CN119617699A - Miniature wireless electric heating and refrigerating device - Google Patents
Miniature wireless electric heating and refrigerating device Download PDFInfo
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- CN119617699A CN119617699A CN202411830704.1A CN202411830704A CN119617699A CN 119617699 A CN119617699 A CN 119617699A CN 202411830704 A CN202411830704 A CN 202411830704A CN 119617699 A CN119617699 A CN 119617699A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a miniature wireless electric heating and refrigerating device, and relates to the technical field of semiconductor thermoelectric energy conversion. The invention provides a miniature wireless thermoelectric refrigeration device which comprises a wireless power supply mechanism and a semiconductor refrigeration mechanism which are mutually independent, wherein the wireless power supply mechanism comprises a wireless power supply transmitting coil, a first conversion circuit module and a power supply which are sequentially connected, and the semiconductor refrigeration mechanism comprises a miniature semiconductor refrigeration sheet, a second conversion circuit module and a wireless power supply receiving coil which are sequentially connected. The invention adopts the wireless power supply mechanism as the power supply part of the miniature wireless thermoelectric refrigeration device, gets rid of the limitation of the traditional refrigeration mode by the position of a fixed power supply, the wireless power supply transmitting coil can provide a magnetic field in a target area, and the wireless power supply receiving coil can generate induced alternating current in the magnetic field, thereby providing electric energy for the miniature semiconductor refrigeration piece, and realizing the effect that the miniature semiconductor refrigeration piece can provide accurate refrigeration and temperature control for a movable target object.
Description
Technical Field
The invention relates to the technical field of semiconductor thermoelectric energy conversion, in particular to a miniature wireless electric heating and refrigerating device.
Background
The thermoelectric material is used as an advanced clean, safe, stable and pollution-free energy material and has the characteristic of being capable of realizing the mutual conversion of heat energy and electric energy. The thermoelectric energy conversion device based on thermoelectric material design has the advantages of good stability, high reliability, no maintenance, long service life and the like, and is paid attention to in the working process by the advantages of no moving parts, no noise, no vibration, no release of any greenhouse gas, no toxicity, no harm and the like.
The thermoelectric refrigeration technology is a solid-state electronic refrigeration technology, and the purpose of dispelling heat flow in a target area of an object is achieved by applying direct current to a thermoelectric module formed by serially connecting P-type thermoelectric arm thermoelectric materials and N-type thermoelectric arm thermoelectric materials and transmitting heat from one side end surface to the other side end surface of the thermoelectric module under the effect of the Peltier effect.
The thermoelectric refrigerator (Thermoelectric cooler, TEC) made of thermoelectric materials has the advantages of rapidness, no noise, accurate temperature control and the like during refrigeration, can provide accurate and controllable refrigeration and heat dissipation for various devices needing real-time temperature control, such as microelectronic chip heat flux concentration parts, portable medicament storage devices, wearable human-computer interaction devices, consumer electronics and the like, and provides a heat dissipation solution favorable for in-situ refrigeration for solving the heat management problem. The micro thermoelectric refrigerator has high process integration, large thermoelectric pair number in unit area and high refrigerating power in unit area, and can utilize small current in milliamp level to control temperature accurately. Meanwhile, the miniature thermoelectric refrigerator is small in size and convenient for integration of integrated devices, so that the miniature thermoelectric refrigerator can be built in functional equipment to work, and the problem of heat concentration caused by high integration level in a plurality of microcircuits is solved.
In the practical application process of the existing thermoelectric refrigeration technology, the integrated refrigeration device can only work at a fixed position due to the volume, power and line limitation of a direct-current power supply, and the problems of complex line layout, large occupied space and the like exist in an application scene.
In view of the above, there is an urgent need for a refrigeration device that can obviate the limitation of the conventional refrigeration mode due to the fixed power position.
Disclosure of Invention
In order to solve the problems, the invention provides the miniature wireless thermoelectric refrigeration device, which gets rid of the limitation of the traditional refrigeration mode by the position of a fixed power supply, and realizes the effect that the miniature semiconductor refrigeration sheet can provide accurate refrigeration and temperature control for a movable target object.
