CN116626555A - Magnetic field measurement method, magnetic field measurement system, and magnetic field measurement equipment - Google Patents
Magnetic field measurement method, magnetic field measurement system, and magnetic field measurement equipment Download PDFInfo
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Abstract
磁场量测方法包括:施加磁场于第一粒子及第二粒子;通过第一粒子,依据磁场及第一粒子及第二粒子之间的第一耦合强度产生第一输出光;以及依据第一输出光的强度计算磁场的强度。如此一来,可以对磁场进行精细的测量。此外,一种磁场量测系统及磁场量测设备也在此揭示。
The magnetic field measurement method includes: applying a magnetic field to the first particle and the second particle; generating a first output light according to the magnetic field and the first coupling strength between the first particle and the second particle through the first particle; and according to the first output The intensity of the light calculates the intensity of the magnetic field. In this way, fine measurements of the magnetic field can be made. In addition, a magnetic field measurement system and a magnetic field measurement device are also disclosed herein.
Description
技术领域technical field
本发明内容是有关于一种磁场量测技术,特别是关于一种磁场量测方法、磁场量测系统及磁场量测设备。The content of the present invention relates to a magnetic field measurement technology, in particular to a magnetic field measurement method, a magnetic field measurement system, and a magnetic field measurement device.
背景技术Background technique
对微小的细胞或装置进行观测时,需要测量微弱的磁场。然而,测量微弱磁场的量测装置具有诸多缺点。例如需要在极低温的环境运作,或是无法调整空间分辨率。因此,要如何克服上述缺点为本领域重要的课题。When observing tiny cells or devices, it is necessary to measure weak magnetic fields. However, measuring devices for measuring weak magnetic fields have many disadvantages. For example, it needs to operate in an extremely low temperature environment, or the spatial resolution cannot be adjusted. Therefore, how to overcome the above-mentioned shortcomings is an important issue in this field.
发明内容Contents of the invention
本发明实施例包含一种磁场量测方法。磁场量测方法包括:施加磁场于第一粒子及第二粒子;通过第一粒子,依据磁场及第一粒子及第二粒子之间的第一耦合强度产生第一输出光;以及依据第一输出光的强度计算磁场的强度。An embodiment of the invention includes a magnetic field measurement method. The magnetic field measurement method includes: applying a magnetic field to the first particle and the second particle; generating a first output light according to the magnetic field and the first coupling strength between the first particle and the second particle through the first particle; and according to the first output The intensity of the light calculates the intensity of the magnetic field.
在一些实施例中,产生第一输出光包括:调整第一粒子及第二粒子之间的距离以调整第一耦合强度;以及通过调整第一耦合强度,调整第一输出光的强度。In some embodiments, generating the first output light includes: adjusting the distance between the first particle and the second particle to adjust the first coupling strength; and adjusting the intensity of the first output light by adjusting the first coupling strength.
在一些实施例中,磁场量测方法还包括:通过第一激光固定第一粒子;以及通过第二激光固定第二粒子;其中调整第一粒子及第二粒子之间的距离包括:调整第一激光的位置及第二激光的位置的至少一者。In some embodiments, the magnetic field measurement method further includes: fixing the first particle by the first laser; and fixing the second particle by the second laser; wherein adjusting the distance between the first particle and the second particle includes: adjusting the first particle At least one of the position of the laser and the position of the second laser.
在一些实施例中,计算磁场的强度包括:依据第一输出光的强度产生输出信号;以及依据输出信号的至少一局部峰值对应的第一耦合强度的至少一耦合强度值计算磁场的强度。In some embodiments, calculating the strength of the magnetic field includes: generating an output signal according to the strength of the first output light; and calculating the strength of the magnetic field according to at least one coupling strength value of the first coupling strength corresponding to at least one local peak of the output signal.
本发明实施例包含一种磁场量测系统。磁场量测系统包括第一粒子、第二粒子及感测装置。第一粒子用以依据第一耦合强度及磁场产生第一输出光。第二粒子用以以第一耦合强度与第一粒子耦合。感测装置用以依据第一输出光的强度产生对应磁场的强度的读出信号。An embodiment of the invention includes a magnetic field measurement system. The magnetic field measuring system includes a first particle, a second particle and a sensing device. The first particle is used for generating the first output light according to the first coupling strength and the magnetic field. The second particle is used for coupling with the first particle with a first coupling strength. The sensing device is used for generating a readout signal corresponding to the intensity of the magnetic field according to the intensity of the first output light.
在一些实施例中,磁场量测系统还包括:第一移动装置,用以调整第一粒子与第二粒子之间的距离,以调整第一耦合强度,其中距离垂直于磁场的方向。In some embodiments, the magnetic field measurement system further includes: a first moving device for adjusting the distance between the first particle and the second particle to adjust the first coupling strength, wherein the distance is perpendicular to the direction of the magnetic field.
在一些实施例中,磁场量测系统还包括:处理装置,用以在第一移动装置调整距离后,依据对应读出信号的至少一局部峰值的第一耦合强度的至少一耦合强度值,计算磁场的强度。In some embodiments, the magnetic field measurement system further includes: a processing device, configured to calculate according to at least one coupling strength value of the first coupling strength corresponding to at least one local peak value of the readout signal after the first mobile device adjusts the distance The strength of the magnetic field.
本发明实施例包含一种磁场量测设备。磁场量测设备包括第一感测模组、第二感测模组、第一激光产生装置、第二激光产生装置及移动装置。第一感测模组用以感测磁场在第一感测模组周遭的强度。第二感测模组用以感测磁场在第二感测模组周遭的强度。第一激光产生装置用以定位第一感测模组。第二激光产生装置用以定位第二感测模组。移动装置,用以移动第一激光产生装置及第二激光产生装置的至少一者,以调整第一感测模组及第二感测模组之间的距离。Embodiments of the invention include a magnetic field measurement device. The magnetic field measuring device includes a first sensing module, a second sensing module, a first laser generating device, a second laser generating device and a moving device. The first sensing module is used for sensing the intensity of the magnetic field around the first sensing module. The second sensing module is used for sensing the intensity of the magnetic field around the second sensing module. The first laser generating device is used for positioning the first sensing module. The second laser generating device is used for positioning the second sensing module. The moving device is used to move at least one of the first laser generating device and the second laser generating device to adjust the distance between the first sensing module and the second sensing module.
在一些实施例中,第一感测模组包括:处理装置,用以依据第一粒子及第二粒子之间的耦合强度计算磁场在第一感测模组周遭的强度,其中第一激光产生装置还用以产生一激光,并通过激光固定第一粒子。In some embodiments, the first sensing module includes: a processing device for calculating the intensity of the magnetic field around the first sensing module according to the coupling strength between the first particle and the second particle, wherein the first laser generates The device is also used to generate a laser, and fix the first particle by the laser.
在一些实施例中,磁场量测设备还包括:第三感测模组,包含第三粒子及第四粒子,第三感测模组用以依据第三粒子及第四粒子之间的耦合强度计算磁场在第三感测模组周遭的强度,其中第一激光产生装置还用以通过激光固定第三粒子。In some embodiments, the magnetic field measurement device further includes: a third sensing module, including a third particle and a fourth particle, and the third sensing module is used to measure the coupling strength between the third particle and the fourth particle The strength of the magnetic field around the third sensing module is calculated, wherein the first laser generating device is also used to fix the third particle through the laser.
附图说明Description of drawings
图1为根据本案的一实施例所绘示的磁场量测系统的示意图。FIG. 1 is a schematic diagram of a magnetic field measurement system according to an embodiment of the present application.
