CN111059466A - Nitrogen gas supply device, plasma cleaning system and nitrogen gas supply method - Google Patents
Nitrogen gas supply device, plasma cleaning system and nitrogen gas supply method Download PDFInfo
- Publication number
- CN111059466A CN111059466A CN201911206902.XA CN201911206902A CN111059466A CN 111059466 A CN111059466 A CN 111059466A CN 201911206902 A CN201911206902 A CN 201911206902A CN 111059466 A CN111059466 A CN 111059466A
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- nitrogen gas
- gas supply
- control valve
- plasma cleaning
- cleaning machine
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title claims abstract description 202
- 229910001873 dinitrogen Inorganic materials 0.000 title claims abstract description 132
- 238000004140 cleaning Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 35
- 238000001514 detection method Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D1/00—Pipe-line systems
- F17D1/02—Pipe-line systems for gases or vapours
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D3/00—Arrangements for supervising or controlling working operations
- F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Plasma Technology (AREA)
Abstract
The invention belongs to the technical field of plasma cleaning equipment, and particularly relates to a nitrogen gas supply device, a plasma cleaning system comprising the nitrogen gas supply device and a nitrogen gas supply method for supplying nitrogen gas according to the nitrogen gas supply device. The nitrogen gas supply device comprises a first nitrogen gas supply unit and a second nitrogen gas supply unit, wherein the first nitrogen gas supply unit and the second nitrogen gas supply unit are respectively used for supplying nitrogen gas to a plasma cleaning machine, a first control valve is arranged on a first pipeline communicated with the first nitrogen gas supply unit and the plasma cleaning machine, a second control valve is arranged on a second pipeline communicated with the second nitrogen gas supply unit and the plasma cleaning machine, a pressure sensor is communicated with the first pipeline, and a relay is respectively and electrically connected with the pressure sensor, the first control valve and the second control valve. According to the nitrogen gas supply device, sufficient and stable nitrogen gas can be constantly input into the plasma cleaning machine, and the quality and the output of cleaned products are guaranteed.
Description
Technical Field
The invention belongs to the technical field of plasma cleaning equipment, and particularly relates to a nitrogen gas supply device, a plasma cleaning system comprising the nitrogen gas supply device and a nitrogen gas supply method for supplying nitrogen gas according to the nitrogen gas supply device.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
Plasma treatment (plasma cleaning) is a new surface treatment technology, and has been known in recent years with the application of various industries. The plasma cleaning technology removes organic pollutants on the surfaces of metal, ceramic and plastic, and can remarkably enhance the viscosity and welding strength of the surfaces.
The nitrogen is used as an important reaction gas for breaking the vacuum in the final stage of the plasma cleaning, and the insufficient supply of the nitrogen directly reduces the quality and the output of plasma cleaning products.
Disclosure of Invention
The invention aims to at least solve the problem of insufficient nitrogen supply in the working process of a plasma cleaning machine.
The invention provides a nitrogen gas supply device, which comprises:
a first nitrogen gas supply unit;
a second nitrogen gas supply unit, the first nitrogen gas supply unit and the second nitrogen gas supply unit being respectively used for supplying nitrogen gas to the plasma cleaning machine;
the first control valve is arranged on a first pipeline communicated with the plasma cleaning machine and used for controlling the on-off of the first pipeline;
the second control valve is arranged on a second pipeline communicated with the plasma cleaning machine and used for controlling the on-off of the second pipeline;
the pressure sensor is communicated with the first pipeline;
and the relay is electrically connected with the pressure sensor, the first control valve and the second control valve respectively.
According to the nitrogen supply device, the first nitrogen supply unit is arranged on the first pipeline, the second nitrogen supply unit is arranged on the second pipeline, the first control valve is arranged on the first pipeline, the second control valve is arranged on the second pipeline, the first control valve is in a normally open state, the second control valve is in a normally closed state, when the nitrogen supply of the first nitrogen supply unit is sufficient and stable, the first nitrogen supply unit supplies nitrogen to the plasma cleaning machine through the first pipeline all the time, when the pressure sensor detects that the nitrogen supply of the first nitrogen supply unit is insufficient or unstable, the relay is opened, the first control valve is controlled to be closed, the second control valve is controlled to be opened, the second nitrogen supply unit supplies nitrogen to the plasma cleaning single machine through the second pipeline, and after the supply air pressure of the first nitrogen supply unit is stable, the relay performs the first control valve and the second control valve The first nitrogen supply unit supplies nitrogen to the plasma cleaning machine through the first pipeline again, so that sufficient and stable nitrogen is constantly input into the plasma cleaning machine, and the quality and the output of the cleaned product are guaranteed.
