CN119327684B - A PCB coating device and coating system with controllable coating area - Google Patents
A PCB coating device and coating system with controllable coating area Download PDFInfo
- Publication number
- CN119327684B CN119327684B CN202411887137.3A CN202411887137A CN119327684B CN 119327684 B CN119327684 B CN 119327684B CN 202411887137 A CN202411887137 A CN 202411887137A CN 119327684 B CN119327684 B CN 119327684B
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- Prior art keywords
- glue
- dropping
- pcb
- hole
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011248 coating agent Substances 0.000 title claims abstract description 72
- 238000000576 coating method Methods 0.000 title claims abstract description 72
- 239000003292 glue Substances 0.000 claims abstract description 240
- 238000000016 photochemical curing Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 238000005507 spraying Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000007921 spray Substances 0.000 description 22
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 4
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention relates to the field of PCB coating devices, in particular to a PCB coating system with a controllable and adjustable coating area, which comprises a multi-axis robot and a PCB coating device, wherein the PCB coating device comprises a glue dripping disc and a plurality of glue dripping strips, one end of the glue dripping disc in the axial direction is provided with a rectangular glue outlet hole, the other end of the glue dripping disc is provided with a glue injecting hole, the glue dripping disc can rotate around the axis of the glue dripping disc so as to change the angle of the glue outlet hole, the glue dripping strips are attached to the glue dripping disc and cover the glue outlet hole, each glue dripping strip is provided with a glue dripping hole, and the glue dripping strips can move along the length direction of the glue dripping disc so as to change the position of the glue dripping hole. According to the embodiment of the invention, the shape and the area of the overlapped part of the glue outlet hole and the glue dripping hole are changed by changing the angle of the glue dripping disc and the position of the glue dripping strip, so that the PCB coating device forms coating patterns with different areas and shapes on the PCB.
Description
Technical Field
The invention relates to the field of PCB coating devices, in particular to a coating region controllable adjusting type PCB coating device.
The invention also relates to a PCB coating system.
Background
The conventional photo-curing glue coater comprises a multi-axis robot and at least one spray gun, wherein each spray gun corresponds to an independent glue injection pump, the glue injection pump extracts photo-curing glue from a photo-curing glue storage container and then sprays the photo-curing glue through the spray gun, and the different spray guns are provided with spray nozzles with different calibers and shapes.
Because the sprayable areas and sprayable widths of different parts on the PCB are also different, it is desirable to achieve the highest efficiency of spraying, and it is necessary to use different spray guns at different positions on the PCB, such as a thicker spray gun in a wide spray area and a thinner spray gun in a narrow spray area.
Because increasing the number of spray guns can improve the cost and the complexity of equipment, therefore, a traditional photo-curing adhesive coating machine only has 1-2 spray guns, complex and changeable spray patterns on a PCB (printed circuit board) are difficult to match, the edges of the spray positions of the spray guns easily appear positions needing to be coated, the spray efficiency is obviously reduced, and however, the cost and the complexity of the equipment can be obviously improved by 3 or more spray guns.
Disclosure of Invention
The invention aims to provide a PCB coating device and a coating system with a controllable and adjustable coating area, so as to solve the problem that the size of a nozzle of the traditional PCB coating device is fixed and is difficult to adapt to different coating requirements.
In order to solve the technical problems, the invention specifically provides the following technical scheme:
the invention provides a PCB coating device with a coating area controllably regulated, which comprises:
The glue dripping disc is provided with a rectangular glue outlet hole at one end in the axial direction and a glue injection hole at the other end, a cavity for temporarily accommodating photo-curing glue is formed between the glue outlet hole and the glue injection hole, and the photo-curing glue is injected into the cavity through the glue injection hole;
the glue dropping plate is attached to the glue dropping disc and covers the glue outlet holes, the glue dropping plate comprises a plurality of glue dropping strips which are arranged side by side along the width direction of the glue dropping plate, each glue dropping strip is provided with at least one glue dropping hole, a plurality of glue dropping holes form a glue dropping hole group, and a glue outlet channel which allows the photo-curing glue to move from the inner side of the cavity to the outer side of the cavity is formed in the overlapping area of the glue outlet holes and the glue dropping hole group;
The glue dropping disc can rotate around the axis of the glue dropping disc, so that the angle of the glue outlet hole is changed;
The adhesive dropping strip can move along the length direction of the adhesive dropping strip so as to change the positions of the adhesive dropping holes, thereby changing the shape of the adhesive dropping hole group;
along with the movement of the glue dropping disc and the glue dropping strip, the area and the shape of the glue outlet channel are changed, so that the photo-curing glue forms coating patterns with different areas and shapes on the PCB.
