CN111117505A - Conductive copper foil adhesive tape and preparation method thereof - Google Patents
Conductive copper foil adhesive tape and preparation method thereof Download PDFInfo
- Publication number
- CN111117505A CN111117505A CN201911249300.2A CN201911249300A CN111117505A CN 111117505 A CN111117505 A CN 111117505A CN 201911249300 A CN201911249300 A CN 201911249300A CN 111117505 A CN111117505 A CN 111117505A
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- China
- Prior art keywords
- conductive
- copper foil
- agent
- glue
- dispersion liquid
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention provides a conductive copper foil tape and a preparation method thereof, which comprises the following steps from top to bottom: copper foil, conductive glue and PET release base paper; the conductive glue comprises the following raw materials: acrylate polymer, organic solvent, polypyrrole, conductive dispersion liquid, thickening agent, dispersing agent, defoaming agent, heat stabilizer and light stabilizer; the components of the conductive dispersion liquid include: modified capacitance carbon, titanium dioxide, magnesium oxide and a dispersant; the polymerization monomers of the acrylate polymer are butyl acrylate and 2-ethylhexyl acrylate, and the polymerization degree is 2000-5000; the preparation method of the modified capacitance carbon comprises the following steps: the disordered mesoporous carbon of 2000 meshes is obtained by uniformly mixing in a dimethyl carbonate solution of lithium hexafluorophosphate and evaporating the dimethyl carbonate solvent.
Description
Technical Field
The invention belongs to the field of conductive thin film materials, and particularly relates to a conductive copper foil tape and a preparation method thereof.
Background
With the development of the electronic industry towards refinement, welding cannot meet high-precision connection, interference of good performance and effective electromagnetic ray shielding on grounding electrostatic discharge cannot be achieved, and conductive copper-aluminum foil adhesive tapes are required for electromagnetic shielding and grounding electrostatic discharge of many electronic devices.
Disclosure of Invention
The invention provides a conductive copper foil tape with impact resistance and high shielding property and a preparation method thereof, wherein a polypyrrole solution, a metal oxide and a modified capacitance carbon dispersion liquid are added to ensure that insulating glue has a conductive effect; the electromagnetic shielding connecting device can be widely used for electromagnetic shielding connection and high-precision electronic conducting part connection; the adhesive tape is used for sealing seams of an EMI shielding room, a shell and electronic equipment, winding a cable for shielding, providing a reliable grounding surface, providing electric contact for surfaces which cannot be welded, combining the conductive shielding performance of a conductive copper foil and the soft and comfortable characteristic of the adhesive tape, and further having the characteristics of lightness, thinness, durability and the like. The shielding material still has good shielding effect under the environment of dynamic friction and easy corrosion.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
a conductive copper foil tape comprising, from top to bottom: copper foil, conductive glue and PET release base paper; the conductive glue comprises the following raw materials: acrylate polymer, organic solvent, polypyrrole, conductive dispersion liquid, thickening agent, dispersing agent, defoaming agent, heat stabilizer and light stabilizer; the components of the conductive dispersion liquid include: modified capacitance carbon, titanium dioxide, magnesium oxide and a dispersant; the polymerization monomers of the acrylate polymer are butyl acrylate and 2-ethylhexyl acrylate, and the polymerization degree is 2000-5000; the preparation method of the modified capacitance carbon comprises the following steps: the disordered mesoporous carbon of 2000 meshes is obtained by uniformly mixing in a dimethyl carbonate solution of lithium hexafluorophosphate and evaporating the dimethyl carbonate solvent.
Further, the raw materials of the conductive glue comprise acrylate polymer: organic solvent: polypyrrole: conductive dispersion liquid: thickening agent: dispersing agent: defoaming agent: thermal stabilizer: light stabilizer 40-50: 15-20: 14-29: 0.3-1.2:0.05-0.3:0.02-0.4:0.06-0.09:0.1-0.3: 0.2-0.6.
Further, the modified capacitive carbon in the conductive dispersion: titanium dioxide: magnesium oxide: dispersant 0.3-0.6: 1-3: 3-6:10-20.
