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CN111129719A - Electronic device - Google Patents

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Publication number
CN111129719A
CN111129719A CN202010048128.0A CN202010048128A CN111129719A CN 111129719 A CN111129719 A CN 111129719A CN 202010048128 A CN202010048128 A CN 202010048128A CN 111129719 A CN111129719 A CN 111129719A
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CN
China
Prior art keywords
antenna
electronic device
millimeter
wave module
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010048128.0A
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Chinese (zh)
Inventor
雍征东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN202010048128.0A priority Critical patent/CN111129719A/en
Publication of CN111129719A publication Critical patent/CN111129719A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/24Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Support Of Aerials (AREA)

Abstract

The application relates to an electronic device, which comprises a body, a first millimeter wave module and a second millimeter wave module; the body is provided with a first surface, a second surface and a side peripheral surface for connecting the first surface and the second surface, wherein the first surface and the second surface are arranged oppositely in the thickness direction of the electronic equipment; the first millimeter wave module is adjacent to the lateral periphery and comprises a first antenna radiation array, the first antenna radiation array is used for emitting a beam pointing to one side of the first surface, and the direction of the beam radiated by the first antenna radiation array is parallel to the thickness direction of the electronic equipment; the second millimeter wave module is adjacent to the lateral periphery and spaced from the first millimeter wave module, the second millimeter wave module comprises a second antenna radiation array, the second antenna radiation array is used for emitting beams pointing to the lateral periphery, and the direction of the beams radiated by the second antenna radiation array is perpendicular to the thickness direction of the electronic equipment. This application can reduce the quantity that sets up of millimeter wave module.

Description

Electronic device
Technical Field
The present application relates to the field of wireless communication technologies, and in particular, to an electronic device.
Background
The millimeter wave has the characteristics of high carrier frequency and large bandwidth, and is a main means for realizing 5G ultrahigh data transmission rate. The millimeter wave module is usually installed inside electronic equipment such as cell-phone, panel computer, and in order to realize the high gain and the wide coverage of millimeter wave signal, the quantity of millimeter wave module sets up to four and more usually, and the more millimeter wave module of quantity occupies the inside more space of electronic equipment, is unfavorable for realizing the frivolousness of electronic equipment.
Disclosure of Invention
The embodiment of the application provides an electronic device for solving the problems that a plurality of millimeter wave modules occupy more installation space inside the electronic device and are not beneficial to realizing the lightness and thinness of the electronic device.
The application provides an electronic device, including:
the electronic device comprises a body, a first circuit board and a second circuit board, wherein the body is provided with a first surface, a second surface and a side peripheral surface for connecting the first surface and the second surface, and the first surface and the second surface are arranged oppositely in the thickness direction of the electronic device;
the first millimeter wave module is close to the side peripheral surface and comprises a first antenna radiation array, the first antenna radiation array is used for emitting a beam pointing to one side of the first surface, and the direction of the beam radiated by the first antenna radiation array is parallel to the thickness direction of the electronic equipment;
the second millimeter wave module is adjacent to the lateral surface and spaced from the first millimeter wave module, and the second millimeter wave module comprises a second antenna radiation array, the second antenna radiation array is used for emitting a beam pointing to the lateral surface, and the direction of the beam radiated by the second antenna radiation array is perpendicular to the thickness direction of the electronic device.
The utility model provides an electronic equipment, under the prerequisite that the side global of neighbouring body set up first millimeter wave module and second millimeter wave module, because the direction of the wave beam that first antenna radiation array radiated is parallel with electronic equipment's thickness direction, the direction perpendicular to electronic equipment's of the wave beam that second antenna radiation array radiated thickness direction, so can realize millimeter wave signal's high gain and wide cover under the cooperation of first millimeter wave module and second millimeter wave module, especially to the crooked curved screen of wide-angle, also can cover the side region. And can also release electronic equipment inner space under the prerequisite that millimeter wave module quantity reduces.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a rear view (with rear cover hidden) of the electronic device of FIG. 1;
FIG. 3 is a schematic sectional view taken along the sectional line II-II in FIG. 2;
fig. 4 is a schematic structural diagram of a first millimeter wave module according to an embodiment of fig. 3;
FIG. 5 is a schematic structural diagram of a second millimeter wave module along the Z-axis direction in FIG. 2;
FIG. 6 is a partial schematic view of the electronic device along the Z-axis of FIG. 2;
FIG. 7 is a CDF graph illustrating the gain of the antenna system of the present application in the 28GHz operating band;
FIG. 8 is a CDF graph illustrating the gain of the antenna system of the present application in the 39GHz operating band;
fig. 9 is a block diagram of a partial structure of a mobile phone related to an electronic device according to an embodiment.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1 and 2, the electronic device 10 will be described with reference to a smartphone as an example. Those skilled in the art will readily understand that the electronic device 10 of the present application may be any device having communication and storage functions, such as a smart terminal, for example, a smart phone, a tablet computer, a notebook computer, a mobile phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, etc., and the representation form of the smart terminal is not limited herein. Of course, wearable devices such as smartwatches are also applicable to the electronic device 10 according to the embodiments of the present application.
