Disclosure of Invention
The invention provides a method for integrally connecting a photovoltaic cell and a circuit board and a prepared photovoltaic power generation module, aiming at solving the technical problems in the prior art. The metal adopts a series of metals and alloy metals with conductivity, such as copper foil, aluminum, silver, gold and the like with the thickness ranging from 1 to 100 micrometers, and has excellent flexibility. Meanwhile, due to metal connection, the conductive performance is excellent, and the connection strength is extremely high. The use requirement of the flexible power supply system in the subsequent process or application can be met.
The technical scheme adopted by the invention is that the method for integrally connecting the photovoltaic cell and the circuit board comprises the following steps:
(1) Ultrasonic cleaning is carried out on the photovoltaic cell and the circuit board for more than 5 minutes, and grease and dust are removed;
(2) The method comprises the steps of preparing a three-layer composite material-circuit board, namely, a three-layer composite material structure is composed of a metal foil, a POE adhesive film and a metal foil from bottom to top, wherein the POE adhesive film is in a strip shape, at least one pair of metal foils are alternately arranged in the length direction of the POE adhesive film, each pair of metal foils penetrate through the POE adhesive film to be connected with each other, the peripheral edges of the metal foils are positioned in the POE adhesive film, taking out the washed circuit board, placing the three-layer composite material on the circuit board with the same scale as the POE adhesive film, opening a hot press, placing the circuit board with the three-layer composite material in the hot press, and taking out the circuit board after hot pressing;
(3) And correspondingly mounting the lower surfaces of the plurality of washed photovoltaic cells on the metal foil on the three-layer composite material structure of the three-layer composite material-circuit board, sequentially paving POE adhesive films and ETFE films on the upper surfaces of the photovoltaic cells, and putting the photovoltaic cells and the ETFE films into a laminating machine for lamination to obtain the photovoltaic power generation module.
In the step (2), the heat pressing is carried out for 10min to 20min at the temperature of 100 ℃ to 150 ℃.
In the step (3), lamination is carried out at the temperature of 130-150 ℃ and the pressure of 1-1.5MPa for 0.5-1 h.
In the step (2), the thickness of the metal foil in the three-layer composite material structure is 1-100 micrometers, the length is 1-50 millimeters, the thickness of the POE adhesive film is 1-100 micrometers, and the length and the width are 1-100 millimeters.
The photovoltaic cell is a flexible photovoltaic cell, and comprises a flexible III-V photovoltaic cell, an ultrathin silicon solar cell, a copper indium gallium selenium solar cell and a perovskite solar cell, wherein the flexible photovoltaic cell comprises a flexible III-V photovoltaic cell, an ultrathin silicon solar cell, a copper indium gallium selenium solar cell and a perovskite solar cell, and the cell area is 1mm 2-60cm2.
In the step (2), an object which does not damage the hot press and has a flat appearance surface and a certain weight is adopted to press the object.
The pair of metal foils are connected with each other through the POE adhesive film to form a [ -shape.
The metal foil is a metal or alloy metal of copper, aluminum, silver, or gold having conductivity.
The photovoltaic power generation module is prepared by the method.
The invention has the advantages and positive effects that:
1. the battery lower electrode is connected with the circuit bonding pad by adopting the composite material-based power connection technology, so that the battery lower electrode has excellent conductivity, high connection strength, good flexibility and high temperature resistance.
2. Two metal foil layers are connected in a mode that POE adhesive films cover a circuit board, so that the functions of uniform thickness and uniform stress are easily achieved.
Detailed Description
The present invention will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the invention, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships that are based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the invention and simplify the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operate in a particular orientation, and therefore should not be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art in a specific case.
The electrical device, the controller and the like are all arranged conventionally, and the electrical connection mode is also conventional connection.
