CN118248611A - Wafer positioning correction device for wafer transfer - Google Patents
Wafer positioning correction device for wafer transfer Download PDFInfo
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- CN118248611A CN118248611A CN202410352396.XA CN202410352396A CN118248611A CN 118248611 A CN118248611 A CN 118248611A CN 202410352396 A CN202410352396 A CN 202410352396A CN 118248611 A CN118248611 A CN 118248611A
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- 210000000078 claw Anatomy 0.000 claims description 9
- 230000007723 transport mechanism Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 217
- 239000000758 substrate Substances 0.000 description 49
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
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- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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Abstract
The invention discloses a wafer positioning and correcting device for wafer transfer, which belongs to the technical field of semiconductor equipment and comprises a device base and a transmission mechanism, wherein a positioning mark area, a wafer transfer area and a wafer correcting area are sequentially arranged at the top of the device base; the invention improves the stability of the performance of the semiconductor element by correcting the accuracy of the wafer position after transfer.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a wafer positioning correction device for wafer transfer.
Background
Wafer transfer is a key step in semiconductor manufacturing and other microelectronic fields, the quality and performance of semiconductor devices are ensured through accurate and efficient wafer transfer, along with the increasing demand of the market for semiconductor products, the requirements on wafer transfer technology are higher and higher, the position accuracy after wafer transfer has a larger influence on the subsequent steps of etching, packaging and the like, if the position deviation of the wafer after wafer transfer is larger, the problems of performance degradation and the like of packaged semiconductor elements can be caused, at present, the factors such as stability, electrostatic effect, vibration and the like of wafer adsorption influence the precision of the wafer position, so that the position of the wafer after wafer fixing deviates from the set position, and the quality and performance of the semiconductor elements are reduced, but the factors are difficult to avoid in the operation process of wafer transfer equipment, so that the position of the wafer is required to be corrected before the wafer is fixed, and the wafer is accurately fixed at the set position after the wafer is fixed.
Disclosure of Invention
Aiming at the technical defects in the background technology, the invention provides a wafer positioning correction device for wafer transfer, which solves the technical problems and meets the actual requirements, and the specific technical scheme is as follows:
The wafer positioning correction device for wafer transfer comprises a device base and a transmission mechanism, wherein a positioning mark area, a wafer transfer area and a wafer correction area are sequentially arranged at the top of the device base, the transmission mechanism extends from one end of the positioning mark area to one end of the wafer correction area through the wafer transfer area, and the transmission mechanism consists of two adjacent conveyor belts, and a working space is formed between the two conveyor belts;
The positioning mark area is characterized in that one end of the positioning mark area in the length direction is provided with a first linear driving mechanism extending along the width direction, the first linear driving mechanism is provided with a second linear driving mechanism and a third linear driving mechanism extending along the extending direction of the transmission mechanism, one side of the second linear driving mechanism is provided with a first tracking mechanism, one side of the third linear driving mechanism is provided with a marking mechanism, and the first tracking mechanism and the marking mechanism are mutually matched and are respectively positioned above and below the transmission mechanism;
a fourth linear driving mechanism extending along the width direction is arranged at one end of the wafer transfer area in the length direction, a wafer transfer mechanism is arranged at one side of the fourth linear driving mechanism, a wafer supply mechanism is arranged below the wafer transfer mechanism, and the wafer transfer mechanism and the wafer supply mechanism are respectively positioned above and below the transmission mechanism;
The wafer correction area is far away from the wafer transfer area one end and is equipped with fifth sharp actuating mechanism and sixth sharp actuating mechanism, the extending direction of fifth sharp actuating mechanism and sixth sharp actuating mechanism all is perpendicular with transmission mechanism's extending direction, fifth sharp actuating mechanism one side is equipped with wafer correction mechanism, sixth sharp actuating mechanism one side is equipped with the second and tracks the mechanism, wafer correction mechanism and second track the mechanism and be located transmission mechanism's top and below respectively.
As a further technical scheme of the invention, the first linear driving mechanism comprises a first portal frame, the bottom of the first portal frame is fixedly connected with the device base, two first linear guide rails which are parallel to each other are arranged on one side of the first portal frame, a first driving frame is arranged on the first linear guide rails, and the two first driving frames are respectively fixedly connected with the second linear driving mechanism and the third linear driving mechanism.
As a further technical scheme of the invention, the second linear driving mechanism consists of a second linear guide rail and a second driving frame erected on the second linear guide rail, the second driving frame is fixedly connected with the first tracking mechanism, and the first tracking mechanism faces downwards vertically.