Further, still include support, rotating electrical machines and linear electric motor, the glue dripping dish with the support can be rotationally connected, the glue dripping dish with the actuating part transmission of rotating electrical machines is connected, the glue dripping strip with the support can be connected with sliding, the glue dripping strip with the actuating part transmission of linear electric motor is connected.
Further, one end of the glue dropping disc, which is far away from the glue outlet hole, is connected with a rotating shaft, the rotating shaft is connected with the support through a bearing, and the rotating shaft is connected with an output shaft of the rotating motor through a coupler.
Further, the pivot is hollow, the glue outlet is connected to the one end of pivot, the other end of pivot is through radially lining up the injecting glue pump is connected to the injecting glue pipe of pivot, the injecting glue pump is arranged in follow the storage container of photo-curing glue and extracts photo-curing glue, then through the injecting glue pipe the pivot is exported to the inside of glue outlet, accumulating glue outlet with photo-curing glue between the glue dropping board is through a plurality of glue dropping holes towards the dropping of PCB board.
Further, when the number of the glue dropping holes on each glue dropping strip is greater than 1, the glue dropping holes are distributed at equal intervals along the length direction of the glue dropping strip.
Further, the distance between the axes of two adjacent glue-dropping holes on each glue-dropping strip is larger than the diameter of the glue-dropping hole and smaller than twice the diameter of the glue-dropping hole.
Further, the distance between the axes of two adjacent glue dropping holes is 1.25 times the diameter of the glue dropping holes, and the width of each glue dropping strip is equal to the distance between the axes of two adjacent glue dropping holes on each glue dropping strip.
Further, an included angle of 45 degrees is formed between the length direction of the adhesive dropping strip and the length direction of the adhesive outlet.
Further, chamfer angles are arranged at four corners of the glue outlet hole, and the waist length of the chamfer angles is equal to the width of the glue dropping strip.
The invention also provides a PCB coating system, which is provided with a PCB coating device, the coating system comprises a multi-axis robot, the PCB coating device is arranged on an execution part of the multi-axis robot, the multi-axis robot moves according to a preset path and speed, so that the PCB coating device performs spraying operation at a designated position of the PCB, the angle of the glue dropping disc and the position of the glue dropping strip are respectively changed through the rotating motor and the linear motor, and the photo-curing glue is subjected to spraying operation at different positions on the PCB through the glue outlet channels with other areas and shapes.
Compared with the prior art, the application has the following beneficial effects:
The embodiment of the invention is spliced into a glue dropping plate with a plurality of glue dropping holes and changeable arrangement shapes of the glue dropping holes through the glue dropping strips capable of sliding, and then the photo-curing glue is output to the glue dropping plate through the glue outlet holes capable of rotating, and the shape and the area of the overlapped parts of the glue outlet holes and the glue dropping holes are changed, so that the coating pattern of the photo-curing glue is changed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.
FIG. 1 is a side view of an embodiment of the present invention;
fig. 2 is a front view of a photo-curable adhesive coating unit according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along the direction A-A of FIG. 2;
FIG. 4 is a bottom view of a photo-curable adhesive coating unit according to an embodiment of the present invention, in which an adhesive dripping disc is in a transparent state;
FIG. 5 is a perspective view of a dispensing tray according to an embodiment of the present invention;
FIG. 6 is a perspective view of a bead strip and linear motor according to an embodiment of the present invention;
Fig. 7, fig. 8, fig. 9, fig. 10, fig. 11 and fig. 12 are schematic diagrams of different glue dropping patterns formed by glue dropping discs with different shapes and glue dropping plates with different angles, wherein a solid line rectangular frame in the diagrams is a glue dropping strip, a dotted line rectangular frame is a glue outlet hole, a circle with shadows is a shape of dropping photo-curing glue onto a PCB board, and hollow arrows in the diagrams are the movement directions of the glue dropping strip and the glue dropping disc;
Reference numerals in the drawings are respectively as follows:
1-PCB board, 2-multiaxis robot, 21-support, 22-rotating motor, 23-linear motor, 24-bearing, 3-glue dropping disk, 31-glue outlet hole, 32-chamfer, 33-rotating shaft, 34-glue injection hole, 4-glue dropping plate, 41-glue dropping strip, 42-glue dropping hole, 43-connecting block and 5-glue dropping pattern.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Because the sprayable areas and sprayable widths of different parts on the PCB 1 are also different, the caliber and shape of the optimal spray gun are also different, 1-2 spray guns are not enough to adapt to all specifications of the PCB 1, the edges of the spraying parts of the spray guns always easily appear parts needing to be coated, the spraying efficiency is obviously reduced, and however, 3 or more spray guns can obviously improve the cost and complexity of equipment.
