CN119680914B - AOI (automated optical inspection) machine and AOI detection method - Google Patents
AOI (automated optical inspection) machine and AOI detection method Download PDFInfo
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Abstract
The invention relates to an AOI (automatic optical inspection) machine and an AOI detection method. The first detection device is configured to acquire appearance information of the wafer and first position information of the wafer on the substrate, performs first detection judgment according to the appearance information and the first position information, marks the wafer if the wafer is unqualified, performs the next detection process if the wafer is qualified, and performs second detection judgment according to the position characteristic information, and judges the optical device to be a qualified product if the wafer is qualified, and marks the optical device if the wafer is unqualified. Because the first detection component and the second detection component are arranged, the appearance defect of the surface of the wafer and the position angle of the wafer are firstly checked, and then the three-dimensional shape information of the lead is obtained through the second detection component and compared with the preset position characteristic range, thereby being beneficial to improving the consistency of optical device products.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to an AOI (automated optical inspection) machine and an AOI detection method.
Background
Semiconductor AOI automatic optical inspection equipment is most widely used in the electronics manufacturing industry. The AOI can screen out bad NG products and give an alarm in time to improve the factory reject ratio of the products. The AOI detection principle is a process of outputting the reflected light intensity of the detected object in a quantified gray scale value by adopting an imaging technology, analyzing and judging defects and classifying the defects by comparing the reflected light intensity with the gray scale value of a standard image. Compared with manual inspection, the AOI adopts a common LED or a special light source which is equivalent to natural light during manual inspection, the AOI adopts an optical sensor and an optical lens which are equivalent to human eyes, and an AOI image processing and analyzing system is equivalent to human brain, namely two links of 'watching' and 'judging'. Thus, the working logic of AOI detection can be simply divided into four phases, an image acquisition phase (optical scanning and data collection), a data processing phase (data classification and conversion), an image analysis phase (feature extraction and template comparison) and a defect reporting phase (defect size type classification, etc.). In order to support and realize the four functions of AOI detection, the hardware system of the AOI equipment also comprises a working platform, an imaging system, an image processing system and an electrical system, and is an automation equipment integrating multiple disciplines of machinery, automation, optics, software and the like.
In the prior art, an AOI inspection apparatus generally performs inspection on a semiconductor product only once, and generally only detects defects in a planar dimension of the semiconductor product, where the semiconductor product generally includes a PCB board, a wafer and a wire, the wafer is disposed on the PCB board, the PCB board and the wafer are electrically connected by the wire, and the wire is bent when connected between the wafer and the PCB board, so that the wire is bent, and the wire has poor consistency due to different heights, and in some high-end apparatuses or applications of precise instruments, if the wire is too high, other parts may be blocked to prevent the use of the semiconductor product, and in addition, if a plurality of wires of the semiconductor product generate a cross or overlap phenomenon, a circuit short circuit may be caused, which causes serious consequences that the semiconductor product even the whole apparatus cannot be used.
Disclosure of Invention
The invention aims to provide an AOI (automatic optical inspection) machine, which aims to solve the technical problem that the existing AOI detection equipment can only detect defects of a plane dimension of a semiconductor product once, and the uniformity of the semiconductor product is poor due to the fact that the detected dimension is too small.
In order to solve the above technical problem, provide an AOI detects machine, be applied to optical device, optical device includes base plate, wafer and wire, the wafer set up in on the base plate, the base plate with the wafer passes through the wire electricity is connected, AOI detects the machine includes:
A frame including a first detection bit and a second detection bit;
the conveying device is used for sequentially moving the optical device on the jig to the first detection position and the second detection position;
The first detection device comprises a first mounting frame, a first detection component and a first light source component, wherein the first light source component is slidably mounted on the first mounting frame to adjust the position height of the first light source component, the first light source component is arranged between the first detection component and the conveying device, and the first detection component is connected with the first mounting frame;
the second detection device comprises a second mounting frame, a second detection assembly and a second light source assembly, the second light source assembly is slidably mounted on the second mounting frame to adjust the position height of the second light source assembly, the second light source assembly is arranged between the second detection assembly and the conveying device, and the second detection assembly is connected with the second mounting frame;
The first detection device is configured to obtain appearance information of the wafer and first position information of the wafer on the substrate, the first detection judgment is carried out according to the appearance information and the first position information, if the wafer is not qualified, the wafer is marked, if the wafer is qualified, the next detection process is carried out, the second detection device is configured to obtain position characteristic information of a wire on the optical device, the second detection judgment is carried out according to the position characteristic information, if the wafer is qualified, the optical device is judged to be qualified, and if the wafer is not qualified, the optical device is marked.