Further, the organic solvent is one or two of anhydrous toluene and anhydrous ethyl acetate.
Further, in the preparation method of the modified capacitance carbon: 10 parts by weight of disordered mesoporous carbon was uniformly mixed in 100 parts by weight of a 100g/L dimethyl carbonate solution of lithium hexafluorophosphate, and the dimethyl carbonate solvent was evaporated to obtain.
Further, the titanium dioxide and the magnesium oxide are nano-scale fine powder.
A preparation method of a conductive copper foil tape comprises the following steps:
(1) taking commercially available polypyrrole, acrylate polymer, titanium dioxide, magnesium oxide, thickening agent, dispersing agent, defoaming agent, heat stabilizer, organic solvent and light stabilizer, and isocyanate curing agent;
(2) according to the modified capacitance carbon: titanium dioxide: magnesium oxide: dispersant 0.3-0.6: 1-3: preparing a conductive dispersion liquid according to the proportion of 3-6:10-20, uniformly stirring, and standing at normal temperature;
(3) according to the weight ratio of the acrylate polymer: organic solvent: polypyrrole: conductive dispersion liquid: thickening agent: dispersing agent: defoaming agent: thermal stabilizer: light stabilizer 40-50: 15-20:14-29: 0.3-1.2:0.05-0.3:0.02-0.4:0.06-0.09:0.1-0.3:0.2-0.6, preparing the conductive glue and stirring uniformly;
(4) according to the conductive glue: the curing agent is prepared according to the proportion of 100: 0.5-2.5;
(5) and (3) uniformly coating the glue prepared in the step (4) on the PET release base paper by using the PET release base paper in a scraper coating mode, and pressing and transferring the glue to the copper foil through a pressing wheel, so that the conductive copper foil material can be obtained.
The invention has the beneficial effects that:
products of the invention
The conductive glue synergistically promotes the improvement of the conductive performance by adding a polypyrrole solution, a metal oxide and modified capacitance carbon, wherein the metal oxide is titanium dioxide and magnesium oxide nanopowder, and the modified capacitance carbon is particularly added. The modified capacitance carbon takes superfine disordered mesoporous carbon as a main body, and fully adsorbs lithium hexafluorophosphate in dimethyl carbonate solution of lithium hexafluorophosphate, so that modification is realized, the effect of obviously improving the electrical conductivity is achieved, and meanwhile, the viscosity of the adhesive tape cannot be obviously reduced. The acrylate polymer is also selected to match the additives to achieve the best results of the invention. The conductive adhesive of the invention has good adhesion to the copper foil, so that the copper foil has excellent bonding property with other objects and excellent conductivity.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Any modifications that can be easily made by a person skilled in the art to the present invention without departing from the technical solutions of the present invention will fall within the scope of the claims of the present invention.
Example 1
A conductive copper foil tape comprising, from top to bottom: copper foil, conductive glue and PET release base paper; the conductive glue comprises the following raw materials: acrylate polymer, organic solvent, polypyrrole, conductive dispersion liquid, thickening agent, dispersing agent, defoaming agent, heat stabilizer and light stabilizer; the components of the conductive dispersion liquid include: modified capacitance carbon, titanium dioxide, magnesium oxide and a dispersant; the polymerization monomers of the acrylate polymer are butyl acrylate and 2-ethylhexyl acrylate, and the polymerization degree is 2000-5000; the preparation method of the modified capacitance carbon comprises the following steps: the disordered mesoporous carbon of 2000 meshes is obtained by uniformly mixing in a dimethyl carbonate solution of lithium hexafluorophosphate and evaporating the dimethyl carbonate solvent. The organic solvent is anhydrous toluene.
The preparation method of the modified capacitance carbon comprises the following steps: 10 parts by weight of disordered mesoporous carbon was uniformly mixed in 100 parts by weight of a 100g/L dimethyl carbonate solution of lithium hexafluorophosphate, and the dimethyl carbonate solvent was evaporated to obtain. The titanium dioxide and the magnesium oxide are in a nanometer level.