图2为根据本案的一实施例所绘示的读出信号的信号强度、耦合强度及外加场的关系图。FIG. 2 is a relationship diagram of signal strength, coupling strength and applied field of a readout signal according to an embodiment of the present application.
图3A为根据本案的一实施例所绘示的磁场量测系统的示意图。FIG. 3A is a schematic diagram of a magnetic field measurement system according to an embodiment of the present application.
图3B为根据本案的一实施例所绘示的磁场量测系统的示意图。FIG. 3B is a schematic diagram of a magnetic field measurement system according to an embodiment of the present application.
图4为根据本案的一实施例所绘示的磁场量测设备的示意图。FIG. 4 is a schematic diagram of a magnetic field measuring device according to an embodiment of the present application.
具体实施方式Detailed ways
于本文中,当一元件被称为“连接”或“耦接”时,可指“电性连接”或“电性耦接”。“连接”或“耦接”也可用以表示二或多个元件间相互搭配操作或互动。此外,虽然本文中使用“第一”、“第二”、…等用语描述不同元件,该用语仅是用以区别以相同技术用语描述的元件或操作。除非上下文清楚指明,否则该用语并非特别指称或暗示次序或顺位,也非用以限定本案。Herein, when an element is referred to as "connected" or "coupled", it may mean "electrically connected" or "electrically coupled". "Connected" or "coupled" may also be used to mean that two or more elements operate or interact with each other. In addition, although terms such as "first", "second", ... etc. are used herein to describe different elements, these terms are only used to distinguish elements or operations described with the same technical terms. Unless the context clearly dictates otherwise, the terms do not specifically refer to or imply an order or sequence, nor are they intended to limit the case.
除非另有定义,本文使用的所有术语(包括技术和科学术语)具有与本案所属领域的普通技术人员通常理解的相同的含义。将进一步理解的是,诸如在通常使用的字典中定义的那些术语应当被解释为具有与它们在相关技术和本案的上下文中的含义一致的含义,并且将不被解释为理想化的或过度正式的意义,除非本文中明确地这样定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this matter belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the relevant art and in the context of the present case, and will not be interpreted as idealized or overly formal unless otherwise expressly defined herein.
这里使用的术语仅仅是为了描述特定实施例的目的,而不是限制性的。如本文所使用的,除非内容清楚地指示,否则单数形式“一”、“一个”和“该”旨在包括复数形式,包括“至少一个”。“或”表示“及/或”。如本文所使用的,术语“及/或”包括一个或多个相关所列项目的任何和所有组合。还应当理解,当在本说明书中使用时,术语“包括”及/或“包含”指定所述特征、区域、整体、步骤、操作、元件的存在及/或部件,但不排除一个或多个其它特征、区域整体、步骤、操作、元件、部件及/或其组合的存在或添加。The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "comprising" and/or "comprising" designate the stated features, regions, integers, steps, operations, the presence of elements and/or parts, but do not exclude one or more Existence or addition of other features, regions as a whole, steps, operations, elements, parts and/or combinations thereof.
以下将以附图揭露本案的复数个实施方式,为明确说明起见,许多实务上的细节将在以下叙述中一并说明。然而,应了解到,这些实务上的细节不应用以限制本案。也就是说,在本发明内容部分实施方式中,这些实务上的细节是非必要的。此外,为简化附图起见,一些现有惯用的结构与元件在附图中将以简单示意的方式绘示。The following will disclose multiple implementations of the present case with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present case. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some existing conventional structures and elements will be shown in a simple and schematic way in the drawings.
图1为根据本案的一实施例所绘示的磁场量测系统100的示意图。在一些实施例中,磁场量测系统100用以测量施加在磁场量测系统100上的磁场B1。FIG. 1 is a schematic diagram of a magnetic field measurement system 100 according to an embodiment of the present application. In some embodiments, the magnetic field measurement system 100 is used to measure the magnetic field B1 applied on the magnetic field measurement system 100 .
在一些实施例中,磁场量测系统100可以是一种量子量测系统,包含粒子PT1、PT2、发光装置110、移动装置120、130、激光产生装置140、150、固定装置160、170、感测装置180及处理装置190。In some embodiments, the magnetic field measurement system 100 can be a quantum measurement system, including particles PT1, PT2, a light emitting device 110, a moving device 120, 130, a laser generating device 140, 150, a fixing device 160, 170, a sensor Measuring device 180 and processing device 190.
如图1所示,发光装置110用以发射输入光L11及L12至粒子PT1、PT2。粒子PT1用以依据输入光L11产生输出光L13。粒子PT2用以依据输入光L12产生输出光L14。在一些实施例中,输入光L11及L12的波长大约为473纳米,且输出光L13及L14的波长大约为550纳米。在不同的实施例中,输入光L11及L12以及输出光L13及L14可以具有不同的波长。As shown in FIG. 1 , the light emitting device 110 is used for emitting input lights L11 and L12 to the particles PT1 and PT2 . The particle PT1 is used for generating the output light L13 according to the input light L11. The particle PT2 is used for generating the output light L14 according to the input light L12. In some embodiments, the wavelengths of the input lights L11 and L12 are about 473 nm, and the wavelengths of the output lights L13 and L14 are about 550 nm. In different embodiments, the input lights L11 and L12 and the output lights L13 and L14 may have different wavelengths.
如图1所示,感测装置180用以接收输出光L13及L14的至少一者,并用以依据输出光L13及L14的至少一者产生读出信号BS1。处理装置190依据读出信号BS1进行计算以取得磁场B1的强度。As shown in FIG. 1 , the sensing device 180 is used for receiving at least one of the output lights L13 and L14 , and for generating a readout signal BS1 according to at least one of the output lights L13 and L14 . The processing device 190 performs calculation according to the readout signal BS1 to obtain the strength of the magnetic field B1.
在一些实施例中,粒子PT1包含原子核(nucleus)NC1及自由基对RP1,且粒子PT2包含原子核NC2及自由基对RP2。自由基对RP1包含自由基RD1及RD2,且自由基对RP2包含自由基RD3及RD4。在一些实施例中,原子核NC1及NC2可以通过蛋白质或合成分子实施。自由基对RP1及RP2可以通过孤对电子(lone pair)实施。自由基RD1~RD4可以通过电子实施。In some embodiments, the particle PT1 includes a nucleus NC1 and a free radical pair RP1, and the particle PT2 includes a nucleus NC2 and a free radical pair RP2. The radical pair RP1 includes radicals RD1 and RD2, and the radical pair RP2 includes radicals RD3 and RD4. In some embodiments, nuclei NCl and NC2 may be implemented by proteins or synthetic molecules. The free radical pair RP1 and RP2 can be carried out by a lone pair of electrons (lone pair). The free radicals RD1-RD4 can be carried out by electrons.
如图1所示,自由基RD2与RD3之间的距离比自由基RD2与RD4之间的距离短,且自由基RD2与RD3之间的距离比自由基RD1与RD3之间的距离短。在一些实施例中,自由基RD2与RD3之间的耦合强度G1比自由基RD2与RD4之间的耦合强度及自由基RD1与RD3之间耦合强度的每一者强。As shown in FIG. 1 , the distance between radicals RD2 and RD3 is shorter than the distance between radicals RD2 and RD4 , and the distance between radicals RD2 and RD3 is shorter than the distance between radicals RD1 and RD3 . In some embodiments, the coupling strength G1 between radicals RD2 and RD3 is stronger than each of the coupling strength between radicals RD2 and RD4 and the coupling strength between radicals RD1 and RD3.
