CN119324160B - Wafer and sealing ring assembling and alignment calibration detection process - Google Patents
Wafer and sealing ring assembling and alignment calibration detection process Download PDFInfo
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- CN119324160B CN119324160B CN202411848229.0A CN202411848229A CN119324160B CN 119324160 B CN119324160 B CN 119324160B CN 202411848229 A CN202411848229 A CN 202411848229A CN 119324160 B CN119324160 B CN 119324160B
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- 238000007789 sealing Methods 0.000 title claims abstract description 172
- 238000001514 detection method Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000008569 process Effects 0.000 title claims abstract description 27
- 230000003287 optical effect Effects 0.000 claims description 35
- 238000001179 sorption measurement Methods 0.000 claims description 35
- 230000000007 visual effect Effects 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 11
- 238000010191 image analysis Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims 47
- 238000003384 imaging method Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000012795 verification Methods 0.000 abstract description 3
- 230000033001 locomotion Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 5
- 230000007306 turnover Effects 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Image Analysis (AREA)
Abstract
本发明公开了晶圆和密封环的装配及对位校准的检测工艺，其包括晶圆和密封环的装配步骤和图像对位校准步骤。本发明一方面基于密封环和晶圆保持同步、且零扭矩下自中心对齐的完成晶圆、密封环和挂具的组装，以降低密封环和晶圆脱离导致密封失效率；另一方面采用光束所形成反射成像原理，结合挂具沿着环形阵列的径向将整个密封环逐步送至光束检测区，更准确地拼凑所成像的外轮廓样本和位于所述光束检测区的全部密封环所形成的外轮廓对样本，同时基于外轮廓样本判断密封环的内外轮廓同心对齐度以形成初步判定，再由外轮廓样本和外轮廓对样本比对分析以校准密封环的圆心位置以形成验证判定，从而更准确地获得检测结果。
The present invention discloses a detection process for assembly and alignment of a wafer and a sealing ring, which includes an assembly step of the wafer and the sealing ring and an image alignment step. On the one hand, the present invention completes the assembly of the wafer, the sealing ring and the hanger based on the synchronization of the sealing ring and the wafer and the self-centering alignment under zero torque, so as to reduce the sealing failure rate caused by the separation of the sealing ring and the wafer; on the other hand, the reflection imaging principle formed by the light beam is adopted, and the entire sealing ring is gradually sent to the light beam detection area along the radial direction of the annular array in combination with the hanger, so as to more accurately piece together the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings located in the light beam detection area, and at the same time, the concentric alignment of the inner and outer contours of the sealing ring is judged based on the outer contour sample to form a preliminary judgment, and then the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the center position of the sealing ring to form a verification judgment, so as to obtain a more accurate detection result.
Description
Technical Field
The invention belongs to the technical field of detection, and particularly relates to a detection process for assembly and alignment calibration of a wafer and a sealing ring.
Background
At present, for the assembly of the wafer and the sealing ring, firstly, centering adjustment is carried out on the wafer to ensure that the center of the subsequent wafer is aligned with the center of a mounting groove on the hanger, then, the wafer is transferred to a loading sucker, the loading sucker is driven to turn over and be matched with the mounting groove on the hanger so as to transfer and adsorb the wafer on the hanger, then, the sealing ring is loaded in the mounting groove on the hanger, the sealing ring is kept to be in contact with the edge of the wafer to form a seal, and the sealing ring is locked with the hanger when rotating around the center line of the sealing ring.
However, whether the sealing ring is installed in place or whether the center has a deviation will directly affect the later electroplating treatment, therefore, further calibration alignment detection of the wafer sealing ring is required, in conventional detection, a visual camera is adopted to take a picture, then the picture taken is compared and analyzed, and finally the alignment accuracy is determined based on the analysis result, and obviously, the following technical defects exist:
1) The visual camera has the limitations of angle, focal length and the like, and the accuracy of the acquired photo information can not be ensured, so that the detection error rate is large, the detection result can not be effectively verified, and the tightness can not meet the later electroplating implementation requirement.
