CN110511699A - Bonding sheet is used in the protection of the hole IR - Google Patents
Bonding sheet is used in the protection of the hole IR Download PDFInfo
- Publication number
- CN110511699A CN110511699A CN201910853887.1A CN201910853887A CN110511699A CN 110511699 A CN110511699 A CN 110511699A CN 201910853887 A CN201910853887 A CN 201910853887A CN 110511699 A CN110511699 A CN 110511699A
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- CN
- China
- Prior art keywords
- adhesive
- resisting
- humidity
- temp
- acrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of high-temp resisting high-humidity resisting adhesive, described adhesive includes following component by weight: 100 parts of acrylic copolymer, 1~5 part of curing agent, 0.1~0.5 part of antistatic agent, 0.1~1 part of levelling agent；The solid content of the acrylic acid glue is 20%~30%, is by obtaining after the aggregated reaction of following components by mass percentage: Isooctyl acrylate monomer 50%~80%, methyl acrylate 1%~30%, methyl methacrylate 1%~20%, acrylic acid 1%~10%, 4- hydroxybutyl acrylate 1%~10%, azodiisobutyronitrile 0.1%~0.3%.The present invention also provides the hole the IR bonding sheets made of described adhesive.High-temp resisting high-humidity resisting adhesive of the invention solves the problems, such as that the existing hole IR protection materials can not overcome pollution, residue glue, higher tack, low dyestripping electrostatic pressure simultaneously.
Description
Technical field
The present invention relates to protection technical field of membrane, and in particular to a kind of high-temp resisting high-humidity resisting adhesive and the protection bonding of the hole IR
Piece.
Background technique
Touch display screen is component indispensable in modern electronic equipment, generally by cover board, functional sheet and display screen group
At with the diversification of terminal function, in order to the distance between effective awareness apparatus and user's face, present producer
The hole IR, i.e. infrared ray hole are opened up in equipment, the effect in the hole is to make infrared light and shield visible light (380-780nm
Wavelength region) and ultraviolet light (190-380nm wavelength region)；In order to realize above-mentioned effect, the technology being widely used at present is
One layer of IR ink of back side silk-screen in the hole IR, IR ink can filter out the light of 190-780nm wave-length coverage, to only allow red
Outer light penetrates.
Due in the printing of the electronic equipment hole glass panel IR, high temperature sputter, carrying and use process, surface be easy by
Contact staining, generallys use bonding sheet and is covered on its surface and be allowed to from damaging and polluting.Therefore, the back side of the pore membrane containing IR is protected
Cuticula largely uses in the LCD industry such as mobile phone, plate, notebook, is mainly used for the component assembling front lens back side (silk-screen face)
Protection, protect eyeglass, prevent that eyeglass is dirty, scratches.
And existing IR pore membrane is the additional protective film for not having viscosity being attached on protective film, when film need by
IR pore membrane is pasted by design position to protective film；And IR pore membrane its film edge before affixing to back protection film tends to
Because with the external world contact etc. reasons be stained with it is dirty.Current back protection film, the hole IR film raw material are directly covered on back protection film
It is die cut, IR pore membrane raw edges are dirty can be transferred on whole face protective film for cross cutting, are finally transferred on glass, lead to glass
Dirty and entire product it is bad, influence product quality.
The back side of panel for having segment difference this for the hole IR at present, the requirement for adhesive are as follows: viscosity is moderate, and segment difference attaches
Property it is good, remove easy, no residue glue pollution-free to ink again, dyestripping electrostatic pressure request is less than 1.0kv etc. and requires.According to silica gel,
Not only price is high, but also has been easy transfer ghost, pollutes affixed object；According to polyurethane adhesive, price is high, and it is (low to do high physical property
Dyestripping electrostatic pressure) it is more difficult.Also have using acrylic, but it is easy to pollute to affixed object ink area, easy residue glue.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of high-temp resisting high-humidity resisting adhesive, which solves existing
The hole IR protection materials can not overcome the problems, such as pollution, residue glue, higher tack, low dyestripping electrostatic pressure simultaneously.
