CN116875936A - Uniform nitriding device for high-density plasma on surface of soft base material and working method - Google Patents
Uniform nitriding device for high-density plasma on surface of soft base material and working method Download PDFInfo
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Abstract
Description
技术领域Technical field
本发明涉及软基材料表面强化技术领域,具体领域为一种软基材料表面高密度等离子体均匀渗氮装置及工作方法。The invention relates to the technical field of surface strengthening of soft base materials. The specific field is a high-density plasma uniform nitriding device and working method on the surface of soft base materials.
背景技术Background technique
高速钢、不锈钢等(软基材料)因其优异的物理和机械特性,如耐腐蚀特性、良好的塑性和光洁度等,在工业生产中具有广泛的应用。然而,高速钢、不锈钢材料的硬度和耐磨性较低,在严苛的服役环境中,内表面会因为高温氧化﹑摩擦和腐蚀等作用产生裂纹,严重影响使用寿命,造成大量的经济损失。面对复杂严苛服役环境时,为了获得更好的综合性能,需要对其进行特定渗氮表面强化处理以提高使用寿命和保障服役安全。High-speed steel, stainless steel, etc. (soft base materials) are widely used in industrial production due to their excellent physical and mechanical properties, such as corrosion resistance, good plasticity and smoothness, etc. However, the hardness and wear resistance of high-speed steel and stainless steel materials are low. In harsh service environments, the inner surface will crack due to high-temperature oxidation, friction and corrosion, seriously affecting the service life and causing a large amount of economic losses. When faced with complex and harsh service environments, in order to obtain better overall performance, specific nitriding surface strengthening treatment is required to increase service life and ensure service safety.
目前,虽然可以通过电镀和化学镀的方法对内表面进行处理,但是由于均匀性差、电镀沉积的材料少、对内表面的形貌有影响以及污染环境等问题,本领域研究人员一直在寻求一种更加优异的技术方案。At present, although the inner surface can be treated by electroplating and chemical plating, researchers in this field have been looking for a solution due to problems such as poor uniformity, less material deposited by electroplating, impact on the morphology of the inner surface, and environmental pollution. A better technical solution.
在相对较软的金属基材沉积涂层时,实际上相对较软的金属基材无法支撑薄的硬涂层,在高负载下会发生塑性变形导致涂层失效,所引发的“蛋壳效应”会降低涂层表面的承载能力,从而限制其工作性能。而表面渗氮是公认的提高不锈钢硬度和耐磨性的一种经济且有效的处理手段,经过渗氮处理后的不锈钢表面会形成一层具有高硬度的过饱和固溶相,这会大大提升不锈钢表面的硬度和耐磨性,延长了使用寿命。因此需要对软基材料进行特定渗氮表面强化处理,之后再对其进行表面硬质薄膜涂层处理。这种双重表面处理在提高相对较软基材的表面承载能力特别有效。When depositing a coating on a relatively soft metal substrate, the relatively soft metal substrate is actually unable to support a thin hard coating, and plastic deformation will occur under high load, causing coating failure, resulting in the "eggshell effect" ” will reduce the load-bearing capacity of the coating surface, thereby limiting its working performance. Surface nitriding is recognized as an economical and effective treatment method to improve the hardness and wear resistance of stainless steel. After nitriding treatment, the surface of stainless steel will form a layer of supersaturated solid solution phase with high hardness, which will greatly improve the hardness and wear resistance of stainless steel. The hardness and wear resistance of the stainless steel surface extend the service life. Therefore, it is necessary to perform specific nitriding surface strengthening treatment on the soft base material, and then perform surface hard film coating treatment on it. This dual surface treatment is particularly effective in improving the surface load-bearing capacity of relatively soft substrates.
