CN118813946A - Method, device and processing system for chamfering hole edges and ultrasonic vibration strengthening of tapered holes - Google Patents

Abstract

The present application relates to the technical field of fatigue-resistant manufacturing of load-bearing holes, and in particular to a method, device and processing system for ultrasonic vibration strengthening of chamfered hole edges and tapered holes, wherein the method comprises: analyzing the strengthening requirements of the chamfered hole edges or tapered holes of the target load-bearing holes; determining the processing parameters of the ultrasonic vibration device, the vibration trajectory and vibration parameters of the target strengthening head according to the current requirements of the chamfered hole edges or tapered holes; controlling the ultrasonic vibration device to apply the vibration trajectory to the target strengthening head according to the processing parameters and vibration parameters, so as to achieve ultrasonic vibration strengthening of the chamfered hole edges or tapered hole walls of the target load-bearing holes. Thus, the problem that the chamfered hole edges and the tapered hole walls cannot be strengthened, resulting in poor overall fatigue resistance of the load-bearing holes, is solved.

Description

Method, device and processing system for chamfering hole edges and conical hole ultrasonic vibration strengthening

Technical Field

The present application relates to the technical field of fatigue-resistant manufacturing of load-bearing holes, and in particular to a method, device and processing system for chamfering hole edges and ultrasonic vibration strengthening of tapered holes.

Background Art

"Load-bearing hole-fastener" is a common connection form in aircraft manufacturing. The load-bearing hole is usually composed of the hole wall and the chamfer of the hole edge. The strengthening of the load-bearing hole is the main content of aircraft anti-fatigue manufacturing, and has received great attention from the industry and scientific research circles in recent years.

In the related art, the existence of chamfered hole edges can reduce stress concentration at the edges of the load-bearing holes and improve assembly efficiency.

However, the current fatigue-resistant manufacturing technologies for load-bearing holes, such as extrusion strengthening and rolling strengthening, focus on strengthening the hole wall, but fail to strengthen the chamfered cone surface at the hole edge, which results in fatigue cracks at the hole edge. The weak fatigue resistance of the hole edge limits the improvement of the overall fatigue resistance of the load-bearing hole. In addition, the existing strengthening technology is only applicable to straight holes, and cannot be used to strengthen tapered holes, which are more prone to fatigue failure due to uneven force.

Summary of the invention

The present application provides a method, device and processing system for chamfering hole edges and strengthening tapered holes by ultrasonic vibration, so as to solve the problems that the chamfering of hole edges and the wall surface of tapered holes cannot be strengthened, resulting in poor overall fatigue resistance of the load-bearing holes.

The first aspect of the present application provides an ultrasonic vibration device, comprising the following steps: a device housing and a strengthening head; a booster, one end of the booster is connected to the strengthening head; a transducer, one end of the transducer is connected to the other end of the booster; a machine tool interface, the other end of the transducer is connected to the machine tool interface, the machine tool interface is connected to the main shaft of the machine tool, and pressure is applied to the strengthening head through the main shaft of the machine tool; a non-contact power transmission system, the non-contact power transmission system is respectively connected to the device housing and the machine tool, and provides an alternating electrical signal to the transducer. When the frequency of the alternating electrical signal is the same as the resonant frequency of the transducer, the vibration is transmitted to the strengthening head through the booster, thereby realizing ultrasonic vibration strengthening of the chamfer of the edge of the target load-bearing hole or the wall of the tapered hole.

Optionally, in one embodiment of the present application, the strengthening head, the booster and the transducer have the same natural frequency.

Optionally, in one embodiment of the present application, the transducer includes a piezoelectric sheet, an electrode sheet, a first mass block and a second mass block, wherein the piezoelectric sheet and the electrode sheet are alternately arranged between the first mass block and the second mass block.

Optionally, in one embodiment of the present application, it also includes: a connecting bolt, through which the first mass block and the second mass block are fixedly connected; a first stud, through which the booster is connected to the second mass block; a second stud, through which the reinforcement head is connected to the booster; and a connecting piece, through which the booster is fixed to the device housing.

