CN111029325A - Chip on film substrate and flexible organic light emitting diode display device - Google Patents
Chip on film substrate and flexible organic light emitting diode display device Download PDFInfo
- Publication number
- CN111029325A CN111029325A CN201911172826.5A CN201911172826A CN111029325A CN 111029325 A CN111029325 A CN 111029325A CN 201911172826 A CN201911172826 A CN 201911172826A CN 111029325 A CN111029325 A CN 111029325A
- Authority
- CN
- China
- Prior art keywords
- flexible
- chip
- substrate
- light emitting
- organic light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 85
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 20
- 238000007689 inspection Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000007373 indentation Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000000879 optical micrograph Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a chip on film substrate and a flexible organic light emitting diode display device. The chip on film substrate comprises a flexible transparent substrate; the first conducting layer and the second conducting layer are arranged on the flexible transparent substrate at intervals; and a chip arranged on the first conductive layer and the second conductive layer and electrically connected with the first conductive layer and the second conductive layer. When the flexible transparent substrate in the chip on film substrate optically detects the flexible organic light emitting diode display device comprising the flexible organic light emitting diode display panel and the flexible printed circuit board which are electrically connected with the chip on film substrate, the interconnection situation between the flexible organic light emitting diode display panel and the flexible organic light emitting diode display device can be determined, and the problems of misjudgment or incapability of judging the interconnection situation and the like can be reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a chip on film substrate and a flexible organic light emitting diode display device.
Background
Nowadays, portable electronic devices such as tablet computers are becoming more and more popular, and the mainstream technology in the flat panel display industry is Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED) display. In recent years, OLED displays have been increasingly developed due to their characteristics of self-luminescence, extremely high contrast, and the like. Meanwhile, the development trend of ultra-narrow frames and full-face screens enables the market of the flexible OLED panel to be wider.
One of the driving methods of the flexible OLED panel at present is to use a Chip On Film (COF) technology to interconnect the Display panel, the driving Chip, and the flexible printed Circuit board, so that the Display panel can rapidly and accurately Display a picture under the control of an external video Driver Integrated-Circuit (DDI) Chip. COF technology is commonly used in conjunction with Optical Inspection, such as Automated Optical Inspection (AOI) or Optical Microscope (OM), to determine the interconnection between the display panel, the driver chip and the flexible printed circuit board. However, the substrate and the flexible printed circuit board of the COF technology often use colored materials, which are prone to erroneous judgment or impossible judgment when the interconnection situation between the substrate and the flexible printed circuit board occurs during the detection of the optical instrument, thereby affecting the reliability judgment of the flexible OLED panel. Therefore, there is a need to provide a novel COF substrate to solve the problems encountered in the conventional COF technology.
Disclosure of Invention
In view of the above, the present invention provides a Chip On Film (COF) substrate, so as to solve the problem in the prior art that the interconnection between the COF substrate and the flexible OLED panel of the flexible Organic Light Emitting Diode (OLED) display and the flexible printed circuit board cannot be determined or determined by mistake during the detection of the optical instrument.
In order to achieve the above object, an embodiment of the invention provides a flip chip on film substrate, which includes a flexible transparent substrate; the first conducting layer and the second conducting layer are arranged on the flexible substrate at intervals; and a chip arranged on the first conductive layer and the second conductive layer and electrically connected with the first conductive layer and the second conductive layer.
In an embodiment of the invention, the flexible transparent substrate includes polyimide.
In an embodiment of the invention, the substrate further includes an anisotropic conductive layer formed on a portion of the first conductive layer and the second conductive layer.
In an embodiment of the invention, the anisotropic conductive layer includes a polymer conductive adhesive and conductive particles.
In an embodiment of the invention, the substrate further includes a conductive bump disposed between the chip and the first and second conductive layers.
Furthermore, another embodiment of the present invention provides a flexible organic light emitting diode display device, comprising a flexible organic light emitting diode display panel; a flexible printed circuit board; and a chip on film substrate electrically connected to the flexible OLED panel and the flexible PCB. The chip on film substrate comprises a flexible transparent substrate; a first conductive layer and a second conductive layer disposed on the flexible transparent substrate at intervals to electrically connect the flexible organic light emitting diode panel and the flexible printed circuit board; and a chip arranged on the first conductive layer and the second conductive layer and electrically connected with the first conductive layer and the second conductive layer.
