CN110411818A - An intelligent digestion and cooling all-in-one machine - Google Patents
An intelligent digestion and cooling all-in-one machine Download PDFInfo
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- CN110411818A CN110411818A CN201910789174.3A CN201910789174A CN110411818A CN 110411818 A CN110411818 A CN 110411818A CN 201910789174 A CN201910789174 A CN 201910789174A CN 110411818 A CN110411818 A CN 110411818A
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Abstract
本发明公开了一种智能消解、冷却一体机,属于环保设备技术领域,解决了现在对水样消解和冷却设备是分开的,导致实验过程较为复杂,并且水样冷却时效率低并且不环保的问题,本发明包括箱体底板,所述箱体底板的上方设置有保温箱,所述保温箱内壁的顶部设置有加热块,所述加热块上设置有插入试管的第一插孔,所述保温箱内壁的底部设置有加热机构,所述箱体底板上设置有冷却块,所述冷却块上设置有第二插孔,所述箱体底板上设置有半导体冷却机构。通过设置加热块与冷却块,并且使用相对应的加热机构与冷却机构对其加热和降温,所以便可实现在同一个设备上实现对取样水的消解和冷却,避免了设备过于复杂给实验带来影响。
The invention discloses an intelligent digestion and cooling integrated machine, which belongs to the technical field of environmental protection equipment, and solves the problem that the water sample digestion and cooling equipment are separated, resulting in a relatively complicated experimental process, and the water sample is cooled with low efficiency and is not environmentally friendly. Problem, the present invention includes a box bottom plate, an incubator is arranged above the box bottom plate, a heating block is arranged on the top of the inner wall of the incubator, and a first jack for inserting a test tube is arranged on the heating block. A heating mechanism is provided at the bottom of the inner wall of the incubator, a cooling block is provided on the bottom of the box, a second jack is provided on the cooling block, and a semiconductor cooling mechanism is provided on the bottom of the box. By setting the heating block and the cooling block, and using the corresponding heating mechanism and cooling mechanism to heat and cool it, it is possible to realize the digestion and cooling of the sampled water on the same equipment, avoiding the equipment being too complicated and causing the experiment to be inconvenient. to influence.
Description
技术领域technical field
本发明涉及环保设备技术领域,更具体的是涉及一种智能消解、冷却一体机,用于对水样预处理。The invention relates to the technical field of environmental protection equipment, and more specifically relates to an intelligent digestion and cooling integrated machine for pretreatment of water samples.
背景技术Background technique
近年来随着改革的深化,基础投资加大,基础设施大规模的改造和工业化提升,生活及工业用水量持续增长,排到江河湖海的废水逐渐增加,对环境和生态造成了不同程度的破坏,加之有些地域监管不力,矿业野蛮开采,致使水的质量严重变差,CODcr、氨氮、总磷、重金属等严重超标。随着生活水平的提高,人们对生活的质量的要求也越来越高,同时政府环境污染的治理和监管越来越重视,尤其对水质的监管加大了力度,从过去对水质单一的监测指标评价水质质量,已不能全面反映水体质量。对重点污染源、地表水、河流断面、污水处理厂等,国家均以多参数监测仪器组成“水质在线自动监测系统”对水质在线实时监控,并记录水质的变化,通过无线、有线、网络平台将数据传入监测中心、监测站、及相关职能部门,在对水质检测的工作中会对取样水进行预处理。In recent years, with the deepening of reforms, increased basic investment, large-scale transformation of infrastructure and upgrading of industrialization, domestic and industrial water consumption has continued to increase, and wastewater discharged to rivers, lakes and seas has gradually increased, causing varying degrees of damage to the environment and ecology. Destruction, coupled with weak supervision in some areas, and brutal mining, resulting in serious deterioration of water quality, CODcr, ammonia nitrogen, total phosphorus, heavy metals, etc. seriously exceeded the standard. With the improvement of living standards, people's requirements for the quality of life are getting higher and higher. At the same time, the government pays more and more attention to the control and supervision of environmental pollution, especially the supervision of water quality. Indexes to evaluate water quality can no longer fully reflect the quality of water bodies. For key pollution sources, surface water, river sections, sewage treatment plants, etc., the state uses multi-parameter monitoring instruments to form a "water quality online automatic monitoring system" to monitor water quality online in real time and record changes in water quality. The data is transmitted to the monitoring center, monitoring station, and related functional departments, and the sampled water will be pretreated in the work of water quality testing.
