CN118562301A - A fireproof heat dissipation insulating sheet and preparation method thereof - Google Patents
A fireproof heat dissipation insulating sheet and preparation method thereof Download PDFInfo
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- CN118562301A CN118562301A CN202410621127.9A CN202410621127A CN118562301A CN 118562301 A CN118562301 A CN 118562301A CN 202410621127 A CN202410621127 A CN 202410621127A CN 118562301 A CN118562301 A CN 118562301A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 title claims description 83
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 68
- 238000009413 insulation Methods 0.000 claims abstract description 56
- 229910052582 BN Inorganic materials 0.000 claims abstract description 46
- 229920002545 silicone oil Polymers 0.000 claims abstract description 41
- 238000002156 mixing Methods 0.000 claims abstract description 33
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 27
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 27
- 239000011231 conductive filler Substances 0.000 claims abstract description 24
- 229920002050 silicone resin Polymers 0.000 claims abstract description 21
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000002994 raw material Substances 0.000 claims abstract description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003063 flame retardant Substances 0.000 claims abstract description 16
- 239000002270 dispersing agent Substances 0.000 claims abstract description 9
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 16
- 239000001257 hydrogen Substances 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- GJIIAJVOYIPUPY-UHFFFAOYSA-N 2-methylidenebut-3-enoic acid Chemical compound OC(=O)C(=C)C=C GJIIAJVOYIPUPY-UHFFFAOYSA-N 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 238000004073 vulcanization Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 6
- 239000000839 emulsion Substances 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000000872 buffer Substances 0.000 claims description 5
- 239000003995 emulsifying agent Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000004114 Ammonium polyphosphate Substances 0.000 claims description 3
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 3
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 3
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 claims description 3
- 238000004945 emulsification Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 3
- 238000009849 vacuum degassing Methods 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- 239000002114 nanocomposite Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 15
- 238000005452 bending Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 10
- 238000004132 cross linking Methods 0.000 description 8
- 238000011056 performance test Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000006884 silylation reaction Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229920002125 Sokalan® Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical group [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004901 spalling Methods 0.000 description 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000019982 sodium hexametaphosphate Nutrition 0.000 description 1
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 235000019832 sodium triphosphate Nutrition 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
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- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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Abstract
本申请涉及防火隔热绝缘片技术领域,更具体地说,涉及一种防火散热绝缘片及其制备方法,由以下重量份的原料制备得到:乙烯基硅油100份、含氢硅油5‑15份、甲基乙烯基硅树脂20‑30份、导热填料40‑60份、阻燃剂6‑12份、催化剂1‑2份、硫化剂1‑2份,每份所述导热填料是由氮化硼、碳化硅和分散剂按照重量份比为(10‑15):(5‑10):3混合得到,通过上述配方制备得到防火散热绝缘片具有良好的绝缘导热性和柔韧性,导热系数可达9.0W/mK以上,同时该散热绝缘片还具有良好的防火性能,可随意弯曲,适用范围广。The present application relates to the technical field of fireproof heat-insulating sheets, and more specifically, to a fireproof heat-dissipating insulating sheet and a preparation method thereof, which is prepared from the following raw materials in parts by weight: 100 parts of vinyl silicone oil, 5-15 parts of hydrogenated silicone oil, 20-30 parts of methyl vinyl silicone resin, 40-60 parts of thermally conductive filler, 6-12 parts of flame retardant, 1-2 parts of catalyst, and 1-2 parts of vulcanizing agent, wherein each part of the thermally conductive filler is obtained by mixing boron nitride, silicon carbide and dispersant in a weight ratio of (10-15): (5-10): 3. The fireproof heat-dissipating insulating sheet prepared by the above formula has good insulation thermal conductivity and flexibility, and the thermal conductivity coefficient can reach above 9.0W/mK. At the same time, the heat-dissipating insulating sheet also has good fire resistance, can be bent at will, and has a wide range of applications.
Description
技术领域Technical Field
本申请涉及防火隔热绝缘片技术领域,更具体地说,涉及一种防火散热绝缘片及其制备方法。The present application relates to the technical field of fireproof heat-insulating sheets, and more specifically, to a fireproof heat-dissipating insulating sheet and a preparation method thereof.
背景技术Background Art
新能源电池通常是采用多个单元电池组组成,将各个电池组采用串联或/和交联等方式连接得到。相邻两个电池单元间通常通过绝缘散热片进行隔开,避免电池单元间发生短路,提高新能源电池使用的安全性能。New energy batteries are usually composed of multiple unit battery packs, which are connected in series or/and cross-linked. Two adjacent battery cells are usually separated by insulating heat sinks to avoid short circuits between battery cells and improve the safety performance of new energy batteries.
传统的绝缘散热片包括橡胶绝缘散热片、导热硅胶绝缘散热片以及陶瓷绝缘散热片。其中,导热硅胶绝缘散热片具有良好绝缘导热性能,且可以填充电池单元之间的缝隙,有一定的减震作用,比橡胶橡胶绝缘散热片和陶瓷绝缘散热片更方便使用。Traditional insulating heat sinks include rubber insulating heat sinks, thermally conductive silicone insulating heat sinks and ceramic insulating heat sinks. Among them, thermally conductive silicone insulating heat sinks have good insulation and thermal conductivity, can fill the gaps between battery cells, have a certain shock absorption effect, and are more convenient to use than rubber insulating heat sinks and ceramic insulating heat sinks.
