CN118777336A - A nondestructive testing system and method for graphene film - Google Patents

Abstract

The invention relates to the technical field of nondestructive testing, and discloses a nondestructive testing system and method for a graphene film, wherein the method comprises the following steps: obtaining the average thickness of the graphene film and determining the X-ray emission intensity; horizontally moving the linear emission unit along the transverse direction of the graphene film by using the X-ray emission intensity, and collecting the transmission intensity of the X-rays in real time to record the number of abnormal positions; when judging that the graphene film is abnormal, detecting the graphene film with the area array emission intensity, obtaining a first intensity distribution diagram, determining a defect coordinate point and adjusting the area array emission intensity; and performing secondary detection on the graphene film by using the area array secondary intensity based on the area array emission unit, and determining the defect type and the defect number according to the first intensity distribution diagram and the second intensity distribution diagram to obtain the quality grade of the graphene film. The invention provides a more comprehensive graphene film quality evaluation. The detection efficiency is improved, and high standard of graphene film quality is ensured.

Description

A nondestructive testing system and method for graphene film

Technical Field

The present invention relates to the technical field of nondestructive testing, and in particular to a nondestructive testing system and method for a graphene film.

Background Art

With the widespread application of graphene materials in electronic devices, sensors, energy storage and other fields, the quality control and defect detection of graphene films have become particularly important. The structural integrity and thickness uniformity of graphene films directly affect their electrical, thermal and mechanical properties, so the detection of graphene films is particularly critical.

Traditional graphene film inspection methods mainly include optical microscopy, scanning electron microscopy (SEM) and atomic force microscopy (AFM) technologies. However, these methods have certain limitations in large-area inspection, rapid screening and detection sensitivity. With the continuous development of production technology, online inspection technology has gradually become the main means to achieve efficient quality control. X-ray imaging technology has gradually been introduced into graphene film defect detection due to its advantages such as non-contact, strong penetration and high resolution.

During the X-ray inspection of graphene films, the change in X-ray transmission intensity reflects the thickness uniformity of the film and the defect characteristics inside the material. However, due to the diversity of the thickness and defect distribution of graphene films, the traditional single intensity setting often cannot take into account defects of different types and depths. During the inspection, personnel need to manually adjust the emission intensity, which takes a long time and depends on the operator's experience.

Therefore, it is necessary to design a nondestructive testing system and method for graphene films to solve the problems existing in the current technology.

Summary of the invention

In view of this, the present invention proposes a nondestructive testing method for graphene films, aiming to solve the problems existing in the current graphene film testing, that is, it is difficult to take into account defects of different types and depths, the testing process is complicated, the testing takes a long time and is dependent on personnel experience.

On the one hand, the present invention provides a non-destructive testing method for a graphene film, comprising:

Collecting thickness data of several positions of the graphene film to establish a thickness data set, obtaining an average thickness of the graphene film according to the thickness data set, and determining the X-ray emission intensity according to the average thickness;

Placing a linear emitting unit below the graphene film, horizontally moving the linear emitting unit along the lateral direction of the graphene film with the X-ray emission intensity, collecting the X-ray transmission intensity in real time, determining the abnormal position according to the X-ray transmission intensity and recording the number of abnormal positions;

When the number of abnormal positions is greater than the preset number of abnormal positions, it is determined that the graphene film has an abnormality, the linear emission unit is removed and a planar array emission unit is arranged under the graphene film, the X-ray emission intensity is adjusted according to the number of abnormal positions to obtain a planar array emission intensity, the graphene film is detected with the planar array emission intensity to obtain a first intensity distribution diagram, the first intensity distribution diagram is analyzed to determine the defect coordinate point, the planar array emission intensity is adjusted according to the positional relationship of the defect coordinate point to obtain a planar array secondary intensity;

Based on the area array transmitting unit, the graphene film is subjected to secondary detection with the area array secondary intensity to obtain a second intensity distribution map, and the defect type and defect quantity are determined according to the first intensity distribution map and the second intensity distribution map;

The quality grade of the graphene film is obtained according to the defect type and the defect quantity.

