CN119689218A - Chip testing device - Google Patents
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- CN119689218A CN119689218A CN202411999724.1A CN202411999724A CN119689218A CN 119689218 A CN119689218 A CN 119689218A CN 202411999724 A CN202411999724 A CN 202411999724A CN 119689218 A CN119689218 A CN 119689218A
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Abstract
本申请提供一种芯片测试装置，涉及测试设备技术领域，包括机箱，机箱内沿第一方向设置有背板，将机箱内划分为沿第二方向并排的第一区和第二区，第一区沿第三方向由下向上层叠有至少两个升降液冷模块和至少两个待测芯片模块，待测芯片模块与机箱抽拉连接，升降液冷模块对待测芯片模块进行散热，第一区和第二区通过背板通信连接，保证待测芯片模块在正常运行的同时完成高低温试验；第二区沿第三方向由下向上层叠有驱动模块和辅助模块，驱动模块同层设置有控制模块，驱动模块与升降液冷模块连接，辅助模块与待测芯片模块连接，控制模块分别与待测芯片模块、升降液冷模块、驱动模块和辅助模块电连接，第一方向、第二方向和第三方向两两垂直。
The present application provides a chip testing device, which relates to the technical field of testing equipment, including a chassis, a backplane is arranged in the chassis along a first direction, and the chassis is divided into a first area and a second area arranged side by side along a second direction, at least two lifting liquid cooling modules and at least two chip modules to be tested are stacked from bottom to top in the first area along a third direction, the chip modules to be tested are connected to the chassis by pulling, the lifting liquid cooling module dissipates heat for the chip modules to be tested, the first area and the second area are connected by backplane communication, so as to ensure that the chip modules to be tested complete high and low temperature tests while operating normally; a driving module and an auxiliary module are stacked from bottom to top in the second area along the third direction, a control module is arranged on the same layer as the driving module, the driving module is connected to the lifting liquid cooling module, the auxiliary module is connected to the chip module to be tested, the control module is electrically connected to the chip module to be tested, the lifting liquid cooling module, the driving module and the auxiliary module respectively, and the first direction, the second direction and the third direction are perpendicular to each other.
Description
Technical Field
The application relates to the technical field of test equipment, in particular to a chip test device.
Background
With the continuous development and progress of AI (ART I FICIA L I NTE L L IGENCE ) technology, AI chips become a key element of the development of the technology. In performance testing of AI chips, high and low temperature tests are a routine operation. The existing test equipment has lower test efficiency, mainly because the loading process of replacing the chip to be tested in the test process is complex, the automation degree of the test process is lower, and the test efficiency is further influenced, meanwhile, the dependency of the existing test on operation staff is higher, the unstable factors in the test process are increased, and the test accuracy is also influenced to a certain extent.
Disclosure of Invention
The embodiment of the application aims to provide a chip testing device which can improve the degree of automation of testing and improve the testing efficiency and the testing accuracy.
In one aspect of the embodiment of the application, a chip testing device is provided, which comprises a chassis, wherein a back plate is arranged in the chassis along a first direction so as to divide the interior of the chassis into a first area and a second area which are parallel along a second direction, at least two lifting liquid cooling modules and at least two chip modules to be tested are stacked from bottom to top along a third direction, the chip modules to be tested are connected with the chassis in a pulling manner, the lifting liquid cooling modules dissipate heat of the chip modules to be tested, and the first area and the second area are connected through the back plate in a communication manner so as to ensure that the chip modules to be tested can finish high-low temperature tests while operating normally;
The second area is provided with a driving module and an auxiliary module in a stacking mode from bottom to top along the third direction, the driving module is provided with a control module on the same layer, the driving module is connected with the lifting liquid cooling module and used for achieving lifting of the lifting liquid cooling module, the auxiliary module is connected with the chip module to be tested and used for guaranteeing normal operation of the chip module to be tested, the control module is respectively and electrically connected with the chip module to be tested, the lifting liquid cooling module, the driving module and the auxiliary module, and the first direction, the second direction and the third direction are perpendicular to each other.
