CN118330941A - A backlight module and its manufacturing process - Google Patents

Abstract

The application discloses a backlight module and a manufacturing process thereof, and relates to the technical field of liquid crystal display screens. The light source comprises a lower frame, wherein the inner bottom of the lower frame is fixedly connected with a reflecting plate, the top of the reflecting plate is fixedly connected with a light guide plate, the inner part of the lower frame is fixedly connected with a lower diffusion sheet, the lower diffusion sheet is arranged above the light guide plate, the top of the lower diffusion sheet is fixedly connected with a lower light enhancement sheet, the top of the lower light enhancement sheet is fixedly connected with an upper light enhancement sheet, and the top of the upper light enhancement sheet is fixedly connected with an upper diffusion sheet. After the upper frame and the lower frame are guided to be pressed relatively, the lower frame drives the buckle to be clamped with the slot, then the locking assembly is screwed to drive the upper frame and the lower frame to extrude the rubber sealing ring, the heat dissipation fins are driven to be attached to the heat conduction plate, meanwhile, working heat generated by electric elements in the element mounting slot is conducted to the heat dissipation fins through the starting cooling assembly, and heat exchange cooling is formed by utilizing outside air and the heat dissipation fins.

Description

A backlight module and its manufacturing process

Technical Field

The present application relates to the technical field of liquid crystal display screens, and in particular to a backlight module and a manufacturing process thereof.

Background technique

At present, liquid crystal display devices have been widely used in various electronic products such as computer monitors, televisions, laptops, mobile phones, digital cameras, etc. due to their advantages of lightness, power saving, and low radiation. Since liquid crystal itself does not emit light, a backlight module is required to provide lighting for the liquid crystal display device.

The main structure of a general backlight module includes a light source, a light guide plate, a lower diffuser, a lower light-enhancing sheet, an upper light-enhancing sheet, an upper diffuser, a frame, etc. The working principle is that the light emitted by the light bar passes through the light guide plate, is conducted inside the light guide plate and irradiates the dots, causing scattering, and then outputs from the side of the light guide plate without dots to form a surface light source. Finally, after being processed by the diffuser and light-enhancing sheet, the light becomes more uniform and brighter, providing sufficient backlight support for LCD products.

In actual applications, in order to prevent the light from spilling out, the light bar is usually sealed and installed between the upper and lower frames of the backlight module and the light guide plate. However, this sealed installation method also brings a problem: the heat generated by the light bar during operation is difficult to dissipate effectively, which will cause the temperature to rise, affect the working efficiency and stability of the light source, and shorten its service life.

Summary of the invention

The purpose of this application is to solve the problem that the heat generated by the light strip during operation is difficult to dissipate effectively, which will cause the temperature to rise, affect the working efficiency and stability of the light source, and shorten its service life. This application provides a backlight module and its manufacturing process.

In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions:

The top of the lower frame is fixedly connected to the lower frame, and the top of the lower frame is fixedly connected to the light guide plate. The lower diffuser is fixedly connected inside the lower frame, and the lower diffuser is installed above the light guide plate. The top of the lower diffuser is fixedly connected to the lower light-enhancing sheet, and the top of the lower light-enhancing sheet is fixedly connected to the upper light-enhancing sheet. The top of the upper light-enhancing sheet is fixedly connected to the upper diffuser, and the top of the upper diffuser is fixedly connected to the upper frame. The top of the upper diffuser is covered with an upper frame, and the inner side of the upper frame is symmetrically provided with a card slot, and the bottom of the upper frame is fixedly connected with a rubber sealing ring, and the rubber sealing ring is installed between the lower frame and the upper frame. One end of the upper frame is symmetrically and evenly fixedly connected with a plurality of heat dissipation fins, the inner side of the lower frame is symmetrically provided with a component mounting slot, and a cooling component for conducting heat to the heat dissipation fins is installed inside the component mounting slot, and one end of the lower frame is symmetrically fixedly connected with a pair of buckles adapted to the card slot, and a pair of locking components for fixing the lower frame and the upper frame are symmetrically installed inside the lower frame.