In addition, the nitrogen gas supply device according to the present invention may have the following additional features:
in some embodiments of the present invention, the first line and the second line are in communication with the plasma cleaner through a common line.
In some embodiments of the present invention, the first line and the second line are in communication with the plasma cleaner, respectively.
In some embodiments of the invention, the pressure sensor is provided with a first limit value, and the relay opens and closes the first control valve and opens the second control valve when the air pressure in the first pipeline is lower than the first limit value.
In some embodiments of the invention, the nitrogen gas supply device further comprises an alarm unit electrically connected to the pressure sensor.
In some embodiments of the invention, the first control valve and the second control valve are both two-position two-way electromagnetic directional valves.
In some embodiments of the invention, the pressure sensor is a smart pressure sensor with pressure display and setting.
In some embodiments of the invention, the first nitrogen gas supply unit is a plant total nitrogen gas supply apparatus and the second nitrogen gas supply unit is a nitrogen gas cylinder.
Another aspect of the present invention also provides a plasma cleaning system, including:
a plasma cleaning machine;
the nitrogen gas supply device is communicated with the plasma cleaning machine and is used for supplying nitrogen gas to the plasma cleaning machine;
wherein the nitrogen gas supply device is the nitrogen gas supply device according to any one of claims 1 to 7.
Another aspect of the present invention also provides a nitrogen gas supply method for supplying nitrogen gas according to the nitrogen gas supply apparatus described above, including the steps of:
inputting nitrogen into the plasma cleaning machine through a first nitrogen supply unit;
detecting the air pressure in the first pipeline;
and controlling the first control valve to be continuously opened or closing the first control valve and opening the second control valve according to the detection result.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. Wherein:
FIG. 1 is a block diagram of a plasma cleaning system according to an embodiment of the present invention;
FIG. 2 is a block diagram of a plasma cleaning system according to another embodiment of the present invention.
The reference symbols in the drawings denote the following:
100: nitrogen gas supply device
11: first nitrogen gas supply unit, 12: first control valve, 13: first pipeline, 14: a pressure sensor;
21: second nitrogen gas supply unit, 22: second control valve, 23: a second pipeline;
30: a relay;
200: a plasma cleaning machine.
0
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 is a block diagram showing a plasma cleaning system according to an embodiment of the present invention. As shown in fig. 1, the plasma cleaning system in the present embodiment includes a nitrogen gas supply device 100 and a plasma cleaning machine 200. Among them, the nitrogen gas supply device 100 includes a first nitrogen gas supply unit 11, a second nitrogen gas supply unit 21, a first control valve 12, a second control valve 22, a pressure sensor 14, and a relay 30. The first nitrogen gas supply unit 11 and the second nitrogen gas supply unit 21 are respectively used for supplying nitrogen gas to the plasma cleaning machine 200, and the first control valve 12 is arranged on a first pipeline 13 communicated with the first nitrogen gas supply unit 10 and the plasma cleaning machine 200, is used for controlling the on-off of the first pipeline 13 and is in a normally open state. The second control valve 22 is disposed on a second pipeline 23 communicating the second nitrogen gas supply unit 21 and the plasma cleaning machine 200, and is used for controlling the on-off of the second pipeline 23 and is in a normally closed state. The pressure sensor 14 communicates with the first pipe 13, and the relay 30 is electrically connected to the pressure sensor 14, the first control valve 12, and the second control valve 22, respectively.
According to the nitrogen gas supply apparatus 100 and the plasma cleaning system in the present embodiment, by providing the first nitrogen gas supply unit 11 on the first pipe 13 and the second nitrogen gas supply unit 21 on the second pipe 23, respectively, and providing the first control valve 12 on the first pipe 13 and the second control valve 22 on the second pipe 23, respectively, the first control valve 12 is in the normally open state, and the second control valve 22 is in the normally closed state, and when the nitrogen gas amount supply of the first nitrogen gas supply unit 11 is sufficiently stabilized, the nitrogen gas supply is always performed to the plasma cleaning machine 200 through the first pipe 13 by the first nitrogen gas supply unit 11, and when the pressure sensor 14 detects that the nitrogen gas amount supply of the first nitrogen gas supply unit 11 is insufficient or unstable, the relay 30 is opened and the first control valve 12 is controlled to be closed, the second control valve 22 is opened, and the nitrogen gas supply is performed to the plasma cleaning machine 200 through the second pipe 23 by the second nitrogen gas supply unit 21, after the supply pressure of the first nitrogen gas supply unit 11 is stabilized, the relay 30 switches the first control valve 12 and the second control valve 22, so that nitrogen gas is supplied to the plasma cleaning machine 200 through the first nitrogen gas supply unit 11 via the first pipeline 13 again, thereby constantly maintaining a sufficient and stable amount of nitrogen gas to be input into the plasma cleaning machine 200 and ensuring the quality and yield of the cleaned product.
