CN110361417A - A kind of test macro and test method of pump laser chip heat transfer response characteristic - Google Patents

Abstract

The present invention relates to the field of pump lasers, in particular to a test system for the thermal conduction response characteristics of a pump laser chip, comprising: the thermal conduction test device includes a cooler that carries or is attached to one end of the pump laser chip to be tested, and is arranged on the chip to be tested. The other end of the pump laser chip or the temperature sensor whose heat conduction position is the farthest; the drive unit, which outputs a controllable current to control the operation of the refrigerator; the sampling unit obtains the status information of the refrigerator and the induction information of the temperature sensor; the processing unit Test the thermal conduction response characteristics of the pump laser chip. It also relates to a testing method based on the testing system. The present invention obtains the heat conduction performance of the pump laser chip through the test system of the heat conduction response characteristic of the pump laser chip, thereby testing the heat conduction response characteristic of the pump laser chip; Response characteristics for easy subsequent manufacturing.

Description

A test system and test method for the thermal conduction response characteristics of a pump laser chip

technical field

The invention relates to the field of pump lasers, in particular to a test system and a test method for the thermal conduction response characteristics of a pump laser chip.

Background technique

Pump lasers are widely used in the fields of optical amplifiers and fiber lasers. The chip is a semiconductor component with temperature-sensitive characteristics. At the same time, the manufacturing and assembly process (DieBounding) of its core component CoS (Chip on Submount) affects the heat conduction response performance of the product and further affects the performance of the pump laser. The performance of the pump laser is affected.

Specifically, the control of the Die Bounding link in the manufacturing process of CoS, a key component of the pump laser, is related to the heat conduction effect of CoS. At the same time, limited by the Die Bounding process, it is difficult to detect product defects through ordinary detection methods.

Among them, thermal conduction is the heat transfer phenomenon when there is no macroscopic motion in the medium, which can occur in solid, liquid and gas, but strictly speaking, it is pure heat conduction only in solid, and even in fluid At rest, where natural convection also occurs due to density differences caused by temperature gradients, heat convection and heat conduction occur simultaneously in the fluid.

Contents of the invention

The technical problem to be solved by the present invention is to provide a test system and test method for the thermal conduction response characteristics of the pump laser chip in view of the above-mentioned defects of the prior art, so as to solve the problem that the heat conduction effect of the core component CoS of the pump laser cannot be obtained. Defects are prone to occur during the production process.

The technical solution adopted by the present invention to solve the technical problem is to provide a test system for the thermal conduction response characteristics of the pump laser chip, including: a thermal conduction test device, and the thermal conduction test device includes an end that carries or is attached to the pump laser chip to be tested. The refrigerator, and the temperature sensor set at the other end of the pump laser chip to be tested or the farthest heat conduction position; the drive unit, the drive unit is connected with the refrigerator, and outputs a controllable current to control the operation of the refrigerator; the sampling unit , the sampling unit is connected with the refrigerator and the temperature sensor respectively, and obtains the state information of the refrigerator and the induction information of the temperature sensor respectively; Thermal conduction response characteristics of a pump laser chip.

Wherein, the preferred solution is: the refrigerator is placed horizontally, the pump laser chip to be tested is placed on the refrigerator, and the temperature sensor is arranged on the upper end surface of the pump laser chip to be tested.

Among them, the preferred solution is: the refrigerator is a semiconductor refrigerator.

Wherein, the preferred solution is: the temperature sensor is a thermistor.

Wherein, the preferred solution is: the processing unit includes a control module and a PC terminal, the control module, the drive unit and the sampling unit form a test board, and the control module controls the adoption information collected by the test board and sends it to the PC terminal , the PC end obtains the response value of the heat conduction of the pump laser chip to be tested according to the information of the sampling unit, and tests the heat conduction response characteristic of the pump laser chip.

Wherein, a preferred solution is: the test board further includes a filter unit to filter the adoption information.

Among them, a preferred solution is: the PC terminal includes a storage module to store an algorithm flow for calculating the response value of heat conduction.