Further, the first detection device further comprises a first adjustment component, the first detection component is installed on the first installation frame through the first adjustment component, and the first adjustment component is used for adjusting the position of the first detection device;
The second detection device further comprises a second adjustment assembly, the second detection assembly is mounted on the second mounting frame through the second adjustment assembly, and the second adjustment assembly is used for adjusting the position of the second detection device.
Further, the first light source assembly comprises a first sliding rod, a first bearing plate and a first light source piece, the first sliding rod and the first light source piece are respectively and fixedly installed on the first bearing plate, the first installation frame comprises a first sliding groove and a first fixing piece, the first sliding rod is matched with the first sliding groove, and the first fixing piece acts on the first sliding rod to enable the first sliding rod to be in a movable or fixed state;
The second light source component comprises a second sliding rod, a second bearing plate and a second light source piece, the second sliding rod and the second light source piece are respectively and fixedly installed on the second bearing plate, the second installation frame comprises a second sliding groove and a second fixing piece, the second sliding rod is matched with the second sliding groove, and the second fixing piece acts on the second sliding rod to enable the second sliding rod to be in a movable or fixed state.
Further, the first light source piece comprises a first light emitting surface and a first through hole, the first through hole is arranged right above the first detection position, the first light emitting surface is used for emitting light along the Z-axis direction, the second light source piece comprises a second light emitting surface and a second through hole, the second through hole is arranged right above the second detection position, and the second light emitting surface is used for forming an irradiation space in the circumferential range of the second detection.
Further, the conveying device comprises a conveying track, a movable gripper, a first in-place sensor and a second in-place sensor, wherein the movable gripper is connected with the conveying track to drive the optical device to move, the first in-place sensor is arranged at the first detection position, and the second in-place sensor is arranged at the second detection position.
Further, AOI detects machine still including set up in loading module and unloading module at conveyor both ends relatively, the loading module include main part frame, bracket, and all install in X axle removal subassembly, Y axle removal subassembly and the Z axle removal subassembly on the main part frame, the bracket with Z axle removes the subassembly and is connected, the bracket is used for bearing the tool in the magazine, the unloading module be configured to with the structure of loading module is the same.
Further, the main body frame comprises a loading level, a first cavity and a second cavity which are respectively and independently arranged, the Z-axis moving assembly is arranged in the first cavity, the Y-axis moving assembly is arranged in the second cavity, and the height position of the X-axis moving assembly is flush with the loading level;
the Y-axis moving assembly comprises a Y-axis motor, a belt, a driving wheel, a driven wheel and a moving piece, wherein the driving wheel is connected with the Y-axis motor, the driving wheel and the driven wheel are connected through the belt in a coupling way, the moving piece is connected with the belt, and a plurality of placing positions for placing the material box are formed on the moving piece;
The Z-axis moving assembly comprises a Z-axis motor, a ball screw, a guide rod and a first sliding block, wherein the Z-axis motor and the guide rod are fixedly arranged on the main body frame, the first sliding block is slidably arranged on the ball screw and the guide rod, and the bracket is connected with the first sliding block.
Further, the Y-axis moving assembly further comprises a guide rail and a second sliding block, the second sliding block is slidably mounted on the guide rail, the moving piece comprises a moving plate and a plurality of cylinder groups fixedly mounted on the moving plate, the cylinder groups are arranged on the moving plate at intervals, the placing position is formed between every two adjacent cylinder groups, and the moving plate is fixedly connected with the second sliding block.
A second object of the present invention is to provide a detection method, using the AOI detector described above, the method comprising:
presetting appearance defect characteristics, a position deviation range and a position characteristic range;
Moving the optical device to the first detection position by the conveying device;
obtaining appearance information of the wafer and first position information of the wafer on the substrate;
Comparing the first position information with a position deviation range, comparing the appearance information with the appearance defect characteristics, if the first position information is in the position deviation range and the appearance information does not accord with the appearance defect characteristics, transferring the optical device to the second detection position for the next detection process, and if the first position information exceeds the position deviation range and/or the appearance information accords with the appearance defect characteristics, marking the optical device;
acquiring position characteristic information of a wire positioned on the optical device;
Comparing the position characteristic information with the position characteristic range, judging that the optical device is qualified if the position characteristic information accords with the position characteristic range, and marking if the position characteristic information does not accord with the position characteristic range.
