CN110839323A - Combined type machine shell - Google Patents
Combined type machine shell Download PDFInfo
- Publication number
- CN110839323A CN110839323A CN201911135729.9A CN201911135729A CN110839323A CN 110839323 A CN110839323 A CN 110839323A CN 201911135729 A CN201911135729 A CN 201911135729A CN 110839323 A CN110839323 A CN 110839323A
- Authority
- CN
- China
- Prior art keywords
- upper cover
- opening
- shell
- group
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/13—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
技术领域technical field
一种电子装置用的外设机壳,特别有关组合式机壳A peripheral casing for an electronic device, particularly a combined casing
背景技术Background technique
现行的电子产品都会设计专属的外设机壳,这样虽然可以赋予产品各自的识别性。但对于制造厂商而言,每一种新的外设机壳需要承担各种的开发成本,例如:新设计图或模具开发等。因此大部分的电子装置是不能共享外设机壳的设计。Existing electronic products are designed with exclusive peripheral casings, which can give products their own identity. But for manufacturers, each new peripheral case needs to bear various development costs, such as new design drawings or mold development. Therefore, most electronic devices cannot share the design of the peripheral casing.
为能有效利用已开发的外壳,所以有厂商提出许多可以扩充的机壳设计。习知技术的“备援式电源供应器之机壳组合结构(中国台湾发明I505760)”揭示在现有的机壳外侧设置可固定的定位结构,以使另一机壳可以外挂至现有机壳的一侧,借以扩展电源的数量。但是外挂机壳仅是起到机壳的扩展,但对于内部电路并无连通的实际作用。In order to effectively utilize the developed casing, some manufacturers have proposed many expandable casing designs. The prior art "Case combination structure of a redundant power supply (I505760 invented in Taiwan)" discloses that a fixable positioning structure is provided on the outside of the existing case, so that another case can be externally attached to the existing machine. one side of the case, thereby extending the number of power supplies. However, the external casing is only used for the expansion of the casing, but has no practical effect on connecting the internal circuit.
此外,美商Ampro Computers另推出PC/104的接口与外壳。PC/104是多组相同大小外壳以堆叠的方式,使得内部空间可以连通。而连通的内部空间可以提供电路板堆叠。虽然堆叠外壳可以无限制的扩充机壳的高度与界面。但是PC/104是透过外壳侧壁的叠加使得内部空间得以扩张,且内部空间的铜柱固定各电路板与所有的外壳,使得其中层的各外壳不会因为外力而变动位置。In addition, American Ampro Computers also introduced PC/104 interface and shell. PC/104 is a stack of multiple sets of the same size enclosures, so that the internal space can be communicated. And the interconnected interior space can provide for circuit board stacking. Although the stacking case can expand the height and interface of the case without limit. However, PC/104 expands the inner space through the superposition of the side walls of the outer casing, and the copper pillars in the inner space fix each circuit board and all the outer casings, so that the positions of the inner casings will not change due to external force.
这样的组装方式虽然直接且便利,但是各层的外壳是由多个铜柱串接。在多个铜柱串接的情况下,串接铜柱的中间部位的强度会影响各层外壳组合时的强固性。Although such an assembly method is direct and convenient, the shells of each layer are connected in series by a plurality of copper columns. When a plurality of copper pillars are connected in series, the strength of the middle part of the serially connected copper pillars will affect the strength of the combination of the various layers of shells.
发明内容SUMMARY OF THE INVENTION
本申请所要解决的技术问题在于切换高速资料传输与高分辨率影片的传输速度。The technical problem to be solved by this application is to switch the transmission speed of high-speed data transmission and high-resolution video.
为了解决上述问题,本申请提供一种组合式机壳根据外设接口与电路板层数量的不同决定外设机壳的组装与配置。In order to solve the above problems, the present application provides a combined case to determine the assembly and configuration of the peripheral case according to the difference in the number of peripheral interfaces and circuit board layers.
