Disclosure of Invention
The invention aims to overcome the defects of low heat dissipation efficiency, low power density and low space utilization rate caused by insufficient layout of power loss devices in the existing BUCK power supply, and provides a voltage reduction power supply module.
In a first aspect, the present invention provides a BUCK power module, including a BUCK circuit disposed in a housing; the heat dissipation device also comprises at least two heat dissipation rows, wherein the heat dissipation rows are arranged at intervals; the BUCK circuit comprises an output end, an input end, a public end and at least two BUCK loops which are connected in parallel; each BUCK loop comprises a first diode, an output filter capacitor, an output reactor and at least one first switching tube, wherein the first switching tube and the first diode are sequentially connected, one end of the first diode is connected with one end of the output reactor, the other end of the first diode is connected with one end of the output filter capacitor, and the other end of the output reactor is connected with the other end of the output filter capacitor; the input end, the public end and the output end are sequentially arranged at the tail part of the box body in parallel, the radiating row is arranged on one side of the public end, the output filter capacitor is arranged on the other side of the public end, the output reactor is arranged between two adjacent radiating rows, the first switching tube and the first diode are arranged on the outer side surface of the radiating row, and the first switching tube and the first diode in the same BUCK loop are arranged at the same radiating row.
The voltage-reducing power supply module of the scheme increases the power of the whole BUCK circuit by connecting a plurality of BUCK loops in parallel so as to meet the larger power requirement in practical application; considering that the reactor needs to be cooled in a potting mode, the heat conduction path of the first switch tube and the heat conduction path of the first diode are single-sided heat conduction, the reactor is arranged between two adjacent heat dissipation rows, heat conduction efficiency between the heat dissipation rows and the reactor can be greatly improved, and space between the two adjacent heat dissipation rows is conveniently utilized to fill and encapsulate heat conduction glue; the first switch tube and the first diode are arranged on the outer side face of the radiating row, so that the first switch tube and the first diode can be replaced quickly, and the assembly property and maintainability of the first switch tube and the first diode are ensured; and the positions of the components are configured in such a way, each radiating surface of the radiating rows and the space between two adjacent radiating rows and between the radiating rows and the box body can be fully utilized, so that the space utilization rate is higher, and the structure of the scheme is more compact and higher power density is obtained.
Preferably, the number of the BUCK loops is an integer multiple of two, the input end is arranged between two adjacent heat dissipation rows, the first switching tubes in each BUCK loop are distributed in mirror symmetry on two sides of the input end along the distribution direction of the heat dissipation rows, and the first diodes in each BUCK loop are distributed in mirror symmetry on two sides of the input end along the distribution direction of the heat dissipation rows.
Preferably, the input end is connected with an input reactor in series, the input reactor is arranged between two adjacent heat dissipation rows and between the tail of the box body and the output reactor, and the input reactor, the output reactor and the two adjacent heat dissipation rows are encapsulated by adopting heat-conducting glue.
Preferably, an input filter capacitor is further connected in parallel between one end, far away from the input end, of the input reactor and the common end, one end of the input filter capacitor is connected between the input reactor and the first switching tube, the other end of the input filter capacitor is connected with the anode of the first diode, and the input filter capacitor is distributed in mirror symmetry on two sides of the input end along the distribution direction of the heat dissipation row.
Preferably, the input end, the public end and the output end are copper bars, one end of the input reactor is connected with the input end through the copper bars, one end of a first switching tube in each BUCK loop is connected with the other end of the input reactor through the copper bars, the other end of the first switching tube is connected to the cathode of the first diode and one end of the output reactor through the copper bars, the other end of the output reactor is connected with one end of the output filter capacitor through the copper bars, and the anode of the first diode and the other end of the output filter capacitor are connected to the public end.
Preferably, the output filter capacitor further comprises at least two laminated rows, an insulating layer is arranged between the laminated rows, the anode of the first diode and one end of the output filter capacitor are connected with the common end through one laminated row, and one end of the output reactor and the other end of the output filter capacitor are connected with the output end through the other laminated row.
Preferably, the device further comprises an input sensor and an output sensor, wherein the input sensor is arranged on the box body at one side of the input end, and the output sensor is sleeved on the output end.
Preferably, the first switching tube is connected in parallel with a second diode.
Preferably, the output filter capacitance is arranged between the common terminal and the output terminal.
Preferably, the portable electronic device further comprises a display panel, wherein the display panel is arranged at the front end of the box body.
Compared with the prior art, the invention has the beneficial effects that:
The invention provides a voltage-reducing power supply module which increases the power of the whole BUCK circuit by connecting a plurality of BUCK loops in parallel so as to meet the larger power requirement in practical application. The invention also arranges the reactor between two adjacent radiating rows, arranges the first switch tube and the first diode on the outer side surface of the radiating rows, fully utilizes each radiating surface of the radiating rows and the space between two adjacent radiating rows, between the radiating rows and the box body, not only can meet the radiating requirements of the reactor, the first switch tube and the first diode, but also can facilitate the encapsulating operation of the heat conducting glue of the reactor, and meet the assemblability and maintainability of the first switch tube and the first diode, and has more compact size and higher power density.
