CN118086852B - Bidirectional coating cathode mechanism, coating production line and bidirectional coating method - Google Patents
Bidirectional coating cathode mechanism, coating production line and bidirectional coating method Download PDFInfo
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- CN118086852B CN118086852B CN202410516531.XA CN202410516531A CN118086852B CN 118086852 B CN118086852 B CN 118086852B CN 202410516531 A CN202410516531 A CN 202410516531A CN 118086852 B CN118086852 B CN 118086852B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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Abstract
The invention discloses a bidirectional coating cathode mechanism, a coating production line and a bidirectional coating method, which comprise a target cylinder, wherein an isolation supporting mechanism is arranged in the target cylinder, a cooling shaft is arranged in the middle of the isolation supporting mechanism, one end of the cooling shaft is a cooling water inlet, and the other end of the cooling shaft is a cooling water outlet; the magnetic rod used for rotary magnetron sputtering is characterized in that magnets are respectively arranged in two directions to form two annular areas where electromagnetic fields are orthogonal, and magnetron sputtering is used for coating films in two directions simultaneously. For example, the coating can be carried out to the upper part and the lower part of the rotary target material, the productivity of the equipment can be doubled, and the collection rate of the target material is higher.
Description
Technical Field
The invention relates to the field of magnetron sputtering coating, in particular to a bidirectional coating cathode mechanism, a coating production line and a bidirectional coating method.
Background
Sputtering is a physical vapor deposition coating technology, and the principle is that gas molecules are ionized by an electric field in a vacuum environment to generate positive ions and electrons, and the positive ions bombard a target material at negative potential to bombard target material atoms to form a film layer. The magnetron sputtering is to form a magnetic field by adopting a permanent magnet behind a target, wherein the arrangement of the permanent magnet is usually N (or S pole) in the middle and S (or N pole) around, an annular horizontal magnetic field is formed on the surface of the target and is orthogonal to an electric field perpendicular to the surface of the target, and in the orthogonal area of the electromagnetic field, the movement of electrons is accelerated and decelerated by the electric field and deflected by the magnetic field and is restrained in the orthogonal area of the annular electromagnetic field to do spiral movement, so that the probability of ionization generated by collision of the electrons and other gas molecules is greatly increased, and the sputtering is enhanced. In general, magnetron sputtering coating of a rotary target is to form a circular orthogonal area of electromagnetic fields by arranging a magnetic rod providing a magnetic field at the center of the rotary target, sputtering mainly occurs to the side, and coating is performed in the direction, but for products needing bidirectional coating, the product needs to enter a coating device twice to complete bidirectional coating operation, so that coating efficiency is low and labor cost is high.
Disclosure of Invention
The technical problem solved by the invention is to provide a bi-directional coating cathode mechanism capable of realizing bi-directional coating.
The technical scheme adopted for solving the technical problems is as follows: the bidirectional film plating cathode mechanism comprises a target cylinder, wherein an isolation supporting mechanism is arranged in the target cylinder, a cooling shaft is arranged in the middle of the isolation supporting mechanism, one end of the cooling shaft is a cooling water inlet, and the other end of the cooling shaft is a cooling water outlet; the two sides of the isolation supporting mechanism are symmetrically provided with a first magnet array assembly and a second magnet array assembly respectively, and one side of the target cylinder is provided with a rotary driving mechanism for driving the target cylinder to do rotary motion.
Further is: the first magnet array assembly comprises a first middle magnet and first side magnets positioned at two sides of the first middle magnet, and the polarities of the first middle magnet and the first side magnets are opposite; the second magnet array assembly comprises a second middle magnet and second side magnets positioned on two sides of the second middle magnet, and the polarities of the second middle magnet and the second side magnets are opposite, so that a horizontal magnetic field can be formed on the surface of the target cylinder.
The invention also discloses a coating production line, which adopts the bidirectional coating cathode mechanism and comprises a feeding cavity, a coating cavity and a discharging cavity which are sequentially connected from left to right, wherein an upper layer transmission roller and a lower layer transmission roller for transmitting a substrate carrier are arranged in the feeding cavity, the coating cavity and the discharging cavity, and a plurality of first bidirectional coating cathode mechanisms are arranged between the upper layer transmission roller and the lower layer transmission roller (18) of the coating cavity.
The invention also discloses a coating production line, which adopts the bidirectional coating cathode mechanism, and comprises a feeding cavity, a coating cavity and a discharging cavity which are sequentially connected from left to right, wherein an upper layer transmission roller and a lower layer transmission roller for transmitting a substrate carrier are arranged in the feeding cavity, the coating cavity and the discharging cavity, a plurality of first bidirectional coating cathode mechanisms are arranged between the upper layer transmission roller and the lower layer transmission roller which are close to one side of the feeding cavity, a plurality of second bidirectional coating cathode mechanisms are arranged between the upper layer transmission roller and the lower layer transmission roller which are close to one side of the discharging cavity, and a carrier lifting transposition mechanism for transmitting the substrate carrier on the upper layer transmission roller to the lower layer transmission roller and transmitting the substrate carrier on the lower layer transmission roller to the upper layer transmission roller is arranged between the first bidirectional coating cathode mechanisms and the second bidirectional coating cathode mechanisms.