A preparation method of a conductive copper foil tape comprises the following steps:
(1) taking commercially available polypyrrole, acrylate polymer, titanium dioxide, magnesium oxide, thickening agent, dispersing agent, defoaming agent, heat stabilizer, organic solvent and light stabilizer, and isocyanate curing agent;
(2) according to the modified capacitance carbon: titanium dioxide: magnesium oxide: dispersant 0.45: 2: preparing a conductive dispersion liquid according to the proportion of 4.5:15, uniformly stirring, and standing at normal temperature;
(3) according to the weight ratio of the acrylate polymer: organic solvent: polypyrrole: conductive dispersion liquid: thickening agent: dispersing agent: defoaming agent: thermal stabilizer: light stabilizer 45: 17.5:21.5: 0.8:0.15:0.2:0.08:0.2:0.4:0.075 conductive glue is prepared and stirred uniformly;
(4) according to the conductive glue: the curing agent is prepared in a ratio of 100: 1;
(5) and (3) uniformly coating the glue prepared in the step (4) on the PET release base paper by using the PET release base paper in a scraper coating mode, and pressing and transferring the glue to the copper foil through a pressing wheel, so that the conductive copper foil material can be obtained.
Comparative example 1
Same as example 1, except that modified capacitance carbon, titanium dioxide, magnesium oxide were not added.
Comparative example 2
Same as example 1 except that modified capacitance carbon was not added.
Comparative example 3
Same as example 1 except that no titanium dioxide, magnesium oxide, was added.
Comparative example 4
Same as example 1 except that the modified capacitive carbon was not modified.
Comparative example 5
Same as example 1, except that no polypyrrole was added.
Comparative example 6
Same as example 1 except that the acrylate polymer was replaced with a commercially available polyacrylic acid glue.
TABLE 1
The conductive glue synergistically promotes the improvement of the conductive performance by adding the solution of polypyrrole, the metal oxide and the modified capacitance carbon, wherein the metal oxide is the nano powder of titanium dioxide and magnesium oxide, and the modified capacitance carbon is particularly added. The modified capacitance carbon takes superfine disordered mesoporous carbon as a main body, and fully adsorbs lithium hexafluorophosphate in dimethyl carbonate solution of lithium hexafluorophosphate, so that modification is realized, the effect of obviously improving the electrical conductivity is achieved, and meanwhile, the viscosity of the adhesive tape cannot be obviously reduced. The acrylate polymer is also selected to match the additives to achieve the best results of the invention. The conductive adhesive of the invention has good adhesion to the copper foil, so that the copper foil has excellent bonding property with other objects and excellent conductivity.
Claims (7)
1. A conductive copper foil tape, characterized in that: from top to bottom: copper foil, conductive glue and PET release base paper; the conductive glue comprises the following raw materials: acrylate polymer, organic solvent, polypyrrole, conductive dispersion liquid, thickening agent, dispersing agent, defoaming agent, heat stabilizer and light stabilizer; the components of the conductive dispersion liquid include: modified capacitance carbon, titanium dioxide, magnesium oxide and a dispersant; the polymerization monomers of the acrylate polymer are butyl acrylate and 2-ethylhexyl acrylate, and the polymerization degree is 2000-5000; the preparation method of the modified capacitance carbon comprises the following steps: the disordered mesoporous carbon of 2000 meshes is obtained by uniformly mixing in a dimethyl carbonate solution of lithium hexafluorophosphate and evaporating the dimethyl carbonate solvent.
2. The conductive copper foil tape according to claim 1, wherein: the raw materials of the conductive glue comprise acrylate polymer: organic solvent: polypyrrole: conductive dispersion liquid: thickening agent: dispersing agent: defoaming agent: thermal stabilizer: light stabilizer 40-50: 15-20: 14-29: 0.3-1.2:0.05-0.3:0.02-0.4:0.06-0.09:0.1-0.3: 0.2-0.6.
3. The conductive copper foil tape of claim 1, wherein the modified capacitive carbon in the conductive dispersion is: titanium dioxide: magnesium oxide: dispersant 0.3-0.6: 1-3: 3-6:10-20.