Optionally, the chip module that awaits measuring includes the test carrier, be provided with buckle and the chip that awaits measuring on the test carrier, the chip module that awaits measuring sets up the one side orientation of chip that awaits measuring the lift liquid cooling module, the buckle orientation the tip of backplate is provided with first connector, the backplate orientation the tip of buckle is provided with the second connector, first connector with the second connector is pegged graft, realizes the chip module that awaits measuring with the communication connection of backplate.
Optionally, a power connector is further disposed on a side of the back plate facing the chip module to be tested, a power interface is correspondingly disposed on a side of the back plate facing the chip module to be tested, and the power interface of the chip module to be tested is plugged with the power connector of the back plate to realize electrical connection of the chip module to be tested.
Optionally, the lifting liquid cooling module comprises a lifting carrier, a lifting mechanism arranged on the lifting carrier, and a liquid cooling module arranged on the lifting mechanism, wherein the lifting mechanism lifts the liquid cooling module to enable the liquid cooling module to be in contact with the chip to be tested.
Optionally, the lifting mechanism is further provided with a jumper module, the chip module to be tested comprises a PCB board, the jumper module is connected with the PCB board and the buckle board, the lifting mechanism performs primary synchronous lifting on the liquid cooling module and the jumper module, and then performs secondary lifting on the jumper module, so that the jumper module and the PCB board are spliced.
Optionally, a third connector is arranged on the PCB of the chip module to be tested, a fourth connector is arranged on the buckle plate, a jumper board is arranged on the jumper module, one end of the jumper board is used for being inserted on the fourth connector, and the other end of the jumper board is used for being inserted on the third connector.
Optionally, the jacking carrier with the quick-witted case pull is connected, be provided with the pulley on the jacking carrier, the quick-witted incasement sets up the hole, through the pulley with the hole cooperation is in order to fix the lift liquid cooling module with the relative position of quick-witted case.
Optionally, the driving module is further provided with an interface board and an external device on the same layer, and the interface board protrudes from the auxiliary module along the second direction away from one end of the chip module to be tested.
Optionally, a guide rail is disposed on one side of the chassis along the second direction, and the chassis is in push-pull fit with the cabinet through the guide rail.
Optionally, the auxiliary module is further provided with a heat dissipation module on the same layer, the heat dissipation module dissipates heat of the control module, and the control module is electrically connected with the heat dissipation module.
According to the chip testing device provided by the embodiment of the application, the chip testing device is designed as the independent chassis, the chassis is of a standard 4U chassis size and can be placed into a standard ORv machine frame, the single chassis can realize performance testing of at least two chip modules to be tested, and when a plurality of chassis are stacked in the machine cabinet, the performance testing of a plurality of groups of chip modules to be tested is realized, so that the testing efficiency can be greatly improved. The chassis is conveniently stacked in the cabinet, and can be flexibly configured according to actual requirements, so that different testing requirements are met. The chip module to be tested adopts a drawing arrangement, so that different chips to be tested can be conveniently replaced for testing. The lifting liquid cooling module adopts an automatic lifting mode, so that the testing efficiency is greatly improved, and the lifting liquid cooling module dissipates heat of the chip module to be tested, so that the normal work of the chip module to be tested is ensured. The auxiliary module guarantees normal operation of the chip module to be tested, and the driving module is used for achieving lifting of the lifting liquid cooling module. The application adopts modularized arrangement, each module is reasonably distributed in the case, and is used for ensuring that the chip module to be tested completes high-low temperature test while operating normally in a limited space, and the application is convenient to detach, simplifies the original complex loading flow and reduces the skill requirement for operators. Meanwhile, each module and the whole machine are automatically controlled through the control module, so that the overall automatic function of the device is further improved, the testing efficiency is improved, and meanwhile, the testing accuracy can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an external appearance of a chip testing apparatus according to the present embodiment;
FIG. 2 is a schematic diagram of a case of a chip testing apparatus according to the present embodiment;
FIG. 3 is a second schematic diagram of a case of the chip test apparatus according to the present embodiment;