The second aspect of the present application provides a processing system, including: a spindle of a machine tool; the above-mentioned ultrasonic vibration device, wherein the machine tool is connected to the ultrasonic vibration device through the spindle, and during the ultrasonic strengthening process, the ultrasonic vibration device is allowed to rotate with the spindle or is allowed not to rotate; a processing control device, which is used to analyze the strengthening requirements of the target load-bearing hole edge chamfer or tapered hole wall, and control the ultrasonic vibration device according to the strengthening requirements to achieve ultrasonic vibration strengthening of the target load-bearing hole edge chamfer or tapered hole wall.

The third aspect of the present application provides a method for ultrasonic vibration strengthening of hole edge chamfering and tapered hole, and the method is applied to the above-mentioned processing system, wherein the method includes the following steps: analyzing the strengthening requirements of the target load-bearing hole edge chamfering or tapered hole; determining the processing parameters of the ultrasonic vibration device, the vibration trajectory and vibration parameters of the target strengthening head according to the current load-bearing hole edge chamfering or tapered hole strengthening requirements; controlling the ultrasonic vibration device to apply the vibration trajectory to the target strengthening head according to the processing parameters and vibration parameters, so as to achieve ultrasonic vibration strengthening of the target load-bearing hole edge chamfering or tapered hole wall.

The fourth aspect of the present application provides an ultrasonic vibration strengthening device for chamfering hole edges and tapered holes, including: a demand analysis module for analyzing the strengthening requirements of the target load-bearing hole edge chamfering or tapered hole wall; a parameter determination module for determining the processing parameters of the ultrasonic vibration device, the vibration trajectory and vibration parameters of the target strengthening head according to the current load-bearing hole edge chamfering or tapered hole wall strengthening requirements; an ultrasonic strengthening module for controlling the ultrasonic vibration device to apply a vibration trajectory to the target strengthening head according to the processing parameters and vibration parameters, so as to achieve ultrasonic vibration strengthening of the target load-bearing hole edge chamfering or tapered hole wall.

The fifth aspect of the present application provides a processing control device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor executing the program to implement the hole edge chamfering and tapered hole ultrasonic vibration strengthening method as described in the above embodiment.

The sixth aspect of the present application provides a computer-readable storage medium on which a computer program is stored. The program is executed by a processor to implement the hole edge chamfering and tapered hole ultrasonic vibration strengthening method as described in the above embodiment.

The seventh aspect of the present application provides a computer program product, including a computer program or instructions. When the computer program is executed, it is used to implement the hole edge chamfering and tapered hole ultrasonic vibration strengthening method as described in the above embodiment.

Therefore, this application includes the following beneficial effects:

The embodiment of the present application implements ultrasonic longitudinal vibration strengthening of the target load-bearing hole chamfer or tapered hole wall by applying a specific vibration trajectory to the strengthening head through an ultrasonic vibration device according to different load-bearing hole edge chamfer or tapered hole wall strengthening requirements, adjusting processing parameters and vibration parameters, so as to cause plastic deformation and compressive residual stress on the chamfered hole edge cone surface and the tapered hole wall, improve the surface quality of the chamfered cone surface and the tapered hole wall surface, and enhance its fatigue resistance. Thus, the problem that the hole edge chamfer and the tapered hole wall surface cannot be strengthened, resulting in poor overall fatigue resistance of the load-bearing hole, is solved.

Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

FIG1 is a block diagram of an ultrasonic vibration device provided according to a specific embodiment of the present application;

FIG2 is a schematic diagram of an ultrasonic vibration device provided according to a specific embodiment of the present application;

FIG3 is a cross-sectional view of an ultrasonic vibration device provided according to a specific embodiment of the present application;

FIG4 is a top view of an ultrasonic vibration device provided according to a specific embodiment of the present application;

FIG5 is a bottom view of an ultrasonic vibration device provided according to a specific embodiment of the present application;

FIG6 is a schematic diagram of a strengthening head structure provided according to a specific embodiment of the present application;

FIG7 is a schematic diagram of a design principle of a strengthening head provided according to a specific embodiment of the present application;

FIG8 is a schematic diagram of a modal simulation result of an ultrasonic vibration device provided according to a specific embodiment of the present application (I);

FIG9 is a schematic diagram of a modal simulation result of an ultrasonic vibration device provided according to a specific embodiment of the present application (II);

FIG10 is a schematic diagram of a modal simulation result of an ultrasonic vibration device provided according to a specific embodiment of the present application (III);

FIG11 is a physical diagram of an ultrasonic vibration device provided according to a specific embodiment of the present application;

FIG12 is an ultrasonic vibration device and a measured diagram of its natural frequency according to a specific embodiment of the present application;

FIG13 is a measured image of a reinforced surface provided according to a specific embodiment of the present application;

FIG14 is a block diagram of a processing system provided according to a specific embodiment of the present application;

FIG15 is a flow chart of a method for ultrasonic vibration strengthening of hole edge chamfering and tapered hole provided according to an embodiment of the present application;

FIG16 is an exemplary diagram of a hole edge chamfering and tapered hole ultrasonic vibration strengthening device provided according to an embodiment of the present application;

FIG. 17 is a schematic diagram of the structure of a processing control device provided according to an embodiment of the present application.

Explanation of reference numerals: first mass block-1, second mass block-2, booster-3, strengthening head-4, connecting bolt-5, first stud-6, second stud-7, 4 electrode sheets-8, 4 piezoelectric sheets-9, contactless power transmission system-10, device housing-11, connector-12, workpiece-13, tapered hole-14, hole edge chamfer-15, machine tool interface-16, busbar length of strengthening head-LL1, busbar length of hole edge chamfer-LL2, busbar length of tapered hole wall-LL3, strengthening head Small diameter - DD1, large diameter of strengthening head - DD2, small diameter of chamfered hole edge - DD3, large diameter of chamfered hole edge - D4D, small diameter of tapered hole - DD5, large diameter of tapered hole - DD6, angle between busbar and axis - θ, length of each section of strengthening head - L1~L6, diameter of each cross section of strengthening head - d1~d7, longitudinal displacement of each section of strengthening head - U1~U6, demand analysis module - 100, parameter determination module - 200, ultrasonic strengthening module - 300, memory - 1701, processor - 1702 and communication interface - 1703.

DETAILED DESCRIPTION

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

The following describes a method, device and processing system for ultrasonic vibration strengthening of chamfered hole edges and tapered holes according to an embodiment of the present application with reference to the accompanying drawings. In response to the problems mentioned in the above background technology, the present application provides a method for ultrasonic vibration strengthening of chamfered hole edges and tapered holes. In this method, according to different requirements for strengthening the chamfered hole edges or tapered hole walls of load-bearing holes, an ultrasonic longitudinal vibration strengthening device is used to apply a vibration trajectory to a structurally matched strengthening head to achieve strengthening of the chamfered hole edges and tapered hole walls. In this way, the problem that the chamfered hole edges and tapered hole walls cannot be strengthened, resulting in poor overall fatigue resistance of the load-bearing holes, is solved.

Specifically, FIG1 is a block diagram of an ultrasonic vibration device provided in an embodiment of the present application.

As shown in FIG. 1 , the ultrasonic vibration device 101 includes: a device housing 11 , a strengthening head 4 , a booster 3 , a machine tool interface 16 and a non-contact power transmission system 10 .

Among them, one end of the booster 3 is connected to the strengthening head 4; one end of the transducer is connected to the other end of the booster 3; the other end of the transducer is connected to the machine tool interface 16, and the machine tool interface 16 is connected to the main shaft of the machine tool, and pressure is applied to the strengthening head 4 through the main shaft of the machine tool; the non-contact power transmission system 10 is respectively connected to the device housing 11 and the machine tool, providing an alternating electrical signal to the transducer. When the frequency of the alternating electrical signal is the same as the resonant frequency of the transducer, the vibration is transmitted to the strengthening head 4 through the booster 3, thereby realizing ultrasonic vibration strengthening of the target load-bearing hole edge chamfer 15 or the tapered hole 14 wall.