但是,随着电池技术不断创新和提升,电池的能量密度不断增加,电池的体积不断缩小,形状多变,电池运行功率越大,在使用过程中散发热量会更高,产生的电压也更高。导热硅胶绝缘散热片导热系数通常在1.0-5.0W/mK,其导热性能还不能满足现有电池的使用,同时现有导热硅胶绝缘散热片的由于添加了大量导热填料,用量一般超过60%,使其柔韧性大大降低,在使用过程中容易出现变形现象,故需要改进。However, with the continuous innovation and improvement of battery technology, the energy density of batteries is increasing, the size of batteries is shrinking, and the shapes are changing. The greater the operating power of the battery, the higher the heat dissipated during use and the higher the voltage generated. The thermal conductivity of thermally conductive silicone insulating heat sinks is usually 1.0-5.0W/mK, and its thermal conductivity cannot meet the use of existing batteries. At the same time, the existing thermally conductive silicone insulating heat sinks have a large amount of thermally conductive fillers added, and the amount is generally more than 60%, which greatly reduces its flexibility and is prone to deformation during use, so it needs to be improved.
发明内容Summary of the invention
为了提高导热硅胶绝缘散热的导热性能,本申请提供一种防火散热绝缘片及其制备方法。In order to improve the thermal conductivity of thermally conductive silicone insulation and heat dissipation, the present application provides a fireproof heat dissipation insulation sheet and a preparation method thereof.
本申请中防火散热绝缘片简称为散热绝缘片。In the present application, the fireproof heat dissipation insulation sheet is referred to as the heat dissipation insulation sheet for short.
第一方面,本申请提供一种防火散热绝缘片,采用如下的技术方案:In a first aspect, the present application provides a fireproof heat dissipation insulation sheet, which adopts the following technical solution:
一种防火散热绝缘片,由以下重量份的原料制备得到:A fireproof heat dissipation insulating sheet is prepared from the following raw materials in parts by weight:
乙烯基硅油100份100 parts of vinyl silicone oil
含氢硅油5-15份5-15 parts of hydrogen silicone oil
甲基乙烯基硅树脂20-30份20-30 parts of methyl vinyl silicone resin
导热填料40-60份Thermally conductive filler 40-60 parts
阻燃剂6-12份Flame retardant 6-12 parts
催化剂1-2份1-2 parts of catalyst
硫化剂1-2份1-2 parts of vulcanizing agent
所述导热填料是由氮化硼、碳化硅和分散剂按照重量份比为(10-15):(5-10):3混合得到。The thermal conductive filler is obtained by mixing boron nitride, silicon carbide and a dispersant in a weight ratio of (10-15): (5-10): 3.
通过采用上述技术方案,制备得到散热绝缘片具有良好的绝缘导热性和柔韧性,导热系数可达9.0W/mK以上,同时该散热绝缘片还具有良好的防火性能和柔软性,可随意弯曲以适用于各种形状的电池。By adopting the above technical solution, the heat dissipation insulating sheet prepared has good insulation thermal conductivity and flexibility, and the thermal conductivity coefficient can reach above 9.0W/mK. At the same time, the heat dissipation insulating sheet also has good fire resistance and flexibility, and can be bent at will to be suitable for batteries of various shapes.
本申请中通过将氮化硼、碳化硅和分散剂按照特定比例混合,进一步提高防火散热绝缘片的导热效率,减少导热粉体的使用量。氮化硼具有良好的导热性能,能够大大提高散热绝缘片的导热性能,但单独使用氮化硅会增加散热绝缘片的粘度上升,同时氮化硼的脆性大,在使用过程中容易散裂,会影响散热绝缘片的柔韧度;散热绝缘片是要贴合电池进行使用,而现有电池具有多种形状,如圆柱、方形以及软包电池,使得绝缘散热片在使用过程中需要进行弯曲,在弯曲处的受力作用较大,容易使氮化硼散裂。而碳化硅的韧性较好,与氮化硼共用,可减少氮化硼的用量,能提高散热绝缘片的韧性,同时碳化硅具有良好的导热性和绝缘性能,能够提高散热绝缘片导热性和绝缘性。分散剂使得氮化硼、碳化硅更好地分散在体系中,提高散热绝缘片的均匀性和稳定性。In this application, by mixing boron nitride, silicon carbide and dispersant in a specific proportion, the thermal conductivity of the fireproof heat dissipation insulation sheet is further improved, and the amount of thermal conductive powder used is reduced. Boron nitride has good thermal conductivity and can greatly improve the thermal conductivity of the heat dissipation insulation sheet, but the use of silicon nitride alone will increase the viscosity of the heat dissipation insulation sheet. At the same time, boron nitride is brittle and easy to break during use, which will affect the flexibility of the heat dissipation insulation sheet; the heat dissipation insulation sheet is to be used in conjunction with the battery, and the existing batteries have a variety of shapes, such as cylindrical, square and soft-pack batteries, so that the insulating heat dissipation sheet needs to be bent during use, and the force at the bend is large, which easily causes the boron nitride to break. Silicon carbide has good toughness, and when used together with boron nitride, the amount of boron nitride can be reduced, and the toughness of the heat dissipation insulation sheet can be improved. At the same time, silicon carbide has good thermal conductivity and insulation performance, which can improve the thermal conductivity and insulation of the heat dissipation insulation sheet. The dispersant allows boron nitride and silicon carbide to be better dispersed in the system, improving the uniformity and stability of the heat dissipation insulation sheet.