In an embodiment of the invention, the flexible transparent substrate includes polyimide.
In an embodiment of the invention, the substrate further includes an anisotropic conductive layer formed on a portion of the first conductive layer and the second conductive layer to form an electrical connection between the first conductive layer and the second conductive layer and the flexible oled panel and the flexible pcb.
In an embodiment of the invention, the flexible oled panel includes a transparent flexible substrate.
In an embodiment of the invention, the flexible printed circuit board includes a yellow-green polyimide flexible substrate.
Compared with the prior art, the flexible transparent base layer is used in the chip on film substrate, when the flexible organic light emitting diode display device comprising the flexible organic light emitting diode display panel and the flexible printed circuit board which are electrically connected with the chip on film substrate is optically detected by adopting an automatic optical inspection system or an optical microscope and the like, the interconnection situation between the chip on film substrate and the flexible organic light emitting diode display panel as well as between the chip on film substrate and the flexible printed circuit board can be determined, and the problems that the interconnection situation between the chip on film substrate and the flexible organic light emitting diode display panel as well as between the chip on film substrate and the flexible printed circuit board is misjudged or can not be judged and the like can be reduced.
In order to make the aforementioned and other objects of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below:
drawings
Fig. 1 is a schematic top view of a flexible organic light emitting diode display device according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view taken at 2-2 in fig. 1.
Fig. 3 is an optical microscope image of a portion within a flexible organic light emitting diode display device according to a first embodiment of the present invention.
Fig. 4 is a flowchart illustrating a process of fabricating a flexible transparent substrate in a chip on film substrate according to a first embodiment of the invention.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. Furthermore, directional phrases used herein, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.
Fig. 1 is a schematic top view of a flexible organic light emitting diode display device 20 according to a first embodiment of the present invention. As shown in fig. 1, the flexible oled display device 20 includes a flexible oled display panel 600, a flexible printed circuit board 800, and a chip on film substrate 700.
The flexible oled display panel 600 includes a transparent flexible substrate 610, and the transparent flexible substrate 610 includes a display area 600a and a peripheral area 600b surrounding the display area 600 a. A pixel array (not shown) of organic light emitting diodes for image display is formed in the display region 600a of the transparent flexible substrate 610. A portion of the transparent flexible substrate 610, for example, a right portion of the peripheral region 600b shown in fig. 1, is provided with a plurality of conductive terminals 620, and the plurality of conductive terminals 620 are electrically connected to the pixel array in the display region 600 a.
As shown in fig. 1, the flexible printed circuit board 800 includes a yellow-green polyimide flexible base layer 810. One end of the yellow-green polyimide flexible substrate 810, for example, one end of the flexible printed circuit board 800 close to the flip-chip film 700, is provided with a plurality of conductive terminals 820, and the plurality of conductive terminals 820 transmit control signals from a central processing unit (not shown) electrically connected to the yellow-green polyimide flexible substrate 810 to the flexible oled display panel 600.
In the present embodiment, a Chip On Film (COF) technology is used between the flexible oled display panel 600 and the flexible pcb 800 to interconnect the display panel, the driving Chip, and the flexible pcb. Thus, the chip on film substrate 700 is disposed between the flexible oled display panel 600 and the flexible pcb 800 and partially covers the flexible oled display panel 600 and the flexible pcb 800. The COF substrate 700 includes a flexible transparent base layer 710 and a chip 750 disposed on a portion of the flexible transparent base layer 710. The flexible transparent base layer 710 is a transparent or milky looking polyimide that is nearly completely colorless in the ultraviolet light at wavelengths less than 320 nanometers and has a light transmission greater than 84% in the visible region. As shown in fig. 1, one end of the chip on film substrate 700 is, for example, the end close to the flexible oled display panel 600, and is electrically connected to the conductive terminals 620 in the peripheral region 600b of the transparent flexible substrate 610 of the flexible oled display panel 600, and the other end of the chip on film substrate 700 is, for example, the end close to the flexible printed circuit board 800, and is electrically connected to the conductive terminals 820 of the yellow-green polyimide flexible base layer 810 of the flexible printed circuit board 800. The chip 750 included in the substrate 700 is, for example, an image driving chip.