Further is: the carrier lifting transposition mechanism comprises a plurality of upper layer translation structures and a plurality of lower layer translation structures with the same structure, and also comprises a swing arm structure for shifting a substrate carrier on the upper layer translation structure to the lower layer translation structure or for shifting the substrate carrier on the lower layer translation structure to the upper layer translation structure;
the coating cavity comprises two side cavity walls which are oppositely arranged, and the plurality of upper layer translation structures and the plurality of lower layer translation structures are oppositely arranged on the side cavity walls;
The upper layer translation structure comprises a first rotary driving shaft arranged on a side cavity wall, a rotary driving mechanism used for driving the first rotary driving shaft to do rotary motion is arranged on the outer side of the side cavity wall, a horizontal groove is formed in the end portion of the first rotary driving shaft, the upper layer translation structure further comprises a carrier plate driving roller, a moving rod is arranged at one end of the carrier plate driving roller, the moving rod stretches into the horizontal groove in a clamping mode and can horizontally move in the horizontal groove, the moving rod can follow the first rotary driving shaft to do rotary motion, the upper layer translation structure further comprises a sliding sleeve, the sliding sleeve is sleeved on the first rotary driving shaft and is in sliding connection with the first rotary driving shaft, one end of the sliding sleeve, extending out of the first rotary driving shaft, is in rotary connection with the carrier plate driving roller through a bearing, a reciprocating motion shaft is arranged on one side of the first rotary driving shaft, the reciprocating motion shaft penetrates through the side cavity wall, a horizontal driving mechanism used for driving the opposite side cavity wall to do horizontal motion is arranged on the outer side of the side cavity wall, and the connecting rod is connected with the sliding sleeve.
Further is: one side of the sliding sleeve is provided with a carrier deviation correcting wheel for correcting the substrate carrier.
Further is: the swing arm structure comprises a second rotary driving shaft, a rotary driving mechanism used for driving the second rotary driving shaft to do rotary motion is arranged on the outer side of the side cavity wall, a swing arm is arranged at one end of the second rotary driving shaft, the swing arm and the second rotary driving shaft are vertically arranged, and a movable roller is arranged at one end, far away from the second rotary driving shaft, of the swing arm.
Further is: the substrate carrier comprises a carrier body, a through groove is formed in the middle of the carrier body, and concave structures facing the carrier plate driving rollers are arranged on two sides of the carrier body, so that the carrier plate driving rollers can be located in the concave structures.
Further is: the feeding cavity comprises a feeding chamber, a first buffer chamber and a first transition chamber which are sequentially arranged along the movement direction of the product, a first gate valve is arranged at the inlet of the feeding chamber, a second gate valve is arranged between the feeding chamber and the first buffer chamber, and a third gate valve is arranged between the first buffer chamber and the first transition chamber;
The discharging cavity comprises a second transition chamber, a second buffer chamber and a sheet discharging chamber which are sequentially arranged along the movement direction of the product, a fourth gate valve is arranged between the second transition chamber and the second buffer chamber, a fifth gate valve is arranged between the second buffer chamber and the sheet discharging chamber, and a sixth gate valve is arranged at the outlet end of the sheet discharging chamber.
The invention also discloses a bidirectional coating method, which adopts the coating production line and comprises the following steps:
S100: the first gate valve is opened, a plurality of products to be coated enter the film feeding chamber along with the carrier through the upper layer transmission roller and the lower layer transmission roller, the first gate valve is closed, the film feeding chamber is subjected to vacuumizing treatment, and the film feeding chamber is in a vacuumizing state;
S200: the second door valve is opened, a plurality of products to be coated enter the first buffer chamber along with the substrate carrier, the second door valve is closed, the first buffer chamber is vacuumized to reach higher vacuum degree, and meanwhile, the wafer inlet chamber is vacuumized;
s300: the third door valve is opened, a plurality of products to be coated enter the first transition chamber along with the substrate carrier, the third door valve is closed, and the first transition chamber is vacuumized;
S400: the method comprises the steps that a plurality of products to be coated enter a coating cavity along with a substrate carrier, a first bidirectional coating cathode mechanism performs sputtering coating on the lower surface of the products on an upper layer conveying roller, meanwhile, the first bidirectional coating cathode mechanism performs sputtering coating on the upper surface of the products on a lower layer conveying roller, then a carrier lifting transposition mechanism performs transposition on the products on the upper layer conveying roller and the products on the lower layer conveying roller, so that the products on the upper layer conveying roller move onto the lower layer conveying roller, the products on the lower layer conveying roller move onto the upper layer conveying roller, then a second bidirectional coating cathode mechanism performs sputtering coating on the lower surface of the products on the upper layer conveying roller, meanwhile, the second bidirectional coating cathode mechanism performs sputtering coating on the upper surface of the products on the lower layer conveying roller, and then the products to be coated enter a second transition chamber along with the substrate carrier;
s500: the fourth gate valve is opened, a plurality of products to be coated enter the second buffer chamber along with the substrate carrier, the fourth gate valve is closed, and the second buffer chamber is vacuumized;
s600: the fifth door valve is opened, a plurality of products to be coated enter the wafer discharging chamber along with the substrate carrier, the fifth door valve is closed, and the wafer discharging chamber is subjected to vacuum breaking treatment;
S700: and the sixth door valve is opened, a plurality of products to be coated move out of the wafer discharging chamber along with the carrier, then the sixth door valve is closed, the wafer discharging chamber is vacuumized, and the next products are waited to enter the wafer discharging chamber.
