CN117444389A - Laser scanning welding device suitable for micro LED BT plate - Google Patents

Abstract

The invention is suitable for the technical field of laser welding. The invention discloses a micro LED BT plate laser scanning welding device, which comprises a chassis, a BT plate conveying mechanism arranged on the chassis, and a line laser for carrying out line laser welding on the BT plate conveying mechanism, wherein the line laser comprises a laser generator and a laser path mechanism for guiding laser output by the laser generator to a welding spot, and the laser path mechanism converts laser spots into rectangular laser spots with uniform energy density distribution in a projection plane. When the micro LED BT plate is used, the welding spots on the micro LED BT plate are scanned by using the linear laser, the laser spots are converted into the linear laser with uniform energy density distribution in the front projection plane by using the laser path mechanism, so that the temperature of each welding spot on the same scanning line or the whole micro LED BT plate is basically the same, the energy consumption can be reduced, the consistency of welding quality can be ensured, and the welding efficiency can be improved.

Description

Laser scanning welding device suitable for micro LED BT plate

Technical Field

The invention relates to the technical field of welding, in particular to a laser scanning welding device suitable for micro LED BT plates.

Background

Display screen technology includes LCD, TFT, and LED etc. because LED display has good display effect, and the area appears in theory and can not normally show and can repair, more and more is used. The existing micro LED BT plate (Bismaleimide Triazine, BT resin substrate) is usually welded by adopting reflow soldering, and the BT plate chip welding technology mainly adopts reflow soldering, wherein the reflow soldering is carried out at the normal temperature of 180-220 ℃, and the problems of slow temperature rise, long startup preheating time, large space occupied by equipment, high energy consumption and the like exist. Particularly, when the high-temperature tin product is used, the temperature of reflow soldering is difficult to raise, and defects such as cold soldering, bridging and the like are more easily generated.

Disclosure of Invention

The technical problem to be solved mainly by the invention is to provide the laser scanning welding device suitable for the micro LED BT plate, wherein the micro LED BT plate can improve the welding efficiency and the welding quality.

In order to solve the technical problems, the invention provides a laser scanning welding device suitable for micro LED BT plates, which comprises a chassis, a BT plate conveying mechanism arranged on the chassis and a line laser for carrying out line laser welding on BT plates on the BT plate conveying mechanism, wherein the line laser comprises a laser generator and a laser path mechanism for guiding laser output by the laser generator to welding spots, and the laser path mechanism converts laser spots into rectangular laser spots with uniform energy density distribution in a projection plane.

Further, the case is provided with two parallel brackets, two sliding rails are arranged on the brackets, and a laser path seat for fixing a laser path mechanism is arranged between the two sliding rails.

Further, the BT plate conveying mechanism is provided with two parallel conveying frames, BT plate fixing seats arranged on the two conveying frames and used for fixing BT plates, and a driving mechanism used for driving the BT plate fixing seats to move along the conveying frames.

Further, the driving mechanism comprises motors and gears driven by the motors, which are respectively arranged on the two conveying frames, and a transmission part matched with the gears.

Further, the transmission member includes a chain.

Further, the laser path mechanism comprises a laser shaping assembly for shaping input laser, so that the input laser light spots with uneven energy distribution are adjusted to output laser light spots with even energy distribution, and the laser shaping assembly comprises a first shaping lens, a second shaping lens and a third shaping lens which are sequentially arranged on the same optical axis of a light source from near to far.

Further, the optical axes of the first shaping lens, the second shaping lens and the third shaping lens are on the same straight line.

Further, the first shaping lens comprises a first lens body, the first lens body is a plane on one side surface of incident light, and the one side surface of emergent light is an inward concave surface, wherein the concave surface forms a groove-shaped structure on the surface of the first lens body in one direction.

Further, the second shaping lens includes a second lens body, the surface of the second lens body on one side close to the first shaping lens is arc-shaped, the surface of the second lens body on the opposite side to the arc-shaped surface is plane, the arc-shaped surface forms a first arch structure in one direction, and the first arch structure is perpendicular to the groove-shaped structure.