The electronic device 10 includes a body 100, a first millimeter-wave module 200, and a second millimeter-wave module 300.
The body 100 includes a first surface 110, a second surface 120, and a side circumferential surface 130 connecting the first surface 110 and the second surface 120, the first surface 110 and the second surface 120 are disposed opposite to each other in a thickness direction of the electronic device 10, and the thickness direction of the electronic device 10 may be understood as a Y-axis extending direction illustrated in fig. 1 and 2. Wherein, the reverse arrangement can be understood as follows: for example, in the thickness direction of the electronic apparatus 10 (the Y-axis direction in fig. 1 and 2), assuming that a reference plane parallel to the XZ plane is defined at a point position in the middle of the side circumferential surface 130, it is possible to have all points on the first surface 110 on one side of the reference plane and all points on the second surface 120 on the other opposite side of the reference plane.
In one embodiment, the side surface 130 includes a first side 131, a second side 132, a third side 133 and a fourth side 134 connected in sequence, the first side 131 is disposed opposite to the third side 133, and the second side 132 is disposed opposite to the fourth side 134. The first side 131, the second side 1312, the third side 133 and the fourth side 134 are sequentially enclosed to form a closed rectangular frame. In one embodiment, the length of first side 131 has a value greater than the length of second side 132, and second side 132 is located at the top of electronic device 10. The connection between the first side 131 and the second side 132 and the fourth side 134, and the connection between the third side 133 and the second side 132 and the fourth side 134 may be rounded. It is understood that in other embodiments, the connection between the first side 131 and the second side 132 and the fourth side 134, and the connection between the third side 133 and the second side 132 and the fourth side 134 may also be a right angle transition.
In an embodiment, the body 100 includes a middle frame 101, a rear cover 102 and a display screen 103, the rear cover 102 and the display screen 103 are connected to two opposite sides of the middle frame 101 and enclose an accommodation space, and the accommodation space may be used to mount devices such as the first millimeter wave module 200, the second millimeter wave module 300, the motherboard 400 of the electronic device 10, and the power supply 790. In this case, the first surface 110 is formed on a side of the rear cover 102 facing away from the display screen 103, the second surface 120 is formed on a side of the display screen 103 facing away from the rear cover 102, and if the main body 100 further includes a cover glass covering the display screen 103, a side of the cover glass facing away from the display screen 103 (the displayable region is used for displaying image information) constitutes all or part of the second surface 120.
Referring to fig. 2, the first millimeter wave module 200 and the second millimeter wave module 300 are both disposed 130 adjacent to the side circumferential surface and spaced apart from the middle frame 101 and the rear cover 102. In one embodiment, the first millimeter-wave module 200 is disposed adjacent to the first side 131, and the second millimeter-wave module 300 is disposed adjacent to the second side 132. Electronic device 10 is capable of transmitting and receiving millimeter-wave signals under the cooperative action of first millimeter-wave module 200 and second millimeter-wave module 300, thereby enabling electronic device 10 to achieve high gain and wide coverage of millimeter-wave signals.