Furthermore, the determining of the X-ray emission intensity according to the average thickness includes:

Tm＝T0+αln(1+βh);

Wherein, Tm represents the X-ray emission intensity, T0 represents the reference intensity, α represents the intensity gain coefficient, which controls the amplitude of the intensity increase, β represents the adjustment coefficient, which controls the sensitivity of the thickness to the intensity, and h represents the average thickness of the graphene film.

Furthermore, the X-ray emission intensity is adjusted according to the number of abnormal positions to obtain the array emission intensity, including:

A downward adjustment coefficient is set according to the number of abnormal positions, and the X-ray emission intensity is adjusted according to the downward adjustment coefficient to obtain the array emission intensity. The downward adjustment coefficient is inversely proportional to the number of abnormal positions, and the value range of the downward adjustment coefficient is [0, 1].

Furthermore, analyzing the first intensity distribution diagram to determine the defect coordinate point includes:

Arbitrarily determine a central point (x ₀ , y ₀ ) in the first intensity distribution diagram;

The neighborhood range is determined with the central point as the center of the circle and k as the neighborhood radius;

Calculate the neighborhood average intensity according to the transmission intensity of each coordinate point within the neighborhood;

When the difference between the transmission intensity of the central point and the neighborhood average intensity is greater than the intensity difference threshold, the coordinates of the central point are determined to be defect coordinate points.

Furthermore, the neighborhood average strength is calculated by the following formula:

Wherein, T _avg represents the neighborhood average intensity, k represents the neighborhood radius, (x ₀ , y ₀ ) represents the coordinates of the center point, and T(i, j) represents the transmission intensity of point (i, j) on the first intensity distribution diagram.

Furthermore, when the emission intensity of the planar array is adjusted according to the positional relationship of the defect coordinate points, it includes:

The distance data between the defect coordinate points is obtained according to the defect coordinate points, the average distance of the defect coordinate points is obtained according to the distance data, and the influence factor adjustment coefficient is determined according to the average distance of the defect coordinate points to adjust the emission intensity of the array to obtain the secondary intensity of the array, and the average distance of the defect coordinate points is inversely proportional to the influence factor adjustment coefficient.

Further, when determining the defect type and the defect quantity according to the first intensity distribution map and the second intensity distribution map, it includes:

Taking the transmission intensity of the first intensity distribution graph and the second intensity distribution graph where the transmission intensity is the same and the coordinate point corresponding to the transmission intensity is not the defect coordinate point as the standard transmission intensity;

When the transmission intensity corresponding to a position in the two intensity distribution diagrams is greater than the standard transmission intensity and is respectively close to the area array emission intensity and the area array secondary intensity, it is determined that there is a hole at the position;

When the transmission intensity corresponding to a position in the two intensity distribution diagrams is greater than the standard transmission intensity and less than the array emission intensity and the array secondary intensity, it is determined that there is local peeling at the position;

When the transmission intensity corresponding to a position in the two intensity distribution maps is less than the standard transmission intensity, it is determined that an interlayer exists at the position.

Further, obtaining the quality grade of the graphene film according to the defect type and defect quantity includes:

The quality score of the graphene film is determined according to the defect type and defect quantity, and the quality score is calculated by the following formula:

Q = w1*Q1+w2*Q2+w3*Q3;

Among them, Q represents the quality score, w1, w2, and w3 represent the weight coefficient of holes, the weight coefficient of local peeling, and the weight coefficient of interlayers, respectively; Q1, Q2, and Q3 represent the number of holes, the number of local peeling, and the number of interlayers, respectively.

Furthermore, when obtaining the quality grade of the graphene film according to the defect type and defect quantity, it also includes:

The quality grade of the graphene film is determined according to the quality score; the quality grade is in inverse proportion to the quality score.

Compared with the prior art, the beneficial effects of the present invention are: by collecting film thickness data to establish a data set, optimizing the X-ray emission intensity according to the average thickness, and combining the step-by-step detection of the linear emission unit and the array emission unit, the sensitivity and accuracy of the detection are gradually improved. The need for manual adjustment is effectively reduced, and the detection time and dependence on the operator's experience are reduced. When there are complex defects in the film, multiple tests are performed to improve the accuracy of defect identification and the accuracy of classification, providing a more comprehensive graphene film quality assessment. The detection efficiency is improved and the high standard of graphene film quality is ensured.