Detailed Description
The present invention will be described in further detail with reference to test examples and specific embodiments. It should not be construed that the scope of the above subject matter of the present invention is limited to the following embodiments, and all techniques realized based on the present invention are within the scope of the present invention.
Unless specifically stated otherwise, in the description of specific embodiments of the present invention, terms of expression of orientation or positional relationship in which "upper", "lower", "left", "right", "center", "inside", "outside", "etc. are indicated are all based on the expression of orientation or positional relationship shown in the drawings, or are the orientation or positional relationship in which the inventive product/apparatus/device is put when used conventionally. These directional or positional terms are merely used to facilitate description of the aspects of the invention or to simplify the description of the specific embodiments, so that a skilled artisan will readily understand the aspects, rather than to indicate or imply that a particular device/component/element must have a particular orientation or be constructed and operated in a particular positional relationship, and thus should not be construed as limiting the invention.
Furthermore, the terms "horizontal," "vertical," "overhang," "parallel," and the like, if any, do not denote the requirement that the corresponding apparatus/component/element be absolutely horizontal or vertical or overhang or parallel, but may be slightly inclined or offset. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined. Or may be simply understood as a corresponding device/component/element, disposed in a "horizontal", "vertical", "overhanging", "parallel" or the like direction, capable of having an error/deviation within + 10%, more preferably within + 8%, more preferably within + 6%, more preferably within + 5%, more preferably within + 4% of the corresponding directional arrangement. As long as the corresponding device/component/element is within the error/deviation range, it is still possible to achieve its function in the solution according to the invention.
Furthermore, the appearances of the terms "first," "second," "third," etc. are merely descriptive for distinguishing between similar or identical components and not necessarily for describing a relative importance of a particular component or components.
Furthermore, in the description of the embodiments of the present invention, "several", "a plurality" and "a number" represent at least 2. There may be any case of 2, 3, 4, 5, 6, 7, 8, 9, etc., and even more than 9.
Furthermore, in the description of the technical solutions of the present invention, unless explicitly specified/limited/restricted otherwise, the occurrence of the terms "set", "install", "connect", "provided", "laid" and "arranged" shall be understood in a broad sense, for example, as a fixed connection, as a removable connection, as an integral connection, as a connection means commonly used in the art, such as welding, riveting, bolting, screwing, etc. The connection may be a mechanical connection, an electrical connection or a communication connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements.
Example 1
As shown in fig. 1 to 11, a step-down power supply module includes a BUCK circuit provided in a case 1; the heat dissipation device further comprises at least two heat dissipation rows 11, and the heat dissipation rows 11 are arranged at intervals; the BUCK circuit comprises an output end 2, an input end 3, a public end 4 and at least two BUCK loops which are connected in parallel; each BUCK loop comprises a first switching tube 7, a first diode 8, an output reactor 10 and an output filter capacitor 9; the input end 3, the public end 4 and the output end 2 are sequentially arranged at the tail part of the box body 1 in parallel, the heat dissipation row 11 is arranged at one side of the public end 4, the output filter capacitor 9 is arranged at the other side of the public end 4, the output reactor 10 is arranged between two adjacent heat dissipation rows 11, the first switching tube 7 and the first diode 8 are arranged on the outer side surface of the heat dissipation row 11, and the first switching tube 7 and the first diode 8 in the same BUCK loop are arranged at the same heat dissipation row 11.
In an alternative embodiment, as shown in fig. 5 and 6, the simplified working principle of the BUCK loop is that a first switching tube 7, an output reactor 10 and an output filter capacitor 9 are sequentially connected in series from the input end 3 to the common end 4, a cathode of a first diode 8 is connected between the first switching tube 7 and the output reactor 10, and an anode of the first diode 8 is connected to the common end 4.
In an alternative embodiment, as shown in fig. 6 to 11, two or more parallel BUCK circuits may share one output filter capacitor 9.
In an alternative implementation manner, the number of the BUCK loops is an integer multiple of two, the input end 3 is arranged between two adjacent heat dissipation rows 11, the first switching tubes 7 in each BUCK loop are distributed in a mirror symmetry manner on two sides of the input end 3 along the distribution direction of the heat dissipation rows 11, and the first diodes 8 in each BUCK loop are distributed in a mirror symmetry manner on two sides of the input end 3 along the distribution direction of the heat dissipation rows 11; for example, in fig. 4, the first switching tube 7 and the first diode 8 in the BUCK circuits on the upper and lower sides of the input end 3 are all distributed in mirror symmetry along the up and down direction, so that the paths of the BUCK circuits on the two sides of the input end 3 are basically consistent, and the circuits are more uniform.