在一些实施例中,磁场B1被施加在粒子PT1及PT2。粒子PT1用以依据输入光L11、磁场B1及耦合强度G1产生输出光L13。粒子PT2用以依据输入光L12、磁场B1及耦合强度G1产生输出光L14。在一些实施例中,输出光L13的强度及输出光L14的强度与耦合强度G1有关。In some embodiments, magnetic field B1 is applied to particles PT1 and PT2. The particle PT1 is used for generating the output light L13 according to the input light L11, the magnetic field B1 and the coupling strength G1. The particle PT2 is used for generating the output light L14 according to the input light L12, the magnetic field B1 and the coupling strength G1. In some embodiments, the intensity of the output light L13 and the intensity of the output light L14 are related to the coupling intensity G1.
在一些实施例中,代表粒子PT1及PT2的能量的哈密尔顿(Hamiltonian)函数H可以被表示为如下式(1)。In some embodiments, the Hamiltonian function H representing the energies of the particles PT1 and PT2 can be expressed as the following formula (1).
在一些实施例中,式(1)中的a代表超精细交互作用(Hyperfine interaction)的系数,SA1对应自由基RD1的自旋,I1对应粒子PT1的自旋,SB1对应自由基RD2的自旋,I2对应粒子PT2的自旋,对应自由基RD1的自旋在Z方向上的分量,/>对应自由基RD2的自旋在Z方向上的分量,/>对应自由基RD4的自旋在Z方向上的分量,/>对应自由基RD3的自旋在Z方向上的分量,且θ对应施加于粒子PT1及PT2的外加场。在一些实施例中,Z方向与磁场B1的方向平行。在一些实施例中,外加场θ与磁场B1的关系可以被表示为如下式(2),其中γ2为一常数。In some embodiments, a in formula (1) represents the coefficient of hyperfine interaction (Hyperfine interaction), S A1 corresponds to the spin of free radical RD1, I 1 corresponds to the spin of particle PT1, and S B1 corresponds to free radical RD2 The spin of I 2 corresponds to the spin of the particle PT2, The component of the spin corresponding to the free radical RD1 in the Z direction, /> The component of the spin corresponding to the free radical RD2 in the Z direction, /> The component of the spin corresponding to the free radical RD4 in the Z direction, /> corresponds to the component of the spin of the radical RD3 in the Z direction, and θ corresponds to the external field applied to the particles PT1 and PT2. In some embodiments, the Z direction is parallel to the direction of the magnetic field B1. In some embodiments, the relationship between the applied field θ and the magnetic field B1 can be expressed as the following equation (2), where γ 2 is a constant.
B1=θ/γe...式(2)。B1 = θ/γ e ... Formula (2).
在一些实施例中,对应于哈密尔顿函数H,粒子PT1及PT2具有特征态|m>及|n>。其中m及n为正整数。特征态|m>及|n>所对应的能量,也就是特征态|m>及|n>所对应的特征值包含外加场θ及耦合强度G1的信息。换言之,特征态|m>及|n>所对应的特征值会随着外加场θ及/或耦合强度G1的变化而变化。In some embodiments, corresponding to the Hamiltonian function H, the particles PT1 and PT2 have characteristic states |m> and |n>. Where m and n are positive integers. The energies corresponding to the eigenstates |m> and |n>, that is, the eigenvalues corresponding to the eigenstates |m> and |n> contain the information of the external field θ and the coupling strength G1. In other words, the eigenvalues corresponding to the eigenstates |m> and |n> will change with the change of the external field θ and/or the coupling strength G1.
在一些实施例中,输出光L13的强度及输出光L14的强度的每一者可以通过如下式(3)所示的函数Φ(θ)表示。在一些实施例中,函数Φ(θ)对应读出信号BS1的信号强度,例如读出信号BS1的电压准位或电流准位。在一些实施例中,读出信号BS1的信号强度对应输出光L13的强度及输出光L14的强度的至少一者。In some embodiments, each of the intensity of the output light L13 and the intensity of the output light L14 can be represented by a function Φ(θ) as shown in the following formula (3). In some embodiments, the function Φ(θ) corresponds to the signal strength of the readout signal BS1 , such as the voltage level or current level of the readout signal BS1 . In some embodiments, the signal intensity of the readout signal BS1 corresponds to at least one of the intensity of the output light L13 and the intensity of the output light L14 .
在一些实施例中,式(3)中的ρmn对应密度函数,M为正整数。ωmn对应特征态|m>的能阶及|n>的能阶之间的能量差。可以通过如下式(4)表示,且f(ωmn)可以通过如下式(5)表示。In some embodiments, ρ mn in formula (3) corresponds to a density function, and M is a positive integer. ω mn corresponds to the energy difference between the energy level of the eigenstate |m> and the energy level of |n>. can be represented by the following formula (4), and f(ω mn ) can be represented by the following formula (5).
在一些实施例中,式(4)中的对应投影算符(projection operator)。式(5)中的k为常数。In some embodiments, in formula (4) Corresponds to the projection operator. k in formula (5) is a constant.
如上述式(1)到式(5)所示,函数Φ(θ)随着外加场θ及/或耦合强度G1的变化而变化。由上述式(1)到式(5)计算可得在耦合强度G1具有如下式(6)到式(7)所示的耦合强度值G11~G12时,函数Φ(θ)具有局部峰值。As shown in the above formulas (1) to (5), the function Φ(θ) changes with the change of the applied field θ and/or the coupling strength G1. Calculated from the above formulas (1) to (5), it can be obtained that when the coupling strength G1 has the coupling strength values G11-G12 shown in the following formulas (6) to (7), the function Φ(θ) has a local peak.
在一些实施例中,式(6)到式(7)中的函数Ω为外加场θ的函数。在耦合强度值G11及G12已知的情况下,可以通过如下式(8)得出外加场θ的强度。。In some embodiments, the function Ω in equations (6) to (7) is a function of the applied field θ. When the coupling strength values G11 and G12 are known, the strength of the applied field θ can be obtained by the following formula (8). .
θ=2·(G11+G12)…式(8)。θ=2·(G11+G12)...Formula (8).
在一些实施例中,处理装置190用以进行式(1)至式(8)的运算。在各种实施例中,式(1)至式(8)可以具有各种形式。In some embodiments, the processing device 190 is configured to perform the operations of formula (1) to formula (8). In various embodiments, formulas (1) to (8) may have various forms.
如图1所示,固定装置160用以固定粒子PT2,且固定装置170用以固定粒子PT1。激光产生装置150用以产生激光LZ1,并通过激光LZ1将固定装置170定位在空间中。激光产生装置140用以产生激光LZ2,并通过激光LZ2将固定装置160定位在空间中。As shown in FIG. 1 , the fixing device 160 is used to fix the particle PT2 , and the fixing device 170 is used to fix the particle PT1 . The laser generating device 150 is used to generate a laser light LZ1, and position the fixing device 170 in space through the laser light LZ1. The laser generating device 140 is used to generate a laser light LZ2, and position the fixing device 160 in space through the laser light LZ2.
在一些实施例中,固定装置170包含固定体FB1及线段SG1,且固定装置160包含固定体FB2及线段SG2。如图1所示,固定体FB1用以被激光LZ1固定在空间中,线段SG1用以连接固定体FB1及粒子PT1。固定体FB2用以被激光LZ2固定在空间中,线段SG2用以连接固定体FB2及粒子PT2。在一些实施例中,固定体FB1及FB2通过塑料小球实施,且线段SG1及SG2通过蛋白质构成。在不同的实施例中,固定体FB1及FB2以及线段SG1及SG2可以通过不同的形状及材料实施。In some embodiments, the fixing device 170 includes a fixing body FB1 and a line segment SG1 , and the fixing device 160 includes a fixing body FB2 and a line segment SG2 . As shown in FIG. 1 , the fixed body FB1 is used to be fixed in space by the laser LZ1 , and the line segment SG1 is used to connect the fixed body FB1 and the particle PT1 . The fixed body FB2 is used to be fixed in space by the laser LZ2, and the line segment SG2 is used to connect the fixed body FB2 and the particle PT2. In some embodiments, the anchors FB1 and FB2 are implemented by plastic beads, and the segments SG1 and SG2 are formed by proteins. In different embodiments, the fixing bodies FB1 and FB2 and the line segments SG1 and SG2 can be implemented by different shapes and materials.