而在众多渗氮技术中,渗镀一体化大规模工业化生产中常常存在着渗氮不均匀、渗氮相结构无法精准调控、异型基材表面容易出现打火现象、边缘效应、温升效应、渗镀无法一体化、装载量加大产生电子屏蔽效应等问题,从而导致在工业生产中等离子体渗氮无法实现大尺寸和大批量零件稳定生产。Among many nitriding technologies, in the large-scale industrial production of integrated nitriding and plating, there are often problems such as uneven nitriding, inability to accurately control the nitriding phase structure, and prone to sparking, edge effects, temperature rise effects, etc. on the surface of special-shaped substrates. Problems such as the inability to integrate infiltration plating and the electronic shielding effect caused by increased loading capacity make plasma nitriding unable to achieve stable production of large-size and large-volume parts in industrial production.
如:CN115261777A公开了一种优化管内壁离子渗氮的装置及方法,该装置采用多弧离子镀等离子体源,属于一种多弧渗氮装置,该类装置无法避免尖端零件的表面打火现象、无法实现等离子密度区域的调节、无法实现工业化大规模的装载量及渗氮的均匀性等问题。For example: CN115261777A discloses a device and method for optimizing ion nitriding of the inner wall of a tube. The device uses a multi-arc ion plating plasma source and is a multi-arc nitriding device. This type of device cannot avoid surface sparking of tip parts. , Problems such as the inability to adjust the plasma density area, the inability to achieve industrial large-scale loading and the uniformity of nitriding.
发明内容Contents of the invention
本发明的目的在于提供一种软基材料表面高密度等离子体均匀渗氮装置及工作方法,该装置可实现通过耦合PVD多弧离子源和辅助阳极的磁场分布获得沿轴向分布的可调磁镜比的多级磁场,实现360°侧向可变特性参数的可伸缩环形等离子体,使之实现真正意义上的渗镀一体。The object of the present invention is to provide a device and working method for high-density plasma uniform nitriding on the surface of soft base materials. The device can achieve an axially distributed adjustable magnetic field by coupling the magnetic field distribution of a PVD multi-arc ion source and an auxiliary anode. The mirror-ratio multi-level magnetic field realizes a scalable annular plasma with 360° lateral variable characteristic parameters, making it a true integration of penetration and plating.
为实现上述目的,本发明提供如下技术方案:In order to achieve the above objects, the present invention provides the following technical solutions:
一种软基材料表面高密度等离子体均匀渗氮装置,包括分别设置在腔室内的左侧、右侧、前侧和后侧的4个弧源,每个所述弧源的后方设置有一个永磁铁装置,每个弧源均与一个弧源电源的负极电连接,所述弧源电源的正极接地;还包括分别设置在腔室内的四角上的4个辅助阳极;每个辅助阳极的后方设置有电磁线圈;每个辅助阳极均通过一个可调节电阻与一个辅阳电源的正极电连接,所述辅阳电源的负极接地。A high-density plasma uniform nitriding device for the surface of soft base materials, including 4 arc sources respectively arranged on the left, right, front and rear sides of the chamber, with an arc source provided behind each arc source Permanent magnet device, each arc source is electrically connected to the negative pole of an arc source power supply, the positive pole of the arc source power supply is grounded; it also includes 4 auxiliary anodes respectively arranged at the four corners of the chamber; behind each auxiliary anode An electromagnetic coil is provided; each auxiliary anode is electrically connected to the positive pole of an auxiliary anode power supply through an adjustable resistor, and the negative pole of the auxiliary anode power supply is grounded.
进一步的,所述的电磁线圈具有可调节性,通过调节和永磁铁装置的磁场进行耦合,实现沿轴向分布的可调磁镜比的多级磁场,实现360°侧向可变特性参数的可伸缩环形等离子体,实现了均匀浸没等离子体渗氮。Furthermore, the electromagnetic coil is adjustable and can be coupled with the magnetic field of the permanent magnet device to achieve a multi-level magnetic field with an adjustable magnetic mirror ratio distributed along the axial direction, thereby achieving 360° lateral variable characteristic parameters. The retractable annular plasma realizes uniform immersion plasma nitriding.
