CN119394903A - A bonding strength test structure and method for potting material and printed circuit board - Google Patents
A bonding strength test structure and method for potting material and printed circuit board Download PDFInfo
- Publication number
- CN119394903A CN119394903A CN202411374575.XA CN202411374575A CN119394903A CN 119394903 A CN119394903 A CN 119394903A CN 202411374575 A CN202411374575 A CN 202411374575A CN 119394903 A CN119394903 A CN 119394903A
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- potting
- printed circuit
- ring
- circuit board
- bonding strength
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- 238000004382 potting Methods 0.000 title claims abstract description 97
- 239000000463 material Substances 0.000 title claims abstract description 57
- 238000012360 testing method Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000009864 tensile test Methods 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 238000004364 calculation method Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 3
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 238000011049 filling Methods 0.000 description 31
- 238000007789 sealing Methods 0.000 description 27
- 238000013461 design Methods 0.000 description 8
- 238000011068 loading method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000003566 sealing material Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000007718 adhesive strength test Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention belongs to the technical field of electronic packaging test, and particularly relates to a bonding strength test structure and method for a potting material and a printed board, wherein the potting material is poured between the two printed boards, the two printed boards and the potting material form a printed board potting piece, after a positioning ring and the potting ring are removed, positioning baffles are fixed at the upper end and the lower end of a clamping handle, and the two clamping handles are clamped at the outer sides of the two printed boards through a strong adhesive under the constraint of the two positioning baffles, so that the printed board potting piece and the two clamping handles form a test sample; and removing the two positioning baffles, outwards pulling clamping handles at two ends of the encapsulating piece of the printed board by using a universal tensile testing machine, recording tensile force data until the printed board is separated from the encapsulating material, and calculating the bonding strength according to the tensile force data until the printed board is separated from the encapsulating material. The strong adhesive connection mode of the measured piece and the clamping handle gets rid of the limitation of the installation space and the structural form, and improves the application range and feasibility of interconnection.
Description
Technical Field
The invention belongs to the technical field of electronic packaging tests, and particularly relates to a structure and a method for testing bonding strength of a potting material and a printed board.
Background
The internal filling and sealing reinforcement is an effective means for the application requirement of electronic equipment on high impact resistance. In practical engineering, in addition to the density and hardness of the potting material, the bonding strength of the potting material and the electronic component, especially between the printed board and the potting material, may occur failure phenomena of delamination and peeling of the interface between the potting material and the printed board due to the impact of insufficient bonding strength, resulting in the decrease of the reliability of the equipment. Because the potting material is a polymer composite material, and the internal structure of the electronic equipment is complex, the adhesive force test of the potting material directly based on the filled object is very difficult, so no simple and effective adhesive strength test method exists at present, the potting process has no relevant data support, the reliability of the potting reinforcement is not high, and the method becomes one of the main technical risks of shock resistance protection.
Disclosure of Invention
The invention provides a structure and a method for testing the bonding strength of a potting material and a printed board, which are used for solving the technical problem that the bonding strength of the potting material of a poured object is difficult to test in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the bonding strength test structure for the potting material and the printed boards is characterized by comprising a potting ring, a positioning ring and the printed boards, wherein the printed boards are arranged at two ends of the potting ring, the two printed boards and the potting ring form a cavity, the positioning ring is spliced at the outer side of the potting ring, and a clamping handle is clamped at the outer sides of the two printed boards.
The printed board is adhered to the outer surface of the potting ring through silicone rubber.
The printed board is circular, and the diameter is between the inner diameter and the outer diameter of the filling ring.
The filling ring is composed of two equal-divided semicircular rings, the two semicircular rings are spliced into a circular ring, a chute is formed in the filling ring, semicircular holes are reserved on the two semicircular rings, and the two semicircular holes form a circular hole to form a filling hole.
The positioning ring is a circular ring, and a round hole is formed in the positioning ring corresponding to the hole position of the filling hole of the filling ring for filling and sealing and disassembling.
Be provided with the screw hole on the embedment circle, the screw hole is used for fixed dismantlement pole, dismantles pole one end and takes the screw thread, matches with the internal thread of the screw hole of encapsulating circle.
The end face of the clamping handle is cubic or round.
The clamping handles are adhered and clamped at two ends of the outer side of the printed board.