By adopting the above technical scheme and setting the coordinated use of the locking assembly and the cooling assembly, after guiding the upper frame and the lower frame to be relatively pressed together, the lower frame drives the buckle to form a snap connection with the slot, and then tightens the locking assembly to drive the upper frame and the lower frame to extrude the rubber sealing ring, and drives the heat sink fins and the heat conduction plate to form a fit, and at the same time, by starting the cooling assembly, the working heat generated by the electrical components inside the component mounting slot is transferred to the heat sink fins, and the external air is used to form heat exchange and cooling with the heat sink fins, thereby effectively improving the heat dissipation effect of the heat generated by the working electrical components inside the component mounting slot, and at the same time improving the working efficiency and stability of the electrical components inside the component mounting slot, and extending the service life of the device.

Furthermore, the cooling component includes a heat conducting plate fixedly connected to one side of the lower frame, a semiconductor heat sink connected to the heat conducting plate is fixedly connected inside the lower frame, a heat absorbing plate connected to the semiconductor heat sink is fixedly connected to the inner side of the element mounting groove, and one end of the cooling fin is fitted with the heat conducting plate.

By adopting the above technical scheme, by setting up the semiconductor heat sink for use with the heat conducting plate and the heat absorbing plate, it is convenient to start the semiconductor heat sink in conjunction with the heat absorbing plate to absorb the working heat generated inside the component mounting slot, and then cooperate with the heat conducting plate to conduct the heat generated by the semiconductor heat sink to the surface of the heat dissipation fins, and use the heat dissipation fins to exchange heat with the external air to achieve heat dissipation and cooling, thereby facilitating the cooling of the working environment inside the component mounting slot and improving the practicality of the device.

Furthermore, the locking assembly includes a locking groove opened at one end of the lower frame, the bottom of the buckle is slidably connected to the inside of the locking groove, one end of the lower frame is rotatably connected to a bolt, one end of the bolt passes through the lower frame and extends to the inside of the locking groove, and the end of the bolt extending to the inside of the locking groove is threadedly connected to the buckle.

By adopting the above technical solution, by setting the matching use of the buckle, the locking groove and the bolt, it is convenient to drive the buckle by tightening the bolt to drive the upper frame to extrude the rubber sealing ring along the length direction of the locking groove, thereby achieving a fixed connection between the lower frame and the upper frame of the rubber sealing ring, and at the same time utilizing the deformation of the rubber sealing ring to fill the gap between the lower frame and the upper frame.

Furthermore, a light bar is fixedly connected to the inside of one of the component mounting grooves, a conductive ring piece is fixedly connected to the inner side of the lower frame, an insulating ring piece is fixedly connected to the inner side of the conductive ring piece, an active material ring piece is fixedly connected to the inside of the insulating ring piece, a mask piece is fixedly connected between the insulating ring piece and the conductive ring piece, a plurality of conductive convex grooves are provided at one end of the mask piece, one end of the conductive convex groove passes through the insulating ring piece and the active material ring piece and is connected to the conductive ring piece, the mask piece is installed on one side of another component mounting groove, and a conductive carbon nanotube coating is provided on the inner side of the active material ring piece.

By adopting the above technical solution, a mask sheet is arranged and installed on one side of another component mounting groove, so that the conductive convex groove is connected with the conductive ring sheet to form a first source and drain electrode, and a conductive carbon nanotube coating is arranged on the inner side of the active material ring sheet to form a second source and drain electrode and a light bar are respectively installed in the inside of the two component mounting grooves, thereby reducing the collection of working heat generated by the electrical components connected to the first source and drain electrode and the second source and drain electrode and the light bar, resulting in temperature increase and difficulty in heat dissipation.

Furthermore, an arc-shaped light collecting plate is fixedly connected to the interior of one of the component installation grooves, and the arc-shaped light collecting plate cover is arranged on a side of the light bar away from the light guide plate.

By adopting the above technical solution, by setting up the arc-shaped focusing plate and the light bar for use together, it is convenient to use the arc-shaped focusing plate to guide the light that is not irradiated to the light guide plate by the light bar again, and introduce it into the interior of the light guide plate, thereby improving the utilization rate of the light generated by the light bar.

Furthermore, an annular inner corner is formed on the top of the upper frame.

By adopting the above technical solution and setting the annular inner angle, the overall weight of the device is effectively reduced, thereby reducing the manufacturing cost.

Furthermore, a plurality of triangular reinforcement blocks are symmetrically and evenly fixedly connected inside the annular internal angle.

By adopting the above technical solution, the overall rigidity of the upper frame is effectively improved by arranging the triangular reinforcement blocks, thereby improving the supporting strength of the device body and extending the service life of the device.