进一步的,所述弧源连接的弧源电源可调节电流大小,通过调节弧源电源的电流大小,进而控制弧源发射电子的能力,从而控制等离子的密度来调控被渗软件材料的成分和结构。Furthermore, the arc source power supply connected to the arc source can adjust the current size. By adjusting the current size of the arc source power supply, the ability of the arc source to emit electrons is controlled, thereby controlling the density of plasma to regulate the composition and structure of the infiltrated software material. .
进一步的,所述辅助阳极连接的辅阳电源可调节电流大小性,通过调节辅阳电源的电流大小,进而控制辅助阳极吸收弧源发生的电子,从而控制等离子的密度来调控被渗软件材料的成分和结构。Furthermore, the auxiliary anode power supply connected to the auxiliary anode can adjust the current size. By adjusting the current size of the auxiliary anode power supply, the auxiliary anode is controlled to absorb the electrons generated by the arc source, thereby controlling the density of the plasma to regulate the density of the infiltrated software material. Composition and structure.
进一步的,腔室中部设有转架。Furthermore, a turntable is provided in the middle of the chamber.
进一步的,所述转架上装载有被渗件软基材料。Furthermore, the soft base material to be infiltrated is loaded on the turntable.
进一步的,弧源电源和辅阳电源可以是脉冲电源也可以是直流电源,电源具有可调节性,弧源的正极和辅助阳极的负极都连接真空腔室,其中真空腔室接地。Furthermore, the arc source power supply and the auxiliary anode power supply can be pulse power supplies or DC power supplies. The power supplies are adjustable. The positive electrode of the arc source and the negative electrode of the auxiliary anode are both connected to the vacuum chamber, and the vacuum chamber is grounded.
进一步的,通过可调节电阻可调节辅助阳极的电流。Furthermore, the current of the auxiliary anode can be adjusted through an adjustable resistor.
进一步的,每个电磁线圈均与一个单独的直流电源电连接。Further, each electromagnetic coil is electrically connected to a separate DC power supply.
本发明软基材料表面高密度等离子体均匀渗氮装置的工作方法,具体为:The working method of the high-density plasma uniform nitriding device on the surface of soft base materials of the present invention is specifically as follows:
弧源蒸发的大量电子受到腔室中辅助阳极的牵引,并通过调节永磁铁装置和电磁线圈耦合的磁场分布区域,大量电子在电磁场的作用下进行螺旋运动充满腔室进行离化通入的气体原子,使气体原子形成等离子状态注入并扩散装载在转架上的被渗件软基材料的内部进行渗氮;通过可调节电阻调节辅助阳极电流大小,调控吸收电子的能力,保证电子所电离的等离子体区域延伸浸没所渗软基材料,实现精准调控渗氮成分和结构;A large number of electrons evaporated from the arc source are pulled by the auxiliary anode in the chamber, and by adjusting the magnetic field distribution area coupled by the permanent magnet device and the electromagnetic coil, a large number of electrons perform spiral motion under the action of the electromagnetic field, filling the chamber for ionization of the incoming gas. atoms, so that the gas atoms form a plasma state and are injected and diffused into the soft base material of the infiltrated parts loaded on the turntable for nitriding; the auxiliary anode current is adjusted through the adjustable resistance to regulate the ability to absorb electrons to ensure that the electrons are ionized The plasma area extends and immerses the infiltrated soft base material to achieve precise control of the nitriding composition and structure;
或者,通过调节永磁铁装置的位置来耦合电磁线圈的磁场,实现沿腔室周向分布的可调磁镜比的多级磁镜场进行等离子体渗氮工作;Alternatively, by adjusting the position of the permanent magnet device to couple the magnetic field of the electromagnetic coil, a multi-level magnetic mirror field with an adjustable magnetic mirror ratio distributed along the circumference of the chamber can be realized for plasma nitriding work;
或者,通过调节弧源的电流耦合辅助阳极的电场,实现等离子体密度和能量的调控,进而完成被渗件软基材料的渗氮工作。Alternatively, the electric field of the arc source coupled with the auxiliary anode can be adjusted to control the plasma density and energy, thereby completing the nitriding work of the soft base material to be infiltrated.