To solve this problem, the present embodiment provides a coating system in which the coating area is controllably adjusted.
Fig. 1 shows a side view of a PCB coating system, and in combination with fig. 1, the PCB coating system includes a multi-axis robot 2 and a PCB coating device, the PCB coating device is mounted on an execution portion of the multi-axis robot 2, and the multi-axis robot 2 moves according to a preset path and speed, so that the PCB coating device performs a spraying operation at a designated position of the PCB 1, and it is ensured that the photo-curable glue is uniformly covered on a desired area.
Fig. 2 shows a front view of the PCB coating apparatus, fig. 3 shows a cross-sectional view in A-A direction of fig. 2, fig. 4 shows a bottom view of the PCB coating apparatus, and part of the parts in fig. 4 are transparent, and the PCB coating apparatus includes, in combination with fig. 2, 3 and 4:
The dispensing tray 3 has a rectangular dispensing hole 31 at one end in the axial direction of the dispensing tray 3, a dispensing hole 34 at the other end, and a cavity for temporarily accommodating the photo-curable adhesive is formed between the dispensing hole 31 and the dispensing hole 34, and the photo-curable adhesive is injected into the cavity through the dispensing hole 34.
The glue dropping plate 4 is attached to the glue dropping disc 3 and covers the glue outlet holes 31, the glue dropping plate 4 comprises a plurality of glue dropping strips 41 which are arranged side by side along the width direction of the glue dropping plate, at least one glue dropping hole 42 is formed in each glue dropping strip 41, a plurality of glue dropping holes 42 form a glue dropping hole group, and a glue outlet channel which allows photo-curing glue to move from the inner side of the cavity to the outer side of the cavity is formed in the overlapping area of the glue outlet holes 31 and the glue dropping hole group.
The glue dropping disc 3 can rotate around the axis of the glue dropping disc 3 so as to change the angle of the glue outlet hole 31, the glue dropping strip 41 can move along the length direction of the glue dropping disc 3 so as to change the position of the glue dropping hole 42, the shape of the glue dropping hole group is changed, and along with the movement of the glue dropping disc 3 and the glue dropping strip 41, the area and the shape of the glue outlet channel are changed, so that the photo-curing glue forms coating patterns with different areas and shapes on the PCB 1.
Specific:
Referring to fig. 2 and 3, the support 21, the rotary motor 22, and the linear motor 23 are fixedly mounted on the actuator of the multi-axis robot 2, the dispensing tray 3 is rotatably connected to the support 21, the dispensing tray 3 is in transmission connection with the actuator of the rotary motor 22, the dispensing strip 41 is slidably connected to the support 21, and the dispensing strip 41 is in transmission connection with the actuator of the linear motor 23.
Referring to fig. 3, one end of the glue dropping disc 3 far away from the glue outlet hole 31 is connected with a rotating shaft 33, the rotating shaft 33 is connected with a bracket 21 through a bearing 24, the rotating shaft 33 is connected with an output shaft of the rotating motor 22 through a coupler, the rotating shaft 33 is hollow, one end of the rotating shaft 33 is connected with the glue outlet hole 31, the other end of the rotating shaft 33 is connected with a glue injection pump through a glue injection pipe which radially penetrates through the rotating shaft 33, the glue injection pump is used for extracting photo-curing glue from a photo-curing glue storage container, the photo-curing glue is then output to the inside of the glue outlet hole 31 through the glue injection pipe and the rotating shaft 33, and the photo-curing glue accumulated between the glue outlet hole 31 and the glue dropping plate 4 is dropped towards the PCB board 1 through a plurality of glue dropping holes 42, and the coupler, the glue injection pump and the storage container are not shown in fig. 3.
Fig. 6 shows the adhesive tape 41 and the linear motor 23, and in combination with fig. 6, the two ends of the adhesive tape 41 are provided with connecting blocks 43, and the connecting blocks 43 are fixedly connected with the execution part of the linear motor 23.
In connection with fig. 4, the following are further described:
when the number of the glue-dropping holes 42 on each glue-dropping strip 41 is larger than 1, the glue-dropping holes 42 are equally spaced along the length direction of the glue-dropping strip 41, and the number of the glue-dropping holes 42 on each glue-dropping strip 41 is preferably 2.
