CN117566398A - Chip conveying device and method - Google Patents
Chip conveying device and method Download PDFInfo
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- CN117566398A CN117566398A CN202311771773.5A CN202311771773A CN117566398A CN 117566398 A CN117566398 A CN 117566398A CN 202311771773 A CN202311771773 A CN 202311771773A CN 117566398 A CN117566398 A CN 117566398A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims abstract description 34
- 238000012360 testing method Methods 0.000 claims abstract description 32
- 238000004891 communication Methods 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims description 14
- 230000000007 visual effect Effects 0.000 claims description 14
- 238000003708 edge detection Methods 0.000 claims description 5
- 238000004458 analytical method Methods 0.000 claims description 4
- 238000007781 pre-processing Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 7
- 238000012937 correction Methods 0.000 abstract description 3
- 230000010287 polarization Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010801 machine learning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
- B65G47/14—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0208—Control or detection relating to the transported articles
- B65G2203/0225—Orientation of the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
- B65G2203/044—Optical
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
The invention discloses a chip conveying device and a method, wherein the chip conveying device comprises a conveying component, a feeding shuttle, a vibrating component, a sensing component and a controller; the conveying assembly comprises a conveying base and a sliding mechanism, the sliding mechanism and the feeding shuttle are arranged on the conveying base, and the sliding mechanism drives the feeding shuttle to move; the feeding shuttle is provided with a plurality of chip grooves for accommodating chips; the sensing assembly detects chip feeding and material tilting conditions in the feeding shuttle; the vibration component drives the feeding shuttle to vibrate so as to adjust the position of a chip in the chip slot; the controller is respectively in communication connection with the sliding mechanism, the vibration assembly and the sensing assembly, and controls the motion state of the sliding mechanism and the vibration parameters of the vibration assembly according to the detection result of the sensing assembly, so that chips in each chip slot are conveyed in a state without warping. The chip can be rapidly transported to the test area for testing, meanwhile, the material warping correction of the chip in the transportation process is realized, and the transportation efficiency and the testing efficiency are improved.
Description
Technical Field
The invention belongs to the technical field of chip feeding detection, and particularly relates to a chip conveying device and method.
Background
Generally, after the chip is produced, the chip needs to be transported to a test area for testing, so as to complete the production quality judgment of the chip. In the process of transporting the chip to the test area, the chip is grabbed by a mechanical arm and then placed in a feeding shuttle, and then the feeding shuttle is moved to realize the transportation of the chip. After the chips are transferred into the feeding shuttle through the mechanical arm, the chips placed in the feeding shuttle are prone to being tilted, after the feeding shuttle conveys the tilted chips to the testing area, the chips are prone to being crushed due to the fact that the testing floating head for sucking the chips has larger pressure, and finally produced chips are prone to being abnormal in quality, and meanwhile testing efficiency of the chips is prone to being affected. The existing material warping problem in the chip transportation process is solved, the way of directly correcting manually after detecting the material warping of the chip is adopted to avoid, and the transportation efficiency of the chip is greatly reduced due to the need of multiple-frequency manual intervention, so that the method cannot be well applied to the actual chip production process.
The scheme of current transport chip is like patent CN110436201A, and it discloses an automatic transportation and sorting device of chip, including the fuselage, rotate the installation axis of rotation in the slip space, screw thread installation sliding block in the axis of rotation, the hollow supporting seat of sliding block downside fixed mounting, the motor drives the axis of rotation and rotates, the axis of rotation drives the sliding block and slides left or right and realize pressing from both sides the transportation of getting the in-process, it presss from both sides the chip through the clamp of connecting rod and holds the chip, the clamp of being convenient for the chip is got, prevent that the chip from dropping in the transportation, make the cam rotate the contact lever through screw-threaded linkage, control lever upwards or downwards rotate, realize the removal left of supporting seat, greatly reduced the damage degree of chip in the transportation, and the efficiency of the letter sorting transportation of improvement greatly.
Therefore, how to provide a conveying device capable of improving the transportation efficiency and the testing efficiency of chips is a problem to be solved by those skilled in the art.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a chip conveying device and a chip conveying method. The chip can be rapidly transported to the test area for testing, meanwhile, the material warping correction of the chip in the transportation process is realized, and the transportation efficiency and the testing efficiency are improved.
In a first aspect, the invention provides a chip conveying device, which comprises a conveying component, a feeding shuttle, a vibrating component, a sensing component and a controller;
the conveying assembly comprises a conveying base and a sliding mechanism, the sliding mechanism and the feeding shuttle are arranged on the conveying base, and the sliding mechanism drives the feeding shuttle to move; the feeding shuttle is provided with a plurality of chip grooves for accommodating chips;
the sensing assembly detects chip feeding and material tilting conditions in the feeding shuttle;
the vibration component drives the feeding shuttle to vibrate so as to adjust the position of a chip in the chip slot;
the controller is respectively in communication connection with the sliding mechanism, the vibration assembly and the sensing assembly, and controls the motion state of the sliding mechanism and the vibration parameters of the vibration assembly according to the detection result of the sensing assembly, so that chips in each chip slot are conveyed in a state without warping.