A manufacturing process of a backlight module, the method steps are as follows:

S1: firstly, a conductive ring sheet is fixed on the inner side of the lower frame, and an insulating ring sheet is fixed on the inner side of the conductive ring sheet, and then an active material ring sheet is fixed on the inner side of the insulating ring sheet, and then a mask sheet is arranged between the conductive ring sheet and the insulating ring sheet, and a conductive convex groove arranged on the surface of the mask sheet is used to pass through the insulating ring sheet and the active material ring sheet, and at the same time, the inner side of the conductive ring sheet is connected to expose a part of the conductive ring sheet, and the active material ring sheet is formed into an active component; a conductive carbon nanotube coating is arranged on the active material ring sheet;

S2: Then, the reflector, the light guide plate, the lower diffuser, the lower brightness enhancement sheet, the upper brightness enhancement sheet, and the upper diffuser are sequentially fixed inside the lower frame, and the upper frame and the lower frame are guided to be relatively pressed together, so that the lower frame drives the buckle to form a snap connection with the slot;

S3: Then, the bolt is tightened to drive the buckle to drive the upper frame to squeeze the rubber sealing ring along the length direction of the locking groove, and the rubber sealing ring is deformed to fill the gap between the lower frame and the upper frame, and the upper frame drives the heat sink fins to fit with the heat conducting plate.

In summary, the present application includes at least one of the following beneficial effects:

1. By setting up the coordinated use of the locking component and the cooling component, when the upper frame and the lower frame are guided to be relatively pressed together, the lower frame drives the buckle to form a snap connection with the slot, and then tightens the locking component to drive the upper frame and the lower frame to extrude the rubber sealing ring, and drives the heat dissipation fins and the heat conduction plate to form a fit, and at the same time, by starting the cooling component, the working heat generated by the electrical components inside the component installation slot is transferred to the cooling fins, and the external air is used to form heat exchange and cooling with the cooling fins, thereby effectively improving the heat dissipation effect of the heat generated by the electrical components inside the component installation slot, while improving the working efficiency and stability of the electrical components inside the component installation slot, and extending the service life of the device.

2. By setting the buckle, locking groove and bolt for use, it is convenient to drive the buckle by tightening the bolt to drive the upper frame to squeeze the rubber sealing ring along the length direction of the locking groove, thereby achieving a fixed connection between the lower frame and the upper frame of the rubber sealing ring, and at the same time utilizing the deformation of the rubber sealing ring to fill the gap between the lower frame and the upper frame.

3. A mask sheet is installed on one side of another component mounting groove, so that the conductive convex groove is connected with the conductive ring sheet to form a first source and drain electrode, and a conductive carbon nanotube coating is arranged on the inner side of the active material ring sheet to form a second source and drain electrode and a light bar are installed in the two component mounting grooves respectively, thereby reducing the working heat generated by the electrical components connected to the first source and drain electrode and the second source and drain electrode and the light bar, resulting in a temperature increase and difficulty in heat dissipation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of the three-dimensional structure of the device body in the present application.

FIG. 2 is an exploded view of the internal structure of the lower frame in the present application.

FIG. 3 is a side cross-sectional view of the main body of the device in the present application.

FIG. 4 is an enlarged view of point A in FIG. 3 .

FIG. 5 is an exploded view of the internal structure of the locking slide groove in the present application.

FIG. 6 is an enlarged view of point B in FIG. 5 .

Description of reference numerals:

1. Lower frame; 2. Reflector; 3. Light guide plate; 4. Lower diffuser; 5. Lower light enhancement plate; 6. Upper light enhancement plate; 7. Upper diffuser; 9. Upper frame; 10. Slot; 11. Rubber sealing ring; 12. Heat sink fin; 13. Component mounting slot; 14. Buckle; 15. Heat conduction plate; 16. Semiconductor heat sink; 17. Heat absorbing plate; 18. Locking slide slot; 19. Bolt; 20. Light bar; 21. Conductive ring plate; 22. Mask plate; 23. Insulating ring plate; 24. Active material ring plate; 25. Conductive convex groove; 26. Arc-shaped focusing plate; 27. Annular inner angle; 28. Triangular reinforcement block.

Detailed ways

The present application is further described in detail below in conjunction with Figures 1-6.

The embodiment of the present application discloses a backlight module and a manufacturing process thereof.