It should be noted that millimeter waves refer to electromagnetic waves with a wavelength on the order of millimeters, and the frequency is about 20GHz to 300 GHz. The 3GPP has specified a list of frequency bands supported by 5G NR, the 5G NR spectrum range can reach 100GHz, and two frequency ranges are specified: frequency range 1(FR1), i.e. the sub-6 GHz band, and Frequency range 2(FR2), i.e. the millimeter wave band. Frequency range of Frequency range 1: 450MHz-6.0GHz, with a maximum channel bandwidth of 100 MHz. The Frequency range of the Frequency range 2 is 24.25GHz-52.6GHz, and the maximum channel bandwidth is 400 MHz. The near 11GHz spectrum for 5G mobile broadband comprises: 3.85GHz licensed spectrum, for example: 28GHz (24.25-29.5GHz), 37GHz (37.0-38.6GHz), 39GHz (38.6-40GHz) and 14GHz unlicensed spectrum (57-71 GHz). The working frequency bands of the 5G communication system comprise three frequency bands of 28GHz, 39GHz and 60 GHz.
Referring to fig. 3 and 4, the first mm-wave module 200 includes a first antenna array 210, the first antenna array 210 is used for emitting a beam pointing to a side of the first surface 110, and a direction of the beam radiated by the first antenna array 210 is parallel to a thickness direction (i.e., a Y-axis direction shown in fig. 3) of the electronic device 10. In an embodiment, the first millimeter wave module 200 includes a first antenna substrate 220, the first antenna substrate 220 has a first radiation surface 201, the first radiation surface 201 faces the first surface 110, the first radiation surface 201 is perpendicular to the thickness direction of the electronic device 10, and the first antenna array 210 is disposed on the first radiation surface 201. The first antenna array 210 may be a patch antenna, the first antenna array 210 includes a plurality of first millimeter wave units 211 arranged in an array along an extending direction of the first side surface 131 (i.e., a Z-axis direction shown in fig. 1 and 2), the first millimeter wave units 211 may be radiating patches, and the first antenna array 210 is electrically connected to the motherboard 400, for example, the first antenna array 210 may be electrically connected to the motherboard 400 through a feed line and a flexible circuit board or a spring plate, so as to receive and transmit millimeter wave signals. In an embodiment, the first millimeter wave module 200 is disposed at the edge of the motherboard 400, and the first antenna substrate 220 may be directly attached to the motherboard 400 or may be mounted on a bracket for supporting the motherboard 400. The first antenna radiating array 210 may be other forms of antenna in addition to patch antenna.
Referring to fig. 2 and 5, the second millimeter wave module 300 includes a second antenna radiation array 310, the second antenna radiation array 310 is configured to emit a beam directed to the lateral surface 130, and a direction of the beam radiated by the second antenna radiation array 310 is perpendicular to a thickness direction of the electronic device 10. In an embodiment, the second millimeter-wave module 300 has a second radiation surface 301, the second radiation surface 301 faces the lateral surface 130, and the second radiation surface 301 is parallel to the thickness direction of the electronic device 10, i.e. the second radiation surface 301 is perpendicular to the first surface 110. The second antenna radiation array 310 is disposed on the second radiation surface 301, and the second antenna radiation array 310 may be a patch antenna. The second antenna radiating array 310 may include a plurality of second millimeter-wave units 311 (shown in fig. 5) arranged in an array along the extending direction of the second side 132 (i.e., the X-axis direction shown in fig. 2), and the second millimeter-wave units may be radiating patches. The second antenna radiation array 310 is electrically connected to the main board 400, for example, the second antenna radiation array can be connected to the main board 400 through a flexible circuit board or a spring plate via a feeding trace, so as to receive and transmit millimeter wave signals.
In an embodiment, the second millimeter wave module 300 further includes a second antenna substrate 320, the second radiating surface 301 is formed on the second antenna substrate 320, the second antenna substrate 320 may be directly attached to the motherboard 400, or the second antenna radiating array 310 is disposed on the second antenna substrate 320 and electrically connected to the motherboard through a flexible circuit board or a spring. In addition, the second antenna substrate 320 may be mounted on a bracket for supporting the main board 400.