On the other hand, the present application also provides a non-destructive testing system for a graphene film, which is used to apply the non-destructive testing method for a graphene film, comprising:

A linear transmitting unit, a planar array transmitting unit, a planar array receiving unit and a control module, wherein the control module includes a collection unit, a judgment unit, an adjustment unit, a processing unit and an evaluation unit;

The acquisition unit is configured to acquire thickness data of several positions of the graphene film, establish a thickness data set, obtain an average thickness of the graphene film according to the thickness data set, and determine the X-ray emission intensity according to the average thickness;

The judgment unit collects the transmission intensity of the X-rays collected by the array receiving unit in real time, judges the abnormal position according to the transmission intensity of the X-rays and records the number of abnormal positions; when the number of abnormal positions is greater than the preset number of abnormal positions, the judgment unit determines that the graphene film has an abnormality

The adjustment unit is configured to adjust the X-ray emission intensity according to the number of abnormal positions to obtain a planar array emission intensity, detect the graphene film with the planar array emission intensity to obtain a first intensity distribution diagram, analyze the first intensity distribution diagram to determine defect coordinate points, and adjust the planar array emission intensity according to the positional relationship of the defect coordinate points to obtain a planar array secondary intensity;

The processing unit is configured to obtain a second intensity distribution map, and determine a defect type and a defect quantity according to the first intensity distribution map and the second intensity distribution map;

The evaluation unit is configured to obtain a quality grade of the graphene film according to the defect type and the defect quantity.

It is understandable that the above-mentioned non-destructive testing system and method of graphene film have the same beneficial effects, which will not be described in detail here.

BRIEF DESCRIPTION OF THE DRAWINGS

Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

FIG1 is a flow chart of a nondestructive testing method for a graphene film provided by an embodiment of the present invention;

FIG. 2 is a functional block diagram of a control module in a nondestructive testing system for graphene films provided in an embodiment of the present invention.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

In some embodiments of the present application, referring to FIG. 1 , a nondestructive testing method for a graphene film includes:

S100: collecting thickness data of a plurality of positions of a graphene film to establish a thickness data set, obtaining an average thickness of the graphene film according to the thickness data set, and determining an X-ray emission intensity according to the average thickness.

S200: placing a linear emitting unit under the graphene film, horizontally moving the linear emitting unit along the lateral direction of the graphene film with the X-ray emission intensity, and collecting the X-ray transmission intensity in real time, determining abnormal positions according to the X-ray transmission intensity and recording the number of abnormal positions.

S300: When the number of abnormal positions is greater than the preset number of abnormal positions, it is determined that the graphene film has an abnormality, the linear emission unit is removed and a planar array emission unit is arranged under the graphene film, the X-ray emission intensity is adjusted according to the number of abnormal positions to obtain the planar array emission intensity, the graphene film is detected with the planar array emission intensity to obtain a first intensity distribution diagram, the first intensity distribution diagram is analyzed to determine the defect coordinate points, the planar array emission intensity is adjusted according to the positional relationship of the defect coordinate points to obtain the planar array secondary intensity.

S400: performing secondary detection on the graphene film based on the area array emitting unit with the area array secondary intensity to obtain a second intensity distribution map, and determining the defect type and defect quantity according to the first intensity distribution map and the second intensity distribution map.

S500: Obtaining a quality grade of the graphene film according to the defect type and defect quantity.