本装置的技术原理:弧源产生的大量电子受到腔室中阳极的牵引,并在永磁铁装置和电磁线圈耦合的磁增强装置下进行螺旋运动充满腔室,且离化通入的气体原子,使气体原子形成等离子状态注入并扩散软基材料的内部进行渗氮。The technical principle of this device: A large number of electrons generated by the arc source are pulled by the anode in the chamber, and perform spiral motion under the magnetic enhancement device coupled with the permanent magnet device and the electromagnetic coil to fill the chamber, and ionize the gas atoms introduced, The gas atoms are injected into a plasma state and diffused inside the soft base material for nitriding.
与常规的多弧渗氮装置相比,本装置不仅可通过调节辅阳电磁线圈电流的大小,来控制耦合磁场的分布区域,控制弧源产生的大量电子在电磁场的作用下的运动轨迹,从而控制等离子体密度区域,实现均匀浸没等离子体渗氮,进而精准调控渗氮成分和结构;同时可以避免工业化大规模装载时电子屏蔽效应的产生。Compared with the conventional multi-arc nitriding device, this device can not only control the distribution area of the coupling magnetic field by adjusting the current of the auxiliary anode electromagnetic coil, but also control the movement trajectory of a large number of electrons generated by the arc source under the action of the electromagnetic field, thereby Control the plasma density area to achieve uniform immersion plasma nitriding, thereby accurately controlling the nitriding composition and structure; at the same time, it can avoid the electronic shielding effect during industrial large-scale loading.
与现有技术相比,本发明的有益效果是:Compared with the prior art, the beneficial effects of the present invention are:
(1)该装置实现了大面积靶材(直径160mm)弧源结构均匀放电,产生更多的电子,进行离化气体原子。(1) This device achieves uniform discharge of the arc source structure of a large-area target (diameter 160mm), generates more electrons, and ionizes gas atoms.
(2)该装置基于磁镜场扫描和大面积靶弧源结构的多弧离子源技术,通过耦合多弧离子源和辅助阳极的磁场分布获得沿轴向分布的可调磁镜比的多级磁场,实现360°侧向可变特性参数的可伸缩环形等离子体,实现了均匀浸没等离子体渗氮。(2) The device is based on the multi-arc ion source technology of magnetic mirror field scanning and large-area target arc source structure. By coupling the magnetic field distribution of the multi-arc ion source and the auxiliary anode, a multi-level adjustable magnetic mirror ratio distributed along the axial direction is obtained. Magnetic field realizes 360° lateral variable characteristic parameters of scalable annular plasma, achieving uniform immersion plasma nitriding.
(3)该装置可通过调节辅阳电磁线圈电流的大小来控制耦合的磁场分布区域,进而控制等离子体密度和能量,进而精准调控渗氮成分和结构。(3) The device can control the coupled magnetic field distribution area by adjusting the current of the auxiliary anode electromagnetic coil, thereby controlling the plasma density and energy, and thereby accurately regulating the nitriding composition and structure.
(4)该装置可通过调节辅阳电流来控制吸收电子的能力,从而控制等离子体的密度,进而精准调控渗氮成分和结构。(4) The device can control the ability to absorb electrons by adjusting the auxiliary anode current, thereby controlling the density of the plasma and thereby accurately regulating the nitriding composition and structure.