In an embodiment, referring to fig. 2, the second side 132 has an antenna window 1321, that is, the middle frame 101 has an antenna window 1321, and the second millimeter wave module 300 is aligned with the antenna window 1321, that is, the second antenna substrate 320 is exposed to the antenna window 1321, so that the beam radiated by the second antenna radiation array 310 can pass through the antenna window 1321, and the second antenna radiation array 310 can transmit and receive millimeter wave signals through the middle frame 101 through the antenna window 1321. The antenna window 1321 may be a through hole opened on the middle frame 101, or may be a filler filled in the through hole and capable of providing a specific frequency beam emitted by the second millimeter wave module 300. In one embodiment, the length direction (the X-axis direction shown in fig. 2 and 5) of the second antenna substrate 320 and the length direction (the X-axis direction shown in fig. 2 and 6) of the antenna window 1321 are both parallel to the extending direction of the second side 132, and the width direction (the Y-axis direction shown in fig. 2 and 5) of the second antenna substrate 320 and the width direction (the Y-axis direction shown in fig. 2 and 6) of the antenna window 1321 are both parallel to the thickness direction of the electronic device 10. Referring to FIGS. 6 and 7, if the length of the antenna window 1321 is L1, the width of the antenna window 1321 is W1, the length of the second antenna substrate 320 is L2, and the width of the second antenna substrate 320 is W2, L1 is greater than or equal to L2, and W1 is greater than or equal to 0.9W 2. In addition, referring to fig. 2, the second radiating surface 301 is parallel to the second side surface 132, and the distance S between the second radiating surface 301 and the second side surface 132 is set herein, so that S is less than or equal to 3.72 mm. By such an arrangement, the shielding of the middle frame 101 on the radiation signal of the second millimeter wave module 300 can be avoided, and wide coverage and high gain can be realized. Illustratively, for a millimeter wave antenna module with an operating frequency of 24-40GHz, L is 25mm, W is 4mm, and S is 3.72 mm.
In an embodiment, referring to fig. 3, the first Surface 110 is provided with a wave-transmitting layer 111, the wave-transmitting layer 111 has a Frequency Selective Surface (FSS) 111a, and the Frequency Selective Surface 111a is used for enabling the first Surface 110 to transmit millimeter waves with a Frequency of 24.25GHz-52.6 GHz. It should be noted that the frequency selective surface structure 111a is a periodic array structure formed by a large number of passive resonant structure units arranged according to a certain rule, and has a function of selectively transmitting or reflecting incident waves of a specific frequency. The efficient wave-transparent characteristic exhibited by frequency-selective surface structure 131 enables rear cover 102 to transmit millimeter waves in the 5G band, thereby significantly reducing the influence on the radiation performance of the millimeter-wave modules (including first millimeter-wave module 200 and second millimeter-wave module 300). In addition, the number of the wave-transparent layers 111 may be one or more, when one wave-transparent layer 111 is disposed on the first surface 110, the back cover 102 has a smaller thickness, and when multiple wave-transparent layers 111 are disposed on the first surface 110, the wave-transparent effect of the back cover 102 is advantageously enhanced. In addition, the setting of this application wave-transparent layer 111 can promote the gain threshold value of millimeter wave module.
Referring to fig. 7 and 8, fig. 7 illustrates a CDF gain curve of the antenna system of the present application in a 28GHz working band, fig. 8 is a CDF gain curve of the antenna system of the present application in a 39GHz working band, wherein "first placement mode" indicates that the beam directions of the first millimeter wave module 200 and the second millimeter wave module 300 are both parallel to the thickness direction of the electronic device 10; the second placement mode is to arrange a wave-transmitting layer 111 on the first surface 110 on the basis of the first placement mode; the third placement mode is that the beam direction of the first millimeter wave module 200 is parallel to the thickness direction of the electronic device 10, and the beam direction of the second millimeter wave module 300 is perpendicular to the thickness direction of the electronic device 10; the fourth placement mode is to arrange the wave-transmitting layer 111 on the first surface 110 based on the third placement mode. As can be seen from fig. 7 and 8, the form of "putting mode three" adopted in the present application can satisfy the 3GPP performance index, and on this basis, the gain threshold value of the millimeter wave module can be improved by setting the wave-transparent layer 111, so that the user experience is enhanced. Through simulation, under the setting of 'putting mode four', the 28GHz working frequency band can correspondingly improve the 0.9dBi gain threshold, the 39GHz working frequency band can correspondingly improve the 0.6dBi gain threshold, and the 39GHz working frequency band can improve the 0.9dBi gain threshold at 50% gain CDF (beam spherical space coverage), which is beneficial to realizing wider space coverage.
