next step of analysis, if it is greater than 10 -12 , it proves that the interconnection line cannot guarantee the quality of the transmitted electrical signal without deformation. You need to return to the first step to modify the design.
对柔性电路板设计文件(*.brd)进行结构仿真(仿真软件为ANSYS Mechanical或PATRAN)，计算柔性电路板能够承受的最大形变，步骤如下：Perform structural simulation on the flexible circuit board design file (*.brd) (the simulation software is ANSYS Mechanical or PATRAN), and calculate the maximum deformation that the flexible circuit board can withstand. The steps are as follows:
a)设置材料属性，对于柔性印制电路板结构，导入互连线特性参数；a) Set the material properties, and for the flexible printed circuit board structure, import the characteristic parameters of the interconnection line;
b)划分有限元网格；b) dividing the finite element grid;
c)有限元网格细化处理；c) Finite element mesh refinement processing;
d)施加边界条件和载荷；d) apply boundary conditions and loads;
e)分析计算，结果后处理：输出模态、应力、形变；e) Analysis and calculation, post-processing of results: output mode, stress, deformation;
f)输出模型文件。f) Output the model file.
在第一误码率小于等于10-12时，对柔性互连电路板进行结构仿真，计算得到柔性互连电路板所能承受的最大形变之后，执行步骤106。When the first bit error rate is less than or equal to 10 −12 , perform structural simulation on the flexible interconnection circuit board, calculate and obtain the maximum deformation that the flexible interconnection circuit board can withstand, and then perform step 106 .
步骤106：基于所述最大形变，确定所述柔性电路板的最大形变模型；Step 106: Based on the maximum deformation, determine the maximum deformation model of the flexible circuit board;
步骤107：根据所述最大形变模型，计算所述柔性互连电路板在实际工作频率下的第二误码率。Step 107: According to the maximum deformation model, calculate a second bit error rate of the flexible interconnection circuit board at an actual operating frequency.
根据结构分析的结果得到柔性互连的最大形变模型，即最差工况模型，对此模型进行再一次电学分析，分析步骤如步骤104，提取该形变状态下互连线的传输参数，并进行频域和时域的分析，计算在实际工作频率下高速信号的眼图、抖动和浴盆曲线，并计算该频率下的误码率，即第二误码率。According to the results of the structural analysis, the maximum deformation model of the flexible interconnection is obtained, that is, the worst working condition model, and the electrical analysis is performed on this model again, and the analysis steps are as in step 104, and the transmission parameters of the interconnection line under the deformation state are extracted, and carried out Analysis in the frequency domain and time domain, calculate the eye diagram, jitter and bathtub curve of the high-speed signal at the actual working frequency, and calculate the bit error rate at this frequency, that is, the second bit error rate.
步骤108：基于所述第二误码率，分析所述柔性互连电路板的信号传输质量。Step 108: Analyze the signal transmission quality of the flexible interconnection circuit board based on the second bit error rate.
对第二误码率进行判断，如果小于等于10-12，则证明该柔性PCB在最大形变条件下信号传输无误码，设计完成；如果大于10-12则证明该互连线在最大形变的状态下就无法保证所传输的电信号质量，则需返回第一步修改设计。Judging the second bit error rate, if it is less than or equal to 10 -12 , it proves that the flexible PCB has no error in signal transmission under the condition of maximum deformation, and the design is completed; if it is greater than 10 -12 , it proves that the interconnection line is in the state of maximum deformation If the quality of the transmitted electrical signal cannot be guaranteed, it is necessary to return to the first step to modify the design.