2) In image acquisition, external interference (such as beam interference, hanger shake, etc.) is easily received, so that the quality of the acquired image cannot meet the detection requirement.
3) In the rotary assembly, the rotary buckle is generated by the sealing ring relative to the wafer and the hanger, and the edges of the wafer are pressed to form the seal between the sealing ring and the wafer, however, the sealing ring is in a twisted state when the rotary buckle is assembled, so that the sealing ring keeps the movement trend of restoring the natural state to seal, the service life is low, and once the sealing ring is subjected to external force, the sealing ring and the wafer are easily caused to relatively shift.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing an improved detection process for assembling and alignment calibration of a wafer and a sealing ring.
In order to solve the technical problems, the invention adopts the following technical scheme that the detection process for assembling and aligning calibration of the wafer and the sealing ring comprises the following steps:
S1, assembling wafer and sealing ring
Pressing the wafer from the edge and the sealing ring on the assembly carrier, turning the assembly carrier to a vertical state, and then turning the assembly carrier to assemble the wafer and the sealing ring on the hanger;
s2, image alignment calibration
(1) Image acquisition
(2) Image analysis
Comparing the obtained objects in the step (1) to calibrate the posture and the central position of the sealing ring, particularly, in the step (S1), attaching the wafer to the sealing ring in alignment with the center of the sealing ring based on negative pressure, and then keeping synchronous rotation by the wafer and the sealing ring so as to assemble the wafer on the hanger;
In step S2, the adopted light path unit comprises a plurality of light path emitting components distributed in an annular array and light path reflecting components which are aligned by taking the center of the annular array as a reference, wherein light beams emitted by the light path emitting components form a light beam detection area, the adopted image processing unit comprises a visual camera which is aligned with the center of the light path reflecting components and is positioned below the light path reflecting components and an image processor, in the step (1), the whole sealing ring is gradually sent to the light beam detection area along the radial direction of the annular array by a hanging tool in the image acquisition of step (1), contour information of the sealing ring is continuously imaged on the light path emitting components in the reflection of the light beams, then pictures are acquired by the visual camera to splice an outer contour sample formed by the imaged outer contour sample and all sealing rings positioned in the light beam detection area, and in the step (2), in the image analysis, the concentric alignment degree of the inner contour and the outer contour of the sealing ring is judged by the outer contour sample and the outer contour sample is compared with the sample so as to calibrate the circle center position of the sealing ring.
Preferably, in step S1, the wafer is suction-pressed against the sealing ring based on the negative pressure. The offset rate of the sealing ring and the wafer to the assembly is reduced, and the accuracy of the alignment assembly is improved.
Further, the sealing ring is also installed on the assembly carrier in a negative pressure absorption mode. The assembly is carried out on the premise of keeping the two parts stationary.
According to one specific implementation and preferred aspect of the present invention, the assembly carrier includes a carrier body having an assembly surface, a first adsorption ring and a second adsorption ring formed on the assembly surface, wherein the first adsorption ring and the second adsorption ring are concentric, and the first adsorption ring is located at an outer periphery of the second adsorption ring, the first adsorption ring is used for adsorption of the seal ring, and the second adsorption ring is used for adsorption of the wafer. Based on the concentric rings, the wafer and the sealing ring are respectively adsorbed and fixed, so that the alignment firmness of the wafer and the sealing ring is greatly improved, and the wafer and the sealing ring can keep synchronous movement (namely, no relative displacement is generated).
According to a further specific implementation and preferred aspect of the present invention, in step S1, the seal ring assembling unit further includes an assembling power part driving the assembling carrier to rotate around its own axis, and a turning power part driving the assembling carrier to turn over so as to face the wafer and the seal ring to the carrier, wherein the wafer holder is provided on the carrier, and the wafer and the seal ring turned over toward the wafer holder are loaded or unloaded by the driving of the assembling power part. Satisfy rotatory assembly or rotatory dismantlement to improve the dismouting efficiency of wafer sealing ring subassembly.