Further, the position characteristic information includes height information, length information and bending angle information of the wire, and the position characteristic range includes a height position range, a length position range and a bending angle range, wherein the height information is compared with the height position range, the length information is compared with the length position range, the bending angle information is compared with the bending angle range, and one of the height information, the length information and the bending angle information does not conform to the position characteristic range, and the optical device is determined to be disqualified.
The implementation of the embodiment of the invention has the following beneficial effects:
In one embodiment, the AOI inspection machine of the present application, due to the arrangement of the first inspection component and the second inspection component, first inspects the appearance defect of the wafer surface and the position angle of the wafer on the substrate by the first inspection component, at this time, mainly inspects the top surface of the wafer, and after confirming that the wafer is not damaged and the position of the wafer is not problematic, acquires the three-dimensional shape information of the wire by the second inspection component, specifically including the height information, the length information and the bending angle information of the wire, and compares the three-dimensional shape information with the preset position feature range. The positions of the wires meet strict technical requirements, circuit faults or performance degradation caused by wire position deviation are avoided, and consistency of optical device products is improved;
In another embodiment, the first and second detection means are each provided with adjustment assemblies that allow the position of the detection member to be precisely adjusted to be in focus. In addition, the first light source component is slidably mounted on the first mounting frame, and the second light source component is slidably mounted on the second mounting frame. The height positions of the first light source component and the second light source component can be adjusted, so that a user can conveniently adjust the light source component according to actual conditions to enable the light source component to achieve the optimal bright environment, the first detection component and the second detection component can acquire clearer pictures, and the accuracy of detection results is further improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an AOI detector according to an embodiment of the present invention;
FIG. 2 is a top view of an AOI detector according to an embodiment of the invention;
FIG. 3 is a schematic view of a first detecting device according to an embodiment of the present invention;
FIG. 4 is a schematic view of another view angle of the first detecting device according to the embodiment of the present invention;
FIG. 5 is a schematic view of a second detecting device according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a second detecting device according to another embodiment of the present invention;
FIG. 7 is a schematic view of a conveying apparatus according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a feeding module according to an embodiment of the present invention;
Fig. 9 is a schematic structural diagram of a feeding module with a part of a main body frame removed according to an embodiment of the present invention;
FIG. 10 is a schematic view showing a combination of a Y-axis moving assembly and a Z-axis moving assembly according to an embodiment of the present invention;
FIG. 11 is a front view of a Y-axis moving assembly and Z-axis moving assembly combination according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of an optical device according to an embodiment of the present invention;
FIG. 13 is an enlarged partial schematic view of FIG. 12A;
FIG. 14 is a top view of an optical device according to an embodiment of the present invention;
Fig. 15 is a schematic structural view of a jig in a material box according to an embodiment of the present invention;
fig. 16 is a schematic structural diagram of an optical device according to an embodiment of the present invention placed on a fixture;
fig. 17 is a diagram of a method for detecting quality of an optical device using an AOI detector according to an embodiment of the present invention.