在催化剂作用下,本申请中甲基乙烯基硅树脂与-SiH含氢硅油发生硅氢加成反应、乙烯基硅油与-SiH含氢硅油发生硅氢加成反应,甲基乙烯基硅树脂和特定结构乙烯基硅油发生硅氢加成反应,形成不同长度不同结构的主链,这些主链再相互缠绕,从而形成稳定的三维网状结构,提高散热绝缘片的柔韧性,在使用过程中网络结构不易被破坏。本申请中导热填料的用量低于总重量50%,通过将导热填料均匀分布于三维立体网络结构中,搭建形成导热网络结构,提高导热系数,进而提高散热效率。通过添加阻燃剂进一步提高散热绝缘片的阻燃性能。硫化剂促进绝缘散热片硫化成型,提高绝缘散热片的柔韧性、导热性以及绝缘性等性能。Under the action of a catalyst, in this application, methyl vinyl silicone resin undergoes a silylation reaction with -SiH hydrogen-containing silicone oil, vinyl silicone oil undergoes a silylation reaction with -SiH hydrogen-containing silicone oil, and methyl vinyl silicone resin undergoes a silylation reaction with a vinyl silicone oil of a specific structure to form main chains of different lengths and structures, which are then entangled with each other to form a stable three-dimensional network structure, thereby improving the flexibility of the heat dissipation insulation sheet, and the network structure is not easily destroyed during use. In this application, the amount of thermally conductive filler used is less than 50% of the total weight. By evenly distributing the thermally conductive filler in the three-dimensional network structure, a thermally conductive network structure is constructed to improve the thermal conductivity, thereby improving the heat dissipation efficiency. The flame retardant properties of the heat dissipation insulation sheet are further improved by adding a flame retardant. The vulcanizing agent promotes the vulcanization molding of the insulating heat sink, and improves the flexibility, thermal conductivity, and insulation properties of the insulating heat sink.
优选的,所述氮化硼为改性氮化硼,由以下制备方法制备得到:Preferably, the boron nitride is modified boron nitride, which is prepared by the following preparation method:
A:将氮化硼置于有机溶剂中,分散均匀后加入偶联剂,搅拌反应,反应结束后离心洗涤,得到表面改性的氮化硼;A: Put boron nitride in an organic solvent, disperse it evenly, add a coupling agent, stir to react, centrifuge and wash after the reaction is completed to obtain surface-modified boron nitride;
B:将表面改性的氮化硼加入乙醇和水的混合溶液中,然后超声,使所述表面改性的氮化硼均匀的分散,形成乳状液,向乳状液中加入乳化剂和缓冲剂,然后超声分散均匀,得到混合溶液;B: adding the surface-modified boron nitride to a mixed solution of ethanol and water, and then ultrasonicating to uniformly disperse the surface-modified boron nitride to form an emulsion, adding an emulsifier and a buffer to the emulsion, and then ultrasonically dispersing it uniformly to obtain a mixed solution;
C:将混合溶液与乙烯基丙烯酸混合后,在50℃-60℃,氮气保护下,加热回流,进行预乳化,再升温至85℃-90℃,并滴加含有引发剂的水溶液,保持恒温、恒速搅拌反应7-9h,得到初产物,将初产物离心洗涤,真空干燥,得到改性氮化硼。C: After mixing the mixed solution with vinyl acrylic acid, heat to reflux at 50°C-60°C under nitrogen protection for pre-emulsification, then raise the temperature to 85°C-90°C, and dropwise add an aqueous solution containing an initiator, maintain constant temperature and constant speed stirring for 7-9 hours to obtain a primary product, centrifuge and wash the primary product, and vacuum dry it to obtain modified boron nitride.
通过采用上述技术方案,使得氮化硼表面连接有乙烯丙烯酸高分子聚合物,在高分子聚合物的作用下,使得氮化硼的脆性大大降低,进一步提高散热绝缘片的柔韧性和导热性。本申请中先利用偶联剂对氮化硼进行表面改性,有利于氮化硼表面接枝共聚物。再通过利用乙烯基丙烯酸进行乳液聚合包覆,得到乙烯基丙烯酸聚合物包覆氮化硼,使得氮化硼表面具有保护层,可降低氮化硼在使用过程中容易散裂的可能,保持氮化硼结构的完整性,进而保持绝缘散热片的导热性。同时,乙烯基丙烯酸聚合物包覆作用,使得氮化硼表面柔软度大大降低,进一步提高绝缘散热片的柔韧性,同时,乙烯基丙烯酸聚合物能进一步提高氮化硼与三维网状结构结合力,提高散热绝缘片结构稳定性,延长散热绝缘片的使用寿命。By adopting the above technical scheme, the surface of boron nitride is connected with ethylene acrylic acid polymer. Under the action of the polymer, the brittleness of boron nitride is greatly reduced, and the flexibility and thermal conductivity of the heat dissipation insulation sheet are further improved. In this application, the surface of boron nitride is first modified by a coupling agent, which is beneficial to the grafting copolymer on the surface of boron nitride. Then, by using vinyl acrylic acid for emulsion polymerization coating, a vinyl acrylic acid polymer-coated boron nitride is obtained, so that the surface of boron nitride has a protective layer, which can reduce the possibility of easy fragmentation of boron nitride during use, maintain the integrity of the boron nitride structure, and then maintain the thermal conductivity of the insulating heat sink. At the same time, the coating effect of the vinyl acrylic acid polymer greatly reduces the softness of the surface of boron nitride, further improving the flexibility of the insulating heat sink. At the same time, the vinyl acrylic acid polymer can further improve the bonding force between boron nitride and the three-dimensional network structure, improve the structural stability of the heat dissipation insulation sheet, and extend the service life of the heat dissipation insulation sheet.
