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CN116732567A - CuBi2O4/CuO photocathode surface modification method - Google Patents

CuBi2O4/CuO photocathode surface modification method Download PDF

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CN116732567A
CN116732567A CN202310846881.8A CN202310846881A CN116732567A CN 116732567 A CN116732567 A CN 116732567A CN 202310846881 A CN202310846881 A CN 202310846881A CN 116732567 A CN116732567 A CN 116732567A
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cubi
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杨欢
李纯纯
谢家乐
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Xian International University
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Abstract

The invention discloses a CuBi 2 O 4 CuO photocathode surface modification method by electrodepositing ZnO as CuBi 2 O 4 Protection layer of CuO photocathode. The invention improves the PEC performance of the photocathode and improves the stability of the photocathode.

Description

CuBi2O4/CuO光阴极表面修饰方法CuBi2O4/CuO photocathode surface modification method

技术领域Technical field

本发明属于光电化学技术领域,尤其涉及一种CuBi2O4/CuO光阴极表面修饰方法。The invention belongs to the technical field of photoelectrochemistry, and in particular relates to a CuBi 2 O 4 /CuO photocathode surface modification method.

背景技术Background technique

光电化学(PEC)水分解系统,以合理的成本提供了较高的光-氢转换效率,是一种具有发展潜力的技术。在PEC系统中,光阴极用于产氢,开发高效稳定的光阴极材料十分重要。CuBi2O4由于其带隙窄(1.5~1.8eV),导带位置接近于热力学析氢电位(0VRHE),较正的光电流起始电位(>1VRHE),具有较高的太阳能转化效率,其理论光电流密度最高可达到20mA/cm2,具有很大的应用潜力。然而,由于其空穴迁移率低、电子扩散长度有限,光生载流子复合严重、易发生光腐蚀等原因,导致CuBi2O4的光电流密度远低于理论光电流密度,在光电催化领域的应用受到很大的限制。Photoelectrochemical (PEC) water splitting systems provide high light-to-hydrogen conversion efficiency at a reasonable cost and are a technology with development potential. In the PEC system, the photocathode is used to produce hydrogen, and it is very important to develop efficient and stable photocathode materials. Due to its narrow band gap (1.5~1.8eV), CuBi2O4's conduction band position is close to the thermodynamic hydrogen evolution potential (0V RHE ), and its relatively positive photocurrent starting potential (>1V RHE ), it has high solar energy conversion efficiency. Its theory The photocurrent density can reach up to 20mA/cm 2 , which has great application potential. However, due to its low hole mobility, limited electron diffusion length, severe photogenerated carrier recombination, and susceptibility to photocorrosion, the photocurrent density of CuBi 2 O 4 is far lower than the theoretical photocurrent density. In the field of photoelectrocatalysis The application is greatly restricted.

发明内容Contents of the invention

本发明所要解决的技术问题在于针对上述现有技术中的不足,提供CuBi2O4/CuO光阴极表面修饰方法,提高了光阴极的PEC性能并提高光阴极的稳定性。The technical problem to be solved by the present invention is to provide a CuBi2O4/CuO photocathode surface modification method to improve the PEC performance of the photocathode and improve the stability of the photocathode in view of the above-mentioned deficiencies in the prior art.

本发明公开了一种CuBi2O4/CuO光阴极表面修饰方法,通过电沉积ZnO作为CuBi2O4/CuO光阴极的保护层。The invention discloses a method for surface modification of CuBi 2 O 4 /CuO photocathode, which uses electrodeposition of ZnO as a protective layer for the CuBi 2 O 4 /CuO photocathode.

上述技术方案,利用合适的沉积方法,在CuBi2O4/CuO光阴极表面制备高质量的保护层,可以有效减轻CuBi2O4/CuO光阴极的光腐蚀。通过电沉积ZnO作为CuBi2O4/CuO光阴极的保护层。在AM1.5G光照和0.2VRHE电位下,CuBi2O4/CuO/ZnO光阴极表现出了1.18mA/cm2的光电流密度,约为CuBi2O4/CuO光阴极电流密度的两倍。在涂覆ZnO层之后,在12h稳定性测试期间,CuBi2O4/CuO的电流保持率从58.3%提高到84%。实验结果表明,非晶ZnO覆盖层不仅可以作为保护层,同时,有效地改善了光阴极的电荷转移,并且提高了光阴极的电化学活性面积。The above technical solution uses appropriate deposition methods to prepare a high-quality protective layer on the surface of the CuBi 2 O 4 /CuO photocathode, which can effectively reduce the photocorrosion of the CuBi 2 O 4 /CuO photocathode. ZnO is electrodeposited as a protective layer for the CuBi 2 O 4 /CuO photocathode. Under AM1.5G illumination and 0.2VRHE potential, the CuBi 2 O 4 /CuO/ZnO photocathode exhibits a photocurrent density of 1.18mA/cm2, which is approximately twice the current density of the CuBi 2 O 4 /CuO photocathode. After coating the ZnO layer, the current retention rate of CuBi 2 O 4 /CuO increased from 58.3% to 84% during the 12h stability test. Experimental results show that the amorphous ZnO covering layer not only serves as a protective layer, but also effectively improves the charge transfer of the photocathode and increases the electrochemically active area of the photocathode.

本发明与现有技术相比具有以下优点:通过在CuBi2O4/CuO光阴极表面沉积高质量的保护层,可以减轻CuBi2O4/CuO光阴极的光腐蚀,提高光阴极的稳定性。Compared with the existing technology, the present invention has the following advantages: by depositing a high-quality protective layer on the surface of the CuBi 2 O 4 /CuO photocathode, the photocorrosion of the CuBi 2 O 4 /CuO photocathode can be reduced and the stability of the photocathode can be improved. .

下面通过附图和实施例,对本发明的技术方案做进一步的详细描述。The technical solution of the present invention will be further described in detail below through the accompanying drawings and examples.

附图说明Description of drawings

图1中(a)为CuBi2O4/CuO/ZnO光阴极的XRD图谱,(b-c)为CuBi2O4/CuO光阴极的SEM图像,(d-f)为CuBi2O4/CuO/ZnO光阴极的SEM图像,(g-i)为CuBi2O4/CuO/ZnO光阴极的EDS图谱。In Figure 1, (a) is the XRD pattern of the CuBi 2 O 4 /CuO/ZnO photocathode, (bc) is the SEM image of the CuBi 2 O 4 /CuO photocathode, and (df) is the CuBi 2 O 4 /CuO/ZnO photocathode. SEM image of the cathode, (gi) is the EDS pattern of the CuBi 2 O 4 /CuO/ZnO photocathode.

图2为CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的紫外-可见吸收光谱图,其中插图为CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的Tauc图,以及CuBi2O4/CuO/ZnO光阴极样品的照片。Figure 2 shows the UV-visible absorption spectra of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode. The inset is the Tauc of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode. Figure, and photos of CuBi 2 O 4 /CuO/ZnO photocathode samples.

图3为CuBi2O4/CuO/ZnO(a-d)的TEM图像,其中(d)中的插图是CuBi2O4(730)晶面的晶体结构。Figure 3 is a TEM image of CuBi 2 O 4 /CuO/ZnO (ad), in which the inset in (d) is the crystal structure of the CuBi 2 O 4 (730) crystal plane.