Preferably, the rotation axis formed by assembling the power member is disposed to intersect with the rotation axis formed by flipping the power member. Here, two rotation axes intersect at a point, can reduce the required motion space of assembly carrier, be convenient for promote the compactibility of structure.
Further, the sealing ring assembling unit also comprises a translation power component for driving the assembling carrier to reciprocate along the direction of the central line of the assembling carrier.
In some embodiments, a guide channel is formed on the carrier, the guide channel extends vertically and is matched with the wafer rack, the wafer rack is inserted in the guide channel, and the transfer device is used for driving the wafer rack to move up and down along the guide channel.
Preferably, the wafer and the sealing ring are loaded in a mounting groove on the wafer rack, and the image processor is used for detecting whether the circle centers of the wafer and the sealing ring are aligned with the center of the mounting groove based on the comparison of the sealing ring and the edge of the mounting groove.
According to a further specific implementation and preferred aspect of the present invention, in the step (2) image analysis, the outer contour samples are formed by continuous dynamic stitching or segmented picture stitching. The required outer contour sample can be formed whether the information is acquired dynamically or statically, and the alignment degree of the inner contour and the outer contour of the outer contour sample can also detect the circle center position.
According to yet another specific implementation and preferred aspect of the present invention, in the step (2) image analysis, the outer contour pair sample is acquired by the vision camera based on the center of the seal ring aligned with the center of the light beam detection area. Accurate acquisition of verification information is ensured, and thus the formed result is more accurate.
According to still another specific implementation and preferred aspect of the present invention, each of the light path emitting components includes an emitting body for emitting a light beam, and a light-transmitting cover which is disposed on the emitting body and is capable of transmitting light, wherein a center line of the light-transmitting cover is disposed to intersect with a center line of the annular array, and an angle between the center line of the light-transmitting cover and the center line of the annular array is equal to a refractive angle formed by the light beam passing through the light-transmitting cover. The light beams formed in this way can be emitted in a relatively concentrated or overlapping annular shape, and no interference exists between the light beams.
Preferably, the light beams formed by the light-transmitting covers are spliced in the annular circumferential direction to form the light beam detection area, the light beam detection area is annular, and the center of the sealing ring and the center of the light beam detection area are positioned on the same straight line. Further, the inner and outer contours of the seal ring are both located within the beam detection region. Here, according to the conventional calculation in optics, the setting of the angle of the light-transmitting cover is determined, and the refraction generated by the light beam passing through the light-transmitting cover is compensated, so that the operation is simple and convenient, and the precision is high.
Further, the translucent cover is the rectangle, and in the orthographic projection on annular array central line extension direction, the medial side of translucent cover is located the inboard of sealing ring, the lateral side is located the outside of sealing ring. Here, each segment on the seal ring is ensured to be within the beam detection zone.
Preferably, the light beam emitted by each light path emitting member is disposed perpendicularly to the plane in which the seal ring is disposed. Under the irradiation of the vertical light beam, the formation of a shadow part is avoided, and the quality of the reflected image is effectively improved. The orientation of each light path emitting component intersects with or is arranged in parallel with the extending direction of the central line of the annular array. In practical application, the existing light path emitting component inevitably generates refraction (the refraction angle is determined by the adopted light-transmitting element material) when emitting the light beam, so the application adjusts the orientation of the light beam emitting component according to the refraction condition of the light beam emitted by the adopted light path emitting component so as to ensure that the light beam can vertically irradiate the sealing ring.
According to still another specific implementation and preferred aspect of the present invention, in step S1, the wafer assembling unit includes a wafer carrier, an alignment power unit for driving the wafer carrier and adjusting its own center, and a lifting power unit.
The alignment power component comprises a centering module used for detecting the edge of the wafer to determine the center of the wafer, and an alignment module used for driving the wafer carrying disc and driving the center of the wafer to be aligned with the center of the sealing ring, wherein the centering module comprises a plurality of detection cameras which are circumferentially distributed at intervals around the wafer carrying disc, the wafer is horizontally arranged on the wafer carrying disc and keeps the corresponding part on the edge in a detection area formed by each detection camera, and/or the wafer is provided with a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are perpendicular to each other, the alignment module comprises a first alignment power piece used for driving the wafer carrying disc to reciprocate along the first radial direction and a second alignment power piece used for driving the wafer carrying disc to reciprocate along the second radial direction, and the alignment module further comprises a third alignment power piece used for driving the wafer carrying disc to rotate along the center line direction of the wafer carrying disc.