The test method comprises the steps of pouring the potting material between the two printed boards, forming a printed board potting piece by the two printed boards and the potting material, fixing positioning baffles at the upper end and the lower end of a clamping handle after a positioning ring and the potting ring are removed, and clamping the two clamping handles on the outer sides of the two printed boards through a strong adhesive under the constraint of the two positioning baffles, so that the printed board potting piece and the two clamping handles form a test sample piece.
Removing the two positioning baffles, outwards pulling clamping handles at two ends of the encapsulating piece of the printed board by using a universal tensile testing machine, recording tensile force data until the printed board is separated from the encapsulating material, and calculating the bonding strength through the tensile force data, wherein the calculating method comprises the following steps of:
Adhesive strength = ,Wherein F is the maximum pulling force, S is the contact area of the potting material and the printed board, and d is the diameter of the inner ring of the potting ring.
Compared with the prior art, the invention has the following beneficial effects:
According to the bonding strength test structure of the potting material and the printed board, the printed board is fixed at the two ends of the potting ring to form the closed cavity, the actual working environment is simulated, the potting material is ensured to be solidified under the controlled condition, the obtained bonding strength test result is closer to the actual application scene, and the accuracy of test data and the repeatability of experiments are improved. The splicing design of the positioning ring is beneficial to accurately aligning and fixing the positions of the printed board and the filling ring, avoids deviation caused by manual placement, ensures that the filling and sealing materials can be uniformly distributed, ensures that the test result is not influenced by artificial factors, and improves the standardization degree of the test. The design of centre gripping handle has made things convenient for test structure's transport and installation dismantlement process for it is more convenient to shift the sample between different test conditions or laboratory, also is convenient for carry out necessary operation or observation in embedment and solidification in-process simultaneously, has reduced the operation degree of difficulty, has improved work efficiency.
Furthermore, due to the design of the spliced type pouring ring and the inclined groove, the stress concentration position at the inclined groove opening is ensured, the inner ring is coated with the release agent, the binding force between the pouring material and the pouring ring is reduced, the pouring material and the pouring ring are convenient to peel, the disassembly and reuse of the tool after pouring can be conveniently carried out by combining the disassembly rod, the low-cost design of the tool is realized, and meanwhile, the disassembly rod can be conveniently used for holding the operation and applying the torque.
Furthermore, the design of the circular printed board with the diameter between the inner diameter and the outer diameter of the filling and sealing ring is convenient for the adhesion of the filling and sealing ring and the disassembly of the positioning ring after filling and sealing is easy, and the contact area difference between the printed board and different interfaces of the filling and sealing material and the clamping handle is increased, namely the bonding area between the printed board and the clamping handle is increased, the bonding force between the printed board and the clamping handle is ensured, and meanwhile, the bonding area between the printed board and the filling and sealing material is reduced, and the bonding force between the printed board and the filling and sealing material is reduced, so that the interface between the printed board and the filling and sealing material is ensured to be separated firstly during a tensile test, and the measured data is the bonding strength between the printed board and the filling and sealing material. The design method ensures the detachability of the tool, and simultaneously ensures the testability of the bonding strength of the printed board and the potting material on the premise of simplifying the connection mode of the sample piece and the clamping handle. Comprehensively solves the problems of embedding sample, clamping handle interconnection and embedding bonding strength testability.
Furthermore, according to the bonding strength test method for the encapsulating material and the printed board, disclosed by the invention, by constructing a special test structure and adopting a standardized operation flow, for example, the filling of the encapsulating material, the fixing of the printed board and the position of the clamping handle are precisely controlled, and the tensile test is carried out on a universal tensile testing machine, so that the accuracy and the reliability of a test result are obviously improved, and test data are more convincing.
Furthermore, the invention is tested based on a universal tensile testing machine, has strong universality, can freely design the end surface shape according to the tested structural member except for the standardized design of the handle part of the clamping handle, can test the bonding strength of components with corresponding characteristics, such as components, chips and the like besides a printed board, and has strong expansibility. The method has the advantages that the connection mode of the tested piece and the strong adhesive of the clamping handle is free from the limitation of the installation space and the structural form, the application range and the feasibility of interconnection are improved, the steps are clear, the operation is simple and convenient, the preparation and the fixing process of a sample are simplified particularly by the aid of the clamping handle and the positioning baffle, the operation complexity is reduced, and the testing efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the front of a potting fixture;
FIG. 2 is a schematic side view of a potting tool structure;
FIG. 3 is a schematic diagram of a front view of a test sample preparation;
FIG. 4 is a schematic diagram of a side view of a test sample;
FIG. 5 is a schematic diagram of the change in loading force of the universal tensile tester.