In order to solve the above-mentioned technical problems, the present invention provides a kind of high-temp resisting high-humidity resisting adhesive, described adhesive includes
Following component by weight: 100 parts of acrylic copolymer, 1~5 part of curing agent, 0.1~0.5 part of antistatic agent, levelling agent
0.1~1 part；
The solid content of the acrylic copolymer is 20~30%, is by following components by mass percentage through poly-
It is obtained after conjunction reaction: Isooctyl acrylate monomer 50%~80%, methyl acrylate 1%~30%, methyl methacrylate 1%~
20%, acrylic acid 1%~10%, 4- hydroxybutyl acrylate 1%~10%, azodiisobutyronitrile 0.1%~0.3%；
Further, the acrylic copolymer is by obtaining after the aggregated reaction of following components by mass percentage
: Isooctyl acrylate monomer 60%, methyl acrylate 15%, methyl methacrylate 15%, acrylic acid 8%, 4- hydroxybutyl third
Olefin(e) acid ester 2%, azodiisobutyronitrile 0.2%.
Further, the acrylic copolymer is obtained through following preparation method:
Take Isooctyl acrylate monomer, methyl acrylate, methyl methacrylate, acrylic acid, the 4- hydroxybutyl third of formula ratio
Olefin(e) acid ester and azodiisobutyronitrile are added solvent, polyase 13~6 hour at 50~70 DEG C, then dilute, and it is total to obtain the acrylic acid
Polymers.
Further, the weight average molecular weight Mw of the acrylic copolymer is 1,000,000~1,500,000, molecular weight distribution PD:8-
15。
Further, the solvent is the solvent of not containing benezene, including ethyl acetate, acetone, butanone, isopropanol and it
Mixture.
Further, the antistatic agent includes LiTFSI, Bu3MePTFSI or MTOATFSI and their mixing
Object.
Further, described adhesive further includes 0.01~0.05 part of organometallic catalysts.Further, described to have
Machine metal-based catalysts include organotin catalysts, organic bismuth catalyst, organic Zr catalyst, organozinc catalyst, organo-aluminium
Catalyst and their mixture.
Further, the catalyst is di-n-butyltin dilaurate.
Further, the high-temp resisting high-humidity resisting adhesive further includes surfactant and silane coupling agent.
Another aspect of the present invention provides a kind of hole IR protection bonding sheet, including substrate, is coated on the substrate
Adhesive phase and release film on described adhesive layer is fitted in, described adhesive layer is bonded by the high-temp resisting high-humidity resisting
What agent was coated with.
The beneficial effects of the present invention are:
1. high-temp resisting high-humidity resisting adhesive of the invention introduces a certain amount of high Tg using a variety of acrylate multi-component copolymers
Acrylic acid hard monomer MMA (methyl methacrylate) and the high Tg cross-linking monomer AA (acrylic acid) of more amount, the propylene made
Molecular weight and wider molecular weight distribution of the acid polymer with superelevation, so that adhesive be made to can satisfy the comprehensive of various performances
Conjunction demand, especially high temperature and humidity resistance.
2. protection bonding sheet in the hole IR of the invention, by introducing antistatic agent and levelling agent in adhesive, effectively
The big problem of dyestripping voltage is improved, while surveying effect to ring also to have certain influence.
3. protection bonding sheet in the hole IR of the invention, segment difference adhesion is good, it is easy to remove again, pollution-free to the hole IR ink,
Without residue glue, dyestripping voltage is small, meets the requirement of the hole IR fitting.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of embodiment of the hole IR protection bonding sheet of the invention；
Wherein: 1, PET base material；2, glue layer；3, release film.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It more fully understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
1, acrylic copolymer is prepared
Synthesis example 1
According to Isooctyl acrylate monomer 60%, methyl acrylate 15%, methyl methacrylate 15%, acrylic acid 8%, 4- hydroxyl
Said components are added in reaction kettle the ratio of base butyl propyleneglycol acid esters 2% and azodiisobutyronitrile 0.2%, and acetic acid second is added
Ester adds part dilution with toluene polymerization reaction 5 hours at 60 DEG C, and obtaining solid content is 30%, molecular weight (Mw) it is 1,200,000
Acrylic copolymer.