本申请的组合式机壳包括:底壳、上盖壳与前套组件。底壳包括底板、侧壁部与套接部,侧壁部的相对两侧边分别连接于底板的侧边与套接部的侧边,套接部具有第一开孔组与第二开孔组,侧壁部与套接部之间设置靠抵件;上盖壳包括上盖板与外套部,上盖板的侧边设置外套部,上盖壳盖覆于底壳并沿着套接部的表面移动,外套部涵盖套接部外侧,外套部设置第三开孔组,上盖壳套接于底壳的第一位置时,第一开孔组的位置对应于第三开孔组的位置,上盖壳套接于底壳的第二位置时,第二开孔组的位置对应于第三开孔组的位置且外套部的侧边抵住靠抵部;前套组件包括前面板与前套部,前套部设置于前面板的侧边,前套组件用于套接于上盖壳套覆于底壳所形成的开口。The combined casing of the present application includes: a bottom casing, an upper cover casing and a front cover assembly. The bottom shell includes a bottom plate, a side wall portion and a socket portion, the opposite sides of the side wall portion are respectively connected to the side edges of the bottom plate and the side edges of the socket portion, and the socket portion has a first opening group and a second opening hole Set, an abutting member is arranged between the side wall portion and the socket portion; the upper cover shell includes an upper cover plate and an outer cover portion, the side edge of the upper cover plate is provided with an outer cover portion, and the upper cover shell covers the bottom case and is connected along the socket. The surface of the cover moves, the outer cover covers the outside of the socket, and the outer cover is provided with a third group of openings. When the upper cover shell is sleeved at the first position of the bottom case, the position of the first group of holes corresponds to the position of the third group of holes position, when the upper cover shell is sleeved on the second position of the bottom shell, the position of the second opening group corresponds to the position of the third opening group and the side edge of the outer cover abuts against the abutting part; the front cover assembly includes a front cover assembly. The panel and the front cover part, the front cover part is arranged on the side of the front panel, and the front cover assembly is used for being sleeved on the opening formed by the upper cover shell covering the bottom case.
本申请的组合式机壳可以根据不同的电路的堆叠方式,进而选择不同组合方式的机壳。对于生产线而言,本申请的组合式机壳不需另行制造新的底壳与上盖壳,只要采用相应高度的前套组件就可以降低机壳的硬体与组装的各种成本。The combined case of the present application can be selected according to different circuit stacking manners, and further, the case of different combined manners can be selected. For the production line, the combined casing of the present application does not need to manufacture new bottom casings and upper cover casings separately, as long as the front cover assembly of the corresponding height is used, the hardware and assembly costs of the casing can be reduced.
当然,实施本申请的任一产品必不一定需要同时达到以上所述的所有技术效果。Of course, any product implementing the present application does not necessarily need to achieve all of the above-mentioned technical effects at the same time.
附图说明Description of drawings
此处所说明的附图用来提供对本申请的进一步理解,构成本申请的一部分,本申请的示意性实施例及其说明用于解释本申请,并不构成对本申请的不当限定。The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The schematic embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation of the present application.
图1为本申请的组合式机壳的立体示意图。FIG. 1 is a three-dimensional schematic diagram of a combined casing of the present application.
图2A为本申请的底壳前视图。FIG. 2A is a front view of the bottom case of the present application.
图2B为本申请的底壳立体视图。FIG. 2B is a perspective view of the bottom case of the present application.
图3A为本申请的上盖壳前视图。FIG. 3A is a front view of the upper cover case of the present application.
图3B为本申请的上盖壳立体视图。FIG. 3B is a perspective view of the upper cover case of the present application.
图3C为本申请的上盖壳与底壳组装的立体视图。FIG. 3C is a perspective view of the assembly of the upper cover case and the bottom case of the present application.
图4A为本申请的前套组件的立体图。4A is a perspective view of the front cover assembly of the present application.
图4B为本申请的两种前套组件的立体图。4B is a perspective view of two front cover assemblies of the present application.
图5A为本申请的第一前套组件、底壳、上盖壳与电路板的立体示意图。5A is a schematic perspective view of the first front cover assembly, the bottom case, the upper cover case and the circuit board of the present application.
图5B为本申请的第一前套组件、底壳、上盖壳与电路板的组装后立体示意图。5B is a schematic perspective view of the first front cover assembly, the bottom case, the upper cover case and the circuit board after assembly of the present application.
图6A为本申请的第二前套组件、底壳、上盖壳与电路板的立体示意图。6A is a schematic perspective view of the second front cover assembly, the bottom case, the upper cover case and the circuit board according to the present application.
图6B为本申请的第二前套组件、底壳、上盖壳与电路板的组装后立体示意图。FIG. 6B is a schematic perspective view of the second front cover assembly, the bottom case, the upper cover case and the circuit board after assembly according to the present application.
具体实施方式Detailed ways
以下请配合附图及实施例来详细说明本申请的实施方式,藉此对本申请如何应用技术手段来解决技术问题并达成技术功效的实现过程能充分理解并据以实施。The embodiments of the present application will be described in detail below with reference to the accompanying drawings and examples, so as to fully understand and implement the implementation process of how to apply technical means to solve technical problems and achieve technical effects in the present application.