在一些实施例中,移动装置130用以移动激光产生装置150的位置,使得激光LZ1的位置改变,以调整固定装置170及粒子PT1的位置。移动装置120用以移动激光产生装置140的位置,使得激光LZ2的位置改变,以调整固定装置160及粒子PT2的位置。如图1所示,粒子PT1及PT2之间具有垂直于Z方向的距离D1。移动装置120及130用以通过调整粒子PT1及PT2的位置调整距离D1。In some embodiments, the moving device 130 is used to move the position of the laser generating device 150 so that the position of the laser LZ1 changes, so as to adjust the positions of the fixing device 170 and the particle PT1. The moving device 120 is used to move the position of the laser generating device 140 so that the position of the laser LZ2 is changed, so as to adjust the positions of the fixing device 160 and the particle PT2. As shown in FIG. 1 , there is a distance D1 perpendicular to the Z direction between the particles PT1 and PT2 . The moving devices 120 and 130 are used to adjust the distance D1 by adjusting the positions of the particles PT1 and PT2.
在一些实施例中,当距离D1增加时,耦合强度G1减少,当距离D1减少In some embodiments, when the distance D1 increases, the coupling strength G1 decreases, and when the distance D1 decreases
时,耦合强度G1增加,在一些实施例中,移动装置120及130用以通过调整5距离D1调整耦合强度G1,以改变读出信号BS1的信号强度。关于调整耦合强度G1的细节在以下关于图2的实施例中进一步说明。, the coupling strength G1 increases. In some embodiments, the mobile devices 120 and 130 are used to adjust the coupling strength G1 by adjusting the distance D1 to change the signal strength of the readout signal BS1. The details about adjusting the coupling strength G1 are further explained in the following embodiment with respect to FIG. 2 .
图2为根据本案的一实施例所绘示的读出信号BS1的信号强度、耦合强度G1及外加场θ的关系图200。如图2所示,关系图200的横轴对应耦合强度G1,FIG. 2 is a graph 200 showing the relationship between the signal strength of the readout signal BS1 , the coupling strength G1 and the applied field θ according to an embodiment of the present application. As shown in FIG. 2 , the horizontal axis of the relationship diagram 200 corresponds to the coupling strength G1,
关系图200的纵轴对应读出信号BS1的信号强度。关系图200包含曲线CV1~CV7。The vertical axis of the relationship graph 200 corresponds to the signal strength of the readout signal BS1. The relationship diagram 200 includes curves CV1 to CV7.
在一些实施例中,曲线CV1~CV7对应不同强度的外加场θ。在图2所示的实施例中,曲线CV1~CV7分别对应强度为0.3、0.25、0.2、0.15、0.1、0.05及0的外加场θ。In some embodiments, the curves CV1 - CV7 correspond to different intensities of the applied field θ. In the embodiment shown in FIG. 2 , the curves CV1 - CV7 correspond to the applied field θ with intensities of 0.3, 0.25, 0.2, 0.15, 0.1, 0.05 and 0, respectively.
请参照图1及图2,当外加场θ(即,磁场B1)被施加于粒子PT1及PT2时,5移动装置120及130用以改变距离D1以取得曲线CV1~CV7的对应一者,并取得对应的局部峰值。在取得局部峰值后,可以依据局部峰值及式(8)计算外加场1 and 2, when the external field θ (that is, the magnetic field B1) is applied to the particles PT1 and PT2, the moving devices 120 and 130 are used to change the distance D1 to obtain a corresponding one of the curves CV1-CV7, and Get the corresponding local peak. After obtaining the local peak value, the external field can be calculated according to the local peak value and formula (8)
θ的强度。The strength of θ.
以下以外加场θ的强度为0.3的曲线CV1举例说明。当移动装置130将粒In the following, the curve CV1 with the strength of the applied field θ being 0.3 is used as an example for illustration. When the mobile device 130 will
子PT1靠近粒子PT2时及/或当移动装置120将粒子PT2靠近粒子PT1时,距0离D1逐渐减少,使得耦合强度G1逐渐增加。When the sub PT1 is close to the particle PT2 and/or when the moving device 120 moves the particle PT2 close to the particle PT1, the distance D1 from 0 decreases gradually, so that the coupling strength G1 gradually increases.
在上述操作期间,耦合强度G1依序具有耦合强度值G21、G11、G22、G23、G12及G24。感测装置180接收输出光L13及L14的至少一者,以依序取得对应耦合强度值G21、G11、G22、G23、G12及G24的读出信号BS1的信号强度值。During the above operations, the coupling strength G1 has coupling strength values G21 , G11 , G22 , G23 , G12 and G24 in sequence. The sensing device 180 receives at least one of the output lights L13 and L14 to sequentially obtain the signal strength values of the readout signal BS1 corresponding to the coupling strength values G21 , G11 , G22 , G23 , G12 and G24 .
5如图2所示,当耦合强度G1具有耦合强度值G21时,读出信号BS1具有信号强度值F21。当耦合强度G1具有耦合强度值G11时,读出信号BS1具有信号强度值F11。当耦合强度G1具有耦合强度值G22时,读出信号BS1具有信号强度值F22。当耦合强度G1具有耦合强度值G23时,读出信号BS1具有信号强度值F23。当耦合强度G1具有耦合强度值G12时,读出信号BS1具有信号强度值F12。当耦合强度G1具有耦合强度值G24时,读出信号BS1具有信号强度值F24。As shown in FIG. 2, when the coupling strength G1 has a coupling strength value G21, the readout signal BS1 has a signal strength value F21. When the coupling strength G1 has a coupling strength value G11, the readout signal BS1 has a signal strength value F11. When the coupling strength G1 has a coupling strength value G22, the readout signal BS1 has a signal strength value F22. When the coupling strength G1 has a coupling strength value G23, the readout signal BS1 has a signal strength value F23. When the coupling strength G1 has a coupling strength value G12, the readout signal BS1 has a signal strength value F12. When the coupling strength G1 has a coupling strength value G24, the readout signal BS1 has a signal strength value F24.
如图2所示,信号强度值F11大于信号强度值F21及F22,且信号强度值F12大于信号强度值F23及F24。由此可知,信号强度值F11及F12为曲线CV1的局部峰值。如此一来,图1所示的处理装置190可以通过对应信号强度值F11及F12的耦合强度值G11、G12及式(8)计算出外加场θ的强度为0.3。As shown in FIG. 2 , the signal strength value F11 is greater than the signal strength values F21 and F22 , and the signal strength value F12 is greater than the signal strength values F23 and F24 . It can be seen from this that the signal strength values F11 and F12 are local peaks of the curve CV1. In this way, the processing device 190 shown in FIG. 1 can calculate the strength of the external field θ to be 0.3 through the coupling strength values G11 and G12 corresponding to the signal strength values F11 and F12 and the formula (8).
举另一例来说,当移动装置130将粒子PT1远离粒子PT2时及/或当移动装置120将粒子PT2远离粒子PT1时,距离D1增加,使得耦合强度G1减少。For another example, when the moving device 130 moves the particle PT1 away from the particle PT2 and/or when the moving device 120 moves the particle PT2 away from the particle PT1 , the distance D1 increases, so that the coupling strength G1 decreases.