1 to 4, a backlight module includes a lower frame 1, a reflector 2 is fixedly connected to the inner bottom of the lower frame 1, a light guide plate 3 is fixedly connected to the top of the reflector 2, a lower diffuser 4 is fixedly connected to the interior of the lower frame 1, the lower diffuser 4 is installed above the light guide plate 3, a lower light enhancement sheet 5 is fixedly connected to the top of the lower diffuser 4, an upper light enhancement sheet 6 is fixedly connected to the top of the lower light enhancement sheet 5, an upper diffuser 7 is fixedly connected to the top of the upper light enhancement sheet 6, an upper frame 9 is provided on the top cover of the upper diffuser 7, and a card slot 10 is symmetrically provided on the inner side of the upper frame 9. A rubber sealing ring 11 is fixedly connected to the bottom of the upper frame 9, and the rubber sealing ring 11 is installed between the lower frame 1 and the upper frame 9. A plurality of heat sink fins 12 are symmetrically and evenly fixedly connected to one end of the upper frame 9. Component mounting grooves 13 are symmetrically provided on the inner side of the lower frame 1. A cooling component for conducting heat to the heat sink fins 12 is installed inside the component mounting grooves 13. A pair of buckles 14 adapted to the card slots 10 are symmetrically fixedly connected to one end of the lower frame 1. A pair of locking components for fixing the lower frame 1 and the upper frame 9 are symmetrically installed inside the lower frame 1.

Among them, the cooling component includes a heat conducting plate 15 fixedly connected to one side of the lower frame 1, a semiconductor heat sink 16 connected to the heat conducting plate 15 is fixedly connected inside the lower frame 1, a heat absorbing plate 17 connected to the semiconductor heat sink 16 is fixedly connected to the inner side of the component mounting groove 13, and one end of the cooling fin 12 is in contact with the heat conducting plate 15.

When in use, first manually pull the upper frame 9 and the lower frame 1 to press them relatively, so that the lower frame 1 drives the buckle 14 to form a conflict with the inner side of the upper frame 9, and the buckle 14 is forced to shrink and deform, and then the rebound characteristic of the buckle 14 is used to make one end of the buckle 14 rebound and snap into the inside of the card slot 10, so that the reflector 2, the light guide plate 3, the lower diffuser 4, the lower light-enhancing plate 5, the upper light-enhancing plate 6, and the upper diffuser 7 are fixedly installed between the lower frame 1 and the reflector 2, and then the upper frame 9 is driven to form a tight fit with the lower frame 1 by tightening the locking assembly, and the lower frame 1 cooperates with the upper frame 9 to squeeze the rubber sealing ring 11, so that the rubber sealing ring 11 is forced to deform and fill between the contact surfaces of the lower frame 1 and the upper frame 9, thereby improving the sealing effect between the lower frame 1 and the upper frame 9, and at the same time, the upper frame 9 drives the multiple heat dissipation fins 12 to move along the side of the lower frame 1 to the position that fits with the heat conducting plate 15;

Then, the semiconductor radiator 16 is started to absorb the heat generated by the working electrical components inside the component installation slot 13 by using the heat absorbing end in cooperation with the heat absorbing plate 17, and then the heat dissipation end of the semiconductor radiator 16 transfers the heat to the heat conducting plate 15, so that the heat conducting plate 15 transfers the received heat to the multiple heat dissipation fins 12, thereby expanding the heat dissipation area of the heat conducting plate 15 and achieving heat exchange and cooling with the external air, thereby effectively improving the heat dissipation effect of the heat generated by the working electrical components inside the component installation slot 13 while strengthening the sealing effect between the lower frame 1 and the upper frame 9, improving the working efficiency and stability of the electrical components inside the component installation slot 13, and extending the service life of the device.

2 , 5 and 6 , the locking assembly includes a locking groove 18 opened at one end of the lower frame 1, the bottom of the buckle 14 is slidably connected to the inside of the locking groove 18, one end of the lower frame 1 is rotatably connected to a bolt 19, one end of the bolt 19 passes through the lower frame 1 and extends to the inside of the locking groove 18, and the end of the bolt 19 extending to the inside of the locking groove 18 is threadedly connected to the buckle 14.