Further is: the product running speed in the first transition chamber is greater than the product running speed in the coating cavity, so that the product is in a continuous state in the coating cavity;
the product running speed in the second transition chamber is greater than the product running speed in the coating cavity, so that the product is changed from a continuous state to a separated state in the second transition chamber.
The beneficial effects of the invention are as follows: the technical scheme is that magnets are respectively arranged in two directions to form two annular areas where electromagnetic fields are orthogonal as magnetic rods for rotary magnetron sputtering, and the magnetron sputtering is used for coating films in two directions at the same time. For example, the device can simultaneously carry out coating to the upper part and the lower part of the rotary target, the productivity of the device can be doubled, the collection rate of the target is higher, and meanwhile, the device can carry out position exchange on products at the upper and lower positions after the first bidirectional coating cathode mechanism finishes bidirectional coating through the arrangement of the carrier lifting transposition mechanism, and the second bidirectional coating cathode mechanism carries out coating operation on the other surface of the products after position exchange, so that the efficiency of bidirectional coating of the products is greatly improved.
Drawings
Fig. 1 is a cross-sectional view of a bi-directional coated cathode mechanism according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a coating line according to an embodiment of the application.
FIG. 3 is a schematic diagram of a coating chamber of a coating line according to an embodiment of the present application.
Fig. 4 is a schematic structural diagram of an upper translation structure of a coating chamber of a coating line according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a swing arm structure of a coating chamber of a coating line according to an embodiment of the present application.
Marked in the figure as: the device comprises a target cylinder 1, an isolation supporting mechanism 2, a cooling shaft 3, a first magnet array assembly 4, a first middle magnet 401, a first side magnet 402, a second magnet array assembly 5, a film feeding chamber 7, a first buffer chamber 8, a first transition chamber 9, a first gate valve 10, a second gate valve 11, a third gate valve 12, a film coating chamber 13, a side cavity wall 1301, a second transition chamber 14, a second buffer chamber 15, a film discharging chamber 16, an upper layer transmission roller 17, a lower layer transmission roller 18, a first bi-directional film coating cathode mechanism 19, a second bi-directional film coating cathode mechanism 20, a carrier lifting transposition mechanism 21, an upper layer translation structure 22, a first rotary driving shaft 2201, a horizontal groove 2202, a carrier driving roller 2203, a moving rod 2204, a sliding sleeve 2205, a reciprocating shaft 2206, a connecting rod 2207, a deviation correcting wheel 2208, a lower layer translation structure 23, a swing arm structure 24, a second rotary driving shaft 1, a swing arm 2402, a moving roller 3, a substrate carrier 25, a through groove 2501, a concave structure 2, a fourth gate valve 25026, a sixth gate valve 28.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings.
As shown in fig. 1, the embodiment of the application discloses a bi-directional film plating cathode mechanism, which comprises a target cylinder 1, wherein an isolation supporting mechanism 2 is arranged in the target cylinder 1, a cooling shaft 3 is arranged in the middle of the isolation supporting mechanism 2, one end of the cooling shaft 3 is a cooling water inlet, and the other end of the cooling shaft 3 is a cooling water outlet; the two sides of the isolation supporting mechanism 2 are symmetrically provided with a first magnet array assembly 4 and a second magnet array assembly 5 respectively, and one side of the target cylinder 1 is provided with a rotary driving mechanism for driving the target cylinder 1 to do rotary motion.
It should be explained that the mechanism works in a vacuum electric field environment, and the working principle is as follows: the target cylinder 1 is bombarded by positive ions in the vacuum chamber, so that atoms on the target cylinder 1 are sputtered and migrate to a workpiece to form a coating, and the cathode sputtering coating is a mature process and is not repeated here.
Specifically, the first magnet array assembly 4 includes a first intermediate magnet 401 and first side magnets 402 located at two sides of the first intermediate magnet 401, where the polarities of the first intermediate magnet 401 and the first side magnets 402 are opposite; the second magnet array assembly 5 includes a second middle magnet and second side magnets positioned at both sides of the second middle magnet, and the polarities of the second middle magnet and the second side magnets are opposite, so that a horizontal magnetic field can be formed on the surface of the target cylinder 1.
When the structure works, a substrate to be coated is respectively positioned above and below the bi-directional coating cathode mechanism, when the coating operation is specifically carried out, the target cylinder 1 rotates, under the action of an electric field and a magnetic field, two annular orthogonal electromagnetic field areas are respectively formed on the upper side and the lower side of the bi-directional coating cathode mechanism, magnetron sputtering is used for simultaneously coating films in two directions, and cooling water is introduced into the cooling shaft 3 while the structure works, so that the bi-directional coating cathode mechanism is cooled.
The design of this structure can realize carrying out the coating operation to the top and the below of rotatory target simultaneously to make the productivity of equipment improve one time, two-way coating operation also reducible target's waste simultaneously, and the collection rate to the target is also higher.
The invention also discloses a coating production line, which adopts the bidirectional coating cathode mechanism and comprises a feeding cavity, a coating cavity and a discharging cavity which are sequentially connected from left to right, wherein an upper layer transmission roller and a lower layer transmission roller for transmitting a substrate carrier are arranged in the feeding cavity, the coating cavity and the discharging cavity, and a plurality of first bidirectional coating cathode mechanisms are arranged between the upper layer transmission roller and the lower layer transmission roller 18 of the coating cavity.