在上述操作期间,耦合强度G1依序具有耦合强度值G24、G12、G23、G22、G11及G21。感测装置180接收输出光L13及L14的至少一者,以依序取得对应耦合强度值G24、G12、G23、G22、G11及G21的读出信号BS1的信号强度值。During the above operations, the coupling strength G1 has coupling strength values G24, G12, G23, G22, G11, and G21 in sequence. The sensing device 180 receives at least one of the output lights L13 and L14 to sequentially obtain the signal strength values of the readout signal BS1 corresponding to the coupling strength values G24 , G12 , G23 , G22 , G11 and G21 .
在各种实施例中,感测装置180、移动装置120及130用以进行类似的操作以取得曲线CV2~CV7的局部峰值,并依据局部峰值计算对应的外加场θ的强度。In various embodiments, the sensing device 180 and the mobile devices 120 and 130 are used to perform similar operations to obtain the local peak values of the curves CV2 - CV7 , and calculate the corresponding intensity of the applied field θ according to the local peak values.
在一些做法中,对磁场进行精细测量的量测装置需要极低温的运作环境,或是量测装置的空间分辨率受到制造程序限制,无法轻易改变。In some approaches, the measuring device for precise measurement of the magnetic field requires an extremely low temperature operating environment, or the spatial resolution of the measuring device is limited by the manufacturing process and cannot be easily changed.
相较于上述做法,在本发明实施例中,感测装置180依据具有自由基对RP1的粒子PT1及具有自由基对RP2的粒子PT2之间的耦合强度G1产生对应磁场B1的读出信号BS1。磁场量测系统100不需要低温环境,也可以对磁场B1进行精细的测量。在一些实施例中,磁场量测系统100的灵敏度大约为其中nT为纳特斯拉(nano-Tesla),Hz为赫兹。Compared with the above method, in the embodiment of the present invention, the sensing device 180 generates the readout signal BS1 corresponding to the magnetic field B1 according to the coupling strength G1 between the particle PT1 with the radical pair RP1 and the particle PT2 with the free radical pair RP2 . The magnetic field measurement system 100 does not require a low temperature environment, and can also perform precise measurements on the magnetic field B1. In some embodiments, the sensitivity of the magnetic field measurement system 100 is approximately Where nT is nano-Tesla (nano-Tesla), and Hz is Hertz.
此外,相较于上述做法,在本发明实施例中,移动装置120及130可以在空间中进行各种配置以具有各种空间分辨率。在一些实施例中,磁场量测系统100的空间分辨率可以小于10纳米。In addition, compared with the above-mentioned method, in the embodiment of the present invention, the mobile devices 120 and 130 can be configured in various spaces to have various spatial resolutions. In some embodiments, the spatial resolution of the magnetic field measurement system 100 may be less than 10 nanometers.
图3A为根据本案的一实施例所绘示的磁场量测系统300A的示意图。在一些实施例中,磁场量测系统300A包含粒子PA1~PA3。如图3A所示,粒子PA1及PA2之间具有耦合强度GA1。粒子PA3及PA2之间具有耦合强度GA2。粒子PA1及PA3之间具有耦合强度GA3。在一些实施例中,耦合强度GA1~GA3的每一者受到施加在粒子PA1~PA3上的磁场影响。在一些实施例中,磁场量测系统300A只依据耦合强度GA1~GA3的一部分进行操作。举例来说,磁场量测系统300A可以只依据耦合强度GA1及GA2进行操作。在一些实施例中,粒子PA1~PA3之间不需要全对全连接关系(all to all connection)。FIG. 3A is a schematic diagram of a magnetic field measurement system 300A according to an embodiment of the present application. In some embodiments, the magnetic field measurement system 300A includes particles PA1 - PA3 . As shown in FIG. 3A , there is a coupling strength GA1 between the particles PA1 and PA2 . There is a coupling strength GA2 between the particles PA3 and PA2. There is a coupling strength GA3 between the particles PA1 and PA3. In some embodiments, each of the coupling strengths GA1 - GA3 is affected by a magnetic field applied on the particles PA1 - PA3 . In some embodiments, the magnetic field measurement system 300A only operates according to a part of the coupling strengths GA1 - GA3 . For example, the magnetic field measurement system 300A can only operate according to the coupling strengths GA1 and GA2. In some embodiments, the particles PA1-PA3 do not need an all-to-all connection.
请参照图1及图3A,磁场量测系统300A为磁场量测系统100的一种变化例。在一些实施例中,粒子PA1~PA3中的两者具有类似于粒子PT1及PT2的配置关系。因此,部分细节不再重复说明。Referring to FIG. 1 and FIG. 3A , the magnetic field measurement system 300A is a variation example of the magnetic field measurement system 100 . In some embodiments, two of the particles PA1-PA3 have a configuration relationship similar to that of the particles PT1 and PT2. Therefore, some details will not be repeated.
具例来说,在一些实施例中,固定装置170用以固定粒子PA1,且固定装置160用以固定粒子PA2。发光装置110用以分别发射输入光L11及L12至粒子PA1及PA2。粒子PA1及PA2用以依据耦合强度GA1分别产生输出光L13及L14。感测装置180用以依据输出光L13及L14产生对应施加在粒子PA1及PA2的磁场的读出信号BS1。For example, in some embodiments, the fixing device 170 is used to fix the particle PA1, and the fixing device 160 is used to fix the particle PA2. The light emitting device 110 is used for emitting input lights L11 and L12 to the particles PA1 and PA2 respectively. The particles PA1 and PA2 are used to generate output lights L13 and L14 respectively according to the coupling strength GA1 . The sensing device 180 is used for generating a readout signal BS1 corresponding to the magnetic field applied to the particles PA1 and PA2 according to the output lights L13 and L14 .
在一些实施例中,粒子PA1及PA2还用以依据耦合强度GA1~GA3产生输出光L13及L14。感测装置180用以依据输出光L13及L14产生对应施加在粒子PA1~PA3的磁场的读出信号BS1。In some embodiments, the particles PA1 and PA2 are also used to generate output lights L13 and L14 according to the coupling strengths GA1 - GA3 . The sensing device 180 is used for generating a readout signal BS1 corresponding to the magnetic field applied to the particles PA1 - PA3 according to the output lights L13 and L14 .
在一些实施例中,移动装置130用以调整粒子PA1与PA2之间的距离,以调整耦合强度GA1。在一些实施例中,移动装置130还用以调整粒子PA1与PA3之间的距离,以调整耦合强度GA3。In some embodiments, the moving device 130 is used to adjust the distance between the particles PA1 and PA2 to adjust the coupling strength GA1 . In some embodiments, the moving device 130 is also used to adjust the distance between the particles PA1 and PA3 to adjust the coupling strength GA3.
类似地,在一些实施例中,移动装置140用以调整粒子PA1与PA2之间的距离,以调整耦合强度GA1。在一些实施例中,移动装置140还用以调整粒子PA2与PA3之间的距离,以调整耦合强度GA2。Similarly, in some embodiments, the moving device 140 is used to adjust the distance between the particles PA1 and PA2 to adjust the coupling strength GA1 . In some embodiments, the moving device 140 is also used to adjust the distance between the particles PA2 and PA3 to adjust the coupling strength GA2.