Fig. 2 is a schematic cross-sectional view taken at 2-2 in fig. 1, which shows the electrical connection among the flexible oled display panel 600, the chip on film substrate 700 and the flexible pcb 800. As shown in fig. 2, the substrate 700 further includes a first conductive layer 720 and a second conductive layer 725. The first conductive layer 720 and the second conductive layer 725 are disposed on a portion of the flexible transparent base layer 710 at intervals. The chip 750 is disposed on the first conductive layer 720 and the second conductive layer 725, and is electrically connected to the first conductive layer 720 and the second conductive layer 725 through the conductive bump 740, respectively. The first conductive layer 720 and the second conductive layer 725 are electrically connected to the conductive terminals 620 in the peripheral region 600b of the transparent flexible substrate 610 of the flexible oled panel 600 and the conductive terminals 820 of the yellow-green polyimide flexible substrate 810 of the flexible pcb 800 through the use of an anisotropic conductive layer (ACF)730 including conductive particles and a polymer conductive adhesive and the application of a pressing process, respectively.
Then, after the electrical connection of the flexible oled display panel 600, the flexible printed circuit board 800 and the chip on film substrate 700 included in the flexible oled display device 20 is completed, the electrical connection relationship among the above components is checked by an Optical instrument 400 such as an Automated Optical Inspection (AOI) or an Optical Microscope (OM). The optical instrument 400 shown in fig. 2 includes a light source 400a and a lens 400b, and by observing the reflected light of the light 410 emitted by the light source 400a in the detection region 900, the indentation condition of the conductive particles in the anisotropic conductive layer electrically connected between two members can be detected, and if the indentation condition is shallow/no, a corresponding high impedance may exist, thereby affecting the reliability of the flexible oled display device 20.
In the present embodiment, the total thickness of the COF substrate 700 is about 70 microns, and the thickness of the FPC 800 is about 200 microns. By using the flexible transparent substrate 710 in the COF substrate 700, when the optical instrument 400 is used to inspect the COF substrate 700 and the FPC 800 bound by the anisotropic conductive layer 730, the light 410 emitted by the light source 400a can effectively penetrate through the flexible transparent substrate 710 and be reflected back to the lens 400b of the optical inspection device 400, so as to clearly determine the concave-convex indentation condition of the conductive particles in the anisotropic conductive layer 730 after being pressed, thereby determining and observing the electrical connection condition between the FPC 800 and the COF substrate 700.
Fig. 3 is an optical microscope image of a portion within a flexible organic light emitting diode display device according to a first embodiment of the present invention. As shown in fig. 3, an optical microscope image of an inspection area 900 in an actual product of the flexible oled display device 20 as shown in the drawing under inspection by an optical instrument 400 such as an optical microscope is shown in an embodiment. In the optical microscope image, since the flexible transparent base layer is used in the flip-chip film substrate, the optical inspection device 400 such as an optical microscope can detect the obvious concave-convex indentation condition of the conductive particles after lamination, and the electrical connection condition between the observed flexible printed circuit board 800 and the flip-chip film substrate 700 can be judged according to the obvious concave-convex indentation condition of the conductive particles, thereby judging the reliability of the flexible organic light emitting diode display device 20.
The flexible transparent substrate is used in the COF substrate according to the first embodiment of the present invention, so that when an optical instrument such as an automatic optical inspection system or an optical microscope is used to inspect the flexible OLED display device including the FLEXIBLE OLED display panel and the FLEXIBLE PCB electrically connected to the COF substrate according to the present embodiment, the connection condition between the COF substrate and the FLEXIBLE OLED display panel and the FLEXIBLE PCB can be determined, and the problems of misjudgment or incapability of judgment of the connection condition between the COF substrate and the FLEXIBLE OLED display panel and the FLEXIBLE PCB can be reduced.
Fig. 4 is a flowchart 1000 of a process for manufacturing a flexible transparent substrate used in a chip on film substrate according to a first embodiment of the invention, which includes the following four steps S1001-S1007.