The distance between the axes of two adjacent glue-dispensing holes 42 on each glue-dispensing strip 41 is greater than the diameter of the glue-dispensing hole 42 and less than twice the diameter of the glue-dispensing hole 42, the distance between the axes of two adjacent glue-dispensing holes 42 being preferably 1.25 times the diameter of the glue-dispensing hole 42.
The width of the glue drops 41 is equal to the distance between the axes of two adjacent glue drop holes 42 on each glue drop 41.
An angle of 45 ° is formed between the longitudinal direction of the adhesive tape 41 and the longitudinal direction of the adhesive outlet 31.
Fig. 5 shows a perspective view of the glue dispensing tray 3, in combination with fig. 5, the four corners of the glue outlet hole 31 are provided with chamfers 32, the length of the right-angle sides of the chamfers 32 is equal to the width of the glue dispensing strips 41, and the chamfers 32 are used for reducing the number of the glue dispensing strips 41 required to completely cover the glue outlet hole 31.
The working principle of the PCB coating apparatus is described below, and six different glue dropping patterns 5 are shown in fig. 7 to 12, wherein a solid rectangular frame in the drawing is a glue dropping strip 41, a dotted rectangular frame is a glue outlet 31, a circle with a shadow is a shape in which a photo-curing glue is dropped onto a PCB, and hollow arrows in the drawing are moving directions of the glue dropping strip 41 and the glue dropping tray 3.
With reference to fig. 7 to 12, as the glue bead 41 moves and the glue tray 3 rotates, the PCB board coating apparatus can compose at least six different glue drop patterns 5, such as the continuous rectangular glue drop patterns 5 shown in fig. 7 to 10, and the middle broken rectangular glue drop patterns 5 shown in fig. 11 and 12.
The PCB coating apparatus in fig. 7 to 12 moves in a direction from the left side of the drawing to the right side of the drawing, and the photo-setting paste dropped onto the PCB spreads toward the periphery of itself, thereby filling the surface of the PCB.
The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, the scope of which is defined by the claims. Various modifications and equivalent arrangements of this invention will occur to those skilled in the art, and it is intended to be within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. PCB board coating device that coating area is controllable to be adjusted, characterized in that includes:
a glue dropping disc (3), wherein one end of the glue dropping disc (3) in the axial direction is provided with a rectangular glue outlet hole (31), the other end of the glue dropping disc is provided with a glue injection hole (34), a cavity for temporarily accommodating photo-curing glue is formed between the glue outlet hole (31) and the glue injection hole (34), and the photo-curing glue is injected into the cavity through the glue injection hole (34);
The glue dropping plate (4) is attached to the glue dropping disc (3) and covers the glue outlet holes (31), the glue dropping plate (4) comprises a plurality of glue dropping strips (41) which are arranged side by side along the width direction of the glue dropping plate, at least one glue dropping hole (42) is formed in each glue dropping strip (41), a glue dropping hole group is formed by a plurality of glue dropping holes (42), and a glue outlet channel allowing the photo-curing glue to move from the inner side of the cavity to the outer side of the cavity is formed in the overlapping area of the glue outlet holes (31) and the glue dropping hole group;
The glue dropping disc (3) can rotate around the axis of the glue dropping disc, so that the angle of the glue outlet hole (31) is changed;
The adhesive dropping strip (41) can move along the length direction of the adhesive dropping strip so as to change the position of the adhesive dropping hole (42) and change the shape of the adhesive dropping hole group;
along with the movement of the glue dropping disc (3) and the glue dropping strip (41), the area and the shape of the glue outlet channel are changed, so that the photo-curing glue forms coating patterns with different areas and shapes on the PCB (1).
2. The coating area-controllable and adjustable PCB coating device according to claim 1, wherein,
Still include support (21), rotating electrical machines (22) and linear electric motor (23), glue dripping dish (3) with support (21) can rotationally be connected, glue dripping dish (3) with the execution portion transmission of rotating electrical machines (22) is connected, glue dripping strip (41) with support (21) can be connected with sliding, glue dripping strip (41) with the execution portion transmission of linear electric motor (23) is connected.
3. A coating device for a PCB with a controllable and adjustable coating area according to claim 2, wherein,
One end of the glue dripping disc (3) far away from the glue outlet hole (31) is connected with a rotating shaft (33), the rotating shaft (33) is connected with the bracket (21) through a bearing (24), and the rotating shaft (33) is connected with an output shaft of the rotating motor (22) through a coupler.