(5)该装置可将电子约束在靶-辅阳的炉体侧面区域,提高了被渗件软基材料周围等离子的密度和能量,同时软基零件进行三维转动,更多离子到达渗区,保证膜层致密度。(5) This device can confine electrons to the side area of the furnace body of the target-auxiliary sun, which increases the density and energy of plasma around the soft base material of the infiltrated part. At the same time, the soft base part rotates in three dimensions, and more ions reach the infiltration area. Ensure the density of the film layer.
(6)该装置在侧面等离子体渗氮,一方面提高了工业生产的装载量,另一方面避免了满载时产生电子屏蔽效应。(6) The device has plasma nitriding on the side, which on the one hand increases the loading capacity of industrial production and on the other hand avoids the electron shielding effect when fully loaded.
附图说明Description of the drawings
图1为软基材料表面高密度等离子体均匀渗氮装置的结构示意图。Figure 1 is a schematic structural diagram of a high-density plasma uniform nitriding device on the surface of soft base materials.
其中,100-腔室;1-弧源;2-永磁铁装置;3-辅助阳极;4-可调节电阻;5-电磁线圈;6-转架;7-弧源电源;8-辅阳电源;9-被渗件软基材料。Among them, 100-chamber; 1-arc source; 2-permanent magnet device; 3-auxiliary anode; 4-adjustable resistance; 5-electromagnetic coil; 6-turret; 7-arc source power supply; 8-auxiliary anode power supply ; 9-Soft base material to be penetrated.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
实施例1Example 1
如图1所示,一种软基材料表面高密度等离子体均匀渗氮装置,包括分别设置在腔室100内的左侧、右侧、前侧和后侧的4个弧源1,弧源1是电子发生源,每个所述弧源1的后方设置有一个永磁铁装置2。As shown in Figure 1, a high-density plasma uniform nitriding device for the surface of soft base materials includes four arc sources 1 respectively arranged on the left, right, front and rear sides of the chamber 100. The arc sources 1 is an electron generating source, and a permanent magnet device 2 is provided behind each arc source 1.
每个弧源1均与一个弧源电源7的负极电连接,其中,所述弧源电源7的正极接地;还包括分别设置在腔室100内的四角上的4个辅助阳极3;每个辅助阳极3的后方设置有电磁线圈5。辅助阳极3作为电子收集器,对弧源1产生的电子有一定的牵引作用;所述电磁线圈5与永磁铁装置2进行磁场的耦合,通过耦合电磁线圈5和永磁铁装置2的磁场分布获得沿轴向分布的可调磁镜比的多级磁场,从而使得弧源1产生的电子在电磁场的作用下进行螺旋运动,到达辅助阳极3被吸收。Each arc source 1 is electrically connected to the negative electrode of an arc source power supply 7, wherein the positive electrode of the arc source power supply 7 is grounded; it also includes four auxiliary anodes 3 respectively provided at the four corners of the chamber 100; each An electromagnetic coil 5 is provided behind the auxiliary anode 3 . The auxiliary anode 3 serves as an electron collector and has a certain traction effect on the electrons generated by the arc source 1; the electromagnetic coil 5 and the permanent magnet device 2 perform magnetic field coupling, and the magnetic field distribution obtained by coupling the electromagnetic coil 5 and the permanent magnet device 2 is obtained The multi-level magnetic field with adjustable magnetic mirror ratio distributed along the axial direction causes the electrons generated by the arc source 1 to perform spiral motion under the action of the electromagnetic field, and reach the auxiliary anode 3 to be absorbed.
每个辅助阳极3均通过一个可调节电阻4与一个辅阳电源8的正极电连接,所述辅阳电源8的负极接地。Each auxiliary anode 3 is electrically connected to the positive electrode of an auxiliary anode power source 8 through an adjustable resistor 4, and the negative electrode of the auxiliary anode power source 8 is grounded.