Among them, a preferred solution is: further comprising a control unit connected to the pump laser chip to be tested, and the control unit controls the pump laser chip to be tested to work during the testing process.

Among them, a preferred solution is: further comprising a display unit connected to the processing unit and displaying a software graphical user interface.

Wherein, a preferred solution is: the pump laser chip to be tested is a 980nm pump laser chip.

The technical solution adopted by the present invention to solve the technical problem is to provide a test method based on the test system, which is applied to the test system, including the steps of: driving the refrigerator to work; collecting the status information of the refrigerator and the temperature sensor Sensing information: According to the algorithm flow of the preset thermal conduction response value, combined with the state information and sensing information, the response value of the thermal conduction of the pump laser chip to be tested is obtained, and the thermal conduction response characteristic of the pump laser chip is tested.

Wherein, the preferred solution is: the temperature sensor is a thermistor, and the steps of the test method include: collecting multiple voltage values of the refrigerator during power-on based on the same frequency, and collecting multiple voltage values of the thermistor ; Obtain the average voltage value formed by the maximum voltage value and the minimum voltage value of the array; and, when a voltage value V1 of the refrigerator satisfies that the difference between the Nth voltage value V2 and the average voltage value is greater than the average voltage value, confirm that the time of the voltage value V2 is refrigeration The power-on time T1 of the device; and, when the thermistor starts from a voltage value V3, there are M consecutive voltage values that all have an upward trend, and the Mth voltage value V4 satisfies that the difference between the voltage value V3 and it is greater than the preset voltage Value, confirm that the time where the voltage value V4 is located is the cut-off point T2; perform curve fitting on the time periods from T1 to T2 and T2 to X-T2 respectively, and calculate the intersection point of the two fitting curves, and use it as the thermal The inflection point Ct of the sensitive resistor, and Ct-T1 is the thermal response data.

The beneficial effect of the present invention is that, compared with the prior art, the present invention obtains the heat conduction performance of the pump laser chip through the test system of the heat conduction response characteristic of the pump laser chip, thereby testing the heat conduction response characteristic of the pump laser chip; and through The placement of the refrigerator and the temperature sensor can accurately obtain its thermal conduction response characteristics, which is convenient for subsequent manufacturing.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

Fig. 1 is the structural representation of the test system of the heat conduction response characteristic of the pump laser chip of the present invention;

Fig. 2 is the schematic flow chart of the test method based on the test system of the present invention;

Fig. 3 is the structural representation of control unit of the present invention;

Fig. 4 is a schematic structural diagram of the display unit of the present invention.

Detailed ways

Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

As shown in FIG. 1 and FIG. 2 , the present invention provides a preferred embodiment of a test system for the thermal conduction response characteristics of a pump laser chip.

A test system for the thermal conduction response characteristics of a pump laser chip, comprising a thermal conduction test device, a drive unit 200, a sampling unit 300, and a processing unit 400, wherein the thermal conduction test device includes one end that carries or is attached to the pump laser chip 10 to be tested The refrigerator 110, and the temperature sensor 120 arranged at the other end of the pump laser chip 10 to be tested or at the farthest heat conduction position; the drive unit 200 is connected with the refrigerator 110, and outputs a controllable current to control the operation of the refrigerator 110 The sampling unit 300 is connected with the refrigerator 110 and the temperature sensor 120 respectively, and obtains the status information of the refrigerator 110 and the sensing information of the temperature sensor 120 respectively; the processing unit 400 acquires the pump laser chip to be tested according to the sampling unit 300 using information 10 Response value of heat conduction, testing the heat conduction response characteristics of the pump laser chip.

Preferably, the processing unit 400 includes a control module 410 and a PC terminal 420, the control module 410, the drive unit 200 and the sampling unit 300 constitute a test board 20, and the control module 410 controls the adoption information collected by the test board 20 And send it to the PC terminal 420, the PC terminal 420 obtains the thermal conduction response value of the pump laser chip 10 to be tested according to the adoption information of the sampling unit 300, and tests the thermal conduction response characteristic of the pump laser chip. Wherein, the sampling unit 300 can transmit data to the PC terminal 420 through the control module 410 , or can directly transmit data to the PC terminal 420 under the control of the control module 410 .