In an alternative embodiment, the number of the BUCK loops is four, the outer side surface of each heat dissipation row 11 is provided with the first switch tube 7 and the first diode 8 of two BUCK loops, and four output reactors 10 are arranged between the inner sides of the two heat dissipation rows 11. The box body 1 adopts a 19-inch standard cabinet; the size configuration combination has good space utilization and power density.
In an alternative embodiment, the input end 3 is connected with input reactors 5 in series, and the number of the input reactors 5 is not required to be equal to that of BUCK loops; for example, in fig. 11, the number of BUCK loops is four, and two BUCK loops may be divided into one set, each set provided with one input reactor 5. The input reactor 5 integrates two input reactances, having two output ports and one input port in common. The input reactor 5 is arranged between two adjacent heat dissipation rows 11 and between the tail of the box body 1 and the output reactor 10.
In an alternative embodiment, an input filter capacitor 6 is further connected in parallel between one end of the input reactor 5 far from the input end 3 and the common end 4, one end of the input filter capacitor 6 is connected between the input reactor 5 and the first switch tube 7, the other end of the input filter capacitor 6 is connected with the anode of the first diode 8, for example, in fig. 11, one side of each of the four BUCK loops close to the input end 3 is separately connected in parallel with the input filter capacitor 6; and the input filter capacitors 6 are distributed in mirror symmetry on both sides of the input end 3 along the distribution direction of the heat dissipation rows 11.
In an alternative embodiment, the input 3, the common 4 and the output 2 may extend out of the housing 1 via copper bars. One end of the input reactor 5 is connected with the input end 3 through a copper bar, one end of a first switching tube 7 in each BUCK loop is connected with the other end of the input reactor 5 through a copper bar, the other end of the first switching tube 7 is connected to the cathode of a first diode 8 and one end of an output reactor 10 through a copper bar, the other end of the output reactor 10 is connected with one end of an output filter capacitor 9 through a copper bar, and the anode of the first diode 8 and the other end of the output filter capacitor 9 are connected to the common end 4.
In an alternative embodiment, as shown in fig. 2, the device further includes at least two laminated rows 12, an insulating layer is disposed between two adjacent laminated rows 12, the anode of the first diode 8 and one end of the output filter capacitor 9 are connected to the common terminal 4 through one laminated row 12, and one end of the output reactor 10 and the other end of the output filter capacitor 9 are connected to the output terminal 2 through the other laminated row 12. It should be noted that, since the stack row 12 blocks the underlying elements in a top view, the stack row 12 is hidden in fig. 1, 3, 4, and 5 to facilitate viewing of the underlying elements, except for the stack row 12 shown in fig. 2.
In an alternative embodiment, as shown in fig. 1 and 3, the device further comprises an input sensor 13 and an output sensor 14, wherein the input sensor 13 is arranged on the box body 1 at one side of the input end 3, and the output sensor 14 is sleeved on the output end 2. The input sensor 13 and the output sensor 14 are capable of collecting current information of the input terminal 3 and the output terminal 2, respectively.
In an alternative embodiment, as shown in fig. 10 to 11, each BUCK circuit includes at least two first switching tubes 7 connected in series with each other, so as to implement frequency multiplication control of the first switching tubes 7, thereby reducing the loss of the first switching tubes 7.
In an alternative embodiment, as shown in fig. 8 to 9, a second switching tube 17 may be further included, where one end of the second switching tube 17 is connected between the first switching tube 7 and the output reactor 10, and the other end is connected to the other end of the output filter capacitor 9.
In an alternative embodiment, the two ends of the first switch tube 7 may be connected in parallel with the second diode 16 as shown in fig. 6, 8 and 10, or may not be connected in parallel with the second diode 16 as shown in fig. 7, 9 and 11.
In an alternative embodiment, the output filter capacitor 9 is arranged between the common terminal 4 and the output terminal 2.
In an alternative embodiment, as shown in fig. 11, a plurality of output filter capacitors 9 are connected in parallel between the output terminal 2 and the common terminal 4 to smooth the output as much as possible.
In an alternative embodiment, as shown in fig. 1, the display panel 15 is further included, and the display panel 15 is disposed at the front end of the case 1. The display panel 15 may be used to display the operating state of the BUCK circuit, such as the magnitude of the current in the BUCK circuit, the current waveform, the peak current, the current ripple, etc.
In an alternative embodiment, the input reactor 5, the output reactor 10 and the two heat dissipation rows 11 are encapsulated by using heat conducting glue. The heat-conductive glue includes, but is not limited to, silicone heat-conductive glue, epoxy heat-conductive glue, and polyurethane heat-conductive glue.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.