As shown in fig. 1-2, the method for integrally connecting the photovoltaic cell and the circuit board comprises the following steps:
(1) Ultrasonic cleaning is carried out on the photovoltaic cell 2 and the circuit board 4 for more than 5 minutes, so that grease and dust are removed;
(2) The preparation of the three-layer composite material-circuit board comprises the steps of respectively arranging a metal foil 301, a POE adhesive film 302 and a metal foil 301 from bottom to top, arranging at least one pair of metal foils 301 at intervals in the length direction of the POE adhesive film 302, connecting each pair of metal foils 301 with each other through the POE adhesive film 302, taking out the washed circuit board 4, placing the three-layer composite material on the circuit board 4 with the same scale as the POE adhesive film, opening a hot press, placing the circuit board 4 with the three-layer composite material in the hot press, and taking out the circuit board after the hot press is finished;
(3) And correspondingly attaching the lower surfaces of the plurality of washed photovoltaic cells 2 to a metal foil 301 on a three-layer composite material structure of a three-layer composite material-circuit board, sequentially paving a POE adhesive film 302 and an ETFE film 101 on the upper surfaces of the photovoltaic cells 2 to form a packaging layer 1, and putting the packaging layer 1 and the packaging layer into a laminating machine for lamination to prepare the photovoltaic power generation module.
In the step (2), the heat pressing is carried out for 10min to 20min at the temperature of 100 ℃ to 150 ℃.
In the step (3), lamination is carried out at the temperature of 130-150 ℃ and the pressure of 1-1.5MPa for 0.5-1 h.
In the step (2), the thickness of the metal 301 in the three-layer composite material structure is 1-100 micrometers, the length is 1-50 millimeters, and the thickness of the POE adhesive film 302 is 1-100 micrometers, and the length and the width are 1-100 millimeters.
The circuit board 4 is a flexible circuit board, an FPC circuit board is adopted, the temperature resistance is up to more than 240 ℃, and the photovoltaic cells are flexible photovoltaic cells and comprise flexible and bendable III-V photovoltaic cells, ultrathin silicon solar cells, copper indium gallium selenide solar cells and perovskite solar cells, wherein the cell area is 1mm 2-60cm2.
In the step (2), an object which does not damage the hot press and has a flat appearance surface and a certain weight is adopted to press the object.
The pair of metal foils 301 are connected to each other through the POE glue film 302 to form a "[" shape.
The metal foil is a metal or alloy metal of copper, aluminum, silver, or gold having conductivity.
The photovoltaic power generation module is prepared by the method.
For a further understanding of the invention, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings in which:
In order to realize the connection process of the composite material structure, the adhesion between the lower electrode of the photovoltaic cell and the FPC circuit board bonding pad and the composite material metal foil structure is realized, the thickness of the metal foil structure in the composite material layer is 1-100 micrometers, the length is 1-50 millimeters, and the POE adhesive film is 1-100 micrometers in thickness and 1-100 millimeters in length and width.
The photovoltaic cells are flexible and bendable solar cells such as III-V photovoltaic cells, ultrathin silicon solar cells, copper indium gallium selenide solar cells, perovskite solar cells and the like. The lower electrode of the photovoltaic cell is a metal layer with good conductivity.