Fig. 9 is a block diagram of a partial structure of a mobile phone related to the electronic device 10 provided in the embodiment of the present invention. The mobile phone 700 includes: millimeter-wave module 710 (including first millimeter-wave module 200 and second millimeter-wave module 300), memory 720, input unit 730, display unit 740, sensor 750, audio circuit 760, wireless fidelity (WIFI) module 770, processor 780, and power source 790. Those skilled in the art will appreciate that the handset configuration shown in fig. 9 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
The millimeter wave module 710 may be configured to receive and transmit information or receive and transmit signals during a call, and may receive downlink information of a base station and then process the downlink information to the processor 780; the uplink data may also be transmitted to the base station. The memory 720 may be used to store software programs and modules, and the processor 780 may execute various functional applications and data processing of the mobile phone 700 by operating the software programs and modules stored in the memory 720. The memory 720 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function (such as an application program for a sound playing function, an application program for an image playing function, and the like), and the like; the data storage area may store data (such as audio data, an address book, etc.) created according to the use of the cellular phone 700, and the like. Further, the memory 720 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The input unit 730 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the cellular phone 700. In one embodiment, the input unit 730 may include a touch panel 731 and other input devices 732. The touch panel 731, which may also be referred to as a touch screen, can collect touch operations of a user (e.g., operations of the user on or near the touch panel 731 by using a finger, a stylus, or any other suitable object or accessory) thereon or nearby, and drive the corresponding connection device according to a preset program. In one embodiment, the touch panel 731 can include two portions, a touch measurement device and a touch controller. The touch measuring device measures the touch direction of a user, measures signals brought by touch operation and transmits the signals to the touch controller; the touch controller receives touch information from the touch measurement device, converts it to touch point coordinates, and sends it to the processor 780, where it can receive commands from the processor 780 and execute them. In addition, the touch panel 731 may be implemented by various types, such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. The input unit 730 may include other input devices 732 in addition to the touch panel 731. In one embodiment, other input devices 732 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), and the like.
The display unit 740 may be used to display information input by the user or information provided to the user and various menus of the mobile phone. The display unit 740 may include a display panel 741. In one embodiment, the Display panel 741 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. In one embodiment, the touch panel 731 can overlay the display panel 741, and when the touch panel 731 measures a touch operation on or near the touch panel 731, the touch operation is transmitted to the processor 780 to determine the type of the touch event, and then the processor 780 provides a corresponding visual output on the display panel 741 according to the type of the touch event. Although the touch panel 731 and the display panel 741 are two independent components in fig. 9 to implement the input and output functions of the mobile phone, in some embodiments, the touch panel 731 and the display panel 741 may be integrated to implement the input and output functions of the mobile phone.
The cell phone 700 may also include at least one sensor 750, such as light sensors, motion sensors, and other sensors. In one embodiment, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel 741 according to the brightness of ambient light, and a proximity sensor that turns off the display panel 741 and/or a backlight when the mobile phone is moved to the ear. The motion sensor can comprise an acceleration sensor, the acceleration sensor can measure the magnitude of acceleration in each direction, the magnitude and the direction of gravity can be measured when the mobile phone is static, and the motion sensor can be used for identifying the application of the gesture of the mobile phone (such as horizontal and vertical screen switching), vibration identification related functions (such as pedometer and knocking) and the like. The mobile phone may be provided with other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor.
Audio circuitry 760, speaker 761, and microphone 762 may provide an audio interface between a user and a cell phone. The audio circuit 760 can transmit the electrical signal converted from the received audio data to the speaker 761, and the electrical signal is converted into a sound signal by the speaker 761 and output; on the other hand, the microphone 762 converts the collected sound signal into an electrical signal, converts the electrical signal into audio data after being received by the audio circuit 760, and then outputs the audio data to the processor 780 for processing, and then the processed audio data may be sent to another mobile phone through the millimeter wave module 710, or the audio data may be output to the memory 720 for subsequent processing.
The processor 780 is a control center of the mobile phone, connects various parts of the entire mobile phone by using various interfaces and lines, and performs various functions of the mobile phone and processes data by operating or executing software programs and/or modules stored in the memory 720 and calling data stored in the memory 720, thereby integrally monitoring the mobile phone. In one embodiment, processor 780 may include one or more processing units. In one embodiment, processor 780 may integrate an application processor and a modem processor, where the application processor primarily handles operating systems, user interfaces, applications, and the like; the modem processor handles primarily wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 780.