位于腔室100左侧的辅阳电源8的正极分别与一个可调节电阻4电连接,两个可调节电阻4分别与位于腔室100左侧的两个辅助阳极3连接,从而与弧源电路形成并联电路;位于腔室100右侧的辅阳电源8的正极分别与一个可调节电阻4电连接,两个可调节电阻4分别与位于腔室100右侧的两个辅助阳极3连接,从而与弧源电路形成并联电路。辅阳电源8具有可调节性。The positive electrode of the auxiliary anode power supply 8 located on the left side of the chamber 100 is electrically connected to an adjustable resistor 4 respectively, and the two adjustable resistors 4 are respectively connected to the two auxiliary anodes 3 located on the left side of the chamber 100, thereby connecting with the arc source circuit. A parallel circuit is formed; the positive electrode of the auxiliary anode power supply 8 located on the right side of the chamber 100 is electrically connected to an adjustable resistor 4, and the two adjustable resistors 4 are respectively connected to the two auxiliary anodes 3 located on the right side of the chamber 100, so that Form a parallel circuit with the arc source circuit. The auxiliary Yang power supply 8 is adjustable.
可调节电阻4可以调节辅助阳极3的电流的大小控制吸收电子的能力,控制等离子体密度,进而精准调控渗氮成分和结构。The adjustable resistor 4 can adjust the current of the auxiliary anode 3 to control the ability to absorb electrons, control the plasma density, and thereby accurately control the nitriding composition and structure.
腔室100中部设有转架6,转架6上装载有渗氮的基材零件,即被渗件软基材料9,被渗件软基材料9按照一定的方向进行三维的自转和公转运动。There is a rotating frame 6 in the middle of the chamber 100. The rotating frame 6 is loaded with nitrided base material parts, that is, the soft base material 9 to be infiltrated. The soft base material 9 to be infiltrated performs three-dimensional rotation and revolution motion in a certain direction. .
弧源电源7负极连接弧源,正极接地,其弧源电源7具有可调节性,同时腔室100的电位也接地。The negative pole of the arc source power supply 7 is connected to the arc source, and the positive pole is grounded. The arc source power supply 7 is adjustable, and the potential of the chamber 100 is also grounded.
每个电磁线圈5均与一个单独的直流电源电连接,其电源具有可调节性。Each electromagnetic coil 5 is electrically connected to an independent DC power supply, and its power supply is adjustable.
弧源1蒸发的大量电子受到腔室100中辅助阳极3的牵引,并通过调节永磁铁装置2和电磁线圈5耦合的磁场分布区域,大量电子在电磁场的作用下进行螺旋运动充满腔室进行离化通入的气体原子,使气体原子形成等离子状态注入并扩散装载在转架6上的被渗件软基材料9的内部进行渗氮。通过可调节电阻4调节辅助阳极电流大小,导致吸收电子的能力精准调控,保证电子所电离的等离子体区域延伸浸没所渗软基材料,实现精准调控渗氮成分和结构。A large number of electrons evaporated from the arc source 1 are pulled by the auxiliary anode 3 in the chamber 100, and by adjusting the magnetic field distribution area coupled with the permanent magnet device 2 and the electromagnetic coil 5, a large number of electrons perform spiral motion under the action of the electromagnetic field and fill the chamber for separation. The introduced gas atoms are transformed into a plasma state and are injected and diffused into the interior of the soft base material 9 to be infiltrated loaded on the turntable 6 for nitriding. The size of the auxiliary anode current is adjusted through the adjustable resistor 4, resulting in precise control of the ability to absorb electrons, ensuring that the plasma area ionized by the electrons extends and immerses the soft base material to be infiltrated, thereby achieving precise control of the nitriding composition and structure.
该装置不仅可通过调节电磁线圈电流的大小耦合永磁铁的磁场分布区域,来控制弧源蒸发产生的大量电子在电磁场的作用下的运动轨迹,从而控制等离子体密度区域,实现360°侧向可变特性参数的可伸缩环形等离子体,进而精准调控渗氮成分和结构;同时,可以避免工业化大规模的装载时电子屏蔽效应的产生。This device can not only control the movement trajectory of a large number of electrons generated by arc source evaporation under the action of the electromagnetic field by adjusting the size of the electromagnetic coil current and coupling the magnetic field distribution area of the permanent magnet, thereby controlling the plasma density area and achieving 360° lateral visibility. The scalable annular plasma with variable characteristic parameters can precisely control the nitriding composition and structure; at the same time, it can avoid the electronic shielding effect during industrial large-scale loading.