Specifically, before the detection starts in S100, thickness data are collected at multiple locations on the graphene film, and these data represent the thickness changes of the film in different areas. These thickness data are input into the database to establish a thickness data set, and the average thickness of the entire film is calculated based on the data set. The appropriate X-ray emission intensity is set by the determined average thickness. This is to ensure that during the detection process, the X-rays can accurately penetrate the film while avoiding overexposure or underexposure. In S200, the linear emission unit is placed under the graphene film, and the detection is started with the previously set X-ray emission intensity. The linear emission unit moves horizontally along the lateral direction of the graphene film, and the X-ray transmission intensity passing through the film is collected in real time. By analyzing the changes in the transmission intensity, the abnormal positions in the film are determined, and the number of these abnormal positions is recorded. In S300, when the number of abnormal positions detected exceeds the preset threshold, it is determined that the film has obvious abnormalities. The linear emission unit is removed, and a planar array emission unit is arranged under the graphene film. According to the number of abnormal positions detected, the X-ray emission intensity is adjusted to meet the needs of higher precision detection. Using the adjusted emission intensity, the area array emission unit performs a more comprehensive inspection of the film to obtain a first intensity distribution map. By analyzing the distribution map, the specific coordinate points of the defects are determined, and the emission intensity is further optimized based on the positional relationship of these coordinate points to obtain a more accurate area array secondary intensity. In S400, the area array emission unit is used to perform a secondary inspection of the film with the adjusted secondary intensity. Through the secondary inspection, a second intensity distribution map is obtained. The first intensity distribution map is compared and analyzed with the second intensity distribution map to determine the types and number of defects in the graphene film. In S500, the overall quality of the graphene film is evaluated based on the final determined defect types and numbers, and its quality grade is determined.

It is understandable that by collecting preliminary thickness data and calculating the average thickness, the X-ray emission intensity is optimized to meet the detection needs of films of different thicknesses. Combining the step-by-step detection strategy of the linear emission unit and the array emission unit, the abnormal areas of the film can be deeply detected and accurately analyzed on the basis of preliminary screening. Multiple detections not only improve the sensitivity and accuracy of defect identification, but also reduce the risk of human intervention and misjudgment during the detection process, and realize efficient evaluation of the quality of graphene films. Improve the detection efficiency and the reliability of quality control.

In some embodiments of the present application, determining the X-ray emission intensity according to the average thickness includes:

Tm＝T0+αln(1+βh);

Wherein, Tm represents the X-ray emission intensity, T0 represents the reference intensity, α represents the intensity gain coefficient, which controls the amplitude of the intensity increase, β represents the adjustment coefficient, which controls the sensitivity of the thickness to the intensity, and h represents the average thickness of the graphene film.

In some embodiments of the present application, the X-ray emission intensity is adjusted according to the number of abnormal positions to obtain the array emission intensity, including:

A downward adjustment coefficient is set according to the number of abnormal positions, and the X-ray emission intensity is adjusted according to the downward adjustment coefficient to obtain the array emission intensity. The downward adjustment coefficient is inversely proportional to the number of abnormal positions, and the value range of the downward adjustment coefficient is [0, 1].

Specifically, for example, the average thickness of the graphene film to be detected is h = 0.1 micrometer (μm), the reference X-ray intensity T0 = 10 units, the intensity gain coefficient α = 5 units, and the adjustment coefficient β = the inverse of 100 micrometers (μm ^-1 ). The calculated X-ray emission intensity is 22 units. For situations where the film thickness does not change much, T0 can be set to a range of 10-20 units. The intensity gain coefficient α is preferably 3-10 units. A larger α value is suitable for situations where the thickness changes greatly. The adjustment coefficient β is preferably 50-200μm ^-1 , which is adjusted according to the detection requirements and the film thickness range. The larger this value is, the more sensitive it is to thickness changes.

Specifically, when an abnormality is detected in the graphene film, the X-ray emission intensity is initially reduced by lowering the adjustment coefficient to fully detect the surface defects of the graphene film. For example: Tnew = Tm×(1-γ), Tnew represents the array emission intensity, and γ represents the adjustment coefficient. If the emission intensity is high, subtle surface defects are easily lost, affecting the detection results.

It can be understood that by introducing an X-ray intensity adjustment mechanism based on average thickness and a lowering adjustment coefficient that is inversely proportional to the number of abnormal positions, the X-ray emission intensity can dynamically adapt to different film thicknesses and defect distributions. Especially when there are a large number of abnormal positions, the strategy of reducing the emission intensity effectively reduces the risk of overexposure to sensitive areas, thereby improving the accuracy and sensitivity of defect detection.

In some embodiments of the present application, analyzing the first intensity distribution map to determine the defect coordinate point includes:

Arbitrarily determine a central point (x ₀ , y ₀ ) in the first intensity distribution diagram;

The neighborhood range is determined with the central point as the center of the circle and k as the neighborhood radius;

Calculate the neighborhood average intensity according to the transmission intensity of each coordinate point within the neighborhood;

When the difference between the transmission intensity of the central point and the neighborhood average intensity is greater than the intensity difference threshold, the coordinates of the central point are determined to be defect coordinate points.