The invention provides a miniature wireless thermoelectric refrigerating device which comprises a wireless power supply mechanism and a semiconductor refrigerating mechanism which are mutually independent, wherein the wireless power supply mechanism comprises a wireless power supply transmitting coil, a first converting circuit module and a power supply which are sequentially connected, the semiconductor refrigerating mechanism comprises a miniature semiconductor refrigerating piece, a second converting circuit module and a wireless power supply receiving coil which are sequentially connected, the power supply is used for providing alternating current for the first converting circuit module, the first converting circuit module is used for adjusting the frequency and the power of the alternating current provided by the power supply, the wireless power supply transmitting coil is used for generating a magnetic field, the wireless power supply receiving coil is used for generating induced alternating current in the magnetic field generated by the wireless power supply transmitting coil through an electromagnetic induction principle, the second converting circuit module is used for converting the induced alternating current generated by the wireless power supply receiving coil into direct current and adjusting the power of the direct current, and the miniature semiconductor refrigerating piece is used for providing a refrigerating function.
In some possible embodiments, the volume of the wireless power supply mechanism is 10-20 cm 3, and/or the size of the micro semiconductor refrigeration piece is 0.2-0.7 cm 0.1-0.5 cm, and/or the input current of the micro semiconductor refrigeration piece is 0-800 mA, and/or the temperature difference which can be generated by the micro semiconductor refrigeration piece is 0-63 ℃, and/or the refrigeration power of the micro semiconductor refrigeration piece is 0-0.38W;
In a possible implementation manner, the miniature semiconductor refrigerating sheet sequentially comprises a refrigerating layer, a top electrode layer, a thermoelectric element layer, a bottom electrode layer and a heat release layer from top to bottom, wherein the thermoelectric element layer comprises a plurality of groups of thermoelectric elements, each group of thermoelectric elements comprises a P-type thermoelectric arm and an N-type thermoelectric arm, the top electrode layer comprises a plurality of top electrode sheets, the bottom electrode layer comprises a plurality of bottom electrode sheets, the tops of the P-type thermoelectric arms and the tops of the N-type thermoelectric arms in the thermoelectric elements in the same group are connected through the top electrode sheets, the bottoms of the P-type thermoelectric arms and the bottoms of the N-type thermoelectric arms in the thermoelectric elements in adjacent and different groups are connected through the bottom electrode sheets, and the second conversion circuit module is connected with the bottom electrode sheets positioned at two ends of the thermoelectric element layer through wires.
In a possible implementation manner, the top electrode plate and the bottom electrode plate are made of conductive metal, the refrigerating layer and the heat release layer are made of ceramic substrates, the P-type thermoelectric arm is Bi 0.5Sb1.5Te3, and the N-type thermoelectric arm is Bi 2Se0.3Te2.7.
In a possible implementation manner, the materials of the top electrode slice and the bottom electrode slice are copper or gold, and the materials of the refrigeration layer and the heat release layer are aluminum oxide or aluminum nitride.
In some possible implementations, the outer diameter of the wireless power supply transmitting coil is 5-10 cm, and/or the alternating current power provided by the first conversion circuit module is 20-30 w, and/or the alternating current frequency provided by the first conversion circuit module is 100-200 KHz, and/or the magnetic field provided by the wireless power supply transmitting coil is 10-50 mu T, and/or the magnetic field space provided by the wireless power supply transmitting coil is 5-15 cm by 2-8 cm.
In a possible implementation manner, the induced current generated by the wireless power supply receiving coil is 0-500 mA, and/or the output voltage of the second conversion circuit module is 0-5V, and the output current is 0-800 mA.
In a possible implementation manner, the micro wireless thermoelectric cooling device radiates heat through air convection under an idle condition, the distance between the wireless power supply transmitting coil and the wireless power supply receiving coil is less than 1cm, induced current generated by the wireless power supply receiving coil is 60-80 mA, output power of the wireless power supply receiving coil is 0.28-0.48 w, cooling power of the micro semiconductor cooling sheet is 0.28-0.48 w, and a temperature difference of 10-20 ℃ is established within 5-10 s.
In a possible implementation manner, the micro wireless thermoelectric cooling device radiates heat through metal conduction under an idle condition, the distance between the wireless power supply transmitting coil and the wireless power supply receiving coil is less than 1cm, induced current generated by the wireless power supply receiving coil is 60-80 mA, output power of the wireless power supply receiving coil is 0.28-0.48 w, cooling power of the micro semiconductor cooling sheet is 0.28-0.48 w, and a temperature difference of 20-30 ℃ is established within 80-100 s.