Further, the conveying base comprises an upper conveying base and a lower conveying base, and a sliding mechanism is arranged between the upper conveying base and the lower conveying base;
the sliding mechanism comprises a sliding assembly and a driving assembly, the sliding assembly comprises a guide rail and a plurality of sliding blocks which are arranged on the guide rail in a sliding manner, the guide rail is fixed on the lower conveying base, the sliding blocks are fixed on the bottom of the upper conveying base and are arranged along the length direction of the upper conveying base, the driving assembly comprises a driving motor, a driven wheel and a belt, the output end of the driving motor is fixed with a driving wheel, the driving wheel and the driven wheel are arranged at intervals along the length direction of the upper conveying base, the belt is wound on the driving wheel and the driven wheel, and a fixing plate fixed with the belt is arranged on the upper conveying base.
Further, the vibration assembly comprises a vibration motor, an eccentric wheel and a vibration shaft, wherein the vibration motor is fixed at the bottom of the upper conveying base, the output end of the vibration motor is fixedly provided with the eccentric wheel, one end of the vibration shaft is rotationally connected with the eccentric wheel, and the other end of the vibration shaft penetrates through the upper conveying base and is rotationally connected with the bottom of the feeding shuttle;
the conveying upper base is provided with a plurality of positioning holes, the feeding shuttle is provided with a plurality of limiting holes matched with the positioning holes in position, a positioning pin is fixed in the positioning holes, and a buffer spring sleeved on the positioning pin is arranged between the conveying upper base and the feeding shuttle.
Further, a plurality of chip grooves are formed in the top of the feeding shuttle, the chip grooves are arranged at intervals along the length direction and the width direction of the feeding shuttle to form a matrix structure, a plurality of transverse grooves and a plurality of longitudinal grooves are respectively formed in the top of the feeding shuttle, the transverse grooves are connected with the chip grooves in the same row in series, and the longitudinal grooves are connected with the chip grooves in the same column in series.
Further, the top of the feeding shuttle is provided with a plurality of groups of positioning columns, and each group of positioning columns is respectively arranged on two sides of the chip groove.
Further, the sensing assembly comprises a first sensor group and a second sensor group, the first sensor group comprises a plurality of pairs of laser sensors matched with the number of the transverse grooves, the second sensor group comprises a plurality of pairs of laser sensors matched with the number of the longitudinal grooves, each pair of laser sensors comprises a laser emitter and a laser receiver, the laser emitters and the laser receivers of the first sensor group are respectively arranged at two ends of the sliding mechanism so as to detect chip feeding conditions in the feeding shuttle, and the laser emitters and the laser receivers of the second sensor group are respectively arranged at two sides of the sliding mechanism so as to detect chip material lifting conditions in the feeding shuttle.
Further, according to the detection result of the sensing component, controlling the motion state of the sliding mechanism and the vibration parameter of the vibration component, including:
after the sensor assembly detects that the chip groove in the feeding shuttle is fed, the controller controls the conveying assembly to drive the feeding shuttle to move to a preset position;
the sensing assembly detects a chip in the feeding shuttle positioned at a preset position and gives a warping result;
when the sensing component gives a result that no material warping exists, the controller controls the conveying component to drive the feeding shuttle to convey to the testing area; when the sensing component gives out a tilting result, the controller adjusts the input power of the vibration motor according to the structural parameters of the chip and the performance parameters of the vibration motor, continuously acquires the tilting result detected by the sensing component in a preset adjusting period, and controls the vibration motor to stop vibrating when the sensing component detects that the tilting is not present in the preset adjusting period, and performs early warning operation when the sensing component detects that the tilting is present in the preset adjusting period.
Further, the controller adjusts the input power of the vibration motor according to the structural parameters of the chip and the performance parameters of the vibration motor, and the following relation is satisfied:
wherein P is the input power of the motor, alpha is the vibration coefficient, eta is the conversion efficiency of the motor, and d 1 For the side length of the chip, d 0 The length of the chip groove is g, the gravity acceleration, L is the distance between the output shaft of the motor and the eccentric shaft, M is the rotational inertia of the motor, K is the torque coefficient of the motor, and N is the pole pair number of the motor.
Further, the sensing assembly comprises a visual identification assembly, and the visual identification assembly is arranged above the conveying assembly and is used for collecting the feed shuttle image and carrying out identification analysis;
the structural parameters of the chip are identified and given through a visual identification component, and the method specifically comprises the following steps:
the visual recognition component collects an image of the feeding shuttle after feeding the chip groove in the feeding shuttle;
preprocessing the feed shuttle image to obtain a feed shuttle processed image;
analyzing and processing the feed shuttle processing image based on a pre-constructed chip detection model to give a chip image;
edge detection is respectively carried out on the feed shuttle processing image and the chip image, and edge coordinates of the feed shuttle and the chip are given;
giving the pixel size of the chip based on the edge coordinates of the chip, and giving the pixel size of the feeding shuttle based on the edge coordinates of the feeding shuttle;
the actual size of the chip is given based on the pixel size of the feed shuttle, the actual size of the feed shuttle, and the pixel size of the chip.