图4中(a)为CuBi2O4和CuO电极的Mott-Schottky图,(b)为CuBi2O4/CuO光阴极的能带结构示意图。In Figure 4 (a) is the Mott-Schottky diagram of CuBi 2 O 4 and CuO electrodes, and (b) is a schematic diagram of the energy band structure of CuBi 2 O 4 /CuO photocathode.

图5为CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的XPS图谱:(a)Cu2p;(b)Bi4f;(c)O1s;(d)Zn2p。Figure 5 shows the XPS patterns of CuBi2O4/CuO and CuBi2O4/CuO/ZnO photocathode: (a) Cu2p; (b) Bi4f; (c) O1s; (d) Zn2p.

图6中(a)为CuBi2O4/CuO/ZnO电极在不同沉积电位下沉积100秒的斩光LSV曲线;(b)为在-0.4VAg/AgCl下,ZnO沉积电位对光电流密度的影响;(c)为CuBi2O4/CuO/ZnO电极在-0.2VAg/AgCl,不同沉积时间下的斩光LSV曲线;(d)为在0.2VRHE下,ZnO沉积时间对光电流密度的影响。Figure 6 (a) shows the chopping LSV curve of CuBi 2 O 4 /CuO/ZnO electrode deposited at different deposition potentials for 100 seconds; (b) shows the relationship between ZnO deposition potential and photocurrent density at -0.4V Ag/AgCl. The influence of _ Effect of density.

图7中(a)为CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的斩光LSV曲线;(b)根据斩光LSV计算的电极的HC-STH效率;(c)CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的稳定性测试曲线,在0.4VRHE,0.5MNa2SO4和1%(v/v)H2O2电解液中进行;图(c)中的插图显示了CuBi2O4/CuO光阴极在0.4VRHE,0.5MNa2SO4电解液中的稳定性测试曲线。In Figure 7 (a) is the chopping LSV curve of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode; (b) HC-STH efficiency of the electrode calculated based on chopping LSV; (c) CuBi Stability test curves of 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode, conducted in 0.4VRHE, 0.5MNa 2 SO 4 and 1% (v/v) H 2 O 2 electrolyte; Figure ( The inset in c) shows the stability test curve of the CuBi 2 O 4 /CuO photocathode in 0.4V RHE , 0.5M Na 2 SO 4 electrolyte.

图8为稳定性测试后的SEM图像(a)CuBi2O4/CuO;(b)CuBi2O4/CuO/ZnO。Figure 8 shows the SEM images after the stability test (a) CuBi 2 O 4 /CuO; (b) CuBi 2 O 4 /CuO/ZnO.

图9为电化学活性面积(ECSA)测量图,(a)CuBi2O4/CuO;(b)CuBi2O4/CuO/ZnO的循环伏安曲线,扫描速率为20~100mV/s;(c)计算的双电层电容(EDLC)以反映ECSA。Figure 9 shows the electrochemical active area (ECSA) measurement chart, (a) CuBi 2 O 4 /CuO; (b) cyclic voltammetry curve of CuBi 2 O 4 /CuO/ZnO, the scan rate is 20 ~ 100mV/s; ( c) Calculated electric double layer capacitance (EDLC) to reflect ECSA.

图10中(a)ηinj曲线;(b)ηsep曲线;(c)CuBi2O4/CuO和CuBi2O4/CuO/ZnO电极的Mott-Schottky曲线;(d)CuBi2O4/CuO和CuBi2O4/CuO/ZnO电极的测试(散点)和拟合(线)的Nyquist图;插图是用于拟合的等效电路。In Figure 10 (a) η inj curve; (b) η sep curve; (c) Mott-Schottky curve of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO electrodes; (d) CuBi 2 O 4 / Nyquist plots of tested (scatter) and fitted (line) CuO and CuBi 2 O 4 /CuO/ZnO electrodes; inset is the equivalent circuit used for the fitting.

图11为CuBi2O4/CuO和CuBi2O4/CuO/ZnO电极的测试(散点,方形对应电阻,圆形对应相角)和拟合(线)的Bode图。Figure 11 is the Bode plot of the test (scattered points, squares correspond to resistance, circles correspond to phase angle) and fitting (line) of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO electrodes.

图12中(a)为CuBi2O4/CuO光阴极的电极过程示意图;(b)为CuBi2O4/CuO/ZnO光阴极的电极过程示意图;(c)为CuBi2O4/CuO/ZnO的能带图示意图。In Figure 12, (a) is a schematic diagram of the electrode process of CuBi 2 O 4 /CuO photocathode; (b) is a schematic diagram of the electrode process of CuBi 2 O 4 /CuO/ZnO photocathode; (c) is CuBi 2 O 4 /CuO/ Schematic diagram of the energy band diagram of ZnO.

具体实施方式Detailed ways

实施例1Example 1

一种CuBi2O4/CuO光阴极表面修饰方法,通过电沉积ZnO作为CuBi2O4/CuO光阴极的保护层。A method for surface modification of CuBi 2 O 4 /CuO photocathode, which uses electrodeposition of ZnO as a protective layer for CuBi 2 O 4 /CuO photocathode.

CuBi2O4/CuO光阴极可通过以下方法制备:通过两步电沉积的方法,在FTO玻璃衬底上制备了纳米多孔CuBi2O4/CuO光阴极。电沉积使用标准的三电极体系,FTO作为工作电极,Ag/AgCl作为参比电极,铂丝作为对电极。第一步,在FTO上电沉积BiOI纳米片。制备含有0.23M对苯醌的无水乙醇溶液,并搅拌直至其变成透明溶液(溶液1)。同时,制备0.4M的KI溶液,并向KI溶液中添加HNO3,将pH调节至1.7。然后,将Bi(NO3)3·5H2O溶解于调节好pH的KI溶液中,以制备0.04MBi(NO3)3溶液(溶液2)。将溶液1与溶液2混合,并充分搅拌。所得混合溶液用于,室温下,在-0.1VAg/AgCl的恒定电位下在FTO上电沉积BiOI,沉积时间为600s。电沉积后,用去离子水仔细清洗所得BiOI膜,并在室温下干燥。第二步,在BiOI膜上沉积铜源。铜源从0.2MCu(CH3COO)2·H2O的水溶液中电沉积在BiOI光阴极上。在室温下,在-0.3VAg/AgCl的恒定电位下进行300s的沉积。电沉积铜源后,用去离子水洗涤光阴极并在室温下干燥。最后,将电极在450℃下退火3h(升温速率为2℃/min),得到CuBi2O4/CuO光阴极(如图1所示)。The CuBi 2 O 4 /CuO photocathode can be prepared by the following method: a nanoporous CuBi 2 O 4 /CuO photocathode is prepared on an FTO glass substrate through a two-step electrodeposition method. Electrodeposition uses a standard three-electrode system, with FTO as the working electrode, Ag/AgCl as the reference electrode, and platinum wire as the counter electrode. In the first step, BiOI nanosheets are electrodeposited on FTO. Prepare a solution containing 0.23M p-benzoquinone in absolute ethanol and stir until it becomes a clear solution (Solution 1). At the same time, prepare a 0.4M KI solution, add HNO 3 to the KI solution, and adjust the pH to 1.7. Then, Bi(NO 3 ) 3 ·5H 2 O was dissolved in the pH-adjusted KI solution to prepare a 0.04MBi(NO 3 ) 3 solution (solution 2). Mix solution 1 with solution 2 and stir well. The obtained mixed solution was used to electrodeposit BiOI on FTO at a constant potential of -0.1 V Ag/AgCl at room temperature, with a deposition time of 600 s. After electrodeposition, the resulting BiOI film was carefully washed with deionized water and dried at room temperature. In the second step, a copper source is deposited on the BiOI film. The copper source was electrodeposited on the BiOI photocathode from an aqueous solution of 0.2MCu(CH 3 COO) 2 ·H 2 O. Deposition was performed at room temperature for 300 s at a constant potential of -0.3 V Ag/AgCl . After electrodeposition of the copper source, the photocathode was washed with deionized water and dried at room temperature. Finally, the electrode was annealed at 450°C for 3h (heating rate 2°C/min) to obtain a CuBi 2 O 4 /CuO photocathode (as shown in Figure 1).