As a further technical scheme of the invention, the third linear driving mechanism consists of a third linear guide rail and a third driving frame erected on the third linear guide rail, the third driving frame is fixedly connected with the marking mechanism, and the marking mechanism faces vertically upwards.
As a further technical scheme of the invention, the fourth linear driving mechanism comprises a second portal frame, the bottom of which is fixedly connected with the device base, a fourth linear guide rail is arranged on one side of the second portal frame, and a fourth driving frame is arranged on the fourth linear guide rail.
As a further technical scheme of the invention, the wafer transfer mechanism comprises a first movable push rod, wherein the first movable push rod comprises a first fixed end fixedly connected with a fourth center driving mechanism and a first movable end vertically and reciprocally moving at the bottom of the first fixed end, and a wafer adsorption head is arranged at the bottom of the first movable end.
As a further technical scheme of the invention, the crystal feeding mechanism comprises a crystal feeding platform, wherein a first sliding block is arranged at the bottom of the crystal feeding platform, a first sliding rail is arranged at the bottom of the first sliding block, a second sliding block is arranged at the bottom of the first sliding rail, a second sliding rail is arranged at the bottom of the second sliding block, the second sliding rail is mutually perpendicular to the extending direction of the first sliding rail, and a wafer fixing seat fixedly connected with a device base is arranged at the bottom of the second sliding rail.
As a further technical scheme of the invention, one end of the wafer correction area, which is close to the wafer transfer area, is provided with a visual identification mechanism, the visual identification mechanism is positioned above the transmission mechanism and is obliquely oriented to the working space, and the bottom of the visual identification mechanism is provided with a third portal frame fixedly connected with the device base.
As a further technical scheme of the invention, the two ends of the fifth linear driving mechanism and the two ends of the sixth linear driving mechanism are jointly provided with a fourth portal frame, the fifth linear driving mechanism consists of a fifth linear guide rail and a fifth driving frame erected on the fifth linear guide rail, and the fifth driving frame is fixedly connected with the wafer correction mechanism; the sixth linear driving mechanism consists of a sixth linear guide rail and a sixth driving frame erected on the sixth linear guide rail, the sixth driving frame is fixedly connected with the second tracking mechanism, and the second tracking mechanism faces upwards vertically.
As a further technical scheme of the invention, the wafer correction mechanism comprises a second movable push rod, wherein the second movable push rod comprises a second fixed end fixedly connected with a fifth linear driving mechanism and a second movable end vertically reciprocating at the bottom of the second fixed end, a wafer correction clamp is arranged at the bottom of the second movable end, at least 4 correction claws are arranged on the wafer correction clamp, and a correction plate is arranged at the end part of the correction claw.
The invention has the beneficial effects that:
According to the invention, the first tracking mechanism and the marking mechanism accurately etch a reference mark on the back of the substrate, the position of the reference mark is matched with the position of the front of the substrate for transferring the wafer, the wafer transferring mechanism can accurately transfer the wafer to the front of the substrate according to the reference mark, meanwhile, the second tracking mechanism can accurately correct the wafer with deviation generated in the position according to the reference mark and is matched with the wafer correcting mechanism, the reference mark on the back of the substrate is used for positioning in the wafer transferring and correcting process, the positioning precision is prevented from being influenced by the shielding of the wafer transferring mechanism or the wafer correcting mechanism, the precision of the position of the wafer is improved, and the stability of the performance of the semiconductor element is ensured.
Drawings
Fig. 1 is a schematic diagram of a structure of a wafer positioning correction apparatus for wafer transfer.
Fig. 2 is a schematic structural view of a transfer mechanism of a wafer positioning correction device for wafer transfer.
Fig. 3 is a schematic view of the structure of a positioning mark region of a wafer positioning correction device for wafer transfer.
Fig. 4 is a schematic view of the structure of a wafer transfer area of a wafer positioning correction device for wafer transfer.
Fig. 5 is a schematic view of the structure of a wafer correction area of a wafer positioning correction device for wafer transfer.
Fig. 6 is a schematic diagram at a in fig. 5.