Further, the third shaping lens includes a third lens body, a surface of the third lens body on a side close to the second shaping lens is arc-shaped, a surface of the third lens body on a side opposite to the arc-shaped surface is plane, the arc-shaped surface forms a second arch structure in one direction, and the second arch structure is perpendicular to the groove-shaped structure.

Further, the laser shaping assembly further comprises an upper shaping fixing seat and a lower shaping fixing seat, the upper shaping fixing seat and the lower shaping fixing seat are matched to form an installation cavity for installing the first shaping lens, the second shaping lens and the third shaping lens, through holes communicated with the installation cavity are formed in the upper shaping fixing seat and the lower shaping fixing seat along the optical axis direction, and the distance between the first shaping lens and the second shaping lens is smaller than the distance between the second shaping lens and the third shaping lens.

Further, the laser shaping assembly further comprises a protective lens fixed with the lower shaping fixing seat.

Further, the laser shaping assembly further comprises an installation seat with a fixing hole and a straight cylinder with one end positioned in the fixing hole, wherein the installation seat and the laser shaping assembly are arranged on the same optical axis, and a condensing lens is fixed at the end part of the straight cylinder positioned in the fixing hole.

Further, the condensing lens is a biconcave lens, and a collection point of the biconcave lens is located on the optical axis.

Further, the laser shaping assembly further comprises a collimation fixing seat which is connected with the laser light source and used for correcting the light emitting direction of the light source into the same light as the laser shaping assembly, and the collimation fixing seat comprises a collimation fixing seat and a flange which is connected with the collimation fixing seat and the straight cylinder.

Further, the laser shaping assembly adjusts the circular light spot to a bar or rectangular laser light spot.

The invention relates to a micro LED BT plate laser scanning welding device, which comprises a chassis, a BT plate conveying mechanism arranged on the chassis, and a line laser for carrying out line laser welding on a BT plate on the BT plate conveying mechanism, wherein the line laser comprises a laser generator and a laser path mechanism for guiding laser output by the laser generator to a welding spot, and the laser path mechanism converts laser spots into rectangular laser spots with uniform energy density distribution in a projection plane. When the micro LED BT plate is used, the welding spots on the micro LED BT plate are scanned by using linear laser (line laser), and the linear laser is a rectangular laser spot with uniform energy density distribution in a laser vertical projection plane, wherein the laser spot is converted into the rectangular laser spot with uniform energy density distribution in the laser vertical projection plane by using a laser path mechanism, so that the temperature of each welding spot on the same field scanning line is basically the same, the melting time and the temperature of the welding spots on the same scanning line are basically the same, the quality consistency of the welding spots on the same scanning line is ensured, and after the whole micro LED BT plate is scanned, the quality of each welding spot is basically the same. On the one hand, the energy consumption is reduced, on the other hand, the consistency of welding quality can be protected, and meanwhile, the welding efficiency can be improved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the following brief description will be given of the drawings required for the description of the embodiments or the prior art, it being apparent that the drawings in the description only illustrate certain embodiments of the invention and should not be construed as limiting the scope, and that other relevant drawings can be obtained from these drawings without inventive effort to a person skilled in the art.

Fig. 1 is a schematic structural diagram of an embodiment of a micro LED BT board laser scanning welding device.

Fig. 2 is a schematic structural view of an embodiment of a BT plate conveyor mechanism.

Fig. 3 is a schematic structural diagram of an embodiment of a light path structure of an output stripe laser.

Fig. 4 is a schematic view of the structure along the vertical direction of the optical path.

Fig. 5 is a schematic view of the cross-sectional structure of fig. 4 taken along the direction F-F.

Fig. 6 is an exploded schematic view of the structure of the optical path of the output laser of the strip laser.

Fig. 7 is an enlarged schematic view of the portion a in fig. 5.

The achievement of the object, functional features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed Description

The claims hereof are to be read in further detail with reference to specific embodiments and to the accompanying drawings, in which the embodiments described are only some, but not all embodiments of the invention. Based on the embodiments of the present invention, one of ordinary skill in the art would be able to devise all other embodiments that are obtained without inventive effort and that are within the scope of the present invention.