The wafer can be directly aligned and adjusted by taking the sealing ring as a reference, the wafer and the sealing ring are accurately assembled in the lifting motion, and meanwhile, the center position of the wafer is determined by the edge of the wafer, so that the centering precision is high. The detection cameras are used for synchronously detecting at least three positions in the edge of the wafer, so that the center of the wafer is accurately determined, in addition, the wafer carrying disc can be quickly and accurately moved to the centering position by moving in the first radial direction and the second radial direction which are perpendicular to the wafer, and meanwhile, the wafer carrying disc rotates around the center line of the wafer carrying disc, so that edge searching and calibration of the wafer are synchronously realized.
According to still another specific implementation and preferred aspect of the invention, the wafer carrying disc is provided with a plurality of vacuum adsorption holes which are distributed in an annular interval way, the wafer is horizontally placed on the wafer carrying disc and adsorbed on the wafer carrying disc through the plurality of vacuum adsorption holes, the middle part of the wafer carrying disc is provided with a lifting channel, the lifting power part comprises a lifting sucker arranged in the lifting channel and a lifting power part for driving the lifting sucker to move up and down along the lifting channel, when the lifting sucker is aligned, the lifting sucker is positioned in the lifting channel, and when the wafer carrying disc is assembled, the lifting sucker is adsorbed on the bottom surface of the wafer and moves upwards to drive the wafer to be assembled on the assembly carrier. The wafer can be assembled with the sealing ring in a state of being kept in alignment with the sealing ring, and meanwhile, the wafer is simple in structure and convenient to install and implement.
According to still another specific implementation and preferred aspect of the present invention, the optical path unit further includes a support formed with a detection window, wherein a plurality of optical path emitting parts are distributed around the detection window, and the optical path reflecting parts include a plane mirror mounted on the support and extending obliquely upward and downward, wherein the plane mirror can acquire part or the entire profile information reflected by the seal ring through the detection window. The structure is simple, and the installation and the implementation are convenient.
Preferably, the upper side of the plane mirror passes through the detection window in a direction approaching the sealing ring and emerges from the light path emitting component. The light beam emitted by the light path emitting component is prevented from being mistakenly incident into the plane mirror to form reflection under refraction, and interference to image information acquired by the camera is reduced.
Due to the implementation of the technical scheme, compared with the prior art, the invention has the following advantages:
In the assembly and calibration of the existing wafer and sealing ring, the accuracy of the acquired photo information cannot be ensured due to the limitations of angles, focal lengths and the like of a visual camera, so that the detection error rate is large, the detection result cannot be effectively verified, and the tightness cannot meet the requirement of later electroplating implementation; in addition, in the rotary assembly, the wafer is pressed on the assembly carrier from the edge and the sealing ring after the assembly and the alignment and alignment detection process are adopted, the assembly carrier is turned to a vertical state, then the wafer and the sealing ring are assembled on the hanger by the knob, the sealing ring keeps the movement trend to restore the natural state for sealing, the service life is low, once the relative displacement and the like of the sealing ring and the wafer are easily caused by external force, the application integrally designs the assembly and alignment detection process of the wafer and the sealing ring, skillfully solves the defects and the shortcomings of the prior art, and after the assembly and alignment detection process of the wafer and the sealing ring are adopted, firstly, the wafer is pressed on the assembly carrier from the edge and the sealing ring, the assembly carrier is turned to the vertical state, and then the sealing ring is assembled on the hanger by the knob, secondly, the wafer is aligned with the center on the basis of negative pressure, then the assembly and the sealing ring is maintained on the ring is arranged on the ring, and finally the whole optical path is imaged by the annular array after the assembly and the alignment and alignment detection process is carried out, the optical path of the optical path is gradually formed by the annular array, the visual camera acquires pictures to splice the imaged outer contour sample and the outer contour pair sample formed by all sealing rings positioned in the light beam detection area, and meanwhile, the outer contour sample and the outer contour pair sample are compared and analyzed to calibrate the circle center position of the sealing ring, so that compared with the prior art, the application completes the assembly of the wafer, the sealing ring and the hanging tool based on the fact that the sealing ring and the wafer are kept synchronous and aligned from the center under zero torque on one hand, so as to reduce the sealing failure rate caused by the separation of the sealing ring and the wafer; on the other hand, the principle of reflection imaging formed by light beams is adopted, the whole sealing ring is gradually sent to a light beam detection area along the radial direction of the annular array by combining the hanging tool, the imaged outer contour sample and the outer contour pair sample formed by all the sealing rings in the light beam detection area are spliced more accurately, meanwhile, the concentric alignment degree of the inner contour and the outer contour of the sealing ring is judged based on the outer contour sample to form preliminary judgment, and then the circle center position of the sealing ring is calibrated by comparing the outer contour sample and the outer contour pair sample to form verification judgment, so that the detection result is obtained more accurately.