Further, the pixel size of the chip is given based on the edge coordinates of the chip, including:
the boundary of the feeding shuttle and the chip is respectively given based on the edge coordinates of the feeding shuttle and the chip;
comparing the boundary of the chip with the boundary of the feeding shuttle to give a chip with each boundary parallel to at least one boundary of the feeding shuttle;
comparing the adjacent boundary of each given chip with the adjacent boundaries of other given chips to determine the chips with the same adjacent boundary comparison result and the same maximum number;
the pixel size of each boundary of the chip is given based on the determined chip corresponding boundary.
Further, the predetermined adjustment period includes a first adjustment period and a second adjustment period, wherein the first adjustment period is not less than the second adjustment period;
continuously acquiring a material warping result detected by the sensing assembly in a preset adjusting period, wherein the material warping result comprises the following steps of:
continuously acquiring the logarithm of the laser sensor for detecting the material tilting in the first adjusting period, giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in the first adjusting period is increased or unchanged, giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in a certain time in the first adjusting period is zero, continuously acquiring the logarithm of the laser sensor for detecting the material tilting in the second adjusting period when the logarithm of the laser sensor for detecting the material tilting in the first adjusting period is reduced, giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in a certain time in the second adjusting period is zero, and giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in the second adjusting period is not zero.
In a second aspect, the present invention further provides a conveying method for chip testing, where the chip conveying device specifically includes:
after the sensing component detects chip feeding, the controller controls the conveying component to convey the feeding shuttle to a preset position;
the sensing assembly detects the material warping condition of the chip at the preset position, and the following operation is carried out:
the controller controls vibration parameters of the vibration component when the sensing component detects the existence of the material warping so as to adjust the position of a chip in the chip groove; or alternatively
The controller controls the motion state of the sliding mechanism when the sensing assembly detects that the material is not tilted, so as to convey the feeding shuttle to the testing area.
Further, according to the detection result of the sensing component, controlling the motion state of the sliding mechanism and the vibration parameter of the vibration component, including:
after the sensor assembly detects that the chip groove in the feeding shuttle is fed, the controller controls the conveying assembly to drive the feeding shuttle to move to a preset position;
the sensing assembly detects a chip in the feeding shuttle positioned at a preset position and gives a warping result;
when the sensing component gives a result that no material warping exists, the controller controls the conveying component to drive the feeding shuttle to convey to the testing area; when the sensing component gives out a tilting result, the controller adjusts the input power of the vibration motor according to the structural parameters of the chip and the performance parameters of the vibration motor, continuously acquires the tilting result detected by the sensing component in a preset adjusting period, and controls the vibration motor to stop vibrating when the sensing component detects that the tilting is not present in the preset adjusting period, and performs early warning operation when the sensing component detects that the tilting is present in the preset adjusting period.
Further, the structural parameters of the chip are identified and given through the visual identification component, and the method specifically comprises the following steps:
the visual recognition component collects an image of the feeding shuttle after feeding the chip groove in the feeding shuttle;
preprocessing the feed shuttle image to obtain a feed shuttle processed image;
analyzing and processing the feed shuttle processing image based on a pre-constructed chip detection model to give a chip image;
edge detection is respectively carried out on the feed shuttle processing image and the chip image, and edge coordinates of the feed shuttle and the chip are given;
giving the pixel size of the chip based on the edge coordinates of the chip, and giving the pixel size of the feeding shuttle based on the edge coordinates of the feeding shuttle;
the actual size of the chip is given based on the pixel size of the feed shuttle, the actual size of the feed shuttle, and the pixel size of the chip.
Further, the pixel size of the chip is given based on the edge coordinates of the chip, including:
the boundary of the feeding shuttle and the chip is respectively given based on the edge coordinates of the feeding shuttle and the chip;
comparing the boundary of the chip with the boundary of the feeding shuttle to give a chip with each boundary parallel to at least one boundary of the feeding shuttle;
comparing the adjacent boundary of each given chip with the adjacent boundaries of other given chips to determine the chips with the same adjacent boundary comparison result and the same maximum number;
the pixel size of each boundary of the chip is given based on the determined chip corresponding boundary.
Further, the predetermined adjustment period includes a first adjustment period and a second adjustment period, wherein the first adjustment period is not less than the second adjustment period;
continuously acquiring a material warping result detected by the sensing assembly in a preset adjusting period, wherein the material warping result comprises the following steps of:
continuously acquiring the logarithm of the laser sensor for detecting the material tilting in the first adjusting period, giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in the first adjusting period is increased or unchanged, giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in a certain time in the first adjusting period is zero, continuously acquiring the logarithm of the laser sensor for detecting the material tilting in the second adjusting period when the logarithm of the laser sensor for detecting the material tilting in the first adjusting period is reduced, giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in a certain time in the second adjusting period is zero, and giving out the detection result of the material tilting in the preset adjusting period when the logarithm of the laser sensor for detecting the material tilting in the second adjusting period is not zero.