It should be explained that the surface of the product to be coated is downward and enters the coating cavity from the upper layer transmission roller, or the surface of the product to be coated is upward and enters the coating cavity from the lower layer transmission roller.
When the device specifically works, a product follows the substrate carrier, sequentially passes through the upper layer transmission roller and the lower layer transmission roller, enters the coating cavity for coating operation, and simultaneously carries out coating operation on the products on the upper side and the lower side through a plurality of first bidirectional coating cathode mechanisms.
The transmission line can realize the coating operation of two single-layer coating products at the same time, thereby greatly increasing the coating efficiency and doubling the productivity.
As shown in fig. 2, the invention also discloses a film plating production line, which adopts the bidirectional film plating cathode mechanism, and comprises a feeding cavity, a film plating cavity 13 and a discharging cavity which are sequentially connected from left to right, wherein an upper layer transmission roller 17 and a lower layer transmission roller 18 for transmitting a substrate carrier 25 are arranged in the feeding cavity, the film plating cavity 13 is provided with a plurality of first bidirectional film plating cathode mechanisms 19 between the upper layer transmission roller 17 and the lower layer transmission roller 18 which are close to one side of the feeding cavity, a plurality of second bidirectional film plating cathode mechanisms 20 are arranged between the upper layer transmission roller 17 and the lower layer transmission roller 18 which are close to one side of the discharging cavity, and a carrier lifting transposition mechanism 21 for transmitting the substrate carrier 25 on the upper layer transmission roller 17 to the lower layer transmission roller 18 and transmitting the substrate carrier 25 on the lower layer transmission roller 18 to the upper layer transmission roller 17 is arranged between the first bidirectional film plating cathode mechanisms and the second bidirectional film plating cathode mechanisms;
The feeding cavity comprises a feeding chamber 7, a first buffer chamber 8 and a first transition chamber 9 which are sequentially arranged along the movement direction of the product, a first gate valve 10 is arranged at the inlet of the feeding chamber 7, a second gate valve 11 is arranged between the feeding chamber 7 and the first buffer chamber 8, and a third gate valve 12 is arranged between the first buffer chamber 8 and the first transition chamber 9;
The discharging cavity comprises a second transition chamber 14, a second buffer chamber 15 and a sheet discharging chamber 16 which are sequentially arranged along the product moving direction, a fourth gate valve 26 is arranged between the second transition chamber 14 and the second buffer chamber 15, a fifth gate valve 27 is arranged between the second buffer chamber 15 and the sheet discharging chamber 16, and a sixth gate valve 28 is arranged at the outlet end of the sheet discharging chamber 16.
When the vacuum coating device specifically works, the first gate valve 10 is opened, a plurality of products to be coated enter the film feeding chamber 7 along with the substrate carrier, the first gate valve 10 is closed, the film feeding chamber 7 is subjected to vacuum pumping treatment, and the film feeding chamber 7 is in a vacuum pumping state; then, the second door valve 11 is opened, a plurality of products to be coated enter the first buffer chamber 8 along with the substrate carrier, the second door valve 11 is closed, the first buffer chamber 8 is vacuumized to reach higher vacuum degree, and meanwhile, the wafer feeding chamber 7 is vacuumized; then, the third gate valve 12 is opened, a plurality of products to be coated enter the first transition chamber 9 along with the substrate carrier, the third gate valve 12 is closed, and the first transition chamber 9 is vacuumized; then, a plurality of products to be coated enter the coating cavity 13 along with the substrate carrier, the first bidirectional coating cathode mechanism performs sputtering coating on the lower surface of the product on the upper layer transmission roller 17, meanwhile, the first bidirectional coating cathode mechanism performs sputtering coating on the upper surface of the product on the lower layer transmission roller 18, then the carrier lifting transposition mechanism 21 performs transposition on the product on the upper layer transmission roller 17 and the product on the lower layer transmission roller 18, so that the product on the upper layer transmission roller 17 moves onto the lower layer transmission roller 18, the product on the lower layer transmission roller 18 moves onto the upper layer transmission roller 17, then the second bidirectional coating cathode mechanism performs sputtering coating on the lower surface of the product on the upper layer transmission roller 17, meanwhile, the second bidirectional coating cathode mechanism performs sputtering coating on the upper surface of the product on the lower layer transmission roller 18, then the plurality of products to be coated enter the second transition chamber 14 along with the substrate carrier, then the fourth gate valve 26 is opened, the plurality of products to be coated enter the second buffer chamber 15 along with the product on the lower layer transmission roller 18, the fourth gate valve 26 is closed, and the second buffer chamber 15 performs vacuum pumping treatment on the substrate; then, the fifth gate valve 27 is opened, a plurality of products to be coated enter the wafer discharging chamber 16 along with the substrate carrier, the fifth gate valve 27 is closed, and the wafer discharging chamber 16 is subjected to vacuum breaking treatment; finally, the sixth gate valve 28 is opened, the products to be coated move out of the film discharging chamber 16 along with the carrier, then the sixth gate valve 28 is closed, the film discharging chamber 16 is vacuumized, and the next product is waited to enter the film discharging chamber 16.