Wherein: the apparatus includes a device base 1, a transfer mechanism 2, a conveyor 21, a work space 22, a positioning mark section 3, a first linear driving mechanism 31, a first gantry 311, a first linear guide 312, a first driving carriage 313, a second linear driving mechanism 32, a second linear guide 321, a second driving carriage 322, a third linear driving mechanism 33, a third linear guide 331, a third driving carriage 332, a first tracking mechanism 34, a mark mechanism 35, a wafer transfer section 4, a fourth linear driving mechanism 41, a second gantry 411, a fourth linear guide 412, a fourth driving carriage 413, a wafer transfer mechanism 42, a first movable push rod 421, a wafer chuck 422, a wafer supply mechanism 43, a wafer stage 431, a first slider 432, a first slide 433, a second slider 434, a second slide 435, a wafer holder 436, a wafer correction section 5, a visual recognition mechanism 51, a fifth linear driving mechanism 52, a fifth linear guide 521, a fifth driving carriage 522, a sixth linear driving mechanism 53, a sixth linear guide 531, a sixth driving carriage 532, a wafer correction mechanism 54, a second push rod 521, a second movable push rod 421, a wafer chuck 542, a fourth slide 541, a fourth slide 57, and a fourth gantry 541.
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings and examples, but the embodiments of the present invention are not limited to the following examples, and the present invention relates to the relevant essential parts in the art, and should be regarded as known and understood by those skilled in the art.
As shown in fig. 1-6, a wafer positioning and correcting device for wafer transfer comprises a device base 1 and a transmission mechanism 2, wherein a positioning mark area 3, a wafer transfer area 4 and a wafer correcting area 5 are sequentially arranged at the top of the device base 1, the transmission mechanism 2 extends from one end of the positioning mark area 3 to one end of the wafer correcting area 5 through the wafer transfer area 4, the transmission mechanism 2 consists of two adjacent conveyor belts 21, and a working space 22 is formed between the two conveyor belts 21;
One end of the positioning mark area 3 in the length direction is provided with a first linear driving mechanism 31 extending along the width direction, the first linear driving mechanism 31 is provided with a second linear driving mechanism 32 and a third linear driving mechanism 33 extending along the extending direction of the transmission mechanism 2, one side of the second linear driving mechanism 32 is provided with a first tracking mechanism 34, one side of the third linear driving mechanism 33 is provided with a marking mechanism 35, and the first tracking mechanism 34 and the marking mechanism 35 are matched with each other and are respectively positioned above and below the transmission mechanism 2;
A fourth linear driving mechanism 41 extending along the width direction is arranged at one end of the length direction of the wafer transfer area 4, a wafer transfer mechanism 42 is arranged at one side of the fourth linear driving mechanism 41, a wafer supply mechanism 43 is arranged below the wafer transfer mechanism 42, and the wafer transfer mechanism 42 and the wafer supply mechanism 43 are respectively positioned above and below the transmission mechanism 2; the wafer transfer mechanism 42 comprises a first movable push rod 421, wherein the first movable push rod 421 comprises a first fixed end fixedly connected with the fourth linear driving mechanism 41 and a first movable end vertically reciprocating at the bottom of the first fixed end, and a wafer adsorption head 422 is arranged at the bottom of the first movable end;
A fifth linear driving mechanism 52 and a sixth linear driving mechanism 53 are arranged at one end of the wafer correction area 5 far away from the wafer transfer area 4, the extending directions of the fifth linear driving mechanism 52 and the sixth linear driving mechanism 53 are perpendicular to the extending direction of the transmission mechanism 2, a wafer correction mechanism 54 is arranged at one side of the fifth linear driving mechanism 52, a second tracking mechanism 55 is arranged at one side of the sixth linear driving mechanism 53, and the wafer correction mechanism 54 and the second tracking mechanism 55 are respectively positioned above and below the transmission mechanism 2; the wafer correction mechanism 54 includes a structure in which a second movable push rod 541 is provided, the second movable push rod 541 includes a second fixed end fixedly connected to the fifth linear driving mechanism 52 and a second movable end vertically reciprocating at the bottom of the second fixed end, a wafer correction clamp 542 is provided at the bottom of the second movable end, the wafer correction clamp 542 is provided with at least 4 correction claws 543, and the correction plate 544 is provided at the end of the correction claw 543.
The invention is used for correcting the position of a wafer transferred onto a substrate, in the process of manufacturing a semiconductor, the wafer on the wafer is usually transferred onto the substrate, then the wafer is fixed on the substrate through a die bonding process, and the wafer is only placed on the surface of the substrate or is stuck on the surface of the substrate through an adhesive after being transferred onto the substrate, and the wafer cannot be accurately transferred to a set position due to factors such as stability of adsorption of the wafer, electrostatic effect, vibration, uniformity of adhesive coating and the like, so that a certain deviation is generated on the position of the wafer, and the problems that the connection between the wafer and a circuit is inaccurate, the connection between the wafer and other components is unstable, the packaging material cannot completely cover the wafer and the like can be generated, and the problems can lead to the performance reduction and even rejection of a semiconductor element.