It should be noted that during ultrasonic enhancement, the ultrasonic device may or may not rotate.

It can be understood that the high-frequency impact of the conical strengthening head driven by ultrasonic longitudinal vibration induces the chamfering of the hole edge or the plastic deformation of the tapered hole wall, generates residual compressive stress, improves the surface quality, strengthens the hole edge and the tapered hole wall of the load-bearing hole, and enhances the overall fatigue resistance of the load-bearing hole.

In the embodiment of the present application, the reinforcing head 4, the booster 3 and the transducer have the same natural frequency.

The transducer includes a piezoelectric sheet 9 , an electrode sheet 8 , a first mass block 1 and a second mass block 2 , wherein the piezoelectric sheet 9 and the electrode sheet 8 are alternately arranged between the first mass block 1 and the second mass block 2 .

In the embodiment of the present application, the ultrasonic vibration device 101 further includes: a connecting bolt 5 , a first stud 6 , a second stud 7 and a connecting piece 12 .

Among them, the piezoelectric sheets 9 and the electrode sheets 8 are alternately arranged between the first mass block 1 and the second mass block 2; the first mass block 1 and the second mass block 2 are fixedly connected by connecting bolts 5; the booster 3 is connected to the second mass block 2 through the first stud 6, the reinforcement head 4 is connected to the booster 3 through the second stud 7, and the booster 3 is fixed to the device housing 11 through the connecting piece 12.

It should be noted that the number of piezoelectric sheets 9 and electrode sheets 8 is not specifically limited, and four are taken as an example.

Specifically, the four piezoelectric sheets 9 have the same polarity and are alternately arranged with the four electrode sheets 8 between the front mass block 2 and the rear mass block 1, and fixed by connecting bolts 5 to form a transducer. The booster 3 is connected to the front mass block through the first stud 6, and the strengthening head 4 is connected to the booster 3 through the second stud 7. The middle part of the booster 3 is fixed to the device housing 11 through a connector 12, and the device housing 11 is connected to the machine tool spindle through a machine tool interface 16.

Further, the ultrasonic vibration device 101 of the embodiment of the present application comprises: a workpiece 13, a tapered hole 14 and a chamfer 15 for the structure diagram, cross-sectional view, top view and bottom view of the ultrasonic vibration device as shown in Figure 2, Figure 3, Figure 4 and Figure 5.

Specifically, a part of the contactless power transmission system 10 is connected to the machine tool, and a part of it is connected to the device housing 11, providing a high-frequency alternating electrical signal to the electrode sheet 8. When the frequency of the electrical signal is the same as the system resonance frequency, the piezoelectric sheet 9 generates ultrasonic longitudinal vibration, which is transmitted to the strengthening head 4 through the booster 3, so that the strengthening head 4 generates longitudinal vibration. The end of the strengthening head 4 is conical, and its structure matches the structure of the chamfer 15 and the tapered hole 14 of the hole to be strengthened on the workpiece 13. The conical surface at the end of the strengthening head 4 contacts the surface to be strengthened, and a certain pre-pressing depth is applied through the machine tool spindle, and the surface to be strengthened generates plastic deformation and residual compressive stress through the ultrasonic longitudinal vibration, thereby improving the surface quality and its anti-fatigue performance.

In the embodiments of the present application, by designing an appropriate geometric structure and connection method, the ultrasonic vibration device has a suitable natural frequency and can generate a vibration form and vibration amplitude that meet the requirements.

Specifically, the booster 3, the strengthening head 4, and the transducer composed of the piezoelectric sheet 9, the electrode sheet 8, the first mass block 1, the second mass block 2, and the connecting bolt 5 have the same natural frequency, so that the connection between the three does not change the natural frequency of the ultrasonic longitudinal vibration system. When the first-order longitudinal mode natural frequency of the three is ω ₀ , the third-order longitudinal mode of the ultrasonic longitudinal vibration system is ω ₀ .