In some embodiments of the present invention, the first nitrogen gas supply unit 11 is a plant total nitrogen gas supply apparatus, and the second nitrogen gas supply unit 21 is a nitrogen gas cylinder. The total nitrogen supply equipment of the plant area provides nitrogen supply for each nitrogen-using equipment in the plant area in real time, wherein the nitrogen supply comprises the plasma cleaning machine 200. However, the total nitrogen supply equipment in the plant area sometimes has a state of insufficient or unstable nitrogen supply, which affects the quality and yield of the products cleaned by the plasma cleaning machine 200, and in order to ensure that the plasma cleaning machine 200 can include sufficient and stable nitrogen supply at any moment, a nitrogen cylinder is placed near the plasma cleaning machine 200, so that the sufficient and stable nitrogen supply is provided to the plasma cleaning machine 200 through the nitrogen cylinder in the state of insufficient or unstable nitrogen supply of the total nitrogen supply equipment in the plant area.
In some embodiments of the present invention, the first line 13 and the second line 23 are in communication with the plasma cleaner 200 through a common line. As shown in fig. 1, since the first nitrogen gas supply unit 11 is a main nitrogen gas supply unit of the plasma cleaning machine 200 and the first pipe 13 is constantly connected to the plasma cleaning machine 200, in order to shorten the length of the second pipe 23 and reduce the cost, the end of the second pipe 23 is communicated with the first pipe 13 disposed between the first control valve 12 and the plasma cleaning machine 200, so that the first pipe 13 and the second pipe 23 share one pipe.
In some embodiments of the present invention, the pressure sensor 14 is an intelligent pressure sensor with pressure display and setting functions, so that the set pressure of the pressure sensor 14 can be conveniently set and read, and thus the operation is convenient. In order to prevent the relay 30 from being repeatedly operated and affecting the life of the relay 30, the pressure set value of the pressure sensor 14 has a certain set range. When the pressure of the nitrogen gas in the first pipe 13 is within the pressure setting range, the relay 30 does not operate, and the operating states of the first control valve 12 and the second control valve 22 are not switched. When the pressure of the nitrogen gas in the first pipe 13 is higher than the maximum value in the pressure setting range, it means that the nitrogen gas in the first pipe 13 is sufficiently sufficient and the relay 30 does not work as well. When the pressure of the nitrogen gas in the first line 13 is lower than the minimum value in the pressure setting range, the relay 30 operates, and switches the operating states of the first control valve 12 and the second control valve 22. If the pressure point detected by the nitrogen gas is 4Mp, when the supplied gas fluctuates frequently, for example, around 4Mp, and the relay 30 will operate frequently, so that the service life of the relay 30 is shortened and the whole system is unstable, we can set the hysteresis to 0.3, that is, the relay does not operate when the nitrogen gas pressure in the first pipeline 13 is within 3.7Mp-4.3Mp, and the relay 30 will switch the operating state of the first control valve 12 and the second control valve 22 when the pressure in the first pipeline 13 detected by the pressure sensor 14 is lower than 3.7 Mp.
Since the first control valve 12 and the second control valve 22 are always kept closed and opened during operation, no nitrogen backflow occurs even though the first pipe 13 and the second pipe 23 are connected, thereby ensuring that the nitrogen gas supplied from the first nitrogen gas supply unit 11 and the second nitrogen gas supply unit 21 always flows in the direction of the plasma cleaning machine 200.
For the convenience of control, the first control valve 12 and the second control valve 22 are two-position two-way electromagnetic directional valves.
In some embodiments of the present invention, the nitrogen gas supply device 100 further comprises an alarm unit electrically connected to the pressure sensor 14. The alarm unit may be a buzzer, and when the pressure detected by the pressure sensor 14 is lower than the minimum value within the set range, the buzzer starts to alarm to prompt an operator to switch the nitrogen supply pipeline.
FIG. 2 is a block diagram of a plasma cleaning system according to another embodiment of the present invention. As shown in fig. 2, in some embodiments of the present invention, the first and second pipes 13 and 23 are respectively in communication with a plasma cleaner 200.
The first pipeline 13 and the second pipeline 23 are respectively communicated with the plasma cleaning machine 200, so that the response speed in the switching process of the nitrogen gas supply pipeline can be ensured, and the supply amount of the nitrogen gas can be ensured.
Another aspect of the present invention also proposes a nitrogen gas supply method of supplying nitrogen gas according to the nitrogen gas supply apparatus 100 in any one of the above embodiments, including the steps of:
nitrogen gas is input to the plasma cleaner 200 through the first nitrogen gas supply unit 11.