请参考图1所示,其系为本申请的组合式机壳的立体示意图。本申请的组合式机壳100包括底壳110、上盖壳120与前套组件130。上盖壳120盖覆于底壳110上方,并底壳110与上盖壳120之间形成一中空结构与开口。Please refer to FIG. 1 , which is a three-dimensional schematic diagram of the combined casing of the present application. The combined
底壳110系由底板111、侧壁部112、套接部113、下舌片114与固定座 115所构成。本申请的底板111系以矩形为说明,对于本领域者可以将其应用于其他形状中(例如:圆柱)。底板111的相邻三侧边上设置侧壁部112,侧壁部112的另一侧边设置套接部113。换言之,侧壁部112的相对两侧边分别连接于底板111的侧边与套接部113的侧边。侧壁部112与套接部113 的连接处设置一靠抵部116。请参考图2A与图2B所示,其系分别为本申请的底壳前视图与立体视图。The
在图2A中,侧壁部112与套接部113的设置方向系与底板111的法线平行,且侧壁部112的表面与套接部113的表面分属两相异平面。所以在图2A 中侧壁部112与套接部113之间的段差部分系为靠抵部116。而侧壁部112 的设置投影位置位于底板111的侧边。套接部113的设置投影位置位于底板 111的侧边内侧。因此投影在底板111的侧壁部112的涵盖面积大于套接部 113的涵盖面积。侧壁部112中可以开设至少一第一设备接孔1121,如图2B所示。第一设备接孔1121可以用于设置电源连接口或通讯接口等。In FIG. 2A , the disposition direction of the
在套接部113中开设第一开孔组1131与第二开孔组1132。在本申请中第一开孔组1131与第二开孔组1132的设置位置在于开口的相对面的套接部 113中,如图2A的黑色虚线框。在其他实施态样中也可以将第一开孔组1131 与第二开孔组1132的位置设置于套接部113的相对两侧面中。以底板111 为基准,第一开孔组1131相较于第二开孔组1132更靠近于底板111。第一开孔组1131与第二开孔组1132的开孔数量均为相同。在本申请中第一开孔组1131与第二开孔组1132各自具有两开孔以作为说明。为方便说明上盖壳 120与底壳110的固定位置,在此将第一开孔组1131处定义为第一位置。而第二开孔组1132处另定义为第二位置。以底板111为基准,第一位置的高度低于第二位置的高度。A
在底板111位于开口的一侧边另设置下舌片114,如图2B所示。下舌片 114的设置平面高于底板111,使得下舌片114与底板111之间形成段差结构。于下舌片114中设置第四开孔组1141。而底板111上设置至少一固定座115。固定座115除了承载电路板外,也可以利用定位件117将电路板固定于固定座115上。在本申请中定位件117系以铜柱为说明,但于其他实施态样可以利用螺丝或其他组件固定。A
请参考图3A与图3B,其系分别为本申请的上盖壳前视图与立体视图。本申请的上盖壳120系由上盖板121、外套部122与上舌片123所构成。上盖板121的侧边上设置外套部122,且外套部122中设置第三开孔组1221。外套部122的侧壁高度至少大于套接部113的顶端至第二开孔组1132的距离。外套部122的覆盖范围至少需涵盖第一开孔组1131与第二开孔组1132。在本申请中的外套部122是根据套接部113的设置位置所决定。Please refer to FIG. 3A and FIG. 3B , which are a front view and a three-dimensional view of the upper cover of the present application, respectively. The
换言之,上盖板121的相邻三侧边且对应套接部113处设置外套部122。在上盖板121且位于开口处的侧边设置一上舌片123。上舌片123的设置平面低于上盖板121的平面,使得上舌片123与上盖板121形成一段差结构。在上舌片123中设置第五开孔组1231,如图3B所示。上盖壳120可以沿着底壳110的套接部113移动。上盖壳120可以下移至第一位置或上移至第二位置。第3C图中系以上盖壳120移至第一位置的立体图。第一开孔组1131 与第三开孔组1221位置重叠时,用户可以利用螺丝(或铆钉、卡榫)锁固上盖壳120与底壳110。同理,第二开孔组1132与第三开孔组1221也可以透过螺丝锁合固定,以使上盖壳120固定于底壳110的上方。In other words, the