采用电沉积的方式,在CuBi2O4/CuO光阴极表面沉积ZnO,制备CuBi2O4/CuO/ZnO光阴极。电沉积采用三电极体系,以CuBi2O4/CuO光阴极为工作电极,Ag/AgCl电极作为参比电极,铂丝电极作为对电极。配制0.05MZnCl2溶液,利用0.05MZnCl2溶液在CuBi2O4/CuO电极上电沉积ZnO。在室温下,在-0.2VAg/AgCl的恒定电势下进行沉积,沉积时间为150s。电沉积后,用去离子水洗涤获得的CuBi2O4/CuO/ZnO光阴极,并置于烘箱中,在60℃下干燥。ZnO is deposited on the surface of CuBi 2 O 4 /CuO photocathode by electrodeposition to prepare CuBi 2 O 4 /CuO/ZnO photocathode. Electrodeposition adopts a three-electrode system, with CuBi 2 O 4 /CuO photocathode as the working electrode, Ag/AgCl electrode as the reference electrode, and platinum wire electrode as the counter electrode. Prepare a 0.05MZnCl 2 solution, and use the 0.05MZnCl 2 solution to electrodeposit ZnO on the CuBi 2 O 4 /CuO electrode. Deposition was performed at room temperature at a constant potential of -0.2 V Ag/AgCl , with a deposition time of 150 s. After electrodeposition, the obtained CuBi 2 O 4 /CuO/ZnO photocathode was washed with deionized water and placed in an oven to dry at 60°C.

通过电沉积方法在CuBi2O4/CuO光阴极表面涂覆了一层非晶ZnO。CuBi2O4/CuO/ZnO光阴极的光电流密度是CuBi2O4/CuO光阴极的2.1倍。同时,经12h的稳定性测试,CuBi2O4/CuO/ZnO光阴极的光电流保持率为84%。非晶ZnO层可以提供更多的活性位点,改善电荷转移,并保护CuBi2O4/CuO光阴极。这项工作证明,电沉积ZnO涂层可以在一定程度上减轻光阴极的光腐蚀,同时提高PEC(光电化学水分解系统)性能。A layer of amorphous ZnO is coated on the surface of CuBi 2 O 4 /CuO photocathode by electrodeposition method. The photocurrent density of CuBi 2 O 4 /CuO/ZnO photocathode is 2.1 times that of CuBi 2 O 4 /CuO photocathode. At the same time, after 12 hours of stability testing, the photocurrent retention rate of the CuBi 2 O 4 /CuO/ZnO photocathode was 84%. The amorphous ZnO layer can provide more active sites, improve charge transfer, and protect the CuBi 2 O 4 /CuO photocathode. This work proves that electrodeposited ZnO coating can alleviate photocorrosion of photocathode to a certain extent while improving PEC (photoelectrochemical water splitting system) performance.

材料表征分析:通过X射线衍射(XRD,BRUKER AXS D8 ADVANCE)和Cu Kα辐射鉴定电极的相组成、晶体结构以及生长取向。使用扫描电子显微镜(SEM,ThermoScientific Apreo 2C)获得电极的表面形貌图像。用OXFORD ULTIM Max65记录能量色散光谱(EDS)图。使用Shimadzu UV-3600 plus分光光度计在300~1200nm范围内获得电极的紫外-可见吸收光谱。使用透射电子显微镜(Talos F200S G2)获得电极的TEM图像,分析电极的内部结构。使用X射线光电子能谱(XPS,Thermo Fisher ESCALABXi+)测定电极表面的元素的化学状态。Material characterization analysis: by X-ray diffraction (XRD, BRUKER AXS D8 ADVANCE) and Cu Kα radiation Identify the phase composition, crystal structure, and growth orientation of the electrode. Scanning electron microscopy (SEM, ThermoScientific Apreo 2C) was used to obtain surface morphology images of the electrodes. Energy dispersive spectroscopy (EDS) images were recorded using OXFORD ULTIM Max65. The UV-visible absorption spectrum of the electrode was obtained using a Shimadzu UV-3600 plus spectrophotometer in the range of 300 to 1200 nm. A transmission electron microscope (Talos F200S G2) was used to obtain TEM images of the electrodes and analyze the internal structure of the electrodes. X-ray photoelectron spectroscopy (XPS, Thermo Fisher ESCALABXi+) was used to determine the chemical state of elements on the electrode surface.