实施例2Example 2
与实施例1的区别在于:弧源1产生的大量电子受到腔室100中辅助阳极3的牵引,通过调节永磁铁装置2位置来耦合电磁线圈5的磁场,实现沿腔室周向分布的可调磁镜比的多级磁镜场进行等离子体渗氮工作。The difference from Embodiment 1 is that a large number of electrons generated by the arc source 1 are pulled by the auxiliary anode 3 in the chamber 100, and the magnetic field of the electromagnetic coil 5 is coupled by adjusting the position of the permanent magnet device 2 to achieve a reliable distribution along the circumference of the chamber. The multi-level magnetic mirror field with adjustable magnetic mirror ratio is used for plasma nitriding work.
实施例3Example 3
与实施例1的区别在于:弧源1产生的大量电子受到腔室100中辅助阳极3的牵引,通过调节弧源1电流耦合辅助阳极的电场,实现等离子体密度和能量的调控,进而完成被渗件软基材料的渗氮工作。The difference from Embodiment 1 is that a large number of electrons generated by the arc source 1 are pulled by the auxiliary anode 3 in the chamber 100. By adjusting the electric field of the current coupling auxiliary anode of the arc source 1, the plasma density and energy are controlled, thereby completing the process. Nitriding work for soft base materials.
应用实例Applications
316L奥氏体不锈钢热电偶(thermocouple)是温度测量仪表中常用的测温元件,它用于直接测量温度,并把温度信号转换成热电动势信号,通过电气仪表转换成被测介质的温度。热电偶工作过程会导致其性能不稳定、测量精度低、热响应时间延长、热电势率较小、机械强度差、使用寿命短、整体效率低等问题。这些因素严重地制约了奥氏体不锈钢热电偶的发展和推广应用。面对复杂严苛服役环境时,为了获得更好的综合性能,需要对其进行特定渗氮表面强化处理以提高使用寿命和保障服役安全。选用奥氏体不锈钢的热电偶样品(直径20mmX5mm)作为基体材料,基材表面硬度为300HV0.05,316L austenitic stainless steel thermocouple (thermocouple) is a commonly used temperature measuring element in temperature measuring instruments. It is used to directly measure temperature, convert the temperature signal into a thermoelectromotive force signal, and convert it into the temperature of the measured medium through an electrical instrument. The working process of thermocouples will lead to problems such as unstable performance, low measurement accuracy, prolonged thermal response time, small thermoelectric potential rate, poor mechanical strength, short service life, and low overall efficiency. These factors have seriously restricted the development and popularization of austenitic stainless steel thermocouples. When faced with complex and harsh service environments, in order to obtain better overall performance, specific nitriding surface strengthening treatment is required to increase service life and ensure service safety. An austenitic stainless steel thermocouple sample (diameter 20mmX5mm) is selected as the base material. The surface hardness of the base material is 300HV 0.05 .
经过实施例1的软基材料表面高密度等离子体均匀渗氮装置进行渗氮处理之后,不锈钢热电偶软基材料的硬度从300HV,提高到了1789HV。同时对渗氮处理之后的不锈钢热电偶软基材料进行AlCrN涂层的制备,发现复合涂层的硬度和结合力(3986HV,100N)是单层涂层(1602HV,40N)的2.5倍左右。After the nitriding treatment by the high-density plasma uniform nitriding device on the surface of the soft base material in Example 1, the hardness of the stainless steel thermocouple soft base material increased from 300HV to 1789HV. At the same time, the AlCrN coating was prepared on the soft base material of the stainless steel thermocouple after nitriding treatment. It was found that the hardness and bonding strength of the composite coating (3986HV, 100N) were about 2.5 times that of the single-layer coating (1602HV, 40N).