Wherein, 100, an AOI detector; 110, a frame; 111, a first detection bit; 112, second detection position, 120, conveying device, 121, conveying track, 122, moving grip, 123, first in-place sensor, 124, second in-place sensor, 130, first detection device, 131, first mounting rack, 1311, first sliding groove, 132, first detection component, 133, first light source component, 1331, first sliding rod, 1332, first bearing plate, 1333, first light source component, 1333A, first light emitting surface, 1333B, first through hole, 134, first adjusting component, 140, second detection device, 141, second mounting rack, 1411, second sliding groove, 142, second detection component, 143, second light source component, 1431, second sliding rod, 1432, second bearing plate, 1433, second light source component, 1433A, second light emitting surface, 1433B, second through hole, 144, second adjusting component, 150, feeding module, 151, main body frame, 1511, first cavity, 1512, second cavity, 152, X axis, 152, Y axis, 1541, Y axis 1545, ball bearing pin, 1545, Z axis 1545, moving guide block, 1545, Z axis 1545, moving block, guide pin, ball 1545, Z axis 1545, moving block, guide pin, Z5, moving block, and Z5, moving block, carrying, moving first,;moving moving consist moving first;
200. Optical device 210, substrate 220, wafer 230, wire;
300. 310, a discharge groove;
400. Jig 410, placing groove.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-16, an embodiment of the application provides an AOI inspection machine 100, which is applied to an optical device 200, wherein the optical device 200 includes a substrate 210, a wafer 220 and a wire 230, the wafer 220 is disposed on the substrate 210, the substrate 210 and the wafer 220 are electrically connected through the wire 230, and the AOI inspection machine 100 includes a frame 110, a conveying device 120, a first inspection device 130 and a second inspection device 140. The housing 110 comprises a first detection bit 111 and a second detection bit 112. The conveyor 120 is used to sequentially move the optical device 200 on the jig 400 to the first detection position 111 and the second detection position 112. The first detection device 130 includes a first mounting frame 131, a first detection assembly 132 and a first light source assembly 133, the first light source assembly 133 is slidably mounted on the first mounting frame 131 to adjust the position height of the first light source assembly 133, and the first light source assembly 133 is disposed between the first detection assembly 132 and the conveying device 120, and the first detection assembly 132 is connected with the first mounting frame 131. The second detecting device 140 includes a second mounting frame 141, a second detecting component 142 and a second light source component 143, the second light source component 143 is slidably mounted on the second mounting frame 141 to adjust the position height of the second light source component 143, and the second light source component 143 is disposed between the second detecting component 142 and the conveying device 120, and the second detecting component 142 is connected with the second mounting frame 141. The first detecting device 130 is configured to obtain appearance information of the wafer 220 and first position information of the wafer 220 on the substrate 210, perform a first detection and determination according to the appearance information and the first position information, mark the wafer if the wafer is failed, perform a next detection process if the wafer is failed, and the second detecting device 140 is configured to obtain position feature information of the wire 230 on the optical device 200, perform a second detection and determination according to the position feature information, determine that the optical device 200 is a qualified product if the wafer is failed, and mark the wafer if the wafer is failed. Illustratively, the failed optical device 200 is marked in the above description, and the marking refers to a < map > label for client image mapping, that is, when the failed optical device 200 is detected, the AOI inspection machine 100 of the present application will not reject it, but will package it together, and when the user uses it, the position and number of failed optical devices 200 in the whole box of optical devices 200 can be checked.
In addition, in this embodiment, the AOI inspection machine 100 is provided with two inspection bits, that is, the first inspection bit 111 and the second inspection bit 112, and each inspection bit is provided with a corresponding inspection device to inspect the optical device 200, however, in a specific application, the number of the inspection bits is not limited to this, and the corresponding inspection may be configured according to the requirement and the function, for example, as an alternative, the number of the inspection bits may be one, three, or four, and when a plurality of inspection bits are provided, the plurality of inspection bits may be linearly distributed, or may be distributed in a disc shape.
Referring to fig. 1 and 2, in the AOI inspection machine 100 of the present application, since the first inspection component 132 and the second inspection component 142 are provided, the appearance defect of the surface of the wafer 220 and the position angle of the wafer 220 on the substrate 210 are inspected by the first inspection component 132, at this time, the top surface of the wafer 220 is mainly inspected, it is confirmed that the wafer 220 is not damaged and the position of the wafer 220 is not problematic, and then the three-dimensional shape information of the wire 230, including the height information, the length information and the bending angle information of the wire 230, is obtained by the second inspection component 142, and compared with the preset position feature range. The position of the wire 230 meets strict technical requirements, and circuit faults or performance degradation caused by position deviation of the wire 230 are avoided;
Referring to fig. 4 and 6, in one possible embodiment, the first detecting device 130 further includes a first adjusting component 134, the first detecting component 132 is mounted on the first mounting frame 131 through the first adjusting component 134, and the first adjusting component 134 is used for adjusting the position of the first detecting device 130. The second detecting device 140 further includes a second adjusting component 144, the second detecting component 142 is mounted on the second mounting frame 141 through the second adjusting component 144, and the second adjusting component 144 is used for adjusting the position of the second detecting device 140. In another embodiment, the first and second detection means 130, 140 are each provided with adjustment assemblies that allow the position of the detection member to be precisely adjusted to be in focus. The first adjusting component 134 and the second adjusting component 144 are two-axis moving mechanisms, the positions of the detecting components can be adjusted in the X-axis direction and the Z-axis direction respectively, and the first adjusting component 134 and the second adjusting component 144 are manually adjusted. In addition, the first light source assembly 133 is slidably mounted on the first mounting frame 131, and the second light source assembly 143 is slidably mounted on the second mounting frame 141. The height positions of the first light source component 133 and the second light source component 143 can be adjusted, so that a user can conveniently adjust the light source component according to actual conditions to achieve the optimal bright environment, and the first detection component 132 and the second detection component 142 can acquire clearer pictures, thereby being beneficial to further improving the accuracy of detection results.