Drawings
FIG. 1 is a structural view of the wafer and seal ring inspection apparatus of the present invention (with the mounting carrier vertical);
FIG. 2 is a structural view (another perspective) of the wafer and seal ring inspection apparatus of the present invention;
FIG. 3 is a schematic front view of FIG. 1 (with the mounting vehicle vertical);
FIG. 4 is a schematic front view of FIG. 1 (assembly carrier level);
FIG. 5 is a schematic view of the seal ring assembly unit of FIG. 1;
FIG. 6 is a schematic diagram of the wafer assembly unit of FIG. 1;
FIG. 7 is a schematic diagram of the detecting device in FIG. 1;
FIG. 8 is a schematic front view of FIG. 7;
FIG. 9 is a left side schematic view of FIG. 8;
FIG. 10 is a schematic cross-sectional view taken along line A-A of FIG. 8;
① parts of a carrier, 1 parts of a guide channel;
② . The device comprises an assembling device, a wafer assembling unit, a wafer carrying disc, a 21, an alignment power part, an a, a centering module, a1, a detection camera, a b, an alignment module, a b1, a first alignment power part, a b11, a first base, a b12, a second base, a b2, a second alignment power part, a b20, a third base, a b3, a third alignment power part, a b30, a rotating seat, a b31, a third power part, a 22, a lifting power part, a c, a lifting sucker, a d, a lifting power part, a t, a lifting channel, a3, a sealing ring assembling unit, a 30, an assembling carrier, f, a carrier body, h1, a first adsorption ring, h2, a second adsorption ring, 31, an assembling power part, 32, a turnover power part, 33 and a translation power part;
③ . Detecting device 4, transfer device 5, light path unit 50, bracket k, detecting window 51, light path emitting component 510, emitting body 511, light transmission cover 52, light path reflecting component 520, plane mirror 6, image processing unit 60, visual camera;
m, a sealing ring, J, a wafer and G, a hanging tool.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As shown in fig. 1 to 10, in the process of assembling and aligning the wafer and the seal ring according to the present embodiment, the wafer and the seal ring inspection apparatus includes a carrier ①, an assembling device ②, and an inspecting device ③.
Specifically, the carrier ① is disposed along the up-down direction, and a guide channel 1 extending up and down is formed on the carrier ①, and the hanger G is mounted on the guide channel 1 in a manner of moving up and down from two opposite sides.
The assembling device ② is used for relatively assembling the sealing ring M, the wafer J and the hanging tool G, wherein the assembling is divided into a first step of assembling the sealing ring M and the wafer J in alignment to form a wafer sealing ring assembly, and a second step of assembling a wafer sealing ring assembly knob on the hanging tool G.