fig. 4 is a schematic drawing showing a drawing state of a chip module to be tested of the chip test device according to the present embodiment;
Fig. 5 is a schematic diagram of a drawing state of a lifting liquid cooling module of the chip test device according to the embodiment;
FIG. 6 is a schematic diagram of a first area of a chip test apparatus according to the present embodiment;
FIG. 7 is a schematic diagram of a second area of the chip test apparatus according to the present embodiment;
FIG. 8 is a second schematic diagram of a second area of the chip test apparatus according to the present embodiment;
FIG. 9 is a schematic diagram of a chip module to be tested of the chip test apparatus according to the present embodiment;
FIG. 10 is a schematic diagram of a test carrier of the chip test apparatus according to the present embodiment;
FIG. 11 is a schematic view of a buckle plate structure of a chip testing device according to the present embodiment;
FIG. 12a is a schematic diagram of a back plate of a chip test apparatus according to the present embodiment;
FIG. 12b is a schematic diagram of a back plate of the chip test apparatus according to the second embodiment;
FIG. 13 is a schematic view showing a connection structure between a back plate and a buckle plate of the chip testing device according to the present embodiment;
fig. 14 is a schematic structural diagram of a jacking mechanism of the chip testing device according to the present embodiment;
fig. 15 is a schematic structural diagram of a lifting carrier of a chip test apparatus according to the present embodiment.
The icons are 10-chassis, 10A-first area, 10B-second area, 101-top board, 102-bottom board, 102 a-hole, 103-side board, 104-dust screen, 105-guide rail, 106-back board, 106 a-second connector, 106B-power connector, 106 c-guide pin, 106 d-function interface, 11-chip module to be tested, 110-test carrier, 111-buckle board, 112-first connector, 113-PCB board, 114-third connector, 12-lifting liquid cooling module, 120-handle, 121-front panel, 122-display screen, 123-button, 124-lifting mechanism, 125-lifting carrier, 126-pulley, 13-auxiliary module, 14-heat dissipation module, 15-driving module, 16-control module, 17-interface board, 18-water break switch, F1-first direction, F2-second direction, F3-third direction.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.
In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put in use of the product of this application, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
It should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed" and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, directly connected, indirectly connected through an intermediate medium, or communicating between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1, an embodiment of the application provides a chip testing device, which comprises a chassis 10, wherein a back plate 106 is disposed in the chassis 10 along a first direction F1 to divide the interior of the chassis 10 into a first area 10A and a second area 10B along a second direction F2, the first area 10A is laminated with at least two lifting liquid cooling modules 12 and at least two chip modules 11 to be tested from bottom to top along a third direction F3, the chip modules 11 to be tested are connected with the chassis 10 in a pulling manner, the lifting liquid cooling modules 12 dissipate heat of the chip modules 11 to be tested, and the first area 10A and the second area 10B are connected in a communication manner through the back plate 106 to ensure that the chip modules 11 to be tested complete high-low temperature tests while operating normally.
The second area 10B is provided with a driving module 15 and an auxiliary module 13 from bottom to top in a lamination manner along a third direction F3, the driving module 15 is provided with a control module 16 on the same layer, the auxiliary module 13 is provided with a heat dissipation module 14 on the same layer, the driving module 15 is connected with the lifting liquid cooling module 12 for realizing lifting of the lifting liquid cooling module 12, the auxiliary module 13 is connected with the chip module 11 to be tested for ensuring normal operation of the chip module 11 to be tested, the heat dissipation module 14 dissipates heat of the control module 16, and the control module 16 is respectively and electrically connected with the chip module 11 to be tested, the lifting liquid cooling module 12, the driving module 15, the auxiliary module 13 and the heat dissipation module 14, wherein the first direction F1, the second direction F2 and the third direction F3 are perpendicular to each other.
As shown in fig. 2 and 3, the enclosure 10 is a standard 4U enclosure size to fit into a cabinet so that the enclosure 10 can be easily stacked in the cabinet. According to the application, a plurality of chip testing devices can be stacked in the cabinet, each chip testing device can radiate heat of at least two chip modules 11 to be tested, when the plurality of chip testing devices are stacked, space can be saved, after the plurality of chip testing devices are stacked, heat of a plurality of groups of chip modules 11 to be tested can be radiated at the same time, and test efficiency is improved.