优选的,制备所述改性氮化硼所用原料的重量份如下所示:Preferably, the weight parts of the raw materials used to prepare the modified boron nitride are as follows:
氮化硼20-30份Boron nitride 20-30 parts
有机溶剂50-70份50-70 parts of organic solvent
偶联剂2.5-3.5份Coupling agent 2.5-3.5 parts
乙醇8-18份8-18 parts of ethanol
水10-20份10-20 parts water
乳化剂4-5份Emulsifier 4-5 parts
缓冲剂4-5份Buffer 4-5 parts
乙烯基丙烯酸5-9份Vinyl acrylic acid 5-9 parts
含有引发剂的水溶液6-10份。Contains 6-10 parts of aqueous solution of initiator.
通过采用上述技术方案,优化制备改性氮化硼所用原料的重量,进一步提高氮化硼与乙烯基丙烯酸聚合物的结合效率,使得氮化硼散裂的可能性大大降低,进而提高绝缘散热片的柔韧性,缓冲弯曲处的作用力,延长散热绝缘片的使用寿命。By adopting the above technical scheme, the weight of the raw materials used to prepare the modified boron nitride is optimized, and the bonding efficiency of boron nitride and vinyl acrylic polymer is further improved, so that the possibility of boron nitride spalling is greatly reduced, thereby improving the flexibility of the insulating heat sink, buffering the force at the bend, and extending the service life of the heat dissipation insulating sheet.
优选的,所述乙烯基硅油的结构式如下:Preferably, the structural formula of the vinyl silicone oil is as follows:
通过采用上述技术方案,提高乙烯基硅油中乙烯含量,有利于提高三维立体网络交联密度,进一步提高散热绝缘片的柔韧性、绝缘性以及散热性。By adopting the above technical solution, the ethylene content in the vinyl silicone oil is increased, which is beneficial to increasing the cross-linking density of the three-dimensional network and further improving the flexibility, insulation and heat dissipation of the heat dissipation insulation sheet.
优选的,所述乙烯基硅油中n=50-150,m=60-200。Preferably, in the vinyl silicone oil, n=50-150, m=60-200.
通过采用上述技术方案,优化n、m的值,使得乙烯基硅油中乙烯基含量适中,有利于与甲基乙烯基硅树脂、含氢硅油交联形成柔韧性好的散热绝缘片,同时还能提高散热绝缘片的柔韧性、绝缘性以及散热性。乙烯基硅油中乙烯基含量较高,交联之后的空间网状结构的交联点过多,导致散热绝缘片在加热固化之后硬度过高;烯基硅油中乙烯基含量少,交联之后的空间网状结构的交联点过少,使得散热绝缘片的强度、绝缘性以及散热性都会下降。By adopting the above technical solution, the values of n and m are optimized, so that the vinyl content in the vinyl silicone oil is moderate, which is conducive to cross-linking with methyl vinyl silicone resin and hydrogen-containing silicone oil to form a heat dissipation insulation sheet with good flexibility, and at the same time, it can also improve the flexibility, insulation and heat dissipation of the heat dissipation insulation sheet. The vinyl content in the vinyl silicone oil is relatively high, and the cross-linking points of the spatial network structure after cross-linking are too many, resulting in the heat dissipation insulation sheet being too hard after heating and curing; the vinyl content in the alkenyl silicone oil is low, and the cross-linking points of the spatial network structure after cross-linking are too few, which reduces the strength, insulation and heat dissipation of the heat dissipation insulation sheet.
优选的,所述氮化硼的平均粒径为30-100nm,所述碳化硅的平均粒径为100-500nm。Preferably, the average particle size of the boron nitride is 30-100 nm, and the average particle size of the silicon carbide is 100-500 nm.
通过采用上述技术方案,对氮化硼和碳化硅级配进一步优化,可显著提高组合物的导热系数,减少氮化硼在使用过程中散裂情况。By adopting the above technical solution, the gradation of boron nitride and silicon carbide is further optimized, the thermal conductivity of the composition can be significantly improved, and the spalling of boron nitride during use can be reduced.
优选的,所述甲基乙烯基硅树脂中乙烯含量为0.1-0.5mol/100g,分子量为10-40万。Preferably, the ethylene content of the methyl vinyl silicone resin is 0.1-0.5 mol/100g and the molecular weight is 100,000-400,000.
通过采用上述技术方案,优化甲基乙烯基硅树脂的参数,提高甲基乙烯基硅树脂与-SiH含氢硅油发生硅氢加成反应的效率,促进三维立体网络形成,提高散热绝缘片的柔韧性、绝缘性以及导热性。By adopting the above technical scheme, the parameters of methyl vinyl silicone resin are optimized, the efficiency of the silylation reaction between methyl vinyl silicone resin and -SiH hydrogen-containing silicone oil is improved, the formation of a three-dimensional network is promoted, and the flexibility, insulation and thermal conductivity of the heat dissipation insulation sheet are improved.
优选的,所述含氢硅油在25℃条件下的粘度为1000-5000mpa.s,含氢量为0.1-0.4%。Preferably, the viscosity of the hydrogen-containing silicone oil at 25° C. is 1000-5000 mPa.s, and the hydrogen content is 0.1-0.4%.
通过采用上述技术方案,优化含氢硅油的粘度和含氢量,进一步提高甲基乙烯基硅树脂与-SiH含氢硅油发生硅氢加成反应和乙烯基硅油与-SiH含氢硅油发生硅氢加成反应的反应效率,提高交联密度,进而使得散热绝缘片的柔韧性、绝缘性以及导热性大大提高。By adopting the above technical scheme, the viscosity and hydrogen content of hydrogenated silicone oil are optimized, the reaction efficiency of the hydrosilylation reaction between methyl vinyl silicone resin and -SiH hydrogenated silicone oil and the hydrosilylation reaction between vinyl silicone oil and -SiH hydrogenated silicone oil is further improved, the crosslinking density is increased, and the flexibility, insulation and thermal conductivity of the heat dissipation insulating sheet are greatly improved.