In some embodiments, the assembly device ② comprises a wafer assembly unit 2 and a sealing ring assembly unit 3, wherein the wafer assembly unit 2 comprises a wafer carrying disc 20, an alignment power part 21 for driving the wafer carrying disc 20 and driving a wafer J to adjust the center of the wafer carrying disc, and a lifting power part 22, the sealing ring assembly unit 3 comprises an assembly carrier 30 arranged above the wafer carrying disc 20 and used for aligning and assembling the sealing ring M and the wafer J, an assembly power part 31 for driving the assembly carrier 30 to rotate around the axis of the wafer carrying disc, and a turnover power part 32 for driving the assembly carrier 30 to turn over so as to enable the sealing ring M and the wafer J to face the carrier 1, wherein the sealing ring M and the wafer J turned over towards the wafer hanging tool G are loaded or unloaded under the driving of the assembly power part 31.
In this example, the wafer carrier 20 has a plurality of vacuum adsorption holes distributed in annular space, the wafer J is horizontally placed and adsorbed on the wafer carrier 20 by a plurality of vacuum adsorption holes, the middle part of the wafer carrier 20 is provided with a lifting channel t, the lifting power component 22 comprises a lifting sucker c arranged in the lifting channel t and a lifting power component d for driving the lifting sucker c to move up and down along the lifting channel t, when the wafer carrier is aligned, the lifting sucker c is positioned in the lifting channel t, and when the wafer carrier is assembled, the lifting sucker c is adsorbed on the bottom surface of the wafer J and moves upwards to drive the wafer to be assembled on the assembly carrier 30. The wafer can be assembled with the sealing ring in a state of being kept in alignment with the sealing ring, and meanwhile, the wafer is simple in structure and convenient to install and implement.
In the first assembling step, the assembling carrier 30 horizontally forms an assembling surface from the bottom, the sealing ring M is horizontally positioned on the bottom of the assembling carrier 30, the wafer J is placed on the wafer carrier plate 20, and the center position of the wafer J is adjusted based on the center position of the sealing ring M by the alignment power component 21, wherein the alignment power component 21 comprises a centering module a for detecting the edge of the wafer J to determine the center of the wafer, and an alignment module b for driving the wafer carrier plate 20 and driving the center of the wafer J to align with the center of the sealing ring M. The centering module a comprises three detection cameras a1 which are circumferentially distributed around the wafer carrier plate 20 at intervals, the wafer J is horizontally placed on the wafer carrier plate 20, the edge of the wafer J protrudes out of the wafer carrier plate 20 and keeps the corresponding position on the edge in a detection area formed by the three detection cameras a1, and the center position of the wafer J is automatically searched through linkage of the three detection cameras a 1.
In some embodiments, the wafer J has a first radial direction and a second radial direction, wherein the first radial direction and the second radial direction are vertically arranged, the alignment module b comprises a first alignment power part b1 driving the wafer carrier 20 to reciprocate along the first radial direction, a second alignment power part b2 driving the wafer carrier 20 to reciprocate along the second radial direction, a third alignment power part b3 driving the wafer carrier 20 to rotate around the self center line direction, the first alignment power part b1 comprises a first base b11, a second base b12 slidingly connected on the first base b11 along the first radial direction, a first power part driving the second base b12 to reciprocate along the first radial direction, three detection cameras a1 are fixed on the first base b11, the second power part b2 comprises a third base b20 slidingly connected on the second base b12 along the second radial direction, a third power part b3 driving the third base b20 to reciprocate along the second radial direction, the third alignment power part b3 comprises a rotary base 20 rotatably arranged on the third base b and a rotary base 30 fixedly arranged on the third base 30 and a rotary base 30 fixedly connected on the bottom of the third base b30 along the first radial direction. In some embodiments, the first power member and the second power member may be any conventional linear driving mechanism, and the third power member b31 adopts a belt transmission.