In step S1001, a raw material solution in which a raw material bulk is mixed, for example, a raw material bulk containing pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (ODA —) and a raw material solvent of Dimethylformamide (DMF) is provided. In order to prepare a colorless transparent polyimide film, a fluorine-containing group or an alicyclic gene such as a fluorine substituent and a trifluoromethyl substituent may be introduced into the raw material bulk. Alternatively, to prepare a milky white polyimide film, monomers capable of bending the main chain, such as 3,4 'and 3, 3' dianhydrides, meta-substituted diamines, etc., may be incorporated into the bulk of the raw material. Next, in step S1003, prepolycondensation is carried out, for example, at 0 to 20 ℃ to obtain a polyamide. Next, in step S1005, the coating film is filtered to remove impurities. Next, in step S1007, a heating curing process is performed, for example, at 80-300 ℃, and the polyimide material suitable for the transparent or milky flexible base layer used in the substrate of the chip on film of the invention in the first embodiment is formed through the processes of oven and step heating and cooling. The transparent or milky-white flexible base layer obtained in step S1007 can further pass through a conventional Chip On Film (COF) process to obtain the substrate 700 with the flip Chip Film according to the first embodiment of the present invention, thereby completing the preparation of the flexible oled display device 20 according to the first embodiment of the present invention.
The present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A COF substrate comprises
A flexible transparent base layer;
the first conducting layer and the second conducting layer are arranged on the flexible transparent base layer at intervals; and
and the chip is arranged on the first conducting layer and the second conducting layer and is electrically connected with the first conducting layer and the second conducting layer.
2. The substrate of claim 1, wherein the flexible transparent base layer comprises polyimide.
3. The substrate according to claim 1, wherein the substrate further comprises an anisotropic conductive layer formed on a portion of the first conductive layer and the second conductive layer.
4. The substrate according to claim 3, wherein the anisotropic conductive layer comprises a polymer conductive paste and conductive particles.
5. The substrate according to claim 1, wherein the substrate further comprises a conductive bump disposed between the chip and the first and second conductive layers.
6. A flexible organic light emitting diode display device comprises
A flexible organic light emitting diode display panel;
a flexible printed circuit board; and
a chip on film substrate electrically connected to the flexible OLED panel and the flexible printed circuit board, the chip on film substrate comprising
A flexible transparent base layer;
a first conductive layer and a second conductive layer disposed on the flexible transparent substrate at intervals to electrically connect the flexible organic light emitting diode panel and the flexible printed circuit board; and
and the chip is arranged on the first conducting layer and the second conducting layer and is electrically connected with the first conducting layer and the second conducting layer.
7. The flexible organic light emitting diode display device of claim 6, wherein the flexible transparent base layer comprises polyimide.
8. The flexible oled display device claimed in claim 6, wherein the chip on film substrate further includes an anisotropic conductive layer formed on a portion of the first and second conductive layers to form electrical connections between the first and second conductive layers and the flexible oled panel and the flexible pcb.
9. The flexible oled display device claimed in claim 6, wherein the flexible oled panel includes a transparent flexible substrate.