In a possible implementation manner, under the condition that a bionic prosthesis made of an organic material is used as a test carrier, a radiating surface is placed in air, heat is radiated through air convection, the distance between a wireless power supply transmitting coil and a wireless power supply receiving coil is smaller than 1cm, induced current generated by the wireless power supply receiving coil is 60-80 mA, the output power of the wireless power supply receiving coil is 0.28-0.48 w, the refrigerating power of a miniature semiconductor refrigerating sheet is 0.28-0.48 w, and a temperature difference of 10-20 ℃ is established within 5-10 s.
The invention provides a miniature wireless thermoelectric refrigeration device, which comprises the following beneficial effects:
1) The invention adopts the wireless power supply mechanism as the power supply part of the miniature wireless thermoelectric refrigeration device, gets rid of the limitation of the traditional refrigeration mode by the position of a fixed power supply, the wireless power supply transmitting coil can provide a magnetic field in a target area, and the wireless power supply receiving coil can generate induced alternating current in the magnetic field, thereby providing electric energy for the miniature semiconductor refrigeration piece, and realizing the effect that the miniature semiconductor refrigeration piece can provide accurate refrigeration and temperature control for a movable target object.
2) The wireless power supply transmitting coil and the wireless power supply receiving coil adopted by the invention can change the current by changing the distance between the wireless power supply transmitting coil and the wireless power supply receiving coil, namely the magnitude of induced current changes along with the distance between the wireless power supply transmitting coil and the wireless power supply transmitting coil, and the magnitude of current input by the miniature semiconductor refrigerating sheet changes along with the space, so that the refrigerating effect changes along with the position change of a target area.
3) The miniature wireless thermoelectric refrigerating device has high refrigerating speed, and the target thermoelectric area can be rapidly cooled and maintained at a certain temperature difference by applying pulse current to the wireless induction power supply module, so that the original working process of the miniature wireless thermoelectric refrigerating device is not interrupted.
Drawings
Fig. 1 is a schematic structural diagram of a wireless power supply mechanism in the present invention.
Fig. 2 is a schematic structural diagram of a semiconductor refrigeration mechanism according to the present invention.
Fig. 3 is a schematic diagram of the operation of the present invention.
Fig. 4 is a schematic structural view of a micro semiconductor refrigeration sheet according to the present invention.
Fig. 5 is a graph of performance test data of the present invention in an unloaded state with heat dissipation through air.
Fig. 6 is a graph of performance test data for heat dissipation through brass in an unloaded state of the invention.
Fig. 7 is a graph of performance test data for the application of the present invention to a prosthesis.
Reference numerals
Wireless power supply mechanism 1
Wireless power supply transmitting coil 11
First conversion circuit module 12
Power supply 13
Semiconductor refrigeration mechanism 2
Wireless power supply receiving coil 21
Second conversion circuit module 22
Micro semiconductor refrigerating plate 23
Refrigerating layer 3
Top electrode layer 31
Top electrode sheet 31a
Thermoelectric element layer 32
P-type thermoelectric leg 32a
N-type thermoelectric leg 32b
Bottom electrode layer 33
Bottom electrode sheet 33a
Heat release layer 34
Heating platform 4
Prosthesis 5
Contact position Sp1 of prosthesis and refrigerating layer
Prosthesis quarter site Sp2
One-half part Sp3 of prosthesis
Heating platform and prosthesis contact surface Sp4
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "left", "right", "upper", "lower", "above", "below", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
The embodiment of the invention provides a miniature wireless thermoelectric refrigeration device, referring to fig. 1 and 2, comprising a wireless power supply mechanism 1 and a semiconductor refrigeration mechanism 2 which are mutually independent, wherein in a specific embodiment, the volume of the semiconductor refrigeration mechanism 2 is 15-20 cm 3. With continued reference to fig. 1, the wireless power supply mechanism 1 includes a wireless power supply transmitting coil 11, a first conversion circuit module 12, and a power supply 13, which are sequentially connected, and in a specific embodiment, the units are connected by wires. In some supplementary embodiments, the outer diameter of the wireless power supply transmitting coil 11 is 8-10 cm, the input voltage of the power supply 13 is 220V ac, the output voltage of the power supply 13 is 20-30V ac, the ac provided by the first converting circuit module 12 is 100-200 khz high-frequency ac, the power of the ac provided by the first converting circuit module 12 is 20-30 w, the magnetic field provided by the wireless power supply transmitting coil 11 is 10-50 μt, and the magnetic field space provided by the wireless power supply transmitting coil 11 is 5-15 cm by 2-8 cm. With continued reference to fig. 2, the semiconductor refrigeration mechanism 2 includes a micro semiconductor refrigeration piece 23, a second conversion circuit module 22, and a wireless power supply receiving coil 21, which are sequentially connected, and in a specific embodiment, the units are connected by wires. In some supplementary embodiments, the outer diameter of the wireless power supply receiving coil 21 is 1-5 cm, the size of the micro semiconductor cooling plate 23 is 0.2-0.7 cm 0.1-0.5 cm, the input current of the micro semiconductor cooling plate 23 is 0-800 ma, the temperature difference that the micro semiconductor cooling plate 23 can generate is 0-63 ℃, and the cooling power of the micro semiconductor cooling plate 23 is 0-0.38 w.