The FPC circuit board is made of high-temperature resistant material, and the temperature resistance is higher than 240 ℃. The bonding pad on the circuit is copper, the area is slightly larger than the area of the photovoltaic cell, and the boundary is expanded by 0.01-2mm;
The specific manufacturing steps are as follows:
(1) Placing the photovoltaic cell and the circuit board into acetone for ultrasonic cleaning for more than 5 minutes, and removing grease and dust;
(2) Three-layer composite material structures are prepared according to the scale of the circuit board, namely, a metal foil-POE adhesive film-metal foil is ready for use (the metal foil comprises a series of conductive metals such as copper foil, aluminum, silver and gold and alloy metals, and the like), the thickness of the metal foil structure is 1-100 micrometers, the length of the metal foil structure is 1-50 millimeters, the POE adhesive film is 1-100 micrometers, and the length and the width of the POE adhesive film are 1-100 millimeters. The three-layer composite material structure comprises a metal foil, a POE adhesive film and a metal foil from bottom to top, wherein the two metal foils penetrate through the adhesive film to be connected with each other, the cleaned circuit board is taken out, and the three-layer composite material is placed on the circuit board;
(3) Opening a hot press, placing a circuit board with three layers of composite materials in the hot press, pressing the circuit board by adopting a series of objects such as metal plates and the like which do not damage the hot press and have a certain weight and smooth appearance surface, setting the hot press at 100-150 ℃ for 10-20 min, performing hot pressing, and taking out the circuit board after the hot pressing is finished;
(4) And mounting the washed photovoltaic cell on the three-layer composite material structure of the circuit board, and carrying out lamination packaging on the photovoltaic cell. And sequentially paving a POE adhesive film and an ETFE film on the upper surface of the flexible photovoltaic cell, and putting the POE adhesive film and the ETFE film into a laminating machine for lamination, wherein the temperature is 130-150 ℃, the pressure is 1-1.5MPa, the time is 0.5-1h, and the flexible photovoltaic power generation module is prepared after lamination is completed.
Example 1
(1) Placing the rigid photovoltaic cells and the PCB circuit board meeting the requirements into acetone for ultrasonic cleaning for 5 minutes, and removing grease and dust;
(2) Three-layer composite material structures are prepared according to the scale of the circuit board, namely, a metal foil-POE adhesive film-metal foil is ready for use (the metal foil comprises a series of conductive metals such as copper foil, aluminum, silver and gold and alloy metals, and the metal foil structure has the thickness of 60 micrometers, the length of 20 millimeters, and the POE adhesive film has the thickness of 40 micrometers and the length and the width of 80 millimeters. The three-layer composite material structure is respectively provided with a metal foil, a POE adhesive film and a metal foil from bottom to top, and the two metal foils penetrate through the adhesive film to be connected with each other. Taking out the cleaned circuit board, and placing the three-layer composite material on the circuit board;
(3) Opening a hot press, placing a circuit board with three layers of composite materials in the hot press, pressing the circuit board by adopting a series of objects such as metal plates and the like which do not damage the hot press and have a certain weight and smooth appearance surface, setting the hot press at 130 ℃ for 15min, carrying out hot pressing, and taking out after the hot pressing is finished;
(4) And mounting the washed photovoltaic cell on the three-layer composite material structure of the circuit board, and carrying out lamination packaging on the photovoltaic cell. And (3) sequentially paving a POE adhesive film and an ETFE film on the upper surface of the flexible photovoltaic cell, putting the POE adhesive film and the ETFE film into a laminating machine for lamination, and taking out after lamination is completed at the temperature of 150 ℃ and the pressure of 1.5MPa for-1 h to prepare the flexible photovoltaic power generation module.
Example 2
(1) Placing the flexible photovoltaic cells and the PCB which meet the requirements into acetone for ultrasonic cleaning for 5 minutes, and removing grease and dust;
(2) Three-layer composite material structures are prepared according to the scale of the circuit board, namely, a metal foil-POE adhesive film-metal foil is ready for use (the metal foil comprises a series of conductive metals such as copper foil, aluminum, silver, gold and the like, but not limited to the metal foil), the thickness of the metal foil structure is 60 micrometers, the length is 20 millimeters, and the POE adhesive film is 40 micrometers in thickness and the length and the width are 80 millimeters. The three-layer composite material structure is respectively provided with a metal foil, a POE adhesive film and a metal foil from bottom to top, and the two metal foils penetrate through the adhesive film to be connected with each other. Taking out the cleaned circuit board, and placing the three-layer composite material on the circuit board;
(3) Opening a hot press, placing a circuit board with three layers of composite materials in the hot press, pressing the circuit board by adopting a series of objects such as metal plates and the like which do not damage the hot press and have a certain weight and smooth appearance surface, setting the hot press at 130 ℃ for 15min, carrying out hot pressing, and taking out after the hot pressing is finished;
(4) And mounting the washed photovoltaic cell on the three-layer composite material structure of the circuit board, and carrying out lamination packaging on the photovoltaic cell. And sequentially paving a POE adhesive film and an ETFE film on the upper surface of the flexible photovoltaic cell, putting the POE adhesive film and the ETFE film into a laminating machine for lamination, and taking out after lamination is completed at the temperature of 150 ℃ and the pressure of 1.5MPa for 1h to prepare the flexible photovoltaic power generation module.