水的预处理是在水的精制处理之前,预先进行的初步处理,以便在水的经处理时取得良好效果,提高水质。因为自然界的水都有大量杂质,如泥沙、粘土、有机物、微生物、机械杂质等,这些杂质的存在,严重影响精制水的水质与处理效果,因此必须在精处理之前将一些杂质降低或去除,这就需要预处理,有时也称前处理。Water pretreatment is the preliminary treatment before the water refining treatment, so as to achieve good results and improve water quality when the water is treated. Because natural water has a lot of impurities, such as sediment, clay, organic matter, microorganisms, mechanical impurities, etc., the existence of these impurities seriously affects the water quality and treatment effect of refined water, so some impurities must be reduced or removed before fine treatment , which requires preprocessing, sometimes called preprocessing.
在对取样水进行预处理时,会对取样水进行消解,目前在标样消解过程中采用风冷回流模式,冷却时,通常采用以增大风冷却系统,从而节约冷却时间,但由于增大冷却系统从而增加了噪音,这样在仪器的环保方面带来了不足之处,而且风冷会出现冷却不均匀现象。也有水冷回流模式进行冷却,虽然也能提高冷却效率,但是同时带来了水资源的浪费,能源的消耗,增加水冷系统的同时增大了仪器的结构,不利于仪器的紧凑化设计且成本高。另外现在对水样消解和冷却的设备是分开的,在实验时,难免会因为设备过多出现差错,因此设计一种智能消解、冷却一体机来解决上述问题。When the sample water is pretreated, the sample water will be digested. At present, the air-cooled reflux mode is used in the digestion process of the standard sample. When cooling, it is usually used to increase the air cooling system to save the cooling time. However, due to the increased cooling The system thus increases the noise, which brings shortcomings in the environmental protection of the instrument, and the air cooling will cause uneven cooling. There is also a water-cooled reflux mode for cooling. Although it can also improve the cooling efficiency, it also brings waste of water resources and energy consumption. Adding a water-cooling system increases the structure of the instrument at the same time, which is not conducive to the compact design of the instrument and high cost. . In addition, the equipment for digestion and cooling of water samples is now separated. During the experiment, it is inevitable that there will be errors due to too many equipment. Therefore, an intelligent digestion and cooling all-in-one machine is designed to solve the above problems.
发明内容Contents of the invention
本发明的目的在于:为了解决现在对水样消解和冷却设备是分开的,导致实验过程较为复杂,并且水样冷却时效率低并且不环保的问题,本发明提供一种智能消解、冷却一体机。The purpose of the present invention is to solve the problem that the current equipment for digestion and cooling of water samples is separated, resulting in a relatively complicated experimental process, and the problem of low efficiency and non-environmental protection when cooling water samples. The present invention provides an intelligent digestion and cooling integrated machine .
本发明为了实现上述目的具体采用以下技术方案:The present invention specifically adopts the following technical solutions in order to achieve the above object:
一种智能消解、冷却一体机,包括箱体底板,所述箱体底板的上方设置有保温箱,所述保温箱内壁的顶部设置有加热块,所述保温箱的顶部设置有与加热块相适配的开口,所述加热块上设置有插入试管的第一插孔,所述保温箱内壁的底部设置有给加热块加热用的加热机构,所述箱体底板上固定安装有冷却块支架,所述冷却块支架上固定安装有冷却块,所述冷却块上设置有插入试管用的第二插孔,所述箱体底板上设置有给冷却块冷却的半导体冷却机构,所述箱体底板上固定安装有盖住加热机构与冷却机构的机壳,所述机壳上开设有分别与加热块、冷却块相适配的开口。An intelligent digestion and cooling integrated machine, comprising a box bottom plate, an incubator is arranged above the box bottom plate, a heating block is arranged on the top of the inner wall of the incubating box, and a heating block is arranged on the top of the incubating box. The heating block is provided with a first jack for inserting a test tube, the bottom of the inner wall of the incubator is provided with a heating mechanism for heating the heating block, and the cooling block bracket is fixedly installed on the bottom plate of the box , a cooling block is fixedly installed on the cooling block bracket, a second jack for inserting a test tube is arranged on the cooling block, a semiconductor cooling mechanism for cooling the cooling block is arranged on the bottom plate of the box body, the box body A casing covering the heating mechanism and the cooling mechanism is fixedly installed on the bottom plate, and openings corresponding to the heating block and the cooling block are provided on the casing.