Referring to fig. 4 and 5, in one possible embodiment, the first light source assembly 133 includes a first sliding rod 1331, a first bearing plate 1332 and a first light source member 1333, wherein the first sliding rod 1331 and the first light source member 1333 are fixedly mounted on the first bearing plate 1332, respectively, and the first mounting frame 131 includes a first sliding slot 1311 and a first fixing member (not shown) that is engaged with the first sliding slot 1311, and the first sliding rod 1331 acts on the first sliding rod 1331 to enable the first sliding rod 1331 to be in a movable or fixed state.
Referring to fig. 6 and 7, the second light source assembly 143 includes a second slide rod 1431, a second bearing plate 1432 and a second light source member 1433, the second slide rod 1431 and the second light source member 1433 are fixedly mounted on the second bearing plate 1432 respectively, the second mounting frame 141 includes a second sliding slot 1411 and a second fixing member (not shown in the drawings), the second slide rod 1431 cooperates with the second sliding slot 1411, and the second fixing member acts on the second slide rod 1431 to make the second slide rod 1431 in a movable or fixed state. Illustratively, the height positions of the first light source 1333 and the second light source 1433 are manually adjusted.
Referring to fig. 4 and 6, in one possible embodiment, the first light source piece 1333 includes a first light emitting surface 1333A and a first through hole 1333B, the first through hole 1333B is disposed directly above the first detection position 111, the first light emitting surface 1333A is configured to emit light along the Z-axis direction, the second light source piece 1433 includes a second light emitting surface 1433A and a second through hole 1433B, the second through hole 1433B is disposed directly above the second detection position 112, and the second light emitting surface 1433A is configured to form an irradiation space within a circumferential range of the second detection. For example, since the first detecting device 130 can only detect the information of the wafer 220 on the two-dimensional plane, the first light source 1333 only needs to intensively irradiate the upper surface of the wafer 220, and the second detecting device 140 needs to detect the three-dimensional position information of the wire 230, so that the irradiation space formed by the second light source 1433 should be capable of illuminating the periphery of the wafer 220 and the wire 230, so that the second detecting device 140 can acquire the guided three-dimensional position information. In addition, it should be noted that, the first through hole 1333B is used for avoiding the first detection component 132, the first detection component 132 obtains the image information of the wafer 220 through the first through hole 1333B, the second through hole 1433B is used for avoiding the second detection component 142, and the second detection component 142 obtains the image information of the wafer 220 through the second through hole 1433B.
Referring to fig. 1 and 7, in one possible embodiment, the conveying device 120 includes a conveying track 121, a moving grip 122, a first in-place sensor 123 and a second in-place sensor 124, where the moving grip 122 is connected to the conveying track 121 to drive the optical device 200 to move, the first in-place sensor 123 is disposed at the first detection position 111, and the second in-place sensor 124 is disposed at the second detection position 112. Illustratively, the in-place sensor can ensure that the optics 200 are accurately positioned to the first detection bit 111 and the second detection bit 112 during transport. In addition, by automatically sensing whether the optics 200 are in place, the time to wait and manually intervene can be reduced, thereby improving the efficiency of operation of the overall AOI inspection machine 100.