Illustratively, the chassis 10 includes a bottom plate 102, a side plate 103, and a top plate 101, where the bottom plate 102, the side plate 103, and the top plate 101 are connected by screws, and have good structural stability. The chassis 10 is a semi-closed structure with front and rear openings along the second direction F2, the front opening of the chassis 10 is used for conveniently pushing and pulling the chip module 11 to be tested and the lifting liquid cooling module 12, and the rear opening of the chassis 10 is used for conveniently arranging the interface board 17 of fig. 7 to be in butt joint with equipment of a customer.
The side plates 103 may be porous plates, which can not only eliminate stress, but also reduce the dead weight of the chassis 10, and facilitate heat dissipation of the chassis 10. A dust screen 104 is covered outside the side plate 103 for dust prevention, and a guide rail 105 is installed outside the dust screen 104 so that the cabinet 10 can be easily pushed into the cabinet. The bottom plate 102 is provided with a hole 102a to accommodate a pulley 126 (fig. 13) of the lifting liquid cooling module 12, and the relative positions of the chassis 10 and the lifting liquid cooling module 12 are fixed by the cooperation of the pulley 126 and the hole 102a, and the lifting liquid cooling module 12 can be pushed into the chassis 10 through the pulley. The pulley 126 at the bottom of the lifting liquid cooling module 12 is matched with the case 10, and the guide rail 105 of the side plate 103 of the case 10 is matched with the cabinet, so that when the lifting liquid cooling module 12 is pushed into the case 10 and the whole chip testing device is pushed into the cabinet, the manual load can be reduced, and the chip testing device is stable in structure. Through tests, the single side stress of the case 10 is 1600N, the maximum deformation is about 0.03mm, and the average deformation of the middle part is about 0.023mm.
As shown in fig. 3, a back plate 106 is disposed in the chassis 10, the back plate 106 is disposed along a first direction F1 of the chassis 10, the back plate 106 divides the interior of the chassis 10 into a first area 10A and a second area 10B along two sides of the back plate 106, the first area 10A and the second area 10B are arranged side by side along a second direction F2, and in the present application, the first direction F1 is a width direction of the chassis 10, the second direction F2 is a length direction of the chassis 10, the first area 10A is located at a front end of the chassis 10, and the second area 10B is located at a rear end of the chassis 10.
In the high-low temperature test process of the AI chip, on one hand, the normal operation of the AI chip is ensured, and on the other hand, the heat dissipation problem of the chip is solved, so that the chip is prevented from being damaged. The present test equipment generally adopts a heat dissipation cold plate to dissipate heat, and the heat dissipation cold plate is generally contacted with the chip to be tested through a pressing mechanism, so that the heat dissipation cold plate is pressed on the chip to be tested. However, the pressing mechanism itself has a weight, and there is a risk of damaging the chip to be tested.
In the present application, as shown in fig. 4 to 6, in the first area 10A, the lifting liquid cooling module 12 and the chip module 11 to be tested are stacked in the third direction F3, i.e., the height direction of the chassis 10, and heat dissipation can be performed on the chip module 11 to be tested by the lifting liquid cooling module 12. The contact surface of the lifting liquid cooling module 12 and the chip module 11 to be tested is provided with a heat conducting material, and the heat conducting material is used for filling up a tiny gap between the lifting liquid cooling module 12 and the chip module 11 to be tested and enhancing the heat dissipation effect. The chip module 11 to be tested is located above the lifting liquid cooling module 12, so that the replacement of the heat conducting material can be facilitated, the pressure on the chip module 11 to be tested caused by the weight of the lifting liquid cooling module 12 can be avoided, and the damage probability of the chip module 11 to be tested is reduced.
As shown in fig. 4, the chip module 11 to be tested is connected with the chassis 10 in a pulling manner, so that the chip module 11 to be tested is conveniently pulled out of the chassis 10 in a pulling manner, and different chips to be tested are replaced for performance test. Illustratively, the chip module under test 11 and the back plane 106 may be communicatively connected for performance testing of the chip module under test 11.