The power supply 13 is used for providing alternating current to the first conversion circuit module 12, the first conversion circuit module 12 is used for adjusting the frequency and power of the alternating current provided by the power supply 13, generally amplifying the frequency of the alternating current provided by the power supply 13 to be high-frequency alternating current, the wireless power supply transmitting coil 11 is used for generating a magnetic field with the size of 10-50 mu T, the wireless power supply receiving coil 21 is used for generating induced alternating current with the current of 0-500 mA through an electromagnetic induction principle in the magnetic field generated by the wireless power supply transmitting coil 11, the second conversion circuit module 22 is used for converting the induced alternating current generated by the wireless power supply receiving coil 21 into direct current with the voltage of 0-5V and adjusting the power of the direct current, the output current of the direct current is 0-800 mA, and the micro semiconductor refrigerating sheet 23 is used for providing a refrigerating function and can accurately, rapidly and temperature-controllably refrigerating the part with concentrated local heat flux of a freely moving object in the magnetic field space provided by the wireless power supply transmitting coil 11. The invention adopts the wireless power supply mechanism 1 as the power supply part of the micro wireless thermoelectric refrigeration device, gets rid of the limitation of the traditional refrigeration mode by the position of the fixed power supply 13, the wireless power supply transmitting coil 11 can provide a magnetic field in a target area, the wireless power supply receiving coil 21 can generate induced alternating current in the magnetic field, thereby providing electric energy for the micro semiconductor refrigeration piece 23, and realizing the effect that the micro semiconductor refrigeration piece 23 can provide accurate refrigeration and temperature control for movable target objects.
When the micro wireless thermoelectric cooling device provided by the embodiment of the invention is used, as long as the wireless power supply receiving coil 21 is positioned in the magnetic field range of the wireless power supply transmitting coil 11, induced current can be generated, so that the micro semiconductor cooling sheet 23 is powered, and in a complementary embodiment, referring to fig. 3, one wireless power supply mechanism 1 can supply power to a plurality of semiconductor cooling mechanisms 2. Therefore, the wireless power supply transmitting coil 11 and the wireless power supply receiving coil 21 adopted by the invention can change the current by changing the distance between the wireless power supply transmitting coil 11 and the wireless power supply receiving coil 21, namely the magnitude of induced current changes along with the distance between the wireless power supply transmitting coil 11 and the wireless power supply transmitting coil 11, the magnitude of current input by the micro semiconductor refrigerating sheet 23 changes along with the space, so that the refrigerating effect changes along with the position change of a target area, and in addition, the power of the micro semiconductor refrigerating sheet 23 can be further controlled through the first conversion circuit module 12 and the second conversion circuit module 22, so that the accurate temperature control can be realized according to the actual requirements.