The chip conveying device and method provided by the invention at least comprise the following beneficial effects:
(1) Through the cooperation of conveying component, vibration subassembly and sensing subassembly, can be fast with the chip transportation to test area test, realize simultaneously that the perk of chip is rectified in the transportation, improve the chip quality to and improve conveying efficiency and efficiency of software testing.
(2) Through the setting of vibration subassembly and locating pin, can make the pan feeding shuttle can not break away from the transport and go up the base when vibrating to after vibration is accomplished, can drive the pan feeding shuttle through slide mechanism and move to the test area.
(3) Through first sensor group and second sensor group, can realize detecting the pan feeding condition and the perk condition of pan feeding shuttle inner chip, provide theoretical basis for follow-up control sliding mechanism and vibration subassembly.
(4) Through the setting of visual identification subassembly, can carry out preliminary judgement perk material condition according to the boundary condition of detection, can also realize the discernment to the chip size simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a chip conveying device provided by the invention;
FIG. 2 is a schematic cross-sectional view of a chip handling apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic view of a vibration assembly according to one embodiment of the present invention;
fig. 4 is a flowchart of a chip conveying method provided by the invention.
Reference numerals illustrate: the device comprises a 1-conveying component, a 11-conveying base, a 111-conveying upper base, a 112-conveying lower base, 113-positioning pins, a 12-sliding component, 121-guide rails, 122-sliding blocks, 2-feeding shuttles, 21-chip grooves, 22-transverse grooves, 23-longitudinal grooves, 24-positioning columns, 3-vibration components, 31-vibration motors, 32-eccentric wheels, 33-vibration shafts, 41-first sensor groups, 42-second sensor groups and 43-laser sensors.
Detailed Description
In order to better understand the above technical solutions, the following detailed description will be given with reference to the accompanying drawings and specific embodiments. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such product or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a commodity or device comprising such element.
Referring to fig. 1-3, the invention provides a chip conveying device, which comprises a conveying component 1, a feeding shuttle 2, a vibrating component 3, a sensing component and a controller;
the conveying assembly 1 comprises a conveying base 11 and a sliding mechanism, wherein the sliding mechanism and the feeding shuttle 2 are arranged on the conveying base 11, and the sliding mechanism drives the feeding shuttle 2 to move; the feeding shuttle 2 is provided with a plurality of chip grooves 21 for accommodating chips;
the sensing assembly detects chip feeding and tilting conditions in the feeding shuttle 2;
the vibration component 3 drives the feeding shuttle 2 to vibrate so as to adjust the position of a chip in the chip groove 21;
the controller is respectively in communication connection with the sliding mechanism, the vibration assembly 3 and the sensing assembly, and controls the motion state of the sliding mechanism and the vibration parameters of the vibration assembly 3 according to the detection result of the sensing assembly, so that chips in the chip grooves 21 are conveyed in a state without warping.
The structure of the feeding shuttle 2 can be set according to different requirements, in a practical application scene, the top of the feeding shuttle 2 is provided with a plurality of chip grooves 21, the chip grooves 21 are arranged at intervals along the length direction and the width direction of the feeding shuttle 2 to form a matrix structure, the top of the feeding shuttle 2 is provided with a plurality of transverse grooves 22 and a plurality of longitudinal grooves 23 which are respectively arranged along the length direction and the width direction of the feeding shuttle, the transverse grooves 22 are connected with the chip grooves 21 in the same row in series, and the longitudinal grooves 23 are connected with the chip grooves 21 in the same row in series. Through the arrangement of the transverse grooves 22 and the longitudinal grooves 23, the chip feeding and warping detection device can be matched with a sensing assembly, and the chip in the chip groove 21 is subjected to feeding and warping detection. Wherein, the top of the feeding shuttle 2 is also provided with a plurality of groups of positioning columns 24, and each group of positioning columns 24 is respectively arranged at two sides of the chip groove 21. The positioning column 24 is used for realizing the alignment of the mechanical arm or the test floating head when loading and unloading, so that the mechanical arm or the test floating head can conveniently realize the unloading or the grabbing of the chips in the chip groove 21.