在一些实施例中,磁场量测系统300A还包含用以控制粒子PA3的移动装置(图未示)。控制粒子PA3的移动装置用以调整粒子PA1与PA3之间的距离,以调整耦合强度GA3。控制粒子PA3的移动装置还用以调整粒子PA2与PA3之间的距离,以调整耦合强度GA2。In some embodiments, the magnetic field measurement system 300A further includes a moving device (not shown) for controlling the particle PA3. The moving device controlling the particle PA3 is used to adjust the distance between the particles PA1 and PA3 to adjust the coupling strength GA3. The moving device controlling the particle PA3 is also used to adjust the distance between the particles PA2 and PA3 to adjust the coupling strength GA2.
图3B为根据本案的一实施例所绘示的磁场量测系统300B的示意图。在一些实施例中,磁场量测系统300B包含粒子PB1~PB4。FIG. 3B is a schematic diagram of a magnetic field measurement system 300B according to an embodiment of the present application. In some embodiments, the magnetic field measurement system 300B includes particles PB1 - PB4 .
如图3B所示,粒子PB1及PB2之间具有耦合强度GB1。粒子PB3及PB2之间具有耦合强度GB2。粒子PB1及PB3之间具有耦合强度GB3。粒子PB1及PB4之间具有耦合强度GB4。粒子PB4及PB2之间具有耦合强度GB5。粒子PB4及PB3之间具有耦合强度GB6。在一些实施例中,耦合强度GB1~GB6的每一者受到施加在粒子PB1~PB4上的磁场影响。在一些实施例中,磁场量测系统300B只依据耦合强度GB1~GB6的一部分进行操作。举例来说,磁场量测系统300B可以只依据耦合强度GB1、GB2及GB5进行操作,而不依据耦合强度GB3、GB4及GB6进行操作。在一些实施例中,粒子PB1~PB4之间不需要全对全连接关系(all to all connection)。As shown in FIG. 3B , there is a coupling strength GB1 between the particles PB1 and PB2 . There is a coupling strength GB2 between the particles PB3 and PB2. There is a coupling strength GB3 between the particles PB1 and PB3. There is a coupling strength GB4 between the particles PB1 and PB4. There is a coupling strength GB5 between the particles PB4 and PB2. There is a coupling strength GB6 between the particles PB4 and PB3. In some embodiments, each of the coupling strengths GB1-GB6 is affected by a magnetic field applied on the particles PB1-PB4. In some embodiments, the magnetic field measurement system 300B only operates according to a part of the coupling strengths GB1 - GB6 . For example, the magnetic field measuring system 300B can only operate according to the coupling strengths GB1 , GB2 and GB5 , but not according to the coupling strengths GB3 , GB4 and GB6 . In some embodiments, the particles PB1-PB4 do not need an all-to-all connection.
请参照图1及图3B,磁场量测系统300B为磁场量测系统100的一种变化例。在一些实施例中,粒子PB1~PB4中的两者具有类似于粒子PT1及PT2的配置关系。因此,部分细节不再重复说明。Referring to FIG. 1 and FIG. 3B , the magnetic field measurement system 300B is a variation example of the magnetic field measurement system 100 . In some embodiments, two of the particles PB1 - PB4 have a configuration relationship similar to that of the particles PT1 and PT2 . Therefore, some details will not be repeated.
具例来说,在一些实施例中,固定装置170用以固定粒子PB1,且固定装置160用以固定粒子PB2。发光装置110用以分别发射输入光L11及L12至粒子PB1及PB2。粒子PB1及PB2用以依据耦合强度GB1分别产生输出光L13及L14。感测装置180用以依据输出光L13及L14产生对应施加在粒子PB1及PB2的磁场的读出信号BS1。For example, in some embodiments, the fixing device 170 is used to fix the particle PB1, and the fixing device 160 is used to fix the particle PB2. The light emitting device 110 is used for emitting input lights L11 and L12 to the particles PB1 and PB2 respectively. The particles PB1 and PB2 are used to generate output lights L13 and L14 respectively according to the coupling strength GB1. The sensing device 180 is used for generating a readout signal BS1 corresponding to the magnetic field applied to the particles PB1 and PB2 according to the output lights L13 and L14 .
在一些实施例中,粒子PB1及PB2还用以依据耦合强度GB1~GB6的一部分或全部产生输出光L13及L14。感测装置180用以依据输出光L13及L14产生对应施加在粒子PB1~PB4的磁场的读出信号BS1。In some embodiments, the particles PB1 and PB2 are also used to generate output lights L13 and L14 according to part or all of the coupling strengths GB1 - GB6 . The sensing device 180 is used for generating a readout signal BS1 corresponding to the magnetic field applied to the particles PB1 - PB4 according to the output lights L13 and L14 .
在一些实施例中,移动装置130用以调整粒子PB1与PB2之间的距离,以调整耦合强度GB1。移动装置130还用以调整粒子PB1与PB3之间的距离,以调整耦合强度GB3。移动装置130还用以调整粒子PB1与PB4之间的距离,以调整耦合强度GB4。In some embodiments, the moving device 130 is used to adjust the distance between the particles PB1 and PB2 to adjust the coupling strength GB1. The moving device 130 is also used to adjust the distance between the particles PB1 and PB3 to adjust the coupling strength GB3. The moving device 130 is also used to adjust the distance between the particles PB1 and PB4 to adjust the coupling strength GB4.
类似地,在一些实施例中,移动装置140用以调整粒子PB1与PB2之间的距离,以调整耦合强度GB1。移动装置140还用以调整粒子PB2与PB3之间的距离,以调整耦合强度GB2。移动装置140还用以调整粒子PB2与PB4之间的距离,以调整耦合强度GB5。Similarly, in some embodiments, the moving device 140 is used to adjust the distance between the particles PB1 and PB2 to adjust the coupling strength GB1. The moving device 140 is also used to adjust the distance between the particles PB2 and PB3 to adjust the coupling strength GB2. The moving device 140 is also used to adjust the distance between the particles PB2 and PB4 to adjust the coupling strength GB5.
在一些实施例中,磁场量测系统300B还包含用以控制粒子PB3的移动装置(图未示)。控制粒子PB3的移动装置用以调整粒子PB1与PB3之间的距离,以调整耦合强度GB3。控制粒子PB3的移动装置还用以调整粒子PB2与PB3之间的距离,以调整耦合强度GB2。控制粒子PB3的移动装置还用以调整粒子PB4与PB3之间的距离,以调整耦合强度GB6。In some embodiments, the magnetic field measurement system 300B further includes a moving device (not shown) for controlling the particle PB3. The moving device controlling the particle PB3 is used to adjust the distance between the particles PB1 and PB3 to adjust the coupling strength GB3. The moving device controlling the particle PB3 is also used to adjust the distance between the particles PB2 and PB3 to adjust the coupling strength GB2. The moving device controlling the particle PB3 is also used to adjust the distance between the particles PB4 and PB3 to adjust the coupling strength GB6.
在一些实施例中,磁场量测系统300B还包含用以控制粒子PB4的移动装置(图未示)。控制粒子PB4的移动装置用以调整粒子PB1与PB4之间的距离,以调整耦合强度GB4。控制粒子PB4的移动装置还用以调整粒子PB2与PB4之间的距离,以调整耦合强度GB5。控制粒子PB4的移动装置还用以调整粒子PB4与PB3之间的距离,以调整耦合强度GB6。In some embodiments, the magnetic field measurement system 300B further includes a moving device (not shown) for controlling the particle PB4. The moving device controlling the particle PB4 is used to adjust the distance between the particles PB1 and PB4 to adjust the coupling strength GB4. The moving device controlling the particle PB4 is also used to adjust the distance between the particles PB2 and PB4 to adjust the coupling strength GB5. The moving device controlling the particle PB4 is also used to adjust the distance between the particles PB4 and PB3 to adjust the coupling strength GB6.