进一步地,所述加热块设置为方形铝块,所述加热块的顶部设置有隔热拼块,所述隔热拼块上设置有与第一插孔相连通的圆孔,所述加热机构包括给加热块加热用的电阻棒,所述电阻棒与加热块紧密接触,还包括设置在保温箱四周的隔热板,所述加热块与保温箱之间填充有石棉。Further, the heating block is set as a square aluminum block, and the top of the heating block is provided with a heat-insulating piece, and a round hole communicating with the first socket is provided on the heat-insulating piece, and the heating mechanism It includes a resistance rod for heating the heating block, the resistance rod is in close contact with the heating block, and a heat insulation board arranged around the incubator, and asbestos is filled between the heating block and the incubator.
进一步地,所述冷却机构包括设置在冷却块一侧的半导体制冷块,所述半导体制冷块的制冷端与冷却块的一侧贴面连接,且接触面涂有一薄层导热硅脂,所述半导体制冷块的散热端贴面分别连接有第一散热片与第二散热片,所述第一散热片与第二散热片上均设置有第一风扇,所述机壳上位于第一风扇的地方设置有通风口,所述冷却块的外围缠绕设置有保温棉,所述冷却块支架为非金属材料。Further, the cooling mechanism includes a semiconductor refrigeration block arranged on one side of the cooling block, the cooling end of the semiconductor refrigeration block is connected to one side of the cooling block, and the contact surface is coated with a thin layer of heat-conducting silicone grease. The heat dissipation end of the semiconductor refrigeration block is respectively connected with a first heat sink and a second heat sink, and the first heat sink and the second heat sink are each provided with a first fan, and the casing is located at the place where the first fan is located. Air vents are provided, thermal insulation cotton is wound around the cooling block, and the cooling block bracket is made of non-metallic material.
进一步地,所述加热机构与半导体冷却机构之间设置有一定的距离形成风道,所述机壳上位于风道处设置有排风口,所述排风口上设置有第二风扇。Further, a certain distance is set between the heating mechanism and the semiconductor cooling mechanism to form an air duct, and an air outlet is provided on the casing at the air duct, and a second fan is arranged on the air outlet.
进一步地,所述机壳的顶部设置有能够覆盖住加热块上试管的防喷罩。Further, the top of the casing is provided with a spray-proof cover capable of covering the test tube on the heating block.
工作原理:可以在机壳上设置用于显示竖直的显示面板,在箱体底板上设置用于开启和关闭加热机构与半导体制冷机构的固态继电器,在外壳上设置给设备供电的开关电源与电源插座,使用时,当开关电源接通时,通过在显示面板上选择相应消解模式,进入后仪器自动开启本模式下的消解升温与冷却降温,内部电阻棒发热,加热块温度上升,可以采用PID温度采集算法,升至所需温度后系统自行控温;同时半导体制冷模块启动,冷却块降温,同上,冷却块温度降至所需温度后系统自行控温,同时散热片(第一散热片与第二散热片)和风扇将半导体转换出的热量及时排出,达到高效率高性能冷却的实验要求,使实验从以往繁杂变得简洁,流畅。Working principle: a vertical display panel can be set on the casing, a solid state relay for turning on and off the heating mechanism and semiconductor refrigeration mechanism can be set on the bottom plate of the box, and a switching power supply and When using the power socket, when the switching power supply is turned on, select the corresponding digestion mode on the display panel. After entering, the instrument will automatically start the digestion and cooling in this mode. The internal resistance rod will heat up, and the temperature of the heating block will rise. PID temperature acquisition algorithm, the system automatically controls the temperature after rising to the required temperature; at the same time, the semiconductor refrigeration module starts, and the cooling block cools down. As above, the system controls the temperature by itself after the cooling block temperature drops to the required temperature, and at the same time the heat sink (the first heat sink) With the second heat sink) and the fan, the heat converted from the semiconductor is discharged in time to meet the experimental requirements of high-efficiency and high-performance cooling, making the experiment simple and smooth from the previous complicated.