In an embodiment of the present application, as shown in Figure 6, the structural parameters of the strengthening head of the embodiment of the present application include: the busbar length LL1 of the strengthening head, the busbar length LL2 of the hole edge chamfer, the busbar length LL3 of the tapered hole wall, the small diameter DD of the strengthening head, the large diameter DD2 of the strengthening head, the small diameter DD3 of the hole edge chamfer, the large diameter DD4 of the hole edge chamfer, the small diameter DD5 of the tapered hole, the large diameter DD6 of the tapered hole, and the angle θ between the busbar and the axis.

Specifically, the angle θ between the cone surface generatrix of the strengthening head 4 and the axis is equal to the angle θ between the hole edge chamfer 15 and the tapered hole 14, the major diameter DD2 of the strengthening head 4 is greater than or equal to the major diameter DD4 of the hole edge chamfer 15 and the major diameter DD6 of the tapered hole, the minor diameter DD1 of the strengthening head 4 is less than or equal to the minor diameter DD3 of the hole edge chamfer 15 and the minor diameter DD5 of the tapered hole, and the generatrix length LL1 of the strengthening head 4 is greater than or equal to the generatrix length LL2 of the hole edge chamfer 15 and the generatrix length LL3 of the tapered hole wall.

As shown in Figure 7, the strengthening head can be divided into 6 parts along the axial direction. In the figure, L1~L6 are the lengths of each section of the strengthening head, d1~d7 are the diameters of each cross section of the strengthening head, and U1~U6 are the longitudinal displacements of each section of the strengthening head. The process of calculating the natural frequency based on the structural parameters of the strengthening head is as follows:

The axial displacement of the rod specimen can be expressed as:

In the formula, u1, u2, and u3 are displacements in the three directions of X, Y, and Z respectively. Therefore, we can get:

Where E is the elastic modulus, A is the cross-sectional area, ρ is the material density, and f(x, t) is the external force. For a tapered rod of homogeneous material, we can obtain:

Simplify formula 3 and calculate the material sound velocity formula Substituting in, we get:

Substituting the theoretical solution into equation 4, the governing equation of the conic section is obtained as follows:

The area of the conic section is:

Substitute equation 6 into equation 5 and combine and ω＝2πf, we can get:

Solving the above formula, we can get:

For a rod-shaped specimen with a constant cross section, Equation 4 can be simplified to:

Furthermore, substituting the theoretical solution into equation 10, the control equation of the constant cross section is obtained as follows:

Therefore, the solution can be obtained:

u＝a·coskx+b·sinkx(Formula 12)

Based on equations 8, 9, and 12, the free vibration analysis of the reinforced head can be carried out to find the natural frequency under specific structural parameters:

u ₁ ＝a ₁ Coskx+b ₁ Sinkx -L ₁ <x<0

u ₂ =F(x)[a ₂ Coskx+b ₂ Sinkx] 0<x<L ₂

u ₃ ＝a ₃ Cosk(xL ₂ )+b ₃ Sink(xL ₂ ) L ₂ <x<L ₂ +L ₃

The electrode sheet 8 is made of copper.

Further, as shown in Figures 8, 9, 10, 11 and 12, the ultrasonic vibration device modal simulation result diagram and the ultrasonic vibration device and its natural frequency actual measurement diagram provided in the embodiment of the present application, the ultrasonic vibration device designed and manufactured by the above process can meet the requirements of ultrasonic strengthening of hole edges and tapered holes. As shown in the actual measurement diagram of the strengthened surface in Figure 13, a significant improvement in surface quality can be observed.