The lifting liquid cooling module 12 can lift in the case 10, and in the third direction F3, when the lifting liquid cooling module 12 lifts to a position attached to the chip module 11 to be tested, heat dissipation can be performed on the chip module 11 to be tested, and when the lifting liquid cooling module 12 descends to a position spaced from the chip module 11 to be tested, the chip module 11 to be tested can be conveniently pulled out from the case 10, so that different chips to be tested can be replaced for performance test. After the chip to be tested is replaced, the chip module to be tested 11 is pushed into the case 10 again, and then the lifting liquid cooling module 12 is lifted to a position attached to the chip module to be tested 11, so that heat dissipation is carried out on the chip module to be tested 11. So, when realizing carrying out the performance test to the chip module 11 to be tested, the chip module 11 to be tested also dissipates heat.
According to the application, at least two chip modules 11 to be tested and at least two lifting liquid cooling modules 12 are arranged in a one-to-one correspondence manner, and when a plurality of chip modules 11 to be tested and a plurality of lifting liquid cooling modules 12 are arranged, performance test and heat dissipation can be carried out on a plurality of groups of chip modules 11 to be tested at the same time, so that the test efficiency is improved in a limited space.
As shown in fig. 4 and 5, two chip modules 11 to be tested and lifting liquid cooling modules 12 are respectively arranged symmetrically along the first direction F1, and the two chip modules 11 to be tested and the lifting liquid cooling modules 12 can share the control module 16 and the interface board 17 in fig. 7 and 8.
The second zone 10B is laminated with a driving module 15 and an auxiliary module 13 along the third direction F3, the auxiliary module 13 being provided with a heat dissipation module 14 in the same layer, the driving module 15 being provided with a control module 16 in the same layer.
The auxiliary module 13 is matched with the chip module 11 to be tested, and the auxiliary module 13 is used for ensuring the normal operation of the chip module 11 to be tested. The driving module 15 is connected with the lifting liquid cooling module 12, and the driving module 15 is used for driving the lifting liquid cooling module 12 to lift. The heat dissipation module 14 may be a heat dissipation fan for dissipating heat from a motherboard within the control module 16. The control module 16 is electrically connected with the chip module 11 to be tested, the auxiliary module 13, the lifting liquid cooling module 12 and the heat dissipation module 14 respectively, so as to realize automatic control on the modules and the whole machine, and enable the modules to coordinate and work cooperatively. A water-break switch 18 is further disposed on one side of the control module 16 along the first direction F1, the control module 16 is electrically connected to the water-break switch 18, and the water-break switch 18 is used for controlling the waterway operation of the chip testing device.
In addition, the module of the application is laid out in an upper layer and a lower layer along the third direction F3, the upper layer and the lower layer are designed in a step-difference mode, the lower layer protrudes out of the upper layer, the protruding part of the lower layer is an interface board 17, and the chip testing device of the application is in butt joint with customer equipment through the interface board 17.
The interface board 17 and the driving module 15 are arranged on the same layer, and are far away from one end of the chip module 11 to be tested along the second direction F2, and the interface board 17 protrudes out of the auxiliary module 13 to form a step-type design which can be perfectly combined with customer equipment in a limited space.
In summary, the chip testing device provided by the embodiment of the application is designed for the independent chassis 10, the chassis 10 has a size width and a height of standard 4U chassis size, the chip testing device can be placed into a standard ORv machine frame, a single chassis 10 can realize performance testing of at least two chip modules 11 to be tested, and when a plurality of chassis 10 are stacked in a machine cabinet, performance testing of a plurality of groups of chip modules 11 to be tested is realized, so that the testing efficiency can be greatly improved. The chassis 10 is conveniently stacked in the cabinet, and can be flexibly configured according to actual requirements, so as to meet different testing requirements. The lifting liquid cooling module 12 adopts an automatic lifting mode to realize heat dissipation of the chip module 11 to be tested, so that the testing efficiency is greatly improved, and the normal work of the chip module 11 to be tested is ensured by heat dissipation of the chip module 11 to be tested. The application adopts modularized arrangement, reasonably distributes in the case 10, is used for ensuring that the chip module 11 to be tested completes high-low temperature test while operating normally in a limited space, can be conveniently disassembled, simplifies the original complex loading flow and reduces the skill requirement of operators. Meanwhile, other modules and the whole machine are automatically controlled through the control module 16, so that the overall automatic function of the device is further improved, the testing efficiency is improved, and meanwhile, the testing accuracy can be improved.