In some embodiments, the assembly carrier 30 includes a carrier body f, a first adsorption ring h1 and a second adsorption ring h2 formed at the assembly surface, wherein the first adsorption ring h1 and the second adsorption ring h2 are concentric, and the first adsorption ring h1 is located at the outer circumference of the second adsorption ring h2, the first adsorption ring h1 is used for adsorption of the sealing ring M, and the second adsorption ring h2 is used for adsorption of the wafer J. Based on the concentric rings, the wafer and the sealing ring are respectively adsorbed and fixed, so that the alignment firmness of the wafer and the sealing ring is greatly improved, and the wafer and the sealing ring can keep synchronous movement (namely, no relative displacement is generated). The seal ring assembling unit 3 further includes a translation power member 33 for driving the assembling carrier 30 to reciprocate along the direction of its own center line, and the rotation axis formed by the assembling power member 31 is disposed to intersect with the rotation axis formed by the turning power member 32. Here, two rotation axes intersect at a point, can reduce the required motion space of assembly carrier, be convenient for promote the compactibility of structure.
In this example, the inspection device ③ includes a transfer device 4, an optical path unit 5, and an image processing unit 6, wherein the transfer device 4 is located above the carrier ① and drives the rack G to move up and down along the up-down direction, the optical path unit 5 includes a support 50 formed with an inspection window k, a plurality of optical path emitting components 51 installed on the support 50 and distributed in an annular array around the inspection window k, and optical path reflecting components 52 aligned with the center of the annular array, wherein the optical beams emitted by the plurality of optical path emitting components 51 form an optical beam inspection area, the center lines of the wafer J and the sealing ring M loaded on the wafer rack G are parallel to the center line of the annular array, wherein the optical beam inspection area can cover the entire sealing ring M, and the wafer rack G moves along the radial direction of the annular array in synchronization with the movement of the wafer rack G, and the sealing ring M can be kept partially or wholly within the optical beam inspection area. The image processing unit 6 includes a vision camera 60 aligned with the center of the optical path reflecting member 52 and located below the optical path reflecting member 52, an image processor (not shown but not easily conceived), and as the wafer holder G moves, the seal ring M passes through the beam detection area segment by segment, the optical path reflecting member 52 acquires contour information reflected by the seal ring M segment by segment, the vision camera 60 converts the contour information into image information and gathers the image information to the image processor to stitch the entire seal ring contour, and detects the center position of the seal ring based on the seal ring contour image.
In some embodiments, the light beam emitted by each light path emitting member 51 is disposed perpendicular to the plane of the seal ring M. Under the irradiation of the vertical light beam, the formation of a shadow part is avoided, and the quality of the reflected image is effectively improved. Meanwhile, the orientation of each optical path emitting member 51 intersects with or is disposed in parallel with the direction in which the center line of the annular array extends. In practical application, the existing light path emitting component inevitably generates refraction (the refraction angle is determined by the adopted light-transmitting element material) when emitting the light beam, so the application adjusts the orientation of the light beam emitting component according to the refraction condition of the light beam emitted by the adopted light path emitting component so as to ensure that the light beam can vertically irradiate the sealing ring. In this example, each light path emitting component 51 includes an emitting body 510 for emitting a light beam, and a light-transmitting cover 511 disposed on the emitting body 510 and capable of transmitting light, wherein a center line of the light-transmitting cover 511 intersects with a center line of the annular array, and an included angle between the center line of the light-transmitting cover 511 and the center line of the annular array is equal to a refractive angle formed by the light beam passing through the light-transmitting cover 511. Here, according to conventional calculation in optics, the setting of the inclination angle of the light-transmitting cover is determined to compensate for refraction generated by the light beam passing through the light-transmitting cover, and the operation is simple and convenient, and the accuracy is high. Further, the translucent cover 511 has a rectangular shape, and in the orthographic projection in the direction of extending the center line of the annular array, the inner side edge of the translucent cover 511 is located inside the seal ring M, and the outer side edge is located outside the seal ring M. Here, each segment on the seal ring is ensured to be within the beam detection zone. The optical path reflecting member 52 includes a flat mirror 520 mounted on the holder 50 and extending obliquely upward and downward, wherein the flat mirror 520 can acquire part or the entire profile information reflected by the seal ring M through the detection window k. The structure is simple, and the installation and the implementation are convenient. It should be noted that, the plane mirror 520 may be a circular, rectangular or other polygonal mirror, so long as the entire sealing ring can be covered in the orthographic projection in the direction extending the center line of the annular array. At the same time, the upper side of the flat mirror 520 passes through the detection window k in a direction approaching the seal ring M and exits the optical path emitting member 51. The light beam emitted by the light path emitting component is prevented from being mistakenly incident into the plane mirror to form reflection under refraction, and interference to image information acquired by the camera is reduced.