It should be understood that, in the embodiments of the present invention, all directional terms, such as "upper", "lower", "left", "right", "front", "rear", etc., are used for convenience in describing the present invention only and are not intended to be limiting, since the directional terms, such as "upper", "lower", "left", "right", "front", "rear", etc., are based on the orientation, positional relationship shown in the drawings or the orientation or positional relationship in which the inventive product is conventionally put in use. Merely to explain the relative positional relationship, movement, etc. between the components shown in the drawings, the directional indication may be changed when the specific posture is changed.

Furthermore, ordinal words such as "first," "second," and the like in the description of the present invention are used for distinguishing purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features indicated. The features defining "first", "second" may be explicit or implicit and at least one of the features. In the description of the present invention, the meaning of "plurality" means at least two, i.e., two or more, unless otherwise specifically defined; the meaning of "at least one" is one or more.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly, and may, for example, be defined as having a relatively fixed positional relationship between components, as having a physically fixed connection between components, as being detachably connected, or as a unitary structure; the connection can be mechanical connection or electric signal connection; can be directly connected or indirectly connected through intermediate media or components; the communication between two elements or the interaction relationship between two elements is not limited by the specification, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to the specific circumstances except that the corresponding function or effect cannot be achieved when other understanding is made.

The invention, if related to a controller, a control circuit is a control technology or a unit conventional to a person skilled in the art, and the control circuit of the controller can be implemented by a person skilled in the art by adopting existing, such as simple programming. The software or program for realizing the control result in cooperation with the hardware is used as the conventional technology of the prior art or the person skilled in the art if the description does not show the control process of the related software or program in detail. The power supply also adopts the prior art in the field, and the main technical point of the invention is to improve the mechanical device, so the invention does not describe specific circuit control relation and circuit connection in detail.

The disclosure of the present invention provides many different embodiments or examples for implementing different structures of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described herein. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.

1-2, the invention provides an embodiment of a laser scanning welding device suitable for micro LED BT plates.

The micro LED BT plate laser scanning welding device comprises a chassis, a BT plate conveying mechanism arranged on the chassis and a line laser for carrying out line laser welding on the BT plate conveying mechanism, wherein the line laser comprises a laser generator and a laser path mechanism for guiding laser output by the laser generator to a welding spot, and the laser path mechanism converts laser spots into rectangular laser spots with uniform energy density distribution in a projection plane.

Specifically, the case is provided with two parallel brackets, two sliding rails are arranged on the brackets, and a laser path seat for fixing a laser path mechanism is arranged between the two sliding rails. The BT plate conveying mechanism is provided with two parallel conveying frames, BT plate fixing seats arranged on the two conveying frames and used for fixing BT plates, and a driving mechanism used for driving the BT plate fixing seats to move along the conveying frames. The driving mechanism comprises motors and gears driven by the motors, which are respectively arranged on the two conveying frames, and a transmission part matched with the gears. The transmission member includes a chain.

When the micro LED BT plate is welded, the welding spots on the micro LED BT plate are scanned by adopting linear laser (line laser), and the linear laser converts laser spots into linear or bar-shaped laser with uniform energy density distribution in a laser vertical projection plane through a laser light path mechanism, so that the temperature of each welding spot on the same scanning line is basically the same, the melting time and the temperature of the welding spots on the same scanning line are basically the same, the quality consistency of the welding spots on the same scanning line is ensured, and after the whole micro LED BT plate is scanned, the quality of each welding spot is basically the same. On the one hand, the energy consumption is reduced, on the other hand, the consistency of welding quality can be protected, and meanwhile, the welding efficiency can be improved.

The laser wavelength and the laser power can be determined according to the requirements of the solder and the BT plate, for example, the rated power is 1000W, and the actual output power is 7-800W, so that the device has an expandable space, and the applicability of the device is improved. The scanning speed can be set according to the requirement when the line laser is used for scanning and welding.