Detecting the air pressure in the first pipeline 13;
and controlling the first control valve 12 to be continuously opened or closing the first control valve 12 and opening the second control valve 22 according to the detection result.
According to the nitrogen gas supply method in the present embodiment, by providing the first nitrogen gas supply unit 11 and the second nitrogen gas supply unit 21 on the first piping 13 and the second piping 23, respectively, and providing the first control valve 12 on the first piping 13 and the second control valve 22 on the second piping 23, respectively, the first control valve 12 is in a normally open state, the second control valve 22 is in a normally closed state, when the nitrogen gas amount supply of the first nitrogen gas supply unit 11 is sufficiently stabilized, the nitrogen gas supply is always performed to the plasma cleaning machine 200 through the first piping 13 by the first nitrogen gas supply unit 11, when the pressure sensor 14 detects that the nitrogen gas amount supply of the first nitrogen gas supply unit 11 is insufficient or unstable, the relay 30 is opened, and the first control valve 12 is controlled to be closed, the second control valve 22 is opened, the nitrogen gas supply is performed to the plasma cleaning machine 200 through the second piping 23 by the second nitrogen gas supply unit 21, after the supply pressure of the first nitrogen gas supply unit 11 is stabilized, the relay 30 switches the first control valve 12 and the second control valve 22, so that nitrogen gas is supplied to the plasma cleaning machine 200 through the first nitrogen gas supply unit 11 via the first pipeline 13 again, thereby constantly maintaining a sufficient and stable amount of nitrogen gas to be input into the plasma cleaning machine 200 and ensuring the quality and yield of the cleaned product.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A nitrogen gas supply apparatus, characterized by comprising:
a first nitrogen gas supply unit;
a second nitrogen gas supply unit, the first nitrogen gas supply unit and the second nitrogen gas supply unit being respectively used for supplying nitrogen gas to the plasma cleaning machine;
the first control valve is arranged on a first pipeline communicated with the plasma cleaning machine and used for controlling the on-off of the first pipeline;
the second control valve is arranged on a second pipeline communicated with the plasma cleaning machine and used for controlling the on-off of the second pipeline;
the pressure sensor is communicated with the first pipeline;
and the relay is electrically connected with the pressure sensor, the first control valve and the second control valve respectively.
2. The nitrogen gas supply apparatus according to claim 1, wherein the first line and the second line communicate with the plasma cleaning machine through a common line.
3. The nitrogen gas supply apparatus according to claim 1, wherein the first line and the second line are respectively communicated with the plasma cleaning machine.
4. A nitrogen gas supply apparatus according to any one of claims 1 to 3, wherein said pressure sensor is provided with a first limit value, and when the gas pressure in said first line is lower than said first limit value, said relay opens and closes said first control valve, and opens said second control valve.
5. The nitrogen gas supply device according to claim 4, further comprising an alarm unit electrically connected to the pressure sensor.
6. The nitrogen gas supply device according to any one of claims 1 to 3, wherein the first control valve and the second control valve are both two-position two-way electromagnetic directional valves.
7. A nitrogen gas supply device according to any one of claims 1 to 3, wherein the pressure sensor is an intelligent pressure sensor having a pressure display and setting.
8. A nitrogen gas supply apparatus according to any one of claims 1 to 3, wherein said first nitrogen gas supply unit is a plant total nitrogen gas supply facility and said second nitrogen gas supply unit is a nitrogen gas cylinder.
9. A plasma cleaning system, comprising:
a plasma cleaning machine;
the nitrogen gas supply device is communicated with the plasma cleaning machine and is used for supplying nitrogen gas to the plasma cleaning machine;
wherein the nitrogen gas supply device is the nitrogen gas supply device according to any one of claims 1 to 7.
10. A nitrogen gas supply method, wherein the nitrogen gas supply is performed according to the nitrogen gas supply apparatus described in claims 1 to 8, comprising the steps of:
inputting nitrogen into the plasma cleaning machine through a first nitrogen supply unit;
detecting the air pressure in the first pipeline;
and controlling the first control valve to be continuously opened or closing the first control valve and opening the second control valve according to the detection result.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911206902.XA CN111059466A (en) | 2019-11-29 | 2019-11-29 | Nitrogen gas supply device, plasma cleaning system and nitrogen gas supply method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911206902.XA CN111059466A (en) | 2019-11-29 | 2019-11-29 | Nitrogen gas supply device, plasma cleaning system and nitrogen gas supply method |
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| CN111059466A true CN111059466A (en) | 2020-04-24 |
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Application publication date: 20200424 |