本发明的有益效果如下:The beneficial effects of the present invention are as follows:
1.本发明结构简单,使用方便,通过在箱体底板上设置加热块与冷却块,并且使用相对应的加热机构与冷却机构对其加热和降温,并且在加热块与冷却块上均设置有放置试管的第一插孔与第二插孔,所以便可实现在同一个设备上实现对取样水的消解和冷却,避免了设备过于复杂给实验带来影响,使用半导体冷却机构对冷却块降温,a:不需要任何制冷剂,可连续工作,没有污染源没有旋转部件,不会产生回转效应,没有滑动部件是一种固体片件,工作时没有震动、噪音、寿命长,安装容易;b:通过输入电流的控制,可实现高精度的温度控制,再加上温度检测和控制手段,很容易实现遥控、程控、计算机控制,便于组成自动控制系统;c:半导体制冷块热惯性非常小,制冷制热时间很快,在热端散热良好冷端空载的情况下,通电不到一分钟,制冷片就能达到最大温差;d:半导体制冷片的单个制冷元件对的功率很小,但组合成电堆,用同类型的电堆串、并联的方法组合成制冷系统的话,功率就可以做的很大,因此制冷功率可以做到几毫瓦到上万瓦的范围;e:半导体制冷片的温差范围,从正温90℃到负温度130℃都可以实现。1. The present invention is simple in structure and easy to use. By setting a heating block and a cooling block on the bottom plate of the box body, and using the corresponding heating mechanism and cooling mechanism to heat and cool it, and both the heating block and the cooling block are provided with The first jack and the second jack of the test tube are placed, so that the digestion and cooling of the sample water can be realized on the same device, which avoids the impact of the equipment being too complicated to the experiment, and the semiconductor cooling mechanism is used to cool down the cooling block , a: Does not require any refrigerant, can work continuously, has no source of pollution, no rotating parts, no gyration effect, no sliding parts, it is a solid piece, no vibration, noise, long life, easy to install; b: Through the control of the input current, high-precision temperature control can be realized, coupled with temperature detection and control means, it is easy to realize remote control, program control, computer control, and easy to form an automatic control system; c: The thermal inertia of the semiconductor refrigeration block is very small, and the refrigeration The heating time is very fast. In the case of good heat dissipation at the hot end and no load at the cold end, the cooling sheet can reach the maximum temperature difference in less than one minute after being powered on; d: The power of a single cooling element pair of a semiconductor cooling sheet is small, but the combination To form a stack, if the same type of stacks are combined in series and parallel to form a refrigeration system, the power can be made very large, so the cooling power can be in the range of a few milliwatts to tens of thousands of watts; e: semiconductor refrigeration sheet The range of temperature difference can be realized from positive temperature 90°C to negative temperature 130°C.
2.本发明结构简单,使用方便,通过设置隔热拼块与保温箱,使得加热机构的保温效果更好,通过在加热块与保温箱之间填充保温棉使得加热机构的保温效果更好。2. The present invention is simple in structure and easy to use. By arranging heat-insulating blocks and an incubator, the heat preservation effect of the heating mechanism is better. By filling the space between the heating block and the heat preservation box, the heat preservation effect of the heating mechanism is better.