As shown in fig. 3-7, the laser light path structure takes a round light spot adjusting and converting rectangular light spots as an example, and the laser light path structure comprises a laser shaping component for shaping input laser, so that the input laser light spots with uneven energy distribution are adjusted to the laser light spots with even output energy distribution, and the laser shaping component comprises a first shaping lens, a second shaping lens and a third shaping lens which are sequentially arranged on the same optical axis of a light source from near to far.

Specifically, the laser shaping assembly adjusts the circular spot to a bar or rectangular laser spot. The optical axes of the first shaping lens, the second shaping lens and the third shaping lens are on the same straight line. The first shaping lens comprises a first lens body, the first lens body is a plane on one side surface of incident light, the one side surface of emergent light is an inward concave surface, and the concave surface forms a groove-shaped structure on the surface of the first lens body in one direction. The second shaping lens comprises a second lens body, the surface of the second lens body, which is close to one side of the first shaping lens, is arc-shaped, the surface of one side, which is opposite to the arc-shaped surface, is plane, the arc-shaped surface forms a first arch structure in one direction, and the first arch structure and the groove-shaped structure are mutually perpendicular. The third plastic lens comprises a third lens body, the surface of the third lens body, which is close to one side of the second plastic lens, is arc-shaped, the surface of one side, which is opposite to the arc-shaped surface, is plane, the arc-shaped surface forms a second arch structure in one direction, and the second arch structure is mutually perpendicular to the groove-shaped structure. The laser shaping assembly further comprises an upper shaping fixing seat and a lower shaping fixing seat, the upper shaping fixing seat and the lower shaping fixing seat are matched to form an installation cavity for installing the first shaping lens, the second shaping lens and the third shaping lens, through holes communicated with the installation cavity are formed in the upper shaping fixing seat and the lower shaping fixing seat along the optical axis direction, and the distance between the first shaping lens and the second shaping lens is smaller than the distance between the second shaping lens and the third shaping lens.

According to the requirement, the laser shaping assembly further comprises an installation seat with a fixing hole and a straight cylinder with one end positioned in the fixing hole, wherein the installation seat and the laser shaping assembly are arranged on the same optical axis, and a condensing lens is fixed at the end part of the straight cylinder positioned in the fixing hole. The condensing lens is a double-sided concave lens, and the collecting point of the double-sided concave lens is positioned on the optical axis.

The laser shaping assembly further comprises a collimation fixing seat which is connected with the laser light source and used for correcting the light emitting direction of the light source into the same light as the laser shaping assembly, and the collimation fixing seat comprises a collimation fixing seat and a flange which is connected with the collimation fixing seat and the straight cylinder.

According to the requirement, the laser shaping assembly further comprises a protective lens fixed with the lower shaping fixing seat.

The laser path structure can be at least basically the same as the energy density of the cross section facula in the direction perpendicular to the optical axis in the laser light emitting direction, can be widely used for laser welding, such as laser scanning welding dense arrays, such as MIN LEDs, MICRO LEDs and other scenes, and can protect the same or smaller energy difference of the part irradiated by the spot during scanning when the field scanning welding is carried out, thereby avoiding the occurrence of welding defects caused by local overhigh temperature and local insufficient temperature when uneven occurs, improving the welding quality, and improving the scanning welding efficiency when the output is a rectangular light source.

The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be replaced with other technical solutions, which may not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (16)

1. The utility model provides a be applicable to micro LED BT board laser scanning welding set, includes quick-witted case and locates the BT board conveying mechanism of machine case to and carry out line laser welding's line laser to BT board on the BT board conveying mechanism, its characterized in that, this line laser includes laser generator and guides the laser beam path mechanism of solder joint with the laser that laser generator output, this laser beam path mechanism converts the laser facula into the rectangle laser facula that energy density distributes evenly with the projection plane.

2. The laser scanning welding device for the micro Light Emitting Diode (LED) BT plate according to claim 1, wherein the case is provided with two parallel brackets, two sliding rails are arranged on the brackets, and a laser path seat for fixing a laser path mechanism is arranged between the two sliding rails.