Synthesis example 2
According to Isooctyl acrylate monomer 70%, butyl acrylate 25%, acrylic acid 3%, hydroxy-ethyl acrylate 2% and azo two
Above-mentioned component is added in reaction kettle the ratio of isobutyronitrile 0.23%, addition ethyl acetate, polymerization reaction 5 hours at 60 DEG C, then
Dilution with toluene is added, obtaining solid content is 32%, the acrylic copolymer that molecular weight (Mw) is 800,000.
2, embodiment 1-4, comparative example 1-4
By according to the formula in table 1, acrylic copolymer, curing agent, antistatic agent, levelling agent and catalyst are uniformly mixed,
Obtain high-temp resisting high-humidity resisting adhesive.
The formula of the adhesive of table 1 embodiment 1-4 and comparative example 1-4
3, bonding sheet is prepared
High-temp resisting high-humidity resisting adhesive is coated on PET corona surface using comma scraper technique, heats 3 points at 95~100 DEG C
Clock drying, obtains glue-line, is then bonded film surface using release film, guarantees bubble-free to get bonding sheet is arrived.
4, performance test
The embodiment 1-4 and comparative example 1-4 bonding sheet prepared is tested for the property in accordance with the following methods, test result is such as
Shown in table 2:
180 ° of peel strengths: it is tested according to method as defined in GB/T2792-2014.
The test of dyestripping electrostatic pressure: bonding sheet is fitted on mobile phone glass screen with 2kg roller, is in addition fixed electrostatic field instrument
On machine, the glass screen for posting test bonding sheet is then placed in the position 10cm below electrostatic field instrument, with the speed of 20cm/s
Degree removes bonding sheet from glass screen, records dyestripping electrostatic pressure.
Temperature tolerance test: on a glass by bonding sheet fitting, being placed in aging 30min in 180 DEG C of baking ovens, then take out,
It is placed at room temperature for 30min, removes bonding sheet, whether observation glass plate has residue glue or offset printing.
High temperature and humidity ring is surveyed: bonding sheet being fitted on band ink mobile phone glass screen, the ring for being placed in 85 DEG C of * 85%RH surveys machine
Interior 72h, then takes out, and is placed at room temperature for 30min, removes bonding sheet, and observe on glass screen and ink area whether have residue glue or
Person's offset printing.
The performance test results of the hole IR protective film in 2 embodiment of table and comparative example
From Table 2, it can be seen that the addition of antistatic agent can improve the high problem of dyestripping voltage, selection suitably resists quiet
Electric agent can effectively improve dyestripping voltage problem.And the introducing of levelling agent can effectively improve glue surface flatness, when reduction is torn off
Frictional force, to reduce dyestripping voltage, in addition surveying effect to ring also has certain influence.The introducing of metallic catalyst also can be slightly
Improve dyestripping voltage problem.
Comparative example 4, acrylic copolymer do not have the hard monomer of high Tg to be added, and resistance to temp effect is poor, and ink matching effect is not
It is good.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (10)
1. a kind of high-temp resisting high-humidity resisting adhesive, which is characterized in that described adhesive includes following component by weight: propylene
100 parts of acid copolymer, 1~5 part of curing agent, 0.1~0.5 part of antistatic agent, 0.1~1 part of levelling agent；
The solid content of the acrylic copolymer is 20%~30%, is aggregated by following components by mass percentage
It is obtained after reaction: Isooctyl acrylate monomer 50%~80%, methyl acrylate 1%~30%, methyl methacrylate 1%~
20%, acrylic acid 1%~10%, 4- hydroxybutyl acrylate 1%~10%, azodiisobutyronitrile 0.1%~0.3%.