3.本发明结构简单,使用方便,通过设置冷却块,使用半导体制冷块对冷却块进行冷却处理,并且使用第一散热片与第二散热片对半导体制冷块的一侧进行散热,便实现了半导体制冷的功能,通过在冷却块周围缠绕设置保温棉,使得冷却块减少了收到外界热量的影响。3. The present invention is simple in structure and easy to use. By setting the cooling block, using the semiconductor refrigeration block to cool the cooling block, and using the first heat sink and the second heat sink to dissipate heat on one side of the semiconductor refrigeration block, it is realized. The function of semiconductor refrigeration is to reduce the impact of external heat on the cooling block by wrapping insulation cotton around the cooling block.
4.本发明结构简单,使用方便,通过将第一插孔与第二插孔的数量设置为若干个,提高了实验的效率,通过将第二插孔设置为贯穿冷却块,使得冷却块上的试管外部冷凝水不会在第二插孔内部形成堆积,冷凝水可以从排水口流出设备外部。4. The present invention is simple in structure and easy to use. By setting the number of the first jack and the second jack to several, the efficiency of the experiment is improved. By setting the second jack to penetrate the cooling block, the cooling block The condensed water outside the test tube will not accumulate inside the second socket, and the condensed water can flow out of the device from the drain port.
5.本发明结构简单,使用方便,通过在加热机构与半导体冷却机构之间形成风道,并且使用第二风扇进行散热,使得加热机构与半导体冷却机构之间的相互影响减小。5. The present invention is simple in structure and easy to use. By forming an air passage between the heating mechanism and the semiconductor cooling mechanism, and using a second fan for heat dissipation, the mutual influence between the heating mechanism and the semiconductor cooling mechanism is reduced.
6.本发明结构简单,使用方便,通过在机壳的顶部设置有能够覆盖住加热块上试管的防喷罩,使得处于高温状态的水样不会飞溅到实验人员的身上,出现意外。6. The present invention is simple in structure and easy to use. A spray-proof cover capable of covering the test tube on the heating block is arranged on the top of the casing, so that the water sample in a high temperature state will not splash on the experimenter, causing accidents.
附图说明Description of drawings
图1是本发明的内部结构示意图;Fig. 1 is a schematic diagram of the internal structure of the present invention;
图2是本发明的外部结构示意图。Fig. 2 is a schematic diagram of the external structure of the present invention.
附图标记:1-隔热拼块,2-电路板,3-第一散热片,4-固态继电器,5-半导体制冷块,6-第二散热片,7-第一风扇,8-箱体底板,9-开关电源,10-冷却块支架,11-冷却块,12-电路板,13-第二风扇,14-电源插座,15-保温箱,16-隔热板,17-加热块,18-防喷套,19-机壳,20-显示面板。Reference signs: 1-heat insulation block, 2-circuit board, 3-first heat sink, 4-solid state relay, 5-semiconductor cooling block, 6-second heat sink, 7-first fan, 8-box Body bottom plate, 9-switching power supply, 10-cooling block bracket, 11-cooling block, 12-circuit board, 13-second fan, 14-power socket, 15-insulation box, 16-heat insulation board, 17-heating block , 18-spray-proof sleeve, 19-casing, 20-display panel.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
实施例1Example 1
请参阅图1-2,本发明提供一种智能消解、冷却一体机,包括箱体底板8,箱体底板8的上方设置有保温箱15,保温箱15内壁的顶部设置有加热块17,保温箱15的顶部设置有与加热块17相适配的开口,加热块17上设置有插入试管的第一插孔,保温箱15内壁的底部8设置有给加热块17加热用的加热机构,箱体底板8上固定安装有冷却块支架10,冷却块支架10上固定安装有冷却块11,冷却块11上设置有插入试管用的第二插孔,箱体底板8上设置有给冷却块冷却的半导体冷却机构,箱体底板8上固定安装有盖住加热机构与冷却机构的机壳19,机壳19上开设有分别与加热块17、冷却块11相适配的开口。Please refer to Fig. 1-2, the present invention provides an intelligent digestion and cooling integrated machine, including a box bottom plate 8, an incubator 15 is arranged above the box bottom plate 8, and a heating block 17 is arranged on the top of the inner wall of the incubator 15 to keep heat The top of box 15 is provided with the opening that matches with heating block 17, and heating block 17 is provided with the first jack that inserts test tube, and the bottom 8 of incubator 15 inner walls is provided with the heating mechanism that heats heating block 17 usefulness, box A cooling block support 10 is fixedly installed on the body bottom plate 8, and a cooling block 11 is fixedly installed on the cooling block support 10. The cooling block 11 is provided with a second jack for inserting a test tube, and the box bottom plate 8 is provided with a cooling block for cooling the cooling block. The semiconductor cooling mechanism, the casing 19 that covers the heating mechanism and the cooling mechanism is fixedly installed on the box bottom plate 8, and the casing 19 is provided with openings that are respectively adapted to the heating block 17 and the cooling block 11.