The structure can enable the products at the upper and lower positions to be subjected to position exchange after the first bidirectional coating cathode mechanism 19 finishes bidirectional coating by arranging the carrier lifting transposition mechanism 21, and the products at the positions after the position exchange are subjected to coating operation on the other surface by the second bidirectional coating cathode mechanism 20, so that the efficiency of bidirectional coating of the products is greatly improved, and meanwhile, the coating cavity 13 can be ensured to be in a completely vacuum environment by arranging the sheet inlet chamber 7, the first buffer chamber 8, the first transition chamber 9, the second transition chamber 14, the second buffer chamber 15 and the sheet outlet chamber 16, and the sheet inlet chamber 7 and the sheet outlet chamber 16 can be in an atmosphere environment during feeding and discharging, so that the situation that a door valve cannot be opened can be prevented.
In this embodiment, as shown in fig. 3 to 5, the carrier lifting and shifting mechanism 21 includes a plurality of upper translation structures 22 and a plurality of lower translation structures 23 with the same structure, and further includes a swing arm structure 24 for shifting the substrate carrier 25 on the upper translation structure 22 to the lower translation structure 23 or for shifting the substrate carrier 25 on the lower translation structure 23 to the upper translation structure 22;
The film plating cavity 13 comprises two side cavity walls 1301 which are oppositely arranged, and the plurality of upper layer translation structures 22 and the plurality of lower layer translation structures 23 are oppositely arranged on the side cavity walls 1301;
The upper translation structure 22 comprises a first rotary driving shaft 2201 installed on the side cavity wall 1301, a rotary driving mechanism used for driving the first rotary driving shaft 2201 to do rotary motion is arranged on the outer side of the side cavity wall 1301, a horizontal groove 2202 is formed in the end portion of the first rotary driving shaft 2201, the upper translation structure further comprises a carrier plate driving roller 2203, a moving shaft 2204 is arranged at one end of the carrier plate driving roller 2203, the moving shaft 2204 stretches into the horizontal groove 2202 to be clamped and can horizontally move in the horizontal groove 2202, the moving shaft 2204 can follow the first rotary driving shaft 2201 to do rotary motion, a sliding sleeve 2205 is arranged on the first rotary driving shaft 2201 and is in sliding connection with the first rotary driving shaft 2201, one end of the sliding sleeve 2205 stretches out of the first rotary driving shaft 2201 to be in rotary connection with the carrier plate driving roller 2203 through a bearing, a reciprocating shaft 2206 is arranged on one side of the first rotary driving shaft 2201, the reciprocating shaft 2206 penetrates through the side cavity wall 1301, the outer side cavity wall 1301 is provided with a reciprocating shaft 2206, and the reciprocating shaft 2207 is connected with the horizontal driving shaft 2207 in a sliding mode, and the reciprocating shaft 2207 is arranged on the outer side cavity wall of the side cavity 1301.
The substrate carrier 25 includes a carrier body, a through slot 2501 is disposed in the middle of the carrier body, and concave structures 2502 facing the carrier driving rollers 2203 are disposed on two sides of the carrier body, so that the carrier driving rollers 2203 can be located in the concave structures 2502.
Specifically, when the carrier lifting and shifting operation is performed, if the substrate carrier 25 in the upper layer translation structure 22 needs to be replaced to the lower layer translation structure 23, the specific operation is as follows: at this time, the driving end of the swing arm structure 24 is located at the upper layer structure and is located at the same horizontal plane with the carrier driving roller 2203, then the first rotating driving shaft 2201 is driven by the rotating driving mechanism to rotate, so as to drive the carrier driving roller 2203 to rotate, thereby making the carrier move forward for a moving distance, at this time, the driving end of the swing arm structure 24 is located in the concave structure 2502, so as to support the carrier body, then the horizontal driving mechanism drives the reciprocating shaft 2206 to retract, so as to drive the carrier driving roller 2203 to retract, at this time, the moving rod 2204 extends into the horizontal groove 2202, the carrier driving roller 2203 withdraws from the concave structure 2502, then the swing arm structure 24 moves, so as to drive the carrier body to move to the lower layer translation mechanism, and the carrier driving roller 2203 of the lower layer translation mechanism extends to the concave structure 2502 of the carrier structure, so that the carrier driving roller 2203 can realize the transportation of the substrate carrier 25 in the upper layer translation structure 22, and the substrate carrier 25 in the lower layer translation structure 23 can be replaced to the upper layer translation structure 22, and the operation is the same as that described above.
In this structure, can realize carrying out the exchange of upper and lower position to substrate carrier 25 through swing arm structure 24's setting, and this lift transposition structure is simple convenient, also need not to occupy the too much space of equipment simultaneously to make this equipment can use widely in a large scale.
In this embodiment, a carrier deflection wheel 2208 is provided on one side of the sliding sleeve 2205 for deflecting the substrate carrier 25.
Specifically, the carrier deviation correcting wheel 2208 is connected to the sliding sleeve 2205 and can move along with the sliding sleeve 2205 to extend and retract, the carrier deviation correcting wheels 2208 on the two side walls 1301 are disposed opposite to each other, the carrier deviation correcting wheels 2208 on two sides can extend into the concave structures 2502 on two sides of the carrier body respectively, and the deviation of the substrate carrier 25 is achieved by contacting the carrier body.
In this structure, by setting the carrier deviation correcting wheel 2208, deviation correction on the substrate carrier 25 can be achieved, so that the motion stability of the substrate carrier 25 is ensured.