In addition, the sensing assembly comprises a first sensor group 41 and a second sensor group 42, the first sensor group 41 comprises a plurality of pairs of laser sensors 43 matched with the number of the transverse grooves 22, the second sensor group 42 comprises a plurality of pairs of laser sensors 43 matched with the number of the longitudinal grooves 23, the first sensor group 41 comprises a laser emitter and a laser receiver, each pair of laser sensors 43 comprises a laser emitter and a laser receiver, the laser emitter and the laser receiver of the first sensor group 41 are respectively arranged at two ends of the sliding mechanism so as to detect chip feeding conditions in the feeding shuttle 2, and the laser emitter and the laser receiver of the second sensor group 42 are respectively arranged at two sides of the sliding mechanism so as to detect chip warping conditions in the feeding shuttle 2. Wherein the pitch positions formed by all pairs of laser sensors 43 in the second sensor group 42 match the pitch positions of all longitudinal grooves 23. Therefore, when the feeding shuttle 2 moves to the position of the second sensor group 42, chip detection in all the longitudinal grooves 23 on the feeding shuttle 2 is realized through all the pairs of laser sensors 43 in the second sensor group 42, and finally, the material tilting condition of the chips in the feeding shuttle 2 is judged. In addition, the sensing assembly may further include a third sensor group disposed close to the second sensor group 42 for detecting the position of the feeding shuttle 2, so as to ensure that the laser sensor 43 of the second sensor group 42 can implement the warpage detection of the chip through the longitudinal groove 23 of the feeding shuttle 2.
Referring to fig. 1 and 2, the conveying base 11 of the present invention may include a conveying upper base 111 and a conveying lower base 112, with a sliding mechanism provided between the conveying upper base 111 and the conveying lower base 112. Wherein the width of the conveying upper base 111 is smaller than the width of the conveying lower base 112. The sliding mechanism may include a sliding component 12 and a driving component, where the sliding component 12 includes a guide rail 121 and a plurality of sliders 122 slidably disposed on the guide rail 121, the guide rail 121 is fixed on the lower conveying base 112, the sliders 122 are fixed on the bottom of the upper conveying base 111 and are disposed along the length direction of the upper conveying base 111, the driving component includes a driving motor, a driven wheel and a belt, the output end of the driving motor is fixed with a driving wheel, the driving wheel and the driven wheel are disposed along the length direction of the upper conveying base 111 at intervals, the belt is wound on the driving wheel and the driven wheel, and a fixing plate fixed with the belt is disposed on the upper conveying base 111. At least two sliding blocks 122 are arranged on each guide rail 121, and the sliding blocks 122 are U-shaped and are reversely buckled on the guide rails 121. In addition, the driving motor is fixed on the lower conveying base 112, the driven wheel is rotationally fixed on the lower conveying base 112, when the feeding shuttle 2 is driven to move through the conveying assembly 1, the driving motor drives the belt to move through the driving wheel and the driven wheel, the movement direction of the belt is the same as the length direction of the guide rail 121, the belt movement can drive the upper conveying base 111 fixed on the belt to move along the guide rail 121, and finally, the chip on the feeding shuttle 2 is transported.
Referring to fig. 3, when vibration of the feed shuttle 2 is implemented according to a detection result of the sensing assembly, the vibration assembly 3 may include a vibration motor 31, an eccentric wheel 32 and a vibration shaft 33, the vibration motor 31 is fixed at the bottom of the upper conveying base 111, the eccentric wheel 32 is fixed at the output end thereof, one end of the vibration shaft 33 is rotatably connected with the eccentric wheel 32, and the other end passes through the upper conveying base 111 to be rotatably connected with the bottom of the feed shuttle 2; the upper conveying base 111 is provided with a plurality of positioning holes, the feeding shuttle 2 is provided with a plurality of limiting holes matched with the positioning holes, the positioning holes are internally fixed with positioning pins 113, and a buffer spring sleeved on the positioning pins 113 is arranged between the upper conveying base 111 and the feeding shuttle 2. In addition, the output end of the vibration motor 31 is fixed with the center of the eccentric wheel 32, the vibration shaft 33 is fixed with the eccentric shaft of the eccentric wheel 32 in a rotating way, the vibration shaft 33 is perpendicular to the eccentric shaft, and the distance between the center of the eccentric wheel 32 and the axis of the eccentric shaft is 0.5-3 mm. The upper conveying base 111 is provided with a strip-shaped hole matched with the eccentric wheel 32 in position, and the vibration shaft 33 penetrates through the strip-shaped hole and is fixed with the upper conveying base 111 in a rotating mode. By arranging the eccentric wheel 32, the eccentric wheel 32 can be driven to rotate when the output end of the vibration motor 31 rotates, so that the eccentric shaft of the eccentric wheel 32 has periodical change in height. Due to the height change of the eccentric shaft, the vibration shaft 33 is driven to move up and down, and finally the up and down vibration of the feeding shuttle 2 is realized. When the feeding shuttle 2 vibrates, the buffering of the feeding shuttle 2 can be realized through the buffering spring, and damage of vibration to the feeding shuttle 2 is reduced. Meanwhile, the locating pin 113 plays a role in guiding the feeding shuttle 2, so that the feeding shuttle 2 only vibrates along the vertical direction, the situation of deflection in the vibration process is avoided, and the connecting structure among the vibration motor 31, the eccentric wheel 32 and the vibration shaft 33 is damaged. In order to further reduce the possible collision situation in the vibration process of the feeding shuttle 2, a buffer pad may be disposed at one end of the positioning pin 113 away from the upper conveying base 111, so as to avoid the collision between the feeding shuttle 2 and the positioning pin 113.