本实施例中,加热块17设置为方形铝块,加热块17的顶部设置有隔热拼块1,隔热拼块1上设置有与第一插孔相连通的圆孔,加热机构包括给加热块加热用的电阻棒,电阻棒与加热块紧密接触,还包括设置在保温箱15四周的隔热板16,加热块17与保温箱15之间填充有石棉。In this embodiment, the heating block 17 is set as a square aluminum block, the top of the heating block 17 is provided with a heat-insulating block 1, and the heat-insulating block 1 is provided with a round hole communicating with the first jack, and the heating mechanism includes a The resistance bar that heating block is used for heating, and resistance bar is in close contact with heating block, also comprises the insulation board 16 that is arranged on incubator 15 all around, is filled with asbestos between heating block 17 and incubator 15.
冷却机构包括设置在冷却块11一侧的半导体制冷块5,半导体制冷块5的制冷端与冷却块11的一侧贴面连接,且接触面涂有一薄层导热硅脂,半导体制冷块5的散热端贴面分别连接有第一散热片3与第二散热片6,第一散热片3与第二散热片6上均设置有第一风扇7,机壳19上位于第一风扇7的地方设置有通风口,冷却块11的外围缠绕设置有保温棉,冷却块支架10为非金属材料可以在机壳19上设置用于显示竖直的显示面板20,在箱体底板8上设置用于开启和关闭加热机构与半导体制冷机构的固态继电器4,在外壳19上设置给设备供电的开关电源9与电源插座14。The cooling mechanism includes a semiconductor refrigeration block 5 arranged on one side of the cooling block 11. The cooling end of the semiconductor refrigeration block 5 is connected to one side of the cooling block 11, and the contact surface is coated with a thin layer of heat-conducting silicone grease. The first heat sink 3 and the second heat sink 6 are respectively connected to the veneer of the heat dissipation end, the first heat sink 3 and the second heat sink 6 are provided with a first fan 7, and the casing 19 is located at the place of the first fan 7 Ventilation openings are provided, insulation cotton is wrapped around the periphery of the cooling block 11, and the cooling block support 10 is made of non-metallic material, and a vertical display panel 20 can be arranged on the casing 19, and a vertical display panel 20 can be arranged on the bottom plate of the box body 8 for Turn on and off the solid-state relay 4 of the heating mechanism and the semiconductor refrigeration mechanism, and set the switching power supply 9 and the power socket 14 for supplying power to the equipment on the casing 19 .
使用时,当开关电源9接通时,通过在显示面板20上选择相应消解模式,进入后仪器自动开启本模式下的消解升温与冷却降温,内部电阻棒发热,加热块17温度上升,可以采用PID温度采集算法,升至所需温度后系统自行控温;同时半导体制冷模块启动,冷却块11降温,同上,冷却块11温度降至所需温度后系统自行控温,同时散热片第一散热片与第二散热片和风扇第一风扇与第二风扇将半导体转换出的热量及时排出,达到高效率高性能冷却的实验要求,使实验从以往繁杂变得简洁,流畅。When in use, when the switching power supply 9 is turned on, by selecting the corresponding digestion mode on the display panel 20, the instrument will automatically start the digestion heating and cooling cooling in this mode after entering, the internal resistance rod will generate heat, and the temperature of the heating block 17 will rise. PID temperature acquisition algorithm, the system controls the temperature automatically after rising to the required temperature; at the same time, the semiconductor refrigeration module starts, and the cooling block 11 cools down, as above, after the temperature of the cooling block 11 drops to the required temperature, the system controls the temperature by itself, and at the same time, the heat sink is the first to dissipate heat Fin and the second heat sink and fan The first fan and the second fan discharge the heat converted from the semiconductor in time to meet the experimental requirements of high-efficiency and high-performance cooling, making the experiment simple and smooth from the previous complicated.