Specifically, referring to fig. 9 to 11, the chip module 11 to be tested includes a test carrier 110, a test chip and a buckle 111 are disposed on the test carrier 110, and a surface of the chip module 11 to be tested, where the chip is disposed, faces the lifting liquid cooling module 12, so that the chip module 11 to be tested is pushed into the chassis 10 in a downward direction of the test chip so as to be attached to the lifting liquid cooling module 12, and dissipate heat of the chip to be tested.
As shown in fig. 12a and 13, a first connector 112 is disposed at an end of the buckle 111 facing the back plate 106, and a second connector 106a is disposed at an end of the back plate 106 facing the buckle 111, when the chip module 11 to be tested is pushed into the chassis 10, the first connector 112 is plugged into the second connector 106a of the back plate 106, so as to realize communication connection between the chip module 11 to be tested and the back plate 106, so as to be used for performing performance test on the chip to be tested.
Through the connection between the back plate 106 and the buckle plate 111, cables can be saved, the internal space of the case 10 is increased, a plurality of groups of chip modules 11 to be tested and corresponding lifting liquid cooling modules 12 are arranged in the case 10 conveniently, and meanwhile, heat dissipation is carried out on the plurality of groups of chips to be tested.
The side of the back plate 106 facing the chip module 11 to be tested is further provided with a power connector 106b and a guide pin 106c, and the side of the chip module 11 to be tested facing the back plate 106 is correspondingly provided with a power interface, and when the first connector 112 and the second connector 106a are in blind insertion, the power interface of the chip module 11 to be tested is further inserted into the power connector 106b of the back plate 106, so as to realize the electrical connection of the chip module 11 to be tested. The guide pin 106c facilitates the guide alignment of the chip module 11 to be tested and the back plate 106, and realizes accurate plugging.
As shown in fig. 12B, a side of the back board 106 away from the chip module 11 to be tested, that is, a side of the back board 106 facing the second area 10B, is designed with multiple different functional interfaces 106d, so that the modules in the first area 10A and the second area 10B in front of and behind the back board 106 can be in communication connection, thereby saving most cables when the cables are used for connection in the prior art, increasing the internal space of the chassis 10, further making the interior of the chassis 10 cleaner and tidier, and reducing risk points.
As shown in fig. 14 and 15, the lifting liquid cooling module 12 includes a lifting carrier 125, a lifting mechanism 124, a liquid cooling module and a jumper module, wherein the lifting carrier 125 can push the lifting liquid cooling module 12 into the chassis 10 or pull the lifting liquid cooling module out of the chassis 10, the lifting mechanism 124 is disposed on the lifting carrier 125, and the lifting mechanism 124 is used for lifting the liquid cooling module, so that the liquid cooling module contacts with the chip to be tested to achieve the optimal heat dissipation effect.
In some embodiments, the liquid cooling module includes a heat dissipation cold plate, the purpose of the lifting mechanism 124 is to support the heat dissipation cold plate, the heat dissipation cold plate is opposite to the chip to be tested in position and has a size equivalent to the chip to be tested, and when the lifting mechanism 124 supports the heat dissipation cold plate, the heat dissipation can be performed on the chip to be tested in a targeted manner, so that the heat dissipation effect is good.