本发明实施例提供的针对柔性互连可靠性的多物理场分析方法，具有如下有益效果：The multi-physics field analysis method for the reliability of flexible interconnection provided by the embodiment of the present invention has the following beneficial effects:
(1)本发明在柔性互连电路板电性能分析方法中采用了基于趋肤效应对超薄电路板表面网格的划分方法，充分考虑了高速传输带来的趋肤效应；(1) In the method for analyzing the electrical properties of the flexible interconnection circuit board, the present invention adopts a method for dividing the surface grid of the ultra-thin circuit board based on the skin effect, fully considering the skin effect caused by high-speed transmission;
(2)本发明通过结构仿真分析计算柔性电路板的最大形变，并提取最大形变模型；(2) The present invention calculates the maximum deformation of the flexible circuit board through structural simulation analysis, and extracts the maximum deformation model;
(3)采用多物理场分析的方法将结构分析和电磁场分析相结合，对柔性电路的可靠性进行充分评估。(3) The reliability of the flexible circuit is fully evaluated by combining the structural analysis and the electromagnetic field analysis with the method of multi-physics analysis.
实施例二Embodiment two
参照图2，示出了本发明实施例提供的一种针对柔性互连可靠性的多物理场分析装置的结构示意图，如图2所示，该针对柔性互连可靠性的多物理场分析装置具体可以包括如下模块：Referring to FIG. 2 , it shows a schematic structural diagram of a multi-physics analysis device for flexible interconnect reliability provided by an embodiment of the present invention. As shown in FIG. 2 , the multi-physics analysis device for flexible interconnect reliability Specifically, the following modules can be included:
电路设计文件导入模块201，用于将柔性互连电路设计文件导入电磁仿真软件；The circuit design file import module 201 is used to import the flexible interconnection circuit design file into the electromagnetic simulation software;
三维电磁模型建立模块202，用于基于所述柔性互连电路设计文件，在所述电磁仿真软件中建立柔性互连电路板对应的三维电磁模型；A three-dimensional electromagnetic model building module 202, configured to establish a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file;
互连传输参数提取模块203，用于基于所述三维电磁模型，提取所述柔性互连电路板对应的互连传输参数；An interconnection transmission parameter extraction module 203, configured to extract interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
第一误码率计算模块204，用于根据所述互连传输参数，计算所述柔性互连电路板在实际工作频率下的第一误码率；The first bit error rate calculation module 204 is configured to calculate the first bit error rate of the flexible interconnection circuit board at the actual operating frequency according to the interconnection transmission parameters;
最大形变计算模块205，用于在所述第一误码率小于等于10-12时，对所述柔性互连电路板进行结构仿真，计算得到所述柔性互连电路板所能承受的最大形变；A maximum deformation calculation module 205, configured to perform structural simulation on the flexible interconnection circuit board when the first bit error rate is less than or equal to 10 −12 , and calculate the maximum deformation that the flexible interconnection circuit board can bear ;
最大形变模型确定模块206，用于基于所述最大形变，确定所述柔性互连电路板的最大形变模型；A maximum deformation model determination module 206, configured to determine a maximum deformation model of the flexible interconnection circuit board based on the maximum deformation;
第二误码率计算模块207，用于根据所述最大形变模型，计算所述柔性互连电路板在实际工作频率下的第二误码率；The second bit error rate calculation module 207 is configured to calculate a second bit error rate of the flexible interconnection circuit board at an actual operating frequency according to the maximum deformation model;
信号传输质量分析模块208，用于基于所述第二误码率，分析所述柔性互连电路板的信号传输质量。The signal transmission quality analysis module 208 is configured to analyze the signal transmission quality of the flexible interconnection circuit board based on the second bit error rate.