通过在箱体底板8上设置加热块17与冷却块11,并且使用相对应的加热机构与冷却机构对其加热和降温,并且在加热块17与冷却块11上均设置有放置试管的第一插孔与第二插孔,所以便可实现在同一个设备上实现对取样水的消解和冷却,避免了设备过于复杂给实验带来影响,使用半导体冷却机构对冷却块降温,a:不需要任何制冷剂,可连续工作,没有污染源没有旋转部件,不会产生回转效应,没有滑动部件是一种固体片件,工作时没有震动、噪音、寿命长,安装容易;b:通过输入电流的控制,可实现高精度的温度控制,再加上温度检测和控制手段,很容易实现遥控、程控、计算机控制,便于组成自动控制系统;c:半导体制冷块热惯性非常小,制冷制热时间很快,在热端散热良好冷端空载的情况下,通电不到一分钟,制冷片就能达到最大温差;d:半导体制冷片的单个制冷元件对的功率很小,但组合成电堆,用同类型的电堆串、并联的方法组合成制冷系统的话,功率就可以做的很大,因此制冷功率可以做到几毫瓦到上万瓦的范围;e:半导体制冷片的温差范围,从正温90℃到负温度130℃都可以实现。By setting the heating block 17 and the cooling block 11 on the bottom plate of the box body 8, and using the corresponding heating mechanism and cooling mechanism to heat and cool it, and the heating block 17 and the cooling block 11 are provided with the first place for placing the test tube. The jack and the second jack, so that the digestion and cooling of the sampled water can be realized on the same device, which avoids the impact of the equipment being too complicated to the experiment, and the semiconductor cooling mechanism is used to cool the cooling block, a: no need Any refrigerant, can work continuously, no pollution source, no rotating parts, no gyration effect, no sliding parts, it is a solid piece, no vibration, noise, long life and easy installation; b: Controlled by input current , can achieve high-precision temperature control, coupled with temperature detection and control means, it is easy to realize remote control, program control, computer control, and easy to form an automatic control system; c: The thermal inertia of the semiconductor refrigeration block is very small, and the cooling and heating time is very fast , in the case of good heat dissipation at the hot end and no load at the cold end, the cooling sheet can reach the maximum temperature difference in less than one minute after being powered on; If the same type of stacks are combined in series and parallel to form a refrigeration system, the power can be made very large, so the refrigeration power can be in the range of several milliwatts to tens of thousands of watts; e: the temperature difference range of semiconductor refrigeration chips, from Positive temperature of 90°C to negative temperature of 130°C can be achieved.
通过设置隔热拼块1与保温箱15,使得加热机构的保温效果更好,通过在加热块17与保温箱15之间填充保温棉使得加热机构的保温效果更好。By arranging the heat insulation block 1 and the heat preservation box 15, the heat preservation effect of the heating mechanism is better, and by filling the heat insulation cotton between the heating block 17 and the heat preservation box 15, the heat preservation effect of the heating mechanism is better.
通过设置冷却块11,使用半导体制冷块对冷却块11进行冷却处理,并且使用第一散热片3与第二散热片6对半导体制冷块5的一侧进行散热,便实现了半导体制冷的功能,通过在冷却块11周围缠绕设置保温棉,使得冷却块减少了收到外界热量的影响。By setting the cooling block 11, using the semiconductor refrigeration block to cool the cooling block 11, and using the first heat sink 3 and the second heat sink 6 to dissipate heat on one side of the semiconductor refrigeration block 5, the function of semiconductor refrigeration is realized. By wrapping the thermal insulation cotton around the cooling block 11, the cooling block reduces the influence of external heat.