The device base 1 of the present invention is used for fixing and providing supporting force for the transmission mechanism 2, the first linear driving mechanism 31, the fourth linear driving mechanism 41, the crystal feeding mechanism 43, the fifth linear driving mechanism 52, the sixth linear driving mechanism 53, etc.; the transmission mechanism 2 is connected with a power transmission line through a power transmission cable and operates under the drive of a driving device such as a driving motor, the transmission direction of the transmission mechanism 2 is from one point of the positioning mark area 3 to the wafer transfer area 4 and the wafer correction area 5, the transmission direction of the transmission mechanism 2 is set to be the length direction of the invention, the transmission mechanism 2 is used for transmitting a substrate fixed with a wafer, one end of the transmission mechanism 2 far away from the wafer correction area 5 is connected with equipment for carrying out pretreatment on the substrate outside, the substrate after the pretreatment is transmitted to the top surface of the transmission mechanism 2, the surface fixed with the wafer is set to be the front surface, and the transmission mechanism 2 transmits the substrate to the positioning mark area 3 in the front surface upwards; in addition, it should be noted that, the two sides of the transmission mechanism 2 are provided with a limiting structure for limiting the substrate, so as to avoid the deviation towards the width direction in the substrate transmission process, and thus the substrate is better tracked and positioned, the limiting structure is a technical means commonly used in the art, and a person skilled in the art can set according to the actual requirement.
The front surface of the substrate is provided with transfer marks at each position for transferring the wafer, the transfer marks are usually grooves matched with the wafer, wire frames matched with the edge outline of the wafer, and the like, namely the transferred wafer needs to be matched with the transfer marks, otherwise, the position of the wafer is represented to generate deviation; the first tracking mechanism 34 preferably employs a laser profiler that can generate a three-dimensional profile of the surface of the object by emitting a laser beam and measuring the change in reflected light, capturing the profile of the transfer marks to achieve tracking positioning, thereby positioning each transfer mark on the surface of the substrate; the marking mechanism 35 preferably adopts a laser etching machine, when the first tracking mechanism 34 positions the transfer mark, a horizontal positioning coordinate is generated according to the center of the transfer mark, the marking mechanism 35 etches a reference mark on the back surface of the substrate through laser according to the horizontal positioning coordinate, the positioning mark operation of the substrate is completed, and when the transfer mark is blocked by a wafer or other equipment, the reference mark can be positioned and the horizontal positioning coordinate is generated, so that the position of the positioning wafer or the transfer mark is tracked.
Further, the first linear driving mechanism 31 translates the second linear driving mechanism 32 and the third linear driving mechanism 33 along the width direction, and the second linear driving mechanism 32 and the third linear driving mechanism 33 translate the first tracking mechanism 34 and the marking mechanism 35 along the length direction respectively, so that the first tracking mechanism 34 and the marking mechanism 35 can translate along the length direction and the width direction, the first tracking mechanism 34 can track and position the transfer mark on the front surface of the substrate, meanwhile, the transmission mechanism 2 is composed of two adjacent conveyor belts 21, a working space 22 is formed between the two conveyor belts 21, and the marking mechanism 35 can reference the mark on the back surface of the substrate in the working space 22 through laser etching.
After etching the reference mark on the back of the substrate, the substrate is continuously transferred to the wafer transfer area 4 by the transfer mechanism 2, the wafer transfer mechanism 42 is composed of a first movable push rod 421 and a wafer adsorption head 422, the first movable push rod 421 is preferably an electric push rod, the first movable push rod 421 enables the wafer adsorption head 422 to reciprocate along the vertical direction through a first movable end, the wafer adsorption head 422 is connected with an external vacuum pump, a vacuum chuck is arranged at the bottom end, and air in the vacuum chuck is pumped by the vacuum pump to form negative pressure, so that the wafer adsorption head 422 can firmly adsorb wafers; the wafer supplying mechanism 43 is used for fixing the wafer after the wafer expansion, and the fourth linear driving mechanism 41 enables the wafer transferring mechanism 42 to translate along the width direction, and is matched with the first movable push rod 421, so that the wafer adsorbing head 422 can adsorb and place the wafer on the transferring mark on the front surface of the substrate.
It should be noted that, the first tracking mechanism 34, that is, the laser profiler, may be disposed in the wafer transferring area 4 to position the transferring mark, so that the wafer transferring mechanism 42 may accurately transfer the wafer onto the transferring surface on the front side of the substrate, but the tracking of the transferring mark by the laser profiler may be blocked during the movement of the wafer transferring mechanism 42, so that the deviation of the transferring position of the wafer may be caused.