4. A coating area controllably adjustable PCB coating device according to claim 3, wherein,
The rotary shaft (33) is hollow, one end of the rotary shaft (33) is connected with a glue outlet hole (31), the other end of the rotary shaft (33) is connected with a glue injection pump through a glue injection pipe which radially penetrates through the rotary shaft (33), the glue injection pump is used for extracting photo-curing glue from a storage container of photo-curing glue, then the photo-curing glue is output to the inside of the glue outlet hole (31) through the glue injection pipe and the rotary shaft (33), and photo-curing glue stored between the glue outlet hole (31) and the glue dropping plate (4) is dropped towards the PCB (1) through a plurality of glue dropping holes (42).
5. A coating device for a PCB with a controllable adjustment of a coating area according to any one of the claims 2 to 4, characterized in that,
When the number of the glue dropping holes (42) on each glue dropping strip (41) is larger than 1, the glue dropping holes (42) are distributed at equal intervals along the length direction of the glue dropping strips (41).
6. The coating area-controllable PCB coating device according to claim 5, wherein,
The distance between the axes of two adjacent glue-dropping holes (42) on each glue-dropping strip (41) is larger than the diameter of the glue-dropping hole (42) and smaller than twice the diameter of the glue-dropping hole (42).
7. The coating area-controllable PCB coating device of claim 6, wherein,
The distance between the axes of two adjacent glue dropping holes (42) is 1.25 times the diameter of the glue dropping holes (42), and the width of each glue dropping strip (41) is equal to the distance between the axes of two adjacent glue dropping holes (42) on each glue dropping strip (41).
8. The coating area-controllable PCB coating device according to claim 7, wherein,
An included angle of 45 degrees is formed between the length direction of the adhesive dropping strip (41) and the length direction of the adhesive outlet hole (31).
9. The coating area-controllable PCB coating device according to claim 8, wherein,
And chamfering corners of the glue outlet holes (31) are provided with chamfering corners (32), and the waist length of the chamfering corners (32) is equal to the width of the glue dropping strip (41).
10. A PCB board coating system, characterized by having a PCB board coating device according to any one of claims 2-9;
the coating system comprises a multi-axis robot (2), the PCB coating device is mounted on an executing part of the multi-axis robot (2), the multi-axis robot (2) moves according to a preset path and speed, so that the PCB coating device performs spraying operation at a designated position of the PCB (1), the angle of the glue dropping disc (3) and the position of the glue dropping strip (41) are respectively changed through the rotating motor (22) and the linear motor (23), and the photo-curing glue is subjected to spraying operation at different positions of the glue outlet channel of other areas and shapes on the PCB (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411887137.3A CN119327684B (en) | 2024-12-20 | 2024-12-20 | A PCB coating device and coating system with controllable coating area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411887137.3A CN119327684B (en) | 2024-12-20 | 2024-12-20 | A PCB coating device and coating system with controllable coating area |
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| Publication Number | Publication Date |
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| CN119327684A CN119327684A (en) | 2025-01-21 |
| CN119327684B true CN119327684B (en) | 2025-03-07 |
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| CN202411887137.3A Active CN119327684B (en) | 2024-12-20 | 2024-12-20 | A PCB coating device and coating system with controllable coating area |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103688602A (en) * | 2011-07-08 | 2014-03-26 | 住友重机械工业株式会社 | Method for manufacturing substrate and substrate manufacturing device |
| CN104460125A (en) * | 2014-12-08 | 2015-03-25 | 合肥鑫晟光电科技有限公司 | Liquid crystal coating nozzle and liquid crystal coating device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG99920A1 (en) * | 2000-07-18 | 2003-11-27 | Matsushita Electric Industrial Co Ltd | Screen printing apparatus and method of the same |
| JP2010040323A (en) * | 2008-08-05 | 2010-02-18 | Panasonic Corp | Liquid drop discharge device, liquid drop discharge method, and manufacturing method of organic el element |
| CN102221784B (en) * | 2010-04-19 | 2013-07-24 | 北京京东方光电科技有限公司 | Glue coating device and glue coating method |
| CN206240738U (en) * | 2016-12-05 | 2017-06-13 | 深圳市劲华电子材料有限公司 | A kind of adjustable drop glue head of adhesive dripping machine |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103688602A (en) * | 2011-07-08 | 2014-03-26 | 住友重机械工业株式会社 | Method for manufacturing substrate and substrate manufacturing device |
| CN104460125A (en) * | 2014-12-08 | 2015-03-25 | 合肥鑫晟光电科技有限公司 | Liquid crystal coating nozzle and liquid crystal coating device |
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| CN119327684A (en) | 2025-01-21 |
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