According to the ultrasonic vibration device proposed in the embodiment of the present application, according to different requirements for strengthening the chamfer of the edge of the load-bearing hole or the wall of the tapered hole, the ultrasonic vibration device applies a specific vibration trajectory to the strengthening head, and the processing parameters and vibration parameters are adjusted to achieve ultrasonic longitudinal vibration strengthening of the chamfer of the edge of the target load-bearing hole or the wall of the tapered hole, so that the chamfered cone surface of the hole edge and the wall of the tapered hole produce plastic deformation and compressive residual stress, improve the surface quality of the chamfered cone surface and the wall of the tapered hole, and enhance its anti-fatigue performance. In addition, the embodiment of the present application also discloses a processing system 102, as shown in Figure 14, the processing system 102 includes: the spindle of the machine tool; the above-mentioned ultrasonic vibration device, wherein the machine tool is connected to the ultrasonic vibration device 101 through the spindle, and during the ultrasonic strengthening process, the ultrasonic vibration device is allowed to rotate with the spindle or is allowed not to rotate; a processing control device, which is used to analyze the strengthening requirements of the chamfer of the edge of the target load-bearing hole or the tapered hole, and control the ultrasonic vibration device 101 according to the strengthening requirements to achieve ultrasonic vibration strengthening of the chamfer of the edge of the target load-bearing hole or the wall of the tapered hole.

Secondly, FIG15 is a schematic flow chart of a method for ultrasonic vibration strengthening of hole edge chamfering and tapered hole provided in an embodiment of the present application.

As shown in FIG15 , the hole edge chamfering and tapered hole ultrasonic vibration strengthening method comprises the following steps:

In step S101, the strengthening requirements of the chamfer of the edge of the target load-bearing hole or the wall of the tapered hole are analyzed.

It is understandable that analyzing the current load-bearing hole edge chamfering or tapered hole wall strengthening requirements includes but is not limited to obtaining at least one of the number of hole edges or tapered hole walls, major diameter, minor diameter, busbar length, and angle between the busbar and the axis.

In step S02, the processing parameters of the ultrasonic vibration device, the vibration trajectory and vibration parameters of the target strengthening head are determined according to the current requirements for chamfering the edge of the load-bearing hole or strengthening the wall of the tapered hole.

It can be understood that the processing parameters include at least one of pre-pressing depth, feed speed, and rotation speed, the vibration parameters include at least one of vibration frequency and vibration amplitude, and the vibration trajectory is a straight line.

In step S03, the ultrasonic vibration device is controlled to apply a vibration trajectory to the target strengthening head according to the processing parameters and the vibration parameters, so as to achieve ultrasonic vibration strengthening of the chamfer of the target load-bearing hole edge or the wall of the tapered hole.

It is understandable that by designing an appropriate geometric structure and connection method, the ultrasonic vibration device has a suitable natural frequency and can generate a vibration form and vibration amplitude that meet the requirements. The target strengthening head is a cone that matches the chamfered cone surface of the hole edge or the wall of the tapered hole, and the angle between its generatrix and the axis is equal to the angle between the chamfered cone surface of the hole edge or the wall of the tapered hole, and the length of its generatrix can be greater than or equal to the length of the generatrix of the chamfered cone surface of the hole edge or the wall of the tapered hole.

It should be noted that the above-mentioned description of the embodiments of the ultrasonic vibration device and the processing system is also applicable to the explanation of the embodiments of the ultrasonic vibration strengthening method for chamfering the hole edge and the tapered hole, and will not be repeated here.

According to the proposed hole edge chamfering and tapered hole ultrasonic vibration strengthening method, the embodiment of the present application applies a specific vibration trajectory to the strengthening head through an ultrasonic vibration device according to different requirements for strengthening the hole edge chamfering or tapered hole wall, and adjusts the processing parameters and vibration parameters to achieve ultrasonic longitudinal vibration strengthening of the target load-bearing hole edge chamfering or tapered hole, so that the hole edge chamfering cone surface and the tapered hole wall produce plastic deformation and compressive residual stress, improve the surface quality of the chamfered cone surface and the tapered hole wall surface, and enhance its fatigue resistance. In this way, the problem that the hole edge chamfering and the tapered hole wall surface cannot be strengthened, resulting in poor overall fatigue resistance of the load-bearing hole, is solved.