During use, when the upper frame 9 and the lower frame 1 are manually pulled relative to each other and pressed to drive the buckle 14 to form a snap connection with the slot 10, the bolt 19 is tightened to form a threaded connection with the buckle 14, and the buckle 14 is driven to move downward along the length direction of the locking slot 18, so that one end of the buckle 14 pushes the upper frame 9 in the direction of the lower frame 1 to squeeze the rubber sealing ring 11, so that the rubber sealing ring 11 is deformed under the force and fills the gap between the lower frame 1 and the upper frame 9, thereby facilitating the fixed connection between the lower frame 1 and the upper frame 9, and effectively improving the sealing between the lower frame 1 and the upper frame 9.

2-4, a light bar 20 is fixedly connected to the inside of a component mounting groove 13, a conductive ring piece 21 is fixedly connected to the inner side of the lower frame 1, an insulating ring piece 23 is fixedly connected to the inner side of the conductive ring piece 21, an active material ring piece 24 is fixedly connected to the inside of the insulating ring piece 23, a mask piece 22 is fixedly connected between the insulating ring piece 23 and the conductive ring piece 21, a plurality of conductive convex grooves 25 are provided at one end of the mask piece 22, one end of the conductive convex groove 25 passes through the insulating ring piece 23 and the active material ring piece 24, and is connected to the conductive ring piece 21, the mask piece 22 is installed on one side of another component mounting groove 13, and a conductive carbon nanotube coating is provided on the inner side of the active material ring piece 24.

When in use, firstly, the mask sheet 22 is connected with the insulating ring sheet 23 and the active material ring sheet 24 by setting a conductive groove 25, so that the electrical component can be connected with the conductive ring sheet 21 through the conductive groove 25 to form a first source and drain, and a conductive carbon nanotube coating is set on the inner side of the active material ring sheet 24 to form a second source and drain. At the same time, the mask sheet 22 is installed on one side of another component mounting groove 13, so that the electrical components connected to the first source and drain and the second source and drain are conveniently installed inside the other component mounting groove 13, so that the electrical components connected to the first source and drain and the second source and drain and the light bar 20 are respectively installed inside the two component mounting grooves 13, thereby reducing the problem of the working heat generated by the electrical components connected to the first source and drain and the second source and drain and the light bar 20, which leads to temperature increase and difficulty in heat dissipation, and further improves the practicality of the device.

3 and 4 , an arc-shaped light-collecting plate 26 is fixedly connected to the interior of one component mounting groove 13 , and the arc-shaped light-collecting plate 26 is covered on a side of the light bar 20 away from the light guide plate 3 .

During use, when the light bar 20 is started to output light toward the interior of the light guide plate 3, the arc-shaped focusing plate 26 is provided to reflect and guide the light emitted by the light bar 20 toward the side away from the light guide plate 3, and reintroduce it into the interior of the light guide plate 3, thereby effectively improving the utilization rate of the light generated by the light bar 20 and improving the practicality of the device.

1 and 2 , an annular inner corner 27 is formed at the top of the upper frame 9 .

When in use, the annular inner corner 27 is provided to effectively reduce the deadweight of the upper frame 9, thereby reducing the weight of the entire device and reducing the manufacturing cost.

1 and 2 , a plurality of triangular reinforcement blocks 28 are symmetrically and evenly fixedly connected inside the annular internal angle 27 .

When in use, the overall rigidity of the upper frame 9 is effectively improved by setting the triangular reinforcement block 28, thereby reducing the degree of deformation of the upper frame 9 caused by force during installation, and reducing the possibility of internal components of the lower frame 1 being squeezed and damaged due to deformation of the upper frame 9, thereby improving the safety of the device.

A manufacturing process of a backlight module, the method steps are as follows:

S1: First, a conductive ring sheet 21 is fixed on the inner side of the lower frame 1, and an insulating ring sheet 23 is fixed on the inner side of the conductive ring sheet 21, and then an active material ring sheet 24 is fixed on the inner side of the insulating ring sheet 23, and then a mask sheet 22 is arranged between the conductive ring sheet 21 and the insulating ring sheet 23, and a conductive convex groove 25 arranged on the surface of the mask sheet 22 is used to pass through the insulating ring sheet 23 and the active material ring sheet 24, and at the same time, the inner side of the conductive ring sheet 21 is connected to expose a part of the conductive ring sheet 21, and the active material ring sheet 24 is formed into an active component; a conductive carbon nanotube coating is arranged on the active material ring sheet 24;