In this embodiment, the swing arm structure 24 includes a second rotating driving shaft 2401, a rotating driving mechanism for driving the second rotating driving shaft 2401 to perform a rotating motion is disposed on the outer side of the side cavity wall 1301, one end of the second rotating driving shaft 2401 is provided with a swing arm 2402, the swing arm 2402 is disposed perpendicular to the second rotating driving shaft 2401, and one end of the swing arm 2402 away from the second rotating driving shaft 2401 is provided with a moving roller 2403.
Specifically, when the substrate carrier 25 in the upper translation structure 22 needs to be replaced into the lower translation structure 23 during lifting driving, the specific operations are as follows: at this time, the moving roller 2403 and the carrier driving roller 2203 are located at the same horizontal plane, then the rotation driving mechanism drives the first rotation driving shaft 2201 to rotate, so as to drive the carrier driving roller 2203 to rotate, so as to enable the carrier to move forward for a moving distance, at this time, the moving roller 2403 is located in the concave structure 2502, then the horizontal driving mechanism drives the reciprocating shaft 2206 to retract, so as to drive the carrier driving roller 2203 to retract, the carrier driving roller 2203 withdraws from the concave structure 2502, the rotation driving mechanism drives the second rotation driving shaft 2401 to rotate, so that the second rotation driving shaft 2401 drives the swing arm 2402 to rotate, so that the swing arm 2402 drives the moving roller 2403 to move on the same horizontal plane as the carrier driving roller 2203 in the lower translation structure 23, and the carrier driving roller 2203 of the lower translation mechanism extends to the concave structure 2502 of the carrier structure, thereby completing the lifting operation of the whole substrate carrier 25.
Through the cooperation of swing arm structure 24 and upper translation structure 22 and lower translation structure 23 in this structure, can realize exchanging the position of substrate carrier 25 in upper translation structure 22 and lower translation structure 23 to can realize accomplishing the two-sided coating operation of product under the condition that need not to overturn the product in same equipment.
The invention also discloses a bidirectional coating method, which adopts the coating production line and comprises the following steps:
S100: the first gate valve 10 is opened, a plurality of products to be coated enter the film feeding chamber 7 along with the carrier through the upper layer conveying roller 17 and the lower layer conveying roller 18, the first gate valve 10 is closed, the film feeding chamber 7 is subjected to vacuumizing treatment, and the film feeding chamber 7 is in a vacuumizing state;
S200: the second door valve 11 is opened, a plurality of products to be coated enter the first buffer chamber 8 along with the substrate carrier, the second door valve 11 is closed, the first buffer chamber 8 is vacuumized to reach higher vacuum degree, and meanwhile, the wafer feeding chamber 7 is vacuumized;
s300: the third gate valve 12 is opened, a plurality of products to be coated enter the first transition chamber 9 along with the substrate carrier, the third gate valve 12 is closed, and the first transition chamber 9 is vacuumized;
S400: the products to be coated enter the coating cavity 13 along with the substrate carrier, the first bidirectional coating cathode mechanism performs sputtering coating on the lower surface of the product on the upper layer conveying roller 17, meanwhile, the first bidirectional coating cathode mechanism performs sputtering coating on the upper surface of the product on the lower layer conveying roller 18, then the carrier lifting transposition mechanism 21 carries out transposition on the product on the upper layer conveying roller 17 and the product on the lower layer conveying roller 18, so that the product on the upper layer conveying roller 17 moves onto the lower layer conveying roller 18, the product on the lower layer conveying roller 18 moves onto the upper layer conveying roller 17, then the second bidirectional coating cathode mechanism performs sputtering coating on the lower surface of the product on the upper layer conveying roller 17, meanwhile, the second bidirectional coating cathode mechanism performs sputtering coating on the upper surface of the product on the lower layer conveying roller 18, and then the products to be coated enter the second transition chamber 14 along with the substrate carrier;
S500: the fourth gate valve 26 is opened, a plurality of products to be coated enter the second buffer chamber 15 along with the substrate carrier, the fourth gate valve 26 is closed, and the second buffer chamber 15 is vacuumized;
s600: the fifth gate valve 27 is opened, a plurality of products to be coated enter the wafer discharging chamber 16 along with the substrate carrier, the fifth gate valve 27 is closed, and the wafer discharging chamber 16 is subjected to vacuum breaking treatment;
s700: the sixth gate valve 28 is opened, a plurality of products to be coated move out of the film discharging chamber 16 along with the carrier, then the sixth gate valve 28 is closed, the film discharging chamber 16 is vacuumized, and the next products are waited to enter the film discharging chamber 16.
The device can be used for carrying out position exchange on products at the upper and lower positions after the first bidirectional coating cathode mechanism 19 finishes bidirectional coating by arranging the carrier lifting transposition mechanism 21, and carrying out coating operation on the other surface of the products at the position exchanged by the second bidirectional coating cathode mechanism 20, so that the bidirectional coating efficiency of the products is greatly improved.
In this embodiment, the product running speed in the first transition chamber 9 is greater than the product running speed in the coating cavity 13, so that the product is in a continuous state in the coating cavity 13;
The product running speed in the second transition chamber 14 is greater than the product running speed in the coating chamber 13, so that the product changes from a continuous state to a separated state in the second transition chamber 14.
The arrangement of the method can realize that the distance between two adjacent substrate carriers 25 is small when the film coating cavity 13 is arranged, thereby reducing the waste of productivity and target materials.