In the micro wireless thermoelectric refrigeration device provided by the embodiment of the invention, referring to fig. 4, the micro semiconductor refrigeration sheet 23 sequentially includes a refrigeration layer 3, a top electrode layer 31, a thermoelectric element layer 32, a bottom electrode layer 33, and a heat release layer 34 from top to bottom. The thermoelectric element layer 32 includes a plurality of groups of thermoelectric elements, each group including one P-type thermoelectric leg 32a and one N-type thermoelectric leg 32b, the top electrode layer 31 includes a plurality of top electrode sheets 31a, and the bottom electrode layer 33 includes a plurality of bottom electrode sheets 33a. With continued reference to fig. 4, the top of the P-type thermoelectric leg 32a and the top of the N-type thermoelectric leg 32b are connected by a top electrode tab 31a in the same set of thermoelectric elements, and the bottom of the P-type thermoelectric leg 32a and the bottom of the N-type thermoelectric leg 32b are connected by a bottom electrode tab 33a in an adjacent and different set of thermoelectric elements. The second conversion circuit module 22 is connected to bottom electrode pads 33a located at both ends of the thermoelectric element layer 32 through wires. Illustratively, the arrangement of the P-type thermoelectric legs 32a and the N-type thermoelectric legs 32b in each set of thermoelectric elements should be identical, e.g., P-type thermoelectric legs 32a on the left and N-type thermoelectric legs 32b on the right. In addition, a gap is left between the P-type thermoelectric leg 32a and the N-type thermoelectric leg 32b in each group of thermoelectric elements, and the thermoelectric legs are not in direct contact, and meanwhile, referring to fig. 4, all thermoelectric elements are connected in sequence to form a plurality of pi shapes. In one embodiment, referring to fig. 4, the number of thermoelectric elements is four, the P-type thermoelectric leg 32a is Bi 0.5Sb1.5Te3, and the N-type thermoelectric leg 32b is Bi2 sec 0.3te2.7. In a complementary embodiment, the materials of the top electrode plate 31a and the bottom electrode plate 33a are conductive metals, preferably copper or gold, the materials of the refrigerating layer 3 and the heat releasing layer 34 are ceramic substrates with high thermal conductivity, preferably aluminum oxide or aluminum nitride, and the P-type thermoelectric legs 32a and the N-type thermoelectric legs 32b are sealed by organic materials, such as silica gel, epoxy resin, etc., so as to isolate the external environmental pollution for protecting.
Example 1
The test condition of the micro wireless thermoelectric refrigerating device in this embodiment is that the heat release layer 34 is placed in air in an idle state, heat is dissipated by air convection, the outer diameter of the wireless power supply transmitting coil 11 is 8.8cm, the outer diameter of the wireless power supply receiving coil 21 is 3cm, the input voltage of the power supply 13 is 220V alternating current, the output voltage is 24V alternating current, the volume of the semiconductor refrigerating mechanism 2 is 15cm 3, the magnetic field space of the wireless power supply transmitting coil 11 is 10cm x 5cm, the size of the micro semiconductor refrigerating sheet 23 is 0.5cm x 0.3cm, the distance between the wireless power supply transmitting coil 11 and the wireless power supply receiving coil 21 is <1cm, the induced current generated by the wireless power supply receiving coil 21 is about 70mA, the output power of the wireless power supply receiving coil 21 is 0.35w, and the refrigerating power of the micro semiconductor refrigerating sheet 23 is 0.35w.
The experimental result shows that the micro wireless radio refrigerating device in the embodiment establishes a temperature difference of 16.8 ℃ in 7 seconds, as shown in fig. 5.
Example two
The test condition of the micro wireless thermoelectric refrigerating device in this embodiment is that the heat release layer 34 is placed on a brass block under no-load condition, heat is released through metal conduction, the outer diameter of the wireless power supply transmitting coil 11 is 8.8cm, the outer diameter of the wireless power supply receiving coil 21 is 3cm, the input voltage of the power supply 13 is 220V ac, the output voltage is 24V ac, the volume of the semiconductor refrigerating mechanism 2 is 15cm 3, the magnetic field space of the wireless power supply transmitting coil 11 is 10cm x 5cm, the size of the micro semiconductor refrigerating sheet 23 is 0.5cm x 0.3cm, the distance between the wireless power supply transmitting coil 11 and the wireless power supply receiving coil 21 is <1cm, the induced current generated by the wireless power supply receiving coil 21 is about 70mA, the output power of the wireless power supply receiving coil 21 is 0.35w, and the refrigerating power of the micro semiconductor refrigerating sheet 23 is 0.35w.
The experimental result shows that the micro wireless radio refrigerating device in the embodiment establishes a temperature difference of 16.8 ℃ in 90s, as shown in fig. 6.