请参考图4A,其系为本申请的前套组件的立体图。前套组件130包括前面板131与前套部132。前套组件130用于套盖于底壳110与上盖壳120所形成的开口。当前套组件130套盖于开口时,上舌片123与下舌片114会抵靠住前面板131与前套部132的交界处。前面板131中开设至少一第二设备接孔1311。前面板131的侧边设置前套部132,如图4A所示。前套部132 的侧壁长度是根据上舌片123与下舌片114的长度所决定。前套部132中设置第六开孔组1321与第七开孔组1322。在本申请中第六开孔组1321是设置于前套部132的上方,而第七开孔组1322则是设置于前套部132的下方。第六开孔组1321的设置位置是根据第四开孔组1141的位置。因此第六开孔组 1321与第七开孔组1322的开孔数量也是根据第四开孔组1141与第五开孔组 1231的数量所决定。Please refer to FIG. 4A , which is a perspective view of the front cover assembly of the present application. The
换言之,当前套组件130套盖于开口时,第四开孔组1141与第六开孔组 1321会形成一贯通的开孔。同理,第五开孔组1231与第七开孔组1322的也是对应的设置位置,使得前套组件130于开口时第五开孔组1231与第七开孔组1322形成一贯通的开孔。在组装前套组件130时可以采用螺丝锁固第六开孔组1321与与第七开孔组1322,使得前套组件130被固定于底壳110与上盖壳120的前侧面。In other words, when the
本申请的前套组件130的种类分别为第一前套组件130a与第二前套组件 130b。上盖壳120位于第一位置则选用第一前套组件130a。上盖壳120位于第二位置则选用第二前套组件130b。第一前套组件130a与第二前套组件130b 的前面板131均有设置第二设备接孔1311。由于第二前套组件130b的前面板131大于第一前套组件130a的前面板131,因此第二前套组件130b可设置较多数量(或大型的)第二设备接孔1311,请配合图4B所示。图4B左侧为第一前套组件130a,右侧为第二前套组件130b。其中,图4A与图4B的第二设备接孔1311仅为说明示例,并非仅局限于所述连接界面的种类与数量。The types of the
延续图4B的两种前套组件的示例说明,另外请配合图5A与图5B所示。在图5A的底壳110与上盖壳120的中空结构中假设可容置两层电路板,且上盖壳120位于第一位置。而第一前套组件130a中开设四种界面的开孔,分别为RJ-45接口、VGA接口、HDMI接口与并列埠(Parallel Port)。而底板111 上分别设置第一电路141与第二电路142,且第一电路141与第二电路142 之间以定位件117相互连接。定位件117另可贯穿第一电路141并与底板111连接,借以将第一电路141与第二电路142固定于中空结构之中。前述的各项部件组装后如图5B所示。Continuing the exemplary description of the two front cover assemblies in FIG. 4B , please also cooperate with those shown in FIGS. 5A and 5B . In the hollow structure of the
相对于第一前套组件130a,本申请另可选择第二前套组件130b,请配合图6A与图6B所示。图6A中系以三层电路板为说明,其系分别为第一电路 141、第二电路142与第三电路143,其中第一电路141与第二电路142与图 4A的例子相同。图6A中在第二电路142上更堆叠一第三电路143。第三电路 143上另设置一组并列埠。第二电路142与第三电路143间可以透过定位件 117固定,例如:铜柱或螺丝等。上盖壳120可以沿着套接部113上移至第二位置,使得中空结构的空间加大,如图6B所示。使用者可以选择第二前套组件130b,借以符合相应空间的前套组件130。In contrast to the first
本申请的组合式机壳可以根据不同的电路的堆叠方式,进而选择不同组合方式的机壳。对于生产线而言,本申请的组合式机壳不需另行制造新的底壳与上盖壳,只要采用相应高度的前套组件就可以降低机壳的硬体与组装的各种成本。The combined case of the present application can be selected according to different circuit stacking manners, and further, the case of different combined manners can be selected. For the production line, the combined casing of the present application does not need to manufacture new bottom casings and upper cover casings separately, as long as the front cover assembly of the corresponding height is used, the hardware and assembly costs of the casing can be reduced.