优选的,所述阻燃剂包括氢氧化镁、聚磷酸铵、十溴二苯醚、硅酮阻燃剂、三氧化二锑和氢氧化铝中的至少一种。上述阻燃剂的阻燃效果好,使用上述阻燃剂能进一步提高散热绝缘片的防火性能。Preferably, the flame retardant includes at least one of magnesium hydroxide, ammonium polyphosphate, decabromodiphenyl ether, silicone flame retardant, antimony trioxide and aluminum hydroxide. The flame retardant has a good flame retardant effect, and the use of the flame retardant can further improve the fireproof performance of the heat dissipation insulation sheet.
第二方面,本申请提供一种用于新能源电池包防火散热绝缘片的制备方法,采用如下技术方案:In the second aspect, the present application provides a method for preparing a fireproof heat dissipation insulating sheet for a new energy battery pack, using the following technical solution:
一种用于新能源电池包防火散热绝缘片的制备方法,包括以下制备步骤:A method for preparing a fireproof heat dissipation insulating sheet for a new energy battery pack comprises the following preparation steps:
S1、按照重量份计,将乙烯基硅油、含氢硅油、甲基乙烯基硅树脂、阻燃剂和催化剂进行混炼,得到混合物A,混炼温度为40-50℃,混炼时间为40-60min,混炼速度为800-1000r/min;S1. According to parts by weight, vinyl silicone oil, hydrogenated silicone oil, methyl vinyl silicone resin, flame retardant and catalyst are mixed to obtain a mixture A, the mixing temperature is 40-50° C., the mixing time is 40-60 min, and the mixing speed is 800-1000 r/min;
S2、将混合物A、导热填料和硫化剂混炼,得到混合物B,混炼温度为40-50℃,混炼时间为20-30min,混炼速度为1000-1200r/min,得到混合物B;S2, mixing mixture A, thermal conductive filler and vulcanizing agent to obtain mixture B, the mixing temperature is 40-50° C., the mixing time is 20-30 min, and the mixing speed is 1000-1200 r/min to obtain mixture B;
S3、将混合物B进行真空脱泡,时间为20-30min,真空压力为0.2-0.4KPa,形成导热硅胶;S4、将导热硅胶加热至80-100℃进行一次硫化3-6min,再加热至110-120℃进行二次硫化2-4min,降温冷却后进行裁切,得到防火散热绝缘片。S3. Vacuum degassing the mixture B for 20-30 minutes at a vacuum pressure of 0.2-0.4 KPa to form thermally conductive silica gel. S4. Heat the thermally conductive silica gel to 80-100°C for primary vulcanization for 3-6 minutes, then heat it to 110-120°C for secondary vulcanization for 2-4 minutes, cool it down, and then cut it to obtain a fireproof heat dissipation insulating sheet.
通过采用上述技术方案,制备得到防火散热绝缘片具有良好的绝缘导热性,导热系数可达9.0W/mK以上,同时该散热绝缘片还具有良好的防火性能。By adopting the above technical solution, the prepared fireproof heat dissipation insulating sheet has good insulation thermal conductivity, and the thermal conductivity coefficient can reach above 9.0W/mK. At the same time, the heat dissipation insulating sheet also has good fireproof performance.
综上所述,本申请具有以下有益效果:In summary, this application has the following beneficial effects:
1、本申请中通过将乙烯基硅油、含氢硅油、甲基乙烯基硅树脂、导热填料、阻燃剂、催化剂和硫化剂制备防火散热绝缘片,其中,导热填料是由氮化硼、碳化硅和分散剂按照特定比例混合得到,通过特定的导热填料提高加散热绝缘片的导热性能和柔韧性,减少导热填料的添加量;同时乙烯基硅油、含氢硅油和甲基乙烯基硅树脂之间的发生交联,大大提高散热绝缘片的柔韧性和绝缘性,使得散热绝缘片可以随意弯曲使用,仍能保持良好的导热性和绝缘性。1. In the present application, a fireproof heat dissipation insulating sheet is prepared by mixing vinyl silicone oil, hydrogen-containing silicone oil, methyl vinyl silicone resin, thermal conductive filler, flame retardant, catalyst and vulcanizing agent, wherein the thermal conductive filler is obtained by mixing boron nitride, silicon carbide and dispersant in a specific proportion. The specific thermal conductive filler is used to improve the thermal conductivity and flexibility of the heat dissipation insulating sheet and reduce the amount of thermal conductive filler added; at the same time, cross-linking occurs between the vinyl silicone oil, hydrogen-containing silicone oil and methyl vinyl silicone resin, which greatly improves the flexibility and insulation of the heat dissipation insulating sheet, so that the heat dissipation insulating sheet can be bent and used at will, and still maintain good thermal conductivity and insulation.
2、本申请中通过对氮化硼进行改性,使得氮化硼的表面结合有乙烯基丙烯酸聚合物,使得氮化硼在使用的过程中不会出现散裂的情况,从而保证散热绝缘片的导热性,同时还能提高氮化硼与三维网状结构结合力,提高散热绝缘片结构稳定性,延长散热绝缘片的使用寿命。2. In the present application, the boron nitride is modified so that the surface of the boron nitride is bonded with a vinyl acrylic polymer, so that the boron nitride will not spall during use, thereby ensuring the thermal conductivity of the heat dissipation insulating sheet. At the same time, it can also improve the bonding strength between the boron nitride and the three-dimensional network structure, improve the structural stability of the heat dissipation insulating sheet, and extend the service life of the heat dissipation insulating sheet.