After the wafer is transferred to the front side of the substrate, the substrate is transferred to the wafer correction area 5 by the transfer mechanism 2, the second tracking mechanism 55 preferably adopts a laser profiler, the wafer correction mechanism 54 and the second tracking mechanism 55 are driven by the fifth linear driving mechanism 52 and the sixth linear driving mechanism 53 to synchronously move respectively, the horizontal coordinates of tracking positioning performed by the second tracking mechanism 55 are always the same as the horizontal coordinates of the centers between the 4 correction claws 543 in the wafer correction mechanism 54, after the substrate is transferred to the wafer correction area 5, the reference mark on the back side of the substrate is positioned by the second tracking mechanism 55, the second movable push rod 541 preferably adopts an electric push rod, the second movable push rod 541 enables the wafer correction clamp 542 to move downwards to the wafer correction clamp 542 to be close to the front side of the substrate to be abutted by the second movable end, at this time, the correction plates 543 at the end parts of the 4 correction claws 544 are respectively positioned around the wafer, the horizontal centers between the 4 correction plates 544 are overlapped with the horizontal centers of the reference mark, then the wafer correction clamp 542 is operated to make the 4 correction claws and the correction plates 544 to be centered, if the wafer is shifted in the transfer process, the wafer correction plate is shifted to the wafer correction mark near the center, and the wafer correction mark near the wafer center is completed, and the wafer correction mark near the wafer center is shifted to the wafer transfer position, and wafer correction wafer is completed.
According to the invention, the first tracking mechanism 34 and the marking mechanism 35 are used for precisely etching a reference mark on the back surface of the substrate, the position of the reference mark is matched with the position of the front surface of the substrate for transferring wafers, the wafer transferring mechanism 42 can precisely transfer the wafers to the front surface of the substrate according to the reference mark, meanwhile, the second tracking mechanism 55 can precisely correct the wafers with deviation according to the reference mark and matched with the wafer correcting mechanism 54, the wafers are positioned through the reference mark on the back surface of the substrate in the transferring and correcting process, the positioning accuracy is prevented from being influenced by shielding of the wafer transferring mechanism 42 or the wafer correcting mechanism 54, the wafers can be precisely fixed at the set position after being subjected to die bonding in the subsequent process, and the wafers can be well connected with other components and packaged in the subsequent process, so that the stability of the performance of the semiconductor element is ensured.
As shown in fig. 3, as one of the preferred embodiments of the present invention, the first linear driving mechanism 31 includes a first gantry 311 having a bottom fixedly connected to the device base1, two first linear guide rails 312 parallel to each other are provided on one side of the first gantry 311, a first driving frame 313 is mounted on the first linear guide rails 312, and the two first driving frames 313 are fixedly connected to the second linear driving mechanism 32 and the third linear driving mechanism 33, respectively.
The first linear driving mechanism 31 is fixed to the apparatus base 1 by the first portal frame 311, and the first driving carriage 313 moves along the first linear guide rail 312 by driving the pulley to rotate by the driving motor, so that the second linear driving mechanism 32 and the third linear driving mechanism 33 move in the direction in which the first linear guide rail 312 extends, that is, in the width direction.
Further, the present invention preferably provides two first linear driving mechanisms 31, wherein the two first linear driving mechanisms 31 are respectively located at two ends of the positioning mark area 3 in the length direction, and the two first linear driving mechanisms 31 are respectively fixed at two ends of the second linear driving mechanism 32 and two ends of the third linear driving mechanism 33 through 4 first driving frames 313, so that the second linear driving mechanism 32 and the third linear driving mechanism 33 can move smoothly.
As shown in fig. 3, as one of the preferred embodiments of the present invention, the second linear driving mechanism 32 is composed of a second linear guide 321 and a second driving frame 322 mounted on the second linear guide 321, the second driving frame 322 is fixedly connected to the first tracking mechanism 34, and the first tracking mechanism 34 is vertically oriented downward.
The second linear driving mechanism 32 moves along the width direction integrally through a group of first driving frames 313 in the first linear driving mechanism 31, the second driving frames 322 move along the second linear guide rail 321 in a manner of driving pulleys to rotate through a driving motor, so that the first tracking mechanism 34 moves along the length direction, the first tracking mechanism 34 can move along the length and width directions through the cooperation of the first linear driving mechanism 31 and the second linear driving mechanism 32, and the first tracking mechanism 34 faces downwards vertically, so that the transfer marks on the front surface of the substrate can be tracked and positioned.