为了确定电极的组成,通过XRD对CuBi2O4/CuO/ZnO光阴极进行了表征。如图1(a)所示,位于20.8°、27.9°、30.7°、33.3°、37.4°、46.7°和52.9°的衍射峰与四方相CuBi2O4(JCPDSNO.71-1774)相匹配,分别对应于(200)、(211)、(002)、(130)、(202)、(141)和(123)晶面。同时,从CuBi2O4/CuO/ZnO的XRD图谱可以观察到单斜相CuO的衍射峰。位于35.5°、38.6°和48.8°的衍射峰,分别对应CuO的(-111)、(111)和(-202)晶面。由于ZnO的负载量低,因此无法观察到明显的ZnO衍射峰。用SEM表征的制备的CuBi2O4/CuO光阴极的形貌,如图1(b)和(c)所示。可以清楚地观察到纳米片和八面体结构。考虑到制造工艺,可以推断出纳米片是CuBi2O4,而后者是CuO。为了提高CuBi2O4/CuO异质结光电极的稳定性,在上述光阴极表面涂覆了电沉积的ZnO覆盖层。CuBi2O4/CuO/ZnO光阴极的SEM图像如图1(d-f)所示。与未涂覆的CuBi2O4/CuO电极相比,CuBi2O4/CuO/ZnO被纳米片状的ZnO超薄层覆盖(图1(d)和(e)),其显示出一些褶皱(见图1(d)和(e)中的箭头)。用EDS图谱测量了截面CuBi2O4/CuO/ZnO薄膜的元素分布。图1(g-i)中的EDS图谱清楚地证实了CuBi2O4和CuO分别是纳米片和八面体结构,这支持了之前的推断。EDS结果还表明,ZnO层覆盖在CuBi2O4/CuO的整个膜上。如图1(f)所示,CuBi2O4/CuO/ZnO膜的平均厚度约为1.2μm。光电极的光吸收特性是表征光电极性能的重要指标之一,光电极的光吸收能力直接影响着光生载流子的产生。CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的紫外-可见吸收光谱如图2所示。可以观察到,在300~1100nm范围内,在沉积ZnO后,电极的光吸收度略有下降,这是由于ZnO具有较宽的光学带隙。从Tauc图(图2的插图)推导出的CuBi2O4/CuO和CuBi2O4/CuO/ZnO的光学带隙分别为1.80eV和1.81eV。In order to determine the composition of the electrode, the CuBi 2 O 4 /CuO/ZnO photocathode was characterized by XRD. As shown in Figure 1(a), the diffraction peaks located at 20.8°, 27.9°, 30.7°, 33.3°, 37.4°, 46.7° and 52.9° match the tetragonal phase CuBi 2 O 4 (JCPDSNO.71-1774), Corresponding to the (200), (211), (002), (130), (202), (141) and (123) crystal planes respectively. At the same time, the diffraction peak of monoclinic phase CuO can be observed from the XRD pattern of CuBi 2 O 4 /CuO/ZnO. The diffraction peaks located at 35.5°, 38.6° and 48.8° correspond to the (-111), (111) and (-202) crystal planes of CuO respectively. Due to the low loading of ZnO, no obvious ZnO diffraction peak can be observed. The morphology of the prepared CuBi 2 O 4 /CuO photocathode characterized by SEM is shown in Figure 1(b) and (c). Nanosheets and octahedral structures can be clearly observed. Considering the fabrication process, it can be deduced that the nanosheets are CuBi 2 O 4 and the latter is CuO. In order to improve the stability of the CuBi 2 O 4 /CuO heterojunction photoelectrode, an electrodeposited ZnO covering layer was coated on the surface of the above photocathode. The SEM image of CuBi 2 O 4 /CuO/ZnO photocathode is shown in Figure 1(df). Compared with the uncoated CuBi 2 O 4 /CuO electrode, CuBi 2 O 4 /CuO/ZnO is covered by an ultrathin layer of nanosheet-like ZnO (Fig. 1(d) and (e)), which shows some wrinkles (See arrows in Figure 1(d) and (e)). The element distribution of the cross-section CuBi 2 O 4 /CuO/ZnO film was measured using EDS spectrum. The EDS pattern in Figure 1(gi) clearly confirms that CuBi 2 O 4 and CuO are nanosheet and octahedral structures respectively, which supports the previous inference. The EDS results also show that the ZnO layer covers the entire film of CuBi 2 O 4 /CuO. As shown in Figure 1(f), the average thickness of the CuBi 2 O 4 /CuO/ZnO film is approximately 1.2 μm. The light absorption characteristics of the photoelectrode are one of the important indicators to characterize the performance of the photoelectrode. The light absorption capacity of the photoelectrode directly affects the generation of photogenerated carriers. The UV-visible absorption spectra of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode are shown in Figure 2. It can be observed that in the range of 300 to 1100 nm, the light absorption of the electrode decreases slightly after depositing ZnO, which is due to the wide optical band gap of ZnO. The optical band gaps of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO, deduced from the Tauc diagram (inset of Figure 2), are 1.80 eV and 1.81 eV, respectively.

TEM不仅用于确定ZnO覆盖层的结构,还用于鉴定CuBi2O4/CuO异质结。CuBi2O4/CuO/ZnO光阴极的TEM图像如图3所示。如图3(a)所示,光电极表面覆盖有薄层ZnO。图3(a)中标记区域的高分辨率TEM(HRTEM)图像如图3(b)所示。可以清楚地观察到0.31nm的晶格间距,这可以与CuBi2O4的(220)晶面的晶面间距相匹配。在图3(c)中,0.25nm的晶格距离可以被索引为CuO的(-111)晶面的晶面间距。同时,可以观察到非晶ZnO层。CuBi2O4和CuO形成紧密接触的异质结,这促进了CuBi2O4/CuO界面处的电荷转移。0.36nm的较大条纹间距可能归因于由氧空位引起的CuBi2O4的晶格畸变。此外,在图3(c)中观察到1.12nm的条纹间距。图3(c)中标记区域的HRTEM图像如图3(d)所示,图像为CuBi2O4的高折射率(730)晶面。(730)晶面的结构如图3(d)中的插图所示,与真实的空间原子排列非常匹配。TEM is not only used to determine the structure of the ZnO covering layer but also to identify the CuBi 2 O 4 /CuO heterojunction. The TEM image of CuBi 2 O 4 /CuO/ZnO photocathode is shown in Figure 3. As shown in Figure 3(a), the surface of the photoelectrode is covered with a thin layer of ZnO. The high-resolution TEM (HRTEM) image of the marked area in Figure 3(a) is shown in Figure 3(b). A lattice spacing of 0.31 nm can be clearly observed, which can match the interplanar spacing of the (220) crystal plane of CuBi2O4 . In Figure 3(c), the lattice distance of 0.25 nm can be indexed as the interplanar spacing of the (-111) crystal plane of CuO. At the same time, an amorphous ZnO layer can be observed. CuBi 2 O 4 and CuO form a heterojunction in close contact, which promotes charge transfer at the CuBi 2 O 4 /CuO interface. The larger stripe spacing of 0.36nm may be attributed to the lattice distortion of CuBi2O4 caused by oxygen vacancies. Furthermore, a stripe spacing of 1.12 nm is observed in Figure 3(c). The HRTEM image of the marked area in Figure 3(c) is shown in Figure 3(d). The image is the high refractive index (730) crystal plane of CuBi 2 O 4 . The structure of the (730) crystal plane is shown in the inset in Figure 3(d), which closely matches the real spatial atomic arrangement.

为了阐明CuBi2O4/CuO异质结的能带结构,制备了CuBi2O4和CuO电极。根据图3-5(a)中的紫外-可见吸收光谱,得到CuBi2O4和CuO的Tauc图(如图3-5(b)、(c)所示)。由CuBi2O4和CuO的Tauc图,得到CuBi2O4和CuO的光学带隙分别为1.81eV和1.43eV。根据CuBi2O4和CuO电极的Mott-Schottky图(图4(a)),通过公式In order to elucidate the energy band structure of CuBi 2 O 4 /CuO heterojunction, CuBi 2 O 4 and CuO electrodes were prepared. According to the UV-visible absorption spectrum in Figure 3-5(a), the Tauc diagrams of CuBi 2 O 4 and CuO are obtained (as shown in Figure 3-5(b) and (c)). From the Tauc diagrams of CuBi 2 O 4 and CuO, the optical band gaps of CuBi 2 O 4 and CuO are 1.81eV and 1.43eV respectively. According to the Mott-Schottky diagram of CuBi 2 O 4 and CuO electrodes (Fig. 4(a)), by the formula