While the foregoing is directed to embodiments of the present invention, other and further details of the invention may be had by the present invention, it should be understood that the foregoing description is merely illustrative of the present invention and that no limitations are intended to the scope of the invention, except insofar as modifications, equivalents, improvements or modifications are within the spirit and principles of the invention.
Claims (4)
1. Coating production line, its characterized in that: the device comprises a feeding cavity, a coating cavity (13) and a discharging cavity which are sequentially connected from left to right, wherein an upper layer transmission roller (17) and a lower layer transmission roller (18) for transmitting a substrate carrier (25) are arranged in the feeding cavity, the coating cavity (13) and the discharging cavity, a plurality of first bidirectional coating cathode mechanisms (19) are arranged between the upper layer transmission roller (17) and the lower layer transmission roller (18) which are close to one side of the feeding cavity, a plurality of second bidirectional coating cathode mechanisms (20) are arranged between the upper layer transmission roller (17) and the lower layer transmission roller (18) which are close to one side of the discharging cavity, and a carrier lifting mechanism (21) for transmitting the substrate carrier (25) on the upper layer transmission roller (17) to the lower layer transmission roller (18) and transmitting the substrate carrier (25) on the lower layer transmission roller (18) to the upper layer transmission roller (17) is arranged between the first bidirectional coating cathode mechanisms and the second bidirectional coating cathode mechanisms;
The carrier lifting and shifting mechanism (21) comprises a plurality of upper layer translation structures (22) and a plurality of lower layer translation structures (23) which are identical in structure, and further comprises a swing arm structure (24) for shifting a substrate carrier (25) on the upper layer translation structure (22) to the lower layer translation structure (23) or for shifting the substrate carrier (25) on the lower layer translation structure (23) to the upper layer translation structure (22);
the coating cavity (13) comprises two side cavity walls (1301) which are oppositely arranged, and the plurality of upper layer translation structures (22) and the plurality of lower layer translation structures (23) are oppositely arranged on the side cavity walls (1301);
The upper layer translation structure (22) comprises a first rotary driving shaft (2201) arranged on a side cavity wall (1301), a rotary driving mechanism used for driving the first rotary driving shaft (2201) to do rotary motion is arranged on the outer side of the side cavity wall (1301), a horizontal groove (2202) is arranged at the end part of the first rotary driving shaft (2201), the upper layer translation structure also comprises a carrier plate driving roller (2203), a moving rod (2204) is arranged at one end of the carrier plate driving roller (2203), the moving rod (2204) stretches into the horizontal groove (2202) to be clamped and can horizontally move in the horizontal groove (2202), the moving rod (2204) can follow the first rotary driving shaft (2201) to do rotary motion, the upper layer translation structure also comprises a sliding sleeve (2205) which is sleeved on the first rotary driving shaft (2201) and is in sliding connection with the first rotary driving shaft (2201), one end of the sliding sleeve (2205) stretches out of the first rotary driving shaft (2201) and the carrier plate driving roller (2203) to be rotatably connected with one end of the carrier plate driving roller (2204), the moving rod (2204) stretches into the horizontal groove (2206) to horizontally move in the horizontal groove (2206), the moving rod (2206) is arranged on the side cavity (1301) and can horizontally move along the side wall (2206), the connecting rod (2207) is connected with the sliding sleeve (2205);
a carrier deviation correcting wheel (2208) for correcting the deviation of the substrate carrier (25) is arranged on one side of the sliding coat (2205);
The swing arm structure (24) comprises a second rotary driving shaft (2401), a rotary driving mechanism for driving the second rotary driving shaft (2401) to do rotary motion is arranged on the outer side of the side cavity wall (1301), a swing arm (2402) is arranged at one end of the second rotary driving shaft (2401), the swing arm (2402) is perpendicular to the second rotary driving shaft (2401), and a movable roller (2403) is arranged at one end, far away from the second rotary driving shaft (2401), of the swing arm (2402);
The substrate carrier (25) comprises a carrier body, wherein a through groove (2501) is formed in the middle of the carrier body, and concave structures (2502) facing to the carrier driving rollers (2203) are arranged on two sides of the carrier body, so that the carrier driving rollers (2203) can be positioned in the concave structures (2502);
The first bidirectional coating cathode mechanism (19) and the second bidirectional coating cathode mechanism (20) comprise a target cylinder (1), an isolation supporting mechanism (2) is arranged in the target cylinder (1), a cooling shaft (3) is arranged in the middle of the isolation supporting mechanism (2), one end of the cooling shaft (3) is a cooling water inlet, and the other end of the cooling shaft (3) is a cooling water outlet; the two sides of the isolation supporting mechanism (2) are symmetrically provided with a first magnet array assembly (4) and a second magnet array assembly (5) respectively, and one side of the target cylinder (1) is provided with a rotary driving mechanism for driving the target cylinder (1) to do rotary motion;
The first magnet array assembly (4) comprises a first middle magnet (401) and first side magnets (402) positioned on two sides of the first middle magnet (401), and the polarities of the first middle magnet (401) and the first side magnets (402) are opposite; the second magnet array assembly (5) comprises a second middle magnet and second side magnets positioned on two sides of the second middle magnet, and the polarities of the second middle magnet and the second side magnets are opposite, so that a horizontal magnetic field can be formed on the surface of the target cylinder (1).