Referring to fig. 8, 9, 10 and 11, in one possible embodiment, the AOI inspection machine 100 further includes a loading module 150 and a discharging module 160 disposed at opposite ends of the conveying device 120, the loading module 150 includes a main body frame 151, a bracket 152, and an X-axis moving assembly 153, a Y-axis moving assembly 154 and a Z-axis moving assembly 155 all mounted on the main body frame 151, the bracket 152 is connected with the Z-axis moving assembly 155, the bracket 152 is used for carrying a jig 400 in the material box 300, and the discharging module 160 is configured to have the same structure as the loading module 150. Illustratively, in the present embodiment, the magazine 300 has a plurality of discharge slots 310 for placing the jig 400, the plurality of discharge slots 310 are arranged in a single row at intervals, the jig 400 is strip-shaped, and a plurality of discharge slots 410 are arranged on the jig 400 in a single row at intervals, and the discharge slots 410 are used for placing the substrate 210 or the optical device 200. In one possible embodiment, the main body frame 151 includes a loading level and a first cavity 1511 and a second cavity 1512 that are separately provided, the z-axis moving assembly 155 is disposed in the first cavity 1511, the Y-axis moving assembly 154 is disposed in the second cavity 1512, and the X-axis moving assembly 153 is disposed at a height level with the loading level.
Referring to fig. 8, 9, 10 and 11, the Y-axis moving assembly 154 includes a Y-axis motor 1541, a belt 1542, a driving wheel 1543, a driven wheel 1544 and a moving member 1545, wherein the driving wheel 1543 is connected with the Y-axis motor 1541, the driving wheel 1543 is coupled with the driven wheel 1544 through the belt 1542, the moving member 1545 is connected with the belt 1542, and a plurality of placement positions 1545C for placing the cartridges 300 are formed on the moving member 1545.
Referring to fig. 8, 9, 10 and 11, the Z-axis moving assembly 155 includes a Z-axis motor 1551, a ball screw 1552, a guide bar 1553 and a first slider 1554, the Z-axis motor 1551 and the guide bar 1553 are fixedly installed on the main body frame 151, the first slider 1554 is slidably installed on the ball screw 1552 and the guide bar 1553, and the bracket 152 is connected with the first slider 1554.
Referring to fig. 8, 9, 10 and 11, in one possible embodiment, the Y-axis moving assembly 154 further includes a guide track 1546 and a second slider 1547, the second slider 1547 is slidably mounted on the guide track 1546, the moving member 1545 includes a moving plate 1545A and a plurality of cylinder groups 1545B fixedly mounted on the moving plate 1545A, the plurality of cylinder groups 1545B are disposed on the moving plate 1545A at intervals, a placement position 1545C is formed between adjacent cylinder groups 1545B, and the moving plate 1545A is fixedly connected to the second slider 1547. Illustratively, a plurality of placement sites 1545C are formed, and one placement site 1545C may place one cartridge 300. One column group 1545B includes two columns respectively provided at both ends of the moving plate 1545A. The Y-axis moving assembly 154 is provided with the guide rail 1546 and the second sliding block 1547, so that stability and accuracy of the moving member 1545 in the moving process are improved, and control accuracy is improved. The loading process includes a Y-axis motor 1541 for driving the cartridge 300 to move along the Y-axis direction such that the cartridge 300 is disposed on the carrier 152. Thereafter, the Z-axis motor 1551 drives the carriage 152 to rise in the Z-axis direction to the loading level, and thereafter the X-axis moving assembly 153 moves in the X-axis direction to push the jig 400 in the magazine 300 onto the rail of the conveyor 120. In this embodiment, the structure of the blanking module 160 is the same as that of the loading module 150, during blanking, the moving gripper 122 of the conveying device 120 is utilized to push the jig 400 into the material box 300, the Z-axis motor 1551 drives the bracket 152 to descend along the Z-axis direction, and then the Y-axis motor 1541 is used to drive the material box 300 to move along the Y-axis direction to move out the material box 300, so as to finish blanking.
Referring to fig. 17, a second object of the present invention is to provide a detection method, using the AOI detector 100, comprising:
presetting appearance defect characteristics, a position deviation range and a position characteristic range;
Moving the optical device 200 to the first detection position 111 by the conveying means 120;
Appearance information of the wafer 220 is obtained, and first position information of the wafer 220 on the substrate 210 is obtained, wherein the first position information includes, for example, a position distance and a position angle of the wafer 220 on the substrate 210. The appearance information includes the appearance state of the upper surface of the wafer 220, and it is checked whether it has breakage, cracks, stains, or the like.