The handset 700 also includes a power supply 790 (e.g., a battery) for powering the various components, which may preferably be logically coupled to the processor 780 via a power management system that may be used to manage charging, discharging, and power consumption.
In one embodiment, the cell phone 700 may also include a camera, a bluetooth module, and the like.
The electronic device 10 of the present application, on the premise that the first millimeter wave module 200 and the second millimeter wave module 300 are disposed on the side peripheral surface 130 adjacent to the body 100, because the direction of the beam radiated by the first antenna radiation array 210 is parallel to the thickness direction of the electronic device 10, and the direction of the beam radiated by the second antenna radiation array 310 is perpendicular to the thickness direction of the electronic device 10, the high gain and the wide coverage of the millimeter wave signal can be realized under the cooperation of the first millimeter wave module 200 and the second millimeter wave module 300, and particularly, the side edge region can be covered on a curved screen bent at a large angle. And can also release electronic equipment 10 inner space under the prerequisite that millimeter wave module quantity reduces, be favorable to realizing electronic equipment 10 frivolousization development.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1.一种电子设备,其特征在于,包括:1. an electronic device, is characterized in that, comprises: 本体,具有第一表面、第二表面、以及连接所述第一表面和所述第二表面的侧周面,所述第一表面和所述第二表面在所述电子设备的厚度方向相背设置;a body having a first surface, a second surface, and a side peripheral surface connecting the first surface and the second surface, the first surface and the second surface being opposite to each other in the thickness direction of the electronic device set up; 第一毫米波模组,邻近所述侧周面,所述第一毫米波模组包括第一天线辐射阵列,所述第一天线辐射阵列用于发射指向所述第一表面所在一侧的波束,且所述第一天线辐射阵列所辐射波束的方向与所述电子设备的厚度方向平行;A first millimeter-wave module, adjacent to the side peripheral surface, the first millimeter-wave module includes a first antenna radiation array, and the first antenna radiation array is used for emitting a beam directed to the side where the first surface is located , and the direction of the beam radiated by the first antenna radiation array is parallel to the thickness direction of the electronic device; 第二毫米波模组,邻近所述侧周面并与所述第一毫米波模组间隔,所述第二毫米波模组包括第二天线辐射阵列,所述第二天线辐射阵列用于发射指向所述侧周面的波束,且所述第二天线辐射阵列所辐射波束的方向垂直于所述电子设备的厚度方向。The second millimeter-wave module is adjacent to the side peripheral surface and spaced apart from the first millimeter-wave module, the second millimeter-wave module includes a second antenna radiation array, and the second antenna radiation array is used for transmitting The beam is directed to the side peripheral surface, and the direction of the beam radiated by the second antenna radiation array is perpendicular to the thickness direction of the electronic device. 2.根据权利要求1所述的电子设备,其特征在于,所述第一毫米波模组包括第一天线基板,所述第一天线基板具有第一辐射面,所述第一辐射面朝向所述第一表面所在一侧,且所述第一辐射面与所述电子设备的厚度方向垂直,所述第一天线辐射阵列设置于所述第一辐射面。2 . The electronic device according to claim 1 , wherein the first millimeter-wave module comprises a first antenna substrate, the first antenna substrate has a first radiation surface, and the first radiation surface faces the The side where the first surface is located, and the first radiation surface is perpendicular to the thickness direction of the electronic device, and the first antenna radiation array is disposed on the first radiation surface. 3.根据权利要求2所述的电子设备,其特征在于,所述第二毫米波模组包括第二天线基板,所述第二天线基板具有第二辐射面,所述第二辐射面朝向所述侧周面,且所述第二辐射面平行于所述电子设备的厚度方向,所述第二天线辐射阵列设置于所述第二辐射面。3 . The electronic device according to claim 2 , wherein the second millimeter-wave module comprises a second antenna substrate, the second antenna substrate has a second radiation surface, and the second radiation surface faces the The side peripheral surface, the second radiation surface is parallel to the thickness direction of the electronic device, and the second antenna radiation array is disposed on the second radiation surface. 