Example III
The test conditions of the micro wireless thermoelectric refrigerating device in the embodiment are that a heating platform 4 is arranged, a bionic prosthesis 5 made of an organic material is used as a test carrier, the bionic prosthesis 5 is arranged on the heating platform 4, the heating temperature of the heating platform 4 is set to be 45 ℃, a refrigerating layer 3 is arranged on the prosthesis 5, a heat release layer 34 is arranged in air, the outer diameter of the wireless power supply transmitting coil 11 is 8.8cm, the outer diameter of the wireless power supply receiving coil 21 is 3cm, the input voltage of the power supply 13 is 220V alternating current, the output voltage is 24V alternating current, the volume of the semiconductor refrigerating mechanism 2 is 15cm 3, the magnetic field space of the wireless power supply transmitting coil 11 is 10cm x 10 x 5cm, the size of the micro semiconductor refrigerating sheet 23 is 0.5cm x 0.3cm, the distance between the wireless power supply transmitting coil 11 and the wireless power supply receiving coil 21 is 1cm, the induced current generated by the wireless receiving coil 21 is about 70mA, the output power of the wireless power supply receiving coil 21 is 0.35w < 0.35.
The contact position (Sp 1) of the prosthesis 5 with the refrigerating layer 3, the temperature of the quarter and half parts (Sp 2, sp 3) of the prosthesis 5, and the contact surface (Sp 4) of the heating platform 4 with the prosthesis 5 were measured by a thermal infrared imager, as shown in FIG. 7. The experimental result shows that the micro wireless thermoelectric refrigerating device in the embodiment establishes a temperature difference of 7.9 ℃ in the time of 6.4s, as shown in fig. 7.
In summary, the miniature wireless thermoelectric refrigerating device has high refrigerating speed, and can quickly cool a target area and maintain a certain temperature difference.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present invention, and these modifications and substitutions should also be considered as being within the scope of the present invention.
Claims (10)
1. The miniature wireless thermoelectric refrigeration device is characterized by comprising a wireless power supply mechanism (1) and a semiconductor refrigeration mechanism (2) which are mutually independent, wherein the wireless power supply mechanism (1) comprises a wireless power supply transmitting coil (11), a first conversion circuit module (12) and a power supply (13) which are sequentially connected, and the semiconductor refrigeration mechanism (2) comprises a miniature semiconductor refrigeration sheet (23), a second conversion circuit module (22) and a wireless power supply receiving coil (21) which are sequentially connected;
-said power supply (13) for supplying alternating current to said first conversion circuit module (12);
-said first conversion circuit module (12) for regulating the frequency and the power of the alternating current supplied by said power supply (13);
The wireless power supply transmitting coil (11) is used for generating a magnetic field;
the wireless power supply receiving coil (21) generates induced alternating current in a magnetic field generated by the wireless power supply transmitting coil (11) through an electromagnetic induction principle;
The second conversion circuit module (22) converts the induced alternating current generated by the wireless power supply receiving coil (21) into direct current and adjusts the power of the direct current;
The micro semiconductor refrigerating sheet (23) provides a refrigerating function.
2. The micro wireless thermoelectric refrigerating device according to claim 1, wherein the volume of the wireless power supply mechanism (1) is 10-20 cm 3;
And/or the size of the miniature semiconductor refrigerating sheet (23) is 0.2-0.7 cm 0.1-0.5 cm;
and/or the input current of the miniature semiconductor refrigerating sheet (23) is 0-800 mA;
and/or the temperature difference which can be generated by the miniature semiconductor refrigerating sheet (23) is 0-63 ℃;
and/or the refrigerating power of the miniature semiconductor refrigerating sheet (23) is 0-0.38W.
3. The micro wireless thermoelectric refrigerating device according to claim 1, wherein the micro semiconductor refrigerating sheet (23) comprises a refrigerating layer (3), a top electrode layer (31), a thermoelectric element layer (32), a bottom electrode layer (34) and a heat release layer (34) in this order from top to bottom;
the thermoelectric element layer (32) comprises a plurality of groups of thermoelectric elements, each group of thermoelectric elements comprises a P-type thermoelectric leg (32 a) and an N-type thermoelectric leg (32 b), the top electrode layer (31) comprises a plurality of top electrode pieces (31 a), and the bottom electrode layer (33) comprises a plurality of bottom electrode pieces (33 a);
the top of the P-type thermoelectric arm (32 a) and the top of the N-type thermoelectric arm (32 b) in the thermoelectric elements in the same group are connected through a top electrode plate (31 a), and the bottom of the P-type thermoelectric arm (32 a) and the bottom of the N-type thermoelectric arm (32 b) in the thermoelectric elements in adjacent and different groups are connected through a bottom electrode plate (33 a);
The second conversion circuit module (22) is connected with bottom electrode pieces (33 a) positioned at two ends of the thermoelectric element layer (32) through wires.