图4为根据本案的一实施例所绘示的磁场量测设备400的示意图。在一些实施例中,磁场量测设备400包含感测区块410、移动装置420及激光产生装置组430。如图4所示,感测区块410、激光产生装置组430及移动装置420在Z方向依序排列。FIG. 4 is a schematic diagram of a magnetic field measurement device 400 according to an embodiment of the present application. In some embodiments, the magnetic field measurement device 400 includes a sensing block 410 , a moving device 420 and a laser generating device set 430 . As shown in FIG. 4 , the sensing block 410 , the laser generating device group 430 and the moving device 420 are arranged sequentially in the Z direction.
在一些实施例中,感测区块410用以感测施加在感测区块410的磁场B4。激光产生装置组430用以朝Z方向的反方向射出激光Z1~Z12至感测区块410。移动装置420用以移动激光产生装置组430。在一些实施例中,磁场B4的方向为Z方向。In some embodiments, the sensing block 410 is used to sense the magnetic field B4 applied to the sensing block 410 . The laser generating device group 430 is used to emit laser light Z1 - Z12 to the sensing block 410 in a direction opposite to the Z direction. The moving device 420 is used for moving the laser generating device group 430 . In some embodiments, the direction of the magnetic field B4 is the Z direction.
在一些实施例中,感测区块410包含感测模组列CL1~CL6。在一些实施例中,感测模组列CL1~CL6的每一者用以感测其周遭的磁场B4的强度。如图4所示,感测模组列CL1~CL6沿着不同于Z方向的X方向依序排列。在一些实施例中,X方向垂直于Z方向。In some embodiments, the sensing block 410 includes sensing module columns CL1 - CL6 . In some embodiments, each of the sensing module columns CL1 - CL6 is used to sense the intensity of the magnetic field B4 around it. As shown in FIG. 4 , the sensing module columns CL1 - CL6 are arranged sequentially along the X direction which is different from the Z direction. In some embodiments, the X direction is perpendicular to the Z direction.
在一些实施例中,激光产生装置组430包含激光产生装置LG1~LG6。如图4所示,激光产生装置LG1~LG6沿着X方向依序排列。激光产生装置LG1用以发射激光Z1及Z2至感测模组列CL1。激光产生装置LG2用以发射激光Z3及Z4至感测模组列CL2。激光产生装置LG3用以发射激光Z5及Z6至感测模组列CL3。激光产生装置LG4用以发射激光Z7及Z8至感测模组列CL4。激光产生装置LG5用以发射激光Z9及Z10至感测模组列CL5。激光产生装置LG6用以发射激光Z11及Z12至感测模组列CL6。In some embodiments, the laser generating device group 430 includes laser generating devices LG1 - LG6 . As shown in FIG. 4 , the laser generating devices LG1 to LG6 are arranged sequentially along the X direction. The laser generating device LG1 is used to emit laser light Z1 and Z2 to the sensing module column CL1. The laser generating device LG2 is used to emit laser light Z3 and Z4 to the sensing module column CL2. The laser generating device LG3 is used to emit laser light Z5 and Z6 to the sensing module column CL3. The laser generating device LG4 is used to emit laser light Z7 and Z8 to the sensing module column CL4. The laser generating device LG5 is used to emit laser light Z9 and Z10 to the sensing module column CL5. The laser generating device LG6 is used to emit laser light Z11 and Z12 to the sensing module column CL6.
在一些实施例中,移动装置420用以移动激光产生装置LG1~LG6以调整感测模组列CL1~CL6的位置。举例来说,如图4所示,感测模组列CL6及CL5之间具有距离D41。移动装置420用以将激光产生装置LG5靠近激光产生装置LG6,以减少距离D41。举另一例来说,移动装置420用以将激光产生装置LG5远离激光产生装置LG6,以增加距离D41。In some embodiments, the moving device 420 is used to move the laser generating devices LG1 - LG6 to adjust the positions of the sensing module columns CL1 - CL6 . For example, as shown in FIG. 4 , there is a distance D41 between the sensing module columns CL6 and CL5 . The moving device 420 is used to move the laser generating device LG5 close to the laser generating device LG6 to reduce the distance D41. For another example, the moving device 420 is used to move the laser generating device LG5 away from the laser generating device LG6 to increase the distance D41.
在一些做法中,对磁场进行精细测量的量测装置的空间分辨率受到制造程序限制,无法轻易改变。In some practices, the spatial resolution of the metrology device that makes fine measurements of the magnetic field is limited by the manufacturing process and cannot be easily changed.
相较于上述做法,在本发明实施例中移动装置420可以调整感测模组列CL1~CL6的位置,以调整磁场量测设备400的空间分辨率。如此一来,使用者可以依据所欲量测的磁场B4对磁场量测设备400进行最佳化。Compared with the above method, in the embodiment of the present invention, the mobile device 420 can adjust the positions of the sensing module columns CL1 - CL6 to adjust the spatial resolution of the magnetic field measuring device 400 . In this way, the user can optimize the magnetic field measuring device 400 according to the magnetic field B4 to be measured.
在一些实施例中,感测模组列CL1~CL6的每一者包含沿着Z方向依序排列的多个感测模组。上述感测模组的每一者用以感测磁场B4在其周遭的强度。在图4所示的实施例中,感测模组列CL6包含感测模组411、412及其他两个感测模组。感测模组列CL5包含感测模组413及其他三个感测模组。感测模组412及411沿着Z方向依序排列。感测模组413及411沿着X方向依序排列。In some embodiments, each of the sensing module columns CL1 - CL6 includes a plurality of sensing modules sequentially arranged along the Z direction. Each of the above-mentioned sensing modules is used for sensing the strength of the magnetic field B4 around it. In the embodiment shown in FIG. 4 , the sensing module column CL6 includes sensing modules 411 , 412 and two other sensing modules. The sensing module column CL5 includes the sensing module 413 and other three sensing modules. The sensing modules 412 and 411 are arranged in sequence along the Z direction. The sensing modules 413 and 411 are arranged in sequence along the X direction.
请参照图1及图4,磁场量测设备400为磁场量测系统100的一种变化例。移动装置120及130对应移动装置420。激光产生装置140及150对应激光产生装置LG1~LG6。发光装置110、感测装置180、粒子PT1、PT2、固定装置160、170及处理装置190对应感测模组列CL1~CL6中的感测模组。激光Z1~Z12对应激光LZ1及LZ2。因此,部分细节不再重复说明。Referring to FIG. 1 and FIG. 4 , the magnetic field measurement device 400 is a variation example of the magnetic field measurement system 100 . The mobile devices 120 and 130 correspond to the mobile device 420 . The laser generating devices 140 and 150 correspond to the laser generating devices LG1-LG6. The light emitting device 110 , the sensing device 180 , the particles PT1 , PT2 , the fixing devices 160 , 170 and the processing device 190 correspond to the sensing modules in the sensing module columns CL1 - CL6 . Lasers Z1 to Z12 correspond to lasers LZ1 and LZ2. Therefore, some details will not be repeated.
举例来说,在一些实施例中,感测模组412包含发光装置110、感测装置180、粒子PT1、PT2、固定装置160、170及处理装置190。激光产生装置LG6包含激光产生装置140及150。激光Z11及Z12分别对应激光LZ1及LZ2。激光Z11用以定位固定装置170。激光Z12用以定位固定装置160。移动装置420包含移动装置120及130。激光Z11及Z12之间的距离对应距离D1。感测模组412用以依据粒子PT1及PT2的耦合强度G1测量感测模组412周遭的磁场B4的强度。For example, in some embodiments, the sensing module 412 includes the light emitting device 110 , the sensing device 180 , the particles PT1 , PT2 , the fixing devices 160 , 170 and the processing device 190 . The laser generating device LG6 includes laser generating devices 140 and 150 . Lasers Z11 and Z12 correspond to lasers LZ1 and LZ2 respectively. The laser Z11 is used to position the fixing device 170 . The laser Z12 is used to position the fixing device 160 . Mobile device 420 includes mobile devices 120 and 130 . The distance between the lasers Z11 and Z12 corresponds to the distance D1. The sensing module 412 is used for measuring the intensity of the magnetic field B4 around the sensing module 412 according to the coupling strength G1 of the particles PT1 and PT2.