The number is 1, the printed board; 2, a threaded hole, 3, a filling sealing ring, 4, a disassembling rod, 5, a positioning ring, 6, a filling sealing hole, 7, a clamping handle, 8, a filling material, 9, a printed board filling material and 10, a positioning baffle.
Detailed Description
For a further understanding of the present invention, the present invention is described in detail below with reference to the drawings and specific examples. It is to be understood that the examples are illustrative of the present invention and are not intended to be limiting.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2, for the embedment frock structure schematic diagram, including a printing board 1, the fixed encapsulating circle 3 of printing board 1 periphery, the fixed laminating in encapsulating circle 3 outside has retainer plate 5, encapsulating circle 3 has two halving semicircles to constitute, two halving semicircles one end is opened and is had the chute, semicircle hole is left to one end, screw hole 2 has still been seted up on two halving semicircles, two screw holes 2 are at the diameter both ends of encapsulating circle 3 respectively, two semicircle holes of two halving semicircles constitute a round hole, the round hole that constitutes with two semicircle holes of encapsulating circle 3 and the corresponding hole of screw thread piece 2 have also been seted up on the retainer plate 5, two dismantlement poles 4 insert in two screw holes 2 of encapsulating circle 3 through the round hole of retainer plate 5.
Referring to fig. 3 and 4, for preparing and testing a test sample, the potting material 8 is encapsulated in the middle of two printed boards 1, the potting material 8 and the printed boards 1 form a printed board potting 9, two clamping handles 7 are clamped at the outer sides of the two printed boards 1, so that the two clamping handles 7 are clamped at two ends of the printed board potting 9, the two clamping handles 7 and the printed board potting 9 form a test sample, the upper ends and the lower ends of the two clamping handles 7 are fixedly provided with positioning baffles 10, the clamping handles 7 and the printed board potting 9 are clamped to form constraint, the clamping handles 7 are tightly attached and fixed with the printed boards 1, during the adhesive strength test, the upper positioning baffle 10 and the lower positioning baffle 10 are taken down, the two clamping handles 7 are respectively pulled outwards by a universal tensile tester, and the adhesive strength is calculated by monitoring the loading force of the universal tensile tester, so that the loading force is the tensile force.
Referring to fig. 5, a loading force change schematic diagram of the universal tensile testing machine is shown in the process that the clamping handle 7 is pulled outwards, when the time is 8.43S, the loading force reaches the maximum value of 2034N, at the moment, the two printed boards 1 are separated from the potting material 8, the universal tensile testing machine stops applying force, and the loading force is changed to 0 immediately.
The embodiment provides a structure and a method for testing the bonding strength of a potting material and a printed board, which comprises the following specific implementation steps:
The bonding strength test of the potting material 8 and the printed board 1 is carried out, the potting ring 3 is needed at first, the potting ring 3 is composed of two semicircular equally-divided rings, the potting ring 3 is provided with a chute, a semicircular hole and a threaded hole 2 are reserved, the two semicircular rings are spliced into a circular ring for use, at the moment, the two semicircular holes also form a circular hole which is the potting hole 6, and the threaded block 2 is used for disassembling the tool after potting and curing. The circular printed board 1 is manufactured, the diameter of the circular printed board 1 is between the inner diameter and the outer diameter of the filling and sealing ring 3, a demolding machine is uniformly coated on the inner ring part of the filling and sealing ring 3, after the demolding agent is solidified, the two parts of the filling and sealing ring 3 are placed in the positioning ring 5, the filling and sealing ring 3 and the positioning ring 5 are spliced into a whole circular ring, and round holes corresponding to the threaded holes 2 and the filling and sealing holes 6 of the filling and sealing ring 3 are also formed in the positioning ring 5, so that attention should be paid to the round holes on the positioning ring 5 being consistent with the threaded holes 2 and the filling and sealing holes 6 of the filling and sealing ring 3 during splicing. The method comprises the steps of coating silicon rubber on the inner diameter and outer diameter parts of the sealing ring 3, namely contact parts of the sealing ring 1, wherein the silicon rubber is not suitable for being coated excessively and is guaranteed to be smooth, bonding the two printed boards 1 on two sides of the sealing ring 3 respectively, tightly adhering and guaranteeing no gaps, forming a cavity by the two printed boards 1 and the sealing ring 3, after the silicon rubber is solidified, enabling the dismounting rods 4 to pass through round holes of the positioning ring 5 and to be mounted on threaded holes 2 of the sealing ring, fixing the dismounting rods 4 at two ends and keeping the sealing ring 6 at the top, slowly injecting the potting compound 8 from the sealing ring 6, stopping injection and placing solidification when the potting compound 8 is basically flush with the sealing ring 6, taking the two dismounting rods 4 out after the potting compound 8 is solidified firmly, taking the positioning ring 5 out again, mounting the dismounting rods 4 on the threaded holes 2 of the sealing ring 3, holding the two dismounting rods 4 to apply moment along the directions away from the opening directions, stripping the potting compound 8 along the opening directions, finally enabling the two printed boards 1 with the sealing ring 8 clamped between the two printed boards, and the two printed boards 1 and the sealing compound 8 to form the sealing member 9.