In summary, the implementation steps of this embodiment include:
S1, assembling wafer and sealing ring
Laminating the wafer and the center of the sealing ring on the sealing ring based on negative pressure so as to press the wafer and the sealing ring on the assembly carrier from the edge, overturning the assembly carrier to a vertical state, aligning the wafer sealing ring assembly, and then screwing the assembly carrier to assemble the wafer and the sealing ring on the hanger;
s2, image alignment calibration
The image processing unit comprises a visual camera and an image processor which are aligned with the center of the optical path reflecting component and positioned below the optical path reflecting component, in image acquisition, the whole sealing ring is gradually sent to the optical path reflecting component along the radial direction of the annular array by a hanger, contour information of the sealing ring is continuously imaged on the optical path reflecting component in the reflection of the optical beam, then a visual camera acquires pictures to splice an outer contour sample imaged and an outer contour pair sample formed by all sealing rings positioned in the optical path reflecting component, in image analysis, the concentric alignment degree of the inner contour and the outer contour of the sealing ring is firstly judged by the outer contour sample, and then the outer contour pair sample is compared and analyzed to calibrate the circle center position of the sealing ring.
After the detection process of the assembly and alignment calibration of the wafer and the sealing ring is adopted, firstly, pressing the wafer on an assembly carrier from the edge and the sealing ring, turning the assembly carrier to a vertical state, and then turning the assembly carrier to assemble the wafer and the sealing ring on a hanger; finally, the whole sealing ring is gradually sent to a beam detection area by the hanging tool along the radial direction of the annular array, the outline information of the sealing ring is continuously imaged on the light path emission part in the reflection of the light beam, then a picture is acquired by a vision camera to splice an outer contour sample formed by the imaged outer contour sample and all sealing rings positioned in the beam detection area, and meanwhile, the outer contour sample and the outer contour sample are compared and analyzed to calibrate the circle center position of the sealing ring, therefore, compared with the prior art, the invention is based on the assembly of the wafer, the sealing ring and the hanging tool which are synchronously aligned from the center under zero torque, so as to reduce the sealing failure rate caused by the separation of the sealing ring and the wafer, on the other hand, the whole sealing ring is gradually sent to the beam detection area along the radial direction of the annular array by adopting the reflection imaging principle formed by the hanging tool, the outer contour sample formed by splicing and the outer contour sample formed by the imaging and all sealing rings positioned in the beam detection area are more accurately compared and analyzed to calibrate the circle center position of the sealing ring, and the outer contour sample is simultaneously compared and the outer contour sample is formed by the comparison and the outer contour sample is calibrated, and the circle center position of the circle center is compared and analyzed and judged, thereby obtaining the detection result more accurately.
The present invention has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present invention and to implement the same, but not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
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| CN116504698A (en) * | 2022-01-19 | 2023-07-28 | 上海凯世通半导体股份有限公司 | Semiconductor wafer alignment device, alignment method and alignment system |
| CN116995018A (en) * | 2023-07-21 | 2023-11-03 | 苏州纳维科技有限公司 | Adsorption film, wafer detection system and method |
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| CN118706187A (en) * | 2024-06-25 | 2024-09-27 | 南京理工大学 | Adaptive optomechanical device for O-ring dimension measurement and defect detection |
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| CN116504698A (en) * | 2022-01-19 | 2023-07-28 | 上海凯世通半导体股份有限公司 | Semiconductor wafer alignment device, alignment method and alignment system |
| CN116995018A (en) * | 2023-07-21 | 2023-11-03 | 苏州纳维科技有限公司 | Adsorption film, wafer detection system and method |
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