S2: Then, the reflector 2, the light guide plate 3, the lower diffuser 4, the lower brightness enhancement sheet 5, the upper brightness enhancement sheet 6, and the upper diffuser 7 are sequentially fixed inside the lower frame 1, and the upper frame 9 is guided to be relatively pressed with the lower frame 1, so that the lower frame 1 drives the buckle 14 to form a snap connection with the card slot 10;

S3: Then, by tightening the bolt 19, the buckle 14 is driven to drive the upper frame 9 to squeeze the rubber sealing ring 11 along the length direction of the locking groove 18, and at the same time, the deformation of the rubber sealing ring 11 is used to fill the gap between the lower frame 1 and the upper frame 9, and at the same time, the upper frame 9 drives the heat dissipation fins 12 to fit with the heat conducting plate 15.

The implementation principle of a backlight module and its manufacturing process of this embodiment is as follows: first, a conductive convex groove 25 is provided to connect the mask sheet 22 with the insulating ring sheet 23 and the active material ring sheet 24, so that the electrical component can be connected with the conductive ring sheet 21 through the conductive convex groove 25 to form a first source and drain electrode, and a conductive carbon nanotube coating is provided on the inner side of the active material ring sheet 24 to form a second source and drain electrode, and at the same time, the mask sheet 22 is installed on one side of another component installation groove 13, so that the electrical component connected with the first source and drain electrode and the second source and drain electrode is conveniently installed inside the other component installation groove 13, so that the electrical component connected with the first source and drain electrode and the second source and drain electrode and the light bar 20 are respectively installed inside the two component installation grooves 13, thereby reducing the collection of working heat generated by the electrical component connected with the first source and drain electrode and the second source and drain electrode and the light bar 20;

Then, the upper frame 9 and the lower frame 1 are manually pulled to press together, so that the lower frame 1 drives the buckle 14 to form a conflict with the inner side of the upper frame 9, and the buckle 14 is forced to shrink and deform, and then the rebound characteristic of the buckle 14 is used to make one end of the buckle 14 rebound and snap into the inside of the slot 10;

Then, the bolt 19 is tightened to form a threaded connection with the buckle 14, and the buckle 14 is driven to move downward along the length direction of the locking slide groove 18, so that one end of the buckle 14 pushes the upper frame 9 in the direction of the lower frame 1 to squeeze the rubber sealing ring 11, so that the rubber sealing ring 11 is deformed by force and fills the gap between the lower frame 1 and the upper frame 9, and at the same time, the upper frame 9 drives the multiple heat dissipation fins 12 to move along the side of the lower frame 1 to a position that fits with the heat conducting plate 15;

Finally, the semiconductor radiator 16 is started to absorb the heat generated by the electrical components inside the component mounting slot 13 by using the heat absorbing end in cooperation with the heat absorbing plate 17, and then the heat dissipating end of the semiconductor radiator 16 transfers the heat to the heat conducting plate 15, so that the heat conducting plate 15 transfers the received heat to the multiple heat dissipating fins 12, thereby expanding the heat dissipation area of the heat conducting plate 15 and achieving heat exchange and cooling with the external air.

Claims (8)