4. The conductive copper foil tape according to claim 1, wherein: the organic solvent is one or two of anhydrous toluene and anhydrous ethyl acetate.
5. The conductive copper foil tape according to claim 1, wherein: the preparation method of the modified capacitance carbon comprises the following steps: 10 parts by weight of disordered mesoporous carbon was uniformly mixed in 100 parts by weight of a 100g/L dimethyl carbonate solution of lithium hexafluorophosphate, and the dimethyl carbonate solvent was evaporated to obtain.
6. The conductive copper foil tape according to claim 1, wherein: the titanium dioxide and the magnesium oxide are nano-scale fine powder.
7. The preparation method of the conductive copper foil adhesive tape is characterized by comprising the following steps:
(1) taking commercially available polypyrrole, acrylate polymer, titanium dioxide, magnesium oxide, thickening agent, dispersing agent, defoaming agent, heat stabilizer, organic solvent and light stabilizer, and isocyanate curing agent;
(2) according to the modified capacitance carbon: titanium dioxide: magnesium oxide: dispersant 0.3-0.6: 1-3: preparing a conductive dispersion liquid according to the proportion of 3-6:10-20, uniformly stirring, and standing at normal temperature;
(3) according to the weight ratio of the acrylate polymer: organic solvent: polypyrrole: conductive dispersion liquid: thickening agent: dispersing agent: defoaming agent: thermal stabilizer: light stabilizer 40-50: 15-20:14-29: 0.3-1.2:0.05-0.3:0.02-0.4:0.06-0.09:0.1-0.3:0.2-0.6, preparing the conductive glue and stirring uniformly;
(4) according to the conductive glue: the curing agent is prepared according to the proportion of 100: 0.5-2.5;
(5) and (3) uniformly coating the glue prepared in the step (4) on PET release base paper by using the PET release base paper in a scraper coating mode, and pressing and transferring the glue to copper foil through a pressing wheel, so that the conductive copper foil adhesive tape material can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911249300.2A CN111117505A (en) | 2019-12-09 | 2019-12-09 | Conductive copper foil adhesive tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911249300.2A CN111117505A (en) | 2019-12-09 | 2019-12-09 | Conductive copper foil adhesive tape and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111117505A true CN111117505A (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911249300.2A Pending CN111117505A (en) | 2019-12-09 | 2019-12-09 | Conductive copper foil adhesive tape and preparation method thereof |
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| Country | Link |
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| CN (1) | CN111117505A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682217A (en) * | 2020-07-08 | 2020-09-18 | 重庆金美新材料科技有限公司 | Conductive adhesive solution and battery pole piece |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101473006A (en) * | 2006-07-04 | 2009-07-01 | 3M创新有限公司 | Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same |
| CN107189721A (en) * | 2017-05-26 | 2017-09-22 | 江苏斯瑞达新材料科技有限公司 | A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape |
| CN108864965A (en) * | 2018-08-01 | 2018-11-23 | 太仓斯迪克新材料科技有限公司 | A kind of conductive tape and preparation method thereof |
| CN108949074A (en) * | 2018-06-05 | 2018-12-07 | 深圳市辰玉科技有限公司 | A kind of lithium ion battery separator coating binder and preparation method |
-
2019
- 2019-12-09 CN CN201911249300.2A patent/CN111117505A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101473006A (en) * | 2006-07-04 | 2009-07-01 | 3M创新有限公司 | Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same |
| CN107189721A (en) * | 2017-05-26 | 2017-09-22 | 江苏斯瑞达新材料科技有限公司 | A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape |
| CN108949074A (en) * | 2018-06-05 | 2018-12-07 | 深圳市辰玉科技有限公司 | A kind of lithium ion battery separator coating binder and preparation method |
| CN108864965A (en) * | 2018-08-01 | 2018-11-23 | 太仓斯迪克新材料科技有限公司 | A kind of conductive tape and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 胡林: "《有序介孔材料与电化学传感器》", 31 December 2013, 合肥工业大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682217A (en) * | 2020-07-08 | 2020-09-18 | 重庆金美新材料科技有限公司 | Conductive adhesive solution and battery pole piece |
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Application publication date: 20200508 |