4.根据权利要求3所述的电子设备,其特征在于,所述侧周面包括顺次连接的第一侧面、第二侧面、第三侧面和第四侧面,所述第一侧面与所述第三侧面相对设置,所述第二侧面与所述第四侧面相对设置,所述第一毫米波模组邻近所述第一侧面设置,所述第二毫米波模组邻近所述第二侧面设置。4 . The electronic device according to claim 3 , wherein the side peripheral surface comprises a first side surface, a second side surface, a third side surface and a fourth side surface connected in sequence, and the first side surface is connected to the The third side is arranged oppositely, the second side is arranged opposite to the fourth side, the first millimeter-wave module is arranged adjacent to the first side, and the second millimeter-wave module is arranged adjacent to the second side set up. 5.根据权利要求4所述的电子设备,其特征在于,所述第一天线辐射阵列包括沿第一侧面的延伸方向呈阵列设置的多个第一毫米波单元,所述第二天线辐射阵列包括沿第二侧面的延伸方向呈阵列设置的多个第二毫米波单元。5 . The electronic device according to claim 4 , wherein the first antenna radiation array comprises a plurality of first millimeter wave units arranged in an array along the extending direction of the first side surface, and the second antenna radiation array It includes a plurality of second millimeter wave units arranged in an array along the extending direction of the second side surface. 6.根据权利要求5所述的电子设备,其特征在于,所述第一毫米波单元和所述第二毫米波单元皆为辐射贴片。6 . The electronic device according to claim 5 , wherein the first millimeter-wave unit and the second millimeter-wave unit are both radiation patches. 7 . 7.根据权利要求4所述的电子设备,其特征在于,所述第二侧面开设有天线窗口,所述第二天线基板外露于所述天线窗口,以使所述第二天线辐射阵列所辐射的波束能够穿过所述天线窗口。7 . The electronic device according to claim 4 , wherein an antenna window is opened on the second side surface, and the second antenna substrate is exposed from the antenna window, so that the second antenna radiation array can radiate radiation. 8 . The beam can pass through the antenna window. 8.根据权利要求7所述的电子设备,其特征在于,所述第二天线基板的长度方向和所述天线窗口的长度方向皆与所述第二侧面的延伸方向平行,所述第二天线基板的宽度方向和所述天线窗口的宽度方向皆与所述电子设备的厚度方向平行,所述天线窗口的长度值L1≥所述第二天线基板的长度值L2,所述天线窗口的宽度值W1≥0.9倍的所述第二天线基板的宽度值W2。8 . The electronic device according to claim 7 , wherein the length direction of the second antenna substrate and the length direction of the antenna window are both parallel to the extension direction of the second side surface, and the second antenna The width direction of the substrate and the width direction of the antenna window are both parallel to the thickness direction of the electronic device, the length value L1 of the antenna window ≥ the length value L2 of the second antenna substrate, and the width value of the antenna window W1 ≥ 0.9 times the width value W2 of the second antenna substrate. 9.根据权利要求1所述的电子设备,其特征在于,所述第一表面设置有透波层,所述透波层具有频率选择表面结构,所述频率选择表面结构用于使所述第一表面透过频率为24.25GHz-52.6GHz的毫米波。9 . The electronic device according to claim 1 , wherein the first surface is provided with a wave-transmitting layer, the wave-transmitting layer has a frequency selective surface structure, and the frequency selective surface structure is used to make the first surface A surface transmits millimeter waves with frequencies ranging from 24.25GHz to 52.6GHz. 10.根据权利要求1所述的电子设备,其特征在于,所述本体包括中框、后盖和显示屏,所述后盖和所述显示屏连接于所述中框相背的两侧并形成收容所述第一毫米波模组和所述第二毫米波模组的收容空间,所述第一表面形成于所述后盖,所述第二表面形成于所述显示屏,所述侧周面形成于所述中框。10. The electronic device according to claim 1, wherein the body comprises a middle frame, a back cover and a display screen, and the back cover and the display screen are connected to opposite sides of the middle frame and are connected to each other. An accommodation space for accommodating the first millimeter-wave module and the second millimeter-wave module is formed, the first surface is formed on the back cover, the second surface is formed on the display screen, the side A peripheral surface is formed on the middle frame.
CN202010048128.0A 2020-01-16 2020-01-16 Electronic device Pending CN111129719A (en)

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Application publication date: 20200508