As shown in fig. 3, as one of the preferred embodiments of the present invention, the third linear driving mechanism 33 is composed of a third linear guide 331 and a third driving frame 332 mounted on the third linear guide 331, the third driving frame 332 is fixedly connected with the marking mechanism 35, and the marking mechanism 35 is vertically oriented upward.
The third linear driving mechanism 33 moves along the width direction through a group of first driving frames 313 in the first linear driving mechanism 31 as a whole, the third driving frames 332 move along the third linear guide rail 331 in a manner of driving pulleys to rotate through a driving motor, so that the marking mechanism 35 moves along the length direction, the marking mechanism 35 can move along the length and width direction through the cooperation of the first linear driving mechanism 31 and the third linear driving mechanism 33, and the marking mechanism 35 can cooperate with the first tracking mechanism 34 to reference the back surface of the substrate in the working space 22 through laser etching.
As shown in fig. 4, as one of the preferred embodiments of the present invention, the fourth linear driving mechanism 41 includes a second portal frame 411 having a bottom fixedly connected to the apparatus base 1, a fourth linear guide 412 provided on one side of the second portal frame 411, and a fourth driving carriage 413 provided on the fourth linear guide 412.
The fourth linear driving mechanism 41 is fixed on the device base 1 through the second portal frame 411, the fourth driving carriage 413 moves along the fourth linear guide rail 412 in a manner of driving the pulley to rotate through the driving motor, namely moves along the width direction, the fourth driving carriage 413 is fixedly connected with the wafer transferring mechanism 42, the fourth linear driving mechanism 41 can enable the wafer transferring mechanism 42 to move between the upper side of the substrate and the wafer supplying mechanism 43, and meanwhile, the wafer adsorbing head 422 can enable the wafer on the wafer supplying mechanism 43 to be transferred to the front side of the substrate through the cooperation of the first movable push rod 421.
As shown in fig. 4, as one of the preferred embodiments of the present invention, the wafer supply mechanism 43 includes a wafer supply platform 431, a first slide block 432 is disposed at the bottom of the wafer supply platform 431, a first slide rail 433 is disposed at the bottom of the first slide block 432, a second slide block 434 is disposed at the bottom of the first slide rail 433, a second slide rail 435 is disposed at the bottom of the second slide block 434, the extending directions of the second slide rail 435 and the first slide rail 433 are mutually perpendicular, and a wafer fixing seat 436 fixedly connected with the device base 1 is disposed at the bottom of the second slide rail 435.
The wafer feeding mechanism 43 of the present invention is fixed on the device base 1 through the wafer fixing seat 436, the wafer feeding platform 431 is used for fixing the wafer after the wafer is expanded, the first sliding rail 433 and the second sliding rail 435 preferably adopt high-precision linear sliding rails to realize high-precision sliding, the wafer feeding platform 431 can move in the width and length directions respectively through the matching of the first sliding block 432 and the first sliding rail 433 and the matching of the second sliding block 434 and the second sliding rail 435 in the wafer feeding mechanism 43, and the wafer feeding platform 431 adjusts the positions of the wafers through movement, so that the wafer transferring mechanism 42 can transfer each wafer in the wafer to the front surface of the substrate respectively.
As shown in fig. 5, as one of the preferred embodiments of the present invention, the wafer correction zone 5 is provided with a visual recognition mechanism 51 at one end near the wafer transfer zone 4, the visual recognition mechanism 51 is located above the conveying mechanism 2 and is inclined toward the working space 22, and a third portal frame 56 fixedly connected with the apparatus base 1 is provided at the bottom of the visual recognition mechanism 51.
The visual recognition mechanism 51 is fixed on the device base 1 through the third portal frame 56, the visual recognition mechanism 51 is composed of a high-speed camera and a machine vision system matched with the high-speed camera, the substrate is transmitted into the wafer correction area 5 through the transmission mechanism 2, the visual recognition mechanism 51 recognizes the position of each wafer in the front of the substrate through capturing the front image of the substrate, the position of each wafer is compared with the position of the edge of the substrate or other reference points, the position of the wafer in the substrate is known, the image of the wafer which needs to be fixed on the substrate is used as a reference image in advance and is loaded into the machine vision system, the machine vision system judges whether the position of the wafer is deviated or not through comparing the image of the front of the current substrate with the reference image, then the position of the wafer with the deviation is transmitted into the wafer correction mechanism 54, and the wafer correction mechanism 54 can correct only the wafer with the deviation, and the correction efficiency of the wafer correction mechanism 54 is improved.