具体实施方式DETAILED DESCRIPTION
实施例Example
实施例1Example 1
一种防火散热绝缘片,由以下方法制备得到:A fireproof heat dissipation insulating sheet is prepared by the following method:
S1、将乙烯基硅油1000g、含氢硅油50g、甲基乙烯基硅树脂200g、阻燃剂60g(十溴二苯醚)和催化剂10g(氯铂酸)进行混炼,得到混合物A,混炼温度为40℃,混炼时间为40min,混炼速度为800r/min;S1, 1000 g of vinyl silicone oil, 50 g of hydrogenated silicone oil, 200 g of methyl vinyl silicone resin, 60 g of flame retardant (decabromodiphenyl ether) and 10 g of catalyst (chloroplatinic acid) were mixed to obtain a mixture A, the mixing temperature was 40° C., the mixing time was 40 min, and the mixing speed was 800 r/min;
S2、将混合物A、导热填料400g(氮化硼)和硫化剂10g(硫磺)混炼,得到混合物B,混炼温度为40℃,混炼时间为20min,混炼速度为1000r/min,得到混合物B;S2, mixing mixture A, 400 g of thermal conductive filler (boron nitride) and 10 g of vulcanizing agent (sulfur) to obtain mixture B, the mixing temperature is 40° C., the mixing time is 20 min, and the mixing speed is 1000 r/min to obtain mixture B;
S3、将混合物B进行真空脱泡,时间为20min,真空压力为0.2KPa,形成导热硅胶;S3, vacuum degassing the mixture B for 20 min at a vacuum pressure of 0.2 KPa to form thermally conductive silica gel;
S4、将导热硅胶加热至80℃进行一次硫化3min,再加热至110℃进行二次硫化2min,降温冷却后进行裁切,得到防火散热绝缘片。S4, heat the thermal conductive silicone to 80°C for primary vulcanization for 3 minutes, then heat it to 110°C for secondary vulcanization for 2 minutes, cool it down and cut it to obtain a fireproof heat dissipation insulation sheet.
乙烯基硅油的结构式如下:The structural formula of vinyl silicone oil is as follows:
n=50,m=200n=50, m=200
含氢硅油在25℃条件下的粘度为1000mpa.s,含氢量为0.1%。The viscosity of hydrogen-containing silicone oil at 25°C is 1000mpa.s and the hydrogen content is 0.1%.
甲基乙烯基硅树脂的乙烯中乙烯含量为0.1mol/100g,分子量为10万。The ethylene content of methyl vinyl silicone resin is 0.1 mol/100g and the molecular weight is 100,000.
导热填料是由氮化硼222g(平均粒径为30nm)、碳化硅111g(平均粒径为100nm)和分散剂67g(焦磷酸钠)按照重量比为10:5:3混合得到。The thermal conductive filler is obtained by mixing 222 g of boron nitride (average particle size of 30 nm), 111 g of silicon carbide (average particle size of 100 nm) and 67 g of dispersant (sodium pyrophosphate) in a weight ratio of 10:5:3.
实施例2-3与实施例1的不同之处在于,制备防火散热绝缘片的部分原料种类、用量以及参数不同,具体差异见表1:The difference between Example 2-3 and Example 1 is that the types, amounts and parameters of some raw materials for preparing the fireproof heat dissipation insulation sheet are different. The specific differences are shown in Table 1:
表1制备防火散热绝缘片的原料种类、用量以及参数Table 1 Types, amounts and parameters of raw materials for preparing fireproof heat dissipation insulation sheets
实施例2中导热填料是由氮化硼273g(平均粒径为80nm)、碳化硅159g(平均粒径为300nm)和分散剂68g(三聚磷酸钠)按照重量比为12:7:3混合得到。In Example 2, the thermal conductive filler is obtained by mixing 273 g of boron nitride (average particle size of 80 nm), 159 g of silicon carbide (average particle size of 300 nm) and 68 g of dispersant (sodium tripolyphosphate) in a weight ratio of 12:7:3.
实施例3中导热填料是由氮化硼321g(平均粒径为100nm)、碳化硅214g(平均粒径为500nm)和分散剂64g(六偏磷酸钠)按照重量比为15:10:3混合得到。In Example 3, the thermal conductive filler is obtained by mixing 321 g of boron nitride (average particle size of 100 nm), 214 g of silicon carbide (average particle size of 500 nm) and 64 g of dispersant (sodium hexametaphosphate) in a weight ratio of 15:10:3.
实施例4Example 4
一种防火散热绝缘片,本实施例与实施例1的不同之处在于:n=50,m=50,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this embodiment and embodiment 1 is that n=50, m=50, and the types, amounts and experimental parameters of other raw materials are consistent with those of embodiment 1.
实施例5Example 5
一种防火散热绝缘片,本实施例与实施例1的不同之处在于:n=50,m=210,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this embodiment and embodiment 1 is that n=50, m=210, and the types, amounts and experimental parameters of other raw materials are consistent with those of embodiment 1.
实施例6Example 6
一种防火散热绝缘片,本实施例与实施例1的不同之处在于:n=60,m=50,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this embodiment and embodiment 1 is that n=60, m=50, and the types, amounts and experimental parameters of other raw materials are consistent with those of embodiment 1.
实施例7Example 7
一种防火散热绝缘片,本实施例与实施例1的不同之处在于:n=40,m=50,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this embodiment and embodiment 1 is that n=40, m=50, and the types, amounts and experimental parameters of other raw materials are consistent with those of embodiment 1.