In some embodiments of the present application, the neighborhood average strength is calculated by the following formula:

Wherein, T _avg represents the neighborhood average intensity, k represents the neighborhood radius, (x ₀ , y ₀ ) represents the coordinates of the center point, and T(i, j) represents the transmission intensity of point (i, j) on the first intensity distribution diagram.

It can be understood that the defect coordinate points of the graphene film are accurately identified on the first intensity distribution map. By calculating the average intensity of the neighborhood and comparing it with the intensity of the center point, the defect coordinate position can be effectively located, thereby improving the accuracy of defect detection. Especially when dealing with complex graphene films, it can respond sensitively to the intensity changes in the local area and provide accurate defect location positioning, providing reliable data support for subsequent detection and analysis. The resolution and accuracy of the detection are improved, which helps to accurately evaluate the quality of the graphene film.

In some embodiments of the present application, when adjusting the emission intensity of the array according to the positional relationship of the defect coordinate points, it includes: obtaining distance data between the defect coordinate points according to the defect coordinate points, obtaining the average distance of the defect coordinate points according to the distance data, determining the influence factor adjustment coefficient according to the average distance of the defect coordinate points to adjust the emission intensity of the array to obtain the secondary intensity of the array, and the average distance of the defect coordinate points is inversely proportional to the influence factor adjustment coefficient.

Specifically, multiple defect coordinate points are determined in the first intensity distribution map. The distance between each pair of defect coordinate points is calculated to form a distance data set. These distance data reflect the distribution of defect points on the surface of the film. Using all the distance values in the distance data set, an average distance value is calculated. This value represents the overall distribution density between the defect coordinate points. According to the average distance of the defect coordinate points calculated above, an influence factor adjustment coefficient A is determined. The influence factor adjustment coefficient A is inversely proportional to the average distance of the defect coordinate points, that is, when the average distance is small (the defect points are dense), the adjustment coefficient should be higher to meet more sophisticated detection needs; conversely, the adjustment coefficient is lower. Because when the defect points are dense, it means that there are more defects on the surface of the graphene film, and the corresponding possibility of defects inside it is greater. In order to fully detect its internal characteristics, the emission intensity is increased to fully detect the internal characteristics.

It can be understood that, assuming that in a certain graphene film inspection, three defect coordinate points A(x1,y1), B(x2,y2), and C(x3,y3) are determined, and the distances between them are dAB, dBC, and dCA, respectively. dAB = 0.5mm, dBC = 0.4mm, dCA = 0.6mm. The average distance davg = 0.5mm. The influence factor adjustment coefficient A = m/0.5, m is preferably 0.6, A = 1.2, and the secondary intensity of the array is 1.2 times the emission intensity of the array.

It can be understood that by introducing the calculation of the average distance of defect coordinate points and the application of the influence factor adjustment coefficient in defect detection, the X-ray intensity can be more finely adapted to the distribution of defects. The detection sensitivity of dense or sparse defects is improved, and the quality inspection process of graphene films is optimized.

In some embodiments of the present application, when determining the defect type and the defect quantity according to the first intensity distribution map and the second intensity distribution map, it includes: taking the transmission intensity of the first intensity distribution map and the second intensity distribution map where the transmission intensity is the same and the coordinate point corresponding to the transmission intensity is not the defect coordinate point as the standard transmission intensity;

Specifically, when the transmission intensity corresponding to a position in the two intensity distribution maps is greater than the standard transmission intensity and is respectively close to the area array emission intensity and the area array secondary intensity, it is determined that there is a hole at the position; when the transmission intensity corresponding to a position in the two intensity distribution maps is greater than the standard transmission intensity and is respectively less than the area array emission intensity and the area array secondary intensity, it is determined that there is local peeling at the position; when the transmission intensity corresponding to a position in the two intensity distribution maps is less than the standard transmission intensity, it is determined that there is an interlayer at the position.