Next, the hole edge chamfering and tapered hole ultrasonic vibration strengthening device proposed in accordance with the embodiment of the present application will be described with reference to the accompanying drawings.

FIG. 16 is a block diagram of a hole edge chamfering and tapered hole ultrasonic vibration strengthening device according to an embodiment of the present application.

As shown in FIG. 16 , the hole edge chamfering and tapered hole ultrasonic vibration strengthening device 103 includes: a demand analysis module 100 , a parameter determination module 200 and an ultrasonic strengthening module 300 .

Among them, the demand analysis module 100 is used to analyze the strengthening requirements of the target load-bearing hole edge chamfer or the tapered hole wall; the parameter determination module 200 is used to determine the processing parameters of the ultrasonic vibration device, the vibration trajectory and vibration parameters of the target strengthening head according to the current load-bearing hole edge chamfer or the tapered hole wall strengthening requirements; the ultrasonic strengthening module 300 is used to control the ultrasonic vibration device to apply the vibration trajectory to the target strengthening head according to the processing parameters and vibration parameters, so as to achieve ultrasonic vibration strengthening of the target load-bearing hole edge chamfer or the tapered hole wall.

It should be noted that the above explanations of the embodiment of the method for chamfering hole edges and strengthening cone holes by ultrasonic vibration are also applicable to the device for chamfering hole edges and strengthening cone holes by ultrasonic vibration in this embodiment, and will not be repeated here.

According to the ultrasonic vibration strengthening device for chamfering the edge of a hole and strengthening the tapered hole proposed in the embodiment of the present application, a specific vibration trajectory is applied to the strengthening head through the ultrasonic vibration device, and the processing parameters and vibration parameters are adjusted to achieve ultrasonic longitudinal vibration strengthening of the chamfering of the edge of the target bearing hole or the wall of the tapered hole, so that the chamfered cone surface of the hole edge and the wall of the tapered hole produce plastic deformation and compressive residual stress, improve the surface quality of the chamfered cone surface and the wall of the tapered hole, and enhance its fatigue resistance. In this way, the problem that the chamfering of the edge of the hole and the wall of the tapered hole cannot be strengthened, resulting in poor overall fatigue resistance of the bearing hole, is solved.

FIG17 is a schematic diagram of the structure of a processing control device provided in an embodiment of the present application. The processing control device may include:

A memory 1701 , a processor 1702 , and a computer program stored in the memory 1701 and executable on the processor 1702 .

When the processor 1702 executes the program, the hole edge chamfering and tapered hole ultrasonic vibration strengthening method provided in the above embodiment is implemented.

Furthermore, the processing control device also includes:

The communication interface 1703 is used for communication between the memory 1701 and the processor 1702 .

The memory 1701 is used to store computer programs that can be executed on the processor 1702 .

The memory 1701 may include a high-speed RAM (Random Access Memory) memory, and may also include a non-volatile memory, such as at least one disk memory.

If the memory 1701, the processor 1702 and the communication interface 1703 are implemented independently, the communication interface 1703, the memory 1701 and the processor 1702 can be connected to each other through a bus and communicate with each other. The bus can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, only one thick line is used in FIG. 17, but it does not mean that there is only one bus or one type of bus.

Optionally, in a specific implementation, if the memory 1701, the processor 1702 and the communication interface 1703 are integrated on a chip, the memory 1701, the processor 1702 and the communication interface 1703 can communicate with each other through an internal interface.

The processor 1702 may be a CPU (Central Processing Unit), or an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present application.

An embodiment of the present application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above-mentioned hole edge chamfering and tapered hole ultrasonic vibration strengthening method.

An embodiment of the present application provides a computer program product, including a computer program or instructions, which, when executed, is used to implement a method for controlling a compression-side heat exchanger of a compressed air energy storage system.

In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

It should be understood that the various parts of the present application can be implemented in hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, the steps or methods can be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array, a field programmable gate array, etc.