The controller of the present invention may specifically include the following steps when controlling the motion state of the sliding mechanism and the vibration parameter of the vibration assembly according to the detection result of the sensing assembly:
after the sensor assembly detects that the chip groove in the feeding shuttle is fed, the controller controls the conveying assembly to drive the feeding shuttle to move to a preset position; the third sensor group is used for detecting whether the feeding shuttle moves at a preset position or not;
the sensing assembly detects a chip in the feeding shuttle positioned at a preset position and gives a warping result;
when the sensing component gives a result that no material warping exists, the controller controls the conveying component to drive the feeding shuttle to convey to the testing area; when the sensing component gives out a tilting result, the controller adjusts the input power of the vibration motor according to the structural parameters of the chip and the performance parameters of the vibration motor, continuously acquires the tilting result detected by the sensing component in a preset adjusting period, and controls the vibration motor to stop vibrating when the sensing component detects that the tilting is not present in the preset adjusting period, and performs early warning operation when the sensing component detects that the tilting is present in the preset adjusting period.
The controller adjusts the input power of the vibration motor according to the structural parameters of the chip and the performance parameters of the vibration motor, and the following relation is satisfied:
wherein P is the input power of the motor, alpha is the vibration coefficient, preferably the vibration coefficient alpha is 3-3.5, eta is the conversion efficiency of the motor, and d 1 For the side length of the chip, d 0 The length of the chip groove is g, the gravity acceleration, L is the distance between the output shaft of the motor and the eccentric shaft, M is the rotational inertia of the motor, K is the torque coefficient of the motor, and N is the pole pair number of the motor.
In addition, the preset gear can be carried out according to the structural parameters of the chip, and different gears can have different vibration frequencies. Therefore, when the sensing assembly gives a result of the existence of the warping, the preset gear is selected according to the structural parameters of the chip. The gear number of the preset gear can be set according to the chip size type number of the actual test area; for example, when the number of kinds of chip sizes in the test area is 5, the number of gear positions of the preset gear positions may be set to 5, and the vibration frequency thereof increases as the number of sequence of preset gear positions increases, wherein the smallest chip size corresponds to the preset gear position with the smallest vibration frequency, and the largest chip size corresponds to the preset gear position with the largest vibration frequency. For determining the vibration frequency of the preset gear, the vibration frequency can be determined in a machine learning mode, for example, chips with different sizes are placed in the feeding shuttle, the situation of warping exists in the feeding shuttle, and the proper vibration frequency is determined by setting different vibration frequencies and carrying out limited experiments on the different vibration frequencies.
The sensing assembly of the invention can also comprise a visual identification assembly which is arranged above the conveying assembly and is used for collecting the feed shuttle image and carrying out identification analysis;
the structural parameters of the chip are identified and given through a visual identification component, and the method specifically comprises the following steps:
the visual recognition component collects an image of the feeding shuttle after feeding the chip groove in the feeding shuttle;
preprocessing the feed shuttle image to obtain a feed shuttle processed image;
analyzing and processing the feed shuttle processing image based on a pre-constructed chip detection model to give a chip image;
edge detection is respectively carried out on the feed shuttle processing image and the chip image, and edge coordinates of the feed shuttle and the chip are given;
giving the pixel size of the chip based on the edge coordinates of the chip, and giving the pixel size of the feeding shuttle based on the edge coordinates of the feeding shuttle;
the actual size of the chip is given based on the pixel size of the feed shuttle, the actual size of the feed shuttle, and the pixel size of the chip.
In an actual application scenario, the feeding shuttle is provided with a plurality of chip grooves, and chips may exist in each chip groove after feeding. After analysis processing is carried out through a chip detection model, chip images are given and correspond to the number of chips in the feeding shuttle, and each chip image comprises one chip. The pre-built chip detection model is obtained by training a conventional image target detection algorithm, and can realize target detection, for example, the chip detection model can be obtained by training an R-CNN or yolov5 algorithm. And respectively carrying out edge detection on the feed shuttle processing image and the chip image through a sobel operator.
The present invention may include the following steps when the pixel size of the chip is given based on the edge coordinates of the chip:
the boundary of the feeding shuttle and the chip is respectively given based on the edge coordinates of the feeding shuttle and the chip;
comparing the boundary of the chip with the boundary of the feeding shuttle to give a chip with each boundary parallel to at least one boundary of the feeding shuttle;
comparing the adjacent boundary of each given chip with the adjacent boundaries of other given chips to determine the chips with the same adjacent boundary comparison result and the same maximum number;
the pixel size of each boundary of the chip is given based on the determined chip corresponding boundary.
The edge coordinates of the chip are pixel coordinates, and the boundary of the chip can be formed according to the pixel coordinates, and the formed chip boundary has a corresponding pixel size (pixel length), so that the pixel size of the chip can be directly given through the chip boundary.