Specifically, in the first intensity distribution map and the second intensity distribution map, find those positions with the same transmission intensity and not defect coordinate points. The transmission intensity of these positions can be regarded as the normal area of the material, and its transmission intensity is set as the standard transmission intensity. The standard transmission intensity is the benchmark for judging defects and is used to distinguish different types of defects. When the transmission intensity of a certain position in both intensity distribution maps is greater than the standard transmission intensity and is close to the array emission intensity and the array secondary intensity, the hole will cause the transmission intensity to increase, so the position is judged to have a hole. When the transmission intensity of a certain position in both intensity distribution maps is greater than the standard transmission intensity, but less than the array emission intensity and the array secondary intensity, it indicates that the transmittance of the position is strong, but not as significant as the hole. Because there is local peeling on the surface of the material, the transmission intensity increases, but not to the extent of a complete hole, so it is judged as local peeling. When the transmission intensity of a certain position in both intensity distribution maps is less than the standard transmission intensity, it indicates that the X-ray transmittance in this area is poor. Because there is an interlayer structure (such as bubbles or foreign matter) in the film, it hinders the penetration of X-rays, so it is judged as an interlayer.

It can be understood that by comparing the intensity distribution diagrams obtained from the two tests, different defect types in the graphene film can be accurately identified based on non-destructive testing. By setting the standard transmission intensity and analyzing the relative relationship of the transmission intensity, defects such as holes, local peeling and interlayers can be effectively distinguished, thereby improving the accuracy of defect detection.

In some embodiments of the present application, when obtaining the quality grade of the graphene film according to the defect type and the defect number, it includes: determining the quality score of the graphene film according to the defect type and the defect number, and the quality score is calculated by the following formula:

Q = w1*Q1+w2*Q2+w3*Q3;

Among them, Q represents the quality score, w1, w2, and w3 represent the weight coefficient of holes, the weight coefficient of local peeling, and the weight coefficient of interlayers, respectively; Q1, Q2, and Q3 represent the number of holes, the number of local peeling, and the number of interlayers, respectively.

In some embodiments of the present application, when obtaining the quality grade of the graphene film according to the defect type and defect quantity, it also includes: determining the quality grade of the graphene film according to the quality score; the quality grade is inversely proportional to the quality score.

Specifically, for example: a graphene film, in which 3 holes (n1=3), 2 local peelings (n2=2) and 1 interlayer (n3=1) are detected. The weight coefficients are w1=5, w2=3, w3=2 respectively. Then the quality score Q=23. The first level score threshold is set to 10, the second level score threshold is set to 20, and the third level score threshold is set to 30. 23>20, so it is rated as the third quality level.

It is understandable that quantitative quality assessment of graphene films not only considers the number of defects, but also introduces a weight coefficient, which can more accurately reflect the difference in the overall quality of the film. This helps to achieve more precise quality control in production and improve the reliability of graphene films in applications.

In the above embodiment, a data set is established by collecting film thickness data, and the X-ray emission intensity is optimized according to the average thickness. The sensitivity and accuracy of the detection are gradually improved by combining the step-by-step detection of the linear emission unit and the array emission unit. The need for manual adjustment is effectively reduced, and the detection time and dependence on the operator's experience are reduced. When there are complex defects in the film, multiple tests are performed to improve the accuracy of defect identification and the accuracy of classification, providing a more comprehensive graphene film quality assessment. The detection efficiency is improved and the high quality standards of the graphene film are ensured.

On the other hand, referring to FIG. 2 , the present application also provides a nondestructive testing system for a graphene film, which is used to apply the nondestructive testing method for a graphene film, including:

A linear transmitting unit, a planar array transmitting unit, a planar array receiving unit and a control module, wherein the control module includes a collection unit, a judgment unit, an adjustment unit, a processing unit and an evaluation unit;

The acquisition unit is configured to acquire thickness data of several positions of the graphene film, establish a thickness data set, obtain an average thickness of the graphene film according to the thickness data set, and determine the X-ray emission intensity according to the average thickness;

The judgment unit collects the transmission intensity of the X-rays collected by the array receiving unit in real time, judges the abnormal position according to the transmission intensity of the X-rays and records the number of abnormal positions; when the number of abnormal positions is greater than the preset number of abnormal positions, the judgment unit determines that the graphene film has an abnormality

The adjustment unit is configured to adjust the X-ray emission intensity according to the number of abnormal positions to obtain a planar array emission intensity, detect the graphene film with the planar array emission intensity to obtain a first intensity distribution diagram, analyze the first intensity distribution diagram to determine defect coordinate points, and adjust the planar array emission intensity according to the positional relationship of the defect coordinate points to obtain a planar array secondary intensity;

The processing unit is configured to obtain a second intensity distribution map, and determine a defect type and a defect quantity according to the first intensity distribution map and the second intensity distribution map;

The evaluation unit is configured to obtain a quality grade of the graphene film according to the defect type and the defect quantity.