A person of ordinary skill in the art may understand that all or part of the steps carried by the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the above-mentioned program may be stored in a computer-readable storage medium, which, when executed, includes one of the steps of the method embodiment or a combination thereof.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims (10)

1. An ultrasonic vibration device, comprising:

A device housing and a reinforcement head;

One end of the booster is connected with the strengthening head;

One end of the transducer is connected with the other end of the booster;

The other end of the transducer is connected with the machine tool interface, the machine tool interface is connected with a main shaft of a machine tool, and pressure is applied to the strengthening head through the main shaft of the machine tool;

And the non-contact type electric energy transmission system is respectively connected with the device shell and the machine tool, provides alternating electric signals for the energy converter, and transmits vibration to the strengthening head through the booster when the frequency of the alternating electric signals is the same as the resonance frequency of the energy converter, so that ultrasonic vibration strengthening of a target bearing Kong Kongbian chamfer or a taper hole wall is realized.

2. The ultrasonic vibration device of claim 1, wherein the stiffening head, the booster and the transducer have the same natural frequency.

3. The ultrasonic vibration device of claim 1, wherein the transducer comprises a piezoelectric sheet, an electrode sheet, a first mass, and a second mass, wherein the piezoelectric sheet and the electrode sheet are alternately arranged between the first mass and the second mass.

4. The ultrasonic vibration device of claim 3, further comprising

The first mass block and the second mass block are fixedly connected through the connecting bolts;

The booster is connected with the second mass block through the first stud;

the strengthening head is connected with the booster through the second double-ended stud;

and the booster is fixed on the device shell through the connecting piece.

5. A processing system, comprising:

a spindle of a machine tool;

The ultrasonic vibration device of any one of claims 1 to 4, wherein the spindle of the machine tool is connected to the ultrasonic vibration device, the ultrasonic vibration device being allowed to rotate with the spindle or not during ultrasonic strengthening;

The processing control equipment is used for analyzing the strengthening requirement of the target bearing Kong Kongbian chamfer or the taper hole, and controlling the ultrasonic vibration device according to the strengthening requirement to realize ultrasonic vibration strengthening of the target bearing Kong Kongbian chamfer or the wall of the taper hole.

6. A method for reinforcing hole edge chamfering and cone hole ultrasonic vibration, which is applied to the processing system of claim 5, wherein the method comprises the steps of:

Analyzing the reinforcement requirement of the chamfer angle of the target bearing Kong Kongbian or the wall of the taper hole;

determining processing parameters of an ultrasonic vibration device, a vibration track of a target strengthening head and vibration parameters according to the current chamfering of the bearing Kong Kongbian or the strengthening requirement of the wall of the taper hole;

and controlling the ultrasonic vibration device to apply the vibration track to the target strengthening head according to the processing parameters and the vibration parameters so as to realize ultrasonic vibration strengthening of the chamfer of the target bearing Kong Kongbian or the wall of the taper hole.

7. The utility model provides a hole limit chamfer and taper hole ultrasonic vibration reinforcing means which characterized in that includes:

the demand analysis module is used for analyzing the reinforcement demand of the chamfer of the target bearing Kong Kongbian or the wall of the taper hole;

The parameter determining module is used for determining processing parameters of the ultrasonic vibration device, the vibration track of the target strengthening head and the vibration parameters according to the current chamfering of the bearing Kong Kongbian or the strengthening requirement of the wall of the taper hole;

And the ultrasonic strengthening module is used for controlling the ultrasonic vibration device to apply the vibration track to the target strengthening head according to the processing parameters and the vibration parameters so as to realize ultrasonic vibration strengthening of the target bearing Kong Kongbian chamfer or taper hole wall.

8. A process control apparatus, comprising: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor executing the program to implement the hole edge chamfering and countersink ultrasonic vibration enhancement method of claim 7.

9. A computer readable storage medium having stored thereon a computer program or instructions which, when executed, implement the hole edge chamfering and countersink ultrasonic vibration enhancement method of claim 7.

10. A computer program product comprising a computer program or instructions which, when executed, implements the method for hole edge chamfering and countersinking ultrasonic vibration enhancement as claimed in claim 7.