In addition, through comparing the boundary of chip and the boundary of pan feeding shuttle, give every boundary and pan feeding shuttle at least one boundary parallel chip, realize having realized having screened the chip preliminarily, when there is one of them boundary of a certain chip and all boundaries of pan feeding shuttle all not having parallel relation, then this chip probably has the circumstances of perk, and it can carry out auxiliary judgement with the testing result of second sensor group to improve the judgement to perk detection. In addition, through preliminary screening, the invention also ensures that the chip which is selected for acquiring the chip size does not have the warpage when the chip size is determined, and improves the accuracy of determining the chip size.
The vibration component can realize vibration of the feeding shuttle in the horizontal direction besides the vibration in the vertical direction. In an actual application scenario, the vibration component may include a polarization motor and a cam, where the polarization motor is fixed on the upper conveying base, and an output end of the polarization motor is fixed with the cam, and a rotation plane of the cam is parallel to the upper conveying base. When horizontal vibration is realized, the cam is driven to rotate by the polarization motor, and the gravity center of the cam is not coincident with the rotation axis of the polarization motor, so that the upper conveying base fixed with the polarization motor can generate small-range horizontal vibration in the rotation process of the cam. Through the horizontal vibration and the vertical vibration of a small range, the warping correction effect in the feeding shuttle can be further improved.
The controller performs early warning operation, including:
the controller generates early warning information of the existence of the warping of the feeding shuttle and sends the early warning information to the server; the server transmits the early warning information to the mobile terminal so as to inform an operator to correct the chip in the feeding shuttle; after the chip is corrected by the operator, the operator sends the completion information to the controller, the controller changes the result of the material warping of the material feeding shuttle into the result of the material warping not existing after receiving the completion information, and the controller controls the conveying assembly to drive the material feeding shuttle to convey to the testing area. After the chip is corrected by an operator, whether the chip of the feeding shuttle has a material tilting condition or not can be judged directly through the detection result of the sensing component, and the feeding shuttle is conveyed to the test area by the conveying component under the control of a certain time after the fact that the material tilting does not exist in the feeding shuttle is judged. Wherein the certain time can be 1s, 2s, 3s and the like.
The invention also provides a conveying method for chip test, which adopts the chip conveying device and specifically comprises the following steps:
after the sensing component detects chip feeding, the controller controls the conveying component to convey the feeding shuttle to a preset position;
the sensing assembly detects the material warping condition of the chip at the preset position, and the following operation is carried out:
the controller controls vibration parameters of the vibration component when the sensing component detects the existence of the material warping so as to adjust the position of a chip in the chip groove; or alternatively
The controller controls the motion state of the sliding mechanism when the sensing assembly detects that the material is not tilted, so as to convey the feeding shuttle to the testing area.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It should be understood that the above embodiments are merely for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and implement the same according to the present invention without limiting the scope of the present invention. All equivalent changes and modifications of the invention are intended to be included within the scope of the present invention, as they are also intended to be encompassed within the scope of the invention.
Claims (10)
1. The chip conveying device is characterized by comprising a conveying component, a feeding shuttle, a vibrating component, a sensing component and a controller;
the conveying assembly comprises a conveying base and a sliding mechanism, the sliding mechanism and the feeding shuttle are arranged on the conveying base, and the sliding mechanism drives the feeding shuttle to move; the feeding shuttle is provided with a plurality of chip grooves for accommodating chips;
the sensing assembly detects chip feeding and material tilting conditions in the feeding shuttle;
the vibration component drives the feeding shuttle to vibrate so as to adjust the position of a chip in the chip slot;
the controller is respectively in communication connection with the sliding mechanism, the vibration assembly and the sensing assembly, and controls the motion state of the sliding mechanism and the vibration parameters of the vibration assembly according to the detection result of the sensing assembly, so that chips in each chip slot are conveyed in a state without warping.
2. The chip conveying device according to claim 1, wherein the chip grooves are arranged at intervals along the length direction and the width direction of the feeding shuttle to form a matrix structure, a plurality of transverse grooves and a plurality of longitudinal grooves which are respectively arranged along the length direction and the width direction of the feeding shuttle are arranged at the top of the feeding shuttle, the transverse grooves are connected with the chip grooves in the same row in series, and the longitudinal grooves are connected with the chip grooves in the same column in series.
3. The chip conveying device according to claim 2, wherein the sensing assembly comprises a first sensor group and a second sensor group, the first sensor group comprises a plurality of pairs of laser sensors matched with the number of the transverse grooves, the second sensor group comprises a plurality of pairs of laser sensors matched with the number of the longitudinal grooves, each pair of laser sensors comprises a laser emitter and a laser receiver, the laser emitters and the laser receivers of the first sensor group are respectively arranged at two ends of the sliding mechanism to detect chip feeding conditions in the feeding shuttle, and the laser emitters and the laser receivers of the second sensor group are respectively arranged at two sides of the sliding mechanism to detect chip warping conditions in the feeding shuttle.