The lifting mechanism 124 is further provided with a jumper module, and the jumper module is used for plugging with an interface of the PCB 113 in the chip module 11 to be tested. For example, a third connector 114 is disposed on an interface of the PCB 113 of the chip module 11 to be tested, a fourth connector is correspondingly disposed on the buckle 111, a plurality of jumper boards are designed on the jumper module, the fourth connectors to be communicated are fixedly communicated through cables at the rear ends of the jumper boards, and the front ends of the jumper boards are inserted into the third connector 114, so that the communication or disconnection between the PCB 113 and the buckle 111 in the chip module 11 to be tested can be realized.
The application can realize two-stage lifting through the lifting mechanism 124, wherein the lifting mechanism 124 is one-stage lifting for the liquid cooling module and is two-stage lifting for the jumper module. In specific application, the lifting mechanism 124 drives the liquid cooling module and the jumper module to synchronously lift up at a first stage, so that the liquid cooling module is in contact with the chip to be tested, at the moment, the jumper module is not plugged into the interface of the PCB 113 of the chip module 11 to be tested, and then, the motor inside the jumper module drives the jumper module to lift up at a second stage, so that the plugging of the interface of the jumper module and the PCB 113 of the chip module 11 to be tested is completed.
The number of jumper modules can be multiple, and when the performance of the chip to be tested is tested, part or all of the jumper modules can be selected to be lifted according to the requirement so as to be spliced with the interfaces of the PCB 113 of the chip module 11 to be tested.
Specifically, the chip module 11 to be tested completes the communication connection between the buckle 111 and the PCB 113 through the jumper module, the buckle 111 is in communication connection with the back plate 106, and the auxiliary module 13 is respectively in communication connection with the back plate 106 and the interface board 17, so that the signals of the chip module 11 to be tested are led out from the interface board 17, and the performance test of the chip module 11 to be tested is realized. Other modules refer to the settings and are not described in detail.
In addition, since the lifting liquid cooling module 12 is pushed and pulled to operate at a low frequency, the lifting liquid cooling module 12 is only required to be pulled out from the chassis 10 when the heat conducting material is replaced or the lifting liquid cooling module 12 fails, and in order to facilitate replacement of the heat conducting material, the lifting liquid cooling module 12 is designed as a push-pull mechanism, and when the lifting liquid cooling module 12 is connected with the chassis 10 in a pulling manner, the lifting liquid cooling module 12 is provided with a handle 120 on a front panel 121 located at the front end along the second direction F2, so as to facilitate the pulling operation.
The front panel 121 is further provided with a display 122 for displaying a pressure value, a button 123 for starting and resetting the chip testing apparatus, and other functional accessories to perform corresponding functions.
The above embodiments of the present application are only examples, and are not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
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| CN202411999724.1A CN119689218A (en) | 2024-12-31 | 2024-12-31 | Chip testing device |
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| CN202411999724.1A CN119689218A (en) | 2024-12-31 | 2024-12-31 | Chip testing device |
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| CN115728624A (en) * | 2022-11-23 | 2023-03-03 | 镭神技术（深圳）有限公司 | Laser chip aging unit module and laser chip testing device |
| CN117572195A (en) * | 2023-09-13 | 2024-02-20 | 杭州中安电子有限公司 | System and method for testing high-speed ADC/DAC |
| CN119147938A (en) * | 2024-09-14 | 2024-12-17 | 深圳市精泰达科技有限公司 | Device for testing performance of GPU chip |
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2024
- 2024-12-31 CN CN202411999724.1A patent/CN119689218A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101120260A (en) * | 2005-02-15 | 2008-02-06 | 株式会社爱德万测试 | Pre-burning device |
| CN111880087A (en) * | 2020-09-28 | 2020-11-03 | 上海菲莱测试技术有限公司 | Laser chip aging and LIV test detection method and system |
| CN115728624A (en) * | 2022-11-23 | 2023-03-03 | 镭神技术（深圳）有限公司 | Laser chip aging unit module and laser chip testing device |
| CN117572195A (en) * | 2023-09-13 | 2024-02-20 | 杭州中安电子有限公司 | System and method for testing high-speed ADC/DAC |
| CN119147938A (en) * | 2024-09-14 | 2024-12-17 | 深圳市精泰达科技有限公司 | Device for testing performance of GPU chip |
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