2. high-temp resisting high-humidity resisting adhesive as described in claim 1, which is characterized in that the acrylic copolymer is by by quality
It is obtained after the aggregated reaction of the following components of percentage meter: Isooctyl acrylate monomer 60%, methyl acrylate 15%, metering system
Sour methyl esters 15%, acrylic acid 8%, 4- hydroxybutyl acrylate 2%, azodiisobutyronitrile 0.2%.
3. high-temp resisting high-humidity resisting adhesive as described in claim 1, which is characterized in that the acrylic copolymer is through as follows
What preparation method obtained:
Take Isooctyl acrylate monomer, methyl acrylate, methyl methacrylate, acrylic acid, the 4- hydroxybutyl acrylic acid of formula ratio
Solvent, polyase 13~6 hour at 50~70 DEG C are added in ester and azodiisobutyronitrile, then dilute to get total to the acrylic acid
Polymers.
4. high-temp resisting high-humidity resisting adhesive as claimed in claim 3, which is characterized in that the weight average molecular weight of the acrylic acid glue
Mw100 ten thousand~1,500,000, molecular weight distribution PD:8-15.
5. high-temp resisting high-humidity resisting adhesive as claimed in claim 3, which is characterized in that the solvent is the solvent of not containing benezene,
It includes ethyl acetate, acetone, butanone, isopropanol and their mixture.
6. high-temp resisting high-humidity resisting adhesive as described in claim 1, which is characterized in that the antistatic agent include LiTFSI,
Bu3MePTFSI, MTOATFSI and their mixture.
7. high-temp resisting high-humidity resisting adhesive as described in claim 1, which is characterized in that described adhesive further includes 0.01~0.05
Part organometallic catalysts.
8. high-temp resisting high-humidity resisting adhesive as claimed in claim 7, which is characterized in that the organometallic catalysts include
Machine tin catalyst, organic bismuth catalyst, organic Zr catalyst, organozinc catalyst, organo aluminum catalyst and their mixing
Object.
9. high-temp resisting high-humidity resisting adhesive as described in claim 1, which is characterized in that also wrapped in the high-temp resisting high-humidity resisting adhesive
Include surfactant and silane coupling agent.
10. a kind of hole IR protection bonding sheet including substrate, the adhesive phase being coated on the substrate and fits in described
Release film on adhesive phase, which is characterized in that described adhesive layer is high by the described in any item high temperature resistants of claim 1-9
What wet binder was coated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910853887.1A CN110511699A (en) | 2019-09-10 | 2019-09-10 | Bonding sheet is used in the protection of the hole IR |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910853887.1A CN110511699A (en) | 2019-09-10 | 2019-09-10 | Bonding sheet is used in the protection of the hole IR |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110511699A true CN110511699A (en) | 2019-11-29 |
Family
ID=68631827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910853887.1A Pending CN110511699A (en) | 2019-09-10 | 2019-09-10 | Bonding sheet is used in the protection of the hole IR |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322030A (en) * | 2021-05-24 | 2021-08-31 | 深圳市通泰盈科技股份有限公司 | High-performance acrylic acid adhesive, preparation method thereof and pressure-sensitive adhesive tape |
| JP7053870B2 (en) | 2018-09-28 | 2022-04-12 | 富士フイルム株式会社 | Manufacturing method of laminated body, manufacturing method of optical member |
| CN119060660A (en) * | 2024-11-01 | 2024-12-03 | 博益鑫成高分子材料股份有限公司 | Adhesive layer, acrylic protective film, preparation method and application thereof |
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| JP7053870B2 (en) | 2018-09-28 | 2022-04-12 | 富士フイルム株式会社 | Manufacturing method of laminated body, manufacturing method of optical member |
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Application publication date: 20191129 |