实施例2Example 2
请参阅图1-2,本实施例是在实施例1的基础上进行了进一步的优化,具体是,第一插孔与第二插孔均设置为若干个,且若干个第一插孔与第二插孔的数量和孔径都相等,若干个第二插孔贯穿冷却块,箱体底板8的顶部且位于第二插孔的正下方设置有排水口。Please refer to Figure 1-2, this embodiment is further optimized on the basis of Embodiment 1, specifically, the first jack and the second jack are set to several, and the number of first jacks and The number and diameter of the second jacks are equal, and several second jacks run through the cooling block, and a drain is provided on the top of the bottom plate 8 of the box and directly below the second jacks.
本实施例中,第一插孔与第二插孔均设置为若干个,且若干个第一插孔与第二插孔的数量和孔径都相等,若干个第二插孔贯穿冷却块,箱体底板8的顶部且位于第二插孔的正下方设置有排水口。In this embodiment, there are several first jacks and second jacks, and the number and diameter of the first jacks and the second jacks are equal, and the number of second jacks runs through the cooling block. A drain is provided on the top of the body bottom plate 8 and directly below the second jack.
加热机构与半导体冷却机构之间设置有一定的距离形成风道,机壳19上位于风道处设置有排风口,排风口上设置有第二风扇13。There is a certain distance between the heating mechanism and the semiconductor cooling mechanism to form an air duct. An air outlet is arranged at the air duct on the casing 19, and a second fan 13 is arranged on the air outlet.
机壳19的顶部设置有能够覆盖住加热块17上试管的防喷罩18。The top of the casing 19 is provided with a spray-proof cover 18 capable of covering the test tube on the heating block 17 .
可以在第一插孔与第二插孔内部设置用于夹持试管的倒角,这样使得试管可以更好的拿放。Chamfers for clamping test tubes can be provided inside the first insertion hole and the second insertion hole, so that the test tubes can be held and placed better.
通过将第一插孔与第二插孔的数量设置为若干个,提高了实验的效率,通过将第二插孔设置为贯穿冷却块,使得冷却块11上的试管外部冷凝水不会在第二插孔内部形成堆积,冷凝水可以从排水口流出设备外部。By setting the number of the first jack and the second jack to several, the efficiency of the experiment is improved, and the second jack is set to penetrate the cooling block, so that the condensed water outside the test tube on the cooling block 11 will not Accumulation is formed inside the two sockets, and the condensed water can flow out of the device from the drain port.
通过在加热机构与半导体冷却机构之间形成风道,并且使用第二风扇13进行散热,使得加热机构与半导体冷却机构之间的相互影响减小。By forming an air duct between the heating mechanism and the semiconductor cooling mechanism, and using the second fan 13 to dissipate heat, the mutual influence between the heating mechanism and the semiconductor cooling mechanism is reduced.
通过在机壳19的顶部设置有能够覆盖住加热块上试管的防喷罩18,使得处于高温状态的水样不会飞溅到实验人员的身上,出现意外。The top of the casing 19 is provided with a spray-proof cover 18 that can cover the test tube on the heating block, so that the water sample in a high temperature state will not splash on the body of the experimenter, and accidents will occur.
以上所述,仅为本发明的较佳实施例,并不用以限制本发明,本发明的专利保护范围以权利要求书为准,凡是运用本发明的说明书及附图内容所作的等同结构变化,同理均应包含在本发明的保护范围内。The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. The scope of patent protection of the present invention is subject to the claims. Any equivalent structural changes made by using the description and accompanying drawings of the present invention, All should be included in the protection scope of the present invention in the same way.
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| CN116472339A (en) * | 2020-11-19 | 2023-07-21 | 横河电机株式会社 | Processing device, nucleic acid extraction system, nucleic acid analysis system |
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