其中,C为半导体的空间电荷电容(F/cm2),e为电子的电荷量,ε0为真空介电常数,ε为半导体的介电常数,NA为受主浓度,E为施加的偏压,Efb为平带电位,kB为玻尔兹曼常数,T为热力学温度(K),计算电极的载流子浓度(NA)。对于CuBi2O4和CuO,ε分别为80和10.26。Mott-Schottky图的线性外推斜率可用于估算NA。CuBi2O4和CuO的NA分别为2.80×1019cm-3和5.82×1019cm-3。然后,价带边缘EV可以通过公式计算获得,其中,EAg/AgCl为0.197V。EF是费米能级,等于真空中的Efb,NV是价带中的有效态密度,其中,CuBi2O4的NV为5×1019cm-3,CuO的NV为5.57×1020cm-3。然后计算出的CuBi2O4和CuO的EV-EF值分别为0.02eV和0.06eV。当CuBi2O4和CuO接触形成异质结后,CuBi2O4和CuO的费米能级将处于相同位置,等同于CuBi2O4/CuO光阴极的Efb(如图10(c)所示)。因此,建立了Ⅱ型CuBi2O4/CuO异质结。CuBi2O4/CuO电极的能带结构如图4(b)所示。 Among them, C is the space charge capacitance of the semiconductor (F/cm2), e is the charge of the electron, ε 0 is the vacuum dielectric constant, ε is the dielectric constant of the semiconductor, N A is the acceptor concentration, and E is the applied bias. Pressure, E fb is the flat band potential, k B is Boltzmann's constant, T is the thermodynamic temperature (K), calculate the carrier concentration ( NA ) of the electrode. For CuBi2O4 and CuO, ε is 80 and 10.26 respectively. The linear extrapolation slope of the Mott-Schottky plot can be used to estimate N A . The N A of CuBi 2 O 4 and CuO are 2.80×10 19 cm -3 and 5.82×10 19 cm -3 respectively. Then, the valence band edge E V can be expressed by the formula It is calculated that E Ag/AgCl is 0.197V. E F is the Fermi energy level, which is equal to E fb in vacuum, and N V is the effective density of states in the valence band. Among them, the N V of CuBi 2 O 4 is 5×10 19 cm -3 and the N V of CuO is 5.57 ×10 20 cm -3 . The calculated EV - EF values of CuBi2O4 and CuO are then 0.02eV and 0.06eV respectively. When CuBi 2 O 4 and CuO contact to form a heterojunction, the Fermi levels of CuBi 2 O 4 and CuO will be at the same position, which is equivalent to the E fb of the CuBi 2 O 4 /CuO photocathode (Figure 10(c) shown). Therefore, type II CuBi 2 O 4 /CuO heterojunction is established. The energy band structure of the CuBi 2 O 4 /CuO electrode is shown in Figure 4(b).

利用XPS测试,对CuBi2O4/CuO和CuBi2O4/CuO/ZnO电极中元素的详细组成和价态进行分析。与CuBi2O4/CuO相比,CuBi2O4/CuO/ZnO的XPS能谱显示出明显的Zn2p峰。这进一步证明了ZnO成功沉积在CuBi2O4/CuO异质结光阴极表面。对于Cu2p能谱(图5(a)),933.5eV和953.5eV处出现的结合能峰,分别归因于Cu2p3/2和Cu2p1/2。双峰间的能量差值为20eV,证明了Cu2+离子的存在。此外,Cu2p3/2的XPS峰可以被Cu2+和Cu+两个单独的峰拟合。Cu+/(Cu++Cu2 +)的比率如表1所示。电沉积ZnO后,Cu2+的一部分转化为Cu+。Cu+的含量与氧空位的浓度有关。Cu+含量越高,表明存在更多的氧空位。此外,Cu2p3/2和Cu2p1/2的卫星峰分别位于942eV和962eV,归因于Cu2+的3d9壳层。在图5(b)中,在158.8eV和164.1eV处出现两个峰值,分别对应于Bi3+离子的Bi4f7/2和Bi4f5/2的结合能。如图5(c)所示,O1s能谱被细分为529.5eV、531.1eV和532.0eV的三个峰。529.5eV的主要O1s峰归因于晶格氧(OL)。位于531.1eV处的峰与氧空位(OV)的存在有关。532.0eV处的峰与表面吸附的氧和羟基(OA)相关。ZnO沉积后,OV/(OL+OV+OA)的比率从20.1%增加到37.5%,表明在ZnO电沉积过程中产生OV。在-0.2VAg/AgCl的电沉积电位下,CuBi2O4/CuO电极上存在还原环境,这导致Cu+和OV的生成。如图5(d)所示,CuBi2O4/CuO/ZnO的Zn2p能谱在1021.7eV和1044.9eV处有两个尖峰,这分别与Zn 2p3/2和Zn2p1/2的结合能有关,证明了Zn2+离子的存在XPS testing was used to analyze the detailed composition and valence state of elements in CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO electrodes. Compared with CuBi 2 O 4 /CuO, the XPS spectrum of CuBi 2 O 4 /CuO/ZnO shows an obvious Zn2p peak. This further proves that ZnO is successfully deposited on the CuBi 2 O 4 /CuO heterojunction photocathode surface. For the Cu2p energy spectrum (Fig. 5(a)), the binding energy peaks appearing at 933.5eV and 953.5eV are attributed to Cu2p 3/2 and Cu2p 1/2 respectively. The energy difference between the double peaks is 20 eV, which proves the existence of Cu 2+ ions. In addition, the XPS peak of Cu2p 3/2 can be fitted by two separate peaks of Cu 2+ and Cu + . The ratio of Cu + /(Cu + +Cu 2 + ) is shown in Table 1. After ZnO is electrodeposited, part of Cu 2+ is converted into Cu + . The content of Cu + is related to the concentration of oxygen vacancies. A higher Cu + content indicates the presence of more oxygen vacancies. In addition, the satellite peaks of Cu2p 3/2 and Cu2p 1/2 are located at 942eV and 962eV respectively, which are attributed to the 3d 9 shell of Cu2 + . In Figure 5(b), two peaks appear at 158.8eV and 164.1eV, corresponding to the binding energies of Bi4f 7/2 and Bi4f 5/2 of Bi 3+ ions, respectively. As shown in Figure 5(c), the O1s energy spectrum is subdivided into three peaks of 529.5eV, 531.1eV and 532.0eV. The main O1s peak at 529.5 eV is attributed to lattice oxygen (O L ). The peak located at 531.1 eV is related to the presence of oxygen vacancies ( OV ). The peak at 532.0 eV is related to surface-adsorbed oxygen and hydroxyl groups ( OA ). After ZnO deposition, the ratio of O V /( OL + O V + O A ) increased from 20.1% to 37.5%, indicating that O V was generated during ZnO electrodeposition. At the electrodeposition potential of -0.2V Ag/AgCl , there is a reducing environment on the CuBi2O4 /CuO electrode, which leads to the generation of Cu + and O V. As shown in Figure 5(d), the Zn2p energy spectrum of CuBi 2 O 4 /CuO/ZnO has two peaks at 1021.7eV and 1044.9eV, which are related to the binding energies of Zn 2p 3/2 and Zn2p 1/2 respectively. , proving the existence of Zn 2+ ions

表5-1 CuBi2O4/CuO和CuBi2O4/CuO/ZnO的Cu2p和O 1s XPS能谱数据分析总结Table 5-1 Summary of Cu2p and O 1s XPS energy spectrum data analysis of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO

电化学性能分析:所有PEC测试都是在电化学工作站(CHI 660E)上使用标准三电极体系进行的,该体系中,制备的光阴极作为工作电极,铂丝作为对电极,Ag/AgCl电极(3MKCl)作为参比电极。测试中,使用与滤光片耦合的300W氙灯(CEL-HXF300)作为光源,光阴极表面的光强约为100mW/cm2。光从电极的背面入射。电解液为0.5M Na2SO4。在20mV/s的扫描速率下记录线性扫描伏安(LSV)曲线。光电化学阻抗谱(PEIS)是在光照条件下,0.1~105Hz的频率范围内,10mV的扰动下,在0.4VRHE的电位下测试获得的。并且,使用Z-View软件对光电化学阻抗谱进行拟合。在黑暗中以2kHz的固定频率测量Mott-Schottky(MS)图。对于电荷注入效率和分离效率测量,所使用的电解液为0.5M Na2SO4与1%(v/v)H2O2的混合电解液。Electrochemical performance analysis: All PEC tests were performed on an electrochemical workstation (CHI 660E) using a standard three-electrode system. In this system, the prepared photocathode was used as the working electrode, platinum wire was used as the counter electrode, and Ag/AgCl electrode ( 3MKCl) as the reference electrode. During the test, a 300W xenon lamp (CEL-HXF300) coupled with a filter was used as the light source, and the light intensity on the photocathode surface was approximately 100mW/cm 2 . Light is incident from the back side of the electrode. The electrolyte is 0.5M Na 2 SO 4 . Linear sweep voltammetry (LSV) curves were recorded at a scan rate of 20 mV/s. Photoelectrochemical impedance spectroscopy (PEIS) was measured under light conditions, in the frequency range of 0.1 to 10 5 Hz, under a disturbance of 10mV, and at a potential of 0.4 VRHE. Moreover, Z-View software was used to fit the photoelectrochemical impedance spectrum. Mott-Schottky (MS) plots were measured in the dark at a fixed frequency of 2 kHz. For charge injection efficiency and separation efficiency measurements, the electrolyte used was a mixed electrolyte of 0.5M Na 2 SO 4 and 1% (v/v) H 2 O 2 .

在AM1.5G光照下,在0.5MNa2SO4电解液中测试所制备的CuBi2O4基光阴极的PEC性能。首先,优化了ZnO合成的电沉积电位和电沉积时间,相应的LSV曲线如图6所示。最佳电沉积电位为-0.2VAg/AgCl。最佳电沉积时间为150秒。其次,比较了CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的PEC性能。图7(a)显示了CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极在0.5MNa2SO4中扫描速率为20mV/s下的斩光LSV曲线。在0.2VRHE下,CuBi2O4/CuO光阴极的光电流密度为0.56mA/cm2。在涂覆非晶ZnO层后,在0.2VRHE下,光电流密度达到1.18mA/cm2,这几乎是原始CuBi2O4/CuO光电流密度的1.1倍。如图7(a)的插图所示,CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的起始电位均大于1.0VRHE。此外,两个光阴极都显示出明显的瞬态电流尖峰,表明电子—空穴对的复合。阴极尖峰(亮起状态)表示光生电子—空穴对复合的发生,而阳极尖峰(熄灭状态)表示,光生电子存储在这些电极表面的捕获位置,然后在黑暗中与空穴复合。因此,ZnO涂层可以抑制CuBi2O4/CuO光阴极上电子—空穴对的复合。在图7(b)中,HC-STH效率,通过使用公式The PEC performance of the prepared CuBi 2 O 4 -based photocathode was tested in 0.5M Na 2 SO 4 electrolyte under AM1.5G illumination. First, the electrodeposition potential and electrodeposition time of ZnO synthesis were optimized, and the corresponding LSV curve is shown in Figure 6. The optimal electrodeposition potential is -0.2V Ag/AgCl . The optimal electrodeposition time is 150 seconds. Secondly, the PEC performance of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode was compared. Figure 7(a) shows the chopping LSV curves of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode in 0.5MNa 2 SO 4 at a scan rate of 20mV/s. Under 0.2V RHE , the photocurrent density of CuBi 2 O 4 /CuO photocathode is 0.56mA/cm 2 . After coating the amorphous ZnO layer, the photocurrent density reaches 1.18mA/cm 2 under 0.2V RHE , which is almost 1.1 times the photocurrent density of the original CuBi 2 O 4 /CuO. As shown in the inset of Figure 7(a), the onset potentials of both CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode are greater than 1.0V RHE . In addition, both photocathode showed clear transient current spikes, indicating the recombination of electron-hole pairs. The cathode spike (lit state) indicates the occurrence of photogenerated electron-hole pair recombination, while the anode spike (off state) indicates that photogenerated electrons are stored in trapping sites on the surface of these electrodes and then recombine with holes in the dark. Therefore, the ZnO coating can inhibit the recombination of electron-hole pairs on the CuBi 2 O 4 /CuO photocathode. In Figure 7(b), the HC-STH efficiency, by using the formula

其中Jph为测得的光电流密度(mA/cm2),Ebias为施加的电势(VRHE),EH+/H2为析氢反应的标准电势(0VRHE),Plight为光的功率密度(100mW/cm2),根据斩光LSV曲线计算得出。在0.2VRHE下,CuBi2O4/CuO光阴极的最大HC-STH效率为0.11%。在0.3VRHE下,CuBi2O4/CuO/ZnO光阴极的最大HC-STH效率为0.26%,相比于CuBi2O4/CuO光阴极,提高了1.4倍。最后,使用1%(v/v)H2O2作为电子清除剂研究了上述两种光阴极的PEC稳定性。如图7(c)所示,12小时稳定性测试后,CuBi2O4/CuO和CuBi2O4/CuO/ZnO,光阴极的光电流保持率分别为58.3%和84%,电极的电流密度与稳定性在报道的CuBi2O4基光阴极中处于较好的水平(见表2)。曲线波动的原因是在稳定性测试期间,氢气泡在光阴极表面形成并释放。光电流衰减的趋势与报道的CuBi2O4/TiO2光阴极类似。图7(c)的插图表明,当在不含牺牲试剂的电解液中测试时,CuBi2O4/CuO光阴极的电流密度在开始光照后几秒内迅速降低。500秒测试后,光电流保持率仅为40%。应当注意,用作电子清除剂的H2O2可以由于额外的空穴注入而引起电流倍增效应,而不需要吸收额外的光子。CuBi2O4/CuO的光电流密度的最初降低然后增加可能是由于CuBi2O4/CuO的光电腐蚀。在相同条件下,CuBi2O4/CuO/ZnO在12小时测试后显示出较高的光电流保持率。这证实了非晶ZnO涂层在一定程度上减轻了作为保护层的CuBi2O4/CuO的光腐蚀。CuBi2O4/CuO/ZnO的光腐蚀应归因于ZnO层的不完善涂层。稳定性测试后的CuBi2O4/CuO和CuBi2O4/CuO/ZnO的形貌表征(图8)表明,在没有ZnO覆盖层的保护下,可以在CuBi2O4/CuO表面观察到一些微小的纳米结构;ZnO保护层可以有效保护CuBi2O4/CuO光阴极的纳米结构。 where J ph is the measured photocurrent density (mA/cm 2 ), E bias is the applied potential (V RHE ), E H+/H2 is the standard potential of the hydrogen evolution reaction (0 V RHE ), and P light is the power density of light. (100mW/cm 2 ), calculated based on the chopping LSV curve. The maximum HC-STH efficiency of the CuBi 2 O 4 /CuO photocathode is 0.11% at 0.2V RHE . Under 0.3V RHE , the maximum HC-STH efficiency of the CuBi 2 O 4 /CuO/ZnO photocathode is 0.26%, which is 1.4 times higher than that of the CuBi 2 O 4 /CuO photocathode. Finally, the PEC stability of the above two photocathode was studied using 1% (v/v) H 2 O 2 as electron scavenger. As shown in Figure 7(c), after 12 hours of stability testing, for CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO, the photocurrent retention rates of the photocathode were 58.3% and 84%, respectively, and the current of the electrode The density and stability are at a better level among the reported CuBi 2 O 4- based photocathode (see Table 2). The reason for the fluctuations in the curve is that hydrogen bubbles were formed and released on the photocathode surface during the stability test. The trend of photocurrent decay is similar to that reported for CuBi2O4 / TiO2 photocathode. The inset of Figure 7(c) shows that when tested in an electrolyte without sacrificial reagents, the current density of the CuBi2O4 /CuO photocathode decreases rapidly within seconds after the start of illumination. After 500 seconds of testing, the photocurrent retention rate is only 40%. It should be noted that H2O2 used as an electron scavenger can cause a current multiplication effect due to additional hole injection without absorbing additional photons . The initial decrease and then increase in the photocurrent density of CuBi 2 O 4 /CuO may be due to photocorrosion of CuBi 2 O 4 /CuO. Under the same conditions, CuBi 2 O 4 /CuO/ZnO showed a higher photocurrent retention rate after 12 hours of testing. This confirms that the amorphous ZnO coating alleviates the photocorrosion of CuBi 2 O 4 /CuO as a protective layer to a certain extent. The photocorrosion of CuBi 2 O 4 /CuO/ZnO should be attributed to the imperfect coating of the ZnO layer. The morphology characterization of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO after the stability test (Figure 8) shows that without the protection of the ZnO covering layer, it can be observed on the surface of CuBi 2 O 4 /CuO Some tiny nanostructures; the ZnO protective layer can effectively protect the nanostructures of the CuBi 2 O 4 /CuO photocathode.