Further, and with reference to Fig. 2, a kind of testing method based on testing system is provided, is applied in described testing system, comprises steps:

Step S10, driving the refrigerator 110 to work;

Step S20, collecting state information of the refrigerator 110 and sensing information of the temperature sensor 120;

Step S30 , according to the algorithm flow of the preset heat conduction response value, combined with state information and sensing information, obtain the heat conduction response value of the pump laser chip 10 to be tested, and test the heat conduction response characteristic of the pump laser chip.

In this embodiment, regarding the heat conduction testing device, it serves as a heat source for heat conduction of the pump laser chip 10 to be tested and an induction core of the heat conduction response. There are several heat conduction schemes as follows:

Solution 1. The refrigerator 110 is used as a carrying platform, and the pump laser to be tested is placed on the carrying platform, and it is bonded to the refrigerator 110. The refrigerator 110 cools or heats to maintain a preset temperature, and the pump laser to be tested The pump laser is conducted from one end to the other. The refrigerator 110 can be loaded horizontally (that is, placed horizontally, which can be considered as a horizontal setting of the bearing surface), or it can be non-horizontally loaded. Of course, in order to ensure that the pump laser to be tested is attached to the refrigerator 110, especially in the case of non-horizontal loading Next, a fixed structure is required for fixing, or a limiting structure is required for limiting. Solution 2: The refrigerator 110 is used as a bonded structure to form a probe, which can be placed at different positions of the pump laser to be tested to maintain a preset temperature.

Wherein, the temperature sensor 120 is also arranged on the pump laser to be tested, and is arranged in a sticky manner, and is preferably arranged on the opposite end surface of the refrigerator 110, such as the refrigerator 110 is arranged on the bottom surface, and the temperature sensor 120 is arranged on the top surface; of course, The current position relative to a refrigerator 110 can be obtained through algorithm calculation or experience summary, and its heat conduction position is the farthest position. As the placement point of the temperature sensor 120, the heat conduction response characteristics of the pump laser to be tested can be further fully obtained . Of course, in order to more accurately obtain the heat conduction response characteristics of the pump laser to be tested, multiple temperature sensors 120 can be set, and the mean value or variance value of the temperature information at different positions can be taken to determine the overall heat conduction response characteristics of the pump laser to be tested .

Further, the refrigerator 110 is preferably a semiconductor refrigerator 110 . Wherein, the conductor cooler 110 (Thermoelectric cooler) refers to a device that utilizes the thermo-electric effect of a semiconductor to produce cold energy, and is also called a thermoelectric cooler 110 . Connect two dissimilar metals with a conductor and connect direct current, the temperature at one junction will drop, and the temperature at the other junction will rise. Of course, the refrigerator 110 may also be other refrigeration equipment.

Further, the temperature sensor 120 is preferably a thermistor. Among them, the thermistor is a type of sensitive element, which is divided into positive temperature coefficient thermistor (PTC) and negative temperature coefficient thermistor (NTC) according to the temperature coefficient. A typical feature of a thermistor is that it is sensitive to temperature and exhibits different resistance values at different temperatures. The temperature information of the thermistor can be judged by obtaining the resistance value of the thermistor. Certainly, the temperature sensor 120 may also be other temperature sensing modules.

In this embodiment, the sampling unit 300 obtains the state information of the refrigerator 110 and the sensing information of the temperature sensor 120 respectively, wherein the obtaining the state information of the refrigerator 110 refers to obtaining the current working state of the refrigerator 110, such as being on or Shutting down, or, refers to obtaining the cooling or heating information of the refrigerator 110, and its own temperature; and obtaining the sensing information of the temperature sensor 120, such as the resistance value of the thermistor, and sending them to the control module 410; and, the above information Also includes the detected time.

Alternatively, the real-time voltage across the refrigerator 110 is sampled, and an acquisition circuit composed of a sampling resistor is used to obtain the actual driving voltage change of the refrigerator 110 through the voltage change at both ends of the resistor, so as to obtain the working state of the refrigerator 110 .