As shown in fig. 5, as one of the preferred embodiments of the present invention, the fourth portal frame 57 is provided at both ends of the fifth linear driving mechanism 52 and both ends of the sixth linear driving mechanism 53 together, the fifth linear driving mechanism 52 is composed of a fifth linear rail 521 and a fifth driving frame 522 mounted on the fifth linear rail 521, and the fifth driving frame 522 is fixedly connected to the wafer alignment mechanism 54; the sixth linear driving mechanism 53 is composed of a sixth linear guide 531 and a sixth driving carriage 532 mounted on the sixth linear guide 531, the sixth driving carriage 532 is fixedly connected to the second tracking mechanism 55, and the second tracking mechanism 55 is vertically oriented upward.
The fifth linear driving mechanism 52 and the sixth linear driving mechanism 53 are fixed on the apparatus base 1 through the fourth portal frame 57, and the fifth driving carriage 522 moves along the fifth linear rail 521 by driving the pulley to rotate through the driving motor, so that the wafer correction mechanism 54 moves in the direction in which the fifth linear rail 521 extends, that is, in the width direction; the sixth driving carriage 532 moves along the sixth linear guide 531 by driving the pulley to rotate by the driving motor, so that the second tracking mechanism 55 moves in the direction in which the sixth linear guide 531 extends, that is, in the width direction; by moving the wafer correction mechanism 54 and the second tracking mechanism 55 in the width direction, the wafer correction mechanism 54 can perform position correction on wafers at different positions on the substrate.
Further, since the principle of operation of each mechanism in the wafer correction zone 5 is: when the second tracking mechanism 55 recognizes the reference mark, the transmission mechanism 2 is controlled to stop running, and the wafer correction mechanism 54 continues to run after finishing the position correction of the wafer; then, a linear driving mechanism may be disposed between the wafer alignment mechanism 54 and the fifth driving carriage 522 and between the second tracking mechanism 55 and the sixth driving carriage 532, so that the wafer alignment mechanism 54 and the second tracking mechanism 55 may both move along the length direction, and when the wafer transfer mechanism 42 transfers the wafer and the transfer mechanism 2 is suspended, the second tracking mechanism 55 may actively track and position the reference mark, thereby enabling the wafer transfer and the wafer position alignment to be performed simultaneously, without the need of suspending the transfer mechanism 2 for multiple times, and improving the working efficiency of the present invention.
In the present invention, the first linear driving mechanism 31, the second linear driving mechanism 32, the third linear driving mechanism 33, the first tracking mechanism 34, the marking mechanism 35, the fourth linear driving mechanism 41, the wafer transfer mechanism 42, the wafer supply mechanism 43, the visual recognition mechanism 51, the fifth linear driving mechanism 52, the sixth linear driving mechanism 53, the wafer correction mechanism 54, and the second tracking mechanism 55 are all connected to an external power transmission line via power cables and supply electric power necessary for their respective operations.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The wafer positioning correction device for wafer transfer comprises a device base (1) and a transmission mechanism (2), and is characterized in that a positioning mark area (3), a wafer transfer area (4) and a wafer correction area (5) are sequentially arranged at the top of the device base (1), the transmission mechanism (2) extends from one end of the positioning mark area (3) to one end of the wafer correction area (5) through the wafer transfer area (4), the transmission mechanism (2) consists of two adjacent conveyor belts (21), and a working space (22) is formed between the two conveyor belts (21);
A first linear driving mechanism (31) extending along the width direction is arranged at one end of the positioning marking area (3), a second linear driving mechanism (32) and a third linear driving mechanism (33) extending along the extending direction of the transmission mechanism (2) are arranged on the first linear driving mechanism (31), a first tracking mechanism (34) is arranged on one side of the second linear driving mechanism (32), a marking mechanism (35) is arranged on one side of the third linear driving mechanism (33), and the first tracking mechanism (34) and the marking mechanism (35) are mutually matched and are respectively positioned above and below the transmission mechanism (2);
A fourth linear driving mechanism (41) extending along the width direction is arranged at one end of the wafer transfer area (4) in the length direction, a wafer transfer mechanism (42) is arranged at one side of the fourth linear driving mechanism (41), a wafer supply mechanism (43) is arranged below the wafer transfer mechanism (42), and the wafer transfer mechanism (42) and the wafer supply mechanism (43) are respectively positioned above and below the transmission mechanism (2);
The wafer correction area (5) is far away from wafer transfer area (4) one end and is equipped with fifth sharp actuating mechanism (52) and sixth sharp actuating mechanism (53), the extending direction of fifth sharp actuating mechanism (52) and sixth sharp actuating mechanism (53) is all perpendicular with the extending direction of transport mechanism (2), fifth sharp actuating mechanism (52) one side is equipped with wafer correction mechanism (54), sixth sharp actuating mechanism (53) one side is equipped with second and tracks mechanism (55), wafer correction mechanism (54) and second track mechanism (55) are located the top and the below of transport mechanism (2) respectively.
2. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the first linear driving mechanism (31) comprises a first portal frame (311) with the bottom fixedly connected with the device base (1), two first linear guide rails (312) parallel to each other are arranged on one side of the first portal frame (311), a first driving frame (313) is erected on the first linear guide rails (312), and the two first driving frames (313) are fixedly connected with the second linear driving mechanism (32) and the third linear driving mechanism (33) respectively.
3. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the second linear driving mechanism (32) consists of a second linear guide rail (321) and a second driving carriage (322) erected on the second linear guide rail (321), the second driving carriage (322) is fixedly connected with the first tracking mechanism (34), and the first tracking mechanism (34) is vertically oriented downward.
4. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the third linear driving mechanism (33) consists of a third linear guide rail (331) and a third driving carriage (332) erected on the third linear guide rail (331), the third driving carriage (332) is fixedly connected with a marking mechanism (35), and the marking mechanism (35) is vertically oriented upwards.
5. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the fourth linear driving mechanism (41) comprises a second portal frame (411) with the bottom fixedly connected with the device base (1), a fourth linear guide rail (412) is arranged on one side of the second portal frame (411), and a fourth driving frame (413) is erected on the fourth linear guide rail (412).
6. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the wafer transfer mechanism (42) comprises a first movable push rod (421), the first movable push rod (421) comprising a first fixed end fixedly connected with a fourth center drive mechanism (41) and a first movable end vertically reciprocating at the bottom of the first fixed end, the bottom of the first movable end being provided with a wafer suction head (422).
7. The wafer positioning correction device for wafer transfer according to claim 1, wherein the wafer supply mechanism (43) comprises a wafer supply platform (431), a first slide block (432) is arranged at the bottom of the wafer supply platform (431), a first slide rail (433) is arranged at the bottom of the first slide block (432), a second slide block (434) is arranged at the bottom of the first slide rail (433), a second slide rail (435) is arranged at the bottom of the second slide block (434), the extending directions of the second slide rail (435) and the first slide rail (433) are mutually perpendicular, and a wafer fixing seat (436) fixedly connected with the device base (1) is arranged at the bottom of the second slide rail (435).
8. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the wafer correction zone (5) is provided with a visual identification means (51) near one end of the wafer transfer zone (4), the visual identification means (51) being located above the transport means (2) and inclined towards the working space (22), the bottom of the visual identification means (51) being provided with a third portal frame (56) fixedly connected with the device base (1).
9. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that both ends of the fifth linear driving mechanism (52) and both ends of the sixth linear driving mechanism (53) are provided with a fourth portal frame (57) together, the fifth linear driving mechanism (52) is composed of a fifth linear guide rail (521) and a fifth driving frame (522) erected on the fifth linear guide rail (521), and the fifth driving frame (522) is fixedly connected with the wafer correction mechanism (54); the sixth linear driving mechanism (53) is composed of a sixth linear guide rail (531) and a sixth driving frame (532) erected on the sixth linear guide rail (531), the sixth driving frame (532) is fixedly connected with the second tracking mechanism (55), and the second tracking mechanism (55) is vertically upwards oriented.
10. Wafer positioning correction device for wafer transfer according to claim 1 characterized in that the wafer correction mechanism (54) comprises a second movable push rod (541) comprising a second fixed end fixedly connected with a fifth linear driving mechanism (52) and a second movable end vertically reciprocating at the bottom of the second fixed end, the bottom of the second movable end is provided with a wafer correction clamp (542), the wafer correction clamp (542) is provided with at least 4 correction claws (543), and the ends of the correction claws (543) are provided with correction plates (544).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410352396.XA CN118248611A (en) | 2024-03-26 | 2024-03-26 | Wafer positioning correction device for wafer transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410352396.XA CN118248611A (en) | 2024-03-26 | 2024-03-26 | Wafer positioning correction device for wafer transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118248611A true CN118248611A (en) | 2024-06-25 |
Family
ID=91559966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410352396.XA Withdrawn CN118248611A (en) | 2024-03-26 | 2024-03-26 | Wafer positioning correction device for wafer transfer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118248611A (en) |
-
2024
- 2024-03-26 CN CN202410352396.XA patent/CN118248611A/en not_active Withdrawn
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Application publication date: 20240625 |