1. A backlight module, comprising a lower frame (1), characterized in that: a reflective plate (2) is fixedly connected to the inner bottom of the lower frame (1), a light guide plate (3) is fixedly connected to the top of the reflective plate (2), a lower diffuser (4) is fixedly connected to the interior of the lower frame (1), the lower diffuser (4) is installed above the light guide plate (3), a lower light enhancement plate (5) is fixedly connected to the top of the lower diffuser (4), an upper light enhancement plate (6) is fixedly connected to the top of the lower light enhancement plate (5), an upper light enhancement plate (6) is fixedly connected to the top of the upper light enhancement plate (6), an upper diffuser (7) is fixedly connected to the top of the upper diffuser (7), an upper frame (9) is provided on the top cover of the upper diffuser (7), and a card slot (1) is symmetrically provided on the inner side of the upper frame (9) 10), a rubber sealing ring (11) is fixedly connected to the bottom of the upper frame (9), and the rubber sealing ring (11) is installed between the lower frame (1) and the upper frame (9); one end of the upper frame (9) is symmetrically and evenly fixedly connected to a plurality of heat dissipation fins (12); an element installation groove (13) is symmetrically opened on the inner side of the lower frame (1); a cooling component for conducting heat to the heat dissipation fins (12) is installed inside the element installation groove (13); one end of the lower frame (1) is symmetrically and fixedly connected to a pair of buckles (14) adapted to the card slot (10); and a pair of locking components for fixing the lower frame (1) and the upper frame (9) are symmetrically installed inside the lower frame (1). 2. A backlight module according to claim 1, characterized in that: the cooling component comprises a heat conducting plate (15) fixedly connected to one side of the lower frame (1), a semiconductor heat sink (16) connected to the heat conducting plate (15) is fixedly connected inside the lower frame (1), a heat absorbing plate (17) connected to the semiconductor heat sink (16) is fixedly connected inside the component mounting groove (13), and one end of the heat dissipation fin (12) is in contact with the heat conducting plate (15). 3. A backlight module according to claim 1, characterized in that: the locking assembly includes a locking groove (18) opened at one end of the lower frame (1), the bottom of the buckle (14) is slidably connected to the inside of the locking groove (18), one end of the lower frame (1) is rotatably connected to a bolt (19), one end of the bolt (19) passes through the lower frame (1) and extends to the inside of the locking groove (18), and the end of the bolt (19) extending to the inside of the locking groove (18) is threadedly connected to the buckle (14). 4. A backlight module according to claim 1, characterized in that: a light bar (20) is fixedly connected inside one of the component mounting grooves (13), a conductive ring sheet (21) is fixedly connected to the inner side of the lower frame (1), an insulating ring sheet (23) is fixedly connected to the inner side of the conductive ring sheet (21), an active material ring sheet (24) is fixedly connected inside the insulating ring sheet (23), a mask sheet (22) is fixedly connected between the insulating ring sheet (23) and the conductive ring sheet (21), a plurality of conductive convex grooves (25) are provided at one end of the mask sheet (22), one end of the conductive convex groove (25) passes through the insulating ring sheet (23) and the active material ring sheet (24), and is connected to the conductive ring sheet (21), the mask sheet (22) is installed on one side of another component mounting groove (13), and a conductive carbon nanotube coating is provided on the inner side of the active material ring sheet (24). 5. A backlight module according to claim 4, characterized in that: an arc-shaped focusing plate (26) is fixedly connected to the interior of one of the component mounting grooves (13), and the arc-shaped focusing plate (26) is covered on a side of the light bar (20) away from the light guide plate (3). 6. The backlight module according to claim 1, characterized in that a circular inner corner (27) is formed on the top of the upper frame (9). 7. The backlight module according to claim 6, characterized in that a plurality of triangular reinforcement blocks (28) are symmetrically and evenly fixedly connected inside the annular inner corner (27). 8. A process for manufacturing a backlight module, characterized in that: the method is applicable to a backlight module as described in any one of claims 1 to 7, and the steps of the method are as follows: S1: firstly, a conductive ring sheet (21) is fixed on the inner side of the lower frame (1), and an insulating ring sheet (23) is fixed on the inner side of the conductive ring sheet (21), and then an active material ring sheet (24) is fixed on the inner side of the insulating ring sheet (23), and then a mask sheet (22) is arranged between the conductive ring sheet (21) and the insulating ring sheet (23), and a conductive convex groove (25) arranged on the surface of the mask sheet (22) is used to pass through the insulating ring sheet (23) and the active material ring sheet (24), and at the same time, the inner side of the conductive ring sheet (21) is connected to expose a part of the conductive ring sheet (21), and the active material ring sheet (24) is formed into an active component; and a conductive carbon nanotube coating is arranged on the active material ring sheet (24); S2: Then, the reflector (2), the light guide plate (3), the lower diffuser (4), the lower brightness enhancement sheet (5), the upper brightness enhancement sheet (6), and the upper diffuser (7) are sequentially fixed inside the lower frame (1), and the upper frame (9) is guided to be pressed relative to the lower frame (1), so that the lower frame (1) drives the buckle (14) to form a snap connection with the slot (10); S3: Then, by tightening the bolt (19), the buckle (14) is driven to drive the upper frame (9) to extrude the rubber sealing ring (11) along the length direction of the locking groove (18), and at the same time, the deformation of the rubber sealing ring (11) is used to fill the gap between the lower frame (1) and the upper frame (9), and at the same time, the upper frame (9) drives the heat dissipation fins (12) and the heat conducting plate (15) to form a fit.