And, the PC terminal 420 calculates the response value of the heat conduction of the pump laser chip 10 to be tested according to the working state of the refrigerator 110 and the change of the sensing information of the temperature sensor 120, as the heat conduction value of the pump laser chip 10 to be tested. Responsiveness. Of course, the control module 410 may be a dedicated control circuit, including a processing chip and corresponding peripheral circuits. Further, the PC terminal 420 includes a storage module to store an algorithm flow for calculating the response value of heat conduction.

In this embodiment, the testing system further includes a filtering unit arranged on the testing board 20 , and the filtering unit can be arranged between the sampling unit 300 and the control module 410 , or between the sampling unit 300 and the PC terminal 420 . The information collected by the acquisition unit is filtered by the filtering unit to improve the accuracy of the information and remove the noise.

In this embodiment, the pump laser chip 10 to be tested is a 980nm pump laser chip, and of course it can also be a pump laser chip with other wavelengths, such as a 1480nmm pump laser chip. Why the wavelength of the pump light source of the pump laser chip 10 to be tested is selected at 980nm or 1480nm, in fact, the wavelength of the pump light source can be 520nm, 650nm, 980nm and 1480nm, but practice has proved that the pump light source with a wavelength of 1480nm has the highest laser efficiency, the second The first is the pump light source with a wavelength of 980nm, and the noise figure of the pump light source with 980nm is relatively low.

As shown in Figure 3, the present invention provides a preferred embodiment of the control unit.

The test system also includes a control unit 500 connected to the pump laser chip 10 to be tested, and the control unit 500 controls the pump laser chip 10 to be tested to work during the test. Of course, the control unit 500 can also be integrated on the test board 20 , and even the control unit 500 and the control module 410 can be the same circuit chip to achieve high integration.

In order to imitate the actual working process of the pump laser chip, the thermal conduction response characteristics of the test system is an important part of the test system.

As shown in FIG. 4, the present invention provides a preferred embodiment of the display unit.

An algorithm formula, and with reference to Figure 4, includes steps:

S31. Collect multiple voltage values of the refrigerator during the power-on process, and collect multiple voltage values of the thermistor;

S321. Obtain the average voltage value formed by the maximum voltage value and the minimum voltage value of the array;

S322, and, when a voltage value V1 of the refrigerator satisfies that the difference between the Nth voltage value V2 and the average voltage value is greater than the average voltage value, confirm that the time of the voltage value V2 is the power-on time T1 of the refrigerator;

S33, and, when the thermistor starts from a voltage value V3, there are continuously M voltage values with an upward trend, and the Mth voltage value V4 satisfies that the difference between the voltage value V3 and the voltage value is greater than the preset voltage value, confirm the voltage value The time at V4 is the cut-off point T2;

S34. Carry out curve fitting for the time periods whose indexes are T1 to T2 and T2 to X-T2 respectively, calculate the intersection point of the two fitting curves, and use it as the inflection point Ct of the thermistor, and Ct-T1 is Thermal response data.

Preferably, the collection frequency is 4 for N, 5 for M, 1500 for X, and a preset voltage value of 0.1V.

Among them, curve fitting refers to selecting an appropriate curve type to fit the observed data, and using the fitted curve equation to analyze the relationship between two variables. In this embodiment, the relationship between the refrigerator and the thermistor is observed through curve fitting, so as to obtain the intersection point as the thermal response data.

Among them, based on the same frequency, multiple voltage values of the refrigerator during the power-on process are collected, and multiple voltage values of the thermistor are collected, preferably 1K samples per second. Of course, by collecting at the same frequency or higher, improve or adapt Test accuracy.

In this embodiment, the test system further includes a display unit 600 connected to the processing unit 400 and displaying a software graphical user interface 610 . Wherein, the display unit 600 is preferably a display screen of the PC terminal 420, which can display a software graphical user interface 610 to realize human-computer interaction.

The specific display content includes: the curve corresponding to the voltage value of the refrigerator; the curve corresponding to the voltage value of the thermistor; and the power-on time T1 of the refrigerator; the dividing point T2 of the thermistor; the fitting curve from T1 to T2 ; T2 to X-T2 fitted curve; inflection point Ct.