Comparing the first position information with the position deviation range, and comparing the appearance information with the appearance defect characteristics, if the first position information is in the position deviation range and the appearance information does not accord with the appearance defect characteristics, transferring the optical device 200 to a second detection position 112 for the next detection process, and if the first position information exceeds the position deviation range and/or the appearance information accords with the appearance defect characteristics, marking the optical device;
acquiring position characteristic information of a wire 230 positioned on the optical device 200;
Comparing the position characteristic information with the position characteristic range, if the position characteristic information accords with the position characteristic range, judging that the optical device 200 is qualified, and if the position characteristic information does not accord with the position characteristic range, marking the optical device.
Referring to fig. 13, 14 and 17, in one possible embodiment, the position feature information includes height information, length information and bending angle information of the conductive wire 230, the position feature range includes a height position range, a length position range and a bending angle range, wherein the height information is compared with the height position range, the length information is compared with the length position range, the bending angle information is compared with the bending angle range, and one of the height information, the length information and the bending angle information does not conform to the position feature range, and it is determined that the optical device 200 is failed. Illustratively, the wafer 220 is disposed on the substrate 210, one end of the wire 230 has a solder joint with the wafer 220, and the other end has a solder joint with the substrate 210, because the wire 230 cannot be in epitaxial contact with the wafer 220 to avoid a circuit short circuit, and the wire 230 is in a bent state between the two solder joints, that is, the length of the wire 230 should be greater than the linear distance between the two solder joints. In the fabrication, the length of the guide should be controlled within a certain length range, specifically, the height D of the wafer 220 is defined, and the height H of the wire 230 is set to be within the range of [1/2D, D ], for example, the height H of the wire 230 may be equal to 1/2D, or 2/3D, or 3/4D, or 4/5D. Defining the distance between two adjacent wafers 220 as L, the height H of the wires 230 should satisfy H <1/2L, avoiding cross contact between adjacent wires 230. It should be noted that H <1/2L and 1/2 D≥H≥D should be satisfied simultaneously. Defining the bending angle of the wire 230 as α, the value range of the bending angle α of the wire 230 is within the range of [75 °,135 ° ], and the meaning of limiting the bending angle of the wire 230 is to avoid the contact between the wire 230 and the wafer 220 to cause a short circuit. The length of the wire 230 is defined as S, and the value of the length S of the wire 230 ranges from [2.5d,5d ]. In one aspect, the length, the bending angle and the height of the wire 230 are limited, so that the uniformity of the product is improved, the positions of the two welding spots are fixed, and the length of the wire 230 is fixed, which is more beneficial to the uniformity of the bending angle and the height thereof when the wire 230 is connected.
In addition, when the present invention is applied TO the TO optical device 200, the length S, the height H, and the specific standard value of the bending angle α of the wire 230 may be set according TO the actual situation, and the height position range, the length position range, and the bending angle range may be set according TO the standard values thereof, for example, the length S of the wire 230 is set TO 4D, the bending angle α is set TO 100 °, the height H is set TO 3/4D, then 4D is the length standard value of the length S, 100 ° is the angle standard value of the bending angle α, and 3/4D is the height standard value of the height H. The height position range is the allowable deviation range of the height standard value, the length position range is the allowable deviation range of the length standard value, and the angle standard value is the allowable deviation range of the bending angle range. The length S of the wire 230 is obtained by extracting a three-dimensional stereoscopic image of the wire 230 by the second detecting unit 142, that is, the length information of the wire 230 acquired by the second detecting means 140 is equal to or close to the actual length of the wire 230. The specific numerical values of the method can be set according to actual conditions, and are not repeated here.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
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| CN112414656A (en) * | 2020-11-06 | 2021-02-26 | 中国电子科技集团公司第十四研究所 | Cabin section vibration test automatic transmission installation system |
| CN114955471A (en) * | 2022-05-20 | 2022-08-30 | 东莞市冠佳电子设备有限公司 | Automatic test equipment for air tightness of water channel and cavity |
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| CN112414656A (en) * | 2020-11-06 | 2021-02-26 | 中国电子科技集团公司第十四研究所 | Cabin section vibration test automatic transmission installation system |
| CN114955471A (en) * | 2022-05-20 | 2022-08-30 | 东莞市冠佳电子设备有限公司 | Automatic test equipment for air tightness of water channel and cavity |
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