这是因为渗氮层在基材和涂层之间产生硬度梯度,以减少基材和涂层系统的失配,进一步提高复合涂层的性能。This is because the nitrided layer creates a hardness gradient between the substrate and coating to reduce the mismatch between the substrate and coating systems, further improving the performance of the composite coating.
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art will understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principles and spirit of the invention. and modifications, the scope of the invention is defined by the appended claims and their equivalents.
Claims (10)
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1390975A (en) * | 2002-03-20 | 2003-01-15 | 太原理工大学 | Equipment and process for osmosizing and plating coated layer by ion beam intensified arc glow |
| KR20100105141A (en) * | 2009-03-20 | 2010-09-29 | 배진범 | Plasma nitrifying surface heat-treatment apparatus including auxiliary electrodes |
| JP2016156080A (en) * | 2015-02-26 | 2016-09-01 | 神港精機株式会社 | Ion nitriding treatment method and ion nitriding treatment device |
| WO2017122044A1 (en) * | 2016-01-13 | 2017-07-20 | Ion Heat S.A.S | Equipment for ion nitriding/nitrocarburizing treatment comprising two furnace chambers with shared resources, able to run glow discharge treatment continuously between the two chambers |
| WO2018172816A1 (en) * | 2017-03-22 | 2018-09-27 | Nci-Swissnanocoat Sa | Method for treating the surface of a titanium or titanium-alloy article and product thereof |
| CN208883972U (en) * | 2018-09-20 | 2019-05-21 | 昆山彰鑫金属真空热处理科技有限公司 | A kind of hot cathode high density arc discharge glow discharge nitriding equipment |
| CN115821200A (en) * | 2022-12-05 | 2023-03-21 | 哈尔滨工业大学 | Method and device for high-density plasma nitriding of inner surface of slender stainless steel pipe |
| CN220352214U (en) * | 2023-07-11 | 2024-01-16 | 南京质子源工程技术研究院有限公司 | Uniform nitriding device for high-density plasmas on surface of soft base material |
-
2023
- 2023-07-11 CN CN202310846904.5A patent/CN116875936B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1390975A (en) * | 2002-03-20 | 2003-01-15 | 太原理工大学 | Equipment and process for osmosizing and plating coated layer by ion beam intensified arc glow |
| KR20100105141A (en) * | 2009-03-20 | 2010-09-29 | 배진범 | Plasma nitrifying surface heat-treatment apparatus including auxiliary electrodes |
| JP2016156080A (en) * | 2015-02-26 | 2016-09-01 | 神港精機株式会社 | Ion nitriding treatment method and ion nitriding treatment device |
| WO2017122044A1 (en) * | 2016-01-13 | 2017-07-20 | Ion Heat S.A.S | Equipment for ion nitriding/nitrocarburizing treatment comprising two furnace chambers with shared resources, able to run glow discharge treatment continuously between the two chambers |
| WO2018172816A1 (en) * | 2017-03-22 | 2018-09-27 | Nci-Swissnanocoat Sa | Method for treating the surface of a titanium or titanium-alloy article and product thereof |
| CN208883972U (en) * | 2018-09-20 | 2019-05-21 | 昆山彰鑫金属真空热处理科技有限公司 | A kind of hot cathode high density arc discharge glow discharge nitriding equipment |
| CN115821200A (en) * | 2022-12-05 | 2023-03-21 | 哈尔滨工业大学 | Method and device for high-density plasma nitriding of inner surface of slender stainless steel pipe |
| CN220352214U (en) * | 2023-07-11 | 2024-01-16 | 南京质子源工程技术研究院有限公司 | Uniform nitriding device for high-density plasmas on surface of soft base material |
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