还可以进一步连续沉积ZnO覆盖层可以完全覆盖并保护内部CuBi2O4/CuO免受电解液接触。A ZnO capping layer can be further continuously deposited to completely cover and protect the internal CuBi 2 O 4 /CuO from electrolyte contact.

表5-2已报道的CuBi2O4(CBO)基光阴极的PEC性能总结。Table 5-2 Summary of reported PEC performance of CuBi 2 O 4 (CBO)-based photocathode.

机理分析:CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的电化学活性面积(ECSA),通过循环伏安法(CV),在20~100mV/s的扫描速率范围内测量并计算,如图9所示。CuBi2O4/CuO和CuBi2O4/CuO/ZnO的双电层电容值分别为0.029mF/cm2和0.044mF/cm2。这说明ZnO层不仅能够保护CuBi2O4/CuO异质结,而且提供了更多的活性位点。Mechanistic analysis: Electrochemical active area (ECSA) of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode, measured by cyclic voltammetry (CV) in the scan rate range of 20 to 100mV/s And calculated, as shown in Figure 9. The electric double layer capacitance values of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO are 0.029mF/cm 2 and 0.044mF/cm 2 respectively. This shows that the ZnO layer can not only protect the CuBi 2 O 4 /CuO heterojunction, but also provide more active sites.

接下来,将电子清除剂(H2O2)添加到电解液中,用于电荷注入和分离效率测量。电荷注入效率(ηinj)和分离效率(ηsep)通过公式和/>计算,其中,JH2O为电极不存在电子清除剂(H2O2)的电解液中测得的光电流密度,JH2O2为电极在存在电子清除剂(H2O2)的电解液中测得的光电流密度,Jabs为是根据电极的紫外-可见吸收光谱计算得到的理论光电流密度。Jabs是根据图2中的紫外-可见吸收光谱计算出的理论光电流密度,为26.25mA/cm2。如图10(a)所示,在0.2VRHE下,CuBi2O4/CuO光阴极的ηinj值为15.3%。在沉积ZnO涂层之后,CuBi2O4/CuO/ZnO光阴极的ηinj值可以达到21.5%。CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的ηsep图如图10(b)所示,没有观察到来自ZnO层的明显抑制。在黑暗中以2kHz的固定频率测量Mott-Schottky曲线,以揭示CuBi2O4/CuO和CuBi2O4/CuO/ZnO电极的受主密度和平带电位(Vfb)的变化。图10(c)中可以观察到负斜率,是p型半导体的典型特性。在ZnO层涂覆之后,Vfb从1.16VRHE变为1.06VRHE。同时,在CuBi2O4/CuO光阴极表面涂覆ZnO层后,观察到Mott-Schottky曲线斜率的降低,这表明电极载流子浓度的降低。Mott-Schottky曲线的变化归因于氧空位的增加。CuBi2O4/CuO光阴极中的受主能级来源于Cu2+空位,氧空位的形成会补偿CuBi2O4/CuO光阴极中的受主能级,将费米能级推离价带最大值。Next, an electron scavenger (H 2 O 2 ) was added to the electrolyte for charge injection and separation efficiency measurements. The charge injection efficiency (η inj ) and separation efficiency (η sep ) are calculated by the formula and/> Calculation, where J H2O is the photocurrent density measured in the electrolyte without electron scavenger (H 2 O 2 ) at the electrode, and J H2O2 is the photocurrent density measured at the electrode in the electrolyte with electron scavenger (H 2 O 2 ) present. The obtained photocurrent density, J abs , is the theoretical photocurrent density calculated based on the UV-visible absorption spectrum of the electrode. J abs is the theoretical photocurrent density calculated based on the UV-visible absorption spectrum in Figure 2, which is 26.25mA/cm 2 . As shown in Figure 10(a), under 0.2V RHE , the eta inj value of the CuBi 2 O 4 /CuO photocathode is 15.3%. After depositing the ZnO coating, the eta inj value of the CuBi 2 O 4 /CuO/ZnO photocathode can reach 21.5%. The eta sep plots of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode are shown in Figure 10(b), and no obvious suppression from the ZnO layer was observed. Mott-Schottky curves were measured at a fixed frequency of 2 kHz in the dark to reveal changes in acceptor density and flat band potential (V fb ) of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO electrodes. A negative slope can be observed in Figure 10(c), which is a typical characteristic of p-type semiconductors. After ZnO layer coating, V fb changed from 1.16V RHE to 1.06V RHE . At the same time, after coating the ZnO layer on the CuBi 2 O 4 /CuO photocathode surface, a decrease in the slope of the Mott-Schottky curve was observed, indicating a decrease in the electrode carrier concentration. The change in the Mott-Schottky curve is attributed to the increase in oxygen vacancies. The acceptor energy level in the CuBi 2 O 4 /CuO photocathode originates from Cu 2+ vacancies. The formation of oxygen vacancies will compensate for the acceptor energy level in the CuBi 2 O 4 /CuO photocathode and push the Fermi level away from the valence With maximum value.