Example 3
(1) Placing the rigid photovoltaic cell and the FPC circuit board meeting the requirements into acetone for ultrasonic cleaning for 5 minutes, and removing grease and dust;
(2) Three-layer composite material structures are prepared according to the scale of the circuit board, namely, a metal foil-POE adhesive film-metal foil is ready for use (the metal foil comprises a series of conductive metals such as copper foil, aluminum, silver, gold and the like, but not limited to the metal foil), the thickness of the metal foil structure is 60 micrometers, the length is 20 millimeters, and the POE adhesive film is 40 micrometers in thickness and the length and the width are 80 millimeters. The three-layer composite material structure is respectively provided with a metal foil, a POE adhesive film and a metal foil from bottom to top, and the two metal foils penetrate through the adhesive film to be connected with each other. Taking out the cleaned circuit board, and placing the three-layer composite material on the circuit board;
(3) Opening a hot press, placing a circuit board with three layers of composite materials in the hot press, pressing the circuit board by adopting a series of objects such as metal plates and the like which do not damage the hot press and have a certain weight and smooth appearance surface, setting the hot press at 130 ℃ for 15min, carrying out hot pressing, and taking out after the hot pressing is finished;
(4) And mounting the washed photovoltaic cell on the three-layer composite material structure of the circuit board, and carrying out lamination packaging on the photovoltaic cell. And sequentially paving a POE adhesive film and an ETFE film on the upper surface of the flexible photovoltaic cell, putting the POE adhesive film and the ETFE film into a laminating machine for lamination, and taking out after lamination is completed at the temperature of 150 ℃ and the pressure of 1.5MPa for 1h to prepare the flexible photovoltaic power generation module.
Example 4
(1) Placing the flexible photovoltaic cell and the FPC circuit board meeting the requirements into acetone for ultrasonic cleaning for 5 minutes, and removing grease and dust;
(2) Three-layer composite material structures are prepared according to the scale of the circuit board, namely, a metal foil-POE adhesive film-metal foil is ready for use (the metal foil comprises a series of conductive metals such as copper foil, aluminum, silver, gold and the like, but not limited to the metal foil), the thickness of the metal foil structure is 60 micrometers, the length is 20 millimeters, and the POE adhesive film is 40 micrometers in thickness and the length and the width are 80 millimeters. The three-layer composite material structure is respectively provided with a metal foil, a POE adhesive film and a metal foil from bottom to top, and the two metal foils penetrate through the adhesive film to be connected with each other. Taking out the cleaned circuit board, and placing the three-layer composite material on the circuit board;
(3) Opening a hot press, placing a circuit board with three layers of composite materials in the hot press, pressing the circuit board by adopting a series of objects such as metal plates and the like which do not damage the hot press and have a certain weight and smooth appearance surface, setting the hot press at 130 ℃ for 15min, carrying out hot pressing, and taking out after the hot pressing is finished;
(4) And mounting the washed photovoltaic cell on the three-layer composite material structure of the circuit board, and carrying out lamination packaging on the photovoltaic cell. And sequentially paving a POE adhesive film and an ETFE film on the upper surface of the flexible photovoltaic cell, putting the POE adhesive film and the ETFE film into a laminating machine for lamination, and taking out after lamination is completed at the temperature of 150 ℃ and the pressure of 1.5MPa for 1h to prepare the flexible photovoltaic power generation module.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.