所述装置与前述的方法流程描述对应,不足之处参考上述方法流程的叙述,不再一一赘述。上述说明示出并描述了本申请的若干优选实施例,但如前所述,应当理解本申请并非局限于本文所披露的形式,不应看作是对其他实施例的排除,而可用于各种其他组合、修改和环境,并能够在本文所述发明构想范围内,通过上述教导或相关领域的技术或知识进行改动。而本领域人员所进行的改动和变化不脱离本申请的精神和范围,则都应在本申请所附权利要求的保护范围内。The device corresponds to the description of the aforementioned method flow, and for the deficiencies, please refer to the description of the aforementioned method flow, which will not be repeated one by one. The above description shows and describes several preferred embodiments of the present application, but as mentioned above, it should be understood that the present application is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various and other combinations, modifications and environments, and can be modified within the scope of the inventive concepts described herein, from the above teachings or from skill or knowledge in the relevant art. However, modifications and changes made by those skilled in the art do not depart from the spirit and scope of the present application, and should all fall within the protection scope of the appended claims of the present application.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911135729.9A CN110839323A (en) | 2019-11-19 | 2019-11-19 | Combined type machine shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911135729.9A CN110839323A (en) | 2019-11-19 | 2019-11-19 | Combined type machine shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110839323A true CN110839323A (en) | 2020-02-25 |
Family
ID=69576703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911135729.9A Withdrawn CN110839323A (en) | 2019-11-19 | 2019-11-19 | Combined type machine shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110839323A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115767967A (en) * | 2022-09-23 | 2023-03-07 | 西安现代控制技术研究所 | Weak rigidity lightweight electronic box |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM318745U (en) * | 2007-03-30 | 2007-09-11 | Proipc Technology Co Ltd | Positioning structure for motherboard of microcomputer |
| TWM351389U (en) * | 2008-09-01 | 2009-02-21 | Aopen Inc | Computer enclosure and computer |
| KR101264668B1 (en) * | 2013-02-07 | 2013-05-15 | 이충원 | Case for portable terminal |
| CN103429033A (en) * | 2012-05-22 | 2013-12-04 | 纬创资通股份有限公司 | Cover plate with assembling and positioning functions and electronic device with assembling and positioning functions |
| CN207557842U (en) * | 2017-12-06 | 2018-06-29 | 北京瑞尔康健科技有限公司 | A kind of machine box for server of adjustable interior space size |
| CN211047463U (en) * | 2019-11-19 | 2020-07-17 | 昆山尚尼司电子科技有限公司 | Combined type machine shell |
-
2019
- 2019-11-19 CN CN201911135729.9A patent/CN110839323A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM318745U (en) * | 2007-03-30 | 2007-09-11 | Proipc Technology Co Ltd | Positioning structure for motherboard of microcomputer |
| TWM351389U (en) * | 2008-09-01 | 2009-02-21 | Aopen Inc | Computer enclosure and computer |
| CN103429033A (en) * | 2012-05-22 | 2013-12-04 | 纬创资通股份有限公司 | Cover plate with assembling and positioning functions and electronic device with assembling and positioning functions |
| KR101264668B1 (en) * | 2013-02-07 | 2013-05-15 | 이충원 | Case for portable terminal |
| CN207557842U (en) * | 2017-12-06 | 2018-06-29 | 北京瑞尔康健科技有限公司 | A kind of machine box for server of adjustable interior space size |
| CN211047463U (en) * | 2019-11-19 | 2020-07-17 | 昆山尚尼司电子科技有限公司 | Combined type machine shell |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115767967A (en) * | 2022-09-23 | 2023-03-07 | 西安现代控制技术研究所 | Weak rigidity lightweight electronic box |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120151098A1 (en) | Systems and methods for providing a universal computing system | |
| KR100476884B1 (en) | A method for manufacturing portable computers and notebook computers by the method | |
| US20130271905A1 (en) | Systems and methods for providing dynamic computing systems | |
| TWI610607B (en) | Casing | |
| US9763338B2 (en) | Modular casings | |
| US20120026678A1 (en) | Fan Mounting System | |
| TWM500282U (en) | Computer internal architecture | |
| US7566104B2 (en) | Bi-directional side emplacing computer casing | |
| US11334124B2 (en) | Electronic device | |
| US8559174B2 (en) | Computer case | |
| CN110839323A (en) | Combined type machine shell | |
| TW201351895A (en) | Power line network device with replacement panel structure | |
| TWM614369U (en) | Wireless communication apparatus | |
| CN211047463U (en) | Combined type machine shell | |
| CN103593012B (en) | Hard disk combination shelf | |
| TW202119892A (en) | Combinable housing | |
| CN210924340U (en) | Integrated component of liquid cooling plate and liquid cooling server | |
| TWM596510U (en) | Assembled casing | |
| JP7526329B2 (en) | Electronics | |
| JP5906919B2 (en) | Support device | |
| US20070076361A1 (en) | Computer device with input/output cover | |
| JP2005011158A (en) | Riser card device with expansion slots on two sides | |
| JP3125255U (en) | Computer power supply mounting structure | |
| TWI794511B (en) | Assembled industrial tablet | |
| CN221900943U (en) | Electronic equipment bracket and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200225 |