It is understandable that by collecting film thickness data to establish a data set, optimizing the X-ray emission intensity according to the average thickness, and combining the step-by-step detection of the linear emission unit and the array emission unit, the sensitivity and accuracy of the detection can be gradually improved. It effectively reduces the need for manual adjustment, reduces the detection time and the dependence on the operator's experience. When there are complex defects in the film, multiple tests are performed to improve the accuracy of defect identification and classification, providing a more comprehensive graphene film quality assessment. Improve the detection efficiency and ensure the high quality standards of graphene films.

Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

The present application is described with reference to the flowchart and/or block diagram of the method, device (system) and computer program commodity according to the embodiment of the present application. It should be understood that each process and/or box in the flowchart and/or block diagram, as well as the combination of the process and/or box in the flowchart and/or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device produce a device for implementing the function specified in one process or multiple processes in the flowchart and/or one box or multiple boxes in the block diagram.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device that implements the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.

These computer program instructions may also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, whereby the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims (10)

1. The nondestructive testing method of the graphene film is characterized by comprising the following steps of:

Acquiring thickness data of a plurality of positions of a graphene film, establishing a thickness data set, acquiring the average thickness of the graphene film according to the thickness data set, and determining X-ray emission intensity according to the average thickness;

The linear emission unit is placed below the graphene film, horizontally moves along the transverse direction of the graphene film with the X-ray emission intensity, acquires the transmission intensity of X-rays in real time, judges abnormal positions according to the transmission intensity of the X-rays, and records the number of the abnormal positions;

when the number of the abnormal positions is larger than the number of preset abnormal positions, judging that the graphene film is abnormal, removing the linear emission unit, arranging a planar array emission unit below the graphene film, adjusting the X-ray emission intensity according to the number of the abnormal positions to obtain planar array emission intensity, detecting the graphene film by the planar array emission intensity to obtain a first intensity distribution diagram, analyzing the first intensity distribution diagram, determining a defect coordinate point, and adjusting the planar array emission intensity according to the position relation of the defect coordinate point to obtain planar array secondary intensity;

Performing secondary detection on the graphene film by using the area array secondary intensity based on the area array emission unit to obtain a second intensity distribution diagram, and determining the defect type and the defect number according to the first intensity distribution diagram and the second intensity distribution diagram;

and obtaining the quality grade of the graphene film according to the defect type and the defect number.

2. The method for non-destructive inspection of a graphene film according to claim 1, wherein said determining the X-ray emission intensity from said average thickness comprises:

Tm＝T0+αln(1+βh)；

wherein Tm represents the X-ray emission intensity, T0 represents the reference intensity, α represents the intensity gain coefficient, the amplitude of the control intensity rise, β represents the adjustment coefficient, the sensitivity of the control thickness to the influence of intensity, and h represents the average thickness of the graphene film.

3. The nondestructive testing method of a graphene film according to claim 2, wherein the adjusting the X-ray emission intensity according to the number of the abnormal positions to obtain the planar array emission intensity comprises:

Setting a lowering adjustment coefficient according to the number of the abnormal positions, adjusting the X-ray emission intensity according to the lowering adjustment coefficient to obtain the area array emission intensity, wherein the lowering adjustment coefficient is in inverse proportion to the number of the abnormal positions, and the value range of the lowering adjustment coefficient is [0,1].

4. A method for non-destructive inspection of a graphene film according to claim 3, wherein analyzing the first intensity profile to determine defect coordinate points comprises:

Optionally determining a center point (x ₀,y₀) in said first intensity profile;

Determining a neighborhood range by taking the center point as a circle center and k as a neighborhood radius;

calculating neighborhood average intensity according to the transmission intensity of each coordinate point in the neighborhood range;

and when the difference value between the transmission intensity of the central point and the neighborhood average intensity is larger than the intensity difference value threshold, judging the coordinate of the central point as a defect coordinate point.