实施例8Example 8
一种防火散热绝缘片,本实施例与实施例1的不同之处在于,所述氮化硼为改性氮化硼,由以下制备方法制备得到:A fireproof heat dissipation insulating sheet, the difference between this embodiment and embodiment 1 is that the boron nitride is modified boron nitride, which is prepared by the following preparation method:
A:将氮化硼250g置于有机溶剂500g(四氢呋喃)中,分散均匀后加入偶联剂25g(γ-甲基丙烯酰氧基丙基三甲氧基硅烷),搅拌反应,反应结束后离心洗涤,得到表面改性的氮化硼;A: Put 250g of boron nitride in 500g of organic solvent (tetrahydrofuran), disperse it evenly, add 25g of coupling agent (γ-methacryloxypropyltrimethoxysilane), stir to react, centrifuge and wash after the reaction is completed, and obtain surface-modified boron nitride;
B:将表面改性的氮化硼加入乙醇80g和水100g的混合溶液中,然后超声,使表面改性的氮化硼均匀的分散,形成乳状液,向乳状液中加入乳化剂30g(平平加-10)和缓冲剂30g(碳酸氢钠),然后超声分散均匀,得到混合溶液;B: adding the surface-modified boron nitride to a mixed solution of 80 g ethanol and 100 g water, and then ultrasonicating to uniformly disperse the surface-modified boron nitride to form an emulsion, adding 30 g of an emulsifier (peregal-10) and 30 g of a buffer (sodium bicarbonate) to the emulsion, and then ultrasonically dispersing it uniformly to obtain a mixed solution;
C:将混合溶液与乙烯基丙烯酸50g混合后,在50℃,氮气保护下,加热回流,进行预乳化,再升温至85℃,并滴加含有引发剂的水溶液60g,保持恒温、恒速搅拌反应7h,得到初产物,将初产物离心洗涤,真空干燥,得到改性氮化硼。C: After mixing the mixed solution with 50 g of vinyl acrylic acid, heat to reflux at 50°C under nitrogen protection for pre-emulsification, then raise the temperature to 85°C, and drop 60 g of an aqueous solution containing an initiator. Keep the temperature and speed constant and stir for 7 hours to obtain a primary product. The primary product is centrifuged and washed, and vacuum dried to obtain modified boron nitride.
含有引发剂的水溶液为过硫酸铵水溶液,质量分数为10%。The aqueous solution containing the initiator is an ammonium persulfate aqueous solution with a mass fraction of 10%.
实施例9-10与实施例8的不同之处在于,制备改性氮化硼的部分原料种类、用量以及参数不同,具体差异见表2:The difference between Examples 9-10 and Example 8 is that the types, amounts and parameters of some raw materials for preparing modified boron nitride are different. The specific differences are shown in Table 2:
表2制备改性氮化硼的原料种类、用量以及参数Table 2 Types, amounts and parameters of raw materials for preparing modified boron nitride
实施例11Embodiment 11
一种防火散热绝缘片,本实施例与实施例1的不同之处在于,乙烯基硅油的结构式如下:A fireproof heat dissipation insulating sheet, the difference between this embodiment and embodiment 1 is that the structural formula of the vinyl silicone oil is as follows:
n=50。n=50.
对比例Comparative Example
对比例1Comparative Example 1
一种防火散热绝缘片,本对比例与实施例1的不同之处在于:导热填料全部为氮化硼,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this comparative example and Example 1 is that the thermal conductive fillers are all boron nitride, and the types, amounts and experimental parameters of other raw materials are consistent with those of Example 1.
对比例2Comparative Example 2
一种防火散热绝缘片,本对比例与实施例1的不同之处在于:导热填料全部为碳化硅,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this comparative example and Example 1 is that the thermal conductive fillers are all silicon carbide, and the types, amounts and experimental parameters of other raw materials are consistent with those of Example 1.
对比例3Comparative Example 3
一种防火散热绝缘片,本对比例与实施例1的不同之处在于:将甲基乙烯基硅树脂替换成等量甲基苯基硅树脂,其余原料的种类、用量与实验参数均与实施例1一致。A fireproof heat dissipation insulating sheet. The difference between this comparative example and Example 1 is that methyl vinyl silicone resin is replaced by an equal amount of methyl phenyl silicone resin, and the types, amounts and experimental parameters of other raw materials are consistent with those in Example 1.
甲基苯基硅树脂的分子量为10万,苯基含量为20%。The molecular weight of methylphenyl silicone resin is 100,000 and the phenyl content is 20%.
性能检测试验Performance testing
将实施例1-11和对比例1-3制备得到防火散热绝缘片径向导热系数测试、绝缘性能测试以及弯曲性能测试。The radial thermal conductivity test, insulation performance test and bending performance test of the fireproof heat dissipation insulation sheet prepared by Examples 1-11 and Comparative Examples 1-3 were conducted.