优选地，所述三维电磁模型建立模块202包括：Preferably, the three-dimensional electromagnetic model building module 202 includes:
材料叠层参数设置子模块，用于根据所述柔性互连电路设计文件，设置所述柔性互连电路板的材料参数和叠层参数，材料参数包含传输导线材料参数和介质参数；The material stacking parameter setting submodule is used to set the material parameters and stacking parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, and the material parameters include transmission wire material parameters and medium parameters;
趋肤深度计算子模块，用于计算所述柔性互连电路电路板在高频下的趋肤深度；The skin depth calculation submodule is used to calculate the skin depth of the flexible interconnection circuit board under high frequency;
最大长度计算子模块，用于计算并设置电磁场有限元网格划分时网格的最大长度；The maximum length calculation sub-module is used to calculate and set the maximum length of the grid when the electromagnetic field finite element grid is divided;
电磁散射参数计算子模块，用于计算提取所述柔性互连电路板的电磁散射参数；The electromagnetic scattering parameter calculation submodule is used to calculate and extract the electromagnetic scattering parameters of the flexible interconnection circuit board;
形变扭曲状态确定子模块，用于确定所述柔性互连电路板是否存在形变和扭曲状态；Deformation and twisting state determination submodule, used to determine whether there is deformation and twisting state of the flexible interconnection circuit board;
三维电磁模型搭建子模块，用于在所述柔性互连电路板不存在形变和扭曲状态时，根据所述传输导线材料参数、所述介质参数、所述叠层参数、所述趋肤深度、所述最大长度和所述电磁散射参数，搭建所述三维电磁模型。The three-dimensional electromagnetic model builds a sub-module, which is used for when the flexible interconnection circuit board does not have a deformation and twisted state, according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, The maximum length and the electromagnetic scattering parameters are used to construct the three-dimensional electromagnetic model.
优选地，所述第一误码率计算模块204包括：Preferably, the first bit error rate calculation module 204 includes:
眼图抖动浴盆计算子模块，用于根据所述三维电磁模型和所述互连传输参数，计算高速信号在所述实际工作频率下的传输眼图、抖动参数和浴盆曲线；The eye diagram jitter bathtub calculation submodule is used to calculate the transmission eye diagram, jitter parameters and bathtub curve of the high-speed signal at the actual operating frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameters;
第一误码率计算子模块，用于根据所述传输眼图、所述抖动参数和所述浴盆曲线，计算得到所述第一误码率。The first bit error rate calculation sub-module is configured to calculate the first bit error rate according to the transmission eye diagram, the jitter parameter and the bathtub curve.
优选地，还包括：Preferably, it also includes:
电路设计文件重新设计模块，用于在所述第一误码率大于10-12时，重新设计所述柔性互连电路板对应的柔性互连电路设计文件。The circuit design file redesign module is used to redesign the flexible interconnection circuit design file corresponding to the flexible interconnection circuit board when the first bit error rate is greater than 10 −12 .
优选地，所述最大形变计算模块205包括：Preferably, the maximum deformation calculation module 205 includes:
材料属性设置子模块，用于设置所述柔性互连电路板的材料属性；The material property setting submodule is used to set the material property of the flexible interconnection circuit board;
有限元网格划分子模块，用于划分有限元网格；The finite element meshing sub-module is used to divide the finite element mesh;
边界条件载荷施加子模块，用于根据所述柔性互连电路板的实际工况施加边界条件和载荷；The boundary condition load applying submodule is used to apply boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
最大形变计算子模块，用于根据所述材料属性、所述有限元网格、所述边界条件和所述载荷，计算得到所述最大形变。The maximum deformation calculation sub-module is used to calculate and obtain the maximum deformation according to the material properties, the finite element grid, the boundary conditions and the load.
优选地，所述信号传输质量分析模块208包括：Preferably, the signal transmission quality analysis module 208 includes:
传输无误码确定子模块，用于在所述第二误码率小于等于10-12时，确定所述柔性互连电路板在最大形变的条件下信号传输无误码；The transmission error-free determination submodule is used to determine that the flexible interconnection circuit board has no error in signal transmission under the condition of maximum deformation when the second bit error rate is less than or equal to 10 −12 ;
电信号质量确定子模块，用于在所述第二误码率大于10-12时，确定所述柔性互连电路板在最大形变的状态下无法保证所传输的电信号质量。The electrical signal quality determination submodule is configured to determine that the quality of the transmitted electrical signal cannot be guaranteed when the flexible interconnection circuit board is in a state of maximum deformation when the second bit error rate is greater than 10 −12 .
以上所述仅为本发明的实施例的较佳实施例而已，并不用以限制本发明的实施例，凡在本发明的实施例的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的实施例的保护范围之内。The above descriptions are only preferred embodiments of the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the embodiments of the present invention, etc. , should be included within the scope of protection of the embodiments of the present invention.
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