4. The micro-scale wireless thermoelectric cooling device according to claim 3, wherein the material of the top electrode sheet (31 a) and the bottom electrode sheet (33 a) is conductive metal, and the material of the cooling layer (3) and the heat release layer (34) is a ceramic substrate;
The P-type thermoelectric leg (32 a) is Bi 0.5Sb1.5Te3, and the N-type thermoelectric leg (32 b) is Bi 2Se0.3Te2.7.
5. The micro-scale wireless thermoelectric cooling device according to claim 4, wherein the material of the top electrode sheet (31 a) and the bottom electrode sheet (33 a) is copper or gold, and the material of the cooling layer (3) and the heat release layer (34) is aluminum oxide or aluminum nitride.
6. The micro wireless thermoelectric refrigerating device according to claim 1, wherein the outer diameter of the wireless power supply transmitting coil (11) is 5-10 cm;
And/or the alternating current power provided by the first conversion circuit module (12) is 20-30 w;
And/or the alternating current frequency provided by the first conversion circuit module (12) is 100-200 KHz;
And/or the magnetic field provided by the wireless power supply transmitting coil (11) is 10-50 mu T;
And/or the magnetic field space provided by the wireless power supply transmitting coil (11) is 5-15 cm 2-8 cm.
7. The micro-scale wireless thermoelectric cooling device according to claim 1, wherein the induced current generated by the wireless power supply receiving coil (21) is 0-500 mA, and/or the output voltage of the second conversion circuit module (22) is 0-5V, and the output current is 0-800 mA.
8. The micro wireless radio refrigerating device according to claim 1, wherein the micro wireless radio refrigerating device radiates heat through air convection under no-load conditions, the distance between the wireless power supply transmitting coil (11) and the wireless power supply receiving coil (21) is less than 1cm, induced current generated by the wireless power supply receiving coil (21) is 60-80 mA, output power of the wireless power supply receiving coil (21) is 0.28-0.48 w, refrigerating power of the micro semiconductor refrigerating sheet (23) is 0.28-0.48 w, and a temperature difference of 10-20 ℃ is established within 5-10 s.
9. The micro wireless thermoelectric cooling device according to claim 1, wherein the micro wireless thermoelectric cooling device radiates heat through metal conduction under no-load conditions, the distance between the wireless power supply transmitting coil (11) and the wireless power supply receiving coil (21) is less than 1cm, induced current generated by the wireless power supply receiving coil (21) is 60-80 mA, output power of the wireless power supply receiving coil (21) is 0.28-0.48 w, cooling power of the micro semiconductor cooling sheet (23) is 0.28-0.48 w, and a temperature difference of 20-30 ℃ is established within 80-100 s.
10. The micro wireless thermoelectric cooling device according to claim 1, wherein the micro wireless thermoelectric cooling device is characterized in that under the condition that a bionic prosthesis (5) made of an organic material is used as a test carrier, a radiating surface is placed in air, heat is radiated through air convection, the distance between a wireless power supply transmitting coil (11) and a wireless power supply receiving coil (21) is less than 1cm, induced current generated by the wireless power supply receiving coil (21) is 60-80 mA, the output power of the wireless power supply receiving coil (21) is 0.28-0.48 w, the cooling power of the micro semiconductor cooling sheet (23) is 0.28-0.48 w, and a temperature difference of 10-20 ℃ is established within 5-10 s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411830704.1A CN119617699A (en) | 2024-12-12 | 2024-12-12 | Miniature wireless electric heating and refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411830704.1A CN119617699A (en) | 2024-12-12 | 2024-12-12 | Miniature wireless electric heating and refrigerating device |
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| Publication Number | Publication Date |
|---|---|
| CN119617699A true CN119617699A (en) | 2025-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411830704.1A Pending CN119617699A (en) | 2024-12-12 | 2024-12-12 | Miniature wireless electric heating and refrigerating device |
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| Country | Link |
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| CN (1) | CN119617699A (en) |
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