举另一例来说,在一些实施例中,感测模组411包含发光装置110、感测装置180、粒子PT1、PT2、固定装置160、170及处理装置190。激光产生装置LG6包含激光产生装置140及150。激光Z11及Z12分别对应激光LZ1及LZ2。激光Z11用以定位固定装置170。激光Z12用以定位固定装置160。移动装置420包含移动装置120及130。激光Z11及Z12之间的距离对应距离D1。感测模组411用以依据粒子PT1及PT2的耦合强度G1测量感测模组411周遭的磁场B4的强度。在一些实施例中,感测模组411及412中的粒子通过相同的激光Z11及Z12定位。For another example, in some embodiments, the sensing module 411 includes the light emitting device 110 , the sensing device 180 , the particles PT1 , PT2 , the fixing devices 160 , 170 and the processing device 190 . The laser generating device LG6 includes laser generating devices 140 and 150 . Lasers Z11 and Z12 correspond to lasers LZ1 and LZ2 respectively. The laser Z11 is used to position the fixing device 170 . The laser Z12 is used to position the fixing device 160 . Mobile device 420 includes mobile devices 120 and 130 . The distance between the lasers Z11 and Z12 corresponds to the distance D1. The sensing module 411 is used for measuring the intensity of the magnetic field B4 around the sensing module 411 according to the coupling strength G1 of the particles PT1 and PT2. In some embodiments, the particles in the sensing modules 411 and 412 are positioned by the same laser Z11 and Z12.
在一些实施例中,感测模组列CL1~CL6中的其他感测模组也具有类似于感测模组412的上述配置。举例来说,感测模组413包含对应粒子PT1的第一粒子及对应粒子PT2的第二粒子。激光Z9用以固定第一粒子。激光Z10用以固定第二粒子。移动装置420用以移动激光Z9及Z10的位置调整第一粒子及第二粒子之间的耦合强度。感测模组413用以依据第一粒子及第二粒子之间的耦合强度计算感测模组413周遭的磁场B4的强度。In some embodiments, other sensing modules in the sensing module columns CL1 - CL6 also have the above configuration similar to the sensing module 412 . For example, the sensing module 413 includes a first particle corresponding to the particle PT1 and a second particle corresponding to the particle PT2. Laser Z9 is used to immobilize the first particle. Laser Z10 is used to immobilize the second particle. The moving device 420 is used to move the positions of the lasers Z9 and Z10 to adjust the coupling strength between the first particle and the second particle. The sensing module 413 is used for calculating the strength of the magnetic field B4 around the sensing module 413 according to the coupling strength between the first particle and the second particle.
在一些实施例中,移动装置420还用以调整激光Z11及Z10的位置,以调整第二粒子及感测模组412中的粒子PT1之间的距离D41,以调整磁场量测设备400的空间分辨率。In some embodiments, the moving device 420 is also used to adjust the positions of the lasers Z11 and Z10 to adjust the distance D41 between the second particle and the particle PT1 in the sensing module 412 to adjust the space of the magnetic field measurement device 400 resolution.
如图4所示,感测模组列CL1~CL6中的感测模组,例如感测模组412,用以进行方法499。方法499包含操作OP41~OP44。As shown in FIG. 4 , the sensing modules in the sensing module columns CL1 - CL6 , such as the sensing module 412 , are used to perform the method 499 . Method 499 includes operations OP41-OP44.
在一些实施例中,在操作OP41,准备自由基对。举例来说,通过固定装置170及160固定具有自由基对RP1及RP2的粒子PT1及PT2,并通过移动装置120及130调整距离D1。In some embodiments, at operation OP41, radical pairs are prepared. For example, the particles PT1 and PT2 having the radical pairs RP1 and RP2 are fixed by the fixing devices 170 and 160 , and the distance D1 is adjusted by the moving devices 120 and 130 .
在一些实施例中,在操作OP42,测量自由基对的输出光。举例来说,通过5感测装置180对输出光L13及L14的强度进行测量。In some embodiments, at operation OP42, the output light of the radical pair is measured. For example, the intensities of the output lights L13 and L14 are measured by the sensing device 180 .
在一些实施例中,在操作OP43,依据输出光产生读出信号。举例来说,感测装置180依据输出光L13及L14的强度产生读出信号BS1。In some embodiments, at operation OP43, a readout signal is generated based on the output light. For example, the sensing device 180 generates the readout signal BS1 according to the intensity of the output lights L13 and L14.
在一些实施例中,在操作OP44,依据读出信号计算磁场的强度。举例来说,In some embodiments, in operation OP44, the strength of the magnetic field is calculated according to the read signal. for example,
通过处理装置190依据读出信号BS1及式(1)到式(8)进行运算,以计算出磁场0B1或B4的强度。在各种实施例中,处理装置190可以位于感测模组412的内The processing device 190 performs calculations according to the readout signal BS1 and equations (1) to (8) to calculate the intensity of the magnetic field OB1 or B4. In various embodiments, the processing device 190 may be located within the sensing module 412
部或外部。internal or external.
虽然本发明已以实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中技术人员,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,故本发明的保护范围当视权利要求所界定者为准。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be defined by the claims.
5【符号说明】5 [Description of symbols]
100、300A、300B:磁场量测系统100, 300A, 300B: magnetic field measurement system
B1、B4:磁场B1, B4: magnetic field
PT1、PT2、PA1~PA3、PB1~PB4:粒子PT1, PT2, PA1~PA3, PB1~PB4: particles
110:发光装置110: Lighting device
0 120、130、420:移动装置0 120, 130, 420: mobile device
140、150、LG1~LG6:激光产生装置140, 150, LG1~LG6: laser generating device
160、170:固定装置160, 170: Fixtures
180:感测装置180: Sensing device
190:处理装置190: Processing device
5L11、L12:输入光5L11, L12: input light
L13、L14:输出光L13, L14: output light
BS1:读出信号BS1: read signal
NC1、NC2:原子核NC1, NC2: Nuclei
RP1、RP2:自由基对RP1, RP2: free radical pair
RD1~RD4:自由基RD1~RD4: free radicals
G1、GA1~GA3、GB1~GB6:耦合强度θ:外加场G1, GA1~GA3, GB1~GB6: Coupling strength θ: Applied field
G11~G12、G21~G24:耦合强度值LZ1、LZ2、Z1~Z12:激光FB1、FB2:固定体G11~G12, G21~G24: Coupling strength value LZ1, LZ2, Z1~Z12: Laser FB1, FB2: Fixed body
SG1、SG2:线段SG1, SG2: line segment
200:关系图200: Relationship Diagram
CV1~CV7:曲线CV1~CV7: curve
D1、D41:距离D1, D41: distance
400:磁场量测设备400: Magnetic field measurement equipment
410:感测区块410: Sensing block
430:激光产生装置组430:Laser generating device group
Z:方向Z: Direction
X:方向X: direction
CL1~CL6:感测模组列CL1~CL6: Sensing module row
499:方法499: method
OP41~OP44:操作。OP41~OP44: Operation.
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