Through the display content of the software graphical user interface 610, the inflection point Ct can be clearly obtained to obtain the thermal response data, so as to realize the test of the thermal conduction response characteristic of the pump laser chip.

The above are only the best embodiments of the present invention, and are not used to limit the scope of the present invention. All equivalent changes or modifications made according to the patent scope of the present invention are covered by the present invention.

Claims (12)

1. A test system for the thermal conduction response characteristics of a pump laser chip, characterized in that it comprises: A heat conduction test device, the heat conduction test device includes a cooler that carries or is attached to one end of the pump laser chip to be tested, and a temperature sensor that is arranged at the other end of the pump laser chip to be tested or at the farthest heat conduction position; A drive unit, the drive unit is connected to the refrigerator, and outputs a controllable current to control the operation of the refrigerator; A sampling unit, the sampling unit is respectively connected with the refrigerator and the temperature sensor, and obtains the state information of the refrigerator and the induction information of the temperature sensor respectively; The processing unit acquires the response value of the heat conduction of the pump laser chip to be tested according to the adoption information of the sampling unit, and tests the heat conduction response characteristic of the pump laser chip. 2. The test system according to claim 1, wherein the refrigerator is placed horizontally, the pump laser chip to be tested is placed on the refrigerator, and the temperature sensor is arranged on the pump laser chip to be tested. upper end face. 3. The testing system according to claim 1 or 2, characterized in that: the refrigerator is a semiconductor refrigerator. 4. The test system according to claim 1 or 2, characterized in that: the temperature sensor is a thermistor. 5. test system according to claim 1, is characterized in that: described processing unit comprises control module and PC end, and described control module, drive unit and sampling unit constitute a test board, and described control module controls test board to collect The received adoption information is sent to the PC terminal, and the PC terminal obtains the response value of the thermal conduction of the pump laser chip to be tested according to the utilization information of the sampling unit, and tests the thermal conduction response characteristic of the pump laser chip. 6. The test system according to claim 5, wherein the test board further comprises a filtering unit to filter the adoption information. 7 . The test system according to claim 5 , wherein the PC terminal includes a storage module to store an algorithm flow for calculating the response value of heat conduction. 8 . 8. The test system according to claim 1 or 5, further comprising a control unit connected to the pump laser chip to be tested, and the control unit controls the pump laser chip to be tested to work during the test process. 9. The test system according to claim 1 or 5, further comprising a display unit connected to the processing unit and displaying a graphical user interface of the software. 10. The test system according to claim 1, wherein the pump laser chip to be tested is a 980nm pump laser chip. 11. A test method based on a test system, characterized in that it is applied to the test system according to any one of claims 1-10, comprising the steps of: Drive the refrigerator to work; Collect the status information of the refrigerator and the sensing information of the temperature sensor; According to the algorithm flow of the preset heat conduction response value, combined with state information and induction information, the response value of the heat conduction of the pump laser chip to be tested is obtained, and the heat conduction response characteristic of the pump laser chip is tested. 12. The test method according to claim 1, characterized in that: the temperature sensor is a thermistor, and the steps of the test method comprise: Collect multiple voltage values of the refrigerator during the power-on process, and collect multiple voltage values of the thermistor; Obtain the average voltage value formed by the maximum voltage value and the minimum voltage value of the array; And, when a voltage value V1 of the refrigerator satisfies that the difference between the Nth voltage value V2 and it is greater than the average voltage value, confirm that the time of the voltage value V2 is the power-on time T1 of the refrigerator; And, when the thermistor starts from a voltage value V3, there are M consecutive voltage values that all have an upward trend, and the Mth voltage value V4 satisfies that the difference between the voltage value V3 and the preset voltage value is greater than the preset voltage value, confirm that the voltage value V4 is located Time is the cut-off point T2; Carry out curve fitting for the time periods whose indexes are T1 to T2 and T2 to X-T2 respectively, calculate the intersection point of the two fitting curves, and use it as the inflection point Ct of the thermistor, and Ct-T1 is the thermal response data.