10. The flexible organic light emitting diode display device of claim 6, wherein the flexible printed circuit board comprises a yellow-green polyimide flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911172826.5A CN111029325A (en) | 2019-11-26 | 2019-11-26 | Chip on film substrate and flexible organic light emitting diode display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911172826.5A CN111029325A (en) | 2019-11-26 | 2019-11-26 | Chip on film substrate and flexible organic light emitting diode display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111029325A true CN111029325A (en) | 2020-04-17 |
Family
ID=70207231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911172826.5A Pending CN111029325A (en) | 2019-11-26 | 2019-11-26 | Chip on film substrate and flexible organic light emitting diode display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111029325A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112562524A (en) * | 2020-12-04 | 2021-03-26 | Tcl华星光电技术有限公司 | Display panel and display panel manufacturing method |
| CN114093290A (en) * | 2021-11-29 | 2022-02-25 | 深圳创维－Rgb电子有限公司 | Display module abnormal positioning method and device, intelligent equipment and storage medium |
| US11456349B2 (en) * | 2019-12-31 | 2022-09-27 | Samsung Display Co., Ltd. | Display device having flexible film with window portion |
| CN116386455A (en) * | 2021-12-30 | 2023-07-04 | 乐金显示有限公司 | Display device and method for manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770438A (en) * | 2004-09-22 | 2006-05-10 | 夏普株式会社 | Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
| CN104835804A (en) * | 2014-02-10 | 2015-08-12 | 三星显示有限公司 | Display device |
| US20180247882A1 (en) * | 2016-04-05 | 2018-08-30 | Samsung Electronics Co., Ltd. | Chip-on-film semiconductor packages and display apparatus including the same |
| CN109491112A (en) * | 2018-11-12 | 2019-03-19 | 深圳市联得自动化装备股份有限公司 | The manufacturing system and production method of liquid crystal display panel |
-
2019
- 2019-11-26 CN CN201911172826.5A patent/CN111029325A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770438A (en) * | 2004-09-22 | 2006-05-10 | 夏普株式会社 | Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
| CN104835804A (en) * | 2014-02-10 | 2015-08-12 | 三星显示有限公司 | Display device |
| US20180247882A1 (en) * | 2016-04-05 | 2018-08-30 | Samsung Electronics Co., Ltd. | Chip-on-film semiconductor packages and display apparatus including the same |
| CN109491112A (en) * | 2018-11-12 | 2019-03-19 | 深圳市联得自动化装备股份有限公司 | The manufacturing system and production method of liquid crystal display panel |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11456349B2 (en) * | 2019-12-31 | 2022-09-27 | Samsung Display Co., Ltd. | Display device having flexible film with window portion |
| CN112562524A (en) * | 2020-12-04 | 2021-03-26 | Tcl华星光电技术有限公司 | Display panel and display panel manufacturing method |
| CN114093290A (en) * | 2021-11-29 | 2022-02-25 | 深圳创维－Rgb电子有限公司 | Display module abnormal positioning method and device, intelligent equipment and storage medium |
| CN116386455A (en) * | 2021-12-30 | 2023-07-04 | 乐金显示有限公司 | Display device and method for manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111029325A (en) | Chip on film substrate and flexible organic light emitting diode display device | |
| US11825725B2 (en) | Display panel including vernier mark for aligning conductive adhesive member, electronic apparatus including the same, and method of manufacturing the electronic apparatus | |
| US10078976B2 (en) | Display device | |
| US8426987B2 (en) | Misalignment detection devices | |
| US10303016B2 (en) | Display device and method for manufacturing the same | |
| CN103578358B (en) | Plastic display panel and the flat panel display equipment using this plastic display panel | |
| US9645430B2 (en) | Display device with touch panel | |
| US20200235078A1 (en) | Display comprising light-emitting chips and manufacturing method therefor | |
| WO2013145692A1 (en) | Display apparatus, electronic apparatus, and touch panel | |
| US20100220455A1 (en) | Bonding structure of circuit substrate for instant circuit inspecting | |
| KR20140011656A (en) | Chip on glass substrate and method for measureing connection resistance of the same | |
| US20100060841A1 (en) | Flexible Display Panel | |
| CN1171117C (en) | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus | |
| US11182032B2 (en) | Touch sensor module, window stack structure including the same and image display device including the same | |
| US10928662B2 (en) | Display apparatus including side sealing member and sealing composition used therein | |
| US8896798B2 (en) | Liquid crystal display and manufacturing method for the same | |
| KR101669997B1 (en) | Flat panel display device and manufacturing method the same | |
| CN101309550B (en) | Circuit board and electronic device applying the same | |
| CN100498359C (en) | Circuit connection detection device, electronic equipment and detection method | |
| US20170092593A1 (en) | Display apparatus | |
| US10635374B2 (en) | Electronic device | |
| KR102323769B1 (en) | Touch display panel | |
| CN101211073A (en) | Substrate circuit bonding structure and detection method thereof | |
| CN103531437B (en) | Method for manufacturing semiconductor device and semiconductor device | |
| US20240121996A1 (en) | Display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200417 |
|
| RJ01 | Rejection of invention patent application after publication |