After the preparation of the printed board encapsulating piece 9 is completed, a test sample is prepared, two positioning baffles 10 are prepared, the two positioning baffles 10 are required to have the same specification, the surface is flat and has a certain weight, the two positioning baffles 10 are placed on the flat surface in parallel, the distance between the two baffles is about the width of the end face of the clamping handle 7, and the two clamping handles 7 are respectively placed at the two ends of the positioning baffles 10. Taking out the printed board encapsulating piece 9, uniformly coating strong adhesive (such as 502 glue) on the outer surfaces of the printed boards 1 at the two sides, placing the printed board encapsulating piece 9 back between the two positioning baffles 10, and pushing the clamping handles 7 in the horizontal direction simultaneously and oppositely under the constraint of the two positioning baffles 10 to ensure that the clamping handles 7 are tightly attached to the printed boards 1 through the strong adhesive (such as 502 glue), as shown by an arrow in fig. 3, until the two ends are contacted with the printed board encapsulating piece 9 and pressure is given to ensure that the printed boards 1 are firmly adhered to the clamping handles 7. Thus, the preparation of the test sample is completed.
After preparation, the adhesive strength test can be started, the prepared test sample is placed on a universal tensile testing machine, two ends of a handle 7 are respectively clamped and subjected to tensile test, as the adhesive strength between the encapsulating material 8 and the printed board 1 is not high, a lower tensile rate is set for stretching, and tensile force change data are recorded, related test data are shown in fig. 5, the tensile force is gradually increased until tension mutation occurs, the two printed boards 1 are separated from the encapsulating material 8, at the moment, the tensile force data when the printed board 1 is separated from the encapsulating material 8 are recorded, at the moment, the loading force of the universal tensile testing machine is the maximum value, namely the maximum tensile force is 2834N, and the adhesive strength =Wherein F is the maximum tensile force, S is the contact area between the potting material 8 and the printed board 1,D is the diameter of the inner ring of the potting ring 3, and after the printed board 1 is separated from the potting material 8, the universal tensile testing machine stops applying force, and the loading force of the universal tensile testing machine is 0.
After the test is finished, the test sample piece is placed into an acetone organic solvent for soaking, the strong adhesive can be disabled after the test sample piece is soaked for a while, the clamping handle 7 and the printed board 1 can be peeled off, and the clamping handle can be recovered for reuse after the end face of the clamping handle 7 is cleaned. The method can remove the residual release agent and potting material 8 in the inner ring of the potting ring 3, and the potting ring 3 can be reused after cleaning
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art. The above is only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited by this, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411374575.XA CN119394903A (en) | 2024-09-29 | 2024-09-29 | A bonding strength test structure and method for potting material and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411374575.XA CN119394903A (en) | 2024-09-29 | 2024-09-29 | A bonding strength test structure and method for potting material and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119394903A true CN119394903A (en) | 2025-02-07 |
Family
ID=94416322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411374575.XA Pending CN119394903A (en) | 2024-09-29 | 2024-09-29 | A bonding strength test structure and method for potting material and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119394903A (en) |
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2024
- 2024-09-29 CN CN202411374575.XA patent/CN119394903A/en active Pending
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