为了研究电荷转移动力学,在0.4VRHE,AM1.5G光照条件下,用电化学阻抗谱分别对CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极进行了表征。如图10(d)所示,测量的CuBi2O4/CuO和CuBi2O4/CuO/ZnO光阴极的Nyquist图利用等效电路(图10(d)中的插图)进行拟合。它由串联电阻(Rs)、体电阻(Rbulk)、体恒相元件(CPEbulk),表面电荷转移电阻(Rct)和来自表面状态的恒相元件(CPEct)组成。表3总结了拟合参数。在沉积ZnO涂层之后,CuBi2O4/CuO/ZnO的电阻从30.1Ω下降到29.4Ω。这表明ZnO覆盖层不能限制电荷传输。而CuBi2O4/CuO/ZnO的Rbulk从原始CuBi2O4/CuO电极的1153.0Ω降至467.7Ω。同时,CuBi2O4/CuO/ZnO的Rct(~15541Ω)也显著低于CuBi2O4/CuO的Rct值(~17931Ω)。这表明ZnO涂层可以显著改善电极/电解液界面处的电荷转移,这可能归因于ZnO具有较高的电子迁移率。此外,CuBi2O4/CuO和CuBi2O4/CuO/ZnO的Bode图(图11)表明,ZnO层可以缩短电极/电解液界面处电荷转移的特征时间(较高的特征频率)。In order to study the charge transfer kinetics, the CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode were characterized by electrochemical impedance spectroscopy under 0.4V RHE and AM1.5G illumination conditions. As shown in Figure 10(d), the measured Nyquist plots of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO photocathode were fitted using the equivalent circuit (inset in Figure 10(d)). It consists of series resistance (R s ), bulk resistance (R bulk ), bulk constant phase element (CPE bulk ), surface charge transfer resistance (R ct ) and constant phase element from the surface state (CPE ct ). Table 3 summarizes the fitting parameters. After depositing the ZnO coating, the resistance of CuBi 2 O 4 /CuO/ZnO dropped from 30.1Ω to 29.4Ω. This indicates that the ZnO capping layer cannot limit charge transport. The R bulk of CuBi 2 O 4 /CuO/ZnO dropped from 1153.0Ω of the original CuBi 2 O 4 /CuO electrode to 467.7Ω. At the same time, the R ct value of CuBi 2 O 4 /CuO/ZnO (~15541Ω) is also significantly lower than the R ct value of CuBi 2 O 4 /CuO (~17931Ω). This indicates that ZnO coating can significantly improve charge transfer at the electrode/electrolyte interface, which may be attributed to the higher electron mobility of ZnO. In addition, the Bode plots of CuBi 2 O 4 /CuO and CuBi 2 O 4 /CuO/ZnO (Fig. 11) show that the ZnO layer can shorten the characteristic time of charge transfer at the electrode/electrolyte interface (higher characteristic frequency).

表5-3通过拟合得到的等效电路中各元件参数Table 5-3 Parameters of each component in the equivalent circuit obtained through fitting

CuBi2O4/CuO表面上ZnO覆盖层的可能机制如图12所示。在图12(a)中,CuBi2O4/CuO的表面直接暴露于Na2SO4电解液中。CuO的自还原电位低于E(H+/H2)。因此,CuO在热力学上是不稳定的。如图12(a)所示,光腐蚀现象可能会严重发生。当在CuBi2O4/CuO的表面上电沉积ZnO覆盖层后(图12(b)),可以有效阻止上述光腐蚀过程。此外,ZnO覆盖层可以提高电化学活性面积,同时提高电极/电解液界面处的电荷转移。从CuBi2O4/CuO/ZnO光阴极的能带结构来看(图12(c)),n型ZnO层可以像光阳极一样产生小的能带弯曲。更重要的是,ZnO层由于其价带边缘高,可以抑制表面电荷复合。此外,非晶态ZnO可能会引入一些缺陷态,这些缺陷态可以通过价态介导传输进行电子注入。The possible mechanism of the ZnO coating on the CuBi 2 O 4 /CuO surface is shown in Figure 12. In Figure 12(a), the surface of CuBi 2 O 4 /CuO is directly exposed to the Na 2 SO 4 electrolyte. The self-reduction potential of CuO is lower than E(H + /H 2 ). Therefore, CuO is thermodynamically unstable. As shown in Figure 12(a), the photocorrosion phenomenon may occur severely. When a ZnO covering layer is electrodeposited on the surface of CuBi 2 O 4 /CuO (Fig. 12(b)), the above photocorrosion process can be effectively prevented. In addition, the ZnO covering layer can increase the electrochemically active area while improving charge transfer at the electrode/electrolyte interface. From the energy band structure of CuBi 2 O 4 /CuO/ZnO photocathode (Fig. 12(c)), the n-type ZnO layer can produce small energy band bending like the photoanode. More importantly, the ZnO layer can suppress surface charge recombination due to its high valence band edge. In addition, amorphous ZnO may introduce some defect states that can allow electron injection through valence state-mediated transport.

利用化学方法沉积薄膜,虽然薄膜致密性不如利用物理法沉积,但其成本低,具有较好的可拓展性。本发明,证明了电沉积ZnO覆盖层作为CuBi2O4/CuO光阴极的保护层的可行性。同时,在AM 1.5G光照下,CuBi2O4/CuO/ZnO光阴极,在0.5M Na2SO4中0.2VRHE电位下,显示出1.18mA/cm2的光电流密度,约为CuBi2O4/CuO光阴极电流密度的两倍。在涂覆ZnO层之后,在12h稳定性测试期间,CuBi2O4/CuO的电流保持率从58.3%提高到84%。实验结果表明,非晶ZnO覆盖层不仅可以作为保护层,还可以作为“助催化剂”,有效地改善了电极的电荷转移,并且提高了电极的电化学活性面积。The use of chemical methods to deposit thin films is not as dense as the physical method, but it is low cost and has good scalability. The present invention proves the feasibility of electrodepositing a ZnO covering layer as a protective layer for CuBi 2 O 4 /CuO photocathode. At the same time, under AM 1.5G illumination, the CuBi 2 O 4 /CuO/ZnO photocathode shows a photocurrent density of 1.18mA/cm 2 at a 0.2V RHE potential in 0.5M Na 2 SO 4 , which is approximately that of CuBi 2 Twice the current density of O 4 /CuO photocathode. After coating the ZnO layer, the current retention rate of CuBi 2 O 4 /CuO increased from 58.3% to 84% during the 12h stability test. Experimental results show that the amorphous ZnO covering layer can not only serve as a protective layer, but also serve as a "cocatalyst", effectively improving the charge transfer of the electrode and increasing the electrochemically active area of the electrode.

以上所述,仅是本发明的较佳实施例,并非对本发明作任何限制,凡是根据本发明技术实质对以上实施例所作的任何简单修改、变更以及等效结构变化,均仍属于本发明技术方案的保护范围内。The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any simple modifications, changes and equivalent structural changes made to the above embodiments based on the technical essence of the present invention still belong to the technology of the present invention. within the protection scope of the scheme.

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1.CuBi 2 O 4 A method for modifying the surface of CuO photocathode, which is characterized in that ZnO is electrodeposited as CuBi 2 O 4 Protection layer of CuO photocathode.
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