3. The laser scanning and welding device for micro LED BT plates according to claim 2, wherein the BT plate transporting mechanism is provided with two parallel transporting frames and BT plate fixing seats provided on the two transporting frames for fixing BT plates, and a driving mechanism for driving the BT plate fixing seats to move along the transporting frames.

4. The laser scanning welding device for the micro LED BT plate according to claim 3, wherein the driving mechanism comprises a motor and a gear driven by the motor, which are respectively arranged on the two conveying frames, and a transmission part matched with the gear.

5. The laser scanning welding apparatus for micro LED BT plates of claim 4, wherein said transmission member comprises a chain.

6. The laser scanning and welding device for micro LED BT board according to claim 1, wherein the laser path mechanism comprises a laser shaping assembly for shaping the input laser, so that the laser spot with uneven energy distribution is adjusted to the laser spot with even output energy distribution, and the laser shaping assembly comprises a first shaping lens, a second shaping lens and a third shaping lens sequentially arranged on the same optical axis of the light source from the near to the far.

7. The laser scanning welding apparatus for micro LED BT board of claim 6, wherein said first shaping lens, second shaping lens and third shaping lens are on the same straight line.

8. The laser scanning welding apparatus for micro LED BT board according to claim 7, wherein said first shaping lens comprises a first lens body having a plane on an incident light side surface and an outgoing light side surface having an inward concave surface, wherein the concave surface forms a groove-like structure on the first lens body surface in one direction.

9. The laser scanning and welding device for micro LED BT board according to claim 8, wherein said second shaping lens comprises a second lens body, a surface of said second lens body on a side close to said first shaping lens is arc-shaped, a surface on a side opposite to said arc-shaped surface is plane, said arc-shaped surface forms a first arch structure in one direction, and said first arch structure is perpendicular to said groove-like structure.

10. The laser scanning and welding device for micro LED BT board according to claim 9, wherein said third shaping lens comprises a third lens body, a surface of said third lens body on a side close to said second shaping lens is arc-shaped, a surface on a side opposite to said arc-shaped surface is plane, said arc-shaped surface forms a second arch structure in one direction, and said second arch structure is perpendicular to said groove-shaped structure.

11. The laser scanning and welding device for micro LED BT board according to claim 10, wherein said laser shaping assembly further comprises an upper shaping fixing seat and a lower shaping fixing seat, said upper shaping fixing seat and said lower shaping fixing seat cooperate to form a mounting cavity for mounting said first shaping lens, said second shaping lens and said third shaping lens, said upper shaping fixing seat and said lower shaping fixing seat are provided with through holes communicating with said mounting cavity along the optical axis direction, and the distance between said first shaping lens and said second shaping lens is smaller than the distance between said second shaping lens and said third shaping lens.

12. The laser scanning welding apparatus for micro LED BT board of claim 11, further comprising a protective lens secured to said lower shaping mount.

13. The laser scanning and welding device for the micro LED BT plate according to claim 11, wherein the laser shaping assembly further comprises a mounting seat with a fixing hole and a straight cylinder with one end positioned in the fixing hole, wherein the mounting seat and the laser shaping assembly are arranged on the same optical axis, and a condensing lens is fixed at the end part of the straight cylinder positioned in the fixing hole.

14. The laser scanning welding apparatus for micro LED BT board according to claim 13, wherein said condensing lens is a biconcave lens, and a collection point of said biconcave lens is located on an optical axis.

15. The laser scanning and welding device for micro LED BT board according to claim 13, wherein said laser shaping assembly further comprises a collimation fixing base for connecting with the laser light source to correct the light emitting direction of the light source to be identical to the light of the laser shaping assembly, said collimation fixing base comprising a collimation fixing base and a flange connecting the collimation fixing base and the straight barrel.

16. The laser scanning welding apparatus for micro LED BT plates of claim 1, wherein said laser shaping assembly adjusts the circular spot to a bar or rectangular laser spot.