4. The chip conveying device according to claim 1, wherein the conveying base comprises an upper conveying base and a lower conveying base, and a sliding mechanism is arranged between the upper conveying base and the lower conveying base;
the sliding mechanism comprises a sliding assembly and a driving assembly, the sliding assembly comprises a guide rail and a plurality of sliding blocks which are arranged on the guide rail in a sliding manner, the guide rail is fixed on the lower conveying base, the sliding blocks are fixed on the bottom of the upper conveying base and are arranged along the length direction of the upper conveying base, the driving assembly comprises a driving motor, a driven wheel and a belt, the output end of the driving motor is fixed with a driving wheel, the driving wheel and the driven wheel are arranged at intervals along the length direction of the upper conveying base, the belt is wound on the driving wheel and the driven wheel, and a fixing plate fixed with the belt is arranged on the upper conveying base.
5. The chip conveying device according to claim 4, wherein the vibration assembly comprises a vibration motor, an eccentric wheel and a vibration shaft, the vibration motor is fixed at the bottom of the upper conveying base, the eccentric wheel is fixed at the output end of the vibration motor, one end of the vibration shaft is rotationally connected with the eccentric wheel, and the other end of the vibration shaft penetrates through the upper conveying base and is rotationally connected with the bottom of the feeding shuttle.
6. The chip conveying device according to claim 5, wherein the upper conveying base is provided with a plurality of positioning holes, the feeding shuttle is provided with a plurality of limiting holes matched with the positioning holes in position, positioning pins are fixed in the positioning holes, and buffer springs sleeved on the positioning pins are arranged between the upper conveying base and the feeding shuttle.
7. The chip conveying apparatus according to claim 5 or 6, wherein controlling the movement state of the slide mechanism and the vibration parameter of the vibration assembly based on the detection result of the sensor assembly comprises:
after the sensor assembly detects that the chip groove in the feeding shuttle is fed, the controller controls the conveying assembly to drive the feeding shuttle to move to a preset position;
the sensing assembly detects a chip in the feeding shuttle positioned at a preset position and gives a warping result;
when the sensing component gives a result that no material warping exists, the controller controls the conveying component to drive the feeding shuttle to convey to the testing area; when the sensing component gives out a tilting result, the controller adjusts the input power of the vibration motor according to the structural parameters of the chip and the performance parameters of the vibration motor, continuously acquires the tilting result detected by the sensing component in a preset adjusting period, and controls the vibration motor to stop vibrating when the sensing component detects that the tilting is not present in the preset adjusting period, and performs early warning operation when the sensing component detects that the tilting is present in the preset adjusting period.
8. The chip conveying device according to claim 7, wherein the sensing assembly comprises a visual identification assembly, and the visual identification assembly is arranged above the conveying assembly and is used for acquiring the feed shuttle image and carrying out identification analysis;
the structural parameters of the chip are identified and given through a visual identification component, and the method specifically comprises the following steps:
the visual recognition component collects an image of the feeding shuttle after feeding the chip groove in the feeding shuttle;
preprocessing the feed shuttle image to obtain a feed shuttle processed image;
analyzing and processing the feed shuttle processing image based on a pre-constructed chip detection model to give a chip image;
edge detection is respectively carried out on the feed shuttle processing image and the chip image, and edge coordinates of the feed shuttle and the chip are given;
giving the pixel size of the chip based on the edge coordinates of the chip, and giving the pixel size of the feeding shuttle based on the edge coordinates of the feeding shuttle;
the actual size of the chip is given based on the pixel size of the feed shuttle, the actual size of the feed shuttle, and the pixel size of the chip.
9. The chip conveying apparatus as claimed in claim 8, wherein the giving the pixel size of the chip based on the edge coordinates of the chip comprises:
the boundary of the feeding shuttle and the chip is respectively given based on the edge coordinates of the feeding shuttle and the chip;
comparing the boundary of the chip with the boundary of the feeding shuttle to give a chip with each boundary parallel to at least one boundary of the feeding shuttle;
comparing the adjacent boundary of each given chip with the adjacent boundaries of other given chips to determine the chips with the same adjacent boundary comparison result and the same maximum number;
the pixel size of each boundary of the chip is given based on the determined chip corresponding boundary.
10. A chip conveying method, characterized in that the chip conveying apparatus according to any one of claims 1 to 9 is employed, comprising:
after the sensing component detects chip feeding, the controller controls the conveying component to convey the feeding shuttle to a preset position;
the sensing assembly detects the material warping condition of the chip at the preset position, and the following operation is carried out:
the controller controls vibration parameters of the vibration component when the sensing component detects the existence of the material warping so as to adjust the position of a chip in the chip groove; or alternatively
The controller controls the motion state of the sliding mechanism when the sensing assembly detects that the material is not tilted, so as to convey the feeding shuttle to the testing area.
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