检测方法/试验方法Detection method/test method
导热系数:根据国家标准GB/T2588-2008测试,使用NETZSCH HY 009导热测试仪,在25℃下进行测试导热系数;Thermal conductivity: Tested according to national standard GB/T2588-2008, using NETZSCH HY 009 thermal conductivity tester, at 25°C;
绝缘性能测试:根据GB/1410-2006执行;采用体积表面电阻率测试仪LST-121进行检测体积电阻;测试体积电阻时,电流从散热片的导热层流经导热绝缘层,电阻越大绝缘性能越好;弯曲性能测试:将实施例1-11和对比例1-3制得防火散热绝缘片反复弯曲5000次,弯折角度为90°,在测试导热系数和电阻,导热系数变化率和电阻变化率越小,说明散热绝缘片的弯曲性能越好,柔韧性越好。试验数据如表3所示:Insulation performance test: According to GB/1410-2006; the volume surface resistivity tester LST-121 is used to detect the volume resistance; when testing the volume resistance, the current flows from the heat conductive layer of the heat sink through the heat conductive insulation layer, and the greater the resistance, the better the insulation performance; bending performance test: the fireproof heat dissipation insulation sheet prepared by Examples 1-11 and Comparative Examples 1-3 is repeatedly bent 5000 times, with a bending angle of 90°, and the thermal conductivity and resistance are tested. The smaller the change rate of thermal conductivity and the change rate of resistance, the better the bending performance and flexibility of the heat dissipation insulation sheet. The test data are shown in Table 3:
表3实施例1-11和对比例1-3的实验数据Table 3 Experimental data of Examples 1-11 and Comparative Examples 1-3
由实施例1和对比例1相比较,可以看出通过单独采用氮化硼作为导热填料,可提高散热绝缘片的导热性和绝缘性能,但是在经过弯曲性能试验后,对比例1中的导热性能和电阻大大降低,说明单独使用氮化硼作为导热填料是不利于提高散热绝缘片的柔韧性能。By comparing Example 1 with Comparative Example 1, it can be seen that the thermal conductivity and insulation performance of the heat dissipation insulating sheet can be improved by using boron nitride alone as a thermally conductive filler. However, after the bending performance test, the thermal conductivity and resistance in Comparative Example 1 are greatly reduced, indicating that using boron nitride alone as a thermally conductive filler is not conducive to improving the flexibility of the heat dissipation insulating sheet.
由实施例1与对比例2相比较,可以看出通过单独采用碳化硅作为导热填料,导热系数和电阻均降低,且经弯曲性能测试后,导热系数和电阻均下降,说明使用氮化硼和碳化硅共用,能进一步提高散热绝缘片的柔韧性、导热性和绝缘性。By comparing Example 1 with Comparative Example 2, it can be seen that by using silicon carbide alone as a thermally conductive filler, both the thermal conductivity and the resistance are reduced, and after the bending performance test, both the thermal conductivity and the resistance are reduced, indicating that the use of boron nitride and silicon carbide together can further improve the flexibility, thermal conductivity and insulation of the heat dissipation insulating sheet.
由实施例1和对比例3相比较,对比例3中导热系数和电阻都不如实施例1,且经弯曲性能测试后,导热系数和电阻都大大降低,说明本申请中通过添加甲基乙烯基硅树脂与其他成分共用,能进一步提高散热绝缘片的柔韧性,保持良好的导热性和绝缘性。By comparing Example 1 with Comparative Example 3, the thermal conductivity and resistance of Comparative Example 3 are not as good as those of Example 1, and after the bending performance test, the thermal conductivity and resistance are greatly reduced, indicating that in the present application, by adding methyl vinyl silicone resin in combination with other components, the flexibility of the heat dissipation insulating sheet can be further improved, and good thermal conductivity and insulation can be maintained.
由实施例1与实施例8-10相比较,实施例8-10中导热系数和电阻均增大,且经过反复弯曲,实施例8-10中导热系数变化率和电阻变化率均小于实施例1,说明通过本申请制备的改性氮化硼,能进一步提高散热绝缘片的柔韧性、导热性和绝缘性。Comparing Example 1 with Examples 8-10, the thermal conductivity and resistance in Examples 8-10 are increased, and after repeated bending, the change rate of thermal conductivity and the change rate of resistance in Examples 8-10 are both less than that in Example 1, indicating that the modified boron nitride prepared by the present application can further improve the flexibility, thermal conductivity and insulation of the heat dissipation insulating sheet.
由实施例1与实施例4-7相比较,实施例4-5经过反复弯曲,实施例4-5中导热系数变化率和电阻变化率均小于实施例1;实施例6-7中导热系数和电阻均减小,且经过反复弯曲,实施例6-7中导热系数变化率和电阻变化率均小于实施例1,说明通过优化乙烯基硅油中n和m值,能进一步提高散热绝缘片的柔韧性、导热性和绝缘性。Comparing Example 1 with Example 4-7, after repeated bending, the change rate of thermal conductivity and the change rate of resistance in Example 4-5 are both smaller than those in Example 1; the thermal conductivity and resistance in Example 6-7 are both reduced, and after repeated bending, the change rate of thermal conductivity and the change rate of resistance in Example 6-7 are both smaller than those in Example 1, indicating that the flexibility, thermal conductivity and insulation of the heat dissipation insulating sheet can be further improved by optimizing the values of n and m in the vinyl silicone oil.
实施例1和实施例11相比较,实施例11中导热系数和电阻均减小,且经过反复弯曲,实施例11中导热系数变化率和电阻变化率均小于实施例1,说明通过使用特定结构的乙烯基硅油配合其他原料共用制备散热绝缘片,能进一步提高散热绝缘片的柔韧性、导热性和绝缘性。Compared with Example 1 and Example 11, the thermal conductivity and resistance in Example 11 are reduced, and after repeated bending, the change rate of thermal conductivity and the change rate of resistance in Example 11 are smaller than those in Example 1, indicating that by using a vinyl silicone oil with a specific structure in combination with other raw materials to prepare the heat dissipation insulating sheet, the flexibility, thermal conductivity and insulation of the heat dissipation insulating sheet can be further improved.
本具体实施例仅仅是对本申请的解释,其并不是对本申请的限制,本领域技术人员在阅读完本说明书后可以根据需要对本实施例做出没有创造性贡献的修改,但只要在本申请的权利要求范围内都受到专利法的保护。This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed. However, as long as it is within the scope of the claims of the present application, it shall be protected by the patent law.
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| US20170107415A1 (en) * | 2015-10-14 | 2017-04-20 | Shin-Etsu Chemical Co., Ltd. | Insulating heat dissipation sheet |
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