2. The coating line according to claim 1, wherein: the feeding cavity comprises a feeding chamber (7), a first buffer chamber (8) and a first transition chamber (9) which are sequentially arranged along the movement direction of the product, a first gate valve (10) is arranged at the inlet of the feeding chamber (7), a second gate valve (11) is arranged between the feeding chamber (7) and the first buffer chamber (8), and a third gate valve (12) is arranged between the first buffer chamber (8) and the first transition chamber (9);
the discharging cavity comprises a second transition chamber (14), a second buffer chamber (15) and a sheet discharging chamber (16) which are sequentially arranged along the product moving direction, a fourth gate valve (26) is arranged between the second transition chamber (14) and the second buffer chamber (15), a fifth gate valve (27) is arranged between the second buffer chamber (15) and the sheet discharging chamber (16), and a sixth gate valve (28) is arranged at the outlet end of the sheet discharging chamber (16).
3. A bi-directional coating method, using the coating line according to any one of claims 1 to 2, characterized by the steps of:
S100: the first gate valve (10) is opened, a plurality of products to be coated enter the film feeding chamber (7) along with the carrier through the upper layer transmission roller (17) and the lower layer transmission roller (18), the first gate valve (10) is closed, the film feeding chamber (7) is subjected to vacuumizing treatment, and the film feeding chamber (7) is in a vacuumizing state;
S200: the second door valve (11) is opened, a plurality of products to be coated enter the first buffer chamber (8) along with the substrate carrier, the second door valve (11) is closed, the first buffer chamber (8) is vacuumized to achieve higher vacuum degree, and meanwhile, the wafer feeding chamber (7) is vacuumized;
S300: the third gate valve (12) is opened, a plurality of products to be coated enter the first transition chamber (9) along with the substrate carrier, the third gate valve (12) is closed, and the first transition chamber (9) is vacuumized;
S400: the substrate carrier is provided with a plurality of products to be coated, the products to be coated enter a coating cavity (13), a first bidirectional coating cathode mechanism performs sputtering coating treatment on the lower surface of the products on an upper layer transmission roller (17), meanwhile, the first bidirectional coating cathode mechanism performs sputtering coating treatment on the upper surface of the products on a lower layer transmission roller (18), then a carrier lifting transposition mechanism (21) performs transposition on the products on the upper layer transmission roller (17) and the products on the lower layer transmission roller (18), so that the products on the upper layer transmission roller (17) move onto the lower layer transmission roller (18), the products on the lower layer transmission roller (18) move onto the upper layer transmission roller (17), then a second bidirectional coating cathode mechanism performs sputtering coating treatment on the lower surface of the products on the upper layer transmission roller (17), and meanwhile, the second bidirectional coating cathode mechanism performs sputtering coating treatment on the upper surface of the products on the lower layer transmission roller (18), and then the products to be coated enter a second transition chamber (14) along with the substrate carrier;
s500: the fourth gate valve (26) is opened, a plurality of products to be coated enter the second buffer chamber (15) along with the substrate carrier, the fourth gate valve (26) is closed, and the second buffer chamber (15) is vacuumized;
S600: the fifth gate valve (27) is opened, a plurality of products to be coated enter the wafer discharging chamber (16) along with the substrate carrier, the fifth gate valve (27) is closed, and the wafer discharging chamber (16) is subjected to vacuum breaking treatment;
S700: the sixth gate valve (28) is opened, a plurality of products to be coated move out of the wafer discharging chamber (16) along with the carrier, then the sixth gate valve (28) is closed, the wafer discharging chamber (16) is vacuumized, and the next products are waited to enter the wafer discharging chamber (16).
4. The bi-directional coating method of claim 3, wherein: the product running speed in the first transition chamber (9) is greater than the product running speed in the coating cavity (13), so that the product is in a continuous state in the coating cavity (13);
The product running speed in the second transition chamber (14) is greater than the product running speed in the coating cavity (13), so that the product changes from a continuous state to a separated state in the second transition chamber (14).
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| CN101812667A (en) * | 2010-04-19 | 2010-08-25 | 中国南玻集团股份有限公司 | Magnetron sputtering plating film cathode device |
| CN109371372A (en) * | 2018-12-23 | 2019-02-22 | 浙江莱宝科技有限公司 | A kind of balancing fields Sputting film-plating apparatus |
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| JP2617439B2 (en) * | 1991-10-18 | 1997-06-04 | アネルバ株式会社 | Sputtering equipment |
| US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
| US20130032476A1 (en) * | 2011-08-04 | 2013-02-07 | Sputtering Components, Inc. | Rotary cathodes for magnetron sputtering system |
| CN112410747A (en) * | 2020-10-15 | 2021-02-26 | 中国建材国际工程集团有限公司 | Coated glass production line with sectional type high-vacuum system and working method |
| CN112593196A (en) * | 2020-12-21 | 2021-04-02 | 无锡爱尔华光电科技有限公司 | Bidirectional coating magnetron sputtering method |
| CN115537747B (en) * | 2022-10-31 | 2024-04-23 | 苏州迈为科技股份有限公司 | Magnetron sputtering cathode device and magnetron sputtering equipment |
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| CN101812667A (en) * | 2010-04-19 | 2010-08-25 | 中国南玻集团股份有限公司 | Magnetron sputtering plating film cathode device |
| CN109371372A (en) * | 2018-12-23 | 2019-02-22 | 浙江莱宝科技有限公司 | A kind of balancing fields Sputting film-plating apparatus |
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