5. The method for non-destructive inspection of a graphene film according to claim 4, wherein the neighborhood average intensity is obtained by the following calculation:

Where T _avg represents the neighborhood average intensity, k represents the neighborhood radius, (x ₀,y₀) represents the coordinates of the center point, and T (i, j) represents the transmission intensity of the (i, j) point on the first intensity profile.

6. The nondestructive testing method of a graphene film according to claim 5, wherein when adjusting the area array emission intensity according to the positional relationship of the defect coordinate points, the method comprises:

Obtaining distance data among the defect coordinate points according to the defect coordinate points, obtaining average distance of the defect coordinate points according to the distance data, determining an influence factor adjustment coefficient according to the average distance of the defect coordinate points, and adjusting the area array emission intensity to obtain the area array secondary intensity, wherein the average distance of the defect coordinate points is in inverse proportion to the influence factor adjustment coefficient.

7. The method according to claim 1, wherein determining the defect type and the defect number from the first intensity distribution map and the second intensity distribution map comprises:

taking the transmission intensity of the coordinate points which are the same as the transmission intensity in the first intensity distribution chart and the second intensity distribution chart and correspond to the transmission intensity and are not the defect coordinate points as standard transmission intensity;

When the corresponding transmission intensity of a position in the two intensity distribution diagrams is larger than the standard transmission intensity and is close to the area array emission intensity and the area array secondary intensity respectively, judging that a hole exists in the position;

When the corresponding transmission intensity of a position in the two intensity distribution diagrams is larger than the standard transmission intensity and smaller than the area array emission intensity and the area array secondary intensity respectively, judging that the position has local flaking;

And when the corresponding transmission intensity of a position in the two intensity distribution diagrams is smaller than the standard transmission intensity, judging that an interlayer exists at the position.

8. The nondestructive testing method of a graphene film according to claim 7, wherein when obtaining the quality grade of the graphene film according to the defect type and the defect number, the method comprises:

Determining the quality score of the graphene film according to the defect type and the defect quantity, wherein the quality score is obtained through the following formula:

Q＝w1*Q1+w2*Q2+w3*Q3；

Wherein, Q represents quality score, w1, w2, w3 represent weight coefficient of holes, weight coefficient of local peeling, weight coefficient of interlayer, Q1, Q2, Q3 represent hole number, local peeling number, interlayer number respectively.

9. The method for non-destructive inspection of a graphene film according to claim 8, wherein when obtaining the quality grade of the graphene film according to the defect type and the defect number, further comprising:

Determining the quality grade of the graphene film according to the quality score; the quality level is inversely related to the quality score.

10. A nondestructive inspection system for a graphene film, for applying the nondestructive inspection method for a graphene film according to any one of claims 1 to 9, comprising:

The device comprises a linear transmitting unit, a planar array receiving unit and a control module, wherein the control module comprises an acquisition unit, a judging unit, an adjusting unit, a processing unit and an evaluation unit;

The acquisition unit is configured to acquire thickness data of a plurality of positions of the graphene film, establish a thickness data set, acquire the average thickness of the graphene film according to the thickness data set, and determine X-ray emission intensity according to the average thickness;

The judging unit acquires the transmission intensity of the X-rays collected by the area array receiving unit in real time, judges abnormal positions according to the transmission intensity of the X-rays and records the number of the abnormal positions; when the number of abnormal positions is greater than a preset number of abnormal positions, the judging unit judges that the graphene film is abnormal

The adjusting unit is configured to adjust the X-ray emission intensity according to the number of the abnormal positions to obtain an area array emission intensity, detect the graphene film with the area array emission intensity to obtain a first intensity distribution diagram, analyze the first intensity distribution diagram, determine a defect coordinate point, and adjust the area array emission intensity according to the position relation of the defect coordinate point to obtain an area array secondary intensity;

the processing unit is configured to obtain a second intensity distribution map, and determine the defect type and the defect number according to the first intensity distribution map and the second intensity distribution map;

The evaluation unit is configured to obtain a quality grade of the graphene film according to the defect type and the defect number.